HSMA/C/L-C120 HSMD/G/S/H-C120 HSMM/N/Q/R-C120 Right Angle ChipLED Data Sheet Description This series of right angle mount ChipLEDs is designed with the smallest footprint to achieve high density of components on board. They have the industry standard footprint of 1.6 mm x 1.0 mm and a height of only 0.6 mm. This makes them very suitable for cellular phone and mobile equipment backlighting and indication application where space is a constraint. They are available in a wide range of color combination. In order to facilitate automated pick and place operation, these ChipLEDs are shipped in tape and reel, with 4000 units per reel. These parts are compatible with IR soldering. Features * Small size right angle mount * 0603 industry standard footprint * Operating temperature range of -30C to +85C * Available in various colors * Compatible with IR solder reflow * Available in 8 mm tape on 7" diameter reel * Reel sealed in zip locked moisture barrier bags Applications * LCD backlighting * Keypad backlighting * Pushbutton backlighting * Symbol indicator CAUTION: HSMM/N/Q/R-C120 LEDs are Class 1 ESD sensitive per MIL-STD-1686. Please observe appropriate precautions during handling and processing. Refer to Avago Technologies Application Note AN-1142 for additional details. Package Dimensions CATHODE MARK (ANODE MARK FOR HSMH-C120) LED DIE 0.6 (0.024) 0.3 (0.012) 1.6 (0.063) POLARITY[3] 1.2 (0.047) CLEAR EPOXY 1.0 (0.039) 0.4 (0.016) PC BOARD 3 - 0.3 (0.012) CATHODE LINE SOLDERING TERMINAL NOTES: 1. ALL DIMENSIONS IN MILLIMETERS (INCHES). 2. TOLERANCE IS 0.1 mm ( 0.004 IN.) UNLESS OTHERWISE SPECIFIED. 3. POLARITY FOR HSMH-C120 WILL BE THE OPPOSITE OF WHAT IS SHOWN ON ABOVE DRAWING. Device Selection Guide AS AlInGaP Amber HSMA-C120 Red HSMC-C120 AlGaAs Red HSMH-C120 GaP Green HSMG-C120 2 Orange HSML-C120 InGaN Green HSMM-C120 HSMQ-C120 Blue HSMN-C120 HSMR-C120 Orange HSMD-C120 HER HSMS-C120 Package Description Untinted, Non Diffused Package Description Untinted, Non Diffused Absolute Maximum Ratings at TA = 25C Parameter DC Forward Current[1] [2] Power Dissipation Reverse Voltage (IR = 100 A) LED Junction Temperature Operating Temperature Range Storage Temperature Range Soldering Temperature HSMA/C/L- HSMD/G/S- HSMHC120 C120 C120 25 20 25 60 52 65 5 5 5 95 95 95 -30 to +85 -40 to +85 See IR soldering profile (Figure 6) HSMM/NC120 20 78 5 95 HSMQ/RC120 20 78 5 95 Units mA mW V C C C Notes: 1. Derate linearly as shown in Figure 4. 2. Drive currents above 5 mA are recommended for best long term performance. Electrical Characteristics at TA = 25C Part Number HSMA-C120 HSMC-C120 HSML-C120 HSMD-C120 HSMG-C120 HSMS-C120 HSMH-C120 HSMM-C120 HSMN-C120 HSMQ-C120 HSMR-C120 Note: 1. VF tolerance: 0.1 V 3 Forward Voltage VF (Volts) @ IF = 20 mA Typ. Max. 1.9 2.4 1.9 2.4 1.9 2.4 2.2 2.6 2.2 2.6 2.1 2.6 1.8 2.6 3.4 3.9 3.4 3.9 3.4 3.9 3.4 3.9 Reverse Breakdown VR (Volts) @ IR = 100 A Min. 5 5 5 5 5 5 5 5 5 5 5 Capacitance C (pF), VF = 0, f = 1 MHz Typ. 11 15 20 7 9 5 20 45 45 100 100 Thermal Resistance RJ-PIN (C/W) Typ. 400 400 400 350 350 350 400 450 450 450 450 Optical Characteristics at TA = 25C Part Number