S29GL512S10FAI023 - Spansion, Inc.

Publication Number S29GL_128S_01GS_Pb_SP Revision 02 Issue Date December 14, 2011

General Description

This supplementary document provides information on a device designed for limited distribution. It describes

how the features, operation, and ordering options of this device have been enhanced or changed from the

standard device on which it is based. The information contained in this document modifies any information on

the same topics established by the data sheets listed in the Affected Documents/Related Documents table

and should be used in conjunction with those documents. This document may also contain information that

was not previously covered by the S29GL-S data sheet. It is intended for hardware system designers and

software developers of applications, operating systems, or tools.

Affected Documents/Related Documents

S29GL-S (Pb Package)

3 Volt-Only Flash Memory with Page Mode

featuring 65 nm MirrorBit® Process Technology

Device Documentation

Supplement

Title Publication Number

S29GL-S MirrorBit Flash Family Data Sheet S29GL_128S_01GS_00

2 S29GL-S (Pb Package) S29GL_128S_01GS_Pb_SP_02 December 14, 2011

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Table of Contents

General Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1

Affected Documents/Related Documents. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1

1. Device Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3

2. Device Bus Operation Changed . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3

3. Embedded Algorithm Performance . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3

4. Electrical Specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3

5. Timing Specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3

6. Ordering Information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4

7. Revision History . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5

December 14, 2011 S29GL_128S_01GS_Pb_SP_02 S29GL-S (Pb Package) 3

Supplement

1. Device Description

None.

2. Device Bus Operation Changed

None.

3. Embedded Algorithm Performance

None.

4. Electrical Specifications

None.

5. Timing Specifications

None.

4 S29GL-S (Pb Package) S29GL_128S_01GS_Pb_SP_02 December 14, 2011

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6. Ordering Information

Valid Combinations

The Recommended Combinations table lists configurations planned to be available in volume. The table

below will be updated as new combinations are released. Consult your local sales representative to confirm

availability of specific combinations and to check on newly released combinations.

Notes:

1. Additional speed, package, and temperature options maybe offered in the future. Check with your local sales representative for

availability.

2. Package Type 0 is standard option.

The ordering part number for the device is formed by a valid combination of the following:

S29GL-S Valid Combinations

Base OPN Speed (ns) Package and

Temperature Model Number Packing Type Ordering Part Number

(yy = Model Number, x = Packing Type)

S29GL01GS

100, 110

FAI

(Note 1) 01, 02 0, 3

(Note 2)

S29GL01GS10FAIyyx

S29GL01GS11FAIyyx

S29GL512S S29GL512S10FAIyyx

S29GL512S11FAIyyx

S29GL256S

90, 100

S29GL256S10FAIyyx

S29GL256S90FAIyyx

S29GL128S S29GL128S10FAIyyx

S29GL128S90FAIyyx

S29GL01GS 10 F A I 01 0

Packing Type

0=Tray

3 = 13” Tape and Reel

Model Number (VIO and VCC Range)

01 = VIO = VCC = 2.7 to 3.6V, highest address sector protected

02 = VIO = VCC = 2.7 to 3.6V, lowest address sector protected

V1 = VIO = 1.65 to VCC, VCC = 2.7 to 3.6V, highest address sector protected

V2 = VIO = 1.65 to VCC, VCC= 2.7 to 3.6V, lowest address sector protected

S1 = VIO = VCC = 2.7 to 3.6V, highest address sector protected, DYB's power-up

in unprotected state

S2 = VIO = VCC = 2.7 to 3.6V, lowest address sector protected, DYB's power-up

in unprotected state

S3 = VIO = VCC = 2.7 to 3.6V, highest address sector protected, DYB's power-up

in protected state

S4 = VIO = VCC = 2.7 to 3.6V, lowest address sector protected, DYB's power-up

in protected state

Temperature Range

C = Extended Commercial (0°C to +85°C)

I = Industrial (–40°C to +85°C)

Package Materials Set

A = Standard

Package Type

F = Fortified Ball-Grid Array Package (LAA064) 11 mm x 13 mm

Speed Option

90 = 90 ns random access time

10 = 100 ns random access time

11 = 110 ns random access time

12 = 120 ns random access time

Device Number/Description

S29GL01GS, S29GL512S, S29GL256S, S29GL128S

3.0 Volt Core, with VIO Option, 1024, 512, 256, 128 Megabit Page-Mode Flash Memory,

Manufactured on 65 nm MirrorBit Eclipse Process Technology

December 14, 2011 S29GL_128S_01GS_Pb_SP_02 S29GL-S (Pb Package) 5

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7. Revision History

Section Description

Revision 01 (October 21, 2011)

Initial release

Revision 02 (December 14, 2011)

Ordering Information Updated Valid Combinations table

6 S29GL-S (Pb Package) S29GL_128S_01GS_Pb_SP_02 December 14, 2011

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Colophon

The products described in this document are designed, developed and manufactured as contemplated for general use, including without

limitation, ordinary industrial use, general office use, personal use, and household use, but are not designed, developed and manufactured as

contemplated (1) for any use that includes fatal risks or dangers that, unless extremely high safety is secured, could have a serious effect to the

public, and could lead directly to death, personal injury, severe physical damage or other loss (i.e., nuclear reaction control in nuclear facility,

aircraft flight control, air traffic control, mass transport control, medical life support system, missile launch control in weapon system), or (2) for

any use where chance of failure is intolerable (i.e., submersible repeater and artificial satellite). Please note that Spansion will not be liable to

you and/or any third party for any claims or damages arising in connection with above-mentioned uses of the products. Any semiconductor

devices have an inherent chance of failure. You must protect against injury, damage or loss from such failures by incorporating safety design

measures into your facility and equipment such as redundancy, fire protection, and prevention of over-current levels and other abnormal

operating conditions. If any products described in this document represent goods or technologies subject to certain restrictions on export under

the Foreign Exchange and Foreign Trade Law of Japan, the US Export Administration Regulations or the applicable laws of any other country,

the prior authorization by the respective government entity will be required for export of those products.

Trademarks and Notice

The contents of this document are subject to change without notice. This document may contain information on a Spansion product under

development by Spansion. Spansion reserves the right to change or discontinue work on any product without notice. The information in this

document is provided as is without warranty or guarantee of any kind as to its accuracy, completeness, operability, fitness for particular purpose,

merchantability, non-infringement of third-party rights, or any other warranty, express, implied, or statutory. Spansion assumes no liability for any

damages of any kind arising out of the use of the information in this document.

and combinations thereof, are trademarks and registered trademarks of Spansion LLC in the United States and other countries. Other names

used are for informational purposes only and may be trademarks of their respective owners.