W942516CH
4M × 4 BANKS × 16 BIT DDR SDRAM
Publication Release Date: May 20, 2003
- 1 - Revision A2
Table of Contents-
1. GENERAL DESCRIPTION ......................................................................................................... 3
2. FEATURES ................................................................................................................................. 3
3. KEY PARAMETERS ................................................................................................................... 4
4. PIN CONFIGURATION ...............................................................................................................5
5. PIN DESCRIPTION..................................................................................................................... 6
6. BLOCK DIAGRAM ...................................................................................................................... 7
7. ELECRICAL CHARACTERISTICS ............................................................................................. 8
7.1 Absolute Maximum Ratings ................................................................................................. 8
7.2 Recommended DC Operating Conditions............................................................................ 8
7.3 Capacitance ......................................................................................................................... 9
7.4 Leakage and Output Buffer Characteristics ......................................................................... 9
7.5 DC Characteristics ............................................................................................................. 10
7.6 AC Characteristics and Operating Condition ..................................................................... 11
7.7 AC Test Conditions ............................................................................................................ 13
8. OPERATION MODE ................................................................................................................. 15
8.1 Simplified Truth Table ........................................................................................................ 15
8.2 Function Truth Table .......................................................................................................... 16
8.3 Function Truth Table for CKE ............................................................................................ 19
8.4 Simplified Stated Diagram.................................................................................................. 20
9. FUNCTIONAL DESCRIPTION.................................................................................................. 21
9.1 Power Up Sequence .......................................................................................................... 21
9.2 Command Function............................................................................................................ 21
9.3 Read Operation..................................................................................................................24
9.4 Write Operation .................................................................................................................. 24
9.5 Precharge........................................................................................................................... 24
9.6 Burst Termination...............................................................................................................25
9.7 Refresh Operation.............................................................................................................. 25
9.8 Power Down Mode............................................................................................................. 25
9.9 Mode Register Operation ................................................................................................... 25
10. TIMING WAVEFORMS ............................................................................................................. 29
10.1 Command Input Timing...................................................................................................... 29
10.2 Timing of the CLK Signals.................................................................................................. 29
W942516CH
- 2 -
10.3 Read Timing (Burst Length = 4)......................................................................................... 30
10.4 Write Timing (Burst Length = 4) ......................................................................................... 31
10.5 DM, Data Mask (W942508CH /W942504CH).................................................................... 32
10.6 DM, Data Mask (W942516CH) .......................................................................................... 32
10.7 Mode Register Set (MRS) Timing ...................................................................................... 33
10.8 Extend Mode Register Set (EMRS) Timing........................................................................ 34
10.9 Auto Precharge Timing (Read Cycle, CL = 2).................................................................... 35
10.10 Auto Precharge Timing (Write Cycle)................................................................................. 37
10.11 Read Interrupted by Read (CL = 2, BL = 2, 4, 8) ............................................................... 38
10.12 Burst Read Stop (BL = 8)................................................................................................... 38
10.13 Read Interrupted by Write & BST (BL = 8)......................................................................... 39
10.14 Read Interrupted by Precharge (BL = 8)............................................................................ 39
10.15 Write Interrupted by Write (BL = 2, 4, 8) ............................................................................ 40
10.16 Write Interrupted by Read (CL = 2, BL = 8) ....................................................................... 40
10.17 Write Interrupted by Read (CL = 2.5, BL = 4) .................................................................... 41
10.18 Write Interrupted by Precharge (BL = 8) ............................................................................ 41
10.19 2 Bank Interleave Read Operation (CL = 2, BL = 2) .......................................................... 42
10.20 2 Bank Interleave Read Operation (CL = 2, BL = 4) .......................................................... 42
10.21 4 Bank Interleave Read Operation (CL = 2, BL = 2) .......................................................... 43
10.22 4 Bank Interleave Read Operation (CL = 2, BL = 4) .......................................................... 43
10.23 Auto Refresh Cycle ............................................................................................................ 44
10.24 Active Power Down Mode Entry and Exit Timing............................................................... 44
10.25 Precharged Power Down Mode Entry and Exit Timing ...................................................... 44
10.26 Self Refresh Entry and Exit Timing .................................................................................... 45
11. PACKAGE DIMENSION ........................................................................................................... 46
12. REVISION HISTORY ................................................................................................................47
W942516CH
Publication Release Date: May 20, 2003
- 3 - Revision A2
1. GENERAL DESCRIPTION
W942516CH is a CMOS Double Data Rate synchronous dynamic random access memory (DDR
SDRAM), organized as 4,194,304 words × 4 banks × 16 bits. Using pipelined architecture and 0.13 µm
process technology, W942516CH delivers a data bandwidth of up to 400M words per second (-5). To
fully comply with the personal computer industrial standard, W942516CH is sorted into four speed
grades: -5, -6, -7, -75 The -5 is compliant to the 200 MHz/CL2.5 & CL3 specification, The -6 is
compliant to the 166 MHz/CL2.5 specification, the -7 is compliant to the 143 MHz/CL2.5 or
DDR266/CL2 specification, the -75 is compliant to the DDR266/CL2.5 specification.
All Inputs reference to the positive edge of CLK (except for DQ, DM, and CKE). The timing reference
point for the differential clock is when the CLK and CLK signals cross during a transition. And Write
and Read data are synschronized with the both edges of DQS (Data Strobe).
By having a programmable Mode Register, the system can change burst length, latency cycle,
interleave or sequential burst to maximize its performance. W942516CH is ideal for main memory in
high performance applications.
2. FEATURES
• 2.5V ±0.2V Power Supply for DDR266
• 2.5V ±0.2V Power Supply for DDR333
• 2.6V ±0.1V Power Supply for DDR400
• Up to 200 MHz Clock Frequency
• Double Data Rate architecture; two data transfers per clock cycle
• Differential clock inputs (CLK and CLK )
• DQS is edge-aligned with data for Read; center-aligned with data for Write
• CAS Latency: 2, 2.5 and 3
• Burst Length: 2, 4 and 8
• Auto Refresh and Self Refresh
• Precharged Power Down and Active Power Down
• Write Data Mask
• Write Latency = 1
• 8K Refresh Cycles / 64 mS
• Interface: SSTL-2
• Packaged in TSOP II 66-pin, 400 x 875 mil, 0.65 mm pin pitch
W942516CH
- 4 -
3. KEY PARAMETERS
SYMBOL DESCRIPTION MIN./MAX. -7 -75
tCK Clock Cycle Time CL = 2 Min. 7.5 nS 8 nS
CL = 2.5 Min. 7 nS 7.5 nS
tRAS Active to Precharge Command Period Min. 45 nS 45 nS
tRC Active to Ref/Active Command Period Min. 65 nS 65 nS
IDD1 Operation Current (Single bank) Max. 120 mA 120 mA
IDD4 Burst Operation Current Max. 165 mA 155 mA
IDD6 Self-Refresh Current Max. 3 mA 3 mA
SYMBOL DESCRIPTION MIN./MAX. -5 -6
CL = 2.5 Min. 5 nS 6 nS
tCK Clock Cycle Time CL = 3 Min. 5 nS 6 nS
tRAS Active to Precharge Command Period Min. 40 nS 42 nS
tRC Active to Ref/Active Command Period Min. 55 nS 60 nS
IDD1 Operation Current (Single bank) Max. 120 mA 120 mA
IDD4 Burst Operation Current Max. 165 mA 165 mA
IDD6 Self-Refresh Current Max. 3 mA 3 mA
W942516CH
Publication Release Date: May 20, 2003
- 5 - Revision A2
4. PIN CONFIGURATION
V
SS
DQ15
V
SS
Q
DQ14
DQ13
V
DD
Q
DQ12
DQ11
V
SS
Q
DQ10
DQ9
V
DD
Q
DQ8
V
SS
NC1
UDQS
CLK
CKE
A11
A9
A8
A7
A6
A5
A4
V
SS
66
65
64
63
62
61
60
59
58
57
56
55
54
53
52
51
50
49
48
47
46
45
44
43
42
41
40
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
25
26
27
V
DD
DQ0
V
DD
Q
DQ1
DQ2
V
SS
Q
DQ3
DQ4
V
DD
Q
DQ5
DQ6
V
SS
Q
DQ7
NC1
V
DD
Q
BS0
BS1
A10/AP
A0
A1
A2
A3
CS
RAS
CAS
WE
28
29
30
31
32
33
39
38
37
36
35
34V
DD
LDM
NC1
LDQS
NC1
V
DD
NC1
V
SS
Q
NC1
A12
NC1
CLK
UDM
V
REF
W942516CH
- 6 -
5. PIN DESCRIPTION
PIN NUMBER PIN NAME FUNCTION DESCRIPTION
28 − 32,
35 − 42 A0 − A12 Address
Multiplexed pins for row and column address.
Row address: A0 − A12.
Column address: A0 − A8. (A10 is used for Auto Precharge)
26, 27 BS0, BS1 Bank Select Select bank to activate during row address latch time, or
bank to read/write during column address latch time.
2, 4, 5, 7, 8, 10,
11, 13, 54, 56, 57,
59, 60, 62, 63, 65
DQ0 −
DQ15 Data Input/ Output The DQ0 – DQ7 input and output data are synchronized with
both edges of DQS.
16,51 LDQS,
UDQS Data Strobe
DQS is Bi-directional signal. DQS is input signal during write
operation and output signal during read operation. It is Edge-
aligned with read data, Center-aligned with write data.
24 CS Chip Select
Disable or enable the command decoder. When command
decoder is disabled, new command is ignored and previous
operation continues.
