October 2013
© 2011 Fairchild Semiconductor Corporation www.fairchildsemi.com
FPF1203 / FPF1203L / FPF1204 / FPF12045 • Rev. 1.2.1
FPF1203 / FPF1203L / FPF1204 / FPF12045 — IntelliMAX™ Ultra-Small, Slew-Rate-Controlled Load Switch
FPF1203 / FPF1203L / FPF1204 / FPF12045
IntelliMAX™ Ultra-Small, Slew-Rate-Controlled Load Switch
Features
1.2 V to 5.5 V Input Voltage Operating Range
Typical RON:
45 mΩ at VIN=5.5 V
55 mΩ at VIN=3.3 V
90 mΩ at VIN=1.8 V
185 mΩ at VIN=1.2 V
Slew Rate Control with tR:
FPF1203/FPF1203l/FPF1204: 100 µs
FPF12045: 2 µs
Output Discharge Function on FPF1204 / 45
Low <1.5 µA Quiescent Current
ESD Protected: Above 7 kV HBM, 2 kV CDM
GPIO / CMOS-Compatible Enable Circuitry
4-Bump, WLCSP 0.76 mm x 0.76 mm,
0.4 mm Pitch
Applications
Mobile Devices and Smart Phones
Portable Media Devices
Tablet PCs
Advanced Notebook, UMPC, MID
Portable Medical Devices
GPS and Navigation Equipment
Description
The FPF1203 / 03L / 04 / 45 are ultra-small integrated
IntelliMAX™ load switches with integrated P-channel
switch and analog control features. Integrated slew-
rate control prevents inrush current and the resulting
excessive voltage drop on the power rail. The input
voltage range operates from 1.2 V to 5.5 V to provide
power-disconnect capability for post-regulated power
rails in portable and consumer products. The low shut-
off current allows power designs to meet standby and
off-power drain specifications.
The FPF120x are controlled by a logic input (ON pin)
compatible with standard CMOS GPIO circuitry found
on Field Programmable Gate Array (FPGA) embedded
processors. The FPF120x are available in 0.76 mm x
0.76 mm 4-bump WLCSP.
Ordering Information
Part Number
Top
Mark
Switch
(Typical)
at 3.3VIN
Output
Discharge
ON Pin
Activity
tR
Package
FPF1203UCX
QL
55 mΩ
NA
Active HIGH
100 µs
4-Bump, Wafer-Level Chip-Scale
Package (WLCSP), 0.76 mm x
0.76 mm, 0.4 mm Pitch
FPF1203LUCX
QP
55 mΩ
NA
Active LOW
100 µs
FPF1204UCX
QM
55 mΩ
65 Ω
Active HIGH
100 µs
FPF1204BUCX
(Backside Laminate)
QM
55 mΩ
65 Ω
Active HIGH
100 µs
FPF12045UCX
NC
55 mΩ
65 Ω
Active HIGH
2 µs
© 2011 Fairchild Semiconductor Corporation www.fairchildsemi.com
FPF1203 / FPF1203L / FPF1204 / FPF12045 • Rev. 1.2.1 2
FPF1203 / FPF1203L / FPF1204 / FPF12045 — IntelliMAX™ Ultra-Small, Slew-Rate-Controlled Load Switch
Application Diagram
FPF1203/03L/04/45
ON
VIN
VIN VOUT
COUT
VOUT
GND
CIN
+
-
Figure 1. Typical Application
Functional Block Diagram
GND
CONTROL
LOGIC Turn-On Slew Rate
Controlled Driver
ESD Protection
FPF1203/03L/04/45
Output Discharge
(Optional)
VIN
ON
VOUT
R
Figure 2. Functional Block Diagram (Output Discharge for FPF1204 / 45)
