ES52C1A25N-12.288M TR RoHS Pb ES52C1 A 25 N -12.288M TR Series RoHS Compliant (Pb-free) 5mm x 7mm Ceramic SMD 3.3Vdc Clipped Sinewave TC(VC)XO Operating Temperature Range 0C to +50C Frequency Stability 2.5ppm Maximum Packaging Options Tape & Reel Nominal Frequency 12.288MHz Control Voltage None (No Connect on Pin 1) ELECTRICAL SPECIFICATIONS Nominal Frequency 12.288MHz Frequency Stability vs. Frequency Tolerance 1.0ppm Maximum (Measured at 25C 2C, Vdd=3.3Vdc, Vc=1.5Vdc) Frequency Stability 2.5ppm Maximum Frequency Stability vs. Input Voltage 0.2ppm Maximum (Vdd 5%) Frequency Stability vs. Aging 1ppm/Year Maximum (at 25C) Frequency Stability vs. Load 0.2ppm Maximum (1kOhm//1pF) Operating Temperature Range 0C to +50C Supply Voltage 3.3Vdc 5% Input Current 1.5mA Maximum Output Voltage 0.8Vp-p Clipped Sinewave Minimum Load Drive Capability 10kOhms//10pF Output Logic Type Clipped Sinewave Control Voltage None (No Connect on Pin 1) Phase Noise -80dBc/Hz at 10Hz offset, -115dBc/Hz at 100Hz offset, -135dBc/Hz at 1kHz offset, -145dBc/Hz at 10kHz offset, -145dBc/Hz at 100kHz offset (Typical Values, at 12.800MHz) Start Up Time 5mSec Maximum Storage Temperature Range -55C to +125C ENVIRONMENTAL & MECHANICAL SPECIFICATIONS Fine Leak Test MIL-STD-883, Method 1014 Condition A Gross Leak Test MIL-STD-883, Method 1014 Condition C Mechanical Shock MIL-STD-202, Method 213 Condition C Resistance to Soldering Heat MIL-STD-202, Method 210 Resistance to Solvents MIL-STD-202, Method 215 Solderability MIL-STD-883, Method 2003 Temperature Cycling MIL-STD-883, Method 1010 Vibration MIL-STD-883, Method 2007 Condition A www.ecliptek.com | Specification Subject to Change Without Notice | Rev J 2/20/2010 | Page 1 of 5 ES52C1A25N-12.288M TR MECHANICAL DIMENSIONS (all dimensions in millimeters) 5.0 0.2 MARKING ORIENTATION 7.0 0.2 2.0 MAX 0.8 0.1 (x4) 5 0.3 0.1 (x10) 1 2.0 0.1 (x4) 1.4 0.1 (x4) 6 10 2.7 0.1 (x4) PIN CONNECTION 1 No Connect 2 Do Not Connect 3 Do Not Connect 4 Do Not Connect 5 Case/Ground 6 Output 7 Do Not Connect 8 Do Not Connect 9 Do Not Connect 10 Supply Voltage LINE MARKING 1 E12.288 E=Ecliptek 2 XXYZZ XX=Ecliptek Manufacturing Code Y=Last Digit of the Year ZZ=Week of the Year Suggested Solder Pad Layout All Dimensions in Millimeters 1.2 (X4) 1.8 (X4) Solder Land (X4) 3.9 3.0 All Tolerances are 0.1 www.ecliptek.com | Specification Subject to Change Without Notice | Rev J 2/20/2010 | Page 2 of 5 ES52C1A25N-12.288M TR CLOCK OUTPUT OUTPUT WAVEFORM VP-P 0VDC Test Circuit for No Connect Option Oscilloscope Current Meter Power Supply Voltage Meter 0.01F (Note 1) Supply Voltage (VDD) 0.1F (Note 1) No Connect Frequency Counter Probe (Note 2) Output Ground RL = 10kOhms CL = 10pF (Note 3) Note 1: An external 0.1F low frequency tantalum bypass capacitor in parallel with a 0.01F high frequency ceramic bypass capacitor close to the package ground and VDD pin is required. Note 2: A low capacitance (<12pF), 10X attenuation factor, high impedance (>10Mohms), and high bandwidth (>300MHz) passive probe is recommended. Note 3: Capacitance value CL includes sum of all probe and fixture capacitance. www.ecliptek.com | Specification Subject to Change Without Notice | Rev J 2/20/2010 | Page 3 of 5 ES52C1A25N-12.288M TR Tape & Reel Dimensions Quantity Per Reel: 1,000 units 4.0 0.1 2.0 0.1 DIA 1.5 +1.0/-0 0.30 0.05 7.5 0.1 16.0 +0.3/-0.1 A0* 6.75 0.10 8.0 0.1 B0* K0* *Compliant to EIA 481A 1.5 MIN 22.4 MAX DIA 40 MIN Access Hole at Slot Location 360 MAX DIA 50 MIN DIA 20.2 MIN DIA 13.0 0.2 2.5 MIN Width 10.0 MIN Depth Tape slot in Core for Tape Start 16.4 +2.0/-0 www.ecliptek.com | Specification Subject to Change Without Notice | Rev J 2/20/2010 | Page 4 of 5 ES52C1A25N-12.288M TR Recommended Solder Reflow Methods Critical Zone TL to T P Temperature (T) TP Ramp-up Ramp-down TL TS Max TS Min tL t S Preheat t 25C to Peak tP Time (t) Low Temperature Infrared/Convection 220C TS MAX to TL (Ramp-up Rate) Preheat - Temperature Minimum (TS MIN) - Temperature Typical (TS TYP) - Temperature Maximum (TS MAX) - Time (tS MIN) Ramp-up Rate (TL to TP) Time Maintained Above: - Temperature (TL) - Time (tL) Peak Temperature (TP) Target Peak Temperature (TP Target) Time within 5C of actual peak (tp) Ramp-down Rate Time 25C to Peak Temperature (t) Moisture Sensitivity Level 5C/second Maximum N/A 150C N/A 60 - 120 Seconds 5C/second Maximum 150C 200 Seconds Maximum 220C Maximum 220C Maximum 1 Time / 215C Maximum 1 Time 15 seconds Maximum 1 Time / 80 seconds Maximum 1 Time 5C/second Maximum N/A Level 1 Low Temperature Manual Soldering 185C Maximum for 10 seconds Maximum, 2 times Maximum. High Temperature Manual Soldering 260C Maximum for 5 seconds Maximum, 2 times Maximum. www.ecliptek.com | Specification Subject to Change Without Notice | Rev J 2/20/2010 | Page 5 of 5