ESP32-WROOM-32
Datasheet
Version 2.8
Espressif Systems
Copyright © 2019
www.espressif.com
About This Document
This document provides the specifications for the ESP32-WROOM-32 module.
Revision History
For revision history of this document, please refer to the last page.
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All liability, including liability for infringement of any proprietary rights, relating to use of information in this docu-
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are granted herein. The Wi-Fi Alliance Member logo is a trademark of the Wi-Fi Alliance. The Bluetooth logo is a
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Copyright © 2019 Espressif Inc. All rights reserved.
Contents
1 Overview 1
2 Pin Definitions 3
2.1 Pin Layout 3
2.2 Pin Description 3
2.3 Strapping Pins 4
3 Functional Description 6
3.1 CPU and Internal Memory 6
3.2 External Flash and SRAM 6
3.3 Crystal Oscillators 6
3.4 RTC and Low-Power Management 7
4 Peripherals and Sensors 8
5 Electrical Characteristics 9
5.1 Absolute Maximum Ratings 9
5.2 Recommended Operating Conditions 9
5.3 DC Characteristics (3.3 V, 25 °C) 9
5.4 Wi-Fi Radio 10
5.5 BLE Radio 11
5.5.1 Receiver 11
5.5.2 Transmitter 11
5.6 Reflow Profile 12
6 Schematics 13
7 Peripheral Schematics 14
8 Physical Dimensions 16
9 Recommended PCB Land Pattern 17
10Learning Resources 18
10.1 Must-Read Documents 18
10.2 Must-Have Resources 18
Revision History 19
List of Tables
1 ESP32-WROOM-32 Specifications 1
2 Pin Definitions 3
3 Strapping Pins 5
4 Absolute Maximum Ratings 9
5 Recommended Operating Conditions 9
6 DC Characteristics (3.3 V, 25 °C) 9
7 Wi-Fi Radio Characteristics 10
8 Receiver Characteristics – BLE 11
9 Transmitter Characteristics – BLE 11
List of Figures
1 ESP32-WROOM-32 Pin Layout (Top View) 3
2 Reflow Profile 12
3 ESP32-WROOM-32 Schematics 13
4 ESP32-WROOM-32 Peripheral Schematics 14
5 Discharge Circuit for VDD33 Rail 14
6 Reset Circuit 15
7 Physical Dimensions of ESP32-WROOM-32 16
8 Recommended PCB Land Pattern 17
1. Overview
1. Overview
ESP32-WROOM-32 is a powerful, generic Wi-Fi+BT+BLE MCU module that targets a wide variety of applications,
ranging from low-power sensor networks to the most demanding tasks, such as voice encoding, music streaming
and MP3 decoding.
At the core of this module is the ESP32-D0WDQ6 chip*. The chip embedded is designed to be scalable and
adaptive. There are two CPU cores that can be individually controlled, and the CPU clock frequency is adjustable
from 80 MHz to 240 MHz. The user may also power off the CPU and make use of the low-power co-processor to
constantly monitor the peripherals for changes or crossing of thresholds. ESP32 integrates a rich set of peripherals,
ranging from capacitive touch sensors, Hall sensors, SD card interface, Ethernet, high-speed SPI, UART, I²S and
I²C.
Note:
* For details on the part numbers of the ESP32 family of chips, please refer to the document ESP32 Datasheet.
The integration of Bluetooth, Bluetooth LE and Wi-Fi ensures that a wide range of applications can be targeted,
and that the module is all-around: using Wi-Fi allows a large physical range and direct connection to the Internet
through a Wi-Fi router, while using Bluetooth allows the user to conveniently connect to the phone or broadcast
low energy beacons for its detection. The sleep current of the ESP32 chip is less than 5 µA, making it suitable
for battery powered and wearable electronics applications. The module supports a data rate of up to 150 Mbps,
and 20 dBm output power at the antenna to ensure the widest physical range. As such the module does offer
industry-leading specifications and the best performance for electronic integration, range, power consumption,
and connectivity.
The operating system chosen for ESP32 is freeRTOS with LwIP; TLS 1.2 with hardware acceleration is built in as
well. Secure (encrypted) over the air (OTA) upgrade is also supported, so that users can upgrade their products
even after their release, at minimum cost and effort.
Table 1provides the specifications of ESP32-WROOM-32.
