18368 - VICOR - Datasheet.Live

Design Guide & Applications Manual

Maxi, Mini, Micro Family DC-DC Converters and Configurable Power Supplies

Maxi, Mini, Micro Design Guide Rev 5.0

Page 77 of 87 03/2018

16. Through-Hole Socket-Mount System (InMate)

InMates are an innovative solution for through-hole socket

requirements. Consisting of individual plastic carriers for the input

and the output, each contains an array of sockets for either a full-,

half- or quarter-brick sized module. The sockets are factory loaded

into the carrier, which holds them rigidly in place throughout the

assembly and soldering process. The carriers are later removed,

leaving the sockets accurately positioned.

Designed for use with pin-compatible Maxi, Mini and Micro Family

converters, InMates are available for a wide range of PCB sizes and

mounting styles. PCB thicknesses can range from 0.055in [1,39mm]

to 0.1375in [3,49mm].

Sockets also allow for mounting modules either inboard, with a

cutout in the PCB for the module, to minimize the height above the

board or onboard. InMates are compatible with the ModuMate or

RoHS pin style.

InMates are available in standard recyclable JEDEC style trays for

use with automated pick-and-place equipment and are compatible

with most standard wave or hand solder operations. The sockets

are soldered into the board as part of the PCB assembly process.

The module can then be plugged into place at anytime later.

NOTE: Please refer to Section 13 of the design guide for the InMate

soldering procedure.

Figure 16.1 — InMate carrier / socket assembly and soldering process

Insert



Solder



Remove Carrier



Insert Module



Design Guide & Applications Manual

Maxi, Mini, Micro Family DC-DC Converters and Configurable Power Supplies

Maxi, Mini, Micro Design Guide Rev 5.0

Page 78 of 87 03/2018

16. Through-Hole Socket-Mount System (InMate)

1. Select Board Thickness:

Nominal 0.062in [1,5mm], 0.093in [2,4mm] or 0.125in [3,1mm].

2. Select Mounting Style:

Inboard requires a PCB cutout for the “belly” of the module.

See dotted lines in PCB drawing links on Page 80 for

cut-out area.

3. Identify Module Type:

Full brick (Maxi), half brick (Mini) or quarter brick (Micro).

4. Select the Ordering Part Number:

Order packages of ﬁve input / output sets or in higher

quantities order input and output InMates separately. For

individual input or output InMates, minimum orders of 35 for

Maxi or Mini and 40 for Micro apply.

5. Verify Correct Pin Style for the Module:

For predeﬁned parts, “S” or “F”= short ModuMate and “N” or

“G” = long ModuMate

See Table 16.4 for standoff recommendations.

Table 16.1 — Guide to InMate selection

InMate: Through-Hole Sockets

Board Thickness Full Brick [Maxi) Half Brick [Mini) Quarter Brick [Micro)

Normal

[Min / Max)

Mounting

Style Input Output Five

Sets Input Output Five

Sets

Style

0.062in

(0.055in / 0.071in)

1,5mm

(1,4mm / 1,8mm)

Inboard 18374 18382 18362 18374 18384 18366 18376 18386 18370 S or F

Onboard 18378 18388 18364 18378 18390 18368 18380 18392 18372 N or G

0.093in

(0.084in / 0.104in)

2,4mm

(2,1mm / 2,6mm)

Inboard 18375 18383 18363 18375 18385 18367 18377 18387 18371 S or F

Onboard 18379 18389 18365 18379 18391 18369 18381 18393 18373 N or G

0.125in

(0.1125in / 0.1375in)

3,1mm

(2,8mm / 3,5mm)

Onboard 21539 21543 21510 21539 21544 21511 21540 21545 21512 N or G

2. 3. 5.1. 4.

Design Guide & Applications Manual

Maxi, Mini, Micro Family DC-DC Converters and Configurable Power Supplies

Maxi, Mini, Micro Design Guide Rev 5.0

Page 79 of 87 03/2018

16. Through-Hole Socket-Mount System (InMate)

Parameter Speciﬁcation Value Reference

Compatibility

Module Pin Styles

F = short Au plated Short RoHS pins

Short ModuMate pins

S = short Au plated

G = long Au plated Long RoHS pins

Long ModuMate pins

N = long Au plated

Mechanical

Contact Normal Force 100g EOL min GR-1217-CORE, R5-23

Number of Mating Cycles 5 max

[h] Exception to GR-1217-CORE which speciﬁes 25 mating cycle

Module Engagement Force 32lbs per connector set max GR-1217-CORE, R5-31,32

Module Disengagement Force 32lbs per connector set max GR-1217-CORE, R5-31,32

Electrical

Current Rating for Output Pin Sockets

50A Maxi

[e] / 50A Mini / 25A Micro

(Based on 248°F [120°C] max socket temp

& 86°F [30°C] max temperature rise of contact)

Gold plating standards and accepted

industry standards such as

IICIT, EIA, Bellcore guidelines

Low-Level Contact Resistance

0.080in [2,03mm] dia socket (LLCR) 400µΩ max GR-1217-CORE, 6.2.1

Low-Level Contact Resistance

0.150in [3,81mm] dia socket (LLCR) 300µΩ max GR-1217-CORE, 6.2.1

Low-Level Contact Resistance

0.180in [4,57mm] dia sockets (LLCR) 200µΩ max GR-1217-CORE, 6.2.1

Thermal

Max Socket Temperature 248°F [120°C] max Max continuous-use temperature for gold plating

Temperature Rise 86°F [30°C] max GR-1217-CORE

[g]

EIA-364-70A

[f]

Environmental

Shock and Vibration

InMate products are tested in random vibration environments to best simulate the broad spectrum of frequencies

and amplitudes that may be encountered in typical applications. Actual system resonant frequencies will depend on

PCB construction and mounting details. For critical or unusual shock and vibration environments, the performance

of the system should be independently veriﬁed.

