SN54F240, SN74F240
OCTAL BUFFERS/DRIVERS
WITH 3-STATE OUTPUTS
SDFS061A – D2932, MARCH 1987 – REVISED OCTOBER 1993
Copyright 1993, Texas Instruments Incorporated
2–1
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
•3-State Outputs Drive Bus Lines or Buffer
Memory Address Registers
•Package Options Include Plastic
Small-Outline (SOIC) and Shrink
Small-Outline (SSOP) Packages, Ceramic
Chip Carriers, and Plastic and Ceramic
DIPs
description
These octal buffers and line drivers are designed
specifically to improve both the performance and
density of 3-state memory address drivers, clock
drivers, and bus-oriented receivers and
transmitters. Taken together with the ′F241 and
′F244, these devices provide the choice of
selected combinations of inverting and
noninverting outputs, symmetrical OE (active-low
output-enable) inputs, and complementary OE
and OE inputs.
The ′F240 is organized as two 4-bit buffers/line
drivers with separate output enable (OE) inputs.
When OE is low, the device passes data from the
A inputs to the Y outputs. When OE is high, the
outputs are in the high-impedance state.
The SN74F240 is available in TI’s shrink
small-outline package (DB), which provides the
same I/O pin count and functionality of standard
small-outline packages in less than half the
printed-circuit-board area.
The SN54F240 is characterized for operation over
the full military temperature range of –55°C to
125°C. The SN74F240 is characterized for
operation from 0°C to 70°C.
FUNCTION TABLE
(each buffer)
INPUTS OUTPUT
OE A Y
L H L
LLH
HXZ
1
2
3
4
5
6
7
8
9
10
20
19
18
17
16
15
14
13
12
11
1OE
1A1
2Y4
1A2
2Y3
1A3
2Y2
1A4
2Y1
GND
VCC
2OE
1Y1
2A4
1Y2
2A3
1Y3
2A2
1Y4
2A1
SN54F240 ...J PACKAGE
SN74F240 . . . DB, DW, OR N PACKAGE
(TOP VIEW)
3212019
910111213
4
5
6
7
8
18
17
16
15
14
1Y1
2A4
1Y2
2A3
1Y3
1A2
2Y3
1A3
2Y2
1A4
SN54F240 . . . FK PACKAGE
(TOP VIEW)
2Y4
1A1
1OE
1Y4
2A2 2OE
2Y1
GND
2A1 VCC
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of Texas Instruments
standard warranty. Production processing does not necessarily include
testing of all parameters.
SN54F240, SN74F240
OCTAL BUFFERS/DRIVERS
WITH 3-STATE OUTPUTS
SDFS061A – D2932, MARCH 1987 – REVISED OCTOBER 1993
2–2 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
logic symbol†logic diagram (positive logic)
†This symbol is in accordance with ANSI/IEEE Std 91-1984
and IEC Publication 617-12.
1
2
4
6
8
19
11
13
15
17 3
5
7
9
12
14
16
18
1A1
1A2
1A3
1A4
1Y1
2A1
2A2
2A3
2A4
2Y1
1Y2
1Y3
1Y4
2Y2
2Y3
2Y4
1OE
2OE
2
1A1 4
1A2 6
1A3 8
1A4
EN
1
1Y1
18
1Y2
16
1Y3
14
1Y4
12
11
2A1 13
2A2 15
2A3 17
2A4
EN
19
2Y1
9
2Y2
7
2Y3
5
2Y4
3
1OE
2OE
absolute maximum ratings over operating free-air temperature range (unless otherwise noted)‡
Supply voltage range, VCC –0.5 V to 7 V. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Input voltage range, VI (see Note 1) –1.2 V to 7 V. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Input current range –30 mA to 5 mA. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Voltage range applied to any output in the disabled or power-off state –0.5 V to 5.5 V. . . . . . . . . . . . . . . . . . .
Voltage range applied to any output in the high state –0.5 V to VCC
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Current into any output in the low state: SN54F240 96 mA. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
SN74F240 128 mA. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Operating free-air temperature range: SN54F240 –55°C to 125°C. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
SN74F240 0°C to 70°C. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Storage temperature range –65°C to 150°C. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
‡Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only and
functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not
implied. Exposure to absolute-maximum-rated conditions for extended periods may af fect device reliability.
NOTE 1: The input voltage ratings may be exceeded provided the input current ratings are observed.
