FPF1203 / FPF1203L / FPF1204 / FPF12045 IntelliMAXTM Ultra-Small, Slew-Rate-Controlled Load Switch Features Description 1.2 V to 5.5 V Input Voltage Operating Range Slew Rate Control with tR: FPF1203/FPF1203l/FPF1204: FPF12045: 2 s The FPF1203 / 03L / 04 / 45 are ultra-small integrated IntelliMAXTM load switches with integrated P-channel switch and analog control features. Integrated slewrate control prevents inrush current and the resulting excessive voltage drop on the power rail. The input voltage range operates from 1.2 V to 5.5 V to provide power-disconnect capability for post-regulated power rails in portable and consumer products. The low shutoff current allows power designs to meet standby and off-power drain specifications. Typical RON: 45 m at VIN=5.5 V 55 m at VIN=3.3 V 90 m at VIN=1.8 V 185 m at VIN=1.2 V 100 s The FPF120x are controlled by a logic input (ON pin) compatible with standard CMOS GPIO circuitry found on Field Programmable Gate Array (FPGA) embedded processors. The FPF120x are available in 0.76 mm x 0.76 mm 4-bump WLCSP. Output Discharge Function on FPF1204 / 45 Low <1.5 A Quiescent Current ESD Protected: Above 7 kV HBM, 2 kV CDM GPIO / CMOS-Compatible Enable Circuitry 4-Bump, WLCSP 0.76 mm x 0.76 mm, 0.4 mm Pitch Applications Mobile Devices and Smart Phones Portable Media Devices Tablet PCs Advanced Notebook, UMPC, MID Portable Medical Devices GPS and Navigation Equipment Ordering Information Switch Output (Typical) Discharge at 3.3VIN Part Number Top Mark FPF1203UCX QL 55 m FPF1203LUCX QP 55 m FPF1204UCX QM 55 m FPF1204BUCX (Backside Laminate) QM 55 m FPF12045UCX NC 55 m (c) 2011 Fairchild Semiconductor Corporation FPF1203 / FPF1203L / FPF1204 / FPF12045 * Rev. 1.2.1 ON Pin Activity tR Active HIGH 100 s NA Active LOW 100 s 65 Active HIGH 100 s 65 Active HIGH 100 s 65 Active HIGH 2 s NA Package 4-Bump, Wafer-Level Chip-Scale Package (WLCSP), 0.76 mm x 0.76 mm, 0.4 mm Pitch www.fairchildsemi.com FPF1203 / FPF1203L / FPF1204 / FPF12045 -- IntelliMAXTM Ultra-Small, Slew-Rate-Controlled Load Switch October 2013 VIN VIN VOUT VOUT FPF1203/03L/04/45 + - CIN ON COUT GND Figure 1. Typical Application Functional Block Diagram FPF1203/03L/04/45 VIN VOUT CONTROL LOGIC ON Turn-On Slew Rate Controlled Driver R ESD Protection Output Discharge (Optional) GND Figure 2. Functional Block Diagram (Output Discharge for FPF1204 / 45) (c) 2011 Fairchild Semiconductor Corporation FPF1203 / FPF1203L / FPF1204 / FPF12045 * Rev. 1.2.1 www.fairchildsemi.com 2 FPF1203 / FPF1203L / FPF1204 / FPF12045 -- IntelliMAXTM Ultra-Small, Slew-Rate-Controlled Load Switch Application Diagram Figure 3. WLCSP Bumps Facing Down (Top View) Figure 4. WLCSP Bumps Facing Up (Bottom View) VOUT A1 A2 VIN VIN A2 A1 VOUT GND B1 B2 ON ON B2 B1 GND Figure 5. Pin Assignments (Top View) Figure 6. Pin Assignments (Bottom View) Pin Definitions Pin # Name Description A1 VOUT A2 VIN B1 GND B2 ON ON/OFF Control, active HIGH; FPF1203/04/45 B2 ON ON/OFF Control, active LOW; FPF1203L Switch output Supply input: input to the power switch Ground (c) 2011 Fairchild Semiconductor Corporation FPF1203 / FPF1203L / FPF1204 / FPF12045 * Rev. 1.2.1 www.fairchildsemi.com 3 FPF1203 / FPF1203L / FPF1204 / FPF12045 -- IntelliMAXTM Ultra-Small, Slew-Rate-Controlled Load Switch Pin Configurations Stresses exceeding the absolute maximum ratings may damage the device. The device may not function or be operable above the recommended operating