Table 1: ESP32-WROOM-32 Specifications
Categories Items Specifications
Certification
RF certification FCC/CE-RED/IC/TELEC/KCC/SRRC/NCC
Wi-Fi certification Wi-Fi Alliance
Bluetooth certification BQB
Green certification RoHS/REACH
Test Reliablity HTOL/HTSL/uHAST/TCT/ESD
Wi-Fi Protocols
802.11 b/g/n (802.11n up to 150 Mbps)
A-MPDU and A-MSDU aggregation and 0.4 µs guard interval
support
Frequency range 2.4 GHz ~2.5 GHz
Bluetooth
Protocols Bluetooth v4.2 BR/EDR and BLE specification
Radio
NZIF receiver with –97 dBm sensitivity
Class-1, class-2 and class-3 transmitter
AFH
Espressif Systems 1 ESP32-WROOM-32 Datasheet V2.8
1. Overview
Categories Items Specifications
Audio CVSD and SBC
Hardware
Module interfaces SD card, UART, SPI, SDIO, I2C, LED PWM, Motor PWM, I2S,
IR, pulse counter, GPIO, capacitive touch sensor, ADC, DAC
On-chip sensor Hall sensor
Integrated crystal 40 MHz crystal
Integrated SPI flash 4 MB
Operating voltage/Power supply 2.7 V ~3.6 V
Operating current Average: 80 mA
Minimum current delivered by
power supply 500 mA
Recommended operating tem-
perature range –40 °C ~+85 °C
Package size (18.00±0.10) mm × (25.50±0.10) mm × (3.10±0.10) mm
Espressif Systems 2 ESP32-WROOM-32 Datasheet V2.8
2. Pin Definitions
2. Pin Definitions
2.1 Pin Layout
Keepout Zone
GND
IO23
IO22
TXD0
RXD0
IO21
NC
IO19
IO18
IO5
IO17
IO16
IO4
IO0
38
37
36
35
34
33
32
31
30
29
28
27
26
25
24
23
22
21
20
19
18
17
16
15
IO2
IO15
SD1
SD0
CLK
CMD
SD3
SD2
IO13
GND
1
2
3
4
5
6
7
8
9
10
11
12
13
14
GND
3V3
EN
SENSOR_VP
SENSOR_VN
IO34
IO35
IO32
IO33
IO25
IO26
IO27
IO14
IO12
39 GND
Figure 1: ESP32-WROOM-32 Pin Layout (Top View)
2.2 Pin Description
ESP32-WROOM-32 has 38 pins. See pin definitions in Table 2.
Table 2: Pin Definitions
Name No. Type Function
GND 1 P Ground
3V3 2 P Power supply
EN 3 I Module-enable signal. Active high.
SENSOR_VP 4 I GPIO36, ADC1_CH0, RTC_GPIO0
SENSOR_VN 5 I GPIO39, ADC1_CH3, RTC_GPIO3
IO34 6 I GPIO34, ADC1_CH6, RTC_GPIO4
IO35 7 I GPIO35, ADC1_CH7, RTC_GPIO5
IO32 8 I/O GPIO32, XTAL_32K_P (32.768 kHz crystal oscillator input), ADC1_CH4,
TOUCH9, RTC_GPIO9
IO33 9 I/O GPIO33, XTAL_32K_N (32.768 kHz crystal oscillator output), ADC1_CH5,
TOUCH8, RTC_GPIO8
Espressif Systems 3 ESP32-WROOM-32 Datasheet V2.8
2. Pin Definitions
Name No. Type Function
IO25 10 I/O GPIO25, DAC_1, ADC2_CH8, RTC_GPIO6, EMAC_RXD0
IO26 11 I/O GPIO26, DAC_2, ADC2_CH9, RTC_GPIO7, EMAC_RXD1
IO27 12 I/O GPIO27, ADC2_CH7, TOUCH7, RTC_GPIO17, EMAC_RX_DV
IO14 13 I/O GPIO14, ADC2_CH6, TOUCH6, RTC_GPIO16, MTMS, HSPICLK, HS2_CLK,
SD_CLK, EMAC_TXD2
IO12 14 I/O GPIO12, ADC2_CH5, TOUCH5, RTC_GPIO15, MTDI, HSPIQ, HS2_DATA2,
SD_DATA2, EMAC_TXD3
GND 15 P Ground
IO13 16 I/O GPIO13, ADC2_CH4, TOUCH4, RTC_GPIO14, MTCK, HSPID, HS2_DATA3,
SD_DATA3, EMAC_RX_ER
SHD/SD2* 17 I/O GPIO9, SD_DATA2, SPIHD, HS1_DATA2, U1RXD
SWP/SD3* 18 I/O GPIO10, SD_DATA3, SPIWP, HS1_DATA3, U1TXD
SCS/CMD* 19 I/O GPIO11, SD_CMD, SPICS0, HS1_CMD, U1RTS
SCK/CLK* 20 I/O GPIO6, SD_CLK, SPICLK, HS1_CLK, U1CTS
SDO/SD0* 21 I/O GPIO7, SD_DATA0, SPIQ, HS1_DATA0, U2RTS
SDI/SD1* 22 I/O GPIO8, SD_DATA1, SPID, HS1_DATA1, U2CTS
IO15 23 I/O GPIO15, ADC2_CH3, TOUCH3, MTDO, HSPICS0, RTC_GPIO13, HS2_CMD,
SD_CMD, EMAC_RXD3
IO2 24 I/O GPIO2, ADC2_CH2, TOUCH2, RTC_GPIO12, HSPIWP, HS2_DATA0,
SD_DATA0
IO0 25 I/O GPIO0, ADC2_CH1, TOUCH1, RTC_GPIO11, CLK_OUT1, EMAC_TX_CLK
IO4 26 I/O GPIO4, ADC2_CH0, TOUCH0, RTC_GPIO10, HSPIHD, HS2_DATA1,
SD_DATA1, EMAC_TX_ER
IO16 27 I/O GPIO16, HS1_DATA4, U2RXD, EMAC_CLK_OUT
IO17 28 I/O GPIO17, HS1_DATA5, U2TXD, EMAC_CLK_OUT_180
