MC14585B 4-Bit Magnitude Comparator The MC14585B 4-Bit Magnitude Comparator is constructed with complementary MOS (CMOS) enhancement mode devices. The circuit has eight comparing inputs (A3, B3, A2, B2, A1, B1, A0, B0), three cascading inputs (A < B, A = B, and A > B), and three outputs (A < B, A = B, and A > B). This device compares two 4-bit words (A and B) and determines whether they are "less than", "equal to", or "greater than" by a high level on the appropriate output. For words greater than 4-bits, units can be cascaded by connecting outputs (A > B), (A < B), and (A = B) to the corresponding inputs of the next significant comparator. Inputs (A < B), (A = B), and (A > B) on the least significant (first) comparator are connected to a low, a high, and a low, respectively. Applications include logic in CPU's, correction and/or detection of instrumentation conditions, comparator in testers, converters, and controls. http://onsemi.com MARKING DIAGRAMS PDIP-16 P SUFFIX CASE 648 16 * * Diode Protection on All Inputs Expandable Applicable to Binary or 8421-BCD Code Supply Voltage Range = 3.0 Vdc to 18 Vdc Capable of Driving Two Low-Power TTL Loads or One Low-Power Schottky TTL Load over the Rated Temperature Range Can be Cascaded - See Figure 3 These Devices are Pb-Free and are RoHS Compliant MAXIMUM RATINGS (Voltages Referenced to VSS) Parameter DC Supply Voltage Range Symbol Value Unit VDD -0.5 to +18.0 V Vin, Vout -0.5 to VDD + 0.5 V Input or Output Current (DC or Transient) per Pin Iin, Iout 10 mA Power Dissipation per Package (Note 1) PD 500 mW Ambient Temperature Range TA -55 to +125 C Storage Temperature Range Tstg -65 to +150 C Lead Temperature (8-Second Soldering) TL 260 C Input or Output Voltage Range (DC or Transient) (c) Semiconductor Components Industries, LLC, 2011 June, 2011 - Rev. 7 SOIC-16 D SUFFIX CASE 751B 1 SOEIAJ-16 F SUFFIX CASE 966 1 A WL, L YY, Y WW, W G 1 16 14585BG AWLYWW 1 16 MC14585B ALYWG 1 = Assembly Location = Wafer Lot = Year = Work Week = Pb-Free Package ORDERING INFORMATION Package Shipping MC14585BCPG PDIP-16 (Pb-Free) 500 Units / Rail MC14585BDG SOIC-16 (Pb-Free) 48 Units / Rail MC14585BDR2G SOIC-16 (Pb-Free) 2500/Tape & Reel MC14585BFELG SOEIAJ-16 2000/Tape & Reel (Pb-Free) Device Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect device reliability. 