conditions and stressing the parts to these levels is not recommended. In addition, extended exposure to stresses above the recommended operating conditions may affect device reliability. The absolute maximum ratings are stress ratings only. Symbol Parameter Min. Max. Unit -0.3 6.0 V VIN VIN, VOUT, VON to GND ISW Maximum Continuous Switch Current at Ambient Operating Temperature 2.2 A PD Power Dissipation at TA=25C 1.0 W TSTG Storage Temperature Range +150 C JA ESD -65 Thermal Resistance, Junction-to-Ambient Electrostatic Discharge Capability(1,2) 1S2P with One Thermal Via 1S2P without Thermal Via (1) 110 (2) 95 Human Body Model, JESD22-A114 7 Charged Device Model, JESD22-C101 2 C/W kV Notes: 1. Measured using 2S2P JEDEC std. PCB. 2. Measured using 2S2P JEDEC PCB COLD PLATE Method. Recommended Operating Conditions The Recommended Operating Conditions table defines the conditions for actual device operation. Recommended operating conditions are specified to ensure optimal performance to the datasheet specifications. Fairchild does not recommend exceeding them or designing to Absolute Maximum Ratings. Symbol Parameter Min. Max. Unit VIN Input Voltage 1.2 5.5 V TA Ambient Operating Temperature -40 +85 C (c) 2011 Fairchild Semiconductor Corporation FPF1203 / FPF1203L / FPF1204 / FPF12045 * Rev. 1.2.1 www.fairchildsemi.com 4 FPF1203 / FPF1203L / FPF1204 / FPF12045 -- IntelliMAXTM Ultra-Small, Slew-Rate-Controlled Load Switch Absolute Maximum Ratings Unless otherwise noted, VIN=1.2 V to 5.5 V and TA=-40 to +85C. Typical values are at VIN=3.3 V and TA=25C. Symbol Parameter Condition Min. Typ. Max. Unit 5.5 V Basic Operation VIN Supply Voltage 1.2 IQ(OFF) Off Supply Current FPF1203/04/45 VON=GND, VOUT=Open, VIN=5.5 V 0.1 1.0 FPF1203L 1.0 2.0 ISD Shutdown Current FPF1203/04/45 VON=GND, VOUT=GND 0.1 1.0 FPF1203L 1.2 3.0 IQ Quiescent Current FPF1203/04/45 IOUT=0 mA, VON=VIN, =5.5 V 0.1 1.5 VIN=5.5 V, IOUT=200 mA, TA=25C 45 55(3) VIN=3.3 V, IOUT=200 mA, TA=25C 55 65(3) VIN=1.8 V, IOUT=200 mA, TA=25C 90 100(3) RON FPF1203L On Resistance VON=VIN, VOUT=Open, VIN=5.5 V VON=VIN, VOUT=GND IOUT=0 mA, VON=GND, VIN, = 5.5 V VIN=1.2 V, IOUT=200 mA, TA=25C 185 (3) VIN=1.8 V, IOUT=200 mA, TA=85C RPD Output Discharge RPULL DOWN VIN=3.3 V, VON=OFF, IFORCE=20 mA, TA=25C, FPF1204 / FPF12045 VIH On Input Logic HIGH Voltage VIN=1.2 V to 5.5 V VIL On Input Logic LOW Voltage RON_PD ION 220 A A A m (3) 105 65 75 1.15 V VIN=1.2 V to 5.5 V 0.65 V VIN=1.2 V to 1.8 V 0.60 V Pull-Down Resistance at ON Pin VIN=1.2 V to 5.5 V On Input Leakage VON=VIN or GND M 8.3 1 A Dynamic Characteristics tDON Turn-On Delay(4) 70 tR VOUT Rise Time(4) 100 tON Turn-On Time(6) tDON (4) Turn-On Delay VIN=3.3 V, RL=10 , CL=0.1 F, TA=25C, FPF12045 170 2 tR VOUT Rise Time(4) 2 tON Turn-On Time(6) 4 tDOFF tF (4,5) Turn-Off Delay (4,5) VOUT Fall Time tOFF Turn-Off Time(5,7) tDOFF Turn-Off Delay(4,5) tF (4,5) VOUT Fall Time (5,7) tOFF Turn-Off Time tDOFF Turn-Off Delay(4,5) tF (4,5) VOUT Fall Time (5,7) tOFF Turn-Off Time tDOFF Turn-Off Delay(4,5) tF tOFF (4,5) VOUT Fall Time (5,7) VIN=3.3 V, RL=10 , CL=0.1 F, TA=25C, FPF1203L s 0.5 2.0 s 2.5 VIN=3.3 V, RL=500 , CL=0.1 F, TA=25C, FPF1203L 6 115 s 121 VIN=3.3 V, RL=10 , CL=0.1 F, TA=25C, FPF1203 4.0 2.9 s 7.3 VIN=3.3 V, RL=500 , CL=0.1 F, TA=25C, FPF1203 Turn-Off Time 6 115 s 121 Continued on the following page... (c) 2011 Fairchild Semiconductor Corporation FPF1203 / FPF1203L / FPF1204 / FPF12045 * Rev. 1.2.1 