IO5 29 I/O GPIO5, VSPICS0, HS1_DATA6, EMAC_RX_CLK
IO18 30 I/O GPIO18, VSPICLK, HS1_DATA7
IO19 31 I/O GPIO19, VSPIQ, U0CTS, EMAC_TXD0
NC 32 - -
IO21 33 I/O GPIO21, VSPIHD, EMAC_TX_EN
RXD0 34 I/O GPIO3, U0RXD, CLK_OUT2
TXD0 35 I/O GPIO1, U0TXD, CLK_OUT3, EMAC_RXD2
IO22 36 I/O GPIO22, VSPIWP, U0RTS, EMAC_TXD1
IO23 37 I/O GPIO23, VSPID, HS1_STROBE
GND 38 P Ground
Notice:
* Pins SCK/CLK, SDO/SD0, SDI/SD1, SHD/SD2, SWP/SD3 and SCS/CMD, namely, GPIO6 to GPIO11 are connected
to the integrated SPI flash integrated on the module and are not recommended for other uses.
2.3 Strapping Pins
ESP32 has five strapping pins, which can be seen in Chapter 6Schematics:
Espressif Systems 4 ESP32-WROOM-32 Datasheet V2.8
2. Pin Definitions
• MTDI
• GPIO0
• GPIO2
• MTDO
• GPIO5
Software can read the values of these five bits from register ”GPIO_STRAPPING”.
During the chip’s system reset release (power-on-reset, RTC watchdog reset and brownout reset), the latches
of the strapping pins sample the voltage level as strapping bits of ”0” or ”1”, and hold these bits until the chip
is powered down or shut down. The strapping bits configure the device’s boot mode, the operating voltage of
VDD_SDIO and other initial system settings.
Each strapping pin is connected to its internal pull-up/pull-down during the chip reset. Consequently, if a strapping
pin is unconnected or the connected external circuit is high-impedance, the internal weak pull-up/pull-down will
determine the default input level of the strapping pins.
To change the strapping bit values, users can apply the external pull-down/pull-up resistances, or use the host
MCU’s GPIOs to control the voltage level of these pins when powering on ESP32.
After reset release, the strapping pins work as normal-function pins.
Refer to Table 3for a detailed boot-mode configuration by strapping pins.
Table 3: Strapping Pins
Voltage of Internal LDO (VDD_SDIO)
Pin Default 3.3 V 1.8 V
MTDI Pull-down 0 1
Booting Mode
Pin Default SPI Boot Download Boot
GPIO0 Pull-up 1 0
GPIO2 Pull-down Don’t-care 0
Enabling/Disabling Debugging Log Print over U0TXD During Booting
Pin Default U0TXD Active U0TXD Silent
MTDO Pull-up 1 0
Timing of SDIO Slave
Pin Default Falling-edge Sampling
Falling-edge Output
Falling-edge Sampling
Rising-edge Output
Rising-edge Sampling
Falling-edge Output
Rising-edge Sampling
Rising-edge Output
MTDO Pull-up 0 0 1 1
GPIO5 Pull-up 0 1 0 1
Note:
• Firmware can configure register bits to change the settings of ”Voltage of Internal LDO (VDD_SDIO)” and ”Timing
of SDIO Slave” after booting.
• The module integrates a 3.3 V SPI flash, so the pin MTDI cannot be set to 1 when the module is powered up.
Espressif Systems 5 ESP32-WROOM-32 Datasheet V2.8
3. Functional Description
3. Functional Description
This chapter describes the modules and functions integrated in ESP32-WROOM-32.
3.1 CPU and Internal Memory
ESP32-D0WDQ6 contains two low-power Xtensa®32-bit LX6 microprocessors. The internal memory includes:
• 448 KB of ROM for booting and core functions.
• 520 KB of on-chip SRAM for data and instructions.
• 8 KB of SRAM in RTC, which is called RTC FAST Memory and can be used for data storage; it is accessed
by the main CPU during RTC Boot from the Deep-sleep mode.
• 8 KB of SRAM in RTC, which is called RTC SLOW Memory and can be accessed by the co-processor during
the Deep-sleep mode.
• 1 Kbit of eFuse: 256 bits are used for the system (MAC address and chip configuration) and the remaining
768 bits are reserved for customer applications, including flash-encryption and chip-ID.
