BLE113
DATA SHEET
Thursday, 10 December 2015
Version 1.48
Silicon Labs
VERSION HISTORY
Version Comment
1.0 Preliminary datasheet -> production datasheet. No changes
1.1 Pull-up resistors added to P1_0 and P1_1 in the example schematic
1.2 5 mm restriction removed from the FCC statement
1.3 Product code for 256k variant added. Peripheral mapping table: analog
comparator added. Added note that pins configured as peripheral I/O signals
do not have pull-up / -down capability. RF Characteristics added.
1.4 Product numbering updated
1.41 CE info
1.42 Updated FCC ID in one incorrect location
1.43 PIO current drive capability figures added
1.44 Current consumption profile added
1.45 SPI slave mode removed
1.46 Example layouts added
1.47 TXP vs hw config figure corrected
1.48 Updated I2C description on table 2
Silicon Labs
TABLE OF CONTENTS
1
BLE113 Product numbering ........................................................................................................................ 6
2
Pinout and Terminal Description ................................................................................................................. 7
2.1
I/O Ports .............................................................................................................................................10
2.2
UART ..................................................................................................................................................10
2.3
Electrical Characteristics ....................................................................................................................11
2.4
Absolute Maximum Ratings ................................................................................................................11
2.5
Recommended Operating Cond iti ons ................................................................................................11
2.6
DC Characteristics .............................................................................................................................11
2.7
Current Consumption .........................................................................................................................13
2.8
RF Characteristics ..............................................................................................................................14
2.9
Antenna characteristics ......................................................................................................................15
3
Physical Dimensions .................................................................................................................................18
4
Power-On Reset and Brownout Detector ..................................................................................................20
5
Design Guidelines .....................................................................................................................................21
5.1
General Design Guidelines .................................................................................................................21
5.2
Layout Guide Lines .............................................................................................................................21
5.3
BLE113-A Layout Guide .....................................................................................................................22
6
Soldering Recommendations ....................................................................................................................24
7
Block diagram ............................................................................................................................................25
8
Certifications ..............................................................................................................................................28
8.1
Bluetooth ............................................................................................................................................28
8.2
FCC and IC ........................................................................................................................................28
8.2.1
FCC et IC ..................................................................................................................................... 29
8.3
CE ........................................................................................................................................................31
8.4
MIC Japan ..........................................................................................................................................31
8.5
KCC (Korea) .......................................................................................................................................31
9
Contact Information .....................................................................................................................................32
Silicon Labs
BLE113 Bluetooth® Smart Module
DESCRIPTION
BLE113 is a Bluetooth Smart module targeted
for small and low power sensors and
accessories. It integrates all features required
for a Bluetooth Smart application: Bluetooth
radio, software stack and GATT based
profiles.
BLE113 Bluetooth Smart module can also host
end user applications, which means no
external micro controller is required in size or
price constrained devices.
BLE113 module has flexible hardware
interfaces to connect to different peripherals
and sensors. BLE113 can be powered directly
from a standard 3V coin cell battery or pair of
AAA batteries.
In lowest power sleep mode it consumes only
500nA and will wake up in few hundred
microseconds.
APPLICATIONS:
•
Health and fitness sensors
•
Medical sensors
•
iPhone and iPad accessories
•
Security and proximity tags
•
Key fobs
•
Smart home sensors and collectors
•
Wireless keys
•
HID keyboards and mice
KEY FEATURES:
•
Bluetooth v. 4.0, single mode compliant
o
Supports master and slave modes
o
Up to eight connections
•
Integrated Bluetooth Smart stack
o
GAP, GATT, L2CAP and SMP
o
Bluetooth Smart profiles
•
Radio performance
o
TX power : 0 dBm to -23 dBm
o
Receiver sensitivity: -93 dBm
•
Ultra low current consumption
o
Transmit: 18.2 mA (0dBm)
o
Transmit: 14.3 mA (0dBm +
DC/DC)
o
Receive: 14.3 mA
o
Sleep mode 3: 0.4 uA
•
Flexible peripheral interfaces
o
UART and SPI
o
I2C, PWM and GPIO
o
12-bit ADC
•
Host interfaces:
o
UART
•
Programmable 8051 processor for stand-
alone operation
•
Dimensions: 9.15 x 15.75 x 2.1 mm
•
Bluetooth, CE, FCC, IC, South Korea and
Japan qualified
Silicon Labs
Page 6 of 32
1
BLE113 Product numbering
Product code Description
BLE113-A BLE113 with integrated chip antenna, 128k flash memory
BLE113-A-M256K BLE113 with integrated chip antenna, 256k flash memory
Silicon Labs
Page 7 of 32
Pinout and Terminal Description
1
Figure 1: BLE113
P1_5
P1_4
P1_3
P1_2
P1_1
P1_0
2
GND
GND
GND
GND
GND
GND
GND
GND
AVDD
NC
P2_2
Reset#
P2_1
P0_0
P2_0
P0_1
P1_7
P0_2
P1_6
P0_3
SCL
P0_4
SDA
P0_5
NC
P0_6
DVDD
P0_7
GND
GND
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
RESET
34
Active low reset. Internal pull-up.