Luminous Intensity Iv (mcd) @ 20 mA[1] Min. Typ. Peak Wavelength peak[2] (nm) Typ. Dominant Wavelength d[2] (nm) Typ. Viewing Angle 2 1/2 Degrees[3] Typ. Luminous Efficacy v (lm/w) Typ. HSMA-C120 HSMC-C120 HSML-C120 HSMD-C120 HSMG-C120 HSMS-C120 HSMH-C120 HSMM-C120 HSMN-C120 25 25 25 2.5 4.0 2.5 4.0 40 10 90 90 90 8 15 10 15 120 30 595 637 609 605 570 630 660 523 468 592 626 605 604 572 626 639 525 470 155 155 155 155 155 155 155 155 155 480 155 370 380 595 145 70 490 80 HSMQ-C120 HSMR-C120 40 16 145 55 520 469 527 473 155 155 500 85 Notes: 1.The luminous intensity Iv is measured at the peak of the spatial radiation pattern which may not be aligned with the mechanical axis of the lamp package. 2.The coordinate is derived from the CIE Chromatically Diagram and represents the perceived color of the device. 3.1/2 is the off-axis angle where the luminous intensity is 1/2 the peak intensity. Light Intensity (Iv) Bin Limits[1] Bin ID A B C D E F G H J K L M N P Q R S T U Intensity (mcd) Min. Max. 0.11 0.18 0.18 0.29 0.29 0.45 0.45 0.72 0.72 1.10 1.10 1.80 1.80 2.80 2.80 4.50 4.50 7.20 7.20 11.20 11.20 18.00 18.00 28.50 28.50 45.00 45.00 71.50 71.50 112.50 112.50 180.00 180.00 285.00 285.00 450.00 450.00 715.00 Tolerance: 15% 4 Color Bin Limits[1] Green Color Bins Dom. Wavelength (nm) Bin ID Min. Max. A 561.5 564.5 B 564.5 567.5 C 567.5 570.5 D 570.5 573.5 E 573.5 576.5 Tolerance: 0.5 nm Yellow/Amber Color Bins Dom. Wavelength (nm) Bin ID Min. Max. A 582.0 584.5 B 584.5 587.0 C 587.0 589.5 D 589.5 592.0 E 592.0 594.5 F 594.5 597.0 Tolerance: 0.5 nm Blue Color Bins Dom. Wavelength (nm) Bin ID Min. Max. A 460.0 465.0 B 465.0 470.0 C 470.0 475.0 D 475.0 480.0 InGaN Green Color Bins Dom. Wavelength (nm) Bin ID Min. Max. A 515.0 520.0 B 520.0 525.0 C 525.0 530.0 D 530.0 535.0 Tolerance: 1 nm Tolerance: 1 nm 100 Orange Color Bins Dom. Wavelength (nm) Bin ID Min. Max. A 597.0 600.0 B 600.0 603.0 C 603.0 606.0 D 606.0 609.0 E 609.0 612.0 F 612.0 615.0 RELATIVE INTENSITY - % Color Bin Limits HER 70 60 GaP ORANGE AlGaAs RED 50 40 30 20 10 550 600 650 700 750 WAVELENGTH - nm 100 RELATIVE INTENSITY - % Please contact your Avago representative for information on currently available bins. GaP GREEN 80 0 500 Tolerance: 1 nm Notes: 1.Bin categories are established for classification of products. Products may not be available in all categories. 90 90 80 InGaN BLUE AS AMBER AS ORANGE AS RED 70 60 InGaN GREEN 50 40 30 20 10 0 400 500 450 550 600 650 700 WAVELENGTH - nm Figure 1. Relative intensity vs. wavelength. IF - FORWARD CURRENT - mA 100 AS AllnGaP AlGaAs 10 HER GaP ORANGE GaP GREEN 1 0.1 1.5 1.7 1.6 1.8 1.9 2.0 2.1 2.2 2.3 VF - FORWARD VOLTAGE - V IF - FORWARD CURRENT - mA 100 10 HSMM, HSMN InGaN HSMQ, HSMR InGaN 1 0.1 1.5 2.0 2.5 3.0 VF - FORWARD VOLTAGE - V Figure 2. Forward current vs. forward voltage. 5 3.5 4.0 1.2 1.0 1.0 LUMINOUS INTENSITY (NORMALIZED AT 20 mA) LUMINOUS INTENSITY (NORMALIZED AT 20 mA) 1.2 0.8 AS AlInGaP 0.6 AlGaAs 0.4 GaP 0.2 0 0 5 10 15 20 0.8 HSMQ, HSMR InGaN 0.6 0.2 0 25 HSMM, HSMN InGaN 0.4 0 IF - FORWARD CURRENT - mA 5 10 15 20 25 IF - FORWARD CURRENT - mA 30 25 AlInGaP AlGaAs 20 GaP 15 10 5 0 0 10 20 30 40 50 60 70 80 90 TA - AMBIENT TEMPERATURE - C IF MAX. - MAXIMUM FORWARD CURRENT - mA IF MAX. - MAXIMUM FORWARD CURRENT - mA Figure 3. Luminous intensity vs. forward current. Figure 4. Maximum forward current vs. ambient temperature. 