www.fairchildsemi.com 5 FPF1203 / FPF1203L / FPF1204 / FPF12045 -- IntelliMAXTM Ultra-Small, Slew-Rate-Controlled Load Switch Electrical Characteristics Unless otherwise noted, VIN=1.2 V to 5.5 V and TA=-40 to +85C. Typical values are at VIN=3.3 V and TA=25C. Symbol tDOFF tF Parameter Turn-Off Delay (4,5) VOUT Fall Time (5,7) tOFF Turn-Off Time tDOFF Turn-Off Delay(4,5) tF tOFF Condition Min. (4,5) (4,5) VOUT Fall Time (5,7) VIN=3.3 V, RL=10 , CL=0.1 F, TA=25C, FPF1204/45(5) Typ. Max. Unit 4.0 2.5 s 6.5 6 VIN=3.3 V, RL=500, CL=0.1 F, TA=25C, FPF1204/45(5) Turn-Off Time 11 s 17 Notes: 3. This parameter is guaranteed by design and characterization; not production tested. 4. tDON/tDOFF/tR/tF are defined in Figure 23. 5. Output discharge enabled during off-state. 6. tON=tR + tDON. 7. tOFF=tF + tDOFF. (c) 2011 Fairchild Semiconductor Corporation FPF1203 / FPF1203L / FPF1204 / FPF12045 * Rev. 1.2.1 www.fairchildsemi.com 6 FPF1203 / FPF1203L / FPF1204 / FPF12045 -- IntelliMAXTM Ultra-Small, Slew-Rate-Controlled Load Switch Electrical Characteristics Figure 7. Shutdown Current vs. Temperature Figure 8. Shutdown Current vs. Supply Voltage Figure 9. Off Supply Current vs. Temperature (VOUT Floating) Figure 10. Off Supply Current vs. Supply Voltage (VOUT Floating) Figure 11. Quiescent Current vs. Temperature Figure 12. Quiescent Current vs. Supply Voltage Figure 13. RON vs. Temperature Figure 14. RON vs. Supply Voltage (c) 2011 Fairchild Semiconductor Corporation FPF1203 / FPF1203L / FPF1204 / FPF12045 * Rev. 1.2.1 www.fairchildsemi.com 7 FPF1203 / FPF1203L / FPF1204 / FPF12045 -- IntelliMAXTM Ultra-Small, Slew-Rate-Controlled Load Switch Typical Performance Characteristics ID, DRAIN CURRENT (A) 100 100s 10 1ms 1 10ms RDS(ON) Limit 0.1 100ms 1s 10s DC Single Pulse RqJA = 110oC/W TA = 25oC 0.01 0.1 Figure 15. ON Pin Threshold vs. VIN 1 VDS, DRAIN-SOURCE VOLTAGE (V) 10 Figure 16. Drain Current vs. Drain-Source Voltage Safe Operating Area Figure 17. Turn-On Response - FPF1203 / 04 (VIN=3.3 V, CIN=1 F, COUT=0.1 F, RL=10 ) Figure 18. Turn-Off Response - FPF1203 (VIN=3.3 V, CIN=1 F, COUT=0.1 F, RL=10 ) (c) 2011 Fairchild Semiconductor Corporation FPF1203 / FPF1203L / FPF1204 / FPF12045 * Rev. 1.2.1 Figure 19. Turn-Off Response - FPF1203 (VIN=3.3 V, CIN=1 F, COUT=0.1 F, RL=500 ) www.fairchildsemi.com 8 FPF1203 / FPF1203L / FPF1204 / FPF12045 -- IntelliMAXTM Ultra-Small, Slew-Rate-Controlled Load Switch Typical Performance Characteristics (Continued) Figure 20. Turn-Off Response (VIN=3.3 V, CIN=1 F, COUT=0.1 F, RL=10 , FPF1204 / 45) (c) 2011 Fairchild Semiconductor Corporation FPF1203 / FPF1203L / FPF1204 / FPF12045 * Rev. 1.2.1 Figure 21. Turn-Off Response (VIN=3.3 V, CIN=1 F, COUT=0.1 F, RL=500 , FPF1204 / 45) www.fairchildsemi.com 9 FPF1203 / FPF1203L / FPF1204 / FPF12045 -- IntelliMAXTM Ultra-Small, Slew-Rate-Controlled Load Switch Typical Performance Characteristics (Continued) The FPF1203 / 03L / 04 / 045 are low-RON P-channel load switches with controlled turn-on. The core of each device is a 55 m P-channel MOSFET and controller capable of functioning over a wide input operating range of 1.2 to 5.5 V. The FPF1204 / 45 contain a 65 on-chip load resistor for quick output discharge when the switch is turned off. The FPF12045 features a faster VOUT Rise Time of 5 s. VIN VIN VOUT Output Capacitor A 0.1 F capacitor, COUT, should be placed between the VOUT and GND pins. This capacitor prevents parasitic