
3
Absolute Maximum Ratings Thermal Information
V+ to V- . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 44.0V
GND to V-. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25V
VL. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . (GND - 0.3V) to (V+) +0.3V
Digital Inputs VS, VD (Note 1) . . . . . (V-) -2V to (V+) + 2V or 30mA,
Whichever Occurs First
Continuous Current (Any Terminal) . . . . . . . . . . . . . . . . . . . . . 30mA
Peak Current, S or D (Pulsed 1ms, 10% Duty Cycle, Max). . 100mA
Operating Conditions
Temperature Range. . . . . . . . . . . . . . . . . . . . . . . . . . -40oC to 85oC
Voltage Range . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ±20V (Max)
Input Low Voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 0.8V (Max)
Input High Voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2.4V (Min)
Input Rise and Fall Time . . . . . . . . . . . . . . . . . . . . . . . . . . . . ≤20ns
Thermal Resistance (Typical, Note 2) θJA (oC/W)
PDIP Package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 90
SOIC Package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 115
Maximum Junction Temperature (Plastic Package). . . . . . . . .150oC
Maximum Storage Temperature Range . . . . . . . . . . . . .-65oC to 150oC
Maximum Lead Temperature (Soldering 10s) . . . . . . . . . . . . 300oC
(SOIC - Lead Tips Only)
CAUTION: Stresses above those listed in “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress only rating and operationofthe
device at these or any other conditions above those indicated in the operational sections of this specification is not implied.
NOTES:
1. Signals on SX, DX, or INX exceeding V+ or V- will be clamped by internal diodes. Limit forward diode current to maximum current ratings.
2. θJA is measured with the component mounted on an evaluation PC board in free air.
Electrical Specifications Test Conditions: V+ = +15V, V- = -15V, VIN = 2.4V, 0.8V (Note 3), VL= 5V,
Unless Otherwise Specified
PARAMETER TEST CONDITIONS TEMP
(oC) (NO TE 4)
MIN (NOTE5)
TYP (NOTE4)
MAX UNITS
DYNAMIC CHARACTERISTICS
Turn-ON Time, tON RL = 300Ω, CL = 35pF 25 - 100 150 ns
Turn-OFF Time, tOFF 25 - 60 100 ns
Break-Before-Make Time Delay (DG403), tDRL = 300Ω, CL = 35pF 25 5 12 - ns
Charge Injection, Q (Figure 3) CL = 10nF, VG = 0V, RG = 0Ω25 - 60 - pC
OFF Isolation (Figure 4) RL = 100Ω, CL = 5pF, f = 1MHz 25 - 72 - dB
Crosstalk (Channel-to-Channel) (Figure 6) 25 - -90 - dB
Source OFF Capacitance, CS(OFF) f = 1MHz, VS = VD = 0V (Figure 7) 25 - 12 - pF
Drain OFF Capacitance, CD(OFF) 25 - 12 - pF
Channel ON Capacitance, CD(ON) + CS(ON) 25 - 39 - pF
DIGITAL INPUT CHARACTERISTICS
Input Current with VIN Low, IIL VIN Under Test = 0.8V, All Others = 2.4V Full -1 0.005 1 µA
Input Current with VIN High, IIH VIN Under Test = 2.4V, All Others = 0.8V Full -1 0.005 1 µA
ANALOG SWITCH CHARACTERISTICS
Analog Signal Range, VANALOG Full -15 - 15 V
Drain-Source ON Resistance, rDS(ON) V+ = 13.5V, V- = -13.5V,
IS = 10mA, VD = ±10V 25 - 20 45 Ω
Full - - 55 Ω
rDS(ON) Matching Between Channels, ∆rDS(ON) V+ = 16.5V, V- = -16.5V,
IS = -10mA, VD = 5, 0, -5V 25 - 3 3 Ω
Full - - 5 Ω
Source OFF Leakage Current, IS(OFF) V+ = 16.5V, V- = -16.5
VD = ±15.5V, VS = 15.5V 25 -0.5 -0.01 0.5 nA
Full -5 - 5 nA
Drain OFF Leakage Current, ID(OFF) 25 -0.5 -0.01 0.5 nA
Full -5 - 5 nA
Channel ON Leakage Current, ID(ON) +I
S(ON) V± = ±16.5V, VD = VS = ±15.5V 25 -1 -0.04 1 nA
Full -10 - 10 nA
DG401, DG403, DG405