ABB Switzerland Ltd, Semiconductors reserves the right to change specifications without notice.
VCE
=
1200
V
IC
=
100
A
Die size: 11.9 x 11.2 mm
Doc. No. 5SYA 1319-02 Dez 12
Maximum rated values 1)
Parameter
Symbol
Conditions
min
max
Unit
Collector-emitter voltage
VCES
VGE = 0 V, Tvj 25 °C
1200
V
DC collector current
IC
100
A
Peak collector current
ICM
Limited by Tvjmax
200
A
Gate-emitter voltage
VGES
-20
20
V
IGBT short circuit SOA
tpsc
VCC = 900 V, VCEM 1200 V
VGE 15 V, Tvj 125 °C
10
µs
Junction temperature
Tvj
175
°C
Tvj(op)
-40
150
1) Maximum rated values indicate limits beyond which damage to the device may occur per IEC 60747 - 9
IGBT-Die
5SMY 12K1280
5SMY 12K1280
ABB Switzerland Ltd, Semiconductors reserves the right to change specifications without notice.
Doc. No. 5SYA 1319-02 Dez 12 page 2 of 6
IGBT characteristic values 2)
Parameter
Symbol
Conditions
min
typ
max
Unit
Collector (-emitter)
breakdown voltage
V(BR)CES
VGE = 0 V, IC = 1 mA, Tvj = 25 °C
1200
V
Collector-emitter
saturation voltage
VCE sat
IC = 100 A, VGE = 15 V
Tvj = 25 °C
1.9
V
Tvj = 125 °C
2.1
V
Collector cut-off current
ICES
VCE = 1200 V, VGE = 0 V
Tvj = 25 °C
100
µA
Tvj = 125 °C
110
µA
Gate leakage current
IGES
VCE = 0 V, VGE = 20 V, Tvj = 125 °C
-200
200
nA
Gate-emitter threshold voltage
VGE(TO)
IC = 4 mA, VCE = VGE, Tvj = 25 °C
5
7
V
Gate charge
Qge
IC = 100 A, VCE = 600 V, VGE = -15 ..15 V
1120
nC
Input capacitance
Cies
VCE = 25 V, VGE = 0 V, f = 1 MHz,
Tvj = 25 °C
7.43
nF
Output capacitance
Coes
0.52
Reverse transfer capacitance
Cres
0.34
Internal gate resistance
RGint
2
Turn-on delay time
td(on)
VCC = 600 V, IC = 100 A,
VGE = ±15 V, RG = 10,
L = 60 nH,
inductive load
Tvj = 25 °C
135
ns
Tvj = 125 °C
150
Rise time
tr
Tvj = 25 °C
65
ns
Tvj = 125 °C
65
Turn-off delay time
td(off)
VCC = 600 V, IC = 100 A,
VGE = ±15 V, RG = 10,
L = 60 nH,
inductive load
Tvj = 25 °C
420
ns
Tvj = 125 °C
490
Fall time
tf
Tvj = 25 °C
55
ns
Tvj = 125 °C
75
Turn-on switching energy
Eon
VCC = 600 V, IC = 100 A,
VGE = ±15 V, RG = 10,
L = 60 nH,
inductive load
FWD: 5SLY 12G1200
Tvj = 25 °C
10.5
mJ
Tvj = 125 °C
14.4
Turn-off switching energy
Eoff
VCC = 600 V, IC = 100 A,
VGE = ±15 V, RG = 10,
L = 60 nH,
inductive load
Tvj = 25 °C
6.3
mJ
Tvj = 125 °C
10.5
Short circuit current
ISC
tpsc ≤ 10 μs, VGE = 15 V, Tvj = 125 °C,
VCC = 900 V, VCEM ≤ 1200 V
470
A
2) Characteristic values according to IEC 60747 - 9
5SMY 12K1280
ABB Switzerland Ltd, Semiconductors reserves the right to change specifications without notice.
