ESP32-WROOM-32 Datasheet Version 2.8 Espressif Systems Copyright (c) 2019 www.espressif.com About This Document This document provides the specifications for the ESP32-WROOM-32 module. Revision History For revision history of this document, please refer to the last page. Documentation Change Notification Espressif provides email notifications to keep customers updated on changes to technical documentation. Please subscribe at www.espressif.com/en/subscribe. Certification Download certificates for Espressif products from www.espressif.com/en/certificates. Disclaimer and Copyright Notice Information in this document, including URL references, is subject to change without notice. THIS DOCUMENT IS PROVIDED AS IS WITH NO WARRANTIES WHATSOEVER, INCLUDING ANY WARRANTY OF MERCHANTABILITY, NON-INFRINGEMENT, FITNESS FOR ANY PARTICULAR PURPOSE, OR ANY WARRANTY OTHERWISE ARISING OUT OF ANY PROPOSAL, SPECIFICATION OR SAMPLE. All liability, including liability for infringement of any proprietary rights, relating to use of information in this document is disclaimed. No licenses express or implied, by estoppel or otherwise, to any intellectual property rights are granted herein. The Wi-Fi Alliance Member logo is a trademark of the Wi-Fi Alliance. The Bluetooth logo is a registered trademark of Bluetooth SIG. All trade names, trademarks and registered trademarks mentioned in this document are property of their respective owners, and are hereby acknowledged. Copyright (c) 2019 Espressif Inc. All rights reserved. Contents 1 Overview 1 2 Pin Definitions 3 2.1 Pin Layout 3 2.2 Pin Description 3 2.3 Strapping Pins 4 3 Functional Description 6 3.1 CPU and Internal Memory 6 3.2 External Flash and SRAM 6 3.3 Crystal Oscillators 6 3.4 RTC and Low-Power Management 7 4 Peripherals and Sensors 8 5 Electrical Characteristics 9 5.1 Absolute Maximum Ratings 9 5.2 Recommended Operating Conditions 9 5.3 DC Characteristics (3.3 V, 25 C) 9 5.4 Wi-Fi Radio 10 5.5 BLE Radio 11 5.6 5.5.1 Receiver 11 5.5.2 Transmitter 11 Reflow Profile 12 6 Schematics 13 7 Peripheral Schematics 14 8 Physical Dimensions 16 9 Recommended PCB Land Pattern 17 10Learning Resources 18 10.1 Must-Read Documents 18 10.2 Must-Have Resources 18 Revision History 19 List of Tables 1 ESP32-WROOM-32 Specifications 1 2 Pin Definitions 3 3 Strapping Pins 5 4 Absolute Maximum Ratings 9 5 Recommended Operating Conditions 9 6 DC Characteristics (3.3 V, 25 C) 9 7 Wi-Fi Radio Characteristics 10 8 Receiver Characteristics - BLE 11 9 Transmitter Characteristics - BLE 11 List of Figures 1 ESP32-WROOM-32 Pin Layout (Top View) 3 2 Reflow Profile 12 3 ESP32-WROOM-32 Schematics 13 4 ESP32-WROOM-32 Peripheral Schematics 14 5 Discharge Circuit for VDD33 Rail 14 6 Reset Circuit 15 7 Physical Dimensions of ESP32-WROOM-32 16 8 Recommended PCB Land Pattern 17 1. Overview 1. Overview ESP32-WROOM-32 is a powerful, generic Wi-Fi+BT+BLE MCU module that targets a wide variety of applications, ranging from low-power sensor networks to the most demanding tasks, such as voice encoding, music streaming and MP3 decoding. At the core of this module is the ESP32-D0WDQ6 chip*. The chip embedded is designed to be scalable and adaptive. There are two CPU cores that can be individually controlled, and the CPU clock frequency is adjustable from 80 MHz to 240 MHz. The user may also power off the CPU and make use of the low-power co-processor to constantly monitor the peripherals for changes or crossing of thresholds. ESP32 integrates a rich set of peripherals, ranging from capacitive touch sensors, Hall sensors, SD card interface, Ethernet, high-speed SPI, UART, IS and IC. Note: * For details on the part numbers of the ESP32 family of chips, please refer to