23, 22, 21 RAS ,
CAS , WE Command Inputs Command inputs (along with CS ) define the command
being entered.
20, 47 LDM, UDM Write Mask When DM is asserted “high” in burst write, the input data is
masked. DM is synchronized with both edges of DQS.
45, 46 CLK,
CLK
Differential Clock
Inputs
All address and control input signals are sampled on the
crossing of the positive edge of CLK and negative edge of
CLK .
44 CKE Clock Enable
CKE controls the clock activation and deactivation. When
CKE is low, Power Down mode, Suspend mode, or Self
Refresh mode is entered.
49 VREF Reference Voltage VREF is reference voltage for inputs.
1, 18, 33 VDD Power (+2.5V) Power for logic circuit inside DDR SDRAM.
34, 48, 66 VSS Ground Ground for logic circuit inside DDR SDRAM.
3, 9, 15, 55, 61 VDDQ Power (+2.5V) for
I/O Buffer
Separated power from VDD, used for output buffer, to
improve noise.
6, 12, 52, 58, 64 VSSQ Ground for I/O
Buffer
Separated ground from VSS, used for output buffer, to
improve noise.
14, 17, 19, 25,
43, 50, 53 NC1 No Connection No connection
W942516CH
Publication Release Date: May 20, 2003
- 7 - Revision A2
6. BLOCK DIAGRAM
CKE
A10
DLL
CLOCK
BUFFER
COMMAND
DECODER
ADDRESS
BUFFER
REFRESH
COUNTER
COLUMN
COUNTER
CONTROL
SIGNAL
GENERATOR
MODE
REGISTER
COLUMN DECODER
SENSE AMPLIFIER
CELL ARRAY
BANK #2
COLUMN DECODER
SENSE AMPLIFIER
CELL ARRAY
BANK #0
COLUMN DECODER
SENSE AMPLIFIER
CELL ARRAY
BANK #3
DATA CONTROL
CIRCUIT
DQ
BUFFER
COLUMN DECODER
SENSE AMPLIFIER
CELL ARRAY
BANK #1
NOTE:
The cell array configuration is 8912 * 512 * 16
ROW DECODER ROW DECODER
ROW DECODERROW DECODER
A0
A9
A11
A12
BA0
BA1
CS
RAS
CAS
WE
CLK
CLK
DQ0
DQ15
PREFETCH REGISTER
LDM
UDM
UDQS
LDQS
W942516CH
- 8 -
7. ELECRICAL CHARACTERISTICS
7.1 Absolute Maximum Ratings
PARAMETER SYMBOL RATING UNIT
Input/Output Voltage VIN, VOUT -0.3 − VDDQ +0.3 V
Power Supply Voltage VDD, VDDQ -0.3 − 3.6 V
Operating Temperature TOPR 0 − 70 °C
Storage Temperature TSTG -55 − 150 °C
Soldering Temperature (10s) TSOLDER 260 °C
Power Dissipation PD 1 W
Short Circuit Output Current IOUT 50 mA
Note: Exposure to conditions beyond those listed under Absolute Maximum Ratings may adversely affect the life and reliability
of the device.
7.2 Recommended DC Operating Conditions
(TA = 0 to 70°C)
SYMBOL PARAMETER MIN. TYP. MAX. UNIT NOTES
VDD Power Supply Voltage 2.3 2.5 2.7 V 2
VDDQ Power Supply Voltage (for I/O
Buffer) 2.3 2.5 VDD V 2
VREF Input reference Voltage 0.49 x VDDQ 0.50 x VDDQ 0.51 x VDDQ V 2, 3
VTT Termination Voltage (System) VREF - 0.04 VREF VREF + 0.04 V 2, 8
VIH (DC) Input High Voltage (DC) VREF + 0.15 - VDDQ + 0.3 V 2
VIL (DC) Input Low Voltage (DC) -0.3 - VREF - 0.15 V 2
VICK (DC) Differential Clock DC Input Voltage -0.3 - VDDQ + 0.3 V 15
VID (DC)
Input Differential Voltage.
CLK and CLK inputs (DC) 0.36 - VDDQ + 0.6 V 13, 15
VIH (AC) Input High Voltage (AC) VREF + 0.31 - - V 2
VIL (AC) Input Low Voltage (AC) - - VREF - 0.31 V 2
VID (AC)
Input Differential Voltage.
CLK and CLK inputs (AC) 0.7 - VDDQ + 0.6 V 13, 15
VX (AC) Differential AC input Cross Point
Voltage VDDQ/2 - 0.2 - VDDQ/2 + 0.2 V 12, 15
VISO (AC) Differential Clock AC Middle Point VDDQ/2 - 0.2 - VDDQ/2 + 0.2 V 14, 15
Notes: Undershoot Limit: VIL (min) = -0.9V with a pulse width < 5 nS
Overshoot Limit: VIH (max) = VDDQ +0.9V with a pulse width < 5 nS
VIH (DC) and VIL (DC) are levels to maintain the current logic state.
VIH (AC) and VIL (AC) are levels to change to the new logic state.
W942516CH
Publication Release Date: May 20, 2003
- 9 - Revision A2
7.3 Capacitance
(VDD = VDDQ = 2.5V ±0.2V, f = 1 MHz, TA = 25 °C, VOUT (DC) = VDDQ/2, VOUT (Peak to Peak) = 0.2V)
SYMBOL PARAMETER MIN. MAX.
DELTA
(MAX.) UNIT
CIN Input Capacitance (except for CLK pins) 2.0 3.0 0.5 pF
CCLK Input Capacitance (CLK pins) 2.0 3.0 0.25 pF
CI/O DQ, DQS, DM Capacitance 4.0 5.0 0.5 pF
CNC1 NC1 Pin Capacitance - 1.5 - pF
CNC2 NC2 Pin Capacitance 4.0 5.0 - pF
Notes: These parameters are periodically sampled and not 100% tested.
The NC2 pins have additional capacitance for adjustment of the adjacent pin capacitance.
The NC2 pins have Power and Ground clamp.
7.4 Leakage and Output Buffer Characteristics
SYMBOL PARAMETER MIN. MAX. UNITS NOTES
II (L) Input Leakage Current
(0V < VIN < VDDQ, All other pins not under test = 0V) -2 2
µA
IO (L) Output Leakage Current
(Output disabled, 0V < VOUT < VDDQ) -5 5
µA
VOH Output High Voltage
(under AC test load condition) VTT +0.76 - V
VOL Output Low Voltage
(under AC test load condition) - VTT -0.76 V
IOH (DC) Output Minimum Source DC Current -15.2 - mA 4, 6
IOL (DC) Output Minimum Sink DC Current
Full
Strength
15.2 - mA 4, 6
IOH (DC) Output Minimum Source DC Current -10.4 - mA 5
IOL (DC) Output Minimum Sink DC Current
Half
Strength 10.4 - mA 5
W942516CH
- 10 -
7.5 DC Characteristics
MAX.
SYM. PARAMETER -5 -6 -7 -75 UNIT NOTES
IDD0
OPERATING CURRENT: One Bank Active-Precharge; tRC =
tRC min; tCK = tCK min; DQ, DM and DQS inputs changing twice
per clock cycle; Address and control inputs changing once per
clock cycle
110 110 110 110 7
IDD1
OPERATING CURRENT: One Bank Active-Read-Precharge;
Burst = 2; tRC = tRC min; CL = 2.5; tCK = tCK min; IOUT = 0 mA;
Address and control inputs changing once per clock cycle.
120 120 120 120 7, 9
IDD2P
PRECHARGE-POWER-DOWN STANDBY CURRENT: All
Banks Idle; Power down mode; CKE < VIL max; tCK = tCK min;
Vin = VREF for DQ, DQS and DM
2 2 2 2
IDD2F
IDLE FLOATING STANDBY CURRENT: CS > VIH min; All
Banks Idle; CKE > VIH min; Address and other control inputs
changing once per clock cycle; Vin = Vref for DQ, DQS and DM
45 45 45 40 7
IDD2N
IDLE STANDBY CURRENT: CS > VIH min; All Banks Idle;
CKE > VIH min; tCK = tCK min; Address and other control inputs
changing once per clock cycle; Vin > VIH min or Vin < VIL max
for DQ, DQS and DM
45 45 45 40 7
IDD2Q
IDLE QUIET STANDBY CURRENT: CS > VIH min; All Banks
Idle; CKE > VIH min; tCK = tCK min; Address and other control
inputs stable; Vin > VREF for DQ, DQS and DM
40 40 40 35 mA 7
IDD3P ACTIVE POWER-DOWN STANDBY CURRENT: One Bank
Active; Power down mode; CKE < VIL max; tCK = tCK min 20 20 20 20
IDD3N
ACTIVE STANDBY CURRENT: CS > VIH min; CKE > VIH
min; One Bank Active-Precharge; tRC = tRAS max; tCK = tCK min;
DQ, DM and DQS inputs changing twice per clock cycle;
Address and other control inputs changing once per clock cycle
70 70 70 65 7
IDD4R
OPERATING CURRENT: Burst = 2; Reads; Continuous burst;
One Bank Active; Address and control inputs changing once
per clock cycle; CL=2.5; tCK = tCK min; IOUT = 0mA
165 165 165 155 7, 9
IDD4
W
OPERATING CURRENT: Burst = 2; Write; Continuous burst;
One Bank Active; Address and control inputs changing once
per clock cycle; CL = 2.5; tCK = tCK min; DQ, DM and DQS
inputs changing twice per clock cycle
165 165 165 155 7
IDD5 AUTO REFRESH CURRENT: tRC = tRFC min 190 190 190 190 7
IDD6 SELF REFRESH CURRENT: CKE < 0.2V 3 3 3 3
IDD7
RANDOM READ CURRENT: 4 Banks Active Read with
activate every 20ns, Auto-Precharge Read every 20 nS; Burst
= 4; tRCD = 3; IOUT = 0mA; DQ, DM and DQS inputs changing
twice per clock cycle; Address changing once per clock cycle
270 270 270 270
CK
CK
DQS
RANDOM READ CURRENT Timing
t
RCD
t
RC
t
CK = 10ns
(
I
DD7)
Bank 0
Row d
Bank 3
Row c
Bank 1
Row e
Bank 1
Row e
ADDRESS Bank 0
Row d
Bank 2
Row f
Bank 3
Row q
Bank 2
Col f
READ
AP ACT READ
AP
COMMAND READ
AP ACT ACT READ
AP ACT
DQ Qa Qb Qb Qb Qb Qc Qc Qc Qc Qd Qd Qd Qd Qe QeQa
Bank 0
Row h
ACT
Bank 0
Col d
READ
AP ACTACTACT ACT
Bank 1
Col e
Bank 2
Row f
Bank 3
Row q
Bank 2
Col f
Bank 0
Row h
READ
AP
Bank 1
Row e
Bank 3
Col c
Bank 0
Row d
W942516CH
Publication Release Date: May 20, 2003
- 11 - Revision A2
7.6 AC Characteristics and Operating Condition
(Notes: 10, 12)
-7 -75
SYMBOL PARAMETER MIN. MAX. MIN. MAX.