GND
1 - 7, 18,
25, 36
GND
GND
DVDD
17
Supply voltage
Supply voltage 2V - 3.6V
AVDD
8
Supply voltage
Supply voltage 2V - 3.6V
Table 1: Supply and RF Terminal Descriptions
Silicon Labs
Page 8 of 32
PIN
NUMBER
PIN NAME PIN TYPE DESCRIPTION
9
P2_2
Digital I/O
Configurable I/ O p or t, See table 3
10
P2_1
11
P2_0
12
P1_7
13
P1_6
19
P1_5
20
P1_4
21
P1_3
22
P1_2
26
P0_7
27
P0_6
28
P0_5
29
P0_4
30
P0_3
31
P0_2
32
P0_1
33
P0_0
23 P1_1
Digital I/O
Configurable I/O port with 20mA driving
capability, See table 3
24 P1_0
14
SCL
I2C clock or digital I/O
Can be used as I2C clock pin or digital I/O.
Leave floating if not us ed. I f grou n de d disable
pull up.
15 SDA I2C data or digital I/O Can be used as I
2
C da ta pin. Leave floating if not
used. If grounded disable pull up.
Table 2: Terminal Descriptions
PERIPHERAL /
FUNCTION
P0
P1
P2
HARDWARE.XML Example (*
7
6
5
4
3
2
1
0
7
6
5
4
3
2
1
0
2
1
0
Analog Comparator
+
-
(***
ADC
A7
A6
A5
A4
A3
A2
A1
A0
(***
USART 0 SPI (**
Alt.1
C SS MO
MI
<usart channel="0" mode="spi_master" alternate="1" ...
Alt.2
MO
MI C SS
<usart channel="0" mode="spi_master" alternate="2" ...
USART 0 UART
Alt.1
RT CT TX RX
<usart channel="0" mode="uart" alternate="1" ...
Alt.2
TX RX RT CT
<usart channel="0" mode="uart" alternate="2" ...
USART 1 SPI (**
Alt.1
MI MO
C SS
<usart channel="1" mode="spi_master" alternate="1" ...
Alt.2
MI MO
C SS
<usart channel="1" mode="spi_master" alternate="2" ...
USART 1 UART
Alt.1
RX TX RT CT
<usart channel="1" mode="uart" alternate="1" ...
Alt.2
RX TX RT
CT
<usart channel="1" mode="uart" alternate="2" ...
TIMER 1
Alt.1
4 3 2 1 0
<timer index="1" alternate="1" ...
Alt.2
3 4
0 1 2
<timer index="1" alternate="2" ...
TIMER 3
Alt.1
1 0
<timer index="3" alternate="1" ...
Alt.2
1 0
<timer index="3" alternate="2" ...
TIMER 4
Alt.1
1 0
<timer index="4" alternate="1" ...
Alt.2
0
<timer index="4" alternate="2" ...
DEBUG
DC
DD
OBSSEL
5
4
3
2
1
0
*) Refer to Profile Toolkit Developer Guide for detailed settings
**) SS is the slave select signal when BLE113 is set as SPI slave. When set as SPI master, any available I/O can be used as chip select signal of
BLE113
***) The analog comparator and the ADC will be turned on automatically when taken in use and the configuration is done using API (Application
Programming Interface). Refer to Bluetooth Smart Software API Reference
NOTE: Pins configured as peripheral I/O signals do not have pull-up / -down capability
Table 3:Peripheral I/O Pin Mapping
Silicon Labs
Page 9 of 32
Silicon Labs
Page 10 of 32
2.1 I/O Ports
Each I/O port can be configured as an input or output. When configured as input, each I/O port, except pins
P1_0 and P1_1, can also be configured with internal pull-up, pull-down or tri-state. Pull-down or pull-up can
only be configured to whole port, not individual pins. Unused I/O pins should have defined level and not be
floating. See the Profile Toolkit developer guide for more information about the configuration.
During reset the I/O pins are configured as inputs with pull-ups. P1_0 and P1_1 are inputs but do not have
pull-up or pull-down.