© 2011 Fairchild Semiconductor Corporation www.fairchildsemi.com
FPF1203 / FPF1203L / FPF1204 / FPF12045 • Rev. 1.2.1 3
FPF1203 / FPF1203L / FPF1204 / FPF12045 — IntelliMAX™ Ultra-Small, Slew-Rate-Controlled Load Switch
Pin Configurations
Figure 3. WLCSP Bumps Facing Down
(Top View)
Figure 4. WLCSP Bumps Facing Up
(Bottom View)
Figure 5. Pin Assignments (Top View)
Figure 6. Pin Assignments (Bottom View)
Pin Definitions
Pin #
Name
Description
A1
VOUT
Switch output
A2
VIN
Supply input: input to the power switch
B1
GND
Ground
B2
ON
ON/OFF Control, active HIGH; FPF1203/04/45
B2
ON
ON/OFF Control, active LOW; FPF1203L
A
2
A
1
B
2
B
1
V
IN
G
ND
V
OUT
O
N
A
1
A
2
B
1
B
2
V
OUT
O
N
V
IN
G
ND
© 2011 Fairchild Semiconductor Corporation www.fairchildsemi.com
FPF1203 / FPF1203L / FPF1204 / FPF12045 • Rev. 1.2.1 4
FPF1203 / FPF1203L / FPF1204 / FPF12045 — IntelliMAX™ Ultra-Small, Slew-Rate-Controlled Load Switch
Absolute Maximum Ratings
Stresses exceeding the absolute maximum ratings may damage the device. The device may not function or be
operable above the recommended operating conditions and stressing the parts to these levels is not recommended.
In addition, extended exposure to stresses above the recommended operating conditions may affect device reliability.
The absolute maximum ratings are stress ratings only.
Symbol
Parameter
Min.
Max.
Unit
VIN
VIN, VOUT, VON to GND
-0.3
6.0
V
ISW
Maximum Continuous Switch Current at Ambient Operating Temperature
2.2
A
PD
Power Dissipation at TA=25°C
1.0
W
TSTG
Storage Temperature Range
-65
+150
°C
JA
Thermal Resistance, Junction-to-Ambient
1S2P with One Thermal Via(1)
110
°C/W
1S2P without Thermal Via(2)
95
ESD
Electrostatic Discharge Capability(1,2)
Human Body Model,
JESD22-A114
7
kV
Charged Device Model,
JESD22-C101
2
Notes:
1. Measured using 2S2P JEDEC std. PCB.
2. Measured using 2S2P JEDEC PCB COLD PLATE Method.
Recommended Operating Conditions
The Recommended Operating Conditions table defines the conditions for actual device operation. Recommended
operating conditions are specified to ensure optimal performance to the datasheet specifications. Fairchild does not
recommend exceeding them or designing to Absolute Maximum Ratings.
Symbol
Parameter
Min.
Max.
Unit
VIN
Input Voltage
1.2
5.5
V
TA
Ambient Operating Temperature
-40
+85
°C
© 2011 Fairchild Semiconductor Corporation www.fairchildsemi.com
FPF1203 / FPF1203L / FPF1204 / FPF12045 • Rev. 1.2.1 5
FPF1203 / FPF1203L / FPF1204 / FPF12045 — IntelliMAX™ Ultra-Small, Slew-Rate-Controlled Load Switch
Electrical Characteristics
Unless otherwise noted, VIN=1.2 V to 5.5 V and TA=-40 to +85°C. Typical values are at VIN=3.3 V and TA=25°C.
Symbol
Parameter
Condition
Min.
Typ.
Max.