SN54F240, SN74F240
OCTAL BUFFERS/DRIVERS
WITH 3-STATE OUTPUTS
SDFS061A – D2932, MARCH 1987 – REVISED OCTOBER 1993
2–3
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
recommended operating conditions
SN54F240 SN74F240
UNIT
MIN NOM MAX MIN NOM MAX
UNIT
VCC Supply voltage 4.5 5 5.5 4.5 5 5.5 V
VIH High-level input voltage 2 2 V
VIL Low-level input voltage 0.8 0.8 V
IIK Input clamp current –18 –18 mA
IOH High-level output current –12 –15 mA
IOL Low-level output current 48 64 mA
TAOperating free-air temperature –55 125 0 70 °C
electrical characteristics over recommended operating free-air temperature range (unless
otherwise noted)
PARAMETER
TEST CONDITIONS
SN54F240 SN74F240
UNIT
PARAMETER
TEST
CONDITIONS
MIN TYP†MAX MIN TYP†MAX
UNIT
VIK VCC = 4.5 V, II = –18 mA –1.2 –1.2 V
IOH = – 3 mA 2.4 3.3 2.4 3.3
VOH
VCC = 4.5 V IOH = – 12 mA 2 3.2
V
V
OH IOH = – 15 mA 2 3.1
V
VCC = 4.75 V, IOH = – 3 mA 2.7
VOL
VCC =45V
IOL = 48 mA 0.38 0.55
V
V
OL
V
CC =
4
.
5
V
IOL = 64 mA 0.42 0.55
V
IOZH VCC = 5.5 V, VO = 2.7 V 50 50 µA
IOZL VCC = 5.5 V, VO = 0.5 V –50 –50 µA
IIVCC = 5.5 V, VI = 7 V 0.1 0.1 mA
IIH VCC = 5.5 V, VI = 2.7 V 20 20 µA
IIL VCC = 5.5 V, VI = 0.5 V –1 –1 mA
IOS‡VCC = 5.5 V, VO = 0 –100 –225 –100 –225 mA
Outputs high 19 29 19 29
ICC VCC = 5.5 V Outputs low 50 75 50 75 mA
Outputs disabled 42 63 42 63
†All typical values are at VCC = 5 V, TA = 25°C.
‡Not more than one output should be shorted at a time, and the duration of the short circuit should not exceed one second.
SN54F240, SN74F240
OCTAL BUFFERS/DRIVERS
WITH 3-STATE OUTPUTS
SDFS061A – D2932, MARCH 1987 – REVISED OCTOBER 1993
2–4 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
switching characteristics (see Note 2)
PARAMETER FROM
(
INPUT
)
TO
(
OUTPUT
)
VCC = 5 V,
CL = 50 pF,
RL = 500 Ω,
TA = 25°C
VCC = 4.5 V to 5.5 V,
CL = 50 pF,
RL = 500Ω,
TA = MIN to MAX†UNIT
(INPUT)
(OUTPUT)
′F240 SN54F240 SN74F240
MIN TYP MAX MIN MAX MIN MAX
tPLH
Any A
Y
2.2 4.7 7 2.2 9 2.2 8
ns
tPHL
An
y
A
Y
1.2 3.1 4.7 1.2 6 1.2 5.7
ns
tPZH
OE
Y
1.2 3.1 5.3 1.2 6.7 1.2 6.1
ns
tPZL
OE
Y
3.2 6.5 9 3.2 10.5 3.2 10
ns
tPHZ
OE
Y
1.2 3.6 5.3 1.2 6.5 1.2 6.3
ns
tPLZ
OE
Y
1.2 5.6 8 1.2 12.5 1.2 9.5
ns
†For conditions shown as MIN or MAX, use the appropriate value specified under recommended operating conditions.
NOTE 2: Load circuits and waveforms are shown in Section 1.
PACKAGE OPTION ADDENDUM
www.ti.com 25-Sep-2013
Addendum-Page 1
PACKAGING INFORMATION
Orderable Device Status
(1)
Package Type Package
Drawing Pins Package
Qty Eco Plan
(2)
Lead/Ball Finish MSL Peak Temp
(3)
Op Temp (°C) Device Marking
(4/5)
Samples
5962-9758501Q2A ACTIVE LCCC FK 20 1 TBD POST-PLATE N / A for Pkg Type -55 to 125 5962-
9758501Q2A
SNJ54F
240FK
5962-9758501QRA ACTIVE CDIP J 20 1 TBD A42 N / A for Pkg Type -55 to 125 5962-9758501QR
A
SNJ54F240J
5962-9758501QSA ACTIVE CFP W 20 1 TBD Call TI N / A for Pkg Type -55 to 125 5962-9758501QS
A
SNJ54F240W
JM38510/33201B2A ACTIVE LCCC FK 20 1 TBD POST-PLATE N / A for Pkg Type -55 to 125 JM38510/
33201B2A
JM38510/33201BRA ACTIVE CDIP J 20 1 TBD A42 N / A for Pkg Type -55 to 125 JM38510/
33201BRA
JM38510/33201BSA ACTIVE CFP W 20 1 TBD Call TI N / A for Pkg Type -55 to 125 JM38510/
33201BSA
M38510/33201B2A ACTIVE LCCC FK 20 1 TBD POST-PLATE N / A for Pkg Type -55 to 125 JM38510/
33201B2A
M38510/33201BRA ACTIVE CDIP J 20 1 TBD A42 N / A for Pkg Type -55 to 125 JM38510/
33201BRA
M38510/33201BSA ACTIVE CFP W 20 1 TBD Call TI N / A for Pkg Type -55 to 125 JM38510/
33201BSA
SN54F240J ACTIVE CDIP J 20 1 TBD A42 N / A for Pkg Type -55 to 125 SN54F240J
SN74F240DBLE OBSOLETE SSOP DB 20 TBD Call TI Call TI 0 to 70
SN74F240DBR NRND SSOP DB 20 2000 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM 0 to 70 F240
SN74F240DBRE4 NRND SSOP DB 20 2000 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM 0 to 70 F240
SN74F240DBRG4 NRND SSOP DB 20 2000 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM 0 to 70 F240