3.2 External Flash and SRAM
ESP32 supports multiple external QSPI flash and SRAM chips. More details can be found in Chapter SPI in the
ESP32 Technical Reference Manual. ESP32 also supports hardware encryption/decryption based on AES to pro-
tect developers’ programs and data in flash.
ESP32 can access the external QSPI flash and SRAM through high-speed caches.
• The external flash can be mapped into CPU instruction memory space and read-only memory space simul-
taneously.
–When external flash is mapped into CPU instruction memory space, up to 11 MB + 248 KB can be
mapped at a time. Note that if more than 3 MB + 248 KB are mapped, cache performance will be
reduced due to speculative reads by the CPU.
–When external flash is mapped into read-only data memory space, up to 4 MB can be mapped at a
time. 8-bit, 16-bit and 32-bit reads are supported.
• External SRAM can be mapped into CPU data memory space. Up to 4 MB can be mapped at a time. 8-bit,
16-bit and 32-bit reads and writes are supported.
ESP32-WROOM-32 integrates a 4 MB SPI flash, which is connected to GPIO6, GPIO7, GPIO8, GPIO9, GPIO10
and GPIO11. These six pins cannot be used as regular GPIOs.
3.3 Crystal Oscillators
The module uses a 40-MHz crystal oscillator.
Espressif Systems 6 ESP32-WROOM-32 Datasheet V2.8
3. Functional Description
3.4 RTC and Low-Power Management
With the use of advanced power-management technologies, ESP32 can switch between different power modes.
For details on ESP32’s power consumption in different power modes, please refer to section ”RTC and Low-Power
Management” in ESP32 Datasheet.
Espressif Systems 7 ESP32-WROOM-32 Datasheet V2.8
4. Peripherals and Sensors
4. Peripherals and Sensors
Please refer to Section Peripherals and Sensors in ESP32 Datasheet.
Note:
External connections can be made to any GPIO except for GPIOs in the range 6-11. These six GPIOs are connected to
the module’s integrated SPI flash. For details, please see Section 6Schematics.
Espressif Systems 8 ESP32-WROOM-32 Datasheet V2.8
5. Electrical Characteristics
5. Electrical Characteristics
5.1 Absolute Maximum Ratings
Stresses beyond the absolute maximum ratings listed in Table 4below may cause permanent damage to the
device. These are stress ratings only, and do not refer to the functional operation of the device that should follow
the recommended operating conditions.
Table 4: Absolute Maximum Ratings
Symbol Parameter Min Max Unit
VDD33 Power supply voltage –0.3 3.6 V
Ioutput
1Cumulative IO output current - 1,100 mA
Tstore Storage temperature –40 150 °C
1. The module worked properly after a 24-hour test in ambient temperature at 25 °C, and the IOs in three domains
(VDD3P3_RTC, VDD3P3_CPU, VDD_SDIO) output high logic level to ground. Please note that pins occupied by flash
and/or PSRAM in the VDD_SDIO power domain were excluded from the test.
2. Please see Appendix IO_MUX of ESP32 Datasheet for IO’s power domain.
5.2 Recommended Operating Conditions
Table 5: Recommended Operating Conditions
Symbol Parameter Min Typical Max Unit
VDD33 Power supply voltage 2.7 3.3 3.6 V
IV DD Current delivered by external power supply 0.5 - - A
T Operating temperature –40 - 85 °C
5.3 DC Characteristics (3.3 V, 25 °C)
Table 6: DC Characteristics (3.3 V, 25 °C)
Symbol Parameter Min Typ Max Unit
CIN Pin capacitance - 2 - pF
VIH High-level input voltage 0.75×VDD1- VDD1+0.3 V
VIL Low-level input voltage –0.3 - 0.25×VDD1V
IIH High-level input current - - 50 nA
IIL Low-level input current - - 50 nA
VOH High-level output voltage 0.8×VDD1- - V
VOL Low-level output voltage - - 0.1×VDD1V
IOH
High-level source current VDD3P3_CPU power domain 1,2- 40 - mA
(VDD1= 3.3 V, VOH >= 2.64 V, VDD3P3_RTC power domain 1,2- 40 - mA
output drive strength set to the
maximum) VDD_SDIO power domain 1,3- 20 - mA
Espressif Systems 9 ESP32-WROOM-32 Datasheet V2.8
5. Electrical Characteristics
Symbol Parameter Min Typ Max Unit
IOL
Low-level sink current
(VDD1= 3.3 V, VOL = 0.495 V,
output drive strength set to the maximum)
- 28 - mA
RP U Resistance of internal pull-up resistor - 45 - kΩ
RP D Resistance of internal pull-down resistor - 45 - kΩ
VIL_nRST Low-level input voltage of CHIP_PU to power off the chip - - 0.6 V
Notes:
1. Please see Appendix IO_MUX of ESP32 Datasheet for IO’s power domain. VDD is the I/O voltage for a particular power
domain of pins.