Unit
Basic Operation
VIN
Supply Voltage
1.2
5.5
V
IQ(OFF)
Off Supply
Current
FPF1203/04/45
VON=GND, VOUT=Open, VIN=5.5 V
0.1
1.0
μA
FPF1203L
VON=VIN, VOUT=Open, VIN=5.5 V
1.0
2.0
ISD
Shutdown
Current
FPF1203/04/45
VON=GND, VOUT=GND
0.1
1.0
μA
FPF1203L
VON=VIN, VOUT=GND
1.2
3.0
IQ
Quiescent
Current
FPF1203/04/45
IOUT=0 mA, VON=VIN, =5.5 V
0.1
1.5
μA
FPF1203L
IOUT=0 mA, VON=GND, VIN, = 5.5 V
RON
On Resistance
VIN=5.5 V, IOUT=200 mA, TA=25°C
45
55(3)
mΩ
VIN=3.3 V, IOUT=200 mA, TA=25°C
55
65(3)
VIN=1.8 V, IOUT=200 mA, TA=25°C
90
100(3)
VIN=1.2 V, IOUT=200 mA, TA=25°C
185
220(3)
VIN=1.8 V, IOUT=200 mA, TA=85°C(3)
105
RPD
Output Discharge RPULL DOWN
VIN=3.3 V, VON=OFF,
IFORCE=20 mA, TA=25°C,
FPF1204 / FPF12045
65
75
Ω
VIH
On Input Logic HIGH Voltage
VIN=1.2 V to 5.5 V
1.15
V
VIL
On Input Logic LOW Voltage
VIN=1.2 V to 5.5 V
0.65
V
VIN=1.2 V to 1.8 V
0.60
V
RON_PD
Pull-Down Resistance at ON Pin
VIN=1.2 V to 5.5 V
8.3
MΩ
ION
On Input Leakage
VON=VIN or GND
1
μA
Dynamic Characteristics
tDON
Turn-On Delay(4)
VIN=3.3 V, RL=10 Ω, CL=0.1 µF,
TA=25°C, FPF12045
70
μs
tR
VOUT Rise Time(4)
100
tON
Turn-On Time(6)
170
tDON
Turn-On Delay(4)
2
tR
VOUT Rise Time(4)
2
tON
Turn-On Time(6)
4
tDOFF
Turn-Off Delay(4,5)
VIN=3.3 V, RL=10 Ω, CL=0.1 µF,
TA=25°C, FPF1203L
0.5
μs
tF
VOUT Fall Time(4,5)
2.0
tOFF
Turn-Off Time(5,7)
2.5
tDOFF
Turn-Off Delay(4,5)
VIN=3.3 V, RL=500 Ω, CL=0.1 µF,
TA=25°C, FPF1203L
6
μs
tF
VOUT Fall Time(4,5)
115
tOFF
Turn-Off Time(5,7)
121
tDOFF
Turn-Off Delay(4,5)
VIN=3.3 V, RL=10 Ω, CL=0.1 µF,
TA=25°C, FPF1203
4.0
μs
tF
VOUT Fall Time(4,5)
2.9
tOFF
Turn-Off Time(5,7)
7.3
tDOFF
Turn-Off Delay(4,5)
VIN=3.3 V, RL=500 Ω, CL=0.1 µF,
TA=25°C, FPF1203
6
μs
tF
VOUT Fall Time(4,5)
115
tOFF
Turn-Off Time(5,7)
121
Continued on the following page…
© 2011 Fairchild Semiconductor Corporation www.fairchildsemi.com
FPF1203 / FPF1203L / FPF1204 / FPF12045 • Rev. 1.2.1 6
FPF1203 / FPF1203L / FPF1204 / FPF12045 — IntelliMAX™ Ultra-Small, Slew-Rate-Controlled Load Switch
Electrical Characteristics
Unless otherwise noted, VIN=1.2 V to 5.5 V and TA=-40 to +85°C. Typical values are at VIN=3.3 V and TA=25°C.
Symbol
Parameter
Condition
Min.
Typ.
Max.
Unit
tDOFF
Turn-Off Delay(4,5)
VIN=3.3 V, RL=10 Ω, CL=0.1 µF,
TA=25°C, FPF1204/45(5)
4.0
μs
tF
VOUT Fall Time(4,5)
2.5
tOFF
Turn-Off Time(5,7)
6.5
tDOFF
Turn-Off Delay(4,5)
VIN=3.3 V, RL=500Ω, CL=0.1 µF,
TA=25°C, FPF1204/45(5)
6
μs
tF
VOUT Fall Time(4,5)
11
tOFF
Turn-Off Time(5,7)
17
Notes:
3. This parameter is guaranteed by design and characterization; not production tested.
4. tDON/tDOFF/tR/tF are defined in Figure 23.
