SE30PAB, SE30PAD, SE30PAG, SE30PAJ
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Revision: 16-Jun-2020 1Document Number: 87702
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THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
Surface-Mount ESD Capability Rectifiers
LINKS TO ADDITIONAL RESOURCES
FEATURES
• Very low profile - typical height of 0.95 mm
• Ideal for automated placement
• Oxide planar chip junction
• Low forward voltage drop, low leakage current
• ESD capability
• Meets MSL level 1, per J-STD-020,
LF maximum peak of 260 °C
• Not recommended for PCB bottom side wave mounting
• AEC-Q101 qualified
• Material categorization: for definitions of compliance
please see www.vishay.com/doc?99912
TYPICAL APPLICATIONS
General purpose, power line polarity protection, in both
consumer and automotive applications.
MECHANICAL DATA
Case: SMPA (DO-221BC)
Molding compound meets UL 94 V-0 flammability rating
Base P/N-M3 - halogen-free, RoHS-compliant, and
commercial grade
Base P/NHM3 - halogen-free, RoHS-compliant, and
AEC-Q101 qualified
Terminals: matte tin plated leads, solderable per
J-STD-002 and JESD 22-B102
M3 suffix meets JESD 201 class 2 whisker test, HM3 suffix
meets JESD 201 class 2 whisker test
Polarity: color band denotes the cathode end
Notes
(1) Mounted on 20 mm x 20 mm pad areas, 2 oz. FR4 PCB
(2) Free air, mounted on recommended copper pad area
PRIMARY CHARACTERISTICS
IF(AV) 3.0 A
VRRM 100 V, 200 V, 400 V, 600 V
IFSM 32 A
VF at IF = 3.0 A (TA = 125 °C) 1.00 V
IR5 μA
TJ max. 175 °C
Package SMPA (DO-221BC)
Circuit configuration Single
SMPA (DO-221BC)
eSMP® Series
Top View Bottom View
A
K
Cathode
A
node
3
3
3
D
D
D
3
D
3D Models
Available
MAXIMUM RATINGS (TA = 25 °C unless otherwise noted)
PARAMETER SYMBOL SE30PAB SE30PAD SE30PAG SE30PAJ UNIT
Device marking code 30B 30D 30G 30J
Maximum repetitive peak reverse voltage VRRM 100 200 400 600 V
Maximum DC forward current IF (1) 3.0 A
IF (2) 1.4
Peak forward surge current 10 ms single half
sine-wave superimposed on rated load IFSM 32 A
Operating junction and storage temperature range TJ, TSTG -55 to +175 °C
SE30PAB, SE30PAD, SE30PAG, SE30PAJ
www.vishay.com Vishay General Semiconductor
Revision: 16-Jun-2020 2Document Number: 87702
For technical questions within your region: DiodesAmericas@vishay.com, DiodesAsia@vishay.com, DiodesEurope@vishay.com
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
Notes
(1) Pulse test: 300 μs pulse width, 1 % duty cycle
(2) Pulse test: Pulse width 40 ms
Notes
(1) Free air, mounted on recommended PCB, 2 oz. pad area; thermal resistance RJA - junction to ambient
(2) Mounted on 20 mm x 20 mm pad areas, 2 oz. FR4 PCB; RJM - junction to mount
Note
(1) AEC-Q101 qualified
ELECTRICAL CHARACTERISTICS (TA = 25 °C unless otherwise noted)
PARAMETER TEST CONDITIONS SYMBOL TYP. MAX. UNIT
Instantaneous forward voltage
IF = 1.5 A TA = 25 °C
VF (1)
0.98 -
V
IF = 3.0 A 1.07 1.16
IF = 1.5 A TA = 125 °C 0.88 -
IF = 3.0 A 1.00 1.10
Reverse current Rated VR
TA = 25 °C IR (2) -5
μA
TA = 125 °C 7 100
Typical reverse recovery time IF = 0.5 A, IR = 1.0 A, Irr = 0.25 A trr 1.3 - μs
Typical junction capacitance 4.0 V, 1 MHz CJ13 - pF
THERMAL CHARACTERISTICS (TA = 25 °c unless otherwise noted)