the document ESP32 Datasheet. The integration of Bluetooth, Bluetooth LE and Wi-Fi ensures that a wide range of applications can be targeted, and that the module is all-around: using Wi-Fi allows a large physical range and direct connection to the Internet through a Wi-Fi router, while using Bluetooth allows the user to conveniently connect to the phone or broadcast low energy beacons for its detection. The sleep current of the ESP32 chip is less than 5 A, making it suitable for battery powered and wearable electronics applications. The module supports a data rate of up to 150 Mbps, and 20 dBm output power at the antenna to ensure the widest physical range. As such the module does offer industry-leading specifications and the best performance for electronic integration, range, power consumption, and connectivity. The operating system chosen for ESP32 is freeRTOS with LwIP; TLS 1.2 with hardware acceleration is built in as well. Secure (encrypted) over the air (OTA) upgrade is also supported, so that users can upgrade their products even after their release, at minimum cost and effort. Table 1 provides the specifications of ESP32-WROOM-32. Table 1: ESP32-WROOM-32 Specifications Categories Certification Test Items Specifications RF certification FCC/CE-RED/IC/TELEC/KCC/SRRC/NCC Wi-Fi certification Wi-Fi Alliance Bluetooth certification BQB Green certification RoHS/REACH Reliablity HTOL/HTSL/uHAST/TCT/ESD 802.11 b/g/n (802.11n up to 150 Mbps) Wi-Fi Protocols A-MPDU and A-MSDU aggregation and 0.4 s guard interval support Frequency range 2.4 GHz ~ 2.5 GHz Protocols Bluetooth v4.2 BR/EDR and BLE specification NZIF receiver with -97 dBm sensitivity Bluetooth Radio Class-1, class-2 and class-3 transmitter AFH Espressif Systems 1 ESP32-WROOM-32 Datasheet V2.8 1. Overview Categories Items Specifications Audio CVSD and SBC Module interfaces Hardware SD card, UART, SPI, SDIO, I2 C, LED PWM, Motor PWM, I2 S, IR, pulse counter, GPIO, capacitive touch sensor, ADC, DAC On-chip sensor Hall sensor Integrated crystal 40 MHz crystal Integrated SPI flash 4 MB Operating voltage/Power supply 2.7 V ~ 3.6 V Operating current Average: 80 mA Minimum current delivered by power supply Recommended operating temperature range Package size Espressif Systems 500 mA -40 C ~ +85 C (18.000.10) mm x (25.500.10) mm x (3.100.10) mm 2 ESP32-WROOM-32 Datasheet V2.8 2. Pin Definitions 2. Pin Definitions 2.1 Pin Layout Keepout Zone 1 GND GND 38 2 3V3 IO23 37 3 EN IO22 36 4 SENSOR_VP TXD0 35 5 SENSOR_VN RXD0 34 6 IO34 IO21 33 39 GND 27 13 IO14 IO4 26 14 IO12 IO0 25 24 IO16 IO2 IO27 23 12 IO15 28 22 IO17 SD1 IO26 21 11 SD0 29 20 IO5 CLK IO25 19 10 CMD 30 18 IO18 SD3 IO33 17 9 SD2 31 16 32 IO19 IO13 NC IO32 15 IO35 8 GND 7 Figure 1: ESP32-WROOM-32 Pin Layout (Top View) 2.2 Pin Description ESP32-WROOM-32 has 38 pins. See pin definitions in Table 2. Table 2: Pin Definitions Name No. Type Function GND 1 P Ground 3V3 2 P Power supply EN 3 I Module-enable signal. Active high. SENSOR_VP 4 I GPIO36, ADC1_CH0, RTC_GPIO0 SENSOR_VN 5 I GPIO39, ADC1_CH3, RTC_GPIO3 IO34 6 I GPIO34, ADC1_CH6, RTC_GPIO4 IO35 7 I GPIO35, ADC1_CH7, RTC_GPIO5 IO32 8 I/O IO33 9 I/O Espressif Systems GPIO32, XTAL_32K_P (32.768 kHz crystal oscillator input), ADC1_CH4, TOUCH9, RTC_GPIO9 GPIO33, XTAL_32K_N (32.768 kHz crystal oscillator output), ADC1_CH5, TOUCH8, RTC_GPIO8 3 ESP32-WROOM-32 Datasheet V2.8 2. Pin Definitions Name No. Type Function IO25 10 I/O GPIO25, DAC_1, ADC2_CH8, RTC_GPIO6, EMAC_RXD0 IO26 11 I/O GPIO26, DAC_2, ADC2_CH9, RTC_GPIO7, EMAC_RXD1 IO27 12 I/O GPIO27, ADC2_CH7, TOUCH7, RTC_GPIO17, EMAC_RX_DV IO14 13 I/O IO12 14 I/O GND 15 P IO13 16 I/O SHD/SD2* 17 I/O GPIO9, SD_DATA2, SPIHD, HS1_DATA2, U1RXD SWP/SD3* 18 