5. Output discharge enabled during off-state.
6. tON=tR + tDON.
7. tOFF=tF + tDOFF.
© 2011 Fairchild Semiconductor Corporation www.fairchildsemi.com
FPF1203 / FPF1203L / FPF1204 / FPF12045 • Rev. 1.2.1 7
FPF1203 / FPF1203L / FPF1204 / FPF12045 — IntelliMAX™ Ultra-Small, Slew-Rate-Controlled Load Switch
Typical Performance Characteristics
Figure 7. Shutdown Current vs. Temperature
Figure 8. Shutdown Current vs. Supply Voltage
Figure 9. Off Supply Current vs. Temperature
(VOUT Floating)
Figure 10. Off Supply Current vs. Supply Voltage
(VOUT Floating)
Figure 11. Quiescent Current vs. Temperature
Figure 12. Quiescent Current vs. Supply Voltage
Figure 13. RON vs. Temperature
Figure 14. RON vs. Supply Voltage
© 2011 Fairchild Semiconductor Corporation www.fairchildsemi.com
FPF1203 / FPF1203L / FPF1204 / FPF12045 • Rev. 1.2.1 8
FPF1203 / FPF1203L / FPF1204 / FPF12045 — IntelliMAX™ Ultra-Small, Slew-Rate-Controlled Load Switch
Typical Performance Characteristics (Continued)
Figure 15. ON Pin Threshold vs. VIN
Figure 16. Drain Current vs. Drain-Source Voltage
Safe Operating Area
Figure 17. Turn-On Response – FPF1203 / 04
(VIN=3.3 V, CIN=1 µF, COUT=0.1 µF, RL=10 Ω)
Figure 18. Turn-Off Response – FPF1203
(VIN=3.3 V, CIN=1 µF, COUT=0.1 µF, RL=10 Ω)
Figure 19. Turn-Off Response – FPF1203
(VIN=3.3 V, CIN=1 µF, COUT=0.1 µF, RL=500 Ω)
0.01
0.1
1
10
100
0.1 1 10
ID, DRAIN CURRENT (A)
VDS, DRAIN-SOURCE VOLTAGE (V)
DC
10s
1s
100ms
RDS(ON) Limit
Single Pulse
RqJA = 110oC/W
TA= 25oC
10ms
1ms
100µs
© 2011 Fairchild Semiconductor Corporation www.fairchildsemi.com
FPF1203 / FPF1203L / FPF1204 / FPF12045 • Rev. 1.2.1 9
FPF1203 / FPF1203L / FPF1204 / FPF12045 — IntelliMAX™ Ultra-Small, Slew-Rate-Controlled Load Switch
Typical Performance Characteristics (Continued)
Figure 20. Turn-Off Response (VIN=3.3 V, CIN=1 µF,
COUT=0.1 µF, RL=10 Ω, FPF1204 / 45)
Figure 21. Turn-Off Response (VIN=3.3 V, CIN=1 µF,
COUT=0.1 µF, RL=500 Ω, FPF1204 / 45)
© 2011 Fairchild Semiconductor Corporation www.fairchildsemi.com
FPF1203 / FPF1203L / FPF1204 / FPF12045 • Rev. 1.2.1 10
FPF1203 / FPF1203L / FPF1204 / FPF12045 — IntelliMAX™ Ultra-Small, Slew-Rate-Controlled Load Switch
Operation and Application Description
The FPF1203 / 03L / 04 / 045 are low-RON P-channel
load switches with controlled turn-on. The core of each
device is a 55 m P-channel MOSFET and controller
capable of functioning over a wide input operating range
of 1.2 to 5.5 V.
The FPF1204 / 45 contain a 65 on-chip load resistor
for quick output discharge when the switch is turned off.
The FPF12045 features a faster VOUT Rise Time of 5 μs.