1. Temperature Derating: Plastic "P and D/DW" Packages: - 7.0 mW/_C From 65_C To 125_C This device contains protection circuitry to guard against damage due to high static voltages or electric fields. However, precautions must be taken to avoid applications of any voltage higher than maximum rated voltages to this high-impedance circuit. For proper operation, Vin and Vout should be constrained to the range VSS v (Vin or Vout) v VDD. Unused inputs must always be tied to an appropriate logic voltage level (e.g., either VSS or VDD). Unused outputs must be left open. 1 1 Features * * * * * MC14585BCP AWLYYWWG For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD8011/D. Publication Order Number: MC14585B/D MC14585B PIN ASSIGNMENT BLOCK DIAGRAM B2 1 16 VDD A2 2 15 A3 (A = B)out 3 14 B3 (A u B)in 4 13 (A u B)out (A t B)in 5 12 (A t B)out (A = B)in 6 11 B0 A1 7 10 A0 VSS 8 9 B1 (A>B)in (A=B)in (A<B)in A0 B0 A1 B1 A2 B2 A3 B3 4 6 5 10 11 7 9 2 1 15 14 (A>B)out 13 (A=B)out 3 (A<B)out 12 VDD = PIN 16 VSS = PIN 8 TRUTH TABLE (x = Don't Care) Inputs Comparing Cascading Outputs A3, B3 A2, B2 A1, B1 A0, B0 A<B A=B A>B A<B A=B A>B A3 > B3 A3 = B3 A3 = B3 A3 = B3 x A2 > B2 A2 = B2 A2 = B2 x x A1 > B1 A1 = B1 x x x A0 > B0 x x x x x x x x x x x x 0 0 0 0 0 0 0 0 1 1 1 1 A3 = B3 A3 = B3 A3 = B3 A3 = B3 A2 = B2 A2 = B2 A2 = B2 A2 = B2 A1 = B1 A1 = B1 A1 = B1 A1 = B1 A0 = B0 A0 = B0 A0 = B0 A0 = B0 0 0 1 1 0 1 0 1 x x x x 0 0 1 1 0 1 0 1 1 0 0 0 A3 = B3 A3 = B3 A3 = B3 A2 = B2 A2 = B2 A2 < B2 A1 = B1 A1 < B1 x A0 < B0 x x x x x x x x x x x 1 1 1 0 0 0 0 0 0 A3 < B3 x x x x x x 1 0 0 http://onsemi.com 2 MC14585B IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII ELECTRICAL CHARACTERISTICS (Voltages Referenced to VSS) - 55_C Characteristic Output Voltage Vin = VDD or 0 Symbol 25_C 125_C VDD Vdc Min Max Min Typ (Note 2) Max Min Max Unit "0" Level VOL 5.0 10 15 - - - 0.05 0.05 0.05 - - - 0 0 0 0.05 0.05 0.05 - - - 0.05 0.05 0.05 Vdc "1" Level VOH 5.0 10 15 4.95 9.95 14.95 - - - 4.95 9.95 14.95 5.0 10 15 - - - 4.95 9.95 14.95 - - - Vdc Input Voltage "0" Level (VO = 4.5 or 0.5 Vdc) (VO = 9.0 or 1.0 Vdc) (VO = 13.5 or 1.5 Vdc) VIL 5.0 10 15 - - - 1.5 3.0 4.0 - - - 2.25 4.50 6.75 1.5 3.0 4.0 - - - 1.5 3.0 4.0 "1" Level (VO = 0.5 or 4.5 Vdc) (VO = 1.0 or 9.0 Vdc) (VO = 1.5 or 13.5 Vdc) VIH 5.0 10 15 3.5 7.0 11 - - - 3.5 7.0 11 2.75 5.50 8.25 - - - 3.5 7.0 11 - - - 5.0 5.0 10 15 - 3.0 - 0.64 - 1.6 - 4.2 - - - - - 2.4 - 0.51 - 1.3 - 3.4 - 4.2 - 0.88 - 2.25 - 8.8 - - - - - 1.7 - 0.36 - 0.9 - 2.4 - - - - IOL 5.0 10 15 0.64 1.6 4.2 - - - 0.51 1.3 3.4 0.88 2.25 8.8 - - - 0.36 0.9 2.4 - - - mAdc Input Current Iin 15 - 0.1 - 0.00001 0.1 - 1.0 mAdc Input Capacitance (Vin = 0) Cin - - - - 5.0 7.5 - - pF Quiescent Current (Per Package) IDD 5.0 10 15 - - - 5.0 10 20 - - - 0.005 0.010 0.015 5.0 10 20 - - - 150 300 600 mAdc Total Supply Current (Notes 3, 4) (Dynamic plus Quiescent, Per