I/O GPIO10, SD_DATA3, SPIWP, HS1_DATA3, U1TXD SCS/CMD* 19 I/O GPIO11, SD_CMD, SPICS0, HS1_CMD, U1RTS SCK/CLK* 20 I/O GPIO6, SD_CLK, SPICLK, HS1_CLK, U1CTS SDO/SD0* 21 I/O GPIO7, SD_DATA0, SPIQ, HS1_DATA0, U2RTS SDI/SD1* 22 I/O GPIO8, SD_DATA1, SPID, HS1_DATA1, U2CTS IO15 23 I/O IO2 24 I/O IO0 25 I/O IO4 26 I/O IO16 27 I/O GPIO16, HS1_DATA4, U2RXD, EMAC_CLK_OUT IO17 28 I/O GPIO17, HS1_DATA5, U2TXD, EMAC_CLK_OUT_180 IO5 29 I/O GPIO5, VSPICS0, HS1_DATA6, EMAC_RX_CLK IO18 30 I/O GPIO18, VSPICLK, HS1_DATA7 IO19 31 I/O GPIO19, VSPIQ, U0CTS, EMAC_TXD0 NC 32 - - IO21 33 I/O GPIO21, VSPIHD, EMAC_TX_EN RXD0 34 I/O GPIO3, U0RXD, CLK_OUT2 TXD0 35 I/O GPIO1, U0TXD, CLK_OUT3, EMAC_RXD2 IO22 36 I/O GPIO22, VSPIWP, U0RTS, EMAC_TXD1 IO23 37 I/O GPIO23, VSPID, HS1_STROBE GND 38 P Ground GPIO14, ADC2_CH6, TOUCH6, RTC_GPIO16, MTMS, HSPICLK, HS2_CLK, SD_CLK, EMAC_TXD2 GPIO12, ADC2_CH5, TOUCH5, RTC_GPIO15, MTDI, HSPIQ, HS2_DATA2, SD_DATA2, EMAC_TXD3 Ground GPIO13, ADC2_CH4, TOUCH4, RTC_GPIO14, MTCK, HSPID, HS2_DATA3, SD_DATA3, EMAC_RX_ER GPIO15, ADC2_CH3, TOUCH3, MTDO, HSPICS0, RTC_GPIO13, HS2_CMD, SD_CMD, EMAC_RXD3 GPIO2, ADC2_CH2, TOUCH2, RTC_GPIO12, HSPIWP, HS2_DATA0, SD_DATA0 GPIO0, ADC2_CH1, TOUCH1, RTC_GPIO11, CLK_OUT1, EMAC_TX_CLK GPIO4, ADC2_CH0, TOUCH0, RTC_GPIO10, HSPIHD, HS2_DATA1, SD_DATA1, EMAC_TX_ER Notice: * Pins SCK/CLK, SDO/SD0, SDI/SD1, SHD/SD2, SWP/SD3 and SCS/CMD, namely, GPIO6 to GPIO11 are connected to the integrated SPI flash integrated on the module and are not recommended for other uses. 2.3 Strapping Pins ESP32 has five strapping pins, which can be seen in Chapter 6 Schematics: Espressif Systems 4 ESP32-WROOM-32 Datasheet V2.8 2. Pin Definitions * MTDI * GPIO0 * GPIO2 * MTDO * GPIO5 Software can read the values of these five bits from register "GPIO_STRAPPING". During the chip's system reset release (power-on-reset, RTC watchdog reset and brownout reset), the latches of the strapping pins sample the voltage level as strapping bits of "0" or "1", and hold these bits until the chip is powered down or shut down. The strapping bits configure the device's boot mode, the operating voltage of VDD_SDIO and other initial system settings. Each strapping pin is connected to its internal pull-up/pull-down during the chip reset. Consequently, if a strapping pin is unconnected or the connected external circuit is high-impedance, the internal weak pull-up/pull-down will determine the default input level of the strapping pins. To change the strapping bit values, users can apply the external pull-down/pull-up resistances, or use the host MCU's GPIOs to control the voltage level of these pins when powering on ESP32. After reset release, the strapping pins work as normal-function pins. Refer to Table 3 for a detailed boot-mode configuration by strapping pins. Table 3: Strapping Pins Voltage of Internal LDO (VDD_SDIO) Pin Default MTDI Pull-down 3.3 V 1.8 V 0 1 Booting Mode Pin Default SPI Boot Download Boot GPIO0 Pull-up 1 0 GPIO2 Pull-down Don't-care 0 Enabling/Disabling Debugging Log Print over U0TXD During Booting Pin Default U0TXD Active U0TXD Silent MTDO Pull-up 1 0 Timing of SDIO Slave Falling-edge Sampling Falling-edge Sampling Rising-edge Sampling Rising-edge Sampling Falling-edge Output Rising-edge Output Falling-edge Output Rising-edge Output Pull-up 0 0 1 1 Pull-up 0 1 0 1 Pin Default MTDO GPIO5 Note: * Firmware can configure register bits to change the settings of "Voltage of Internal LDO (VDD_SDIO)" and "Timing of SDIO Slave" after booting. * The module integrates a 3.3 V SPI flash, so the pin MTDI cannot be set to 1 when the module is powered up. Espressif Systems 5 ESP32-WROOM-32 Datasheet V2.8 3. Functional Description 3. Functional Description This chapter describes the modules and functions integrated in ESP32-WROOM-32. 