2. For VDD3P3_CPU and VDD3P3_RTC power domain, per-pin current sourced in the same domain is gradually reduced
from around 40 mA to around 29 mA, VOH >=2.64 V, as the number of current-source pins increases.
3. Pins occupied by flash and/or PSRAM in the VDD_SDIO power domain were excluded from the test.
5.4 Wi-Fi Radio
Table 7: Wi-Fi Radio Characteristics
Parameter Condition Min Typical Max Unit
Input frequency - 2412 - 2484 MHz
Output impedance* - - * - Ω
TX power 11n, MCS7 12 13 14 dBm
11b mode 17.5 18.5 20 dBm
Sensitivity 11b, 1 Mbps - –98 - dBm
11b, 11 Mbps - –89 - dBm
11g, 6 Mbps - –92 - dBm
11g, 54 Mbps - –74 - dBm
11n, HT20, MCS0 - –91 - dBm
11n, HT20, MCS7 - –71 - dBm
11n, HT40, MCS0 - –89 - dBm
11n, HT40, MCS7 - –69 - dBm
Adjacent channel rejection 11g, 6 Mbps - 31 - dB
11g, 54 Mbps - 14 - dB
11n, HT20, MCS0 - 31 - dB
11n, HT20, MCS7 - 13 - dB
∗For the modules that use IPEX antennas, the output impedance is 50 Ω. For other modules without IPEX antennas, users do
not need to concern about the output impedance.
Espressif Systems 10 ESP32-WROOM-32 Datasheet V2.8
5. Electrical Characteristics
5.5 BLE Radio
5.5.1 Receiver
Table 8: Receiver Characteristics – BLE
Parameter Conditions Min Typ Max Unit
Sensitivity @30.8% PER - - –97 - dBm
Maximum received signal @30.8% PER - 0 - - dBm
Co-channel C/I - - +10 - dB
Adjacent channel selectivity C/I
F = F0 + 1 MHz - –5 - dB
F = F0 – 1 MHz - –5 - dB
F = F0 + 2 MHz - –25 - dB
F = F0 – 2 MHz - –35 - dB
F = F0 + 3 MHz - –25 - dB
F = F0 – 3 MHz - –45 - dB
Out-of-band blocking performance
30 MHz ~2000 MHz –10 - - dBm
2000 MHz ~2400 MHz –27 - - dBm
2500 MHz ~3000 MHz –27 - - dBm
3000 MHz ~12.5 GHz –10 - - dBm
Intermodulation - –36 - - dBm
5.5.2 Transmitter
Table 9: Transmitter Characteristics – BLE
Parameter Conditions Min Typ Max Unit
RF transmit power - - 0 - dBm
Gain control step - - 3 - dBm
RF power control range - –12 - +9 dBm
Adjacent channel transmit power
F = F0 ± 2 MHz - –52 - dBm
F = F0 ± 3 MHz - –58 - dBm
F = F0 ± > 3 MHz - –60 - dBm
∆f1avg - - - 265 kHz
∆f2max - 247 - - kHz
∆f2avg/∆f1avg - - –0.92 - -
ICFT - - –10 - kHz
Drift rate - - 0.7 - kHz/50 µs
Drift - - 2 - kHz
Espressif Systems 11 ESP32-WROOM-32 Datasheet V2.8
5. Electrical Characteristics
5.6 Reflow Profile
50 150
0
25
1 ~ 3℃/s
0
200
250
200
-1 ~ -5℃/s
Cooling zone
100
217
50
100 250
Reflow zone
!217℃ 60 ~ 90s
Temperature (℃)
Preheating zone
150 ~ 200℃ 60 ~ 120s
Ramp-up zone
Peak Temp.
235 ~ 250℃
Soldering time
> 30s
Time (sec.)
