DATA SHEET BIPOLAR ANALOG INTEGRATED CIRCUIT PC4071 J-FET INPUT LOW-NOISE OPERATIONAL AMPLIFIER DESCRIPTION The PC4071 is a J-FET input operational amplifier. This product is designed as low noise version of the PC4081. The features of the PC4071 are more improved input equivalent noise voltage, input offset voltage and input bias current than those of PC4081. By these features, the PC4071 is excellent choice for wide variety of applications including audio preamplifier and active filter. FEATURES * Low noise: en = 18 nV/ Hz (TYP.) * Very low input bias and offset currents * Output short circuit protection * High input impedance...J-FET Input stage * Internal frequency compensation * High slew rate...13 V/s (TYP.) ORDERING INFORMATION Part Number Package PC4071C 8-pin plastic DIP (7.62 mm (300)) PC4071G2 8-pin plastic SOP (5.72 mm (225)) PIN CONFIGURATION (Top View) EQUIVALENT CIRCUIT V (7) R1 Q14 Q1 Q2 Q8 Q16 R8 II 2 IN 3 7 V+ Q10 IN (3) C1 Q6 Q7 OFFSET NULL 8 NC Q12 (2) II (1) OFFSET 1 NULL Q9 Q5 PC4071C, 4071G2 + R2 R3 R4 Q13 D1 Q4 (5) Q3 R9 R6 R10 Q15 OUT (6) Q11 R5 OFFSET NULL R11 V D2 _ _ + 6 OUT OFFSET 5 NULL 4 R7 V (4) - Remark NC : No Connection The information in this document is subject to change without notice. Before using this document, please confirm that this is the latest version. Not all devices/types available in every country. Please check with local NEC representative for availability and additional information. Document No. G15204EJ4V0DS00 (4th edition) (Previous No. IC-1616) Date Published November 2000 NS CP(K) Printed in Japan The mark shows major revised points. (c) 1987 PC4071 ABSOLUTE MAXIMUM RATINGS (TA = 25C) Parameter + Voltage between V and V Symbol - Note 1 V+ - V- Differential Input Voltage VID Note 2 Input Voltage Output Voltage C Power Dissipation Note 4 Package Unit -0.3 to +36 V 30 V - + - + V -0.3 to V +0.3 VI Note 3 Ratings V VO V -0.3 to V +0.3 V PT 350 mW 440 mW Indefinite sec Note 5 G2 Package Note 6 Output Short Circuit Duration Operating Ambient Temperature TA -20 to +80 C Storage Temperature Tstg -55 to +125 C Notes 1. Reverse connection of supply voltage can cause destruction. 2. The input voltage should be allowed to input without damage or destruction. Even during the transition period of supply voltage, power on/off etc., this specification should be kept. The normal operation will establish when the both inputs are within the Common Mode Input Voltage Range of electrical characteristics. 3. This specification is the voltage which should be allowed to supply to the output terminal from external without damage or destructive. Even during the transition period of supply voltage, power on/off etc., this specification should be kept. The output voltage of normal operation will be the Output Voltage Swing of electrical characteristics. 4. Thermal derating factor is -5.0 mV/C when operating ambient temperature is higher than 55C. 5. Thermal derating factor is -4.4 mV/C when operating ambient temperature is higher than 25C. 6. Pay careful attention to the total power dissipation not to exceed the absolute maximum ratings, Note 4 and Note 5. RECOMMENDED OPERATING CONDITIONS Parameter Symbol MIN. Supply Voltage V 5 Output Current Capacitive Load (AV = +1, Rf = 0 ) TYP. MAX. Unit 16 V IO 10 mA CL 100 pF OFFSET VOLTAGE NULL CIRCUIT 2 _ 6 3 5 + 1 - open or connected to V via a resistor as shown in the left figure. Don't connect to 100 k V 2 Remark The OFFSET NULL pins should be left - any lines other than V , otherwise VR1 mulfunction, degradation, or failure may _ occur. Data Sheet G15204EJ4V0DS PC4071 ELECTRICAL CHARACTERISTICS (TA = 25C, V = 15 V) Parameter Input Offset Voltage Input Bias Current TYP. MAX. Unit Note 7 Conditions MIN. 3 10 mV IIO 5 50 pA IB 30 200 pA 2.7 mA RS 50 VIO Note 7 Input Offset Current Symbol Large Signal Voltage Gain AV RL 2 k , VO = 10 V Supply Current ICC IO = 0 A Common Mode Rejection Ratio CMR 70 86 dB Supply Voltage Rejection Ratio SVR 70 86 dB Output Voltage Swing Vom RL 10 k 12 13.5 V RL 2 k 10 12 V Common Model Input Voltage Range VICM Slew Rate SR Unity Gain Frequency funity Input Equivalent Noise Voltage Vn Input Equivalent Noise Voltage Density 25000 200000 2.0 10 V 13 V/s 3 MHz RS = 100 , f = 10 Hz to 10 kHz 4 Vr.m.s. en RS = 100 , f = 1 kHz 18 nV/Hz Input Offset Voltage VIO