Make sure the next Card you purchase has... BU-65743/65843/65863/65864 PCI MINI-ACE(R) MARK3 AND PCI MICRO-ACE(R)*-TE (R) FEATURES * 32-Bit/33MHz, 3.3Volt, PCI Target Interface * Fully Integrated 1553A/B Notice 2, 1760, McAir, STANAG 3838 Interface Terminal * All +3.3V Operation or +3.3V Logic and +5V Transceivers * 0.88 inch square, 80-Pin CQFP (PCI Mini-ACE Mark3) or 0.80 inch square 324 ball BGA (PCI Micro-ACE TE) * Compatible with PCI Enhanced MiniACE, Enhanced Mini-ACE, Mini-ACE and ACE Generations DESCRIPTION The PCI Mini-ACE Mark3/Micro-ACE TE family of MIL-STD-1553 terminals provides a complete interface between a 32-Bit/33Mhz 3.3V signaling PCI Bus and a MIL-STD-1553 bus. These terminals integrate dual transceiver, protocol logic, and 4K or 64K words of RAM, all of which can be powered from 3.3V. With a 0.88-inch square package, the PCI Mini-ACE Mark3 is the smallest ceramic CQFP PCI 1553 solution available. The 0.80-inch square 324 ball BGA PCI Micro-ACE TE has an even smaller footprint, but has a more restricted operating temperature range. Both are 100% software compatible with the larger PCI Enhanced Mini-ACE and add TAG_CLK inputs. The TAG_CLK input allows a software selectable external time tag clock input. Both parts are available with a choice of either 3.3V transceivers or 5V transceivers. The PCI Micro-ACE TE has a more restricted set of options compared to the PCI Mini-ACE Mark3. Please consult the ordering information at the rear of the data sheet to see which options are available. In addition, the PCI Micro-ACE TE adds RTBOOT and 1553 clock select inputs for applications which must boot into RT mode with Busy bit set. The PCI Mini-ACE Mark3/Micro-ACE TE is nearly 100% software compatible with the Enhanced Mini-ACE and previous generation Mini-ACE terminals. The PCI interface to this terminal is not 5V tolerant. Multiprotocol support of MIL-STD-1553A/B and STANAG 3838, including Mark3 versions incorporating McAir compatible transmitters, is provided. There is a choice of 10, 12, 16, or 20 MHz 1553 clocks. The BC/RT/MT versions with 64K words of RAM include built-in RAM parity checking. BC features include a built-in message sequence control engine, with a set of 20 instructions. This provides an autonomous means of implementing multiframe message scheduling, message retry schemes, data double buffering, asynchronous message insertion, and reporting to the host CPU. * Choice of : - RT only with 4K RAM (BU-65743) - BC/RT/MT with 4K RAM (BU-65843) - BC/RT/MT with 64K RAM, and RAM Parity (BU-65863, BU-65864) * Sleep Mode Option * Choice of 10, 12, 16, or 20 MHz 1553 Clock * Highly Autonomous BC with Built-In Message Sequence Control: - Frame Scheduling - Branching - Asynchronous Message Insertion - General Purpose Queue - User-defined Interrupts * Advanced RT Functions - Global Circular Buffering - Interrupt Status Queue - 50% Circular Buffer Rollover Interrupts * Selective Message Monitor or RT/Monitor FOR MORE INFORMATION CONTACT: The PCI Mini-ACE Mark3 and Micro-ACE TE RT offer single and circular subaddress buffering schemes, along with a global circular buffering option, 50% rollover interrupt for circular buffers, and an interrupt status queue. Data Device Corporation 105 Wilbur Place Bohemia, New York 11716 631-567-5600 Fax: 631-567-7358 www.ddc-web.com Technical Support: 1-800-DDC-5757 ext. 7771 * (c) The technology used in DDC's Micro-ACE series of products may be subject to one or more patents pending. All trademarks are the property of their respective owners. 2003 Data Device Corporation Data Device Corporation www.ddc-web.com 2 BU-65743/65843/65863/65864 AC-6/11-0 TX_INH A/B MISCELLANEOUS RT ADDRESS AND ADDRESS LATCH CH. B CH. A TRANSCEIVER B * TRANSCEIVER A DUAL ENCODER/DECODER, MULTIPROTOCOL AND MEMORY MANAGEMENT 33 MHZ, 32-BIT PCI SLAVE INTERFACE 32 X 32 WRITE FIFO MSTCLR (RST#) INT A # (PCI) CLK PCI Interrupt PCI CLK PCI Control PCI Address/Data, Parity and Bus Command/Byte Enable TRDY#, STOP#, DEVSEL#, PERR#, SERR# FRAME#, IRDY#,IDSEL C/BE#3 - C/BE#0 PAR AD31-AD0 FIGURE 1. PCI MINI-ACE MARK3/MICRO-ACE TE (3.3V TRANSCEIVERS) BLOCK DIAGRAM * ADDRESS BUS DATA BUS 4K X 16 OR 64K X 17 SHARED RAM NOTE 1: Shown with 3.3V transceivers. 5V transceivers are available. BOOT_L,CLK_SEL_0/1 (Micro-ACE TE ONLY) 1553_CLK, SSFLAG/EXT_TRIG,TAG_CLK INCMD/MCRST RT-AD4-LAT RTAD4-RTAD0, RTADP TX/RX_B (1:2.038) TX/RX_B TX/RX_A (1:2.038) TX/RX_A TABLE 1. PCI MINI-ACE MARK3/MICRO-ACE TE SPECIFICATIONS PARAMETER ABSOLUTE MAXIMUM RATING Supply Voltage * Logic +3.3V * Transceiver +3.3V (BU65XX3X8/9) * Transceiver +5V(BU-65XX3F3/4, BU-65XX3G3/4, BU-658XXB3) Logic * Voltage Input Range * Voltage Input Range, +5V Tolerant Pins (Note 16) RECEIVER Differential Input Resistance (Notes 1-6) Differential Input Capacitance (Notes 1-6, 19) Threshold Voltage, Transformer Coupled Common Mode Voltage (Note 7) TRANSMITTER Differential Output Voltage * Direct Coupled Across 35 , Measured on Bus * Transformer Coupled Across 70 , Measured on Bus (BU-65XXXXX-XX0, BU-65XXXXX-XX2) (Note 13) Output Noise, Diff (Direct Coupled) Output Offset Voltage, Transformer Coupled Across 70 ohms Rise/Fall Time (BU-65XXXX3, BU-65XXXX4) LOGIC VIH All signals except PCI, SLEEP_ IN VIL All signals except PCI, SLEEP_ IN Schmidt Hysteresis All signals except PCI IIH, IIL All signals except PCI, SLEEP_ IN IIH (Vcc=3.6V, VIN=Vcc) IIH (Vcc=3.6V, VIN=2.7V) IIL (Vcc=3.6V, VIN=0.4V) VIH SLEEP_IN (Vcc=3.6V) VIL SLEEP_IN (Vcc=3.0V) IIH, IIL SLEEP_IN IIH (Vcc=3.6V, VIN=2.7V) IIL (Vcc=3.6V, VIN=0.0V) VOH (Vcc=3.0V, IOH=max) VOL (Vcc=3.0V, IOL=max) IOL IOH CI (Input Capacitance) PCI LOGIC see PCI spec 3.3V signaling environment CI (Input Capacitance) all PCI except PCI_CLK & IDSEL CI (Input Capacitance) PCI_CLK CI (Input Capacitance) IDSEL Data Device Corporation www.ddc-web.com MIN TYP MAX 4.0 4.5 V V -0.3 7.0 V -0.3 -0.3 Vdd+0.3 V V 2.5 50 pF 0.860 Vp-p 10 Vpeak 6 7 9 Vp-p 18 20 20 21.5 -250 150 27 27 10 250 Vp-p Vp-p mVp-p mVp 100 200 150 250 300 300 ns ns 2.1 V 0.7 0.4 V POWER DISSIPATION (NOTES 17-18) Total Hybrid (3.3V Transceiver) * BU-65863X8(9)-XX0 * Idle w/ transceiver SLEEPIN asserted * Idle w/ transceiver SLEEPIN negated * 25% Transmitter Duty Cycle * 50% Transmitter Duty Cycle * 100% Transmitter Duty Cycle * BU-65863F(G)8-XX2, BU-65863B8-E02 * Idle w/ transceiver SLEEPIN asserted * Idle w/ transceiver SLEEPIN negated * 25% Transmitter