Ramp-up zone — Temp.: <150℃ Time: 60 ~ 90s Ramp-up rate: 1 ~ 3℃/s
Preheating zone — Temp.: 150 ~ 200℃ Time: 60 ~ 120s Ramp-up rate: 0.3 ~ 0.8℃/s
Reflow zone — Temp.: >217℃ 7LPH60 ~ 90s; Peak Temp.: 235 ~ 250℃ (<245℃ recommended) Time: 30 ~ 70s
Cooling zone — Peak Temp. ~ 180℃ Ramp-down rate: -1 ~ -5℃/s
Solder — Sn&Ag&Cu Lead-free solder (SAC305)
Figure 2: Reflow Profile
Espressif Systems 12 ESP32-WROOM-32 Datasheet V2.8
6. Schematics
6. Schematics
SDI/SD1
SDO/SD0
SCK/CLK
SCS/CMD
SWP/SD3
SHD/SD2
CHIP_PU
GPIO35
SCK/CLK
SCS/CMD
SHD/SD2 SWP/SD3
SDI/SD1
SDO/SD0
GPIO34
GPIO25
GPIO26
GPIO27
GPIO14
GPIO12
GPIO15
GPIO13
GPIO2
GPIO0
GPIO5
GPIO18
GPIO17
GPIO4
SENSOR_VP
SENSOR_VN
U0RXD
GPIO22
GPIO23
GPIO21
GPIO19
U0TXD
GPIO16GPIO32
SENSOR_VP
SENSOR_VN
GPIO32
GPIO33 GPIO18
U0TXD
U0RXD
GPIO22
GPIO21
GPIO19
GPIO23
CHIP_PU
GPIO34
GPIO35
GPIO25
GPIO26
GPIO27
GPIO14
GPIO12 GPIO0
GPIO4
GPIO16
GPIO5
GPIO17
GPIO13
SHD/SD2
SWP/SD3
SCS/CMD
SCK/CLK
SDO/SD0
SDI/SD1
GPIO15
GPIO2
GPIO33
GND
GND
GND
GND
GND
VDD33
GND
GND
GND
VDD_SDIO
GND
GND
VDD33
GND GND
GND
GNDGND GND
GND
GND
VDD33
GND
GND
VDD33
GNDGND
GND
GND
VDD33
VDD33
VDD_SDIO
Pin.39
GND
Pin.1
GND Pin.15
GND Pin.38
GND
Pin.2
3V3
Pin.3
CHIP_PU/EN
Pin.4
SENSOR_VP
Pin.5
SENSOR_VN
Pin.6
IO34
Pin.7
IO35
Pin.8
IO32
Pin.9
IO33
Pin.10
IO25
Pin.11
IO26
Pin.12
IO27
Pin.13
IO14
Pin.14
IO12
Pin.16
IO13
Pin.17
SD2
Pin.18
SD3
Pin.19
CMD
Pin.20
CLK
Pin.21
SD0
Pin.22
SD1
Pin.23
IO15
Pin.24
IO2
Pin.25
IO0
Pin.26
IO4
Pin.27
IO16
Pin.28
IO17
Pin.29
IO5
Pin.30
IO18
Pin.31
IO19
Pin.32
NC
Pin.33
IO21
Pin.34
RXD0
Pin.35
TXD0
Pin.36
IO22
Pin.37
IO23
The values of C14, L4 and C15
vary with the actual
selection of a PCB board.
The values of C1 and C2 vary with
the selection of a crystal.
C13
10uF
U1
40MHz+/-10ppm
XIN
1
GND
2XOUT 3
GND 4
C4
0.1uF
C15
TBD
C1
22pF
C11
1uF
R1 20K(5%)
C10
0.1uF
C14 TBD
U3
FLASH
/CS
1
DO 2
/WP 3
GND
4
DI 5
CLK
6
/HOLD
7
VCC 8
D1
ESD3.3V88D-C
C19
0.1uF
C2
22pF
C20
1uF
ANT1
PCB ANT
1
2
C5
10nF/6.3V(10%)
C12
10uF
C18
1uF
C3
100pF
C17
270pF
C16
270pF
C9
0.1uF
U2ESP32-D0WDQ6
VDDA
1
LNA_IN
2
VDD3P3
3
VDD3P3
4
SENSOR_VP
5
SENSOR_CAPP
6
SENSOR_CAPN
7
SENSOR_VN
8
CHIP_PU
9
VDET_1
10
VDET_2
11
32K_XP
12
32K_XN
13
GPIO25
14
GPIO26
15
GPIO27
16
MTMS
17
MTDI
18
VDD3P3_RTC
19
MTCK
20
MTDO
21
GPIO2
22
GPIO0
23
GPIO4
24
VDD_SDIO 26
GPIO16 25
GPIO17 27
SD_DATA_2 28
SD_DATA_3 29
SD_CMD 30
SD_CLK 31
SD_DATA_0 32
GND 49
SD_DATA_1 33
GPIO5 34
GPIO18 35
GPIO19 38
CAP2 47
VDDA 43
XTAL_N 44
XTAL_P 45
GPIO23 36
U0TXD 41
GPIO22 39
GPIO21 42
VDD3P3_CPU 37
CAP1 48
VDDA 46
U0RXD 40
L4
TBD
C6
3.3nF/6.3V(10%)
Figure 3: ESP32-WROOM-32 Schematics
Espressif Systems 13 ESP32-WROOM-32 Datasheet V2.8
7. Peripheral Schematics
7. Peripheral Schematics
5
5
4
4
3
3
2
2
1
1
D D
C C
B B
A A
Espressif Systems
MTDI should be kept at a low electric level when powering up the module.