NOTE: Pins configured as peripheral I/O signals do not have pull-up / -down capability
2.2 UART
UART baud rate can be configured up 2 Mbps. See the Profile Toolkit developer guide for more information.
Following table lists commonly used baud rates for BLE113
Baud rate (bps) Error (%)
2400 0.14
4800 0.14
9600 0.14
14 400 0.03
19 200 0.14
28 800 0.03
38 400 0.14
57 600 0.03
76 800 0.14
115 200 0.03
230 400 0.03
Table 4: Commonly used baud rates for BLE113
Silicon Labs
Page 11 of 32
2.3 Electrical Characteristics
2.4 Absolute Maximum Ratings
Note: These are absolute maximum ratings beyond which the module can be permanently damaged. These are not
maximum operating conditions. The maximum recommended operating conditions are in the table 6.
Rating Min Max Unit
Storage Temperature -40 +85 °C
AVDD, DVDD -0.3 3.9 V
Other Terminal Volatages VSS-0.4 VDD+0.4 V
*)All supply nets must have the same voltage
Table 5: Absolute Maximum Ratings
2.5 Recommended Operating Conditions
Rating Min Max Unit
Operationg Temperature Range -40 +85 °C
AVDD, DVDD (* 2.0 3.6 V
*) Supply voltage noise should be less than 10mVpp. Excessive noise at the supply voltage will reduce the RF
performance.
Table 6: Recommended Operating Conditions
2.6 DC Characteristics
Parameter Test Conditions Min Typ Max Unit
Logic-0 input voltage
0.5 V
Logic-1 input voltage DVDD =3V0 2.5
V
Logic-0 input current Input equals 0V -50
50 nA
Logic-1 input current Input equals VDD -50
50 nA
I/O pin pull-up and pull-down resistors
20
kΩ
Logic-0 output voltage, 4 mA pins Output load 4 mA
0.5(* V
Logic-1 output voltage, 4 mA pins Output load 4 mA 2.4(*
V
*) See Figure 2 and Figure 3
Table 7: DC Characteristics @ VDD=3.0V
For detailed I/O terminal characteristic and timings refer to the CC2541 datasheet available in
(http://www.ti.com/lit/ds/symlink/cc2541.pdf)
Silicon Labs
Page 12 of 32
Figure 2: 4mA PIO Current Drive Capability @ VDD=3.0V
Figure 3: 20mA PIO (P1_0 and P1_1) Current Drive Capability @ VDD= 3.0V
Silicon Labs
Page 13 of 32
2.7 Current Consumption
Power mode hardware.xml Min Typ Max Unit
Transmit
<txpower power = "1"/>
<slow clock enable = ”true”>
18.2
mA
<txpower power = "7"/>
<slow clock enable = ”true”>
18.3
mA
<txpower power = "15"/>
<slow clock enable = ”true”>
20.7
mA
<txpower power = "1"/>
<slow clock enable = ”false”>
23.6
mA
<txpower power = "7"/>
<slow clock enable = ”false”>
23.6
mA
<txpower power = "15"/>
<slow clock enable = ”false”>
26.1
mA
Receive <slow clock enable = ”true”>
21.9
mA
<slow clock enable = ”false”>
27.0
mA
Power mode 1
270
µA
Power mode 2
1
µA
Power mode 3
0.5
µA
Table 8: Current consumption of BLE113
Figure 4: BLE113 TX peak current as a function of the setting in the HW configuration file
Silicon Labs
Page 14 of 32
25.0
22.5
20.0
17.5
15.0
12.5
10.0
7.5
5.0
2.5
0.0
-2.5
Time (ms)
Figure 5: Current consumption profile of BLE113, HR example, advertising
2.8 RF Characteristics
Parameter Min Typ Max Unit
Transmit power -1.5 0 1 dBm
Receiver Sensitivity
-93
dBm
Gain of the Antenna
0.5 dBi
Efficiency of the antenna
30
%
Table 9: RF Characteristic of BLE113
HW Config:
<sleeposc
enable="true" ppm="30" />
<txpower
power="15" bias="5" />
<slow_clock enable="true" />
-0.5
0.0
0.5
1.0
1.5
2.0
2.5
3.0
3.5
4.0
Current (mA)
Silicon Labs
Page 15 of 32
Figure 6: BLE113 TX power as a function of the setting in the HW configuration file
2.9 Antenna characteristics
The antenna is monopole type of chip antenna. The antenna impedance matching is optimized for 1 mm – 2
mm mother board PCB thickness. The radiation pattern is impacted by the layout of the mother board.
Typically the highest gain is towards GND plane and weakest gain away from the GND plane. Figures 4 – 6
show the radiation pattern of BLE113 when mounted to the development board.