3.1 CPU and Internal Memory ESP32-D0WDQ6 contains two low-power Xtensa(R) 32-bit LX6 microprocessors. The internal memory includes: * 448 KB of ROM for booting and core functions. * 520 KB of on-chip SRAM for data and instructions. * 8 KB of SRAM in RTC, which is called RTC FAST Memory and can be used for data storage; it is accessed by the main CPU during RTC Boot from the Deep-sleep mode. * 8 KB of SRAM in RTC, which is called RTC SLOW Memory and can be accessed by the co-processor during the Deep-sleep mode. * 1 Kbit of eFuse: 256 bits are used for the system (MAC address and chip configuration) and the remaining 768 bits are reserved for customer applications, including flash-encryption and chip-ID. 3.2 External Flash and SRAM ESP32 supports multiple external QSPI flash and SRAM chips. More details can be found in Chapter SPI in the ESP32 Technical Reference Manual. ESP32 also supports hardware encryption/decryption based on AES to protect developers' programs and data in flash. ESP32 can access the external QSPI flash and SRAM through high-speed caches. * The external flash can be mapped into CPU instruction memory space and read-only memory space simultaneously. - When external flash is mapped into CPU instruction memory space, up to 11 MB + 248 KB can be mapped at a time. Note that if more than 3 MB + 248 KB are mapped, cache performance will be reduced due to speculative reads by the CPU. - When external flash is mapped into read-only data memory space, up to 4 MB can be mapped at a time. 8-bit, 16-bit and 32-bit reads are supported. * External SRAM can be mapped into CPU data memory space. Up to 4 MB can be mapped at a time. 8-bit, 16-bit and 32-bit reads and writes are supported. ESP32-WROOM-32 integrates a 4 MB SPI flash, which is connected to GPIO6, GPIO7, GPIO8, GPIO9, GPIO10 and GPIO11. These six pins cannot be used as regular GPIOs. 3.3 Crystal Oscillators The module uses a 40-MHz crystal oscillator. Espressif Systems 6 ESP32-WROOM-32 Datasheet V2.8 3. Functional Description 3.4 RTC and Low-Power Management With the use of advanced power-management technologies, ESP32 can switch between different power modes. For details on ESP32's power consumption in different power modes, please refer to section "RTC and Low-Power Management" in ESP32 Datasheet. Espressif Systems 7 ESP32-WROOM-32 Datasheet V2.8 4. Peripherals and Sensors 4. Peripherals and Sensors Please refer to Section Peripherals and Sensors in ESP32 Datasheet. Note: External connections can be made to any GPIO except for GPIOs in the range 6-11. These six GPIOs are connected to the module's integrated SPI flash. For details, please see Section 6 Schematics. Espressif Systems 8 ESP32-WROOM-32 Datasheet V2.8 5. Electrical Characteristics 5. Electrical Characteristics 5.1 Absolute Maximum Ratings Stresses beyond the absolute maximum ratings listed in Table 4 below may cause permanent damage to the device. These are stress ratings only, and do not refer to the functional operation of the device that should follow the recommended operating conditions. Table 4: Absolute Maximum Ratings Symbol Parameter Min Max Unit VDD33 Power supply voltage -0.3 3.6 V Cumulative IO output current - 1,100 mA Storage temperature -40 150 C Ioutput 1 Tstore 1. The module worked properly after a 24-hour test in ambient temperature at 25 C, and the IOs in three domains (VDD3P3_RTC, VDD3P3_CPU, VDD_SDIO) output high logic level to ground. Please note that pins occupied by flash and/or PSRAM in the VDD_SDIO power domain were excluded from the test. 2. Please see Appendix IO_MUX of ESP32 Datasheet for IO's power domain. 