PARAMETER SYMBOL SE30PAB SE30PAD SE30PAG SE30PAJ UNIT
Typical thermal resistance RJA (1) 120 °C/W
RJM (2) 9
IMMUNITY TO ELECTRICAL STATIC DISCHARGE TO THE FOLLOWING STANDARDS
(TA = 25 °C unless otherwise noted)
STANDARD TEST TYPE TEST CONDITIONS SYMBOL CLASS VALUE
AEC-Q101-001 Human body model (contact mode) C = 100 pF, R = 1.5 kVCH3B > 8 kV
ORDERING INFORMATION (Example)
PREFERRED P/N UNIT WEIGHT (g) PREFERRED PACKAGE CODE BASE QUANTITY DELIVERY MODE
SE30PAJ-M3/I 0.033 I 14 000 13" diameter plastic tape and reel
SE30PAJHM3/I (1) 0.033 I 14 000 13" diameter plastic tape and reel
SE30PAB, SE30PAD, SE30PAG, SE30PAJ
www.vishay.com Vishay General Semiconductor
Revision: 16-Jun-2020 3Document Number: 87702
For technical questions within your region: DiodesAmericas@vishay.com, DiodesAsia@vishay.com, DiodesEurope@vishay.com
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
RATINGS AND CHARACTERISTICS CURVES (TA = 25 °C unless otherwise noted)
Fig. 1 - Maximum Forward Current Derating Curve
Fig. 2 - Forward Power Loss Characteristics
Fig. 3 - Typical Instantaneous Forward Characteristics
Fig. 4 - Typical Reverse Leakage Characteristics
Fig. 5 - Typical Junction Capacitance
Fig. 6 - Typical Transient Thermal Impedance
0
0.5
1
1.5
2
2.5
3
3.5
0 255075100125150175
Average Forward Rectied Current (A)
Case Temperature (°C)
RthJM = 9 °C/W
Free air, RthJA = 120 °C/W
TMmeasured at cathode band
terminal PCB mount
0.0
0.4
0.8
1.2
1.6
2.0
2.4
2.8
3.2
3.6
4.0
0 0.4 0.8 1.2 1.6 2 2.4 2.8 3.2 3.6
Average Power Loss (W)
Average Forward Current (A)
D = 0.1
D = 0.2
D = 0.3
D = 0.5
D = 1.0
D = 0.8
D = tp/T
T
tp
10
100
1000
10000
0.1
1
10
0.50.60.70.80.91.01.11.21.31.4
Axis Title
1st line
2nd line
2nd line
Instantaneous Forward Current (A)
Instantaneous Forward Voltage (V)
T
J
= -40 °C
T
J
= 175 °C
T
J
= 25 °C
T
J
= 150 °C
T
J
= 125 °C
T
J
= 75 °C
10
100
1000
10000
0.001
0.01
0.1
1
10
100
10 20 30 40 50 60 70 80 90 100
Axis Title
1st line
2nd line
2nd line
Instantaneous Reverse Current (µA)
Percent of Rated Peak Reverse Voltage (%)
TJ= 150 °C
TJ= 125 °C
TJ= 75 °C
TJ= 25 °C
TJ= 175 °C
TJ= -40 °C
1
10
100
0.1 1 10 100
Junction Capacitance (pF)
Reverse Voltage (V)
TJ= 25 °C
f = 1.0 MHz
Vsig = 50 mVp-p
1
10
100
1000
0.01 0.1 1 10 100
Transient Thermal Impedance (°C/W)
t - Pulse Duration (s)
Junction to Ambient
SE30PAB, SE30PAD, SE30PAG, SE30PAJ
www.vishay.com Vishay General Semiconductor
Revision: 16-Jun-2020 4Document Number: 87702
For technical questions within your region: DiodesAmericas@vishay.com, DiodesAsia@vishay.com, DiodesEurope@vishay.com
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
PACKAGE OUTLINE DIMENSIONS in inches (millimeters)
Cathode Band
0.106 (2.70)
0.098 (2.50)
SMPA (DO-221BC)
0.171 (4.35)
0.163 (4.15)
0.211 (5.35)
0.199 (5.05)
0.039 (1.00)
0.035 (0.90)
0.057 (1.45)
0.049 (1.25)
0.059 (1.50)
0.030 (0.75)
0.012 (0.30)
0.006 (0.15)
Typ.: 0.019 (0.48)
0.122 (3.10)
0.098 (2.50)
0.059 (1.50)
0.030 (0.75)
0.087 (2.20)
0.063 (1.6)
Mounting Pad Layout
0.087 (2.20)
MIN.
MIN.
0.059 (1.50)
MIN. 0.122 (3.10)
MAX. 0.037 (0.92)
0.217 (5.52)
0.060 (1.52)
MIN.
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Revision: 01-Jan-2021 1Document Number: 91000
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