© Semiconductor Components Industries, LLC, 2011
June, 2011 − Rev. 7
1Publication Order Number:
MC14585B/D
MC14585B
4-Bit Magnitude Comparator
The MC14585B 4−Bit Magnitude Comparator is constructed with
complementary MOS (CMOS) enhancement mode devices. The circuit
has eight comparing inputs (A3, B3, A2, B2, A1, B1, A0, B0), three
cascading inputs (A < B, A = B, and A > B), and three outputs (A < B,
A = B, and A > B). This device compares two 4−bit words (A and B)
and determines whether they are “less than”, “equal to”, or “greater
than” by a high level on the appropriate output. For words greater than
4−bits, units can be cascaded by connecting outputs (A > B), (A < B),
and (A = B) to the corresponding inputs of the next significant
comparator. Inputs (A < B), (A = B), and (A > B) on the least significant
(first) comparator are connected to a low, a high, and a low, respectively.
Applications include logic in CPU’s, correction and/or detection of
instrumentation conditions, comparator in testers, converters, and
controls.
Features
•Diode Protection on All Inputs
•Expandable
•Applicable to Binary or 8421−BCD Code
•Supply Voltage Range = 3.0 Vdc to 18 Vdc
•Capable of Driving Two Low−Power TTL Loads or One Low−Power
Schottky TTL Load over the Rated Temperature Range
•Can be Cascaded − See Figure 3
•These Devices are Pb−Free and are RoHS Compliant
MAXIMUM RATINGS (Voltages Referenced to VSS)
Parameter Symbol Value Unit
DC Supply Voltage Range VDD −0.5 to +18.0 V
Input or Output Voltage Range
(DC or Transient)
Vin, Vout −0.5 to VDD
+ 0.5
V
Input or Output Current (DC or Transient)
per Pin
Iin, Iout ±10 mA
Power Dissipation per Package (Note 1) PD500 mW
Ambient Temperature Range TA−55 to +125 °C
Storage Temperature Range Tstg −65 to +150 °C
Lead Temperature (8−Second Soldering) TL260 °C
Stresses exceeding Maximum Ratings may damage the device. Maximum
Ratings are stress ratings only. Functional operation above the Recommended
Operating Conditions is not implied. Extended exposure to stresses above the
Recommended Operating Conditions may affect device reliability.
1. Temperature Derating: Plastic “P and D/DW”
Packages: – 7.0 mW/_C From 65_C To 125_C
This device contains protection circuitry to guard against damage due to high
static voltages or electric fields. However, precautions must be taken to avoid
applications of any voltage higher than maximum rated voltages to this
high−impedance circuit. For proper operation, Vin and Vout should be constrained
to the range VSS v (Vin or Vout) v VDD.
Unused inputs must always be tied to an appropriate logic voltage level
(e.g., either VSS or VDD). Unused outputs must be left open.
Device Package Shipping†
ORDERING INFORMATION
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MC14585BFELG SOEIAJ−16
(Pb−Free)
2000/Tape & Reel
MC14585BDR2G SOIC−16
(Pb−Free)
2500/Tape & Reel
MC14585BDG SOIC−16
(Pb−Free)
48 Units / Rail
MC14585BCPG PDIP−16
(Pb−Free)
500 Units / Rail
†For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specifications
Brochure, BRD8011/D.
