80C32/80C52/80C32E
1
Rev. J – July 03, 2000
1. Description
TEMIC’s 80C52 and 80C32 are high performance CMOS versions of the 8052/8032 NMOS single chip 8 bit
Microcontroller.
The fully static design of the TEMIC 80C52/80C32 allows to reduce system power consumption by bringing the clock
frequency down to any value, even DC, without loss of data.
The 80C52 retains all the features of the 8052: 8 K bytes of ROM; 256 bytes of RAM; 32 I/O lines; three 16 bit timers;
a 6-source, 2-level interrupt structure; a full duplex serial port; and on-chip oscillator and clock circuits. In addition,
the 80C52 has 2 software-selectable modes of reduced activity for further reduction in power consumption. In the idle
mode the CPU is frozen while the RAM, the timers, the serial port and the interrupt system continue to function. In
the power down mode the RAM is saved and all other functions are inoperative.
The 80C32 is identical to the 80C52 except that it has no on-chip ROM. TEMIC’s 80C52/80C32 are manufactured
using SCMOS process which allows them to run from 0 up to 36 MHz with VCC = 5 V.
D80C32: Romless version of the 80C52
D80C32/80C52-12: 0 to 12 MHz
D80C32/80C52-30: 0 to 30 MHz
D80C32/80C52-36: 0 to 36 MHz
D80C32E-30: 0 to 30 MHz Radiation Tolerant
2. Features
DPower control modes
D256 bytes of RAM
D8 Kbytes of ROM (80C52)
D32 programmable I/O lines
DThree 16 bit timer/counters
D64 K program memory space
D64 K data memory space
CMOS 0 to 36 MHz Single Chip 8–bit Microcontroller
80C32/80C52/80C32E
2Rev. J – July 03, 2000
3. Interface
Serial I/O Port
CPU
P0
8–BIT INTERNAL BUS
Parallel I/O Ports
&
External Bus
T0
INT0
T1
INT1
XTAL1
XTAL2
EA
ALE
PSEN
WR
RD
AD0–AD7
A8–A15
RST
VCC VSS
Timer 0 Timer 1 Timer 2
Interrupt Unit
Oscillator
&
Timing
RAM
256 bytes ROM
8 Kbytes
RxD TxD
P3P2P1 T2 T2EX
Figure 1. Block Diagram
80C32/80C52/80C32E
3
Rev. J – July 03, 2000
Diagrams are for reference only. Package sizes are not to scale.
CDIL JLCC
P1.4
P1.3
P1.2
P1.1/T2EX
P1.0/T2
NC
VCC
P0.0/A0
P0.1/A1
P0.2/A2
P0.3/A3
P0.4/A4
P1.5
P1.6
P1.7
RST
RxD/P3.0
NC
TxD/P3.1
INT0/P3.2
INT1/P3.3
T0/P3.4
T1/P3.5
P0.5/A5
P0.6/A6
P0.7/A7
EA
NC
ALE
PSEN
P2.7/A15
P2.6/A14
P2.5/A13
WR/P3.6
RD/P3.7
XTAL2
XTAL1
VSS
NC
P2.0/A8
P2.1/A9
P2.2/A10
P2.3/A11
P2.4/A12
39
38
37
36
35
34
33
32
31
30
29
7
8
9
10
11
12
14
15
16
17
13
18 19 23222120 262524 27 28
5 4 3 2 1 6 44 43 42 41 40
80C32/80C52/
80C32E
80C32/80C52/
80C32E
Figure 2. Pin Configuration
80C32/80C52/80C32E
4Rev. J – July 03, 2000
4. Pin Description
4.1. VSS
Circuit ground potential.
4.2. VCC
Supply voltage during normal, Idle, and Power Down operation.
4.3. Port 0
Port 0 is an 8 bit open drain bi-directional I/O port. Port 0 pins that have 1’s written to them float, and in that state can
be used as high-impedance inputs.
Port 0 is also the multiplexed low-order address and data bus during accesses to external Program and Data Memory.