Duty Cycle * 50% Transmitter Duty Cycle * 100% Transmitter Duty Cycle V 10 -33 -33 0.9 10 -20 2.4 POWER SUPPLY REQUIREMENTS (3.3V TRANSCEIVER) Voltages/Tolerances * +3.3V Current Drain (Total Hybrid) (Note 17) * BU-65863F(G)8(9)-XX0 * Idle w/ transceiver SLEEPIN asserted * Idle w/ transceiver SLEEPIN negated * 25% Transmitter Duty Cycle * 50% Transmitter Duty Cycle * 100% Transmitter Duty Cycle * BU-65863F(G)8-XX2, BU-65863B(R)8-E02 * Idle w/ transceiver SLEEPIN asserted * Idle w/ transceiver SLEEPIN negated * 25% Transmitter Duty Cycle * 50% Transmitter Duty Cycle * 100% Transmitter Duty Cycle * BU-65843F(G)8(9)-XX0, BU-65743F(G)8(9)-XX0 * Idle w/ transceiver SLEEPIN asserted * Idle w/ transceiver SLEEPIN negated * 25% Transmitter Duty Cycle * 50% Transmitter Duty Cycle * 100% Transmitter Duty Cycle * BU-65743F(G)8-XX2, BU-65843X8(R)-XX2 * Idle w/ transceiver SLEEPIN asserted * Idle w/ transceiver SLEEPIN negated * 25% Transmitter Duty Cycle * 50% Transmitter Duty Cycle * 100% Transmitter Duty Cycle k 0.200 -10 -100 -100 2.5 PARAMETER UNITS -0.3 -0.3 6.0 TABLE 1. PCI MINI-ACE MARK3/MICRO-ACE TE SPECIFICATIONS (CONT.) 70 +20 A A A V V -3.4 20 A A V V mA mA pF 10 4 6 pF pF pF 0.4 3.4 3 MIN TYP MAX UNITS 3.15 3.3 3.45 V 31 67 mA 77 110 mA 267 457 837 315 515 915 mA mA mA 27 67 mA 76 110 mA 242 383 725 335 535 995 mA mA mA 16 52 mA 56 95 mA 246 436 816 300 500 900 mA mA mA 12 52 mA 55 95 mA 221 362 704 320 520 980 mA mA mA 0.10 0.22 W 0.25 0.36 W 0.62 0.97 1.64 0.74 1.09 1.79 W W W 0.10 0.22 W 0.25 0.36 W 0.64 1.00 1.73 0.76 1.13 1.88 W W W BU-65743/65843/65863/65864 AC-6/11-0 TABLE 1. PCI MINI-ACE MARK3/MICRO-ACE TE SPECIFICATIONS (CONT.) PARAMETER POWER DISSIPATION (NOTES 17-18) Total Hybrid (3.3V Transceiver) (CONT) * BU-65743F(G)8(9)-XX0, BU-65843F(G)8(9)-XX0 * Idle w/ transceiver SLEEPIN asserted * Idle w/ transceiver SLEEPIN negated * 25% Transmitter Duty Cycle * 50% Transmitter Duty Cycle * 100% Transmitter Duty Cycle * BU-65743F(G)8-XX2, BU-65843F(G)8-XX2, BU-65843B8-E02 * Idle w/ transceiver SLEEPIN asserted * Idle w/ transceiver SLEEPIN negated * 25% Transmitter Duty Cycle * 50% Transmitter Duty Cycle * 100% Transmitter Duty Cycle MIN HOTTEST DIE (3.3V TRANSCEIVER) * BU-65XXXX8(9)-XX0 * Idle * 25% Transmitter Duty Cycle * 50% Transmitter Duty Cycle * 100% Transmitter Duty Cycle * BU-65XXXX8-XX2 * Idle * 25% Transmitter Duty Cycle * 50% Transmitter Duty Cycle * 100% Transmitter Duty Cycle POWER SUPPLY REQUIREMENTS (5V TRANSCEIVER) Voltages/Tolerances +3.3V (Logic) VCC +5V (XCVR or 5V VCC CHA/B) +5V (RAM for BU-65864B(R)3) Current Drain (Total Hybrid) * BU-65863F(G)3(4)-XX0 +5V (XCVR) * Idle * 25% Transmitter Duty Cycle * 50% Transmitter Duty Cycle * 100% Transmitter Duty Cycle +3.3V (Logic) * BU-65863F(G)3-XX2 +5V (XCVR) * Idle * 25% Transmitter Duty Cycle * 50% Transmitter Duty Cycle * 100% Transmitter Duty Cycle +3.3V (Logic) * BU-65864B(R)3-E02 +5V (RAM, CHA, CHB) * Idle * 25% Transmitter Duty Cycle * 50% Transmitter Duty Cycle * 100% Transmitter Duty Cycle +3.3V (Logic) Data Device Corporation www.ddc-web.com 3.0 4.75 4.5 TYP MAX TABLE 1. PCI MINI-ACE MARK3/MICRO-ACE TE SPECIFICATIONS (CONT.) UNITS 0.10 0.17 W 0.18 0.31 W 0.47 0.72 1.22 0.69 1.04 1.74 W W W 0.10 0.17 W 0.18 0.31 W 0.49 0.76 1.31 0.71 1.08 1.83 W W W 0.07 0.37 0.70 1.37 0.11 0.45 0.80 1.51 W W W W 0.07 0.37 0.59 1.13 0.11 0.47 0.84 1.59 W W W W 3.3 5.0 5.0 3.6 5.5 5.5 V V V 65 169 273 481 45 100 205 310 520 60 mA mA mA mA mA 65 180 295 525 45 100 216 332 565 60 mA mA mA mA mA 66 174 282 498 25 120 236 352 585 40 mA mA mA mA mA PARAMETER MIN POWER SUPPLY REQUIREMENTS (5V TRANSCEIVER)(CONT) * BU-65743F(G)3(4)-XX0, BU-65843F(G)3(4)-XX0 +5V (XCVR) * Idle * 25% Transmitter Duty Cycle * 50% Transmitter Duty Cycle * 100% Transmitter Duty Cycle +3.3V (Logic) * BU-65743F(G)3-XX2, BU-65843F(G)3-XX2, BU-65843B3-E02 +5V (XCVR or 5V ChA, 5V Ch B) * Idle * 25% Transmitter Duty Cycle * 50% Transmitter Duty Cycle * 100% Transmitter Duty Cycle +3.3V (Logic) POWER DISSIPATION (NOTE 15) TOTAL HYBRID (5V TRANSCEIVER) * BU-65863F(G)3(4)-XX0 * Idle * 25% Transmitter Duty Cycle * 50% Transmitter Duty Cycle * 100% Transmitter Duty Cycle * BU-65863F(G)3-XX2 * Idle * 25% Transmitter Duty Cycle * 50% Transmitter Duty Cycle * 100% Transmitter Duty Cycle * BU-65864B(R)3-E02 * Idle * 25% Transmitter Duty Cycle * 50% Transmitter Duty Cycle * 100% Transmitter Duty Cycle * BU-65743F(G)3(4)-XX0 BU-65843F(G)3(4)-XX0 * Idle * 25% Transmitter Duty Cycle * 50% Transmitter Duty Cycle * 100% Transmitter Duty Cycle * BU-65743F(G)3-XX2 BU-65843F(G)3-XX2, BU-65843B3-E02 * Idle * 25% Transmitter Duty Cycle * 50% Transmitter Duty Cycle * 100% Transmitter Duty Cycle HOTTEST DIE (5V TRANSCEIVER) * BU-65XXXX3(4)-xx0 * Idle * 25% Transmitter Duty Cycle * 50% Transmitter Duty Cycle * 100% Transmitter Duty Cycle * BU-65XXXX3-xx2 * Idle * 25% Transmitter Duty Cycle * 50% Transmitter Duty Cycle * 100% Transmitter Duty Cycle 4 TYP MAX UNITS 65 169 273 481 25 100 205 310 520 40 mA mA mA mA mA 65 180 295 525 25 100 216 332 565 40 mA mA mA mA mA 0.41 0.73 1.02 1.63 0.75 1.00 1.23 1.68 W W W W 0.41 0.76 1.13 1.86 0.75 1.04 1.34 1.94 W W W W 0.44 0.80 1.17 1.89 0.80 1.09 1.39 1.97 W W W W 0.41 0.70 0.94 1.40 0.63 0.85 1.07 1.51 W W W W 0.41 0.72 0.97 1.45 0.63 0.86 1.09 1.56 W W W W 0.18 0.42 0.66 1.14 0.28 0.51 0.75 1.22 W W W W 0.18 0.48 0.78 1.39 0.28 0.58 0.88 1.48 W W W W BU-65743/65843/65863/65864 AC-6/11-0 TABLE 1. PCI MINI-ACE MARK3/MICRO-ACE TE SPECIFICATIONS (CONT.) PARAMETER CLOCK INPUT PCI CLOCK INPUT FREQUENCY 1553 Clock Frequency * Default Mode * Option * Option * Option * Long Term Tolerance * 1553A Compliance * 1553B Compliance * Short Term Tolerance, 1 second * 1553A Compliance * 1553B Compliance MIN MAX 33.3 16.0 12.0 10.0 20.0 UNITS MHz MHz MHz MHz 0.01 0.10 % % -0.001 0.001 % % -0.01 0.01 2.5 s 9.5 s 10.0 to 10.5 17.5 21.5 49.5 127 4 18.5 22.5 50.5 129.5 19.5 23.5 51.5 131 7 s s s s s -55 -40 0 -40 -65 12 C/W +125 +85 +70 +100 +150 C C C C C +300 C +245 C MSL-3 ESD Class 0 10. 11. 12. 13. 14. 15. 16. 17. 18. 19. 5 UNITS Micro-ACE-TE Moisture Sensitivity Level Electrostatic Discharge Sensitivity 324-ball Plastic BGA Size, Maximum Weight C/W MAX 0.89 X 0.89 X 0.130 (22.6 x 22.6 x 3.3) Lead Toe-to-Toe Distance 80-Pin Gull Lead, MAXIMUM Weight TABLE 1 NOTES: Notes 1 through 6 are applicable to the Receiver Differential Resistance and Differential Capacitance specifications: 1. Specifications include both transmitter and receiver (tied together internally). 