RS 50 , TA = -20 to +70C Average VIO Temperature Drift VIO/T TA = -20 to +70C IIO TA = -20 to +70C 2 nA IB TA = -20 to +70C 7 nA Input Offset Current Input Bias Current Note 7 Note 7 AV = 1 13 mV V/C 10 Notes 7. Input bias currents flow into IC. Because each currents are gate leak current of P-channel J-FET on input stage. And that are temperature sensitive. Short time measuring method is recommendable to maintain the junction temperature close to the operating ambient temperature. Data Sheet G15204EJ4V0DS 3 PC4071 TYPICAL PERFORMANCE CHARACTERISTICS (TA = 25C, TYP.) POWER DISSIPATION OPEN LOOP FREQUENCY RESPONSE 120 500 400 AV - Open Loop Voltage Gain - dB PT - Total Power Dissipation - mW 600 PC4071G2 PC4071C 200C/W 300 200 227C/W 100 20 0 40 60 80 V = 15 V RL = 2 k 100 80 60 40 20 0 100 1 TA - Operating Ambient Temperature - C 10 100 INPUT OFFSET VOLTAGE 5 1k 10 k 100 k 1 M INPUT BIAS CURRENT 100 V = 15 V V = 15 V IB - Input Bias Current - nA 4 VIO - Input Offset Voltage - mV 10 M f - Frequency - Hz 3 2 1 0 -1 -2 10 1.0 0.1 -3 -4 -5 -40 0.01 -20 -20 0 20 40 60 0 20 40 60 80 TA - Operating Ambient Temperature - C 80 TA - Operating Ambient Temperature - C LARGE SIGNAL FREQUENCY RESPONSE OUTPUT VOLTAGE SWING 40 30 RL = 10 k 20 V = 10 V 10 V = 5 V 0 100 1k 10 k RL = 10 k Vom - Output Voltage Swing - Vp-p Vom - Output Voltage Swing - Vp-p V = 15 V 100 k 1M 10 M 30 20 10 0 4 10 V - Supply Voltage - V f - Frequency - Hz Data Sheet G15204EJ4V0DS 20 PC4071 OUTPUT VOLTAGE SWING SUPPLY CURRENT 2.5 V = 15 V ICC - Supply Current - mA Vom - Output Voltage Swing - Vp-p 30 20 10 2.0 1.5 1.0 0.5 5 0 0 100 300 1k 3k 10 15 20 V - Supply Voltage - V 10 k RL - Load Resistance - INPUT EQUIVALENT NOISE VOLTAGE DENSITY 4 10 3 10 2 V = 15 V RS = 100 10 1 10 100 1k 10 k 100 k VOLTAGE FOLLOWER PULSE RESPONSE VI - Input Voltage - V / VO - Output Voltage - V en - Input Equivalent Noise Voltage Density - nV/ Hz 10 AV = +1 RL = 2 k CL = 100 pF V = 15 V 5 0 -5 5 0 -5 f - Frequency - Hz 0 1 2 3 4 t - Time - s Data Sheet G15204EJ4V0DS 5 PC4071 PACKAGE DRAWINGS (Unit : mm) 8-PIN PLASTIC DIP (7.62mm(300)) 8 5 1 4 A K J L P I C H G B M R F D N M NOTES 1. Each lead centerline is located within 0.25 mm of its true position (T.P.) at maximum material condition. 2. ltem "K" to center of leads when formed parallel. ITEM MILLIMETERS A B 10.16 MAX. 1.27 MAX. C 2.54 (T.P.) D 0.500.10 F 1.4 MIN. G 3.20.3 H 0.51 MIN. I J 4.31 MAX. 5.08 MAX. K 7.62 (T.P.) L 6.4 M 0.25 +0.10 -0.05 N 0.25 P 0.9 MIN. R 015 P8C-100-300B,C-2 6 Data Sheet G15204EJ4V0DS PC4071 8-PIN PLASTIC SOP (5.72 mm (225)) 8 5 detail of lead end P 4 1 A H F I G J S B C D M L N K S M E NOTE Each lead centerline is located within 0.12 mm of its true position (T.P.) at maximum material condition. ITEM MILLIMETERS A 5.2 +0.17 -0.20 B 0.78 MAX. C 1.27 (T.P.) D 0.42 +0.08 -0.07 E 0.10.1 F 1.590.21 G 1.49 H 6.50.3 I 4.40.15 J 1.10.2 K 0.17 +0.08 -0.07 L 0.60.2 M 0.12 N 0.10 P 3 +7 -3 S8GM-50-225B-6 Data Sheet G15204EJ4V0DS 7 PC4071 RECOMMENDED SOLDERING CONDITIONS When soldering this product, it is highly recommended to observe the conditions as shown below. If other soldering processes are used, or if the soldering is performed under different conditions, please make sure to consult with our sales offices. For more details, refer to our document "SEMICONDUCTOR DEVICE MOUNTING TECHNOLOGY MANUAL"(C10535E). Type of Surface Mount Device PC4071G2: 8-pin plastic SOP (5.72 mm (225)) Process Infrared Ray Reflow Conditions Symbol Peak temperature: 230C or below (Package surface temperature), IR30-00-1 Reflow time: 30 seconds or less (at 210C or higher), Maximum number of reflow processes: 1 time. Vapor Phase Soldering Peak temperature: 215C or below (Package surface temperature), VP15-00-1 Reflow time: 40 seconds or less (at 200C or higher), Maximum number of reflow processes: 1 time. Wave Soldering Solder temperature: 260C or below, Flow time: 10 seconds or less, WS60-00-1 Maximum number of flow processes: 1 time, Pre-heating temperature: 120C or below (Package surface temperature). Partial Heating Method Pin temperature: 300C or below, - Heat time: 3 seconds or less (Per each side of the device). Caution Apply only one kind of soldering condition to a device, except for "partial heating method", or the device will be damaged by heat stress. Type of Through-hole Device PC4071C: 8-pin plastic DIP (7.62 mm (300)) Process Conditions Wave Soldering Solder temperature: 260C or below, (only to leads) Flow time: 10 seconds or less. Partial Heating Method Pin temperature: 300C or below, Heat time: 3 seconds or less (per each lead). Caution For through-hole device, the wave soldering process must be applied only to leads, and make sure that the package body does not get jet soldered. 