The typical efficiency of the ant enna is 25…35% depending on the mother board layout. Maximum gain is 0.5
dBi.
Silicon Labs
Page 16 of 32
Figure 7: Radiation pattern of BLE113, top view
Figure 8: Radiation pattern of BLE113, front view
Silicon Labs
Page 17 of 32
Figure 9: Radiation pattern of BLE113, side view
Bluegiga Technologies Oy
Page 18 of 32
3
Physical Dimensions
Figure 10: Physical dimensions and pinout (top view)
15.73 mm (+/-0.1mm)
0.3 mm
0.85 mm
0.6 mm
5.53 mm 9.6 mm 0.6 mm
Figure 11: Physical dimensions (top view)
9.15
mm
(
+/-0.1mm
)
4.9
mm
Antenna
Bluegiga Technologies Oy
Page 19 of 32
1.3 mm
0.6 mm
15.73 (+/-0.1) mm
1.9 mm (+/-10%)
Figure 12: Physical dimensions (side view)
Figure 13: Recommended land pattern for BLE113-A
Silicon Labs
Page 20 of 32
4
Power-On Reset and Brownout Detector
BLE113 includes a power-on reset (POR), providing correct initialization during device power on. It also
includes a brownout detector (BOD) operating on the regulated 1.8-V digital power supply only. The BOD
protects the memory contents during supply voltage variations which cause the regulated 1.8-V power to drop
below the minimum level required by digital logic, flash memory, and SRAM. When power is initially applied,
the POR and BOD hold the device in the reset state until the supply voltage rises above the power-on-reset
and brownout voltages.
Silicon Labs
Page 21 of 32
5
Design Guidelines
5.1 General Design Guidelines
LE113 can be used directly with a coin cell battery. Due to relatively high internal resistance of a coin cell
battery it is recommended to place a 100uF capacitor in parallel with the battery. The internal resistance of a
coin cell battery is initially in the range of 10 ohms but the resistance increases rapidly as the capacity is used.
Basically the higher the value of the capacitor the higher is the effective capacity of the battery and thus the
longer the life time for the application. The minimum value for the capacitor depends on the end application
and the maximum transmit power used. The leakage current of a 100uF capacitor is in the range of 0.5 uA to
3 uA and generally ceramic capacitors have lower leakage current than tantalum or aluminum electrolytic
capacitors.
Optional ly TI’s TPS62730 can be used to reduce the current consumption during TX/RX and data processing
stages. TPS62730 is an ultra low power DC/DC converter with by-pass mode and will reduce the current
consumption during transmission nominally by ~20% when using 3V coin cell battery.
Figure 14: Example schematic for BLE113 with a coin cell battery, TPS62730 DCDC converter and an
I2C accelerometer
5.2 Layout Guide Lines
Use good layout practices to avoid excessive noise coupling to supply voltage traces or sensitive analog
signal traces. If using o verlapping gro und planes use stitching vias separated by max 3 mm to avoid emission
from the edges of the PCB. Connect all the GND pins directly to a solid GND plane and make sure that there
is a low impedance path for the return current following the signal and supply traces all the way from start to
the end.
A good practice is to dedicate one of the inner layers to a solid GND plane and one of the inner layers to
supply voltage planes and traces and route all the signals on top and bottom layers of the PCB. This
arrangement will make sure that any return current follows the forward current as close as possible and any
loops are minimized.
Silicon Labs
Page 22 of 32
Signals
GND
Power
Signals
Figure 15: Typical 4-layer PCB construction
not separate GND regions but keep one s olid GND plane.
– Keep t he trace as short as possible
Recommended PCB layer configuration
Figure 17: Recommended layout for BLE113-A
Overlapping GND layers without
GND stitchin g vias
Overlapping GND layers with
GND
stitching vias shielding the
RF energy
Figure 16: Use of stitching vias to avoid emissions from the edges of the PCB
5.3 BLE113-A Layout Guide
For
optimal performance of the antenna place the module at the corner of the PCB as shown in the figure
14.
Do
not place any metal (traces, components, battery etc.) within the clearance area of the antenna.
Connect
all
the GND pins directly to a solid GN D plan e. Place the GND vias as close to the GND pins as possible.
Use
good
layout practices to avoid any excessive noise coupling to signal lines or supply voltage lines.
Avoid
placing
plastic or any other dielectric material closer than 5 mm from the antenna. Any dielectric closer than
5
mm from the antenna will detune the antenna to lower frequencies.