UNITS NOTES
tRC Active to Ref/Active Command Period 65 65
tRFC Ref to Ref/Active Command Period 75 75
tRAS Active to Precharge Command Period 45 100000 45 100000
tRCD Active to Read/Write Command Delay Time 20 20
tRAP Active to Read with Auto Precharge Enable 15 15
nS
tCCD Read/Write(a) to Read/Write(b) Command Period 1 1 tCK
tRP Precharge to Active Command Period 20 20
tRRD Active(a) to Active(b) Command Period 15 15
tWR Write Recovery Time 15 15
tDAL Auto Precharge Write Recovery + Precharge Time 30 30
CL = 2 7.5 15 8 15
tCK CLK Cycle Time CL = 2.5 7 15 7.5 15
tAC Data Access Time from CLK, CLK -0.75 0.75 -0.75 0.75
tDQSCK DQS Output Access Time from CLK, CLK -0.75 0.75 -0.75 0.75
16
tDQSQ Data Strobe Edge to Output Data Edge Skew 0.5 0.5
nS
tCH CLk High Level Width 0.45 0.55 0.45 0.55
tCL CLK Low Level Width 0.45 0.55 0.45 0.55 tCK 11
tHP CLK Half Period (minimum of actual tCH, tCL) Min.
(tCL,tCH) Min.
(tCL,tCH)
tQH DQ Output Data Hold Time from DQS THP
-0.75 THP
-0.75
nS
tRPRE DQS Read Preamble Time 0.9 1.1 0.9 1.1
tRPST DQS Read Postamble Time 0.4 0.6 0.4 0.6 tCK 11
tDS DQ and DM Setup Time 0.5 0.5
tDH DQ and DM Hold Time 0.5 0.5
tDIPW DQ and DM Input Pulse Width (for each input) 1.75 1.75
nS
tDQSH DQS Input High Pulse Width 0.35 0.35
tDQSL DQS Input Low Pulse Width 0.35 0.35
tDSS DQS Falling Edge to CLK Setup Time 0.2 0.2
tDSH DQS Falling Edge Hold Time from CLK 0.2 0.2
tCK 11
tWPRES Clock to DQS Write Preamble Set-up Time 0 0 nS
tWPRE DQS Write Preamble Time 0.25 0.25
tWPST DQS Write Postamble Time 0.4 0.4
tDQSS Write Command to First DQS Latching Transition 0.75 1.25 0.75 1.25
11
tDSSK UDQS – LDQS Skew (x 16) -0.25 0.25 -0.25 0.25
tCK
tIS Input Setup Time 0.9 0.9
tIH Input Hold Time 0.9 0.9
tIPW Control & Address Input Pulse Width (for each input) 2.2 2.2
tHZ Data-out High-impedance Time from CLK, CLK -0.75 0.75 -0.75 0.75
tLZ Data-out Low-impedance Time from CLK, CLK -0.75 0.75 -0.75 0.75
tT(SS) SSTL Input Transition 0.5 1.5 0.5 1.5
nS
tWTR Internal Write to Read Command Delay 1 1 tCK
tXSNR Exit Self Refresh to non-Read Command 75 75 ns
tXSRD Exit Self Refresh to Read Command 10 10 tCK
tREF Refresh Time (8k) 64 64 mS
tMRD Mode Register Set Cycle Time 15 15 nS
W942516CH
- 12 -
-5 -6
SYM. PARAMETER MIN. MAX. MIN. MAX.
UNITS NOTES
tRC Active to Ref/Active Command Period 55 60
tRFC Ref to Ref/Active Command Period 70 72
tRAS Active to Precharge Command Period 40 70000 42 100000
tRCD Active to Read/Write Command Delay Time 15 18
tRAP Active to Read with Auto Precharge Enable 15 15
nS
tCCD Read/Write(a) to Read/Write(b) Command Period 1 1 tCK
tRP Precharge to Active Command Period 15 18
tRRD Active(a) to Active(b) Command Period 10 12
tWR Write Recovery Time 15 15
tDAL Auto Precharge Write Recovery + Precharge Time 30 30
2.5 5 10 6 12
tCK CLK Cycle Time 3 5 10 6 12
tAC Data Access Time from CLK, CLK -0.7 0.7 -0.7 0.7
tDQSCK DQS Output Access Time from CLK, CLK -0.55 0.55 -0.6 0.6
16
tDQSQ Data Strobe Edge to Output Data Edge Skew 0.4 0.45
nS
tCH CLk High Level Width 0.45 0.55 0.45 0.55
tCL CLK Low Level Width 0.45 0.55 0.45 0.55 tCK 11
tHP CLK Half Period (minimum of actual tCH, tCL) Min.
(tCL,tCH) Min.
(tCL,tCH)
tQH DQ Output Data Hold Time from DQS tHP
-0.5 tHP
-0.55
nS
tRPRE DQS Read Preamble Time 0.9 1.1 0.9 1.1
tRPST DQS Read Postamble Time 0.4 0.6 0.4 0.6 tCK 11
tDS DQ and DM Setup Time 0.4 0.45
tDH DQ and DM Hold Time 0.4 0.45
tDIPW DQ and DM Input Pulse Width (for each input) 1.75 1.75
nS
tDQSH DQS Input High Pulse Width 0.35 0.35
tDQSL DQS Input Low Pulse Width 0.35 0.35
tDSS DQS Falling Edge to CLK Setup Time 0.2 0.2
tDSH DQS Falling Edge Hold Time from CLK 0.2 0.2
tCK 11
tWPRES Clock to DQS Write Preamble Set-up Time 0 0 nS
tWPRE DQS Write Preamble Time 0.25 0.25
tWPST DQS Write Postamble Time 0.4 0.6 0.4 0.6
tDQSS Write Command to First DQS Latching Transition 0.72 1.28 0.75 1.25
11
tDSSK UDQS – LDQS Skew (x 16) -0.25 0.25 -0.25 0.25
tCK
tIS Input Setup Time 0.6 0.75
tIH Input Hold Time 0.6 0.75
tIPW Control & Address Input Pulse Width (for each input) 2.2 2.2
tHZ Data-out High-impedance Time from CLK, CLK Max tAC -0.7 0.7
tLZ Data-out Low-impedance Time from CLK, CLK -0.7 0.7 -0.7 0.7
tT(SS) SSTL Input Transition 0.5 1.5 0.5 1.5
nS
tWTR Internal Write to Read Command Delay 2 2 tCK
tXSNR Exit Self Refresh to non-Read Command 75 75 ns
tXSRD Exit Self Refresh to Read Command 10 10 tCK
tREF Refresh Time (8k) 64 64 mS
tMRD Mode Register Set Cycle Time 10 12 nS
W942516CH
Publication Release Date: May 20, 2003
- 13 - Revision A2
7.7 AC Test Conditions
PARAMETER SYMBOL VALUE UNIT
Input High Voltage (AC) VIH VREF +0.31 V
Input Low Voltage (AC) VIL VREF -0.31 V
Input Reference Voltage VREF 0.5 x VDDQ V
Termination Voltage VTT 0.5 x VDDQ V
Input Signal Peak to Peak Swing VSWING 1.0 V
Differential Clock Input Reference Voltage VR Vx (AC) V
Input Difference Voltage. CLK and CLK Inputs (AC) VID (AC) 1.5 V
Input Signal Minimum Slew Rate SLEW 1.0 V/nS
Output Timing Measurement Reference Voltage VOTR 0.5 x VDDQ V
V
SWING (MAX)
V
DD
Q
V
SS
T
T
V
IH
min (AC)
V
REF
V
IL
max (AC)
SLEW = (V
IH
min (AC) - V
IL
max (AC)) /
T
Output
R
T
= 50 ohms
VTT
A.C. TEST LOAD (A)
Z = 50 ohms
output
30pF
Measurement point
Notes:
(1) Conditions outside the limits listed under “ABSOLUTE MAXIMUM RATINGS” may cause permanent damage to the
device.