8 Data Sheet G15204EJ4V0DS PC4071 [MEMO] Data Sheet G15204EJ4V0DS 9 PC4071 [MEMO] 10 Data Sheet G15204EJ4V0DS PC4071 [MEMO] Data Sheet G15204EJ4V0DS 11 PC4071 * The information in this document is current as of November, 2000. The information is subject to change without notice. For actual design-in, refer to the latest publications of NEC's data sheets or data books, etc., for the most up-to-date specifications of NEC semiconductor products. Not all products and/or types are available in every country. Please check with an NEC sales representative for availability and additional information. * No part of this document may be copied or reproduced in any form or by any means without prior written consent of NEC. NEC assumes no responsibility for any errors that may appear in this document. * NEC does not assume any liability for infringement of patents, copyrights or other intellectual property rights of third parties by or arising from the use of NEC semiconductor products listed in this document or any other liability arising from the use of such products. No license, express, implied or otherwise, is granted under any patents, copyrights or other intellectual property rights of NEC or others. * Descriptions of circuits, software and other related information in this document are provided for illustrative purposes in semiconductor product operation and application examples. The incorporation of these circuits, software and information in the design of customer's equipment shall be done under the full responsibility of customer. NEC assumes no responsibility for any losses incurred by customers or third parties arising from the use of these circuits, software and information. * While NEC endeavours to enhance the quality, reliability and safety of NEC semiconductor products, customers agree and acknowledge that the possibility of defects thereof cannot be eliminated entirely. To minimize risks of damage to property or injury (including death) to persons arising from defects in NEC semiconductor products, customers must incorporate sufficient safety measures in their design, such as redundancy, fire-containment, and anti-failure features. * NEC semiconductor products are classified into the following three quality grades: "Standard", "Special" and "Specific". The "Specific" quality grade applies only to semiconductor products developed based on a customer-designated "quality assurance program" for a specific application. The recommended applications of a semiconductor product depend on its quality grade, as indicated below. Customers must check the quality grade of each semiconductor product before using it in a particular application. "Standard": Computers, office equipment, communications equipment, test and measurement equipment, audio and visual equipment, home electronic appliances, machine tools, personal electronic equipment and industrial robots "Special": Transportation equipment (automobiles, trains, ships, etc.), traffic control systems, anti-disaster systems, anti-crime systems, safety equipment and medical equipment (not specifically designed for life support) "Specific": Aircraft, aerospace equipment, submersible repeaters, nuclear reactor control systems, life support systems and medical equipment for life support, etc. The quality grade of NEC semiconductor products is "Standard" unless otherwise expressly specified in NEC's data sheets or data books, etc. If customers wish to use NEC semiconductor products in applications not intended by NEC, they must contact an NEC sales representative in advance to determine NEC's willingness to support a given application. (Note) (1) "NEC" as used in this statement means NEC Corporation and also includes its majority-owned subsidiaries. (2) "NEC semiconductor products" means any semiconductor product developed or manufactured by or for NEC (as defined above). M8E 00. 4