Doc. No. 5SYA 1319-02 Dez 12 page 3 of 6
Mechanical properties
Parameter
Unit
Dimensions
Overall die
L x W
11.9 x 11.2
mm
exposed
front metal
L x W (except gate pad)
10.4 x 9.7
mm
gate pad
L x W
1.12 x 1.14
mm
thickness
140 ± 20
µm
Metallization 3)
front (E)
AlSi1
4
µm
back (C)
Al / Ti / Ni / Ag
1.2
µm
3) For assembly instructions refer to : IGBT and Diode chips from ABB Switzerland Ltd, Semiconductors, Doc. No. 5SYA 2033.
Outline drawing
G
Emitter
9.67
10.37
1.32
1.31
0.23
1.14±0.05
1.12±0.05
0.24
11.89±0.05
11.19±0.05
Note: all dimensions are shown in mm
This is an electrostatic sensitive device, please observe the international standard IEC 60747-1, Chap. IX.
This product has been designed and qualified for Industrial Level.
5SMY 12K1280
ABB Switzerland Ltd, Semiconductors reserves the right to change specifications without notice.
Doc. No. 5SYA 1319-02 Dez 12 page 4 of 6
0
25
50
75
100
125
150
175
200
0 1 2 3 4
VCE [V]
IC [A]
25 °C
125 °C
VGE = 15 V
0
25
50
75
100
125
150
175
200
012345678910 11 12 13 14
VGE [V]
IC [A]
25 °C
125 °C
VCE = 20 V
Fig. 1
Typical on-state characteristics
Fig. 2
Typical transfer characteristics
0
25
50
75
100
050 100 150 200 250 300
IC [A]
Eon, Eoff [mJ]
Eon
Eoff
VCC = 600 V
RG = 10 ohm
VGE = ±15 V
Tvj = 125 °C
Lσ = 60 nH
0
5
10
15
20
25
30
35
40
010 20 30 40 50 60 70
RG [ohm]
Eon, Eoff [mJ]
VCC = 600 V
IC = 100 A
VGE = ±15 V
Tvj = 125 °C
Lσ = 60 nH
Eon
Eoff
Fig. 3
Typical switching characteristics vs
collector current
Fig. 4
Typical switching characteristics vs
gate resistor
5SMY 12M1280
ABB Semiconductors AG reserves the right to change specifications without notice.
Doc. No. 5SYA 1319-02 Dez 12
5 of 6
0
5
10
15
20
0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1
Qg [µC]
VGE [V]
VCC = 600 V
VCC = 900 V
IC = 100 A
Tvj = 25 °C
0.1
1
10
0 5 10 15 20 25 30 35
Vce[V]
C [nF]
VGE = 0 V
fOSC = 1 MHz
VOSC = 50 mV
Cies
Coes
Cres
Fig. 5
Typical gate charge characteristics
Fig. 6
Typical capacitances vs
collector-emitter voltage
0.0
0.5
1.0
1.5
2.0
2.5
0500 1000 1500
VCE [V]
ICpulse
/ IC
VCC £ 1000 V, Tvj(op) = 150 °C
VGE = ±15 V, RG = 10 ohm
Fig. 7
Safe operating area (RBSOA)
5SMY 12M1280
ABB Switzerland Ltd, Semiconductors reserves the right to change specifications without notice.
ABB Switzerland Ltd Doc. No. 5SYA 1319-02 Dez 12
Semiconductors
Fabrikstrasse 3
CH-5600 Lenzburg, Switzerland
Telephone +41 (0)58 586 1419
Fax +41 (0)58 586 1306
Email abbsem@ch.abb.com
Internet www.abb.com/semiconductors
This is an electrostatic sensitive device, please observe the international standard IEC 60747-1, chap. IX.
This product has been designed and qualified for Industrial Level.
Related documents:
5SYA 2045 Thermal runaway during blocking
5SYA 2059 Applying IGBT and Diode dies
5SYA 2093-00 Thermal design of IGBT Modules
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