In this application it uses strong internal pullups when emitting 1’s. Port 0 also outputs the code bytes during program
verification in the 80C52. External pullups are required during program verification. Port 0 can sink eight LS TTL
inputs.
4.4. Port 1
Port 1 is an 8 bit bi-directional I/O port with internal pullups. Port 1 pins that have 1’s written to them are pulled high
by the internal pullups, and in that state can be used as inputs. As inputs, Port 1 pins that are externally being pulled
low will source current (IIL, on the data sheet) because of the internal pullups.
Port 1 also receives the low-order address byte during program verification. In the 80C52, Port 1 can sink/ source three
LS TTL inputs. It can drive CMOS inputs without external pullups.
2 inputs of PORT 1 are also used for timer/counter 2 :
P1.0 [T2]: External clock input for timer/counter 2. P1.1 [T2EX]: A trigger input for timer/counter 2, to be reloaded
or captured causing the timer/counter 2 interrupt.
4.5. Port 2
Port 2 is an 8 bit bi-directional I/O port with internal pullups. Port 2 pins that have 1’s written to them are pulled high
by the internal pullups, and in that state can be used as inputs. As inputs, Port 2 pins that are externally being pulled
low will source current (ILL, on the data sheet) because of the internal pullups. Port 2 emits the high-order address
byte during fetches from external Program Memory and during accesses to external Data Memory that use 16 bit
addresses (MOVX @DPTR). In this application, it uses strong internal pullups when emitting 1’s. During accesses to
external Data Memory that use 8 bit addresses (MOVX @Ri), Port 2 emits the contents of the P2 Special Function
Register.
It also receives the high-order address bits and control signals during program verification in the 80C52. Port 2 can
sink/source three LS TTL inputs. It can drive CMOS inputs without external pullups.
4.6. Port 3
Port 3 is an 8 bit bi-directional I/O port with internal pullups. Port 3 pins that have 1’s written to them are pulled high
by the internal pullups, and in that state can be used as inputs. As inputs, Port 3 pins that are externally being pulled
low will source current (ILL, on the data sheet) because of the pullups. It also serves the functions of various special
features of the TEMIC 51 Family, as listed below.
80C32/80C52/80C32E
5
Rev. J – July 03, 2000
Port Pin Alternate Function
P3.0
P3.1
P3.2
P3.3
P3.4
P3.5
P3.6
P3.7
RXD (serial input port)
TXD (serial output port)
INT0 (external interrupt 0)
INT1 (external interrupt 1)
TD (Timer 0 external input)
T1 (Timer 1 external input)
WR (external Data Memory write strobe)
RD (external Data Memory read strobe)
Port 3 can sink/source three LS TTL inputs. It can drive CMOS inputs without external pullups.
4.7. RST
A high level on this for two machine cycles while the oscillator is running resets the device. An internal pull-down
resistor permits Power -On reset using only a capacitor connected to VCC. As soon as the Reset is applied (Vin), PORT
1, 2 and 3 are tied to one. This operation is achieved asynchronously even if the oscillator does not start-up.
4.8. ALE
Address Latch Enable output for latching the low byte of the address during accesses to external memory. ALE is
activated as though for this purpose at a constant rate of 1/6 the oscillator frequency except during an external data
memory access at which time one ALE pulse is skipped. ALE can sink/source 8 LS TTL inputs. It can drive CMOS
inputs without an external pullup.
4.9. PSEN
Program Store Enable output is the read strobe to external Program Memory. PSEN is activated twice each machine
cycle during fetches from external Program Memory. (However , when executing out of external Program Memory , two
activations of PSEN are skipped during each access to external Data Memory). PSEN is not activated during fetches
from internal Program Memory. PSEN can sink/source 8 LS TTL inputs. It can drive CMOS inputs without an external
pullup.
4.10. EA
When EA is held high, the CPU executes out of internal Program Memory (unless the Program Counter exceeds 1
FFFH). When EA is held low, the CPU executes only out of external Program Memory. EA must not be floated.