2. Impedance parameters are specified directly between pins TX/RX_A(B) and TX/RX_A(B) of the PCI Mini-ACE Mark3/PCI Micro-ACE TE hybrid. 3. It is assumed that all power and ground inputs to the hybrid are connected. 4. The specifications are applicable for both unpowered and powered conditions. 5. The specifications assume a 2 volt rms balanced, differential, sinusoidal input. The applicable frequency range is 75 kHz to 1 MHz. 6. Minimum resistance and maximum capacitance parameters are guaranteed over the operating range, but are not tested. 7. Assumes a common mode voltage within the frequency range of dc to 2 MHz, applied to pins of the isolation transformer on the stub side (either direct or transformer coupled), and referenced to hybrid ground. Transformer must be a DDC recommended transformer or other transformer that provides an equivalent minimum CMRR. 8. Typical value for minimum intermessage gap time. Under software control, this may be lengthened to 65,535 ms - message time, in increments of 1 s. If ENHANCED CPU ACCESS, bit 14 of Configuration Register #6, is set to logic "1", then host accesses during BC Start-of-Message (SOM) and Endof-Message (EOM) transfer sequences could have the effect of lengthening the intermessage gap time. For each host access during an SOM or EOM sequence, the intermessage gap time will be lengthened by 6 clock cycles. Since there are 7 internal transfers during SOM, and 5 during EOM, this could theoretically lengthen the intermessage gap by up to 72 clock cycles; i.e., up to 7.2 s with a 10 MHz clock, 6.0 s with a 12 MHz clock, 4.5 s with a 16 MHz clock, or 3.6 s with a 20 MHz clock. 9. For Enhanced BC mode, the typical value for intermessage gap time is Data Device Corporation www.ddc-web.com TYP PHYSICAL CHARACTERISTICS 80-Pin, Ceramic Flatpack/Gull Lead Size, MAXIMUM s 11 MIN Soldering Flat Pack/Gull Wing Lead Temperature (soldering, 10 sec.) 324-ball BGA Package The reflow profile detailed in IPC/ JEDEC J-STD-020 is applicable for both leaded and lead-free products s 660.5 9 PARAMETER THERMAL (CONT.) 324-Ball Plastic BGA Thermal Resistance,Junction-to-Ball, Hottest Die (JB) ALL PACKAGES Operating Case/Ball Temperature -1XX, -4XX -2XX, -5XX -3XX, -8XX -EXX Storage Temperature MHz -0.01 -0.10 1553 MESSAGE TIMING Completion of CPU Write (BC Start)-to-Start of First Message (for Non-enhanced BC Mode) BC Intermessage Gap (Note 8) Non-enhanced (Mini-ACE compatible) BC mode Enhanced BC mode (Note 9) BC/RT/MT Response Timeout (Note 10) * 18.5 nominal * 22.5 nominal * 50.5 nominal * 128.0 nominal RT Response Time (mid-parity to mid-sync) (Note 11) Transmitter Watchdog Timeout THERMAL 80-Pin, Ceramic Flatpack/Gull Lead Thermal Resistance, Junction-toCase, Hottest Die (JC) (Note 12) TYP TABLE 1. PCI MINI-ACE MARK3/MICRO-ACE TE SPECIFICATIONS (CONT.) in. (mm) 1.13 (28.7) 0.4 (10) in. (mm) Oz. (g) 0.815 X 0.815 X 0.120 (20.7 x 20.7 x 3.05) 0.088 (2.5) in. (mm) Oz. (g) approximately 10 clock cycles longer than for the non-enhanced BC mode. That is, an addition of 1.0 s at 10 MHz, 833 ns at 12 MHz, 625 ns at 16 MHz, or 500 ns at 20 MHz. Software programmable (4 options). Includes RT-to-RT Timeout (measured mid-parity of transmit Command Word to mid-sync of transmitting RT Status Word). Measured from mid-parity crossing of Command Word to mid-sync crossing of RT's Status Word. JC is measured to the bottom of the case, and the numbers indicated are preliminary External 10 F Tantalum and 0.1 F capacitors should be located as close as possible to Pin 10, and a 0.1 F at pins 30, 51 & 69. MIL-STD-1760 requires that the PCI Mini-ACE Mark3 produce a 20 Vp-p minimum output on the stub connection. Power dissipation specifications assume a transformer coupled configuration with external dissipation (while transmitting) of 0.14 watts for the active isolation transformer, 0.08 watts for the active bus coupling transformer, 0.45 watts for each of the two bus isolation resistors and 0.15 watts for each of the two bus termination resistors. The 5V tolerant pins are RTAD0-5, RTAD_PAR, RTAD_LAT, TXINH_A/B, SSFLAG*/EXT_TRIG, TAG_CLK, RTBOOT_L, CLK_SEL_0 and CLK_SEL_1. Current drain and power dissipation specs are based upon a small sampling of 3.3V transceivers and are subject to change. Power dissipation is the input power minus the power delivered to the 1553 fault isolation resistors, the power delivered to the bus termination resistors and the copper losses in the transceiver isolation transformer and the bus coupling transformer. The effective input capacitance as seen from the 1553 bus is reduced by the square of the turns ratio of the coupling transformer. BU-65743/65843/65863/65864 AC-6/11-0 INTRODUCTION One of the salient features of the PCI Mini-ACE Mark3 is its Enhanced Bus Controller architecture. The Enhanced BC's highly autonomous message sequence control engine provides a means for offloading the host processor for implementing multiframe message scheduling, message retry schemes, data double buffering, and asynchronous message insertion. For the purpose of performing messaging to the host processor, the Enhanced BC mode includes a General Purpose Queue, along with user-defined interrupts. The BU-65743 RT, and BU-65843/65864 BC/RT/MT PCI MiniACE Mark3/Micro-ACE TE family of MIL-STD-1553 terminals comprise a complete integrated interface between a PCI host processor and a MIL-STD-1553 bus. All members of the PCI Mini-ACE Mark3 family are packaged in the same 0.88" square, 80-lead CQFP package. All members of the PCI Micro-ACE TE family are packaged in the same 0.8" square, 324 ball, plastic BGA package. The PCI Mini-ACE Mark3/Micro-ACE TE RT offers the same choices of single and circular buffering for individual subaddresses as ACE, Mini-ACE(Plus), and Enhanced Mini-ACE. New enhancements to the RT architecture include a global circular buffering option for multiple (or all) receive subaddresses, a 50% rollover interrupt for circular buffers, an interrupt status queue for logging up to 32 interrupt events, and an option to automatically initialize to RT mode with the Busy bit set. The interrupt status queue and 50% rollover interrupt features are also included as improvements to the PCI Mini-ACE Mark3/Micro-ACE TE's Monitor architecture. The PCI Mini-ACE Mark3/Micro-ACE TE hybrid's provide software