A = Assembly Location
WL, L = Wafer Lot
YY, Y = Year
WW, W = Work Week
G = Pb−Free Package
MARKING
DIAGRAMS
PDIP−16
P SUFFIX
CASE 648
SOIC−16
D SUFFIX
CASE 751B 1
16
14585BG
AWLYWW
SOEIAJ−16
F SUFFIX
CASE 966
1
16
MC14585B
ALYWG
16
1
MC14585BCP
AWLYYWWG
1
1
1
MC14585B
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2
PIN ASSIGNMENT
13
14
15
16
9
10
11
125
4
3
2
1
8
7
6
(A t B)out
(A u B)out
B3
A3
VDD
B1
A0
B0
(A u B)in
(A = B)out
A2
B2
VSS
A1
(A = B)in
(A t B)in
BLOCK DIAGRAM
14
15
1
2
9
7
11
10
5
6
4
13
3
12
VDD = PIN 16
VSS = PIN 8
(A>B)in
(A=B)in
(A<B)in
A0
B0
A1
B1
A2
B2
A3
B3
(A>B)out
(A=B)out
(A<B)out
TRUTH TABLE (x = Don’t Care)
Inputs
Outputs
Comparing Cascading
A3, B3 A2, B2 A1, B1 A0, B0 A < B A = B A > B A < B A = B A > B
A3 > B3 x x x x x x 0 0 1
A3 = B3 A2 > B2 x x x x x 0 0 1
A3 = B3 A2 = B2 A1 > B1 x x x x 0 0 1
A3 = B3 A2 = B2 A1 = B1 A0 > B0 x x x 0 0 1
A3 = B3 A2 = B2 A1 = B1 A0 = B0 0 0 x 0 0 1
A3 = B3 A2 = B2 A1 = B1 A0 = B0 0 1 x 0 1 0
A3 = B3 A2 = B2 A1 = B1 A0 = B0 1 0 x 1 0 0
A3 = B3 A2 = B2 A1 = B1 A0 = B0 1 1 x 1 1 0
A3 = B3 A2 = B2 A1 = B1 A0 < B0 x x x 1 0 0
A3 = B3 A2 = B2 A1 < B1 x x x x 1 0 0
A3 = B3 A2 < B2 x x x x x 1 0 0
A3 < B3 x x x x x x 1 0 0
MC14585B
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3
ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ
ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ
ELECTRICAL CHARACTERISTICS (Voltages Referenced to VSS)
Characteristic Symbol
VDD
Vdc
– 55_C 25_C 125_C
Unit
Min Max Min
Typ
(Note 2) Max Min Max
Output Voltage “0” Level
Vin = VDD or 0
VOL 5.0
10
15
−
−
−
0.05
0.05
0.05
−
−
−
0
0
0
0.05
0.05
0.05
−
−
−
0.05
0.05
0.05
Vdc
“1” Level
Vin = 0 or VDD
VOH 5.0
10
15
4.95
9.95
14.95
−
−
−
4.95
9.95
14.95
5.0
10
15
−
−
−
4.95
9.95
14.95
−
−
−
Vdc
Input Voltage “0” Level
(VO = 4.5 or 0.5 Vdc)
(VO = 9.0 or 1.0 Vdc)
(VO = 13.5 or 1.5 Vdc)
VIL 5.0
10
15
−
−
−
1.5
3.0
4.0
−
−
−
2.25
4.50
6.75
1.5
3.0
4.0
−
−
−
1.5
3.0
4.0
Vdc
“1” Level
(VO = 0.5 or 4.5 Vdc)
(VO = 1.0 or 9.0 Vdc)
(VO = 1.5 or 13.5 Vdc)
VIH 5.0
10
15
3.5
7.0
11
−
−
−
3.5
7.0
11
2.75
5.50
8.25
−
−
−
3.5
7.0
11
−
−
−
Vdc
Output Drive Current
(VOH = 2.5 Vdc) Source
(VOH = 4.6 Vdc)
(VOH = 9.5 Vdc)
(VOH = 13.5 Vdc)
IOH 5.0
5.0
10
15
– 3.0
– 0.64
– 1.6
– 4.2
−
−
−
−
– 2.4
– 0.51
– 1.3
– 3.4
– 4.2
– 0.88
– 2.25
– 8.8
−
−
−
−
– 1.7
– 0.36
– 0.9
– 2.4
−
−
−
−
mAdc
(VOL = 0.4 Vdc) Sink
(VOL = 0.5 Vdc)
(VOL = 1.5 Vdc)
IOL 5.0
10
15
0.64
1.6
4.2
−
−
−
0.51
1.3
3.4
0.88
2.25
8.8
−
−
−
0.36
0.9
2.4
−
−
−
mAdc
Input Current Iin 15 −±0.1 −±0.00001 ±0.1 −±1.0 mAdc
Input Capacitance (Vin = 0) Cin − − − − 5.0 7.5 − − pF
Quiescent Current (Per Package) IDD 5.0
10
15
−
−
−
5.0
10
20
−
−
−
0.005
0.010
0.015
5.0
10
20
−
−
−
150
300
600
mAdc
Total Supply Current (Notes 3, 4)
(Dynamic plus Quiescent,
Per Package)
(CL = 50 pF on all outputs, all
buffers switching)
IT5.0
10
15
IT = (0.6 mA/kHz) f + IDD
IT = (1.2 mA/kHz) f + IDD
IT = (1.8 mA/kHz) f + IDD
mAdc
2. Data labelled “Typ” is not to be used for design purposes but is intended as an indication of the IC’s potential performance.