4.11. XTAL1
Input to the inverting amplifier that forms the oscillator. Receives the external oscillator signal when an external
oscillator is used.
Output of the inverting amplifier that forms the oscillator . This pin should be floated when an external oscillator is used.
80C32/80C52/80C32E
6Rev. J – July 03, 2000
5. Idle And Power Down Operation
Figure 3. shows the internal Idle and Power Down clock configuration. As illustrated, Power Down operation stops
the oscillator. Idle mode operation allows the interrupt, serial port, and timer blocks to continue to function, while the
clock to the CPU is gated off.
These special modes are activated by software via the Special Function Register, PCON. Its hardware address is 87H.
PCON is not bit addressable.
Figure 3. Idle and Power Down Hardware
PCON: Power Control Register
(MSB) (LSB)
76543210
SMOD – – – GF1 GF0 PD IDL
Symbol Position Name and Function
SMOD PCON.7 Double Baud rate bit
When set to a 1, the baud rate is doubled when the serial port is being used in either modes 1, 2 or 3.
–PCON.6 Reserved
The value read from this bit is indeterminate. Do not set this bit.
–PCON.5 Reserved
The value read from this bit is indeterminate. Do not set this bit.
–PCON.4 Reserved
The value read from this bit is indeterminate. Do not set this bit.
GF1 PCON.3 General–purpose flag bit
GF0 PCON.2 General–purpose flag bit
PD(1) PCON.1
Power Down bit. Setting this bit activates power down operation
Cleared by hardware when an interrupt or reset occurs.
Set to activate the Power–Down mode.
If IDL and PD are both set, PD takes precedence.
IDL(1) PCON.0
Idle mode bit
Cleared by hardware when an interrupt or reset occurs.
Set to activate the Idle mode.
If IDL and PD are both set, PD takes precedence.
1. If 1’s are written to PD and IDL at the same time. PD takes, precedence. The reset value of PCON is (000X0000).
80C32/80C52/80C32E
7
Rev. J – July 03, 2000
5.1. Idle Mode
The instruction that sets PCON.0 is the last instruction executed before the Idle mode is activated. Once in the Idle
mode the CPU status is preserved in its entirety: the Stack Pointer, Program Counter, Program Status Word,
Accumulator, RAM and all other registers maintain their data during idle. Table 1. describes the status of the external
pins during Idle mode.
There are three ways to terminate the Idle mode. Activation of any enabled interrupt will cause PCON.0 to be cleared
by hardware, terminating Idle mode. The interrupt is serviced, and following RETI, the next instruction to be executed
will be the one following the instruction that wrote 1 to PCON.0.
The flag bits GF0 and GF1 may be used to determine whether the interrupt was received during normal execution or
during the Idle mode. For example, the instruction that writes to PCON.0 can also set or clear one or both flag bits.
When Idle mode is terminated by an enabled interrupt, the service routine can examine the status of the flag bits.
The second way of terminating the Idle mode is with a hardware reset. Since the oscillator is still running, the hardware
reset needs to be active for only 2 machine cycles (24 oscillator periods) to complete the reset operation.
5.2. Power Down Mode
The instruction that sets PCON.1 is the last executed prior to entering power down. Once in power down, the oscillator
is stopped. The contents of the onchip RAM and the Special Function Register is saved during power down mode. The
hardware reset initiates the Special Fucntion Register. In the Power Down mode, VCC may be lowered to minimize
circuit power consumption. Care must be taken to ensure the voltage is not reduced until the power down mode is
entered, and that the voltage is restored before the hardware reset is applied which freezes the oscillator. Reset should
not be released until the oscillator has restarted and stabilized.
Table 1. describes the status of the external pins while in the power down mode. It should be noted that if the power
down mode is activated while in external program memory, the port data that is held in the Special Function Register
P2 is restored to Port 2. If the data is a 1, the port pin is held high during the power down mode by the strong pullup,
T1, shown in Figure 4.
