VSMY99445DS
www.vishay.com Vishay Semiconductors
Rev. 1.0, 12-Feb-16 1Document Number: 84249
For technical questions, contact: emittertechsupport@vishay.com
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High Power Infrared Emitting Diode, 940 nm,
Surface Emitter Technology
DESCRIPTION
As part of the SurfLightTM portfolio, the VSMY99445DS is an
infrared, 940 nm emitting diode based on surface emitter
technology with high radiant power and high speed, molded
in low thermal resistance SMD package with lens. A 42 mil
chip provides outstanding radiant intensity and allows
DC operation of the device up to 1 A. Superior ESD
characteristics are ensured by an integrated Zener diode.
FEATURES
• Package type: surface mount
• Double stack technology
• Package form: high power SMD with lens
• Dimensions (L x W x H in mm): 3.85 x 3.85 x 2.24
• Peak wavelength: λp = 940 nm
• Zener diode for ESD protection up to 2 kV
• High radiant power
• High radiant intensity
• Angle of half intensity: ϕ = ± 45°
• Designed for high drive currents: up to 1 A (DC) and up
to 5 A pulses
• Low thermal resistance: RthJP = 10 K/W
• Floor life: 168 h, MSL 3, acc. J-STD-020
• Lead (Pb)-free reflow soldering
• Material categorization: for definitions of compliance
please see www.vishay.com/doc?99912
APPLICATIONS
• Infrared illumination for CMOS cameras (CCTV)
• Illumination for cameras (3D gaming)
• Machine vision
Note
• Test conditions see table “Basic Characteristics”
Note
• MOQ: minimum order quantity
PRODUCT SUMMARY
COMPONENT Ie (mW/sr) ϕ (deg) λp (nm) tr (ns)
VSMY99445DS 500 ± 45 940 15
ORDERING INFORMATION
ORDERING CODE PACKAGING REMARKS PACKAGE FORM
VSMY99445DS Tape and reel MOQ: 600 pcs, 600 pcs/reel High power with lens
ABSOLUTE MAXIMUM RATINGS (Tamb = 25 °C, unless otherwise specified)
PARAMETER TEST CONDITION SYMBOL VALUE UNIT
Reverse voltage VR5V
Forward current IF1A
Peak forward current tp/T = 0.5, tp = 100 μs IFM 2A
Surge forward current tp = 100 μs IFSM 5A
Power dissipation PV3.4 W
Junction temperature Tj110 °C
Operating temperature range Tamb -40 to +85 °C
Storage temperature range Tstg -55 to +100 °C
Soldering temperature According to fig. 10, J-STD-20 Tsd 260 °C
Thermal resistance junction / pin According to J-STD-051, soldered on PCB RthJP 10 K/W