3. The formulas given are for the typical characteristics only at 25_C.
4. To calculate total supply current at loads other than 50 pF: IT(CL) = IT(50 pF) + (CL – 50) Vfk where: IT is in mA (per package), CL in pF,
V = (VDD – VSS) in volts, f in kHz is input frequency, and k = 0.001.
ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ
ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ
SWITCHING CHARACTERISTICS (Note 5) (CL = 50 pF, TA = 25_C)
Characteristic Symbol VDD Min
Typ
(Note 6) Max Unit
Output Rise and Fall Time
tTLH, tTHL = (1.5 ns/pF) CL + 25 ns
tTLH, tTHL = (0.75 ns/pF) CL + 12.5 ns
tTLH, tTHL = (0.55 ns/pF) CL + 9.5 ns
tTLH,
tTHL 5.0
10
15
−
−
−
100
50
40
200
100
80
ns
Turn−On, Turn−Off Delay Time
tPLH, tPHL = (1.7 ns/pF) CL + 345 ns
tPLH, tPHL = (0.66 ns/pF) CL + 147 ns
tPLH, tPHL = (0.5 ns/pF) CL + 105 ns
tPLH,
tPHL 5.0
10
15
−
−
−
430
180
130
860
360
260
ns
5. The formulas given are for the typical characteristics only at 25_C.
6. Data labelled “Typ” is not to be used for design purposes but is intended as an indication of the IC’s potential performance.
MC14585B
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4
Figure 1. Dynamic Power Dissipation
Signal Waveforms
Figure 2. Dynamic Signal Waveforms
20 ns
20 ns
2f
1
VDD
VSS
VDD
VSS
VOH
VOL
VOH
VOL
VOH
VOL
(A<B)out
(A=B)out
(A>B)out
B3
A3
20 ns 20 ns
VDD
VSS
VOH
VOL
90%
50%
10%
tPLH tPHL
tTLH tTHL
90%
50%
10%
B0
(A=B)out
(A<B)out
Inputs (A>B) and (A=B) high, and inputs B3, A3, B2,
A2, B1, A1, A0, and (A<B) low.
Inputs (A>B) and (A=B) high, and inputs B2, A2, B1,
A1, B0, A0 and (A<B) low.
f in respect to a system clock.
Figure 3. Cascading Comparators
B11 B10 B9 B8 B7 B6 B5 B4 B3 B2 B1 B0
A11 A10 A9 A8 A7 A6 A5 A4 A3 A2 A1 A0 VSS VDD VSS
WORD
B =
A =
WORD
MC14585B
MC14585B
MC14585B
B3 A3 B2 A2 B1 A1 B0 A0
(A<B)
(A=B)
(A>B)
INPUTS
(A<B)
(A=B)
(A>B)
OUTPUT
(A<B)
(A=B)
(A>B)
OUTPUTS
WORD B = B11, B10, ..., B0.
WORD A = A11, A10, ..., A0.
MC14585B
http://onsemi.com
5
15
14
2
1
7
9
10
11
5
6
4
(A>B)in
(A=B)in
(A<B)in
B0
A0
B1
A1
B2
A2
B3
A3
12
3
13
(A<B)out
(A=B)out
(A>B)out
LOGIC DIAGRAM
MC14585B
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6
PACKAGE DIMENSIONS
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ANSI Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
3. DIMENSION L TO CENTER OF LEADS
WHEN FORMED PARALLEL.
4. DIMENSION B DOES NOT INCLUDE
MOLD FLASH.