Table 1. Status of the external pins during idle and power down modes
Mode Program Memory Ale PSEN PORT0 PORT1 PORT2 PORT3
Idle Internal 1 1 Port Data Port Data Port Data Port Data
Idle External 1 1 Floating Port Data Address Port Data
Power Down Internal 0 0 Port Data Port Data Port Data Port Data
Power Down External 0 0 Floating Port Data Port Data Port Data
5.3. Stop Clock Mode
Due to static design, the TEMIC 80C32/C52 clock speed can be reduced until 0 MHz without any data loss in memory
or registers. This mode allows step by step utilization, and permits to reduce system power consumption by bringing
the clock frequency down to any value. At 0 MHz, the power consumption is the same as in the Power Down Mode.
80C32/80C52/80C32E
8Rev. J – July 03, 2000
5.4. I/O Ports
The I/O buffers for Ports 1, 2 and 3 are implemented as shown in Figure 4.
Figure 4. I/O Buffers in the 80C52 (Ports 1, 2, 3)
When the port latch contains a 0, all pFETS in figure 4 are off while the nFET is turned on. When the port latch makes
a 0-to-1 transition, the nFET turns off. The strong pFET, T1, turns on for two oscillator periods, pulling the output high
very rapidly. As the output line is drawn high, pFET T3 turns on through the inverter to supply the IOH source current.
This inverter and T form a latch which holds the 1 and is supported by T2.
When Port 2 is used as an address port, for access to external program of data memory, any address bit that contains
a 1 will have his strong pullup turned on for the entire duration of the external memory access.
When an I/O pin on Ports 1, 2, or 3 is used as an input, the user should be aware that the external circuit must sink current
during the logical 1-to-0 transition. The maximum sink current is specified as ITL under the D.C. Specifications. When
the input goes below approximately 2 V, T3 turns off to save ICC current. Note, when returning to a logical 1, T2 is
the only internal pullup that is on. This will result in a slow rise time if the user ’s circuit does not force the input line
high.
5.5. Oscillator Characteristics
XTAL1 and XTAL2 are the input and output respectively, of an inverting amplifier which is configured for use as an
on-chip oscillator, as shown in Figure 5. Either a quartz crystal or ceramic resonator may be used.
Figure 5. Crystal Oscillator
To drive the device from an external clock source, XTAL1 should be driven while XTAL2 is left unconnected as shown
in Figure 6. There are no requirements on the duty cycle of the external clock signal, since the input to the internal
clocking circuitry is through a divide-by-two flip-flop, but minimum and maximum high and low times specified on
the Data Sheet must be observed.
80C32/80C52/80C32E
9
Rev. J – July 03, 2000
Figure 6. External Drive Configuration
6. Hardware Description
Same as for the 80C51, plus a third timer/counter.
6.1. Timer/Event Counter 2
Timer 2 is a 16 bit timer/counter like Timers 0 and 1, it can operate either as a timer or as an event counter. This is
selected by bit C/T2 in the Special Function Register T2CON (Figure 1.). It has three operating modes : “capture”,
“autoload” and “baud rate generator”, which are selected by bits in T2CON as shown in Table 2.
In the capture mode there are two options which are selected by bit EXEN2 in T2CON; If EXEN2 = 0, then Timer 2
is a 16 bit timer or counter which upon overflowing sets bit TF2, the Timer 2 overflow bit, which can be used to generate
an interrupt. If EXEN2 = 1, then Timer 2 still does the above, but with the added feature that a 1-to-0 transition at
external input T2EX causes the current value in the Timer 2 registers, TL2 and TH2, to be captured into registers
RCAP2L and RCAP2H, respectively, (RCAP2L and RCAP2H are new Special Function Register in the 80C52). In
addition, the transition at T2EX causes bit EXF2 in T2CON to be set, and EXF2, like TF2, can generate an interrupt.
