TD62382APG/AFG TOSHIBA BIPOLAR DIGITAL INTEGRATED CIRCUIT SILICON MONOLITHIC TD62382APG,TD62382AFG 8CH LOW INPUT ACTIVE SINK DRIVER The TD62382APG / AFG are non-inverting transistor array which are comprised of eight Low saturation output stages and PNP input stages. This device is low level input active driver and is suitable for operation with TTL, 5 V CMOS and 5 V Microprocessor which have sink current output drivers. Applications include relay, hammer, lamp and LED display drivers. This devices are a product for the Pb free(Sn-Ag). TD62382APG FEATURES Low saturation output 0.23 V MAX. @IOUT = 40 mA MAX. TD62382AFG Output rating 50 V MIN. / 50 mA MAX. Input compatible with TTL and 5 V CMOS Low level active inputs Standard supply voltage Package type-APG : DIP-18 pin Package type-AFG : SOP-18 pin Weight DIP18-P-300-2.54D : 1.47 g (Typ.) SOP18-P-375-1.27 : 0.41 g (Typ.) PIN CONNECTION (TOP VIEW) SCHEMATICS (EACH DRIVER) Note: 1 The input and output parasitic diodes cannot be used as clamp diodes. 2005-03-03 TD62382APG/AFG MAXIMUM RATINGS (Ta = 25C) CHARACTERISTIS SYMBOL RATING UNIT VCC -0.5~7.0 V VCE (SUS) -0.5~50 V IOUT 50 mA / ch Input Voltage VIN -22~VCC + 0.5 V Input Current IIN 10 mA Supply Voltage Output Sustaining Voltage Output Current APG Power Dissipation AFG PD (Note) 1.47 W 0.96 Operating Temperature Topr -40~85 C Storage Temperature Tstg -55~150 C Note: Delated above 25C in the proportion of 11.7 mW / C (APG-Type), 7.7 mW / C (AFG-Type). RECOMMENDED OPERATING CONDITIONS (Ta = -40~85C) CHARACTERISTIC Supply Voltage Output Sustaining Voltage Output Current APG SYMBOL CONDITION MIN TYP. MAX UNIT VCC 4.5 5.0 5.5 V 0 50 V DC 1 Circuit 0 40 8 Circuits 0 40 8 Circuits 0 40 IOUT AFG Input Voltage Power Dissipation VCE (SUS) VIN -20 VCC Output On VIN (ON) -20 VCC - 3.5 Output Off VIN (OFF) VCC - 0.3 VCC + 0.5 0.52 0.35 APG AFG PD 2 mA / ch V V W 2005-03-03 TD62382APG/AFG ELECTRICAL CHARACTERISTICS (Ta = 25C) SYMBOL TEST CIR- CUIT ICEX 1 VCE (sat) 2 Output On IIN (ON) 3 Output Off IIN (OFF) 4 CHARACTERISTIC Output Leakage Current Output Saturation Voltage Input Current Input Voltage Output on VIN (ON) Output On ICC(ON) Output Off ICC(OFF) Turn-On Delay TYP. MAX UNIT VCC = 5.5 V, IIN = 0 VOUT = 35 V, Ta = 75C 100 A VCC = 4.5 V, VIN = 0.8 V IOUT = 40 mA 0.23 V VCC = 5.5 V, VIN = 0.4 V -0.32 -0.45 VCC = 5.5 V, VIN = -20 V -2.6 -40 A -20 VCC - 3.5 V VCC = 5.5 V, VIN = 0 V 6 mA / ch VCC = VIN = 5.5 V Ta = 75C 100 A 0.1 VOUT = 50 V RL = 1 k tON 7 Turn-Off Delay MIN 5 6 Supply Current TEST CONDITION VCC = 5 V CL = 15 pF tOFF 3 mA s VOUT = 50 V RL = 1 k 3.0 2005-03-03 TD62382APG/AFG TEST CIRCUIT 1. ICEX 2. VCE (sat) 3. IIN (ON) 4. IIN (OFF) 5. VIN (ON) 6. ICC 7. tON, tOFF Note 1: Pulse Width 50 s, Duty Cycle 10% Output Impedance 50 , tr 10 ns, tf 5 ns Note 2: CL includes probe and jig capacitance. PRECAUTIONS for USING This IC does not integrate protection circuits such as overcurrent and overvoltage protectors. Thus, if excess current or voltage is applied to the IC, the IC may be damaged. Please design the IC so that excess current or voltage will not be applied to the IC. Utmost care is necessary in the design of the output line, VCC and GND line since IC may be destroyed due to short-circuit between outputs, air contamination fault, or fault by improper grounding. 4 2005-03-03 TD62382APG/AFG 5 Type-APG Free Air Type-AFG Free Air 2005-03-03 TD62382APG/AFG PACKAGE DIMENSIONS DIP18-P-300-2.54D Unit: mm Weight: 1.47 g (Typ.) 6 2005-03-03 TD62382APG/AFG PACKAGE DIMENSIONS SOP18-P-375-1.27 Unit: mm Weight: 0.41 g (Typ.) 7 2005-03-03 TD62382APG/AFG About solderability, following conditions were confirmed * Solderability (1) Use of Sn-63Pb solder Bath * solder bath temperature = 230C * dipping time = 5 seconds * the number of times = once * use of R-type flux (2) Use of Sn-3.0Ag-0.5Cu solder Bath * solder bath temperature = 245C * dipping time = 5 seconds * the number of times = once * use of R-type flux RESTRICTIONS ON PRODUCT USE 030619EBA * The information contained herein is subject to change without notice. * The information contained herein is presented only as a guide for the applications of our products. No responsibility is assumed by TOSHIBA for any infringements of patents or other rights of the third parties which may result from its use. No license is granted by implication or otherwise under any patent or patent rights of TOSHIBA or others. * TOSHIBA is continually working to improve the quality and reliability of its products. Nevertheless, semiconductor devices in general can malfunction or fail due to their inherent electrical sensitivity and vulnerability to physical stress. It is the responsibility of the buyer, when utilizing TOSHIBA products, to comply with the standards of safety in making a safe design for the entire system, and to avoid situations in which a malfunction or failure of such TOSHIBA products could cause loss of human life, bodily injury or damage to property. In developing your designs, please ensure that TOSHIBA products are used within specified operating ranges as set forth in the most recent TOSHIBA products specifications. Also, please keep in mind the precautions and conditions set forth in the "Handling Guide for Semiconductor Devices," or "TOSHIBA Semiconductor Reliability Handbook" etc.. * The TOSHIBA products listed in this document are intended for usage in general electronics applications (computer, personal equipment, office equipment, measuring equipment, industrial robotics, domestic appliances, etc.). These TOSHIBA products are neither intended nor warranted for usage in equipment that requires extraordinarily high quality and/or reliability or a malfunction or failure of which may cause loss of human life or bodily injury ("Unintended Usage"). Unintended Usage include atomic energy control instruments, airplane or spaceship instruments, transportation instruments, traffic signal instruments, combustion control instruments, medical instruments, all types of safety devices, etc.. Unintended Usage of TOSHIBA products listed in this document shall be made at the customer's own risk. * The products described in this document are subject to the foreign exchange and foreign trade laws. * TOSHIBA products should not be embedded to the downstream products which are prohibited to be produced and sold, under any law and regulations. 8 2005-03-03