5.2 Recommended Operating Conditions Table 5: Recommended Operating Conditions Symbol Parameter Min Typical Max Unit VDD33 Power supply voltage 2.7 3.3 3.6 V IV DD Current delivered by external power supply 0.5 - - A T Operating temperature -40 - 85 C 5.3 DC Characteristics (3.3 V, 25 C) Table 6: DC Characteristics (3.3 V, 25 C) Symbol CIN VIH Parameter Min Pin capacitance - High-level input voltage 0.75xVDD 1 Typ Max 2 - - Unit pF 1 VDD +0.3 V 1 VIL Low-level input voltage -0.3 - 0.25xVDD IIH High-level input current - - 50 nA IIL Low-level input current - - 50 nA - - VOH VOL High-level output voltage 0.8xVDD Low-level output voltage High-level source current 1 IOH 1 (VDD = 3.3 V, VOH >= 2.64 V, output drive strength set to the maximum) Espressif Systems V V 1 - - 0.1xVDD V VDD3P3_CPU power domain 1, 2 - 40 - mA VDD3P3_RTC power domain 1, 2 - 40 - mA - 20 - mA VDD_SDIO power domain 1, 9 3 ESP32-WROOM-32 Datasheet V2.8 5. Electrical Characteristics Symbol Parameter Min Typ Max Unit - 28 - mA Low-level sink current IOL (VDD1 = 3.3 V, VOL = 0.495 V, output drive strength set to the maximum) RP U Resistance of internal pull-up resistor - 45 - k RP D Resistance of internal pull-down resistor - 45 - k VIL_nRST Low-level input voltage of CHIP_PU to power off the chip - - 0.6 V Notes: 1. Please see Appendix IO_MUX of ESP32 Datasheet for IO's power domain. VDD is the I/O voltage for a particular power domain of pins. 2. For VDD3P3_CPU and VDD3P3_RTC power domain, per-pin current sourced in the same domain is gradually reduced from around 40 mA to around 29 mA, VOH >=2.64 V, as the number of current-source pins increases. 3. Pins occupied by flash and/or PSRAM in the VDD_SDIO power domain were excluded from the test. 5.4 Wi-Fi Radio Table 7: Wi-Fi Radio Characteristics Parameter Condition Min Typical Max Unit Input frequency - 2412 - 2484 MHz Output impedance* - - * - TX power 11n, MCS7 12 13 14 dBm 11b mode 17.5 18.5 20 dBm 11b, 1 Mbps - -98 - dBm 11b, 11 Mbps - -89 - dBm 11g, 6 Mbps - -92 - dBm 11g, 54 Mbps - -74 - dBm 11n, HT20, MCS0 - -91 - dBm 11n, HT20, MCS7 - -71 - dBm 11n, HT40, MCS0 - -89 - dBm 11n, HT40, MCS7 - -69 - dBm 11g, 6 Mbps - 31 - dB 11g, 54 Mbps - 14 - dB 11n, HT20, MCS0 - 31 - dB 11n, HT20, MCS7 - 13 - dB Sensitivity Adjacent channel rejection For the modules that use IPEX antennas, the output impedance is 50 . For other modules without IPEX antennas, users do not need to concern about the output impedance. Espressif Systems 10 ESP32-WROOM-32 Datasheet V2.8 5. Electrical Characteristics 5.5 BLE Radio 5.5.1 Receiver Table 8: Receiver Characteristics - BLE Parameter Conditions Min Typ Max Unit Sensitivity @30.8% PER - - -97 - dBm Maximum received signal @30.8% PER - 0 - - dBm Co-channel C/I - - +10 - dB F = F0 + 1 MHz - -5 - dB F = F0 - 1 MHz - -5 - dB F = F0 + 2 MHz - -25 - dB F = F0 - 2 MHz - -35 - dB F = F0 + 3 MHz - -25 - dB F = F0 - 3 MHz - -45 - dB 30 MHz ~ 2000 MHz -10 - - dBm 2000 MHz ~ 2400 MHz -27 - - dBm 2500 MHz ~ 3000 MHz -27 - - dBm 3000 MHz ~ 12.5 GHz -10 - - dBm - -36 - - dBm Adjacent channel selectivity C/I Out-of-band blocking performance Intermodulation 5.5.2 Transmitter Table 9: Transmitter Characteristics - BLE Parameter Conditions Min Typ Max Unit RF transmit power - - 0 - dBm Gain control step - - 3 - dBm RF power control range - -12 - +9 dBm F = F0 2 MHz - -52 - dBm F = F0 3 MHz - -58 - dBm F = F0 > 3 MHz - -60 - dBm f 1avg - - - 265 kHz f 2max - 247 - - kHz f 2avg / f 1avg - - -0.92 - - ICFT - - -10 - kHz Drift rate - - 0.7 - kHz/50 s Drift - - 2 - kHz Adjacent channel transmit power Espressif Systems 11 ESP32-WROOM-32 Datasheet V2.8 5. Electrical Characteristics Temperature () 5.6 Reflow Profile Peak Temp. 235 ~ 250 250 Preheating