6 25 HSMQ, HSMR InGaN 20 15 HSMM, HSMN InGaN 10 5 0 0 10 20 30 40 50 60 70 80 90 TA - AMBIENT TEMPERATURE - C 100 90 RELATIVE INTENSITY 80 70 60 50 40 30 20 10 0 -90 -80 -70 -60 -50 -40 -30 -20 -10 0 10 20 30 40 50 60 70 80 90 ANGLE 100 RELATIVE INTENSITY 90 80 70 60 50 40 30 20 10 0 -90 -80 -70 -60 -50 -40 -30 -20 -10 0 10 20 30 40 50 60 70 80 90 ANGLE Figure 5. Relative intensity vs. angle. 0.4 (0.016) 10 SEC. MAX. TEMPERATURE 0.4 (0.016) 230C MAX. 4C/SEC. MAX. 140-160C 0.7 (0.028) 4C/SEC. MAX. -3C/SEC. MAX. 0.15 (0.006) CENTERING BOARD OVER 2 MIN. TIME Figure 6. Recommended reflow soldering profile. Note: All dimensions in millimeters (inches). 7 0.8 (0.031) 1.2 (0.047) Figure 7. Recommended soldering pattern. 0.8 (0.031) USER FEED DIRECTION CATHODE SIDE xx xxxxxx xxxxx xxxxx xxxxx xx PRINTED LABEL Figure 8. Reeling orientation. ;; ;; ;; ;; ;;; ;; 8.0 1.0 (0.315 0.039) 10.50 1.0 (0.413 0.039) 20.20 MIN. ( 0.795 MIN.) 13.1 0.5 ( 0.516 0.020) 3.0 0.5 (0.118 0.020) 59.60 1.00 (2.346 0.039) 178.40 1.00 (7.024 0.039) 4.0 0.5 (0.157 0.020) 6 PS 5.0 0.5 (0.197 0.020) NOTE: ALL DIMENSIONS IN MILLIMETERS (INCHES). Figure 9. Reel dimensions. 8 ; ;; ;;;;;;; ;; ;;;;;;; ;; ;;;;;; ; DIM. C (SEE TABLE 1) 2.00 0.05 (0.079 0.002) 4.0 (0.157) 1.50 (0.059) 0.20 0.05 (0.008 0.002) CATHODE 1.75 (0.069) 3.5 0.05 (0.138 0.002) DIM. A (SEE TABLE 1) 8.0 0.30 (0.315 0.012) 4.0 (0.157) CARRIER TAPE R 0.5 0.05 (0.020 0.002) DIM. B (SEE TABLE 1) USER FEED DIRECTION COVER TAPE TABLE 1 DIMENSIONS IN MILLIMETERS (INCHES) PART NUMBER HSMx-C120 SERIES DIM. A DIM. B DIM. C 0.10 (0.004) 0.10 (0.004) 0.10 (0.004) 1.90 (0.075) 1.15 (0.045) Figure 10. Tape dimensions. END THERE SHALL BE A MINIMUM OF 160 mm (6.3 INCHES) OF EMPTY COMPONENT POCKETS SEALED WITH COVER TAPE. START MOUNTED WITH COMPONENTS. THERE SHALL BE A MINIMUM OF 160 mm (6.3 INCHES) OF EMPTY COMPONENT POCKETS SEALED WITH COVER TAPE. MINIMUM OF 230 mm (9.05 IN.) MAY CONSIST OF CARRIER AND/OR COVER TAPE. Figure 11. Tape leader. Notes: 1. All dimensions in millimeters (inches). 2. Tolerance is 0.1 mm ( 0.004 in.) unless otherwise specified. Convective IR Reflow Soldering For more information on IR reflow soldering, refer to Application Note 1060, Surface Mounting SMT LED Indicator Components. 9 Storage Condition: 5 to 30C @ 60% RH max. Baking is required under the condition: a) the blue silica gel indicator becoming white/transparent color b) the pack has been opened for more than 1 week Baking recommended condition: 60 +/- 5C for 20 hours. 0.75 (0.030) For product information and a complete list of distributors, please go to our website: www.avagotech.com Avago, Avago Technologies, and the A logo are trademarks of Avago Technologies Limited in the United States and other countries. Data subject to change. Copyright (c) 2006 Avago Technologies Limited. All rights reserved. 5988-5401EN November 5, 2006