Table 2. Timer 2 Operating Modes
RCLK +
TCLK CP/RL2 TR2 MODE
0
0
1
X
0
1
X
X
1
1
1
0
16 bit auto-reload
16 bit capture
baud rate generator
(off)
The capture mode is illustrated in Figure 7.
80C32/80C52/80C32E
10 Rev. J – July 03, 2000
T2
0
1
TR2
T2CON.2
C/T2
T2CON.1
OSC 12
T2EX EXF2
T2CON.6
RCAP2LRCAP2H
TL2
(8 bits)
TH2
(8 bits) TF2
T2CON.7
EXEN2
T2CON.3
Timer 2
Interrupt
Request
Overflow
Figure 7. Timer 2 in Capture Mode
In the auto-reload mode there are again two options, which are selected by bit EXEN2 in T2CON.If EXEN2 = 0, then
when T imer 2 rolls over it does not only set TF2 but also causes the T imer 2 register to be reloaded with the 16 bit value
in registers RCAP2L and RCAP2H, which are preset by software. If EXEN2 = 1, then Timer 2 still does the above,
but with the added feature that a 1-to-0 transition at external input T2EX will also trigger the 16 bit reload and set EXF2.
The auto-reload mode is illustrated in Figure 8.
T2
0
1
TR2
T2CON.2
C/T2
T2CON.1
OSC 12
T2EX EXF2
T2CON.6
RCAP2LRCAP2H
TL2
(8 bits)
TH2
(8 bits) TF2
T2CON.7
EXEN2
T2CON.3
Timer 2
Interrupt
Request
Overflow
Figure 8. Timer in Auto–Reload Mode
80C32/80C52/80C32E
11
Rev. J – July 03, 2000
T2CON (S:C8h)
T imer/Counter 2 Control Register
76543210
TF2 EXF2 RCLK TCLK EXEN2 TR2 C/T2# CP/RL2#
Bit
Number Bit
Mnemonic Description
7 TF2
Timer 2 Overflow flag
TF2 is not set if RCLK= 1 or TCLK= 1.
Set by hardware when Timer 2 overflows.
Must be cleared by software
6 EXF2 Timer 2 External flag
EXF2 does not cause an interrupt in up/down counter mode (DCEN= 1).
Set by hardware if EXEN2= 1 when a negative transition on T2EX pin is detected.
5 RCLK Receive Clock bit
Clear to select Timer 1 as the Timer Receive Baud Rate Generator for the Serial Port in modes 1 and 3.
Set to select Timer 2 as the Timer Receive Baud Rate Generator for the Serial Port in modes 1 and 3.
4 TCLK Transmit Clock bit
Clear to select Timer 1 as the Timer Transmit Baud Rate Generator for the Serial Port in modes 1 and 3.
Set to select Timer 2 as the Timer Transmit Baud Rate Generator for the Serial Port in modes 1 and 3.
3 EXEN2
Timer 2 External Enable bit
Clear to ignore events on T2EX pin for Timer 2.
Set to cause a capture or reload when a negative transition on T2EX pin is detected unless Timer 2 is being
used as the Baud Rate Generator for the Serial Port.
2 TR2 Timer 2 Run Control bit
Clear to turn off Timer 2.
Set to to turn on Timer 2.
1 C/T2# Timer 2 Counter/Timer Select bit
Clear for Timer operation: Timer 2 counts the divided–down system clock.
Set for Counter operation: Timer 2 counts negative transitions on external pin T2.
0 CP/RL2#
Capture/Reload bit
CP/RL2# is ignored and Timer 2 is forced to auto–reload on Timer 2 overflow if RCLK= 1 or TCLK= 1.
Clear to auto–reload on Timer 2 overflows or negative transitions on T2EX pin if EXEN2= 1.
Set to capture on negative transitions on T2EX pin if EXEN2= 1
Reset Value= 0000 0000b
7. Electrical Characteristics
7.1. Absolute Maximum Ratings(1)
Ambiant Temperature Under Bias:
M = military –55_C to +125_C. . . . . . . . . . . . . . . . . . . . . . . .