zone 150 ~ 200 60 ~ 120s 217 200 Reflow zone !217 60 ~ 90s Cooling zone -1 ~ -5/s Soldering time > 30s Ramp-up zone 1 ~ 3/s 100 50 25 Time (sec.) 0 0 50 100 150 200 250 Ramp-up zone -- Temp.: <150 Time: 60 ~ 90s Ramp-up rate: 1 ~ 3/s Preheating zone -- Temp.: 150 ~ 200 Time: 60 ~ 120s Ramp-up rate: 0.3 ~ 0.8/s Reflow zone -- Temp.: >217 7LPH60 ~ 90s; Peak Temp.: 235 ~ 250 (<245 recommended) Time: 30 ~ 70s Cooling zone -- Peak Temp. ~ 180 Ramp-down rate: -1 ~ -5/s Solder -- Sn&Ag&Cu Lead-free solder (SAC305) Figure 2: Reflow Profile Espressif Systems 12 ESP32-WROOM-32 Datasheet V2.8 6. Schematics Espressif Systems 6. Schematics Pin.1 GND The values of C1 and C2 vary with the selection of a crystal. Pin.15 GND GND 1 C5 10nF/6.3V(10%) GND ANT1 1 2 C14 13 PCB ANT GND 49 C10 0.1uF GND GND TBD C15 L4 TBD TBD C16 270pF C17 GND GND GND 270pF 1 2 3 4 SENSOR_VP 5 6 7 SENSOR_VN8 CHIP_PU 9 10 GPIO34 11 GPIO35 12 GPIO32 3 VDDA LNA_IN VDD3P3 VDD3P3 SENSOR_VP SENSOR_CAPP SENSOR_CAPN SENSOR_VN CHIP_PU VDET_1 VDET_2 32K_XP The values of C14, L4 and C15 vary with the actual selection of a PCB board. ESP32-D0WDQ6 Pin.35 TXD0 SWP/SD3 Pin.19 CMD U0TXD Pin.34 RXD0 SCS/CMD Pin.20 CLK U0RXD GPIO34 Pin.33 IO21 SCK/CLK GPIO21 VDD_SDIO 36 35 34 33 32 31 30 29 28 27 26 25 GPIO23 GPIO18 GPIO5 SDI/SD1 SDO/SD0 SCK/CLK SCS/CMD SWP/SD3 SHD/SD2 GPIO17 Pin.7 IO35 U3 SCS/CMD 1 SCK/CLK 6 SHD/SD2 7 /CS CLK /HOLD FLASH GPIO16 C18 VDD_SDIO Pin.21 SD0 GPIO35 DI DO /WP 5 SDI/SD1 2 SDO/SD0 3 SWP/SD3 Pin.8 IO32 Pin.32 NC SDO/SD0 Pin.22 SD1 GPIO32 Pin.31 IO19 SDI/SD1 GND Pin.9 IO33 Pin.23 IO15 GPIO19 GPIO33 Pin.30 IO18 GPIO15 GPIO18 1uF Pin.10 IO25 GND U2 0.1uF Pin.24 IO2 GPIO25 VDD33 C19 ESP32-WROOM-32 Datasheet V2.8 GPIO13 GPIO15 GPIO2 GPIO0 GPIO4 Pin.6 IO34 GND GPIO23 GPIO18 GPIO5 SD_DATA_1 SD_DATA_0 SD_CLK SD_CMD SD_DATA_3 SD_DATA_2 GPIO17 VDD_SDIO GPIO16 GPIO33 GPIO25 GPIO26 GPIO27 GPIO14 GPIO12 GPIO22 VDD33 8 C13 10uF Pin.5 SENSOR_VN 0.1uF 32K_XN GPIO25 GPIO26 GPIO27 MTMS MTDI VDD3P3_RTC MTCK MTDO GPIO2 GPIO0 GPIO4 C12 10uF Pin.18 SD3 SENSOR_VN C4 GND GND C11 3.3nF/6.3V(10%) GND VDD33 1uF 20K(5%) C6 VCC 0.1uF R1 GPIO23 Pin.36 IO22 SHD/SD2 SENSOR_VP GND GND GND C9 Pin.4 SENSOR_VP GPIO21 U0TXD U0RXD GPIO22 GPIO19 13 14 15 16 17 18 19 20 21 22 23 24 VDD33 GPIO13 Pin.17 SD2 CHIP_PU GND 40MHz+/-10ppm GND GND Pin.37 IO23 4 1uF C2 22pF 48 47 46 45 44 43 42 41 40 39 38 37 C20 Pin.3 CHIP_PU/EN CAP1 CAP2 VDDA XTAL_P XTAL_N VDDA GPIO21 U0TXD U0RXD GPIO22 GPIO19 VDD3P3_CPU C3 100pF Pin.16 IO13 VDD33 GND 2 C1 22pF VDD33 U1 XIN GND D1 ESD3.3V88D-C Pin.2 3V3 GND XOUT 4 GND Pin.38 GND GND GND Pin.29 IO5 GPIO2 Pin.11 IO26 GPIO5 Pin.28 IO17 GPIO26 GPIO17 GND Pin.12 IO27 Pin.27 IO16 GPIO27 GPIO16 Pin.13 IO14 Pin.26 IO4 GPIO14 Pin.14 IO12 GPIO12 Figure 3: ESP32-WROOM-32 Schematics GPIO4 Pin.39 GND Pin.25 IO0 GND GPIO0 7. Peripheral Schematics 7. Peripheral Schematics VDD33 VDD33 C1 10uF GND C2 0.1uF GND GND 1 2 3 SENSOR_VP 4 SENSOR_VN 5 6 IO34 7 IO35 8 IO32 9 IO33 10 IO25 11 IO26 12 IO27 13 14 0.1uF EN C3 P_GND GND3 IO23 IO22 TXD0 RXD0 IO21 NC IO19 IO18 IO5 IO17 IO16 IO4 IO0 GND1 3V3 EN SENSOR_VP SENSOR_VN IO34 IO35 IO32 IO33 IO25 IO26 IO27 IO14 IO12 39 38 37 36 35 34 33 32 31 30 29 28 27 26 25 J1 IO23 IO22 TXD RXD IO21 GND IO19 IO18 IO5 IO17 IO16 IO4 IO0 GND 1 2 GND2 IO13 SD2 SD3 CMD CLK SD0 SD1 IO15 IO2 GND UART DOWNLOAD U1 3 2 1 R1 10K 15 16 17 18 19 20 21 22 23 24 J2 U2 BOOT OPTION 100R 100R 100R 100R MTMS MTDI MTCK MTDO SD2 SD3 CMD CLK SD0 SD1 R2 R3 R4 R5 IO2 GND 1 2 3 4 MTMS MTDI MTCK MTDO JTAG MTDI should be kept at a low electric level when powering up the module. Figure 4: ESP32-WROOM-32 Peripheral Schematics Note: Soldering Pad 39 to the Ground of the base board is not necessary for a satisfactory