EN
TXD
RXD
IO0
MTMS
MTDI
MTCK
MTDO
IO23
IO22
IO21
IO19
IO18
IO5
IO4
IO2
SD2
SD3
CMD
CLK
SD0
SD1
SENSOR_VP
SENSOR_VN
IO34
IO35
IO32
IO33
IO25
IO26
IO27
IO17
IO16
VDD33
GND
VDD33
GND
GND
GND
GND
GND
GND
Title
Size Document Number Re v
Date: Sheet o f
<Doc> 1.0
Application of ESP32-WROOM-32
A4
1 1Thursday, June 21, 2018
Title
Size Document Number Re v
Date: Sheet o f
<Doc> 1.0
Application of ESP32-WROOM-32
A4
1 1Thursday, June 21, 2018
Title
Size Document Number Re v
Date: Sheet o f
<Doc> 1.0
Application of ESP32-WROOM-32
A4
1 1Thursday, June 21, 2018
R2 100R
R4 100R
C1 10uF
U2
JTAG
MTMS 1
MTDI 2
MTCK 3
MTDO 4
U1
GND1
1
3V3
2
EN
3
SENSOR_VP
4
SENSOR_VN
5
IO34
6
IO35
7
IO32
8
IO33
9
IO25
10
IO26
11
IO27
12
IO14
13
IO12
14
GND3 38
IO23 37
IO22 36
TXD0 35
RXD0 34
IO21 33
NC 32
IO19 31
IO18 30
IO5 29
IO17 28
IO16 27
IO4 26
IO0 25
GND2
15
IO13
16
SD2
17
SD3
18
CMD
19
CLK
20
SD0
21
SD1
22
IO15
23
IO2
24
P_GND 39
R1
10K
C3 0.1uF
J1
UART DOWNLOAD
1
2
3
R3 100R
R5 100R
C2 0.1uF
J2
BOOT OPTION
1
2
Figure 4: ESP32-WROOM-32 Peripheral Schematics
Note:
Soldering Pad 39 to the Ground of the base board is not necessary for a satisfactory thermal performance. If users do
want to solder it, they need to ensure that the correct quantity of soldering paste is applied.
VCC
GND
GND GND
VDD33
GND
ESP Module
Discharge Circuit CAP Added By User
Q1
R1
100K
D1SW1
1 2
R2
1K
+
C1
Bulk CAP
Figure 5: Discharge Circuit for VDD33 Rail
Note:
The discharge circuit can be applied in scenarios where ESP32 is powered on and off repeatedly by switching the
power rails, and there is a large capacitor on the VDD33 rail. For details, please refer to Section Power Scheme in
ESP32 Datasheet.
Espressif Systems 14 ESP32-WROOM-32 Datasheet V2.8
7. Peripheral Schematics
5
5
4
4
3
3
2
2
1
1
D D
C C
B B
A A
CHIP_PU
VBAT
GND
GND
Title
Size Document Number Re v
Date: Sheet o f
<Doc> V1
<ResetCirciut>
A4
1 1Thursday, May 31, 2018
Title
Size Document Number Re v
Date: Sheet o f
<Doc> V1
<ResetCirciut>
A4
1 1Thursday, May 31, 2018
Title
Size Document Number Re v
Date: Sheet o f
<Doc> V1
<ResetCirciut>
A4
1 1Thursday, May 31, 2018
R1 0R
R2
100K
U1
Power Supply Supervisor
GND 1
VCC
3
RESET# 2
Figure 6: Reset Circuit
Note:
When battery is used as the power supply for ESP32 series of chips and modules, a supply voltage supervisor is recom-
mended to avoid boot failure due to low voltage. Users are recommended to pull CHIP_PU low if the power supply for
ESP32 is below 2.3 V.
Espressif Systems 15 ESP32-WROOM-32 Datasheet V2.8
8. Physical Dimensions
8. Physical Dimensions
Figure 7: Physical Dimensions of ESP32-WROOM-32
Espressif Systems 16 ESP32-WROOM-32 Datasheet V2.8
9. Recommended PCB Land Pattern
9. Recommended PCB Land Pattern
25.5
18
1.27x13=16.51
1.27x9=11.432.785
1
2
6.3
17
7.49
2.785
5
5
0.9
1
15 24
38
Unit:mm
6.51
4
Figure 8: Recommended PCB Land Pattern
Espressif Systems 17 ESP32-WROOM-32 Datasheet V2.8
10. Learning Resources
10. Learning Resources
10.1 Must-Read Documents
The following link provides documents related to ESP32.
•ESP32 Datasheet
This document provides an introduction to the specifications of the ESP32 hardware, including overview, pin
definitions, functional description, peripheral interface, electrical characteristics, etc.
•ESP-IDF Programming Guide
It hosts extensive documentation for ESP-IDF ranging from hardware guides to API reference.
•ESP32 Technical Reference Manual
The manual provides detailed information on how to use the ESP32 memory and peripherals.
•ESP32 Hardware Resources
The zip files include the schematics, PCB layout, Gerber and BOM list of ESP32 modules and development
boards.
•ESP32 Hardware Design Guidelines
The guidelines outline recommended design practices when developing standalone or add-on systems
based on the ESP32 series of products, including the ESP32 chip, the ESP32 modules and development
boards.
•ESP32 AT Instruction Set and Examples
This document introduces the ESP32 AT commands, explains how to use them, and provides examples of
several common AT commands.
•Espressif Products Ordering Information
10.2 Must-Have Resources
Here are the ESP32-related must-have resources.