board inductance from forcing VOUT below GND when the switch is on. CIN greater than COUT is highly recommended. COUT greater than CIN can cause VOUT to exceed VIN when the system supply is removed. This could result in current flow through the body diode from VOUT to VIN. VOUT FPF1204 + - CIN OFF ON ON GND COUT Figure 22. Typical Application Input Capacitor To limit the voltage drop on the input supply caused by transient inrush current when the switch turns on into a discharged load capacitor or short-circuit, a capacitor must be placed between the VIN and GND pins. A 1 F ceramic capacitor, CIN, placed close to the pins is usually sufficient. Higher-value CIN can be used to reduce the voltage drop in higher-current applications. (c) 2011 Fairchild Semiconductor Corporation FPF1203 / FPF1203L / FPF1204 / FPF12045 * Rev. 1.2.1 Figure 23. Timing Diagram for FPF1203/4/045 Board Layout For best performance, traces should be as short as possible. To be most effective, input and output capacitors should be placed close to the device to minimize the effect of parasitic trace inductance on normal and short-circuit operation. Using wide traces or large copper planes for all pins (VIN, VOUT, ON, and GND) minimizes the parasitic electrical effects and the case-ambient thermal impedance. However, the VOUT pin should not connect directly to the battery source due to the discharge mechanism of the load switch. www.fairchildsemi.com 10 FPF1203 / FPF1203L / FPF1204 / FPF12045 -- IntelliMAXTM Ultra-Small, Slew-Rate-Controlled Load Switch Operation and Application Description F 0.03 C A E 2X 0.40 B O0.20 Cu Pad A1 0.40 D BALL A1 INDEX AREA O0.30 Solder Mask 0.03 C 2X TOP VIEW RECOMMENDED LAND PATTERN (NSMD PAD TYPE) 0.06 C 0.2920.018 0.539 0.461 0.05 C C E 0.2080.021 SEATING PLANE SIDE VIEWS D NOTES: A. NO JEDEC REGISTRATION APPLIES. 0.005 C A B O0.2600.020 4X 0.40 B A 0.40 (Y)0.018 F 1 2 (X)0.018 B. DIMENSIONS ARE IN MILLIMETERS. C. DIMENSIONS AND TOLERANCE PER ASME Y14.5M, 1994. D. DATUM C IS DEFINED BY THE SPHERICAL CROWNS OF THE BALLS. E. PACKAGE NOMINAL HEIGHT IS 500 MICRONS 39 MICRONS (461-539 MICRONS). F. FOR DIMENSIONS D, E, X, AND Y SEE PRODUCT DATASHEET. BOTTOM VIEW G. DRAWING FILNAME: MKT-UC004AFrev1. Figure 24. 4-Bump, 0.76 x 0.76 mm, Wafer-Level Chip-Scale Packaging Product Dimensions D E X Y 760 m 30 m 760 m 30 m 0.180 mm 0.018 m 0.180 mm 0.018 m Package drawings are provided as a service to customers considering Fairchild components. Drawings may change in any manner without notice. Please note the revision and/or date on the drawing and contact a Fairchild Semiconductor representative to verify or obtain the most recent revision. Package specifications do not expand the terms of Fairchild's worldwide terms and conditions, specifically the warranty therein, which covers Fairchild products. Always visit Fairchild Semiconductor's online packaging area for the most recent package drawings: http://www.fairchildsemi.com/dwg/UC/UC004AF.pdf. (c) 2011 Fairchild Semiconductor Corporation FPF1203 / FPF1203L / FPF1204 / FPF12045 * Rev. 1.2.1 www.fairchildsemi.com 11 FPF1203 / FPF1203L / FPF1204 / FPF12045 -- IntelliMAXTM Ultra-Small, Slew-Rate-Controlled Load Switch Physical Dimensions FPF1203 / FPF1203L / FPF1204 / FPF12045 -- IntelliMAXTM Ultra-Small, Slew-Rate-Controlled Load Switch (c) 2011 Fairchild Semiconductor Corporation FPF1203 / FPF1203L / FPF1204 / FPF12045 * Rev. 1.2.1 www.fairchildsemi.com 12