(2) All voltages are referenced to VSS, VSSQ. .( 2.6V±0.1V for DDR400)
(3) Peak to peak AC noise on VREF may not exceed ±2% VREF(DC).
(4) VOH = 1.95V, VOL = 0.35V
(5) VOH = 1.9V, VOL = 0.4V
(6) The values of IOH(DC) is based on VDDQ = 2.3V and VTT = 1.19V.
The values of IOL(DC) is based on VDDQ = 2.3V and VTT = 1.11V.
(7) These parameters depend on the cycle rate and these values are measured at a cycle rate with the minimum values
of tCK and tRC.
(8) VTT is not applied directly to the device. VTT is a system supply for signal termination resistors, is expected to be set
equal to VREF and must track variations in the DC level of VREF.
(9) These parameters depend on the output loading. Specified values are obtained with the output open.
W942516CH
- 14 -
(10) Transition times are measured between VIH min(AC) and VIL max(AC).Transition (rise and fall) of input signals have a fixed
slope.
(11) IF the result of nominal calculation with regard to tCK contains more than one decimal place, the result is rounded up to
the nearest decimal place.
(i.e., TDQSS = 0.75 × tCK, tCK = 7.5 nS, 0.75 × 7.5 nS = 5.625 nS is rounded up to 5.6 nS.)
(12) VX is the differential clock cross point voltage where input timing measurement is referenced.
(13) VID is magnitude of the difference between CLK input level and CLK input level.
(14) VISO means {VICK(CLK)+V (CLK )}/2. ICK
(15) Refer to the figure below.
CLK
CLK
V
SS
V
ICK
V
X
V
X
V
X
V
X
V
X
V
ICK
V
ICK
V
ICK
V
ID(AC)
V
ID(AC)
0 V Differential
V
ISO
V
ISO(min)
V
ISO(max)
V
SS
(16) tAC and tDQSCK depend on the clock jitter. These timing are measured at stable clock.
W942516CH
Publication Release Date: May 20, 2003
- 15 - Revision A2
8. OPERATION MODE
The following table shows the operation commands.
8.1 Simplified Truth Table
SYM. COMMAND
DEVICE
STATE CKEN-1 CKEN DM(4) BS0,
BS1 A10
A12,
A11,
A9-A0
CS
RAS CAS WE
ACT Bank Active Idle(3) H X X V V V L L H H
PRE Bank Precharge Any(3) H X X V L X L L H L
PREA Precharge All Any H X X X H X L L H L
WRIT Write Active(3) H X X V L V L H L L
WRITA Write with Auto
Precharge Active(3) H X X V H V L H L L
READ Read Active(3) H X X V L V L H L H
READA Read with Auto
Precharge Active(3) H X X V H V L H L H
MRS Mode Register
Set Idle H X X L, L C C L L L L
EMRS Extended Mode
Regiser Set Idle H X X H, L V V L L L L
NOP No Operation Any H X X X X X L H H H
BST Burst Read Stop Active H X X X X X L H H L
DSL Device Deselect Any H X X X X X H X X X
AREF Auto Refresh Idle H H X X X X L L L H
SELF Self Refresh
Entry Idle H L X X X X L L L H
H X X X
SELEX Self Refresh Exit
Idle
(Self
Refresh)
L H X X X X
L H H X
H X X X
PD Power Down
Dode Entry
Idle/
Active(5) H L X X X X
L H H X
H X X X
PDEX Power Down
Mode Exit
Any
(Power
Down)
L H X X X X L H H X
WDE Data Write
Enable Active H X L X X X X X X X
WDD Data Write
Disable Active H X H X X X X X X X
Notes:
1. V = Valid X = Don’t Care L = Low level H = High level
2. CKEn signal is input level when commands are issued.
CKEn-1 signal is input level one clock cycle before the commands are issued.
4. These are state designated by the BS0, BS1 signals.
5. LDM, UDM (W942516CH)
6. Power Down Mode can not entry in the burst cycle.
W942516CH
- 16 -
8.2 Function Truth Table
(Note 1)
CURRENT
STATE
CS
RAS
CAS
WE
ADDRESS COMMAND ACTION NOTES
H X X X X DSL Nop
L H H X X NOP/BST Nop
L H L H BS, CA, A10 READ/READA ILLEGAL 3
L H L L BS, CA, A10 WRIT/WRITA ILLEGAL 3
L L H H BS, RA ACT Row activating
L L H L BS, A10 PRE/PREA Nop
L L L H X AREF/SELF Refresh or Self refresh 2
Idle
L L L L Op-Code MRS/EMRS Mode register accessing 2
H X X X X DSL Nop
L H H X X NOP/BST Nop
L H L H BS, CA, A10 READ/READA Begin read: Determine AP 4
L H L L BS, CA, A10 WRIT/WRITA Begin write: Determine AP 4
L L H H BS, RA ACT ILLEGAL 3
L L H L BS, A10 PRE/PREA Precharge 5
L L L H X AREF/SELF ILLEGAL
Row Active
L L L L Op-Code MRS/EMRS ILLEGAL
H X X X X DSL Continue burst to end
L H H H X NOP Continue burst to end
L H H L X BST Burst stop
L H L H BS, CA, A10 READ/READA Term burst, new read: Determine AP 6
L H L L BS, CA, A10 WRIT/WRITA ILLEGAL
L L H H BS, RA ACT ILLEGAL 3
L L H L BS, A10 PRE/PREA Term burst, precharging
L L L H X AREF/SELF ILLEGAL
Read
L L L L Op-Code MRS/EMRS ILLEGAL
H X X X X DSL Continue burst to end
L H H H X NOP Continue burst to end
L H H L X BST ILLEGAL
L H L H BS, CA, A10 READ/READA Term burst, start read: Determine AP 6, 7
L H L L BS, CA, A10 WRIT/WRITA Term burst, start read: Determine AP 6
L L H H BS, RA ACT ILLEGAL 3
L L H L BS, A10 PRE/PREA Term burst. precharging 8
L L L H X AREF/SELF ILLEGAL
Write
L L L L Op-Code MRS/EMRS ILLEGAL
W942516CH
Publication Release Date: May 20, 2003
- 17 - Revision A2
Function Truth Table, continued
CURRENT
STATE
CS
RAS
CAS WE
ADDRESS COMMAND ACTION NOTES
H X X X X DSL Continue burst to end
L H H H X NOP Continue burst to end
L H H L X BST ILLEGAL
L H L H BS, CA, A10 READ/READA ILLEGAL
L H L L BS, CA, A10 WRIT/WRITA ILLEGAL 3
L L H H BS, RA ACT ILLEGAL 3
L L H L BS, A10 PRE/PREA ILLEGAL
L L L H X AREF/SELF ILLEGAL
Read with
Auto
Prechange
L L L L Op-Code MRS/EMRS ILLEGAL
H X X X X DSL Continue burst to end
L H H H X NOP Continue burst to end
L H H L X BST ILLEGAL
L H L H BS, CA, A10 READ/READA ILLEGAL
L H L L BS, CA, A10 WRIT/WRITA ILLEGAL
L L H H BS, RA ACT ILLEGAL 3
L L H L BS, A10 PRE/PREA ILLEGAL 3
L L L H X AREF/SELF ILLEGAL
Write with
Auto
Precharge
L L L L Op-Code MRS/EMRS ILLEGAL
H X X X X DSL Nop-> Idle after tRP
L H H H X NOP Nop-> Idle after tRP
L H H L X BST ILLEGAL
L H L H BS, CA, A10 READ/READA ILLEGAL 3
L H L L BS, CA, A10 WRIT/WRITA ILLEGAL 3
L L H H BS, RA ACT ILLEGAL 3
L L H L BS, A10 PRE/PREA Idle after tRP
L L L H X AREF/SELF ILLEGAL
Precharging
L L L L Op-Code MRS/EMRS ILLEGAL
H X X X X DSL Nop-> Row active after tRCD
L H H H X NOP Nop-> Row active after tRCD
L H H L X BST ILLEGAL
L H L H BS, CA, A10 READ/READA ILLEGAL 3
L H L L BS, CA, A10 WRIT/WRITA ILLEGAL 3
L L H H BS, RA ACT ILLEGAL 3
L L H L BS, A10 PRE/PREA ILLEGAL 3
L L L H X AREF/SELF ILLEGAL
Row
Activating
L L L L Op-Code MRS/EMRS ILLEGAL
W942516CH
- 18 -
Function Truth Table, continued
CURRENT
STATE
CS RAS
CAS
WE
ADDRESS COMMAND ACTION NOTES
H X X X X DSL Nop->Row active after tWR
L H H H X NOP Nop->Row active after tWR
L H H L X BST ILLEGAL
L H L H BS, CA, A10 READ/READA ILLEGAL 3
L H L L BS, CA, A10 WRIT/WRITA ILLEGAL 3
L L H H BS, RA ACT ILLEGAL 3
L L H L BS, A10 PRE/PREA ILLEGAL 3
L L L H X AREF/SELF ILLEGAL
Write
Recovering
L L L L Op-Code MRS/EMRS ILLEGAL
H X X X X DSL Nop->Enter precharge after tWR
L H H H X NOP Nop->Enter precharge after tWR
L H H L X BST ILLEGAL
L H L H BS, CA, A10 READ/READA ILLEGAL 3
L H L L BS, CA, A10 WRIT/WRITA ILLEGAL 3
L L H H BS, RA ACT ILLEGAL 3
L L H L BS, A10 PRE/PREA ILLEGAL 3
L L L H X AREF/SELF ILLEGAL
Write
Recovering
with Auto
Precharge
L L L L Op-Code MRS/EMRS ILLEGAL
H X X X X DSL Nop->Idle after tRC
L H H H X NOP Nop->Idle after tRC
L H H L X BST ILLEGAL
L H L H X READ/WRIT ILLEGAL
L L H X X ACT/PRE/PREA ILLEGAL
Refreshing
L L L X X AREF/SELF/MRS/EMRS ILLEGAL
H X X X X DSL Nop->Row after tMRD
L H H H X NOP Nop->Row after tMRD
L H H L X BST ILLEGAL
L H L X X READ/WRIT ILLEGAL
Mode
Register
Accessing
L L X X X ACT/PRE/PREA/ARE
F/SELF/MRS/EMRS
ILLEGAL
Notes:
1. All entries assume that CKE was active (High level) during the preceding clock cycle and the current clock cycle.
2. Illegal if any bank is not idle.
3. Illegal to bank in specified states; Function may be legal in the bank indicated by Bank Address (BS), depending on the
state of that bank.