compatibility with the Enhanced Mini-ACE, Mini-ACE (Plus) terminals, as well as software compatibility with the older ACE series. The PCI Mini-ACE Mark3/Micro-ACE TE provides complete multiprotocol support of MIL-STD-1553A/B/McAir and STANAG 3838. All versions integrate dual transceivers; along with protocol, host interface, memory management logic; and a minimum of 4K words of RAM. In addition, the BU-6586X BC/RT/MT terminals include 64K words of internal RAM, with built-in parity checking. The PCI Mini-ACE Mark3 series terminals operate over the full military temperature range of -55C to +125C. Available screened to MIL-PRF-38534C, the terminals are ideal for military and industrial processor to 1553 applications. The PCI Mini-ACE Mark3s include a 3.3V or 5V voltage source transceiver for improved line driving capability, with options for MIL-STD-1760 and McAir compatibility. The PCI Micro-ACE TEs are available with 3.3V or 5V voltage source transceivers but do not offer a McAir option. Please consult the ordering information section at the end of this document for all available options. The PCI Micro-ACE TE terminals operate over an extended temperature range of -40C to +100C. TRANSCEIVERS The transceivers in the PCI Mini-ACE Mark3 series terminals are fully monolithic, requiring only a +3.3V power input or a +5V power input. The transmitters are voltage sources, which provide improved line driving capability over current sources. This serves to improve performance on long buses with many taps. The transmitters also offer an option which satisfies the MILSTD-1760 requirement for a minimum of 20 volts peak-to-peak, transformer coupled output. The transceivers in the PCI MicroACE TE are only available with the MIL-STD-1760 option. To provide further flexibility, the PCI Mini-ACE Mark3/Micro-ACE TE has internal 1553 master clock dividers that allow operation with either 10, 12, 16, or 20 MHz clock inputs. The 1553 master clock divider is software programmable or, in the case of the Micro ACE TE, can be controlled via pins when the RTBoot mode is strapped. The PCI Mini-ACE Mark3/Micro-ACE TEs are fully compliant targets, as defined by the PCI Local Bus Specification Revision 2.2, using a 32 bit interface that operates at clock speeds of up to 33 Mhz, from a 3.3V bus. The interface supports PCI interrupts and contains a FIFO that handles PCI burst write transfer cycles. The FIFO is deep enough to accept an entire 1553 message. The PCI interface is NOT 5V tolerant and can not be used in a 5V PCI signaling environment. Data Device Corporation www.ddc-web.com Besides eliminating the demand for an additional power supply, the use of a +3.3V only or +5V only transceiver requires the use of a step-up, rather than a step-down, isolation transformer. This provides the advantage of higher terminal input impedance than is possible for a 15 volt or 12 volt transmitter. As a result, there is a greater margin for the input impedance test, mandated for the 6 BU-65743/65843/65863/65864 AC-6/11-0 1553 validation test. This characteristic allows for longer cable lengths between a system connector and the isolation transformers of an embedded 1553 terminal. TABLE 2. PCI TARGET COMMAND CODES COMMAND TYPE To provide compatibility to McAir specs, the PCI Mini-ACE Mark3 is available with an option for transmitters with increased rise and fall times. All PCI Micro-ACE TE parts can be operated with external transceivers. This is achieved by bonding out the required protocol and transceiver I/O pads to BGA balls. Most applications will use the internal transceivers, which requires PCB traces to interconnect protocol output balls to transceiver input balls and transceiver output balls to protocol input balls. These interconnections are listed in TABLE 71. CODE (C/BE[3:0]#) MEMORY READ 0110 (6h) MEMORY WRITE 0111 (7h) CONFIGURATION READ 1010 (Ah) CONFIGURATION WRITE 1011 (Bh) MEMORY READ MULTIPLE 1100 (Ch) MEMORY READ LINE 1110 (Eh) MEMORY WRITE & INVALIDATE 1111 (Fh) The 3.3V transceiver parts also have a SLEEP_IN input. Asserting SLEEP_IN puts the transceivers into a power saving mode during which the receiver and transmitter of the transceivers are disabled. The PCI Mini-ACE Mark3 does not implement the Memory Read Multiple, Memory Read Line or Memory Write and Invalidate commands. However, in accordance with PCI rules, the PCI MiniACE Mark3 will accept these requests and alias them to the basic memory commands. For example, Memory Read Multiple and Memory Read Line commands will be accepted and treated as Memory Read commands. Similarly, the PCI Mini-ACE Mark3 will accept a memory Write and Invalidate command and treat it as a Memory Write command. The receiver sections of the PCI Mini-ACE Mark3/Micro-ACE TE are fully compliant with MIL-STD-1553B Notice 2 in terms of front-end overvoltage protection, threshold, common mode rejection, and word error rate. PCI REGISTER AND MEMORY ADDRESS The PCI Interface contains a set of "Type 00h" PCI configuration registers that are used to map the device into the host system. There are two Base Address Registers that are used to implement ACE memory space (BAR0) and register space (BAR1). The PCI configuration register space is mapped in accordance with PCI revision 2.2 specifications. ACE memory is accessed internally in 16-bit words, but memory is accessed sequentially allowing for 32-bits of data to be read from the PCI bus. In other words, if a 32-bit PCI read is requested the first 16 bits of data would be read from the requested internal address, the next 16 bits of data would be read from the initial internal address + 1, and then the resulting 32-bit double word would be transferred to the PCI bus. The PCI Mini-ACE Mark3 supports 32-bit and 16-bit read and write operations, 8 bit reads will return 16 bit data, and 8 bit writes are illegal and will cause target-aborts. The PCI Mini-ACE Mark3 acts as a target and responds to the following PCI commands: Data Device Corporation www.ddc-web.com 7 BU-65743/65843/65863/65864 AC-6/11-0 TABLE 3. CONFIGURATION REGISTER SPACE FOR THE PCI MINI-ACE MARK3/MICRO-ACE TE ADDRESS 16 15 24 23 31 8 7 00h 04h 0Xh (X varies with part #, see text) DDC Manufacturer Device ID value (4DDCH) Status Register 04h Command Register Rev ID = 02h Class Code = 078000h 08h BIST 00h 0Ch 0 Vendor ID Device ID Latency Timer 00h Header Type 00h Cache Line Size 00h Base