Table 16.2 — InMate speciﬁcations and materials

Materials Ratings

Headers

Material: Ryton™ R–7 PPS, 65% Glass Fiber and

Mineral-Filled Compound Poly-Phenylene Sulﬁde

Flammability UL94 V-0/5VA

Thermal Stability (short term) 500°F [260°C]

Thermal Stability (long term) 392°F [200°C]

Solder Cap

Material 305 stainless steel

Plating Clear passivate to repel solder

Sockets

Material Brush Wellman Alloy #25 C17200 deep draw quality or equiv. 0.010in thick

Plating Woods nickel strike followed by 50µin min low stress sulfamate-based electrolytic nickel,

followed by 20µin min hard gold, followed by 10µin min soft gold

Table 16.3 — Material properties of InMate components

[e] For 80A operation with Maxi, contact Applications Engineering.

[f] GR-1217-CORE issue 1, November 1995 Generic requirements for separable electrical connectors used in telecommunications hardware.

A module of NEBSFR, FR-2063

[g] ANSI/EIA-364 American National Standards Institute / Electronic Industries Association (Electronic Components, Assemblies & Materials Association)

[h] The module and socket must be replaced after ﬁve mating cycles.

Design Guide & Applications Manual

Maxi, Mini, Micro Family DC-DC Converters and Configurable Power Supplies

Maxi, Mini, Micro Design Guide Rev 5.0

Page 80 of 87 03/2018

16. Through-Hole Socket-Mount System (InMate)

Table 16.4 — InMate standoff recommendations

Standoff Kits for InMate Mounted Modules

Board

Thickness

Mounting

Options

Slotted

Baseplate

Through-Hole

Baseplate

Threaded

Baseplate

Nominal

(Min / Max]

Mounting

Style

Through-Hole

Heat Sink

Threaded

Heat Sink

Through-Hole

Heat Sink

Threaded

Heat Sink

Through-Hole

Heat Sink

0.062in

(0.055in / 0.071in)

1,5mm

(1,4mm /1,8mm)

Inboard Kit -18153 Kit -18154 Kit -18148 Kit -18149 Kit -18148

Bag -19129 Bag -19130 Bag -19124 Bag -19125 Bag -19124

Onboard Kit -18158 Kit -18159 Kit -18153 Kit -18155 Kit -18153

Bag -19134 Bag -19135 Bag -19129 Bag -19131 Bag -19129

0.093in

(0.084in / 0.104in)

2,4mm

(2,1mm /2,6mm)

Inboard Kit -18153 Kit -18154 Kit -18148 Kit -18149 Kit -18148

Bag -19129 Bag -19130 Bag -19124 Bag -19125 Bag -19124

Onboard Kit -18156 Kit -18157 Kit -18150 Kit -18152 Kit -18150

Bag -19132 Bag -19133 Bag -19126 Bag -19128 Bag -19126

0.125in

(0.113in / 0.138in)

3,1mm

(2,8mm / 3,5mm)

Onboard

Kit - 24054 Kit -18157 Kit -24056 Kit - 18152 Kit-24056

Bag -19132 Bag -19133 Bag -19126 Bag - 19128 Bag-19126

Kits include six (6] standoffs and screws. Mini and Micro modules require a minimum of four (4] standoffs.

Bags of one hundred (100] do not include screws; #4-40 thread hardware required.

References

InMate PCB layout drawing for Maxi Module http://asp.vicorpower.com/cadUtil/display_cad.asp?pn=18400&ct=PDF

InMate PCB layout drawing for Mini Module http://asp.vicorpower.com/cadUtil/display_cad.asp?pn=18399&ct=PDF

InMate PCB layout drawing for Micro Module http://asp.vicorpower.com/cadUtil/display_cad.asp?pn=18398&ct=PDF

InMate and Socket outline drawing for Inboard Maxi Modules http://asp.vicorpower.com/cadUtil/display_cad.asp?pn=18483-XX&ct=PDF

InMate and Socket outline drawing for Inboard Mini Modules http://asp.vicorpower.com/cadUtil/display_cad.asp?pn=18482-XX&ct=PDF

InMate and Socket outline drawing for Inboard Micro Modules http://asp.vicorpower.com/cadUtil/display_cad.asp?pn=18481-XX&ct=PDF

InMate and Socket outline drawing for Onboard Maxi Modules http://asp.vicorpower.com/cadUtil/display_cad.asp?pn=18480-XX&ct=PDF

InMate and Socket outline drawing for Onboard Mini Modules http://asp.vicorpower.com/cadUtil/display_cad.asp?pn=20030-XX&ct=PDF

InMate and Socket outline drawing for Onboard Micro Modules http://asp.vicorpower.com/cadUtil/display_cad.asp?pn=20029-XX&ct=PDF

Module Exchange Tool

Used in facilitating the proper extraction of modules from InMate or SurfMate sockets.

Removal without using the Exchange Tool may cause damage to the sockets.

Description Part Number

Maxi Exchange Tool 22827

Mini Exchange Tool 22828

Micro Exchange Tool 22829

22827

22829

22828