4. Illegal if tRCD is not satisfied.
5. Illegal if tRAS is not satisfied.
6. Must satisfy burst interrupt condition.
7. Must avoid bus contention, bus turn around, and/or satisfy write recovery requirements.
8. Must mask preceding data which don’t satisfy tWR
Remark: H = High level, L = Low level, X = High or Low level (Don’t care), V = Valid data
W942516CH
Publication Release Date: May 20, 2003
- 19 - Revision A2
8.3 Function Truth Table for CKE
CKE
CURRENT
STATE n-1 n
CS
ADDRESS ACTION NOTES
H X X X X X X INVALID
L H H X X X X Exit Self Refresh->Idle after tXSNR
L H L H H X X Exit Self Refresh->Idle after tXSNR
L H L H L X X ILLEGAL
L H L L X X X ILLEGAL
Self Refresh
L L X X X X X Maintain Self Refresh
H X X X X X X INVALID
L H X X X X X Exit Power down->Idle after tIS
Power Down
L L X X X X X Maintain power down mode
H H X X X X X Refer to Function Truth Table
H L H X X X X Enter Power down 2
H L L H H X X Enter Power down 2
H L L L L H X Self Refresh 1
H L L H L X X ILLEGAL
H L L L X X X ILLEGAL
All banks Idle
L X X X X X X Power down 2
H H X X X X X Refer to Function Truth Table
H L H X X X X Enter Power down 2
H L L H H X X Enter Power down 2
H L L L L H X ILLEGAL
H L L H L X X ILLEGAL
H L L L X X X ILLEGAL
Row Active
L X X X X X X Power down
Any State
Other Than
Listed Above
H H X X X X X Refer to Function Truth Table
RAS CAS WE
Notes:
1. Self refresh can enter only from the all banks idle state.
2. Power down can enter only from bank idle or row active state.
Remark: H = High level, L = Low level, X = High or Low level (Don’t care), V = Valid data
W942516CH
- 20 -
8.4 Simplified Stated Diagram
POWER
APPLIED
Automatic Sequence
Command Sequence
Read A
Write Read
ROW
ACTIVE
POWER
DOWN
IDLE
MODE
REGISTER
SET
AUTO
REFRESH
SELF
REFRESH
Read
Read A
Write
Write A
PRE
CHARGE
POWER
ON
MRS/EMRS
AREF
SREF
SREFX
PD
PDEX
ACT
BST
Read
Write
Write A
Write A Read A
PRE
PRE
PRE
PRE
ACTIVE
POWERDOWN
PD
PDEX
Read
Read A
W942516CH
Publication Release Date: May 20, 2003
- 21 - Revision A2
9. FUNCTIONAL DESCRIPTION
9.1 Power Up Sequence
(1) Apply power and attempt to CKE at a low state (
≤
0.2V), all other inputs may be undefined
1) Apply VDD before or at the same time as VDDQ.
2) Apply VDDQ before or at the same time as VTT and VREF.
(2) Start Clock and maintain stable condition for 200 µS (min.).
(3) After stable power and clock, apply NOP and take CKE high.
(4) Issue EMRS (Extended Mode Register Set) to enable DLL and establish Output Driver Type.
(5) Issue MRS (Mode Register Set) to reset DLL and set device to idle with bit A8.
(an additional 200 cycles(min) of clock are required for DLL Lock)
(6) Issue precharge command for all banks of the device.
(7) Issue two or more Auto Refresh commands.
(8) Issue MRS-Initialize device operation.
(If device operation mode is set at sequence 5, sequence 8 can be skipped.)
9.2 Command Function
1. Bank Activate Command
(RAS = "L", CAS = "H", WE = "H", BS0, BS1 = Bank, A0 to A12 = Row Address)
The Bank Activate command activates the bank designated by the BS (Bank address) signal. Row
addresses are latched on A0 to A12 when this command is issued and the cell data is read out of
the sense amplifiers. The maximum time that each bank can be held in the active state is specified
as tRAS (max). After this command is issued, Read or Write operation can be executed.
2. Bank Precharge Command
(RAS = "L", CAS = "H", WE = "L", BS0, BS1 = Bank, A10 = "L", A0 to A9, A11, A12 = Don’t
care)
The Bank Precharge command percharges the bank designated by BS. The precharged bank is
switched from the active state to the idle state.
3. Precharge All Command
(RAS = "L", CAS = "H", WE = "L", BS0, BS1 = Don’t care, A10 = "H", A0 to A9, A11, A12 =
Don’t care)
The Precharge All command precharges all banks simultaneously. Then all banks are switched to
the idle state.
4. Write Command
(RAS = "H", CAS = "L", WE = "L", BS0, BS1 = Bank, A10 = "L", A0 to A9, A11 = Column
Address)
W942516CH
- 22 -
The write command performs a Write operation to the bank designated by BS. The write data are
latched at both edges of DQS. The length of the write data (Burst Length) and column access
sequence (Addressing Mode) must be in the Mode Register at power-up prior to the Write
operation.
5. Write with Auto Precharge Command
(RAS = "H", CAS = "L", WE = "L", BS0, BS1 = Bank, A10 = "H", A0 to A9, A11 = Column
Address)
The Write with Auto Precharge command performs the Precharge operation automatically after the
Write operation. This command must not be interrupted by any other commands.
6. Read Command
(RAS = "H", CAS = "L", WE = "H", BS0, BS1 = Bank, A10 = "L", A0 to A9, A11 = Column
Address)
The Read command performs a Read operation to the bank designated by BS. The read data are
synchronized with both edges of DQS. The length of read data (Burst Length), Addressing Mode
and CAS Latency (access time from CAS command in a clock cycle) must be programmed in
the Mode Register at power-up prior to the Read operation.
7. Read with Auto Precharge Command
(RAS = "H", CAS = ”L”, WE = ”H”, BS0, BS1 = Bank, A10 = ”H”, A0 to A9, A11 = Column
Address)
The Read with Auto precharge command automatically performs the Precharge operation after the
Read operation.
1) READA ≥tRAS (min) - (BL/2) x tCK
Internal precharge operation begins after BL/2 cycle from Read with Auto Precharge command.
2) tRCD(min) READA < tRAS(min) - (BL/2) x tCK ≤
Data can be read with shortest latency, but the internal Precharge operation does not begin until
after tRAS (min) has completed.
This command must not be interrupted by any other command.
8. Mode Register Set Command
(RAS = "L", CAS = "L", WE = "L", BS0 = "L", BS1 = "L", A0 to A12 = Register Data)
The Mode Register Set command programs the values of CAS latency, Addressing Mode, Burst
Length and DLL reset in the Mode Register. The default values in the Mode Register after power-
up are undefined, therefore this command must be issued during the power-up sequence. Also,
this command can be issued while all banks are in the idle state. Refer to the table for specific
codes.
9. Extended Mode Register Set Command
(RAS = "L", CAS = "L", WE = "L", BS0 = "H", BS1 = "L", A0 to A12 = Register data)
W942516CH
Publication Release Date: May 20, 2003
- 23 - Revision A2
The Extended Mode Register Set command can be implemented as needed for function
extensions to the standard (SDR-SDRAM). Currently the only available mode in EMRS is DLL
enable/disable, decoded by A0. The default value of the extended mode register is not defined;
therefore this command must be issued during the power-up sequence for enabling DLL. Refer to
the table for specific codes.
10. No-Operation Command
(RAS = "H", CAS = "H", WE = "H")
The No-Operation command simply performs no operation (same command as Device Deselect).
11. Burst Read Stop Command
(RAS = "H", CAS = "H", WE = "L")
The Burst stop command is used to stop the burst operation. This command is only valid during a
Burst Read operation.
12. Device Deselect Command
(CS = "H")
The Device Deselect command disables the command decoder so that the RAS , CAS ,
WE and Address inputs are ignored. This command is similar to the No-Operation command.
13. Auto Refresh Command
(RAS = "L", CAS = "L", WE = "H", CKE = "L", BS0, BS1, A0 to A12 = Don’t care)
The Auto Refresh command is used to refresh the row address provided by the internal refresh
counter. The Refresh operation must be performed 8192 times within 64ms. The next command
can be issued after tREF from the end of the Auto Refresh command. When the Auto Refresh
command is used, all banks must be in the idle state.