Figure 18: Typical return loss of BLE113-A with two different mother board PCB thickness
Silicon Labs
Page 23 of 32
Copper clearance area Copper clearance area
Figure 19: Example layouts for BLE113
Silicon Labs
Page 24 of 32
-
A low residue, “no clean” solder paste should be used due to low mounted height of the component.
6
Soldering Recommendations
BLE113 is compatible with industrial standard reflow profile for Pb-free solders. The reflow profile used is
dependent on the thermal mass of the entire populated PCB, heat transfer efficiency of the oven and
particular type of solder paste used. Consult the datasheet of particular solder paste for profile configurations.
Bluegiga Technologies will give following r ecomm endations for soldering the module to ensure reliable solder
joint and operation of the module after soldering. Since the profile used is process and layout dependent, the
optimum profile should be studied case by case. Thus following recommendation should be taken as a
starting point guide.
-
Refer to technical documentations of particular solder paste for profile configurations
-
Avoid using more than one flow.
-
Reliability of the solder joint and self-alignment of the component are dependent on the solder volume.
Minimum of 150µm stencil thickness is recommended.
-
Aperture size of the stencil should be 1:1 with the pad size.
Figure 20: Reference reflow profile
Silicon Labs
Page 25 of 32
Voltage regulator Reset
Power-on reset
8051 CPU core and memory arbitrator
SRAM
Flash
Radio arbiter
Radio registers
Link layer engine
SRAM
Receive
Frequency
synthetisizer
Transmit
32 MHz
XTAL
32.768
kHz XTAL
CC2540
Analog comparator
IRQ controller DMA
ADC
I2C
USART 0
USART 1
TIMER 1
TIMER 2
TIMER 3
TIMER 4
2V – 3.6V
Reset
U.Fl
connector
(BLE112-E)
Chip
antenna
BLE112-A)
7
Block diagram
BLE113 is based on TI’s CC2541 chip. Embedded 32 MHz and 32.768 kHz crystals are used for clock
generation. Matched balun and low pass filter provide optimal radio performance with extremely low spurious
emissions. Small ceramic chip antenna gives good radiation efficiency even when the module is used in
layouts with very limited space.
Clock
Debug interface
I/O
Figure 21: Simplified block diagram of BLE113
CPU and Memory
The 8051 CPU core is a single-cycle 8051-compatible core. It has three different memory access buses (SFR,
DATA, and CODE/XDATA), a debug interface, and an 18-input extended interrupt unit.
The memory arbiter is at the heart of the system, as it connects the C PU and DMA controller with the physical
memories and all peripherals through the SFR bus. The memory arbiter has four memory-access points,
access of which can map to one of three physical memories: an SRAM, flash memory, and XREG/SFR
registers. It is responsible for performing arbitration and sequencing between simultaneous memory accesses
to the same physical memory.
The SFR bus is a common bus that connects all hardware peripherals to the memory arbiter. The SFR bus
also provides access to the radio registers in the radio register bank, even though these are indeed mapped
into XDATA memory space.
Assembly
variant:
BLE112-A or
BLE112-E
Balun +
LPF
Demodulator
Synth
Modulator
I/O
controller
Silicon Labs
Page 26 of 32
The 8-KB SRAM maps to the DATA memory space and to parts of the XDATA memory spaces. The SRAM is
an ultralow-power SRAM that retains its contents even when the digital part is powered off (power modes 2
and 3).
The 128/256 KB flash block provides in-circuit programmable non-volatile program memory for the device,
and maps into the CODE and XDATA memory spaces.
Peripherals
Writing to the flash block is performed through a flash controller that allows page-wise erasure and 4-bytewise
programming.
A versatile five-channel DMA controller is available in the system, accesses memory using the XDATA
memory space, and thus has access to all physical memories. Each channel (trigger, priority, transfer mode,
addressing mode, source and destination pointers, and transfer count) is configured with DMA descriptors that
can be located anywhere in memory. Many of the hardware peripherals (AES core, flash controller, USARTs,
timers, ADC interface, etc.) can be used with the DMA controller for efficient operation by performing data
transfers between a single SFR or XREG address and flash/SRAM.
Each CC2541 contains a unique 48-bit IEEE address that can be used as the public device address for a
Bluetooth device. Designers are free to use this address, or provide their own, as described in the Bluetooth
specification.
The interrupt controller services a total of 18 interrupt sources, divided into six inter rupt groups, each of which
is associated with one of four interrupt priorities. I/O and sleep timer interrupt requests are serviced even if the
device is in a sleep mode (power modes 1 and 2) by bringing the CC2541 back to the active mode.
The debug interface implements a proprietary two-wire serial interface that is used for in-circuit debugging.