Package) (CL = 50 pF on all outputs, all buffers switching) IT 5.0 10 15 Vin = 0 or VDD Output Drive Current (VOH = 2.5 Vdc) (VOH = 4.6 Vdc) (VOH = 9.5 Vdc) (VOH = 13.5 Vdc) Source (VOL = 0.4 Vdc) (VOL = 0.5 Vdc) (VOL = 1.5 Vdc) Sink IOH IT = (0.6 mA/kHz) f + IDD IT = (1.2 mA/kHz) f + IDD IT = (1.8 mA/kHz) f + IDD Vdc Vdc mAdc mAdc 2. Data labelled "Typ" is not to be used for design purposes but is intended as an indication of the IC's potential performance. 3. The formulas given are for the typical characteristics only at 25_C. 4. To calculate total supply current at loads other than 50 pF: IT(CL) = IT(50 pF) + (CL - 50) Vfk where: IT is in mA (per package), CL in pF, V = (VDD - VSS) in volts, f in kHz is input frequency, and k = 0.001. IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII SWITCHING CHARACTERISTICS (Note 5) (CL = 50 pF, TA = 25_C) Characteristic Symbol Output Rise and Fall Time tTLH, tTHL = (1.5 ns/pF) CL + 25 ns tTLH, tTHL = (0.75 ns/pF) CL + 12.5 ns tTLH, tTHL = (0.55 ns/pF) CL + 9.5 ns tTLH, tTHL Turn-On, Turn-Off Delay Time tPLH, tPHL = (1.7 ns/pF) CL + 345 ns tPLH, tPHL = (0.66 ns/pF) CL + 147 ns tPLH, tPHL = (0.5 ns/pF) CL + 105 ns tPLH, tPHL VDD Min Typ (Note 6) Max 5.0 10 15 - - - 100 50 40 200 100 80 5.0 10 15 - - - 430 180 130 860 360 260 5. The formulas given are for the typical characteristics only at 25_C. 6. Data labelled "Typ" is not to be used for design purposes but is intended as an indication of the IC's potential performance. http://onsemi.com 3 Unit ns ns MC14585B 20 ns 20 ns VDD A3 VSS 1 2f VDD B3 VSS 20 ns 20 ns VOH (A>B)out VDD 90% VOL 50% B0 VOH 10% VSS tPLH (A=B)out tPHL VOL 50% (A<B)out 10% VOL VOL tTLH Inputs (A>B) and (A=B) high, and inputs B2, A2, B1, A1, B0, A0 and (A<B) low. f in respect to a system clock. Inputs (A>B) and (A=B) high, and inputs B3, A3, B2, A2, B1, A1, A0, and (A<B) low. Figure 2. Dynamic Signal Waveforms (A>B) (A=B) (A<B) B3 A3 B2 A2 B1 A1 B0 A0 OUTPUT MC14585B MC14585B WORD B = B11, B10, ..., B0. WORD A = A11, A10, ..., A0. (A>B) (A=B) MC14585B OUTPUTS Figure 3. Cascading Comparators http://onsemi.com 4 VSS VDD VSS (A>B) WORD B10 B9 B8 B7 B6 B5 B4 B3 B2 B1 B0 B = B11 WORD A11 A10 A9 A8 A7 A6 A5 A4 A3 A2 A1 A0 A= (A<B) Figure 1. Dynamic Power Dissipation Signal Waveforms (A<B) tTHL (A=B) (A<B)out VOH 90% VOH INPUTS MC14585B LOGIC DIAGRAM A3 B3 A2 B2 A1 B1 A0 B0 (A<B)in 15 14 2 1 12 7 9 10 11 5 3 (A=B)in (A>B)in (A<B)out 6 13 4 http://onsemi.com 5 (A=B)out (A>B)out MC14585B PACKAGE DIMENSIONS PDIP-16 CASE 648-08 ISSUE T NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. 3. DIMENSION L TO CENTER OF LEADS WHEN FORMED PARALLEL. 