14. Self Refresh Entry Command
(RAS = "L", CAS = "L", WE = "H", CKE = "L", BS0, BS1, A0 to A12 = don’t care)
The Self Refresh Entry command is used to enter Self Refresh mode. While the device is in Self
Refresh mode, all input and output buffer (except the CKE buffer) are disabled and the Refresh
operation is automatically performed. Self Refresh mode is exited by taking CKE "high" (the Self
Refresh Exit command). During self refresh, DLLl is disable.
15. Self Refresh Exit Command
(CKE = "H", CS = "H" or CKE = "H", RAS = "H", CAS = "H")
This command is used to exit from Self Refresh mode. Any subsequent commands can be issued
after tXSNR (tXSRD for Read Command) from the end of this command.
W942516CH
- 24 -
16. Data Write Enable /Disable Command
(DM = "L/H" or LDM, UDM = "L/H")
During a Write cycle, the DM or LDM, UDM signal functions as Data Mask and can control every
word of the input data. The LDM signal controls DQ0 to DQ7 and UDM signal controls DQ8 to
DQ15.
9.3 Read Operation
Issuing the Bank Activate command to the idle bank puts it into the active state. When the Read
command is issued after tRCD from the Bank Activate command, the data is read out sequentially,
synchronized with both edges of DQS (Burst Read operation). The initial read data becomes available
after CAS latency from the issuing of the Read command. The CAS latency must be set in the Mode
Register at power-up.
When the Precharge Operation is performed on a bank during a Burst Read and operation, the Burst
operation is terminated.
When the Read with Auto Precharge command is issued, the Precharge operation is performed
automatically after the Read cycle, then the bank is switched to the idle state. This command cannot
be interrupted by any other commands. Refer to the diagrams for Read operation.
9.4 Write Operation
Issuing the Write command after tRCD from the bank activate command. The input data is latched
sequentially, synchronizing with both edges(rising &falling) of DQS after the Write command (Burst
write operation). The burst length of the Write data (Burst Length) and Addressing Mode must be set
in the Mode Register at power-up.
When the Precharge operation is performed in a bank during a Burst Write operation, the Burst
operation is terminated.
When the Write with Auto Precharge command is issued, the Precharge operation is performed
automatically after the Write cycle, then the bank is switched to the idle state, The Write with Auto
Precharge command cannot be interrupted by any other command for the entire burst data duration.
Refer to the diagrams for Write operation.
9.5 Precharge
There are two Commands, which perform the precharge operation (Bank Precharge and Precharge
All). When the Bank Precharge command is issued to the active bank, the bank is precharged and
then switched to the idle state. The Bank Precharge command can precharge one bank independently
of the other bank and hold the unprecharged bank in the active state. The maximum time each bank
can be held in the active state is specified as tRAS (max). Therefore, each bank must be precharged
within tRAS(max) from the bank activate command.
The Precharge All command can be used to precharge all banks simultaneously. Even if banks are
not in the active state, the Precharge All command can still be issued. In this case, the Precharge
operation is performed only for the active bank and the precharge bank is then switched to the idle
state.
W942516CH
Publication Release Date: May 20, 2003
- 25 - Revision A2
9.6 Burst Termination
When the Precharge command is used for a bank in a Burst cycle, the Burst operation is terminated.
When Burst Read cycle is interrupted by the Precharge command, read operation is disabled after
clock cycle of ( CAS latency) from the Precharge command. When the Burst Write cycle is interrupted
by the Precharge command . the input circuit is reset at the same clock cycle at which the precharge
command is issued. In this case, the DM signal must be asserted "high": during tWR to prevent writing
the invalided data to the cell array.
When the Burst Read Stop command is issued for the bank in a Burst Read cycle, the Burst Read
operation is terminated. The Burst read Stop command is not supported during a write burst operation.
Refer to the diagrams for Burst termination.
9.7 Refresh Operation
Two types of Refresh operation can be performed on the device: Auto Refresh and Self Refresh. By
repeating the Auto Refresh cycle, each bank in turn refreshed automatically. The Refresh operation
must be performed 8192 times(rows)within 64ms. The period between the Auto Refresh command
and the next command is specified by tRFC.
Self Refresh mode enter issuing the Self Refresh command (CKE asserted "low"). while all banks are
in the idle state. The device is in Self Refresh mode for as long as cke held "low". In the case of
8192 burst Auto Refresh commands, 8192 burst Auto Refresh commands must be performed within
7.8 µS before entering and after exiting the Self Refresh mode. In the case of distributed Auto Refresh
commands, distributed auto refresh commands must be issued every 7.8 µS and the last distributed
Auto Refresh commands must be performed within 7.8 µS before entering the self refresh mode. After
exiting from the Self Refresh mode, the refresh operation must be performed within 7.8 µS. In Self
Refresh mode, all input/output buffers are disable, resulting in lower power dissipation (except CKE
buffer). Refer to the diagrams for Refresh operation.
9.8 Power Down Mode
Two types of Power Down Mode can be performed on the device: Active Standby Power Down Mode
and Precharge Standby Power Down Mode.
When the device enters the Power Down Mode, all input/output buffers and DLL are disabled resulting
in low power dissipation (except CKE buffer).
Power Down Mode enter asserting CKE "low" while the device is not running a burst cycle. Taking
CKE: "high" can exit this mode. When CKE goes high, a No operation command must be input at next
CLK rising edge. Refer to the diagrams for Power Down Mode.
9.9 Mode Register Operation
The mode register is programmed by the Mode Register Set command (MRS/EMRS) when all banks
are in the idle state. The data to be set in the Mode Register is transferred using the A0 to A12 and
BS0, BS1 address inputs.
The Mode Register designates the operation mode for the read or write cycle. The register is divided
into five filed: (1) Burst Length field to set the length of burst data (2) Addressing Mode selected bit to
designate the column access sequence in a Burst cycle (3) CAS Latency field to set the assess time
in clock cycle (4) DLL reset field to reset the dll (5) Regular/Extended Mode Register filed to select a
W942516CH
- 26 -
type of MRS (Regular/Extended MRS). EMRS cycle can be implemented the extended function (DLL
enable/Disable mode)
The initial value of the Mode Register (including EMRS) after power up is undefined; therefore the
Mode Register Set command must be issued before power operation.
1. Burst Length field (A2 to A0)
This field specifies the data length for column access using the A2 to A0 pins and sets the Burst
Length to be 2, 4, and 8 words.
A2 A1 A0 Burst Length
0 0 0 Reserved
0 0 1 2 words
0 1 0 4 words
0 1 1 8 words
1 x x Reserved
2. Addressing Mode Select (A3)
The Addressing Mode can be one of two modes; Interleave mode or Sequential Mode, When the
A3 bit is "0", Sequential mode is selected. When the A3 bit is "1", Interleave mode is selected. Both
addressing Mode support burst length 2, 4, and 8 words.
A3 Addressing Mode
0 Sequential
0 Interleave
W942516CH
Publication Release Date: May 20, 2003
- 27 - Revision A2
• Address Sequence of Sequential Mode
A column access is performed by incrementing the column address input to the device. The
address is varied by the Burst Length as the following.
Addressing Sequence of Sequential Mode
DATA ACCESS ADDRESS BURST LENGTH
Data 0 n 2 words (address bits is A0)
Data 1 n + 1 not carried from A0 to A1
Data 2 n + 2 4 words (address bit A0, A1)
Data 3 n + 3 Not carried from A1 to A2
Data 4 n + 4
Data 5 n + 5 8 words (address bits A2, A1 and A0)
Data 6 n + 6 Not carried from A2 to A3
Data 7 n + 7
• Addressing Sequence of Interleave Mode
A Column access is started from the inputted column address and is performed by
interleaving the address bits in the sequence shown as the following.
9.9.1.1 Address Sequence for Interleave Mode
DATA ACCESS ADDRESS BURST LENGTH
Data 0 A8 A7 A6 A5 A4 A3 A2 A1 A0 2 words
Data 1 A8 A7 A6 A5 A4 A3 A2 A1 A0
Data 2 A8 A7 A6 A5 A4 A3 A2 A1 A0 4 words
Data 3 A8 A7 A6 A5 A4 A3 A2 A1 A0
Data 4 A8 A7 A6 A5 A4 A3 A2 A1 A0 8 words
Data 5 A8 A7 A6 A5 A4 A3 A2 A1 A0
Data 6 A8 A7 A6 A5 A4 A3 A2 A1 A0
Data 7 A8 A7 A6 A5 A4 A3 A2 A1 A0
W942516CH
- 28 -
3. CAS Latency field (A6 to A4)
This field specifies the number of clock cycles from the assertion of the Read command to the first
data read. The minimum values of CAS Latency depends on the frequency of CLK.
A6 A5 A4 CAS Latency
0 0 0 Reserved
0 0 1 Reserved
0 1 0 2
0 1 1 3
1 0 0 Reserved
1 0 1 Reserved
1 1 0 2.5
1 1 1 Reserved
4. DLL Reset bit (A8)
This bit is used to reset DLL. When the A8 bit is "1", DLL is reset.
5. Mode Register /Extended Mode register change bits (BS0, BS1)
These bits are used to select MRS/EMRS.
BS1 BS0 A12-A0
0 0 Regular MRS Cycle
0 1 Extended MRS Cycle
1 x Reserved
6. Extended Mode Register field
1) DLL Switch field (A0)
This bit is used to select DLL enable or disable
A0 DLL
0 Enable
1 Disable
2) Output Driver Size Control field (A1)
This bit is used to select Output Driver Size, both Full strength and Half strength are based on
JEDEC standard.