Storage Temperature –65_C to + 150_C. . . . . . . . . . . . . . . . .
Voltage on VCC to VSS –0.5 V to + 7 V. . . . . . . . . . . . . . .
Voltage on Any Pin to VSS –0.5 V to VCC + 0.5 V
. . . . . . . . . . . . . . .
Power Dissipation 1 W(2)
. . . . . . . . . . . . . . . . . . .
Notes:
1. Stresses at or above those listed under “ Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress rating
only and functional operation of the device at these or any other conditions above those indicated in the operational sections of this
specification is not implied. Exposure to absolute maximum rating conditions may affect device reliability.
2. This value is based on the maximum allowable die temperature and the thermal resistance of the package.
80C32/80C52/80C32E
12 Rev. J – July 03, 2000
7.2. DC parameters –Military
Table 3. DC Parameters
TA= –55°C + 125°C; VSS= 0 V; VCC= 5 V ± 10 %; F= 0 to 36 MHz
Symbol Parameter Min Max Unit Test Conditions
VIL Input Low Voltage – 0.5 0.2 VCC –
0.1 V
VIH Input High Voltage (Except XTAL and RST) 0.2 VCC + 1.4 VCC + 0.5 V
VIH1 Input High Voltage (for XTAL and RST) 0.7 VCC VCC + 0.5 V
VOL Output Low Voltage (Port 1, 2 and 3) 0.45 V IOL= 1.6 mA(4)
VOL1 Output Low Voltage (Port 0, ALE, PSEN) 0.45 V IOL= 3.2 mA(4)
VOH Output High Voltage (Port 1, 2 and 3) 2.4 V IOH= – 60 µA
VCC= 5 V ± 10 %
0.75 VCC V IOH= – 25 µA
0.9 VCC V IOH= – 10 µA
VOH1 Output High Voltage
(Port 0 in External Bus Mode, ALE, PEN) 2.4 V IOH= – 400 µA
VCC= 5 V ± 10 %
0.75 VCC V IOH= – 150 µA
0.9 VCC V IOH= – 40 µA
IIL Logical 0 Input Current (Ports 1, 2 and 3) – 75 µAVin= 0.45 V
ILI Input leakage Current +/– 10 µA0.45 < Vin < VCC
ITL Logical 1 to 0 Transition Current (Ports 1, 2 and 3) – 750 µAVin= 2.0 V
IPD Power Down Current 75 µAVCC= 2.0 V to 5.5 V(3)
RRST RST Pulldown Resistor 50 200 KΩ
CIO Capacitance of I/O Buffer 10 pF MHz, Ta= 25_C
ICC Power Supply Current
Freq= 1 MHz Icc op
Icc idle
Freq= 6 MHz Icc op
Icc idle
Freq ≥ 12 MHz Icc op= 1.25 Freq (MHz) + 5 mA
Icc idle= 0.36 Freq (MHz) + 2.7 mA
1.8
1
10
4
mA
mA
mA
mA
VCC= 5.5 V
Notes:
1. ICC is measured with all output pins disconnected; XTAL1 driven with TCLCH, TCHCL= 5 ns, VIL= VSS + .5 V, VIH= VCC –.5 V; XTAL2
N.C. ; EA= RST= Port 0= VCC. ICC would be slighty higher if a crystal oscillator used.
2. Idle ICC is measured w ith all output pi ns disconnected ; XTAL1 driven with TCLCH, TCHCL= 5 ns, VIL= VSS + 5 V, VIH= VCC –.5 V ;
XTAL2 N.C; Port 0= VCC; EA= RST= VSS.
3. Power Down ICC is measured with all output pins disconnected; EA= PORT 0= VCC; XTAL2 N.C. ; RST= VSS.
4. Capacitance loading on Ports 0 and 2 may cause spurious noise pulses to be superimposed on the VOLS of ALE and Ports 1 and 3. The
noise is due to external bus capacitance discharging into the Port 0 and Port 2 pins when these pins make 1 to 0 transitions during bus
operations. In the worst cases (capacitive loading 100 pF), the noise pulse on the ALE line may exceed 0.45 V may exceed 0,45 V with maxi
VOL peak 0.6 V. A Schmitt Trigger use is not necessary.
