S29GL-S (Pb Package) 3 Volt-Only Flash Memory with Page Mode featuring 65 nm MirrorBit(R) Process Technology Device Documentation Supplement General Description This supplementary document provides information on a device designed for limited distribution. It describes how the features, operation, and ordering options of this device have been enhanced or changed from the standard device on which it is based. The information contained in this document modifies any information on the same topics established by the data sheets listed in the Affected Documents/Related Documents table and should be used in conjunction with those documents. This document may also contain information that was not previously covered by the S29GL-S data sheet. It is intended for hardware system designers and software developers of applications, operating systems, or tools. Affected Documents/Related Documents Title Publication Number S29GL-S MirrorBit Flash Family Data Sheet S29GL_128S_01GS_00 Publication Number S29GL_128S_01GS_Pb_SP Revision 02 Issue Date December 14, 2011 Supplement Table of Contents General Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 Affected Documents/Related Documents. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 2 1. Device Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3 2. Device Bus Operation Changed . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3 3. Embedded Algorithm Performance . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3 4. Electrical Specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3 5. Timing Specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3 6. Ordering Information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4 7. Revision History . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5 S29GL-S (Pb Package) S29GL_128S_01GS_Pb_SP_02 December 14, 2011 Supplement 1. Device Description None. 2. Device Bus Operation Changed None. 3. Embedded Algorithm Performance None. 4. Electrical Specifications None. 5. Timing Specifications None. December 14, 2011 S29GL_128S_01GS_Pb_SP_02 S29GL-S (Pb Package) 3 Supplement 6. Ordering Information Valid Combinations The Recommended Combinations table lists configurations planned to be available in volume. The table below will be updated as new combinations are released. Consult your local sales representative to confirm availability of specific combinations and to check on newly released combinations. S29GL-S Valid Combinations Base OPN Package and Temperature Speed (ns) Model Number Packing Type Ordering Part Number (yy = Model Number, x = Packing Type) S29GL01GS10FAIyyx S29GL01GS S29GL01GS11FAIyyx 100, 110 S29GL512S10FAIyyx S29GL512S FAI 01, 02 (Note 1) 0, 3 S29GL512S11FAIyyx (Note 2) S29GL256S10FAIyyx S29GL256S S29GL256S90FAIyyx 90, 100 S29GL128S10FAIyyx S29GL128S S29GL128S90FAIyyx Notes: 1. Additional speed, package, and temperature options maybe offered in the future. Check with your local sales representative for availability. 2. Package Type 0 is standard option. The ordering part number for the device is formed by a valid combination of the following: S29GL01GS 10 F A I 01 0 Packing Type 0 = Tray 3 = 13" Tape and Reel Model Number (VIO and VCC Range) 01 = VIO = VCC = 2.7 to 3.6V, highest address sector protected 02 = VIO = VCC = 2.7 to 3.6V, lowest address sector protected V1 = VIO = 1.65 to VCC, VCC = 2.7 to 3.6V, highest address sector protected V2 = VIO = 1.65 to VCC, VCC= 2.7 to 3.6V, lowest address sector protected S1 = VIO = VCC = 2.7 to 3.6V, highest address sector protected, DYB's power-up in unprotected state S2 = VIO = VCC = 2.7 to 3.6V, lowest address sector protected, DYB's power-up in unprotected state S3 = VIO = VCC = 2.7 to 3.6V, highest address sector protected, DYB's power-up in protected state S4 = VIO = VCC = 2.7 to 3.6V, lowest address sector protected, DYB's power-up in protected state Temperature Range C = Extended Commercial (0C to +85C) I = Industrial (-40C to +85C) Package Materials Set A = Standard Package Type F = Fortified Ball-Grid Array Package (LAA064) 11 mm x 13 mm Speed Option 90 = 90 ns random access time 10 = 100 ns random access time 11 = 110 ns random access time 12 = 120 ns random access time Device Number/Description S29GL01GS, S29GL512S, S29GL256S, S29GL128S 3.0 Volt Core, with VIO Option, 1024, 512, 256, 128 Megabit Page-Mode Flash Memory, Manufactured on 65 nm MirrorBit Eclipse Process Technology 4 S29GL-S (Pb Package) S29GL_128S_01GS_Pb_SP_02 December 14, 2011 Supplement 7. Revision History Section Description Revision 01 (October 21, 2011) Initial release Revision 02 (December 14, 2011) Ordering Information Updated Valid Combinations table December 14, 2011 S29GL_128S_01GS_Pb_SP_02 S29GL-S (Pb Package) 5 Supplement Colophon The products described in this document are designed, developed and manufactured as contemplated for general use, including without limitation, ordinary industrial use, general office use, personal use, and household use, but are not designed, developed and manufactured as contemplated (1) for any use that includes fatal risks or dangers that, unless extremely high safety is secured, could have a serious effect to the public, and could lead directly to death, personal injury, severe physical damage or other loss (i.e., nuclear reaction control in nuclear facility, aircraft flight control, air traffic control, mass transport control, medical life support system, missile launch control in weapon system), or (2) for any use where chance of failure is intolerable (i.e., submersible repeater and artificial satellite). Please note that Spansion will not be liable to you and/or any third party for any claims or damages arising in connection with above-mentioned uses of the products. Any semiconductor devices have an inherent chance of failure. You must protect against injury, damage or loss from such failures by incorporating safety design measures into your facility and equipment such as redundancy, fire protection, and prevention of over-current levels and other abnormal operating conditions. If any products described in this document represent goods or technologies subject to certain restrictions on export under the Foreign Exchange and Foreign Trade Law of Japan, the US Export Administration Regulations or the applicable laws of any other country, the prior authorization by the respective government entity will be required for export of those products. Trademarks and Notice The contents of this document are subject to change without notice. This document may contain information on a Spansion product under development by Spansion. Spansion reserves the right to change or discontinue work on any product without notice. The information in this document is provided as is without warranty or guarantee of any kind as to its accuracy, completeness, operability, fitness for particular purpose, merchantability, non-infringement of third-party rights, or any other warranty, express, implied, or statutory. Spansion assumes no liability for any damages of any kind arising out of the use of the information in this document. Copyright (c) 2011 Spansion Inc. All rights reserved. Spansion(R), the Spansion logo, MirrorBit(R), MirrorBit(R) EclipseTM, ORNANDTM, EcoRAMTM and combinations thereof, are trademarks and registered trademarks of Spansion LLC in the United States and other countries. Other names used are for informational purposes only and may be trademarks of their respective owners. 6 S29GL-S (Pb Package) S29GL_128S_01GS_Pb_SP_02 December 14, 2011