A1 Output Driver
0 Full Strength
1 Half Strength
7. Reserved field
• Test mode entry bit (A7)
This bit is used to enter Test mode and must be set to "0" for normal operation.
• Reserved bits (A9, A10, A11, A12)
These bits are reserved for future operations. They must be set to "0" for normal operation.
W942516CH
Publication Release Date: May 20, 2003
- 29 - Revision A2
10. TIMING WAVEFORMS
10.1 Command Input Timing
CLK
CLK
t
CK
t
CK
t
CL
t
CH
t
IS
t
IH
t
IS
t
IH
t
IS
t
IH
t
IS
t
IH
t
IS
t
IH
CS
RAS
CAS
WE
A0~A12
BS0, 1
Refer to the Command Truth Table
10.2 Timing of the CLK Signals
t
CK
t
T
t
T
V
IH
V
IH(AC)
V
IL(AC)
V
IL
CLK
CLK
CLK
CLK
V
X
V
X
V
X
V
IH
V
IL
t
CH
t
CL
W942516CH
- 30 -
Timing Waveforms, continued
10.3 Read Timing (Burst Length = 4)
t
IS
t
IH
DA0 DA1 DA2
t
CH
t
CL
t
CK
ADD
CMD
CLK
CLK
READ
Col
QA0 QA1 QA2 DA3
QA3
t
RPRE
t
DQSCK
t
DQSCK
t
DQSCK
t
RPST
PostamblePreamble
Hi-Z
Hi-Z
t
DQSQ
t
DQSQ
t
DQSQ
t
QH
t
QH
t
AC
t
LZ
t
HZ
Hi-Z
Hi-Z
DA0 DA1 DA2
QA0 QA1 QA2 DA3
QA3
t
RPRE
t
DQSCK
t
DQSCK
t
DQSCK
t
RPST
PostamblePreamble
Hi-Z
Hi-Z
t
DQSQ
t
DQSQ
t
DQSQ
t
QH
t
QH
t
AC
t
LZ
t
HZ
Hi-Z
Hi-Z
CAS
DQS
Output
(Data)
latency=2
CAS
DQS
Output
(Data)
latency=2.5
Note: The correspondence of LDQS, UDQS to DQ. ( W942516AH)
LDQS DQ0~7
DQ8~15UDQS
t
IS
t
IH
W942516CH
Publication Release Date: May 20, 2003
- 31 - Revision A2
Timing Waveforms, continued
10.4 Write Timing (Burst Length = 4)
t
IS
t
IH tDSH
t
DSS
t
DSS
t
DSH
t
WPRES
t
DH
t
DH
t
DH
t
DS
t
DS
t
DS
t
DQSS
t
DSH
t
DSH
t
DSS
t
DSS
Postamble
t
WPRE
Preamble
tDQSH tDQSHtDQSL tWPST
DA0 DA1 DA2 DA3
t
WPRES
t
DS
t
DS
t
DQSS
t
DSH
t
DSH
t
DSS
t
DSS
Postamble
t
WPRE
Preamble
t
DQSH
t
DQSH
t
DQSL
t
WPST
t
WPRES
t
DH
t
DS
t
DS
t
DQSS
t
DSH
Postamble
t
WPRE
Preamble
t
DQSH
t
DQSH
t
DQSL
t
WPST
DA0 DA1 DA2 DA3
t
DSSK
t
DSSK
t
DSSK
t
DSSK
t
DS
t
DH
t
DH
t
CH
t
CL
t
CK
DQS
Input
(Data)
LDQS
DQ0~7
UDQS
DQ8~15
x4, x8 device
x16 device
ADD
CMD
CLK
CLK
WRIT
Col
DA0 DA1 DA2 DA3
DA0 DA1 DA2 DA3
t
DH
t
DH
t
DH
t
DS
DA0 DA1 DA2 DA3
DA0 DA1 DA2 DA3
Note: x16 has 2DQS’s (UDQS for uper byte and LDQS for lower byte). Even if one of the 2 bytes is not used, both UDQS and
LDQS must be toggled.
W942516CH
- 32 -
Timing Waveforms, continued
10.5 DM, Data Mask (W942508CH /W942504CH)
WRIT
t
DIPW
t
DIPW
t
DH
t
DH
t
DS
t
DS
Masked
/CLK
CLK
CMD
DQS
DM
DQ D3D1D0
10.6 DM, Data Mask (W942516CH)
WRIT
t
DIPW
t
DIPW
t
DH
t
DH
t
DS
t
DS
Masked
/CLK
CLK
CMD
LDQS
LDM
DQ0~
DQ7
D3D1D0
t
DIPW
t
DIPW
t
DH
t
DH
t
DS
t
DS
Masked
UDQS
UDM
DQ8~
DQ15
D3
D2
D0
W942516CH
Publication Release Date: May 20, 2003
- 33 - Revision A2
Timing Waveforms, continued
10.7 Mode Register Set (MRS) Timing
MRS
Register Set data
NEXT CMD
t
MRD
CLK
CLK
CMD
ADD
A2 A1 A0
A3
A6 A5 A4
A8
BS1 BS0
000
000
001
010
011
100
101
110
111
001
010
011
100
101
110
111
0
1
0
1
1
1
0
0
0
1
0
1
2
4
8
2
4
8
Burst Length
Sequential Interleaved
Reserved Reserved
Reserved
Reserved
Reserved
Reserved
Sequential
Interleaved
Addressing Mode
CAS Latency
2
DLL Reset
No
Yes
MRS or EMRS
Regular MRS cycle
Extended MRS cycle
2.5
A0
A1
A2
A3
A4
A5
A6
A7
A8
A9
A10
A11
A12
BS0
BS1 "0"
"0"
"0"
"0"
"0"
"0"
"0"
DLL Reset
Reserved
Addressing Mode
* "Reserved" should stay "0" during
MRS cycle.
Reserved
Mode Register Set or
Extended Mode Register
Set
CAS Latency
Burst Length
Reserved Reserved
3
W942516CH
- 34 -
Timing Waveforms, continued
10.8 Extend Mode Register Set (EMRS) Timing
EMRS
Register Set data
NEXT CMD
t
MRD
CLK
CLK
CMD
ADD
A0
A1
BS1 BS0
0
1
0
1
1
1
0
0
0
1
0
1
Enable
Disable
DLL Switch
Output Driver Size
Full Strength
Hall Strength
MRS or EMRS
Regular MRS cycle
Extended MRS cycle
A0
A1
A2
A3
A4
A5
A6
A7
A8
A9
A10
A11
A12
BS0
BS1 "0"
"0"
"0"
"0"
"0"
"0"
"0"
* "Reserved" should stay "0" during
EMRS cycle.
"0"
"0"
"0"
"0"
"0"
"0"
Output Driver
DLL Switch
Reserved
Mode Register Set or
Extended Mode Register
Set
W942516CH
Publication Release Date: May 20, 2003
- 35 - Revision A2
Timing Waveforms, continued
10.9 Auto Precharge Timing (Read Cycle, CL = 2)
1) tRCD (READA) ≥ tRAS (min) – (BL/2) × tCK
AP
Q7Q6Q5Q4Q3Q2Q1Q0
ACT
READA
ACT
Q0 Q1 Q2 Q3
ACTREADAACT
Q0 Q1
ACT
AP
READAACT
tRP
t
RAS
CMD
DQS
DQ
CMD
DQS
DQ
CMD
DQS
DQ
BL=2
BL=4
BL=8
CLK
CLK
AP
Notes: CL2 shown; same command operation timing with CL = 2.5
In this case, the internal precharge operation begin after BL/2 cycle from READA command.
AP
Represents the start of internal precharging.
The Read with Auto precharge command cannot be interrupted by any other command.
W942516CH
- 36 -
Auto Precharge Timing (Read cycle, CL = 2), continued
2) tRCD/RAP(min) ≤ tRCD (READA) < tRAS (min) – (BL/2) × tCK
AP
Q7Q6Q5Q4Q3Q2Q1Q0
ACT READA ACT
Q0 Q1 Q2 Q3
ACTREADAACT
Q0 Q1
ACT
AP
READAACT
t
RP
t
RAS
CMD
DQS
DQ
CMD
DQS
DQ
CMD
DQS
DQ
BL=2
BL=4
BL=8
CLK
CLK
AP
t
RAP
t
RCD
t
RAP
t
RCD
t
RAP
t
RCD
Notes: CL2 shown; same command operation timing with CL = 2.5
In this case, the internal precharge operation does not begin until after tRAS (min) has command.
AP
Represents the start of internal precharging.
The Read with Auto Precharge command cannot be interrupted by any other command.
W942516CH
Publication Release Date: May 20, 2003
- 37 - Revision A2
Timing Waveforms, continued
10.10 Auto Precharge Timing (Write Cycle)
AP
WRITA ACT
ACTWRITA
ACTWRITA
CMD
DQS
DQ
CMD
DQS
DQ
CMD
DQS
DQ
BL=2
BL=4
BL=8
CLK
CLK
AP
AP
D0 D1
D0 D1 D2 D3
D0 D1 D2 D3 D4 D5 D6 D7
t
DAL
t
DAL
t
DAL
The Write with Auto Precharge command cannot be interrupted by any other command.
AP
Represents the start of internal precharging .