thermal performance. If users do want to solder it, they need to ensure that the correct quantity of soldering paste is applied. Espressif Systems Title Application of ESP32-WROO Size A4 Discharge Circuit VCC CAP Added By User Date: 5 4 1 3 2 SW1 Thursday, June 21, 2018 2 D1 VDD33 Q1 + C1 ESP Module Bulk CAP R2 R1 100K GND Document Number <Doc> 1K GND GND GND Figure 5: Discharge Circuit for VDD33 Rail Note: The discharge circuit can be applied in scenarios where ESP32 is powered on and off repeatedly by switching the power rails, and there is a large capacitor on the VDD33 rail. For details, please refer to Section Power Scheme in ESP32 Datasheet. Espressif Systems 14 ESP32-WROOM-32 Datasheet V2.8 7. Peripheral Schematics U1 GND VBAT R1 0R 3 1 GND 2 CHIP_PU VCC RESET# Power Supply Supervisor R2 100K GND Figure 6: Reset Circuit Note: When battery is used as the power supply for ESP32 series of chips and modules, a supply voltage supervisor is recommended to avoid boot failure due to low voltage. Users are recommended to pull CHIP_PU low if the power supply for ESP32 is below 2.3 V. 5 4 Espressif Systems 3 15 ESP32-WROOM-32 Datasheet V2.8 8. Physical Dimensions Espressif Systems 8. Physical Dimensions ESP32-WROOM-32 DIMENSIONS Unit: mm 18.000.10 Module Width 18.000.10 3.100.10 Module Thickness 0.800.10 Antenna Area 6.000.10 0.450.10 PCB Thickness 0.850.10 0.900.10 0.900.10 4.000.10 16 25.500.10 25.500.10 17.600.10 4.000.10 16.510.10 6.300.10 Module Length 1.000.10 8.650.10 1.270.10 1.270.10 1.500.10 15.800.10 1.270.10 ESP32-WROOM-32 Datasheet V2.8 11.430.10 Top View 1.500.10 3.280.10 3.280.10 Side View Figure 7: Physical Dimensions of ESP32-WROOM-32 11.430.10 Bottom View 9. Recommended PCB Land Pattern 9. Recommended PCB Land Pattern Unit:mm 0.9 6.3 2 1 38 5 6.51 5 1.27x13=16.51 25.5 4 15 2.785 1 7.49 18 24 1.27x9=11.43 2.785 17 Figure 8: Recommended PCB Land Pattern Espressif Systems 17 ESP32-WROOM-32 Datasheet V2.8 10. Learning Resources 10. Learning Resources 10.1 Must-Read Documents The following link provides documents related to ESP32. * ESP32 Datasheet This document provides an introduction to the specifications of the ESP32 hardware, including overview, pin definitions, functional description, peripheral interface, electrical characteristics, etc. * ESP-IDF Programming Guide It hosts extensive documentation for ESP-IDF ranging from hardware guides to API reference. * ESP32 Technical Reference Manual The manual provides detailed information on how to use the ESP32 memory and peripherals. * ESP32 Hardware Resources The zip files include the schematics, PCB layout, Gerber and BOM list of ESP32 modules and development boards. * ESP32 Hardware Design Guidelines The guidelines outline recommended design practices when developing standalone or add-on systems based on the ESP32 series of products, including the ESP32 chip, the ESP32 modules and development boards. * ESP32 AT Instruction Set and Examples This document introduces the ESP32 AT commands, explains how to use them, and provides examples of several common AT commands. * Espressif Products Ordering Information 10.2 Must-Have Resources Here are the ESP32-related must-have resources. * ESP32 BBS This is an Engineer-to-Engineer (E2E) Community for ESP32 where you can post questions, share knowledge, explore ideas, and help solve problems with fellow engineers. * ESP32 GitHub ESP32 development projects are freely distributed under Espressif's MIT license on GitHub. It is established to help developers get started with ESP32 and foster innovation and the growth of general knowledge about the hardware and software surrounding ESP32 devices. * ESP32 Tools This is a webpage where users can download