TD62382APG/AFG
2005-03-03
1
TOSHIBA BIPOLAR DIGITAL INTEGRATED CIRCUIT SILICON MONOLITHIC
TD62382APG,TD62382AFG
8CH LOW INPUT ACTIVE SINK DRIVER
The TD62382APG / AFG are noninverting transistor array
which are comprised of eight Low saturation output stages and
PNP input stages.
This device is low level input active driver and is suitable for
operation with TTL, 5 V CMOS and 5 V Microprocessor which
have sink current output drivers.
Applications include relay, hammer, lamp and LED display
drivers.
This devices are a product for the Pb free(Sn-Ag).
FEATURES
Low saturation output 0.23 V MAX. @IOUT = 40 mA MAX.
Output rating 50 V MIN. / 50 mA MAX.
Input compatible with TTL and 5 V CMOS
Low level active inputs
Standard supply voltage
Package typeAPG : DIP18 pin
Package typeAFG : SOP18 pin
PIN CONNECTION (TOP VIEW)
Weight
DIP18P3002.54D : 1.47 g (Typ.)
SOP18P3751.27 : 0.41 g (Typ.)
SCHEMATICS (EACH DRIVER)
Note: The input and output parasitic diodes cannot be
used as clamp diodes.
TD62382APG
TD62382AFG
TD62382APG/AFG
2005-03-03
2
MAXIMUM RATINGS (Ta = 25°C)
CHARACTERISTIS SYMBOL RATING UNIT
Supply Voltage VCC 0.5~7.0 V
Output Sustaining Voltage VCE (SUS) 0.5~50 V
Output Current IOUT 50 mA / ch
Input Voltage VIN 22~VCC + 0.5 V
Input Current IIN 10 mA
APG 1.47
Power Dissipation
AFG
PD (Note)
0.96
W
Operating Temperature Topr 40~85 °C
Storage Temperature Tstg 55~150 °C
Note: Delated above 25°C in the proportion of 11.7 mW / °C (APGType), 7.7 mW / °C (AFGType).
RECOMMENDED OPERATING CONDITIONS (Ta = 40~85°C)
CHARACTERISTIC SYMBOL CONDITION MIN TYP. MAX UNIT
Supply Voltage VCC 4.5 5.0 5.5 V
Output Sustaining Voltage VCE (SUS)
0 50 V
DC 1 Circuit 0 40
APG 8 Circuits 0 40
Output Current
AFG
IOUT
8 Circuits 0 40
mA /
ch
V
IN 20 V
CC V
Output On VIN (ON) 20 VCC
3.5
Input Voltage
Output Off VIN (OFF) VCC
0.3 VCC
+ 0.5
V
APG 0.52
Power Dissipation
AFG
PD
0.35
W
TD62382APG/AFG
2005-03-03
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ELECTRICAL CHARACTERISTICS (Ta = 25°C)
CHARACTERISTIC SYMBOL
TEST
CIR
CUIT
TEST CONDITION MIN TYP. MAX UNIT
Output Leakage Current ICEX 1
VCC = 5.5 V, IIN = 0
VOUT = 35 V, Ta = 75°C 100 µA
Output Saturation Voltage VCE (sat) 2
VCC = 4.5 V, VIN = 0.8 V
IOUT = 40 mA 0.23 V
VCC = 5.5 V, VIN = 0.4 V 0.32 0.45
Output On IIN (ON) 3
VCC = 5.5 V, VIN = 20 V 2.6
mA
Input Current
Output Off IIN (OFF) 4 40 µA
Input Voltage Output on VIN (ON) 5 20 VCC
3.5 V
Output On ICC(ON) V
CC = 5.5 V, VIN = 0 V 6
mA /
ch
Supply Current
Output Off ICC(OFF)
6
VCC = VIN = 5.5 V
Ta = 75°C 100 µA
TurnOn Delay tON VOUT = 50 V
RL = 1 k 0.1
TurnOff Delay tOFF
7 VCC = 5 V
CL = 15 pF VOUT = 50 V
RL = 1 k 3.0
µs
TD62382APG/AFG
2005-03-03
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TEST CIRCUIT
1. ICEX 2. VCE (sat)
3. IIN (ON) 4. IIN (OFF)
5. VIN (ON) 6. ICC
7. tON, tOFF
Note 1: Pulse Width 50 µs, Duty Cycle 10%
Output Impedance 50 , tr 10 ns, tf 5 ns
Note 2: CL includes probe and jig capacitance.
PRECAUTIONS for USING
This IC does not integrate protection circuits such as overcurrent and overvoltage protectors.
Thus, if excess current or voltage is applied to the IC, the IC may be damaged. Please design the IC so that
excess current or voltage will not be applied to the IC.
Utmost care is necessary in the design of the output line, VCC and GND line since IC may be destroyed due to
shortcircuit between outputs, air contamination fault, or fault by improper grounding.
TD62382APG/AFG
2005-03-03
5
Type-APG Free Air
Type-AFG Free Air
TD62382APG/AFG
2005-03-03
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PACKAGE DIMENSIONS
DIP18P3002.54D Unit: mm
Weight: 1.47 g (Typ.)
TD62382APG/AFG
2005-03-03
7
PACKAGE DIMENSIONS
SOP18P3751.27 Unit: mm
Weight: 0.41 g (Typ.)
TD62382APG/AFG
2005-03-03
8
About solderability, following conditions were confirmed
Solderability
(1) Use of Sn-63Pb solder Bath
· solder bath temperature
= 230°C
· dipping time
= 5 seconds
· the number of times = once
· use of R-type flux
(2) Use of Sn-3.0Ag-0.5Cu solder Bath
· solder bath temperature
= 245°C
· dipping time
= 5 seconds
· the number of times = once
· use of R-type flux
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030619EBA
RESTRICTIONS ON PRODUCT USE