W942516CH
- 38 -
Timing Waveforms, continued
10.11 Read Interrupted by Read (CL = 2, BL = 2, 4, 8)
CMD
ADD
DQS
CLK
CLK
DQ
ACT READ A READ B READ C READ D READ E
Row
Address COl,Add,A Col,Add,B Col,Add,C Col,Add,D Col,Add,E
QC0
QA0 QA1 QB0 QB1
t
CCD
t
CCD
t
CCD
t
CCD
t
RCD
10.12 Burst Read Stop (BL = 8)
READ
CMD
DQS
DQ
CLK
CLK
BST
Q0 Q1 Q2 Q3 Q4 Q5
Q0 Q1 Q2 Q3 Q4 Q5
CAS Latency
CAS Latency
CAS Latency=2
DQS
DQ
CAS Latency=2.5
W942516CH
Publication Release Date: May 20, 2003
- 39 - Revision A2
Timing Waveforms, continued
10.13 Read Interrupted by Write & BST (BL = 8)
READ
CMD
DQS
DQ
CLK
CLK
BST
Q0 Q1 Q2 Q3 Q4 Q5
CAS Latency=2
WRIT
D0 D1 D2 D3 D4 D5 D6 D7
READ
CMD
DQS
DQ
BST
Q0 Q1 Q2 Q3 Q4 Q5
CAS Latency=2.5
WRIT
D0 D1 D2 D3 D4 D5 D6 D7
Burst Read cycle must be terminated by BST Command to avoid I/O conflict.
10.14 Read Interrupted by Precharge (BL = 8)
READ
CMD
DQS
DQ
CLK
CLK
PRE
Q0
Q1
Q2
Q3
Q4
Q5
Q0
Q1
Q2
Q3
Q4
Q5
CAS Latency
CAS Latency
CAS Latency=2
DQS
DQ
CAS Latency=2.5
W942516CH
- 40 -
Timing Waveforms, continued
10.15 Write Interrupted by Write (BL = 2, 4, 8)
CMD
ADD
DQS
CLK
CLK
DQ
ACT
WRIT A
WRIT B
WRIT C
WRIT D
WRIT E
Row
Address
COl. Add. A
Col.Add.B
Col. Add. C
Col. Add. D
Col. Add. E
DC0
DC1
DD0
DD1
DA0
DA1
DB0
DB1
t
CCD
t
CCD
t
CCD
t
CCD
t
RCD
10.16 Write Interrupted by Read (CL = 2, BL = 8)
WRIT
CMD
DQS
DM
CLK
CLK
t
WTR
DQ D4 D5 D6 D7
D0 D1 D2 D3
Data must be
masked by DM
READ
Data masked by READ
command, DQS input ignored.
Q4 Q5 Q6 Q7
Q0 Q1 Q2 Q3
W942516CH
Publication Release Date: May 20, 2003
- 41 - Revision A2
Timing Waveforms, continued
10.17 Write Interrupted by Read (CL = 2.5, BL = 4)
WRIT
CMD
DQS
DM
CLK
CLK
READ
t
WTR
DQ Q0 Q1 Q2 Q3D0 D1 D2 D3
Data must be masked by DM
10.18 Write Interrupted by Precharge (BL = 8)
WRIT
CMD
DQS
DM
CLK
CLK
ACT
t
WR
DQ D4 D5 D6 D7D0 D1 D2 D3
Data must be
masked by DM
PRE
t
RP
Data masked by PRE
command, DQS input ignored.
W942516CH
- 42 -
Timing Waveforms, continued
10.19 2 Bank Interleave Read Operation (CL = 2, BL = 2)
∗ tCK = 100 MHz
CMD
DQS
CLK
CLK
DQ
Q0a Q1a
Q0b Q1b
ACTa/b : Bank Act. CMD of bank a/b
READAa/b : Read with Auto Pre.CMD of bank a/b
APa/b : Auto Pre. of bank a/b
ACTa
ACTb READAa
ACTa
READAb
ACTb
APa APb
t
RCD(a)
t
RAS(a)
t
RP(a)
t
RAS(b)
t
RCD(b)
t
RP(b)
CL(a) CL(b)
Preamble Postamble Preamble Postamble
t
RRD
t
RC(a)
t
RC(b)
t
RRD
10.20 2 Bank Interleave Read Operation (CL = 2, BL = 4)
CMD
DQS
CLK
CLK
DQ
Q2a Q3a Q2b Q3b
ACTa/b : Bank Act. CMD of bank a/b
READAa/b : Read with Auto Pre.CMD of bank a/b
APa/b : Auto Pre. of bank a/b
ACTa READAa
ACTb READAb ACTa ACTb
APa APb
t
RCD(a)
t
RAS(a)
t
RP(a)
t
RAS(b)
t
RCD(b)
t
RP(b)
CL(a) CL(b)
Preamble Postamble
t
RRD
t
RC(a)
t
RC(b)
t
RRD
Q0a Q1a Q0b Q1b
W942516CH
Publication Release Date: May 20, 2003
- 43 - Revision A2
Timing Waveforms, continued
10.21 4 Bank Interleave Read Operation (CL = 2, BL = 2)
CMD
DQS
CLK
CLK
DQ
Q0a
Q1a
Q0b
Q1b
ACTa/b/c/d : Bank Act. CMD of bank a/b/c/d
READAa/b/c/d : Read with Auto Pre.CMD of bank a/b/c/d
APa/b/c/d : Auto Pre. of bank a/b/c/d
ACTa
ACTb
READAa
ACTc
READAb
ACTd
READAc
ACTa
APa APb
t
RCD(a)
t
RAS(a)
t
RP
t
RAS(b)
t
RCD(b)
CL(a) CL(b)
Preamble Postamble Preamble
t
RRD
t
RC(a)
t
RRD
t
RAS(c)
t
RAS(d)
t
RCD(d)
t
RCD(c)
t
RRD
t
RRD
10.22 4 Bank Interleave Read Operation (CL = 2, BL = 4)
CMD
DQS
CLK
CLK
DQ
ACTa/b/c/d : Bank Act. CMD of bank a/b/c/d
READAa/b/c/d : Read with Auto Pre.CMD of bank a/b/c/d
APa/b/c/d : Auto Pre. of bank a/b/c/d
ACTa READAa
ACTb READAb
ACTc READAc
ACTd READAd
ACTa
APa APb
t
RCD(a)
t
RAS(a)
t
RP(a)
t
RAS(b)
t
RCD(b)
CL(a) CL(b)
t
RRD
t
RC(a)
t
RRD
t
RAS(c)
t
RAS(d)
t
RCD(d)
t
RCD(c)
t
RRD
t
RRD
Q2a Q3a Q2b Q3b
CL(c)
Preamble
Q0a Q1a Q0b Q1b
Q0a Q1a
CL(b)
CL(b)
APc
W942516CH
- 44 -
Timing Waveforms, continued
10.23 Auto Refresh Cycle
CMD
CLK
CLK
PREA AREF AREF CMDNOP NOP NOP
t
RP
t
RFC
t
RFC
CKE has to be kept "High" level for Auto-Refresh cycle.
10.24 Active Power Down Mode Entry and Exit Timing
CMD
CLK
CLK
NOP CMDNOP
ExitEntry
NOP NOP
t
IH
t
IS
t
CK
t
IH
t
IS
CKE
10.25 Precharged Power Down Mode Entry and Exit Timing
CMD
CLK
CLK
NOP CMDNOP
ExitEntry
NOP NOP
t
IH
t
IS
t
CK
t
IH
t
IS
CKE
W942516CH
Publication Release Date: May 20, 2003
- 45 - Revision A2
Timing Waveforms, continued
10.26 Self Refresh Entry and Exit Timing
CMD
CLK
CLK
t
IH
t
IS
t
CK
t
IH
t
IS
SELF CMDSELFX NOPNOPPREA
ExitEntry
CKE
t
RP
t
XSRD
NOPSELF
t
XSNR
SELFX NOP ACT READ NOP
Exit
Entry
W942516CH
- 46 -
11. PACKAGE DIMENSION
TSOP 66l – 400 mil
W942516CH
Publication Release Date: May 20, 2003
- 47 - Revision A2
12. REVISION HISTORY
REVISION DATE PAGE DESCRIPTION
Aug. 28, 2002 - Preliminary datasheet
Jan. 9, 2003 28 Add CAS Latency = 3 option
A1
Feb. 14, 2003 - Modified AC timing spec.
A2 May 20, 2003 Add CL2.5 optional in DDR400
Headquarters
No. 4, Creation Rd. III,
Science-Based Industrial Park,
Hsinchu, Taiwan
TEL: 886-3-5770066
FAX: 886-3-5665577
http://www.winbond.com.tw/
Taipei Office
TEL: 886-2-8177-7168
FAX: 886-2-8751-3579
Winbond Electronics Corporation America
2727 North First Street, San Jose,
CA 95134, U.S.A.
TEL: 1-408-9436666
FAX: 1-408-5441798
Winbond Electronics (H.K.) Ltd.
No. 378 Kwun Tong Rd.,
Kowloon, Hong Kong
FAX: 852-27552064
Unit 9-15, 22F, Millennium City,
TEL: 852-27513100
Please note that all data and specifications are subject to change without notice.
All the trade marks of products and companies mentioned in this data sheet belong to their respective owners.
Winbond Electronics (Shanghai) Ltd.
200336 China
FAX: 86-21-62365998
27F, 2299 Yan An W. Rd. Shanghai,
TEL: 86-21-62365999
Winbond Electronics Corporation Japan
Shinyokohama Kohoku-ku,
Yokohama, 222-0033
FAX: 81-45-4781800
7F Daini-ueno BLDG, 3-7-18
TEL: 81-45-4781881
9F, No.480, Rueiguang Rd.,
Neihu District, Taipei, 114,
Taiwan, R.O.C.