•ESP32 BBS
This is an Engineer-to-Engineer (E2E) Community for ESP32 where you can post questions, share knowledge,
explore ideas, and help solve problems with fellow engineers.
•ESP32 GitHub
ESP32 development projects are freely distributed under Espressif’s MIT license on GitHub. It is established
to help developers get started with ESP32 and foster innovation and the growth of general knowledge about
the hardware and software surrounding ESP32 devices.
•ESP32 Tools
This is a webpage where users can download ESP32 Flash Download Tools and the zip file ”ESP32 Certifi-
cation and Test”.
•ESP-IDF
This webpage links users to the official IoT development framework for ESP32.
•ESP32 Resources
This webpage provides the links to all available ESP32 documents, SDK and tools. �����������
Espressif Systems 18 ESP32-WROOM-32 Datasheet V2.8
Revision History
Revision History
Date Version Release notes
2019.01 V2.8 Changed the RF power control range in Table 9from –12 ~+12 to –12 ~+9 dBm.
2018.10 V2.7 Added ”Cumulative IO output current” entry to Table 4: Absolute Maximum Ratings;
Added more parameters to Table 6: DC Characteristics.
2018.08 V2.6
• Added reliability test items the module has passed in Table 1: ESP32-
WROOM-32 Specifications, and removed software-specific information;
• Updated section 3.4: RTC and Low-Power Management;
• Changed the module’s dimensions from (18±0.2) mm x (25.5 ±0.2) mm x
(3.1±0.15) mm to (18.00±0.10) mm x (25.50±0.10) mm x (3.10±0.10) mm;
• Updated Figure 8: Physical Dimensions;
• Updated Table 7: Wi-Fi Radio.
2018.06 V2.5
• Changed the module name to ESP32-WROOM-32;
• Deleted Temperature Sensor in Table 1: ESP32-WROOM-32 Specifications;
• Updated Chapter 3: Functional Description;
• Added Chapter 8: Recommended PCB Land Pattern;
Changes to electrical characteristics:
• Updated Table 4: Absolute Maximum Ratings;
• Added Table 5: Recommended Operating Conditions;
• Added Table 6: DC Characteristics;
• Updated the values of ”Gain control step”, ”Adjacent channel transmit power”
in Table 9: Transmitter Characteristics - BLE.
2018.03 V2.4 Updated Table 1in Chapter 1.
2018.01 V2.3
Deleted information on LNA pre-amplifier;
Updated section 3.4 RTC and Low-Power Management;
Added reset circuit in Chapter 7and a note to it.
2017.10 V2.2
Updated the description of the chip’s system reset in Section 2.3 Strapping Pins;
Deleted ”Association sleep pattern” in Table “Power Consumption by Power Modes”
and added notes to Active sleep and Modem-sleep;
Updated the note to Figure 4Peripheral Schematics;
Added discharge circuit for VDD33 rail in Chapter 7and a note to it.
2017.09 V2.1 Updated operating voltage/power supply range updated to 2.7 ~3.6V;
Updated Chapter 7.
2017.08 V2.0
Changed the sensitivity of NZIF receiver to -97 dBm in Table 1;
Updated the dimensions of the module;
Updated Table “Power Consumption by Power Modes” Power Consumption by
Power Modes, and added two notes to it;
Updated Table 4,7,8,9;
Added Chapter 8;
Added the link to certification download.
2017.06 V1.9
Added a note to Section 2.1 Pin Layout;
Updated Section 3.3 Crystal Oscillators;
Updated Figure 3ESP-WROOM-32 Schematics;
Espressif Systems 19 ESP32-WROOM-32 Datasheet V2.8
Revision History
Date Version Release notes
Added Documentation Change Notification.
2017.05 V1.8 Updated Figure 1Top and Side View of ESP32-WROOM-32 (ESP-WROOM-32).
2017.04 V1.7
Added the module’s dimensional tolerance;
Changed the input impedance value of 50Ωin Table 7Wi-Fi Radio Characteristics
to output impedance value of 30+j10 Ω.
2017.04 V1.6 Added Figure 2Reflow Profile.
2017.03 V1.5
Updated Section 2.2 Pin Description;
Updated Section 3.2 External Flash and SRAM;
Updated Section 4Peripherals and Sensors Description.
2017.03 V1.4
Updated Chapter 1Preface;
Updated Chapter 2Pin Definitions;
Updated Chapter 3Functional Description;
Updated Table Recommended Operating Conditions;
Updated Table 7Wi-Fi Radio Characteristics;
Updated Section 5.6 Reflow Profile;
Added Chapter 10 Learning Resources.
2016.12 V1.3 Updated Section 2.1 Pin Layout.
2016.11 V1.2 Added Figure 7Peripheral Schematics.
2016.11 V1.1 Updated Chapter 6Schematics.
2016.08 V1.0 First release.
Espressif Systems 20 ESP32-WROOM-32 Datasheet V2.8