4. DIMENSION B DOES NOT INCLUDE MOLD FLASH. 5. ROUNDED CORNERS OPTIONAL. -A- 16 9 1 8 B F C L DIM A B C D F G H J K L M S S -T- SEATING PLANE K H G D M J 16 PL 0.25 (0.010) M T A M INCHES MIN MAX 0.740 0.770 0.250 0.270 0.145 0.175 0.015 0.021 0.040 0.70 0.100 BSC 0.050 BSC 0.008 0.015 0.110 0.130 0.295 0.305 0_ 10 _ 0.020 0.040 MILLIMETERS MIN MAX 18.80 19.55 6.35 6.85 3.69 4.44 0.39 0.53 1.02 1.77 2.54 BSC 1.27 BSC 0.21 0.38 2.80 3.30 7.50 7.74 0_ 10 _ 0.51 1.01 SOEIAJ-16 CASE 966-01 ISSUE A 16 LE 9 Q1 E HE 1 M_ L 8 Z DETAIL P D e VIEW P A DIM A A1 b c D E e HE L LE M Q1 Z A1 b 0.13 (0.005) c M NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: MILLIMETER. 3. DIMENSIONS D AND E DO NOT INCLUDE MOLD FLASH OR PROTRUSIONS AND ARE MEASURED AT THE PARTING LINE. MOLD FLASH OR PROTRUSIONS SHALL NOT EXCEED 0.15 (0.006) PER SIDE. 4. TERMINAL NUMBERS ARE SHOWN FOR REFERENCE ONLY. 5. THE LEAD WIDTH DIMENSION (b) DOES NOT INCLUDE DAMBAR PROTRUSION. ALLOWABLE DAMBAR PROTRUSION SHALL BE 0.08 (0.003) TOTAL IN EXCESS OF THE LEAD WIDTH DIMENSION AT MAXIMUM MATERIAL CONDITION. DAMBAR CANNOT BE LOCATED ON THE LOWER RADIUS OR THE FOOT. MINIMUM SPACE BETWEEN PROTRUSIONS AND ADJACENT LEAD TO BE 0.46 ( 0.018). 0.10 (0.004) http://onsemi.com 6 MILLIMETERS MIN MAX --2.05 0.05 0.20 0.35 0.50 0.10 0.20 9.90 10.50 5.10 5.45 1.27 BSC 7.40 8.20 0.50 0.85 1.10 1.50 10 _ 0_ 0.70 0.90 --0.78 INCHES MIN MAX --0.081 0.002 0.008 0.014 0.020 0.007 0.011 0.390 0.413 0.201 0.215 0.050 BSC 0.291 0.323 0.020 0.033 0.043 0.059 10 _ 0_ 0.028 0.035 --0.031 MC14585B PACKAGE DIMENSIONS SOIC-16 CASE 751B-05 ISSUE K -A- 16 NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: MILLIMETER. 3. DIMENSIONS A AND B DO NOT INCLUDE MOLD PROTRUSION. 4. MAXIMUM MOLD PROTRUSION 0.15 (0.006) PER SIDE. 5. DIMENSION D DOES NOT INCLUDE DAMBAR PROTRUSION. ALLOWABLE DAMBAR PROTRUSION SHALL BE 0.127 (0.005) TOTAL IN EXCESS OF THE D DIMENSION AT MAXIMUM MATERIAL CONDITION. 9 -B- 1 P 8 PL 0.25 (0.010) 8 M B S G R K F X 45 _ C -T- SEATING PLANE J M D DIM A B C D F G J K M P R MILLIMETERS MIN MAX 9.80 10.00 3.80 4.00 1.35 1.75 0.35 0.49 0.40 1.25 1.27 BSC 0.19 0.25 0.10 0.25 0_ 7_ 5.80 6.20 0.25 0.50 INCHES MIN MAX 0.386 0.393 0.150 0.157 0.054 0.068 0.014 0.019 0.016 0.049 0.050 BSC 0.008 0.009 0.004 0.009 0_ 7_ 0.229 0.244 0.010 0.019 16 PL 0.25 (0.010) M T B S A S SOLDERING FOOTPRINT 8X 6.40 16X 1 1.12 16 16X 0.58 1.27 PITCH 8 9 DIMENSIONS: MILLIMETERS ON Semiconductor and are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice to any products herein. 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