JAN and JANTX 1N3611 thru 1N3614 and 1N3957
Vishay Semiconductors
Document Number 88651 www.vishay.com
5-Mar-02 1
Patented*
Glass Passivated Rectifiers Rever se V oltage 200 to 1000V
Forward Current 1.0A
formerly
®
Maximum Ratings & Thermal Characteristics Ratings at 25°C ambient temperature unless otherwise specified.
Parameter Symbol Prefix J = JAN Quality Level; Prefix JX = JANTX Quality Level Unit
J,JX 1N3611 J,JX 1N3612 J,JX 1N3613 J,JX 1N3614 J,JX 1N3957
Maximum repetitive peak reverse voltage VRRM 200 400 600 800 1000 V
Maximum RMS voltage VRMS 140 280 420 560 700 V
Maximum DC blocking voltage VDC 200 400 600 800 1000 V
Maximum average forward rectified current
0.375(9.5mm) lead length at TA = 55°CIF(AV) 1.0 A
Peak forward surge current 10 surges of 8.3ms each at
1 min. inter vals super-imposed on IO= 750mA DC; IFSM 30 A
VR= rated VRRM TA= 100°C (per MIL-STD-750 m 4066)
Typical thermal resistance(1) RθJL 38 °C/W
RθJA 45
Operating junction and storage temperature range TJ,T
STG 65 to +175 °C
Barometric Pressure Hg 8 54 87 mm
Electrical Characteristics Ratings at 25°C ambient temperature unless otherwise specified.
Minimum reverse breakdown voltage at 50µAV
BR 220 440 660 880 1100 V
Maximum instantaneous at 1.0A, TA= 25°C 1.1
forward voltage Tp = 300µs at 3.0A, TA= 25°CV
F1.3 V
at 1.0A, TA= 65°C 1.5
Maximum DC reverse current TA = 25°CIR1µA
at rated DC blocking voltage TA = 150°C 300
Typical reverse recovery time at
IF = 0.5A, IR = 1.0A, Irr = 0.25A trr 2.0 µs
Typical junction capacitance at 4V, 1MHz CJ8.0 pF
Notes: (1) Thermal resistance from junction to ambient at 0.375(9.5mm) lead length, P.C.B. mounted
Features
Qualified to MIL-PRF-19500/228
Class 1 high temperature metallurgically bonded con-
struction brazed > 600°C
1.0 ampere operation at TA = 55°C with no thermal r unaway
Typical IRless than 0.1µA
Cavity-free, glass passivated junction. In epoxy over her-
metic glass
High temperature soldering guaranteed: 350°C/10 seconds,
0.375 (9.5mm) lead length, 5 lbs. (2.3kg) tension
Mechanical Data
Case: DO-204AL, molded epoxy over glass body (EG1)
Terminals: Solder plated axial leads, solderable per
MIL-STD-750, Method 2026
Polarity: Color band denotes cathode end
Mounting Position: Any Weight: 0.015oz., 0.4g
Flammability: Epoxy is rated UL 94V-0.
0.107 (2.7)
0.080 (2.0)
0.034 (0.86)
0.028 (0.71)
DIA.
1.0 (25.4)
MIN.
1.0 (25.4)
MIN.
0.205 (5.2)
0.160 (4.1)
DIA.
* Glass-plastic encapsulation technique is covered by Patent No. 3,996,602
and brazed-lead assembly by Patent No. 3,930,306
DO-204AL (EG1)
Dimensions
in inches and
(millimeters)
M
I
L
I
T
A
R
Y
Q
U
A
L
I
F
I
E
D
JAN and JANTX 1N3611 thru 1N3614 and 1N3957
Vishay Semiconductors
formerly
www.vishay.com Document Number 88651
25-Mar-02
Ratings and
Characteristic Curves(TA= 25°C unless otherwise noted)
25 50 75 100 125 150 175
0
0.25
0.5
0.75
1.0
0.4 0.6 0.8 1.0 1.2 1.4 1.6
0.01
0.1
10
1
020 40 60 80 100
0.01
0.1
1
10
Fig. 1 – Forward Current Derating Curve Fig. 2 – Typical Instantaneous
Forward Characteristics
Fig. 3 – Typical Reverse Characteristics
Fig. 5 – Typical Transient
Thermal Impedance
Fig. 4 – Typical Junction Capacitance
Average Forward Rectified Current (A)
Ambient Temperature (°C)
Instantaneous Forward Current (A)
Instantaneous Forward Voltage (V)
Junction Capacitance (pF)
Reverse Voltage (V)
Instantaneous Reverse Current (µA)
Transient Thermal Impedance (°C/W)
Rated Peak Reverse Voltage (%)
t, Pulse Duration, sec
100
10
20
10.1 110
0.01 0.1 110 100
0.1
1
10
100
TJ = 125°C
TJ = 150°C
TJ = 75°C
TJ = 25°C
60 Hz Resistive
or Inductive Load
0.375" (9.5mm)
Lead length
TJ = 25°C
Pulse Width = 300µs
1% Duty Cycle
TJ = 25°C
f = 1.0 MHz
Vsig = 50mVp-p