80C32/80C52/80C32E
13
Rev. J – July 03, 2000
Figure 9. ICC Test Condition, Idle Mode. All other pins are disconnected
Figure 10. ICC Test Condition, Active Mode. All other pins are disconnected
Figure 11. ICC Test Condition, Power Down Mode. All other pins are disconnected
Note:
TCLCH= TCHCL= 5ns
Figure 12. Clock Signal Waveform for ICC Tests in Active and Idle Modes
80C32/80C52/80C32E
14 Rev. J – July 03, 2000
7.3. Explanation of the AC Symbol
Each timing symbol has 5 characters. The first character is always a “T” (stands for time). The other characters,
depending on their positions, stand for the name of a signal or the logical status of that signal. The following is a list
of all the characters and what they stand for.
Example :
TAVLL= Time for Address Valid to ALE low.
TLLPL= Time for ALE low to PSEN low.
A: Address.
C: Clock.
D: Input data.
H: Logic level HIGH
I: Instruction (program memory contents).
L: Logic level LOW, or ALE.
P: PSEN.
Q: Output data.
R: READ signal.
T: Time.
V: Valid.
W: WRITE signal.
X: No longer a valid logic level.
Z: Float.
80C32/80C52/80C32E
15
Rev. J – July 03, 2000
7.4. AC Parameters
TA= –55° + 125°C; VSS= 0 V; VCC= 5 V ± 10 %; F= 0 to 36 MHz
(Load Capacitance for PORT 0, ALE and PSEN= 100 pF; Load Capacitance for all other outputs= 80 pF)
Table 4. External Program Memory Characteristics (values in ns)
16 MHz 30 MHz 36 MHz
Symbol Parameter min max min max min max
TLHLL ALE Pulse Width 110 60 50
TAVLL Address valid to ALE 40 15 10
TLLAX Address Hold After ALE 35 35 35
TLLIV ALE to valid instr in 185 100 80
TLLPL ALE to PSEN 45 25 20
TPLPH PSEN pulse Width 165 80 75
TPLIV PSEN to valid instr in 125 65 50
TPXIX Input instr Hold After PSEN 0 0 0
TPXIZ Input instr Float After PSEN 50 30 25
TPXAV PSEN to Address Valid 55 35 30
TAVIV Address to Valid instr in 230 130 90
TPLAZ PSEN low to Address Float 10 6 5
TPLIV
TPLAZ
ALE
PSEN
PORT 0
PORT 2
A0–A7A0–A7 INSTR ININSTR IN INSTR IN
ADDRESS
OR SFR–P2 ADDRESS A8–A15ADDRESS A8–A15
12 TCLCL
TAVIV
TLHLL
TAVLL
TLLIV
TLLPL
TPLPH
TPXAV
TPXIX TPXIZ
TLLAX
Figure 13. External Program Memory Read Cycle
80C32/80C52/80C32E
16 Rev. J – July 03, 2000
Table 5. External Data Memory Characteristics (values in ns)
16 MHz 30 MHz 36 MHz
Symbol Parameter min max min max min max
TRLRH RD pulse Width 340 180 120
TWLWH WR pulse Width 340 180 120
TLLAX Address Hold After ALE 85 55 35
TRLDV RD to Valid Data in 240 135 110
TRHDX Data hold after RD 0 0 0
TRHDZ Data float after RD 90 70 50
TLLDV ALE to Valid Data In 435 235 170
TAVDV Address to Valid Data IN 480 260 190
TLLWL ALE to WR or RD 150 250 90 115 70 100
TAVWL Address to WR or RD 180 115 75
TQVWX Data valid to WR transition 35 20 15
TQVWH Data Setup to WR transition 380 215 170
TWHQX Data Hold after WR 40 20 15
TRLAZ RD low to Address Float 0 0 0
TWHLH RD or WR high to ALE high 35 90 20 40 20 40