Address Register 0 (for ACE memory) 10h R/W R/W and 0's (see text) 00h 00h Base Address Register 1 (for ACE registers) 14h R/W R/W and 0's (see text) R/W 00h 18h - 24h 28h Base Address Registers 2 through 5 (not used) 00000000h Card Bus CIS pointer (not used) 00000000h 2Ch Subsystem Device and Subsystem Vendor ID Same as Configuration Register 0, Alias Reads to Configuration Register 00 30h 34h-38h Expansion ROM Base Address (Not Used, bit = 0) Reserved 3Ch Max Lat 00h Min Gnt 00h Interrupt Pin 01h The ACE register mapping is located in PCI memory space. Although the PCI Mini-ACE Mark3 can be accessed in 32-bit words, all ACE registers are accessed in 16 bit word reads / writes. If a 32-bit read is performed from the PCI bus in ACE register space only the first 16 bits of data are valid. TABLE 4. DEVICE ID FIELD MAPPING DESCRIPTION DEVICE ID This data sheet will only describe the PCI registers that are specific to configuring the integrated terminal and shared RAM. For specifics or definitions on other PCI bus configuration registers, please see the PCI Local Bus specification revision 2.2. 0400h BC/RT/MT WITH 4K OF RAM (BU-65843) 0402h BC/RT/MT WITH 64K OF RAM (BU-65864) 0404h RT ONLY WITH 4K OF RAM (BU-65743) TABLE 5. PCI COMMAND REGISTER Vendor ID field contains the vendor's ID configuration register. Data Device Corporation's ID code is 4DDCh. BIT 15:10 Device ID field is used to indicate the device being used. This field is configured by DDC to reflect the part value of the device. The following TABLE 4 represents all possible combinations for the Device ID field: RESERVED, 0'S 0 8 SERR# ENABLE 7 0 6 PARITY ERROR CONTROL 1 0 (LSB) 8 DESCRIPTION 9 5:2 Data Device Corporation www.ddc-web.com Interrupt Line R/W 0 MEMORY SPACE 0 BU-65743/65843/65863/65864 AC-6/11-0 PCI COMMAND REGISTER TABLE 6. PCI STATUS REGISTER Reserved: These bits are read-only and return zeroes when read. BIT SERR# Enable: This is an enable bit for the SERR# driver. A value of 0b disables the driver. A value of 1b enables the driver. The value after RST# is 0b. 31 DETECTED PARITY ERROR 30 SIGNALED SYSTEM ERROR 29:28 27 Parity Error Control: This bit controls the device's response to parity errors. When the bit is 1b, the device will take its normal action when a parity error is detected. When this bit is 0b, the device will ignore any parity errors that it detects and continue normal operation. The value after RST# is 0b. 26:25 Memory Space: This bit controls the device's response to memory space accesses. A value of 0b disables the device response. A value of 1b allows the device to respond to memory space accesses. The value after RST# is 0b. DESCRIPTION 0 SIGNALED TARGET ABORT DEVSEL# TIMING = 01 (MEDIUM) 24 0 23 FAST BACK-TO-BACK CAPABLE = 1 22:21 0 20:16 RESERVED, 0'S TABLE 7. (BAR0) ACE MEMORY ADDRESS OFF-SET PCI STATUS REGISTER This register records status information for PCI bus related events. Reads to this register behave normally, but writes can only reset bits. A bit is reset whenever the register is written and the data in the corresponding bit location is a 1. 00000-1FFFC DEFINITION PCI MINI-ACE MARK3/MICRO-ACE TE MEMORY SPACE BAR0 will read back the same for both the 4K word ACE parts (BU-65743/843) and the 64K word ACE (BU-65864). Detected Parity Error: This bit will be set by the device whenever it detects a parity error, even if the Parity Error Control bit in the PCI Control register is 0b. PCI Mini-ACE MARK3/Micro-ACE TE Memory Space: The least significant bit (LSB) of the PCI address is dropped to form the ACE memory address. Signaled System Error: This bit indicates when the device has asserted SERR#. The value after RST# is 0b. BAR1: Used to access ACE register locations. The ACE is allotted a maximum of 4K bytes for its register space. BAR1 will read back as FFFFF000h after all Fs are written to it. All ACE register locations are accessible through the PCI host via the BAR1 offsets 000h to 0FCh. The PCI-to-ACE interface control/status registers are at 800h to 81Ch. PCI accesses outside of these specific regions (e.g., to offset 100h or 820h, etc.) will produce Target Aborts. Signaled Target Abort: This bit is set whenever the device terminates a transaction with a Target-Abort. The value after RST# is 0b. DEVSEL# Timing: The PCI Mini-ACE Mark3 is 01b, medium. Fast Back-to-Back Capable: This bit is set to 1b and indicates that the device is capable of accepting fast back-to-back transactions. PCI Mini-ACE MARK3/Micro-ACE TE Register Space: Register accesses are on a 32-bit boundary: the last 2 bits of the PCI address are dropped to form the internal ACE address. (e.g. 000 = ACE Reg 0, 004 = ACE Reg1, 008 = ACE Reg2, etc.). Refer to TABLE 18 for a listing of these registers. These registers are nearly 100% compatible with the Enhanced Mini-ACE registers. For an exhaustive discussion of these registers and 1553 BC/RT/ MT operation, please refer to the "Enhanced Mini-ACE User Guide". Reserved: These bits are read-only and return zeroes when read. Subsystem Vendor ID/Subsystem Device ID: Field is an alias of the Vendor ID/Device ID fields in Configuration Register 00h. Base Address Registers: Used to implement ACE memory space (BAR0) and ACE register space (BAR1). Base Address Registers 2 through 5 are not used. BAR0: Used to access ACE memory space. The ACE is allotted a maximum of 64K words, 128K bytes, for its memory space. BAR0 will read back as FFFE0000 after all Fs are written to it. Data Device Corporation www.ddc-web.com 9 BU-65743/65843/65863/65864 AC-6/11-0 TABLE 8. (BAR1)ACE/CONTROL REGISTERS - 4K BYTE TOTAL SPACE ADDRESS OFFSET DEFINITION/ACCESSIBILITY NAME 000-0FC ACE PCI MINI-ACE MARK3/MICRO-ACE TE/REGISTER SPACE 100-7FC -- RESERVED (TARGET ABORT IF ACCESSED) 800 REG0 GLOBAL ACTIVITY (RD) 804 REG1 FAIL-SAFE OPERATION/INTERRUPT (RW/WR) 808 REG2 FAIL-SAFE TIMER (RD) 80C REG3 FAIL-SAFE TIMER PRELOAD (RD/WR) 810 REG4 DISCARD TIMER (RD) 814 REG5 DISCARD TIMER PRELOAD (RD/WR) 818 REG6 GENERAL PURPOSE, CUSTOMER USE (RD/WR) 81C REG7 CLEAR FAIL-SAFE INT/RESET ACE (WR) -- RESERVED (TARGET ABORT IF ACCESSED) 820-FFC TABLE 9. REG0 GLOBAL ACTIVITY REGISTER (READ 800H) BIT 31 (MSB) DESCRIPTION PCI INTERRUPT ACTIVE 30 FIFO NOT EMPTY 29 0 28 0 27 0 26 0 25 0 24 1 23 BAR1 DRR_DATA_DISCARD 22 FAIL_SAFE ERROR 21 0 20 0 19 0 18 0 17 0 16 PCI MINI-ACE MARK3/MICRO-ACE TE INTERRUPT ACTIVE 15 0 * * * * * * 0 (LSB) 0 This