5. ROUNDED CORNERS OPTIONAL.
−A−
B
FC
S
H
GD
J
L
M
16 PL
SEATING
18
916
K
PLANE
−T−
M
A
M
0.25 (0.010) T
DIM MIN MAX MIN MAX
MILLIMETERSINCHES
A0.740 0.770 18.80 19.55
B0.250 0.270 6.35 6.85
C0.145 0.175 3.69 4.44
D0.015 0.021 0.39 0.53
F0.040 0.70 1.02 1.77
G0.100 BSC 2.54 BSC
H0.050 BSC 1.27 BSC
J0.008 0.015 0.21 0.38
K0.110 0.130 2.80 3.30
L0.295 0.305 7.50 7.74
M0 10 0 10
S0.020 0.040 0.51 1.01
____
PDIP−16
CASE 648−08
ISSUE T
SOEIAJ−16
CASE 966−01
ISSUE A
HE
A1
DIM MIN MAX MIN MAX
INCHES
--- 2.05 --- 0.081
MILLIMETERS
0.05 0.20 0.002 0.008
0.35 0.50 0.014 0.020
0.10 0.20 0.007 0.011
9.90 10.50 0.390 0.413
5.10 5.45 0.201 0.215
1.27 BSC 0.050 BSC
7.40 8.20 0.291 0.323
0.50 0.85 0.020 0.033
1.10 1.50 0.043 0.059
0
0.70 0.90 0.028 0.035
--- 0.78 --- 0.031
A1
HE
Q1
LE
_10 _0
_10 _
LE
Q1
_
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSIONS D AND E DO NOT INCLUDE
MOLD FLASH OR PROTRUSIONS AND ARE
MEASURED AT THE PARTING LINE. MOLD FLASH
OR PROTRUSIONS SHALL NOT EXCEED 0.15
(0.006) PER SIDE.
4. TERMINAL NUMBERS ARE SHOWN FOR
REFERENCE ONLY.
5. THE LEAD WIDTH DIMENSION (b) DOES NOT
INCLUDE DAMBAR PROTRUSION. ALLOWABLE
DAMBAR PROTRUSION SHALL BE 0.08 (0.003)
TOTAL IN EXCESS OF THE LEAD WIDTH
DIMENSION AT MAXIMUM MATERIAL CONDITION.
DAMBAR CANNOT BE LOCATED ON THE LOWER
RADIUS OR THE FOOT. MINIMUM SPACE
BETWEEN PROTRUSIONS AND ADJACENT LEAD
TO BE 0.46 ( 0.018).
M
L
DETAIL P
VIEW P
c
A
b
e
M
0.13 (0.005) 0.10 (0.004)
1
16 9
8
D
Z
E
A
b
c
D
E
e
L
M
Z
MC14585B
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7
PACKAGE DIMENSIONS
SOIC−16
CASE 751B−05
ISSUE K
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSIONS A AND B DO NOT INCLUDE MOLD
PROTRUSION.
4. MAXIMUM MOLD PROTRUSION 0.15 (0.006) PER SIDE.
5. DIMENSION D DOES NOT INCLUDE DAMBAR
PROTRUSION. ALLOWABLE DAMBAR PROTRUSION
SHALL BE 0.127 (0.005) TOTAL IN EXCESS OF THE D
DIMENSION AT MAXIMUM MATERIAL CONDITION.
18
16 9
SEATING
PLANE
F
J
M
RX 45_
G
8 PLP
−B−
−A−
M
0.25 (0.010) B S
−T−
D
K
C
16 PL
S
B
M
0.25 (0.010) A S
T
DIM MIN MAX MIN MAX
INCHESMILLIMETERS
A9.80 10.00 0.386 0.393
B3.80 4.00 0.150 0.157
C1.35 1.75 0.054 0.068
D0.35 0.49 0.014 0.019
F0.40 1.25 0.016 0.049
G1.27 BSC 0.050 BSC
J0.19 0.25 0.008 0.009
K0.10 0.25 0.004 0.009
M0 7 0 7
P5.80 6.20 0.229 0.244
R0.25 0.50 0.010 0.019
____
6.40
16X
0.58
16X 1.12
1.27
DIMENSIONS: MILLIMETERS
1
PITCH
SOLDERING FOOTPRINT
16
89
8X
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to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability
arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages.
“Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All
operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights
nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications
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MC14585B/D
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