Through this debug interface, it is possible to erase or program the entire flash memory, control which
oscillators are enabled, stop and start execution of the user program, execute instructions on the 8051 core,
set code breakpoints, and single-step through instructions in the code. Using these techniques, it is possible
to perform in-circuit debugging and external flash programming elegantly.
The I/O controller is responsible for all general-purpose I/O pins. The CPU can configure whether peripheral
modules control certain pins or whether they are under software control, and if so, whether each pin is
configured as an input or output and if a pullup or pulldown resistor in the pad is connected. Each peripheral
that connects to the I/O pins can choose bet ween two different I/O pin locations to ensure flexibility in various
applications.
The sleep timer is an ultra low power timer that uses an external 32.768-kHz crystal oscillator. The sleep timer
runs continuously in all operating modes except power mode 3. Typical applications of this timer are as a real-
time counter or as a wake-up timer to exit power modes 1 or 2.
Timer 1 is a 16-bit timer with timer/counter/PWM functionality. It has a programmable prescaler, a 16-bit
period value, and five individually programmable counter/capture channels, each with a 16-bit compare value.
Each of the counter/capture channels can be used as a PWM output or to capture the timing of edges on input
signals. It can also be configured in IR generation mode, where it counts timer 3 periods and the output is
ANDed with the output of timer 3 to generate modulated consumer IR signals with minimal CPU interaction.
Timer 2 is a 40-bit timer used by the Bluetooth low energy stack. It has a 16-bit counter with a configurable
timer period and a 24-bit overflow counter that can be used to keep track of the number of periods that have
transpired. A 40-bit capture register is also used to record the exact time at which a start-of-frame delimiter is
received/transmitted or the exact time at which transmission ends. There are two 16-bit timer-compare
registers and two 24-bit overflow-compare registers that can be used to give exact timing for star t of RX or TX
to the radio or general interrupts.
Timer 3 and timer 4 are 8-bit timers with timer/counter/PWM functionality. They have a programmable
prescaler, an 8-bit period valu e, and one programmable counter channel with an 8-bit compare value. Each of
the counter channels can be used as PWM output.
USART 0 and USART 1 are each configurable as either an SPI master/slave or a UART. They provide double
buffering on both RX and TX and hardware flow control and are thus well suited to high-throughput full-duplex
applications. Each USART has its own high-precision baud-rate generator, thus leaving the ordinary timers
Silicon Labs
Page 27 of 32
free for other uses. When configured as SPI slaves, the USARTs sample the input signal using SCK directly
instead of using some oversampling scheme, and are thus well-suited for high data rates.
The AES encryption/decryption core allows the user to encrypt and decrypt data using the AE S algorithm with
128-bit keys. The AES core also supports ECB, CBC, CFB, OFB, CTR, and CBC-MAC, as well as hardware
support for CCM.
The ADC supports 7 to 12 bits of resolution with a corresponding range of bandwidths from 30-kHz to 4-kHz,
respectively. DC and audio conversions with up to eight input channels (I/O controller pins) are possible. The
inputs can be selected as single-ended or differential. The reference voltage can be internal, AVDD, or a
single-ended or differential external signal. The ADC also has a temperature-sensor input channel. The ADC
can automate the process of periodic sampling or conversion over a sequence of channels.
The I2C module provides a digital peripheral connection with two pins and supports both master and slave
operation. I2C support is compliant with the NXP I2C specification version 2.1 and supports standard mode (up
to 100 kbps) and fast mode (up to 400 kbps). In addition, 7-bit device addressing modes are supported, as well
as master and slave modes..
The ultralow-power analog comparator enables applications to wake up from PM2 or PM3 based on an analog
signal. Both inputs are brought out to pins; the reference voltage must be provided externally. The comparator
output is connected to the I/O controller interrupt d etector and can be treated by the MC U as a regular I/O pin
interrupt.
RF front end
RF front end includes combined matched balun and low pass filter, and ceramic chip antenna with matching
network. Optimal matching combined with effective low pass filter provides extremely low in-band spurious
emissions and harmonics.
Silicon Labs
Page 28 of 32
8
Certifications
BLE113 is compliant to the following specifications.
8.1 Bluetooth
BLE113 is BT qualified as a controller subsystem. As a controller subsystem the module can be used as s uch
with a Host Subsystem to make a Bluetooth end product without additional qualification or QDID. The
Bluetooth QDID of BLE13 is B021015. The Bluetooth listing can be vied from the link below.
https://www.bluetooth.org/tpg/QLI_viewQDL.cfm?qid=21015
8.2 FCC and IC
This device complies with Part 15 of the FCC Rules. Operation is subject to the following two conditions:
(1)
this device may not cause harmful interference, and
(2)
this device must accept any interference received, including interference that may
cause undesired operation.