register will be all 0s after RST#, except for bit 24. Data Device Corporation www.ddc-web.com 10 BU-65743/65843/65863/65864 AC-6/11-0 PCI_INTERRUPT ACTIVE: When set to '1', indicates that PCI Mini-ACE Mark3/Micro-ACE TE has asserted it's interrupt pin. The three possible sources (if enabled and active) are the ACE core, FailSafe timer and BAR1 DRR_DATA_DISCARD. BITS 30 - 22: Reserved, write as 0s FIFO NOT EMPTY: When set to '1', indicates that the write FIFO is not empty. BAR1 DRR_DATA_DISCARD INTERRUPT ENABLE: Enables interrupt to occur on a BAR1 delayed read timeout. BAR1 DRR_DATA_DISCARD: If the data discard timer times out while waiting for a retry on a BAR1 access, this bit will be set. If BAR1 read is discarded, it may have caused an action (for example clearing an ACE interrupt) that has not been recognized by the PCI MASTER. FAILSAFE INTERRUPT ENABLE: When set to a "1", an interrupt is generated if not in FAILSAFE OFF mode and a FAILSAFE error is detected. PCI MINI-ACE MARK3/MICRO-ACE TE INTERRUPT ENABLE: Must be set to "1". FAIL SAFE ERROR: If not in FAIL_SAFE OFF mode and fail safe error occurs (ACE does not respond), this bit will be set. Failsafe errors are extremely unlikely. FAILSAFE INTERRUPT AUTOCLEAR ENABLE: If set, causes interrupt and the FAIL_SAFE ERROR bit (REG0-bit 22) to be cleared whenever upper word of REG0 is read by the PCI MASTER. If not set, bit 1 in Reg 7 must be used to clear Failsafe interrupts. DRR_HOLD: When '0', a delayed read request is discarded if the PCI Mini-ACE Mark3/Micro-ACE TE has obtained requested data and a different transaction is requested. When '1', delayed read request is held until master repeats original request or timeout occurs. FAILSAFE MODE: Fail Safe Errors occur when the internal ACE fails to assert it's hand-shake signal within 1 millisecond (programmable) of when the internal Strobe or Request signal is asserted. Four possible FAILSAFE Modes determine how this situation is handled. TABLE 10. REG1 FAIL-SAFE OPERATION/INTERRUPT REGISTER (READ/WRITE 804H) DESCRIPTION BIT 31 (MSB) 30 DRR_HOLD RESERVED, WRITE AS 0 * * * * * * 22 RESERVED, WRITE AS 0 21 PCI MINI-ACE MARK3/MICRO-ACE TE INTERRUPT ENABLE 20 BAR1 DRR_DATA_DISCARD INTERRUPT ENABLE 19 FAILSAFE INTERRUPT ENABLE 18 FAILSAFE INTERRUPT AUTOCLEAR ENABLE 17 FAILSAFE MODE - BIT 1 (MSB) 16 FAILSAFE MODE - BIT 0 (LSB) 15 RESERVED , WRITE AS 0 * * * * * * 0(LSB) RESERVED, WRITE AS 0 This register will be all 0s after RST#, except for bit 17 will be 1 (Fail-safe mode = fail-safe halt). Note that Failsafe errors are extremely unlikely. Data Device Corporation www.ddc-web.com 11 BU-65743/65843/65863/65864 AC-6/11-0 TABLE 13. REG3 FAIL-SAFE TIMER PRELOAD REGISTER (READ/WRITE 80CH) TABLE 11. FAILSAFE MODE BIT 17 BIT 16 FAILSAFE MODE BIT DESCRIPTION 0 0 FAILSAFE OFF 31(MSB) 0 0 1 FAILSAFE RETRY * * 1 0 FAILSAFE HALT * * 1 1 FAILSAFE SKIP * * 16 0 15 FAIL-SAFE TIMER VALUE - BIT 15 (MSB) NOTE: FAILSAFE errors are extremely unlikely. MODE 1 - FAILSAFE OFF. PCI Mini-ACE Mark3/Micro-ACE TE will wait indefinitely for the transaction to complete. The local bus could hang as a result. The FAILSAFE ERROR bit and interrupt will not be generated even if the enable bit is set. * * * * * * 0 (LSB) MODE 2 - FAILSAFE RETRY. PCI Mini-ACE Mark3/Micro-ACE TE will retry the transfer on the local bus when the FAILSAFE timer times out. FAIL-SAFE TIMER VALUE - BIT 0 (LSB) FAIL-SAFE TIMER VALUE: Write to this register to set the value for the fail-safe timer. The default value is 8400h and no access to this register is needed for normal applications. MODE 3 - FAILSAFE HALT. Once the FAILSAFE timer times out, all future transfers will be terminated with a target abort until the PCI master clears the interrupt. TABLE 14. REG4 DISCARD TIMER REGISTER (READ 810H) MODE 4 - FAILSAFE SKIP. Once the FAILSAFE timer times out, the current transaction is discarded or skipped and the next transaction, whether a stored write in the FIFO or a new transaction, will be attempted. BIT BITS 15-0 ARE RESERVED: Write these bits as 0s. TABLE 12. REG2 FAIL-SAFE TIMER REGISTER (READ 808H) DESCRIPTION 31(MSB) 0 * * * * * * 16 0 15 DISCARD TIMER CURRENT - BIT 15 (MSB) * * 0 * * * * * * * * 0 (LSB) BIT 31(MSB) DESCRIPTION * * 16 0 15 FAIL-SAFE TIMER COUNT - BIT 15 (MSB) * * * * * * 0 (LSB) DISCARD TIMER CURRENT - BIT 0 (LSB) DISCARD TIMER CURRENT: Read this register to obtain the current value of the DISCARD TIMER. Default is 0000h. FAIL-SAFE TIMER COUNT - BIT 0 (LSB) FAIL-SAFE TIMER COUNT: Read this register to obtain the current value of the fail-safe timer. Default is 8400h. Data Device Corporation www.ddc-web.com 12 BU-65743/65843/65863/65864 AC-6/11-0 TABLE 15. REG5 DISCARD TIMER PRELOAD REGISTER (READ/WRITE 814H) BIT BITS 31-2 ARE RESERVED AND MUST BE WRITTEN AS 0s CLEAR FAILSAFE INTERRUPT: Clears the Failsafe Interrupt when set to "1". Failsafe interrupts can also be cleared via the Failsafe Interrupt Autoclear mechanism, enabled by bit 18 in Reg 1. DESCRIPTION 31(MSB) 0 * * * * * * 16 0 15 DISCARD TIMER VALUE - BIT 15 (MSB) * * * * * * 0 (LSB) ACE RESET: Resets the ACE when set to "1". PCI MINI-ACE MARK3/MICRO-ACE TE REGISTER AND MEMORY ADDRESSING The software interface of the enhanced Mini-ACE portion of the PCI Mini-ACE Mark3/Micro ACE TE to the host processor consists of 24 internal operational registers for normal operation, an additional 24 test registers, plus 64K words of shared memory address space. The PCI Mini-ACE Mark3/Micro-ACE TE's 4K X 16 or 64K X 17 internal RAM resides in this address space. DISCARD TIMER VALUE - BIT 0 (LSB) DISCARD TIMER VALUE: Write this register to set the value to be used for the discard timer. The default value is "0". The default value meets the PCI spec and no access to this register is needed for normal applications. For normal operation, the host processor only needs to access the lower 32 register address locations (internal address 00-1F). The next 32 locations (internal address 20-3F) should be reserved, since many of these are used for factory test. INTERNAL REGISTERS TABLE 16. REG6 GENERAL PURPOSE REGISTER (READ/WRITE 818H) BIT The internal address mapping, with the corresponding PCI BAR1 address offset, for the PCI Mini-ACE Mark3/Micro-ACE TE registers is illustrated in TABLE 18. Note that the address lines shown are the PCI Mini-ACE Mark3/Micro-ACE TE's internal ACE register bus and are left shifted 