ESP32 Flash Download Tools and the zip file "ESP32 Certification and Test". * ESP-IDF This webpage links users to the official IoT development framework for ESP32. * ESP32 Resources This webpage provides the links to all available ESP32 documents, SDK and tools. Espressif Systems 18 ESP32-WROOM-32 Datasheet V2.8 Revision History Revision History Date Version Release notes 2019.01 V2.8 Changed the RF power control range in Table 9 from -12 ~ +12 to -12 ~ +9 dBm. 2018.10 V2.7 Added "Cumulative IO output current" entry to Table 4: Absolute Maximum Ratings; Added more parameters to Table 6: DC Characteristics. * Added reliability test items the module has passed in Table 1: ESP32WROOM-32 Specifications, and removed software-specific information; * Updated section 3.4: RTC and Low-Power Management; 2018.08 V2.6 * Changed the module's dimensions from (180.2) mm x (25.5 0.2) mm x (3.10.15) mm to (18.000.10) mm x (25.500.10) mm x (3.100.10) mm; * Updated Figure 8: Physical Dimensions; * Updated Table 7: Wi-Fi Radio. * Changed the module name to ESP32-WROOM-32; * Deleted Temperature Sensor in Table 1: ESP32-WROOM-32 Specifications; * Updated Chapter 3: Functional Description; * Added Chapter 8: Recommended PCB Land Pattern; 2018.06 V2.5 Changes to electrical characteristics: * Updated Table 4: Absolute Maximum Ratings; * Added Table 5: Recommended Operating Conditions; * Added Table 6: DC Characteristics; * Updated the values of "Gain control step", "Adjacent channel transmit power" in Table 9: Transmitter Characteristics - BLE. 2018.03 V2.4 Updated Table 1 in Chapter 1. Deleted information on LNA pre-amplifier; 2018.01 V2.3 Updated section 3.4 RTC and Low-Power Management; Added reset circuit in Chapter 7 and a note to it. Updated the description of the chip's system reset in Section 2.3 Strapping Pins; Deleted "Association sleep pattern" in Table "Power Consumption by Power Modes" 2017.10 V2.2 and added notes to Active sleep and Modem-sleep; Updated the note to Figure 4 Peripheral Schematics; Added discharge circuit for VDD33 rail in Chapter 7 and a note to it. 2017.09 V2.1 Updated operating voltage/power supply range updated to 2.7 ~ 3.6V; Updated Chapter 7. Changed the sensitivity of NZIF receiver to -97 dBm in Table 1; Updated the dimensions of the module; 2017.08 V2.0 Updated Table "Power Consumption by Power Modes" Power Consumption by Power Modes, and added two notes to it; Updated Table 4, 7, 8, 9; Added Chapter 8; Added the link to certification download. Added a note to Section 2.1 Pin Layout; 2017.06 V1.9 Espressif Systems Updated Section 3.3 Crystal Oscillators; Updated Figure 3 ESP-WROOM-32 Schematics; 19 ESP32-WROOM-32 Datasheet V2.8 Revision History Date Version Release notes Added Documentation Change Notification. 2017.05 V1.8 Updated Figure 1 Top and Side View of ESP32-WROOM-32 (ESP-WROOM-32). Added the module's dimensional tolerance; 2017.04 V1.7 Changed the input impedance value of 50 in Table 7 Wi-Fi Radio Characteristics to output impedance value of 30+j10 . 2017.04 V1.6 Added Figure 2 Reflow Profile. Updated Section 2.2 Pin Description; 2017.03 V1.5 Updated Section 3.2 External Flash and SRAM; Updated Section 4 Peripherals and Sensors Description. Updated Chapter 1 Preface; Updated Chapter 2 Pin Definitions; Updated Chapter 3 Functional Description; 2017.03 V1.4 Updated Table Recommended Operating Conditions; Updated Table 7 Wi-Fi Radio Characteristics; Updated Section 5.6 Reflow Profile; Added Chapter 10 Learning Resources. 2016.12 V1.3 Updated Section 2.1 Pin Layout. 2016.11 V1.2 Added Figure 7 Peripheral Schematics. 2016.11 V1.1 Updated Chapter 6 Schematics. 2016.08 V1.0 First release. Espressif Systems 20 ESP32-WROOM-32 Datasheet V2.8