FPF1204
ON
VIN
VIN VOUT
COUT
VOUT
GND
ONOFF
CIN
+
-
Figure 22. Typical Application
Input Capacitor
To limit the voltage drop on the input supply caused by
transient inrush current when the switch turns on into a
discharged load capacitor or short-circuit, a capacitor
must be placed between the VIN and GND pins. A 1 µF
ceramic capacitor, CIN, placed close to the pins is
usually sufficient. Higher-value CIN can be used to
reduce the voltage drop in higher-current applications.
Output Capacitor
A 0.1 µF capacitor, COUT, should be placed between the
VOUT and GND pins. This capacitor prevents parasitic
board inductance from forcing VOUT below GND when
the switch is on. CIN greater than COUT is highly
recommended. COUT greater than CIN can cause VOUT to
exceed VIN when the system supply is removed. This
could result in current flow through the body diode from
VOUT to VIN.
Figure 23. Timing Diagram for FPF1203/4/045
Board Layout
For best performance, traces should be as short as
possible. To be most effective, input and output
capacitors should be placed close to the device to
minimize the effect of parasitic trace inductance on
normal and short-circuit operation. Using wide traces or
large copper planes for all pins (VIN, VOUT, ON, and
GND) minimizes the parasitic electrical effects and the
case-ambient thermal impedance. However, the VOUT
pin should not connect directly to the battery source due
to the discharge mechanism of the load switch.
© 2011 Fairchild Semiconductor Corporation www.fairchildsemi.com
FPF1203 / FPF1203L / FPF1204 / FPF12045 • Rev. 1.2.1 11
FPF1203 / FPF1203L / FPF1204 / FPF12045 — IntelliMAX™ Ultra-Small, Slew-Rate-Controlled Load Switch
Physical Dimensions
Figure 24. 4-Bump, 0.76 x 0.76 mm, Wafer-Level Chip-Scale Packaging
Product Dimensions
D
E
X
Y
760 µm ± 30 µm
760 µm ± 30 µm
0.180 mm± 0.018 µm
0.180 mm± 0.018 µm
Package drawings are provided as a service to customers considering Fairchild components. Drawings may change in any manner
without notice. Please note the revision and/or date on the drawing and contact a Fairchild Semiconductor representative to verify or
obtain the most recent revision. Package specifications do not expand the terms of Fairchild’s worldwide terms and conditions,
specifically the warranty therein, which covers Fairchild products.
Always visit Fairchild Semiconductor’s online packaging area for the most recent package drawings:
http://www.fairchildsemi.com/dwg/UC/UC004AF.pdf.
BOTTOM VIEW
SIDE VIEWS
TOP VIEW RECOMMENDED LAND PATTERN
BALL A1
INDEX AREA
A1
0.005 C A B
F
(NSMD PAD TYPE)
B
A
0.292±0.018
0.208±0.021
NOTES:
A. NO JEDEC REGISTRATION APPLIES.
B. DIMENSIONS ARE IN MILLIMETERS.
C. DIMENSIONS AND TOLERANCE
PER ASME Y14.5M, 1994.
D. DATUM C IS DEFINED BY THE SPHERICAL
CROWNS OF THE BALLS.
E. PACKAGE NOMINAL HEIGHT IS 500 MICRONS
±39 MICRONS (461-539 MICRONS).
F. FOR DIMENSIONS D, E, X, AND Y SEE
PRODUCT DATASHEET.
G. DRAWING FILNAME: MKT-UC004AFrev1.
0.03 C
2X
0.03 C
2X
12
A
B
0.40
0.40
(X)±0.018
SEATING PLANE
C
0.06 C
0.05 CE
D
D
E
0.40
0.40 Ø0.20
Cu Pad
Ø0.30
Solder Mask
(Y)±0.018
Ø0.260±0.020
4X
0.539
0.461
F
© 2011 Fairchild Semiconductor Corporation www.fairchildsemi.com
FPF1203 / FPF1203L / FPF1204 / FPF12045 • Rev. 1.2.1 12
FPF1203 / FPF1203L / FPF1204 / FPF12045 — IntelliMAX™ Ultra-Small, Slew-Rate-Controlled Load Switch