SN74F240DW ACTIVE SOIC DW 20 25 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM 0 to 70 F240
SN74F240DWE4 ACTIVE SOIC DW 20 25 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM 0 to 70 F240
PACKAGE OPTION ADDENDUM
www.ti.com 25-Sep-2013
Addendum-Page 2
Orderable Device Status
(1)
Package Type Package
Drawing Pins Package
Qty Eco Plan
(2)
Lead/Ball Finish MSL Peak Temp
(3)
Op Temp (°C) Device Marking
(4/5)
Samples
SN74F240DWG4 ACTIVE SOIC DW 20 25 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM 0 to 70 F240
SN74F240DWR ACTIVE SOIC DW 20 2000 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM 0 to 70 F240
SN74F240DWRE4 ACTIVE SOIC DW 20 2000 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM 0 to 70 F240
SN74F240DWRG4 ACTIVE SOIC DW 20 2000 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM 0 to 70 F240
SN74F240N ACTIVE PDIP N 20 20 Pb-Free
(RoHS) CU NIPDAU N / A for Pkg Type 0 to 70 SN74F240N
SN74F240NE4 ACTIVE PDIP N 20 20 Pb-Free
(RoHS) CU NIPDAU N / A for Pkg Type 0 to 70 SN74F240N
SN74F240NSR ACTIVE SO NS 20 2000 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM 0 to 70 74F240
SN74F240NSRE4 ACTIVE SO NS 20 2000 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM 0 to 70 74F240
SN74F240NSRG4 ACTIVE SO NS 20 2000 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM 0 to 70 74F240
SNJ54F240FK ACTIVE LCCC FK 20 1 TBD POST-PLATE N / A for Pkg Type -55 to 125 5962-
9758501Q2A
SNJ54F
240FK
SNJ54F240J ACTIVE CDIP J 20 1 TBD A42 N / A for Pkg Type -55 to 125 5962-9758501QR
A
SNJ54F240J
SNJ54F240W ACTIVE CFP W 20 1 TBD Call TI N / A for Pkg Type -55 to 125 5962-9758501QS
A
SNJ54F240W
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability
information and additional product content details.
PACKAGE OPTION ADDENDUM
www.ti.com 25-Sep-2013
Addendum-Page 3
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight
in homogeneous material)
(3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.
(5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation
of the previous line and the two combined represent the entire Device Marking for that device.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
OTHER QUALIFIED VERSIONS OF SN54F240, SN74F240 :
•Catalog: SN74F240
•Military: SN54F240
NOTE: Qualified Version Definitions:
•Catalog - TI's standard catalog product
•Military - QML certified for Military and Defense Applications
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device Package
Type Package
Drawing Pins SPQ Reel
Diameter
(mm)
Reel
Width
W1 (mm)
A0
(mm) B0
(mm) K0
(mm) P1
(mm) W
(mm) Pin1
Quadrant
SN74F240DBR SSOP DB 20 2000 330.0 16.4 8.2 7.5 2.5 12.0 16.0 Q1
SN74F240DWR SOIC DW 20 2000 330.0 24.4 10.8 13.0 2.7 12.0 24.0 Q1
SN74F240NSR SO NS 20 2000 330.0 24.4 8.2 13.0 2.5 12.0 24.0 Q1
PACKAGE MATERIALS INFORMATION
www.ti.com 26-Jan-2013
Pack Materials-Page 1
*All dimensions are nominal
Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm)
SN74F240DBR SSOP DB 20 2000 367.0 367.0 38.0
SN74F240DWR SOIC DW 20 2000 367.0 367.0 45.0
SN74F240NSR SO NS 20 2000 367.0 367.0 45.0
PACKAGE MATERIALS INFORMATION
www.ti.com 26-Jan-2013
Pack Materials-Page 2
MECHANICAL DATA
MSSO002E – JANUARY 1995 – REVISED DECEMBER 2001
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
DB (R-PDSO-G**) PLASTIC SMALL-OUTLINE
4040065 /E 12/01
28 PINS SHOWN
Gage Plane
8,20
7,40
0,55
0,95
0,25
38
12,90
12,30
28
10,50
24
8,50
Seating Plane
9,907,90
30
10,50
9,90
0,38
5,60
5,00
15
0,22
14
A
28
1
2016
6,50
6,50
14
0,05 MIN
5,905,90
DIM
A MAX
A MIN
PINS **
2,00 MAX
6,90
7,50
0,65 M
0,15
0°–ā8°
0,10
0,09
0,25
NOTES: A. All linear dimensions are in millimeters.
B. This drawing is subject to change without notice.
C. Body dimensions do not include mold flash or protrusion not to exceed 0,15.
D. Falls within JEDEC MO-150
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