Any changes or modifications not expressly approved by Bluegiga Technologies could void the
user’s authority to operate the equipment.
FCC RF Radiation Exposure Statement:
This equipment complies with FCC radiation exposure limits set forth for an uncontrolled environment. End
users must follow the specific operating instructions for satisfying RF exposure compliance. This transmitter
meets both portable and mobile limits as demonstrated in the RF Exposure Analysis. This transmitter must not
be co-located or operating in conjunction with any other antenna or transmitter except in accordance with FCC
multi-transmitter product procedures.
IC Statements:
This device complies with Industry Canada licence-exempt RSS standard(s). Operation is subject to the
following two conditions: (1) this device may not cause interference, and (2) this device must accept any
interference, including interference that may cause undesired operation of the device.
Under Industry Canada regulations, this radio transmitter may only operate using an antenna of a type and
maximum (or lesser) gain approved for the transmitter by Industry Canada. To reduce potential radio
interference to other users, the antenna type and its gain should be so chosen that the equivalent isotropically
radiated power (e.i.r.p.) is not more than that necessary for successful communication.
OEM Responsibilities to comply with FCC and Industry Canada Regulations
The BLE113 module has been certified for integration into products only by OEM integrators under the
following condition:
Silicon Labs
Page 29 of 32
•
The transmitter module must not be co-located or operating in conjunction with any other antenna or
transmitter except in accordance with FCC multi-transmitter product procedures.
As long as the two condition above is met, further transmitter testing will not be required. However, the OEM
integrator is still responsible for testing their end-product for any additional compliance requirements required
with this module installed (for example, digital device emissions, PC peripheral requirements, etc.).
IMPORTANT NOTE: In the event that these conditions cannot be met (for certain configurations or co-location
with another transmitter), then the FCC and Industry Canada authorizations are no longer considered valid
and the FCC ID and IC Certification Number cannot be used on the final product. In these circumstances, the
OEM integrator will be responsible for re-evaluating the end product (including the transmitter) and obtaining a
separate FCC and Industry Canada authorization.
End Product Labeling
The BLE113 module is labeled with its own FCC ID and IC Certification Number. If the FCC ID and IC
Certification Number are not visible when the module is installed inside another device, then the outside of the
device into which the module is installed must also display a label referring to the enclosed module. In that
case, the final end product must be labeled in a visible area with the following:
“Contains Transmitter Module FCC ID: QOQBLE113”
“Contains Transmitter Module IC: 5123A-BGTBLE113”
or
“Contains FCC ID: QOQBLE113”
“Contains IC: 5123A-BGTBLE113”
The OEM integrator has to be aware not to provide information to the end user regarding how to install or
remove this RF module or change RF related parameters in the user manual of the end product.
8.2.1
FCC et IC
Déclaration d’IC :
Ce disp ositif est conforme aux normes RSS exemptes de licence d’Industrie Canada. Son fonctionnement est
assujetti aux deux conditions suivantes : (1) ce dispositif ne doit pas provoquer de perturbation et (2) ce
dispositif doit accepter toute perturbation, y compris les perturbations qui peuvent entraîner un fonctionnement
non désiré du dispositif.
Selon les réglementations d’Industrie Canada, cet émetteur radio ne doit fonctionner qu’avec une antenne
d’une typologie spécifique et d’un gain maximum (ou inférieur) approuvé pour l’émetteur par Industrie
Canada. Pour réduire les éventuelles perturbations radioélectriques nuisibles à d’autres utilisateurs, le type
d’antenne et son gain doivent être choisis de manière à ce que la puissance isotrope rayonnée équivalente
(P.I.R.E.) n’excède pas les valeurs nécessaires pour obtenir une communication convenable.
Responsabilités des OEM quant à la conformité avec les réglementations de FCC et d’Industrie
Canada
Les modules BLE113 ont été certifiés pour entrer dans la fabrication de produits exclusivement réalisés par
des intégrateurs dans les conditions suivantes :
Silicon Labs
Page 30 of 32
• Le module transmetteur ne doit pas être installé ou utilisé en concomitance avec une autre antenne
ou un autre transmetteur.
Tant que ces deux conditions sont réunies, il n’est pas nécessaire de procéder à des tests supplémentaires
sur le transmetteur. Cependant, l’ intégrat eur est responsable des tests effectués s ur le produit f inal af in de se
mettre en conformité avec d’éventuelles exigences complémentaires lorsque le module est installé (exemple :
émissions provenant d’appareils numériques, exigences vis-à-vis de périphériques informatiques, etc.)