TQVWHTLLAX
ALE
PSEN
WR
PORT 0
PORT 2
A0–A7 DATA OUT
ADDRESS
OR SFR–P2
TAVWL
TLLWL
TQVWX
ADDRESS A8–A15 OR SFR P2
TWHQX
TWHLH
TWLWH
Figure 14. External Data Memory Write Cycle
80C32/80C52/80C32E
17
Rev. J – July 03, 2000
ALE
PSEN
RD
PORT 0
PORT 2
A0–A7 DATA IN
ADDRESS
OR SFR–P2
TAVWL
TLLWL
TRLAZ
ADDRESS A8–A15 OR SFR P2
TRHDZ
TWHLH
TRLRH
TLLDV
TRHDX
TAVDV
TLLAX
Figure 15. External Data Memory Read Cycle
Table 6. Serial Port Timing – Shift Register Mode (values in ns)
16 MHz 30 MHz 36 MHz
Symbol Parameter min max min max min max
TXLXL Serial Port Clock Cycle Time 750 400 330
TQVXH Output Data Setup to Clock Rising Edge 563 300 220
TXHQX Output Data Hold after Clock Rising Edge 63 50 45
TXHDX Input Data Hold after Clock Rising Edge 0 0 0
TXHDV Clock Rising Edge to Input Data Valid 563 300 250
Figure 16. Shift Register Timing Waveforms
80C32/80C52/80C32E
18 Rev. J – July 03, 2000
Table 7. External Clock Drive Characteristics (XTAL1)
Symbol Parameter Min Max Unit
FCLCL Oscillator Frequency 44 MHz
TCLCL Oscillator period 22.7 ns
TCHCX High Time 5 ns
TCLCX Low Time 5 ns
TCLCH Rise Time 5 ns
TCHCL Fall T ime 5 ns
Figure 17. External Clock Drive Waveforms
Figure 18. AC Testing Input/Output Waveforms
AC inputs during testing are driven at VCC – 0.5 for a logic “1” and 0.45 V for a logic “0”. Timing measurements are
made at VIH min for a logic “1” and VIL max for a logic “0”.
Figure 19. Float Waveforms
For timing purposes as port pin is no longer floating when a 100 mV change from load voltage occurs and begins to
float when a 100 mV change from the loaded VOH/VOL level occurs. Iol/IoH ≥ ± 20 mA.
80C32/80C52/80C32E
19
Rev. J – July 03, 2000
Figure 20. Clock Waveforms
This diagram indicates when signals are clocked internally. The time it takes the signals to propagate to the pins,
however, ranges from 25 to 125 ns. This propagation delay is dependent on variables such as temperature and pin
loading. Propagation also varies from output to output and component. Typically though (TA = 25°C fully loaded) RD
and WR propagation delays are approximately 50 ns. The other signals are typically 85 ns. Propagation delays are
incorporated in the AC specifications.
80C32/80C52/80C32E
20 Rev. J – July 03, 2000
8. Ordering Information
Package Type
C: Side Brazed 40 (.6)
J: J Leaded LCC
D: CDIL 40 (.6)
Temperature Range
M : Military
S : Space
Part Number
80C52 Rom 8 K × 8
80C32 External ROM
80C32E Radiation Tolerant
Customer Rom Code
Mxxx
D 80C52
–12 : 12 MHz version (1)
–30 : 30 MHz version (2)
–36 : 36 MHz version (1)
–36 /883
blank = MHS standards
/883 = MIL STD 883 Class B or S
SB/SC = SCC 9000 level B/C
MQ = QML Q (3)
SV = QML V (3)
1. Only for C32 and C52.
2. Only for C32E
3. The Standard Military Drawing 5962–00518 must be taken as the reference for QML–Q and QML–V procurement.