2 bits with respect to the PCI address: A0 = PCI A2, A1 = PCI A3, etc. For example, Interrupt mask register #1 is located at PCI address BAR1 offset + 0h, Configuration Register #1 is at BAR1 offset + 4h, etc. Note that the table below does not show the internal A5 register address line, which is normally 0 and is set only for access to the reserved factory test registers. DESCRIPTION 31(MSB) RESERVED - BIT 31 (MSB) * * * * * * 0 (LSB) RESERVED - BIT 0 (LSB) This register will be all 0s after RST#. This read/write register is available for customer use, perhaps as a flag register for signaling between bus masters. Also note that the ACE registers are internally 16 bits wide, appear in the lower 16 bits of a 32-bit PCI DWord and that the upper 16 bits will read as zeroes during a 32-bit PCI read. TABLE 17. REG7 RESERVED REGISTER (WRITE 81CH) BIT 31(MSB) DESCRIPTION * * * * * * 1 CLEAR FAILSAFE INTERRUPT 0 (LSB) The configuration registers will be cleared to 0000h after hardware or software reset, with the exception of the Enhanced CPU Access bit (bit 14 in Configuration register #6). RESERVED, WRITE AS 0 - BIT 31 (MSB) RESERVED - BIT 0 (LSB) This register will be all 0s after RST#. No access to this register is needed for normal applications. Data Device Corporation www.ddc-web.com 13 BU-65743/65843/65863/65864 AC-6/11-0 TABLE 18. ACE REGISTER ADDRESS MAPPING ADDRESS LINES BAR1 ADDR OFFSET REGISTER DESCRIPTION/ACCESSIBILITY A4 A3 A2 A1 A0 Data Device Corporation www.ddc-web.com 0 0 0 0 0 00h Interrupt Mask Register #1 (RD/WR) 0 0 0 0 1 04h Configuration Register #1 (RD/WR) 0 0 0 1 0 08h Configuration Register #2 (RD/WR) 0 0 0 1 1 0Ch Start/Reset Register (WR) 0 0 0 1 1 0Ch Non-Enhanced BC/RT Command Stack Pointer / Enhanced BC Instruction List Pointer Register (RD) 0 0 1 0 0 10h BC Control Word / RT Subaddress Control Word Register (RD/WR) 0 0 1 0 1 14h Time Tag Register (RD/WR) 0 0 1 1 0 18h Interrupt Status Register #1 (RD) 0 0 1 1 1 1Ch Configuration Register #3 (RD/WR) 0 1 0 0 0 20h Configuration Register #4 (RD/WR) 0 1 0 0 1 24h Configuration Register #5 (RD/WR) 0 1 0 1 0 28h RT / Monitor Data Stack Address Register (RD/WR) 0 1 0 1 1 2Ch BC Frame Time Remaining Register (RD) 0 1 1 0 0 30h BC Time Remaining to Next Message Register (RD) 0 1 1 0 1 34h Non-Enhanced BC Frame Time / Enhanced BC Initial Instruction Pointer / RT Last Command / MT Trigger Word Register(RD/WR) 0 1 1 1 0 38h RT Status Word Register (RD) 0 1 1 1 1 3Ch RT BIT Word Register (RD) 1 0 0 0 0 40h Test Mode Register 0 1 0 0 0 1 44h Test Mode Register 1 1 0 0 1 0 48h Test Mode Register 2 1 0 0 1 1 4Ch Test Mode Register 3 Test Mode Register 4 1 0 1 0 0 50h 1 0 1 0 1 54h Test Mode Register 5 1 0 1 1 0 58h Test Mode Register 6 1 0 1 1 1 5Ch Test Mode Register 7 1 1 0 0 0 60h Configuration Register #6 (RD/WR) 1 1 0 0 1 64h Configuration Register #7 (RD/WR) 1 1 0 1 0 68h RESERVED 1 1 0 1 1 6Ch BC Condition Code Register (RD) 1 1 0 1 1 6Ch BC General Purpose Flag Register (WR) 1 1 1 0 0 70h BIT Test Status Register (RD) 1 1 1 0 1 74h Interrupt Mask Register #2 (RD/WR) 1 1 1 1 0 78h Interrupt Status Register #2 (RD) 1 1 1 1 1 7Ch BC General Purpose Queue Pointer / RT-MT Interrupt Status Queue Pointer Register (RD/ WR) 14 BU-65743/65843/65863/65864 AC-6/11-0 TABLE 19. INTERRUPT MASK REGISTER #1 (READ/WRITE 00H,PCI 00H) BIT DESCRIPTION 15(MSB) RESERVED 14 RAM PARITY ERROR 13 BC/RT TRANSMITTER TIMEOUT 12 BC/RT COMMAND STACK ROLLOVER 11 MT COMMAND STACK ROLLOVER 10 MT DATA STACK ROLLOVER 9 HANDSHAKE FAIL 8 BC RETRY 7 RT ADDRESS PARITY ERROR 6 TIME TAG ROLLOVER 5 RT CIRCULAR BUFFER ROLLOVER 4 RT SUBADDRESS CONTROL WORD EOM 3 BC END OF FRAME 2 FORMAT ERROR 1 BC STATUS SET/RT MODE CODE/MT PATTERN TRIGGER 0(LSB) END OF MESSAGE TABLE 20. CONFIGURATION REGISTER #1 (READ/WRITE 01H, PCI 04H) BIT BC FUNCTION (Bits 11-0 Enhanced Mode Only) RT WITHOUT ALTERNATE STATUS RT WITH ALTERNATE STATUS (Enhanced Only) MONITOR FUNCTION (Enhanced mode only bits 12-0) 15 (MSB) RT/BC-MT (logic 0) (logic 1) (logic 1) (logic 0) 14 MT/BC-RT (logic 0) (logic 0) (logic 0) (logic 1) 13 CURRENT AREA B/A CURRENT AREA B/A CURRENT AREA B/A CURRENT AREA B/A 12 MESSAGE STOP-ON-ERROR MESSAGE MONITOR ENABLED (MMT) MESSAGE MONITOR ENABLED MESSAGE MONITOR ENABLED 11 FRAME STOP-ON-ERROR DYNAMIC BUS CONTROL ACCEPTANCE S10 TRIGGER WORD ENABLED 10 STATUS SET STOP-ON-MESSAGE BUSY S09 START-ON-TRIGGER 9 STATUS SET STOP-ON-FRAME SERVICE REQUEST S08 STOP-ON-TRIGGER 8 FRAME AUTO-REPEAT SSFLAG S07 NOT USED 7 EXTERNAL TRIGGER ENABLED RTFLAG (Enhanced Mode Only) S06 EXTERNAL TRIGGER ENABLED 6 INTERNAL TRIGGER ENABLED NOT USED S05 NOT USED 5 INTERMESSAGE GAP TIMER ENABLED NOT USED S04 NOT USED 4 RETRY ENABLED NOT USED S03 NOT USED 3 DOUBLED/SINGLE RETRY NOT USED S02 NOT USED 2 BC ENABLED (Read Only) NOT USED S01 MONITOR ENABLED(Read Only) 1 BC FRAME IN PROGRESS (Read Only) NOT USED S00 MONITOR TRIGGERED (Read Only) 0 (LSB) BC MESSAGE IN PROGRESS (Read Only) RT MESSAGE IN PROGRESS (Enhanced mode only,Read Only) RT MESSAGE IN PROGRESS (Read Only) MONITOR ACTIVE (Read Only) Data Device Corporation www.ddc-web.com 15 BU-65743/65843/65863/65864 AC-6/11-0 TABLE 24. BC CONTROL WORD REGISTER (READ/WRITE 04H, PCI 10H) TABLE 21. CONFIGURATION REGISTER #2 (READ/WRITE 02H, PCI 08H) BIT BIT DESCRIPTION 15(MSB) ENHANCED INTERRUPTS 14 RAM PARITY ENABLE 13 BUSY LOOKUP TABLE ENABLE 12 RESERVED FOR FUTURE USE, MUST BE 0 11 OVERWRITE INVALID DATA 10 256-WORD BOUNDARY DISABLE 9 TIME TAG RESOLUTION 2 8 DESCRIPTION 15(MSB) RESERVED 14 MESSAGE ERROR MASK 13 SERVICE REQUEST BIT MASK 12 BUSY BIT MASK 11 SUBSYSTEM FLAG BIT MASK 10 TERMINAL FLAG BIT MASK 9 RESERVED BITS MASK TIME TAG RESOLUTION 1 8 RETRY ENABLED 7 TIME TAG RESOLUTION 0 7 BUS CHANNEL A/B 6 CLEAR TIME TAG ON SYNCHRONIZE 6 OFF-LINE SELF-TEST 5 LOAD TIME TAG ON SYNCHRONIZE 5 MASK BROADCAST BIT 4 INTERRUPT STATUS AUTO CLEAR 4 EOM INTERRUPT ENABLE 3 LEVEL/PULSE INTERRUPT REQUEST 3 1553A/B SELECT 2 CLEAR SERVICE REQUEST 2 MODE CODE FORMAT 1 ENHANCED RT MEMORY MANAGEMENT 1 BROADCAST FORMAT 0(LSB) SEPARATE BROADCAST DATA 0(LSB) RT-to-RT FORMAT TABLE 25. RT SUBADDRESS CONTROL WORD (READ/WRITE 04H, PCI 10H) TABLE 22. START/RESET REGISTER (WRITE 03H, PCI 0CH) BIT BIT DESCRIPTION 15(MSB) RESERVED 14 RESERVED 13 RESERVED 12 DESCRIPTION 15(MSB) RX: GLOBAL CIRCULAR BUFFER ENABLE 14 TX: EOM INT 13 TX: CIRC BUF INT 12 TX: MEMORY MANAGEMENT 2 (MM2) RESERVED 11 TX: MEMORY MANAGEMENT 