IRF620
IRF620FI
N - CHANNEL ENHANCEMENT MODE
POWER MOS TRANSISTORS
■TYPICAL RDS(on) = 0.55 Ω
■AVALANCHE RUGGED TECHNOLOGY
■100% AVALANCHE TESTED
■REPETITIVE AVALANCHE DATA AT 100oC
APPLICATIONS
■HIGH CURRENT, HIGH SPEED SWITCHING
■UNINTERRUPTIBLE POWER SUPPLY (UPS)
■MOTOR CONTROL, AUDIO AMPLIFIERS
■INDUSTRIALACTUATORS
■DC-DC & DC-AC CONVERTERS FOR
TELECOM, INDUSTRIAL AND CONSUMER
ENVIRONMENT
INTERNAL SCHEMATIC DIAGRAM
123
TO-220 ISOWATT220
November 1996
TYPE VDSS RDS(on) ID
IRF620
IRF620FI 200 V
200 V <0.8Ω
<0.8Ω6A
4A
ABSOLUTE MAXIMUM RATINGS
Symbol Parameter Value Unit
IRF620 IRF620FI
VDS Drain-source Voltage (VGS =0) 200 V
V
DGR Drain- gate Voltage (RGS =20kΩ)200V
V
GS Gate-source Voltage ±20 V
IDDrain Current (cont.) at Tc=25o
C64A
I
D
Drain Current (cont.) at Tc=100o
C42A
I
DM(•) Drain Current (pulsed) 24 24 A
Ptot Total Dissipation at Tc=25o
C7030W
Derating Factor 0.56 0.24 W/oC
VISO Insulation Withstand Voltage (DC) 2000 V
Tstg Storage Temperature -65 to 150 oC
TjMax. Operating Junction Temperature 150 oC
(•) Pulsewidth limited by safe operating area
123
1/9
THERMAL DATA
TO-220 ISOWATT220
Rthj-case Thermal Resistance Junction-case Max 1.79 4.17 oC/W
Rthj-amb
Rthc-s
Tl
Thermal Resistance Junction-ambient Max
Thermal Resistance Case-sink Typ
Maximum Lead Temperature For Soldering Purpose
62.5
0.5
300
oC/W
oC/W
oC
AVALANCHE CHARACTERISTICS
Symbol Parameter Max Value Unit
IAR Avalanche Current, Repetitive or Not-Repetitive
(pulse width limited by Tjmax, δ <1%) 6A
E
AS Single Pulse Avalanche Energy
(starting Tj=25o
C, ID=I
AR,V
DD =25V) 20 mJ
EAR Repetitive Avalanche Energy
(pulse width limited by Tjmax, δ <1%) 5mJ
I
AR Avalanche Current, Repetitive or Not-Repetitive
(Tc= 100 oC, pulse width limited by Tjmax, δ <1%) 4A
ELECTRICAL CHARACTERISTICS (Tcase =25o
C unless otherwise specified)
OFF
Symbol Parameter Test Conditions Min. Typ. Max. Unit
V(BR)DSS Drain-source
Breakdown Voltage ID=250µAV
GS = 0 200 V
IDSS Zero Gate Voltage
Drain Current (VGS =0) V
DS =MaxRating
V
DS = Max Rating x 0.8 Tc=125o
C10
100 µA
µA
IGSS Gate-body Leakage
Current (VDS =0) V
GS =±
20 V ±100 nA
ON (∗)
Symbol Parameter Test Conditions Min. Typ. Max. Unit
VGS(th) Gate Threshold Voltage VDS =V
GS ID=250µA234V
R
DS(on) Static Drain-source On
Resistance VGS =10V I
D=3A 0.55 0.8 Ω
I
D(on) On State Drain Current VDS >I
D(on) xR
DS(on)max VGS =10V 6 A
DYNAMIC
Symbol Parameter Test Conditions Min. Typ. Max. Unit
gfs (∗)Forward
Transconductance VDS >I
D(on) xR
DS(on)max ID=3A 1.5 3.5 S
C
iss
Coss
Crss
Input Capacitance
Output Capacitance
Reverse Transfer
Capacitance
VDS =25V f=1MHz V
GS =0 460
90
20
600
120
30
pF
pF
pF
IRF620/FI
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ELECTRICAL CHARACTERISTICS (continued)
SWITCHING RESISTIVE LOAD
Symbol Parameter Test Conditions Min. Typ. Max. Unit
td(on)
tr
td(off)
tf
Turn-on Time
Rise Time
Turn-off Delay Time
Fall Time
VDD =100V I
D=3A
R
G=50
ΩV
GS =10V
(see test circuit)
30
70
135
45
45
100
190
65
ns
ns
ns
ns
Qg
Qgs
Qgd
Total Gate Charge
Gate-Source Charge
Gate-Drain Charge
ID=6A V
GS =10V
V
DD = Max Rating x 0.8