REMARQUE IMPORTANTE : En cas d’inobservance de ces conditions (en ce qui concerne certaines
configurations ou l’emplacement du dispositif à proximité d’un autre émetteur), les autorisations de FCC et
d’Industr ie Canada ne ser ont plus considérées valables et l’identification de FCC et le numéro de certificati on
d’IC ne pourront pas être utilisés sur le produit final. Dans ces cas, l’intégrateur OEM sera chargé d’évaluer à
nouveau le produit final (y compris l’émetteur) et d’obtenir une autorisation indépendante de FCC et
d’Industrie Canada.
Étiquetage du produit final
Le module BLE113 est étiqueté avec sa propre ident ification FCC et son propre numéro de c ertificati on IC. Si
l’identification FCC et le numéro de certification IC ne sont pas visibles lorsque le module est installé à
l’intérieur d’un autre dispositif, la partie externe du dispositif dans lequel le module est installé devra
également présenter une étiquette f aisant r éférence a u module inclus. Dans ce cas, le produit final devra être
étiqueté sur une zone visible avec les informations suivantes :
« Contient module émetteur identification FCC : QOQBLE113 »
« Contient module émetteur IC : 5123A-BGTBLE113 »
ou
« Contient identification FCC : QOQBLE113 »
« Contient IC : 5123A-BGTBLE113 »
Dans le guide d’utilisation du produit final, l’intégrateur OEM doit s’abstenir de fournir des informations à
l’utilisateur final portant sur les procédures à suivre pour instal ler ou retirer ce module RF ou pour cha nger les
paramètres RF.
Silicon Labs
Page 31 of 32
8.3 CE
The official R&TTE DoC is available at www.bluegiga.com
8.4 MIC Japan
BLE113 is certified as a module with type certification number 007-AB0103. As a certified module BLE113 can
be integrated to an end product without a need for additional MIC Japan certification of the end product.
8.5 KCC (Korea)
BLE113 has type certification in Korea with certification number KCC-CRM-BGT-BLE113.
IoT Portfolio
www.silabs.com/IoT SW/HW
www.silabs.com/simplicity Quality
www.silabs.com/quality Support and Community
community.silabs.com
Disclaimer
Silicon Laboratories intends to provide customers with the latest, accurate, and in-depth documentation of all peripherals and modules available for system and software implementers using
or intending to use the Silicon Laboratories products. Characterization data, available modules and peripherals, memory sizes and memory addresses refer to each specific device, and
"Typical" parameters provided can and do vary in different applications. Application examples described herein are for illustrative purposes only. Silicon Laboratories reserves the right to
make changes without further notice and limitation to product information, specifications, and descriptions herein, and does not give warranties as to the accuracy or completeness of the
included information. Silicon Laboratories shall have no liability for the consequences of use of the information supplied herein. This document does not imply or express copyright licenses
granted hereunder to design or fabricate any integrated circuits. The products are not designed or authorized to be used within any Life Support System without the specific written consent
of Silicon Laboratories. A "Life Support System" is any product or system intended to support or sustain life and/or health, which, if it fails, can be reasonably expected to result in significant
personal injury or death. Silicon Laboratories products are not designed or authorized for military applications. Silicon Laboratories products shall under no circumstances be used in
weapons of mass destruction including (but not limited to) nuclear, biological or chemical weapons, or missiles capable of delivering such weapons.
Trademark Information
Silicon Laboratories Inc.® , Silicon Laboratories®, Silicon Labs®, SiLabs® and the Silicon Labs logo®, Bluegiga®, Bluegiga Logo®, Clockbuilder®, CMEMS®, DSPLL®, EFM®, EFM32®,
EFR, Ember®, Energy Micro, Energy Micro logo and combinations thereof, "the world’s most energy friendly microcontrollers", Ember®, EZLink®, EZRadio®, EZRadioPRO®, Gecko®,
ISOmodem®, Precision32®, ProSLIC®, Simplicity Studio®, SiPHY®, Telegesis, the Telegesis Logo®, USBXpress® and others are trademarks or registered trademarks of Silicon Laborato-
ries Inc. ARM, CORTEX, Cortex-M3 and THUMB are trademarks or registered trademarks of ARM Holdings. Keil is a registered trademark of ARM Limited. All other products or brand
names mentioned herein are trademarks of their respective holders.
Silicon Laboratories Inc.
400 West Cesar Chavez
Austin, TX 78 701
USA
http://www.silabs.com
Simplicity S tudio
One-click access to MCU and
wireless tools, documentation,
software, source code libraries &
more. Available for Windows,
Mac and Linux!