(see test circuit)
20
6
8
30 nC
nC
nC
SOURCE DRAIN DIODE
Symbol Parameter Test Conditions Min. Typ. Max. Unit
ISD
ISDM(•)Source-drain Current
Source-drain Current
(pulsed)
6
24 A
A
VSD (∗) Forward On Voltage ISD =6A V
GS =0 1.5 V
t
rr
Qrr
Reverse Recovery
Time
Reverse Recovery
Charge
ISD =6A di/dt=100A/µs
V
DD = 100 V Tj= 150 oC170
1
ns
µC
(∗) Pulsed: Pulse duration = 300 µs, duty cycle 1.5 %
(•) Pulse width limited by safe operating area
Safe Operating Area for TO-220 Safe Operating Area for ISOWATT220
IRF620/FI
3/9
Thermal Impedance for TO-220
Derating Curve for TO-220
Output Characteristics
Thermal Impedance for ISOWATT220
Derating Curve for ISOWATT220
Transfer Characteristics
IRF620/FI
4/9
Transconductance Static Drain-source On Resistance
Maximum Drain Current vs Temperature Gate Charge vs Gate-source Voltage
Normalized Breakdown Voltage vs TemperatureCapacitance Variations
IRF620/FI
5/9
Normalized On Resistance vs Temperature Source-drain Diode Forward Characteristics
Unclamped Inductive Load Test Circuit Unclamped Inductive Waveforms
Switching Time Test Circuit Gate Charge Test Circuit
IRF620/FI
6/9
DIM. mm inch
MIN. TYP. MAX. MIN. TYP. MAX.
A 4.40 4.60 0.173 0.181
C 1.23 1.32 0.048 0.051
D 2.40 2.72 0.094 0.107
D1 1.27 0.050
E 0.49 0.70 0.019 0.027
F 0.61 0.88 0.024 0.034
F1 1.14 1.70 0.044 0.067
F2 1.14 1.70 0.044 0.067
G 4.95 5.15 0.194 0.203
G1 2.4 2.7 0.094 0.106
H2 10.0 10.40 0.393 0.409
L2 16.4 0.645
L4 13.0 14.0 0.511 0.551
L5 2.65 2.95 0.104 0.116
L6 15.25 15.75 0.600 0.620
L7 6.2 6.6 0.244 0.260
L9 3.5 3.93 0.137 0.154
DIA. 3.75 3.85 0.147 0.151
L6
A
C
D
E
D1
F
G
L7
L2
Dia.
F1
L5
L4
H2
L9
F2
G1
TO-220 MECHANICAL DATA
P011C
IRF620/FI
7/9
DIM. mm inch
MIN. TYP. MAX. MIN. TYP. MAX.
A 4.4 4.6 0.173 0.181
B 2.5 2.7 0.098 0.106
D 2.5 2.75 0.098 0.108
E 0.4 0.7 0.015 0.027
F 0.75 1 0.030 0.039
F1 1.15 1.7 0.045 0.067
F2 1.15 1.7 0.045 0.067
G 4.95 5.2 0.195 0.204
G1 2.4 2.7 0.094 0.106
H 10 10.4 0.393 0.409
L2 16 0.630
L3 28.6 30.6 1.126 1.204
L4 9.8 10.6 0.385 0.417
L6 15.9 16.4 0.626 0.645
L7 9 9.3 0.354 0.366
Ø 3 3.2 0.118 0.126
L2
A
B
D
E
H
G
L6
Ø
F
L3
G1
123
F2
F1
L7
L4
ISOWATT220 MECHANICAL DATA
P011G
IRF620/FI
8/9
Information furnished is believed to be accurate and reliable. However, SGS-THOMSON Microelectronics assumes no responsability for the
consequences of use of such informationnor for any infringement of patents or other rights of third parties which may results fromits use. No
licenseis granted by implication or otherwise under any patentor patent rights of SGS-THOMSON Microelectronics. Specifications mentioned
in this publication aresubject to change withoutnotice. Thispublication supersedes and replacesall information previously supplied.
SGS-THOMSON Microelectronics products are not authorized for use as criticalcomponents in lifesupport devices or systems without express
writtenapproval ofSGS-THOMSONMicroelectonics.
1996 SGS-THOMSON Microelectronics - Printedin Italy- All Rights Reserved
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IRF620/FI
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