1 (MM1) 11 CLEAR RT HALT 10 TX: MEMORY MANAGEMENT 0 (MM0) 10 CLEAR SELF-TEST REGISTER 9 RX: EOM INT INITIATE RAM SELF-TEST 8 RX: CIRC BUF INT 7 RX: MEMORY MANAGEMENT 2 (MM2) 6 RX: MEMORY MANAGEMENT 1 (MM1) 5 RX: MEMORY MANAGEMENT 0 (MM0) 4 BCST: EOM INT 9 8 RESERVED 7 RESERVED 6 BC/MT STOP-ON-MESSAGE 5 BC STOP-ON-FRAME 3 BCST: CIRC BUF INT 4 TIME TAG TEST CLOCK 2 BCST: MEMORY MANAGEMENT 2 (MM2) 3 TIME TAG RESET 1 BCST: MEMORY MANAGEMENT 1 (MM1) 2 INTERRUPT RESET 0(LSB) BCST: MEMORY MANAGEMENT 0 (MM0) 1 BC/MT START 0(LSB) RESET TABLE 26. TIME TAG REGISTER (READ/WRITE 05H, PCI 14H) TABLE 23. BC/RT COMMAND STACK POINTER REGISTER (READ 03H, PCI 0CH) BIT 15(MSB) DESCRIPTION BIT COMMAND STACK POINTER 15 DESCRIPTION 15(MSB) TIME TAG 15 * * * * * * * * * 0(LSB) * * COMMAND STACK POINTER 0 Data Device Corporation www.ddc-web.com 0(LSB) 16 * TIME TAG 0 BU-65743/65843/65863/65864 AC-6/11-0 TABLE 29. CONFIGURATION REGISTER #4 (READ/WRITE 08H, PCI 20H) TABLE 27. INTERRUPT STATUS REGISTER #1 (READ 06H, PCI 18H) BIT DESCRIPTION BIT DESCRIPTION 15(MSB) MASTER INTERRUPT 15(MSB) External Bit Word Enable 14 RAM PARITY ERROR 14 Inhibit Bit Word if Busy 13 TRANSMITTER TIMEOUT 13 Mode Command Override Busy 12 BC/RT COMMAND STACK ROLLOVER 12 Expanded Control Word 11 MT COMMAND STACK ROLLOVER 11 BROADCAST MASK ENA/XOR 10 MT DATA STACK ROLLOVER 10 RETRY IF -A AND M.E. 9 HANDSHAKE FAIL 9 RETRY IF STATUS SET 8 BC RETRY 8 1ST RETRY ALT/SAME BUS 7 RT ADDRESS PARITY ERROR 7 2ND RETRY ALT/SAME BUS 6 TIME TAG ROLLOVER 6 VALID M.E./NO DATA 5 RT CIRCULAR BUFFER ROLLOVER 5 VALID BUSY/NO DATA 4 RT SUBADDRESS CONTROL WORD EOM 4 MT TAG GAP OPTION 3 BC END OF FRAME 3 LATCH RT ADDRESS WITH CONFIG #5 2 FORMAT ERROR 2 TEST MODE 2 1 BC STATUS SET / RT MODE CODE / MT PATTERN TRIGGER 1 TEST MODE 1 0(LSB) TEST MODE 0 0(LSB) END OF MESSAGE TABLE 30. CONFIGURATION REGISTER #5 (READ/WRITE 09H, PCI 24H) TABLE 28. CONFIGURATION REGISTER #3 (READ/WRITE 07H, PCI 1CH) BIT BIT DESCRIPTION DESCRIPTION 15(MSB) ENHANCED MODE ENABLE 15(MSB) 12 / 16 MHZ CLOCK SELECT 14 BC/RT COMMAND STACK SIZE 1 14 SINGLE-ENDED SELECT 13 BC/RT COMMAND STACK SIZE 0 13 EXTERNAL TX INHIBIT A 12 MT COMMAND STACK SIZE 1 12 EXTERNAL TX INHIBIT B 11 MT COMMAND STACK SIZE 0 11 EXPANDED CROSSING ENABLED 10 MT DATA STACK SIZE 2 10 RESPONSE TIMEOUT SELECT 1 9 MT DATA STACK SIZE 1 9 RESPONSE TIMEOUT SELECT 0 8 MT DATA STACK SIZE 0 8 GAP CHECK ENABLED 7 ILLEGALIZATION DISABLED 7 BROADCAST DISABLED 6 OVERRIDE MODE T/R ERROR 6 RT ADDRESS LATCH/TRANSPARENT 5 ALTERNATE STATUS WORD ENABLE 4 ILLEGAL RX TRANSFER DISABLE 5 RT ADDRESS 4 3 RESERVED, SET TO 0 4 RT ADDRESS 3 2 RTFAIL / RTFLAG WRAP ENABLE 3 RT ADDRESS 2 1 1553A MODE CODES ENABLE 2 RT ADDRESS 1 0(LSB) ENHANCED MODE CODE HANDLING 1 RT ADDRESS 0 0(LSB) RT ADDRESS PARITY TABLE 31. RT / MONITOR DATA STACK ADDRESS REGISTER (READ/WRITE 0AH, PCI 28H) BIT 15(MSB) * * * * * 0(LSB) Data Device Corporation www.ddc-web.com 17 DESCRIPTION RT / MONITOR DATA STACK ADDRESS 15 * RT / MONITOR DATA STACK ADDRESS 0 BU-65743/65843/65863/65864 AC-6/11-0 TABLE 32. BC FRAME TIME REMAINING REGISTER (READ/WRITE 0BH, PCI 2CH) BIT TABLE 36. RT BIT WORD REGISTER (READ 0FH, PCI 3CH) DESCRIPTION BIT DESCRIPTION 15(MSB) TRANSMITTER TIMEOUT * * 14 LOOP TEST FAILURE B * * 13 LOOP TEST FAILURE A * 12 HANDSHAKE FAILURE 11 TRANSMITTER SHUTDOWN B 10 TRANSMITTER SHUTDOWN A 9 TERMINAL FLAG INHIBITED 8 BIT TEST FAIL 7 HIGH WORD COUNT 6 LOW WORD COUNT 5 INCORRECT SYNC RECEIVED 4 PARITY / MANCHESTER ERROR RECEIVED 3 RT-to-RT GAP / SYNCH / ADDRESS ERROR 2 RT-to-RT NO RESPONSE ERROR 1 RT-to-RT 2ND COMMAND WORD ERROR 0(LSB) COMMAND WORD CONTENTS ERROR 15(MSB) * 0(LSB) BC FRAME TIME REMAINING 15 BC FRAME TIME REMAINING 0 Note: resolution = 100 s per LSB TABLE 33. BC MESSAGE TIME REMAINING REGISTER (READ/WRITE 0CH, PCI 30H) BIT DESCRIPTION 15(MSB) BC MESSAGE TIME REMAINING 15 * * * * * * 0(LSB) BC MESSAGE TIME REMAINING 0 Note: resolution = 1 s per LSB TABLE 34. BC FRAME TIME / RT LAST COMMAND / MT TRIGGER REGISTER (READ/WRITE 0DH, PCI 34H) BIT TABLE 37. CONFIGURATION REGISTER #6 (READ/WRITE 18H, PCI 60H) BIT DESCRIPTION 15(MSB) BIT 15 DESCRIPTION 15(MSB) ENHANCED BUS CONTROLLER 14 ENHANCED CPU ACCESS * * * * 13 COMMAND STACK POINTER INCREMENT ON EOM (RT, MT) * * 12 GLOBAL CIRCULAR BUFFER ENABLE BIT 0 11 GLOBAL CIRCULAR BUFFER SIZE 2 10 GLOBAL CIRCULAR BUFFER SIZE 1 9 GLOBAL CIRCULAR BUFFER SIZE 0 8 DISABLE INVALID MESSAGES TO INTERRUPT STATUS QUEUE 7 DISABLE VALID MESSAGES TO INTERRUPT STATUS QUEUE 6 INTERRUPT STATUS QUEUE ENABLE 5 RT ADDRESS SOURCE 4 ENHANCED MESSAGE MONITOR 3 RESERVED 2 64-WORD REGISTER SPACE 1 CLOCK SELECT 1 0(LSB) CLOCK SELECT 0 0(LSB) TABLE 35. RT STATUS WORD REGISTER (READ/WRITE 0EH, PCI 38H) BIT DESCRIPTION 15(MSB) LOGIC "0" 14 LOGIC "0" 13 LOGIC "0" 12 LOGIC "0" 11 LOGIC "0" 10 MESSAGE ERROR 9 INSTRUMENTATION 8 SERVICE REQUEST 7 RESERVED 6 RESERVED 5 RESERVED 4 BROADCAST COMMAND RECEIVED 3 BUSY 2 SSFLAG 1 DYNAMIC BUS CONTROL ACCEPT 0(LSB) TERMINAL FLAG Data Device Corporation www.ddc-web.com 18 BU-65743/65843/65863/65864 AC-6/11-0 TABLE 38. CONFIGURATION REGISTER #7 (READ/WRITE 19H, PCI 64H) BIT TABLE 40. BC GENERAL PURPOSE FLAG REGISTER (WRITE 1BH, PCI 6CH) DESCRIPTION BIT DESCRIPTION 15(MSB) MEMORY MANAGEMENT BASE ADDRESS 15 15(MSB) CLEAR GENERAL PURPOSE FLAG 7 14 MEMORY MANAGEMENT BASE ADDRESS 14 14 CLEAR GENERAL PURPOSE FLAG 6 13 MEMORY MANAGEMENT BASE ADDRESS 13 13 CLEAR GENERAL PURPOSE FLAG 5 12 MEMORY MANAGEMENT BASE ADDRESS 12 12 CLEAR GENERAL PURPOSE FLAG 4 11 MEMORY MANAGEMENT BASE ADDRESS 11 11 CLEAR GENERAL PURPOSE FLAG 3 10 MEMORY MANAGEMENT BASE ADDRESS 10 10 CLEAR GENERAL PURPOSE FLAG 2 9 RESERVED 9 CLEAR GENERAL PURPOSE FLAG 1 8 RESERVED 8 CLEAR GENERAL PURPOSE FLAG 0 7 RESERVED 7 SET GENERAL PURPOSE FLAG 7 6 RESERVED 6 SET GENERAL PURPOSE FLAG 6 5 RESERVED 5 SET GENERAL PURPOSE FLAG 5 4 RT HALT ENABLE 4 SET GENERAL PURPOSE FLAG 4 3 1553B RESPONSE TIME 3 SET GENERAL PURPOSE FLAG 3 2 ENHANCED TIMETAG SYNCHRONIZE 2 SET GENERAL PURPOSE FLAG 2 1 ENHANCED BC WATCHDOG TIMER ENABLED 1 SET GENERAL PURPOSE FLAG 1 0(LSB) MODE CODE RESET / INCMD SELECT 0(LSB) SET GENERAL PURPOSE FLAG 0 TABLE 41. BIT TEST STATUS REGISTER (READ 1CH, PCI 70H) TABLE 39. BC CONDITION REGISTER (READ 1BH, PCI 6CH) BIT BIT DESCRIPTION DESCRIPTION 15(MSB) ALWAYS 15(MSB) LOGIC "0" 14 RETRY 1 14 LOGIC "0" 13 RETRY 0 13 LOGIC "0" 12 BAD MESSAGE 12 LOGIC "0" 11 MESSAGE STATUS SET 11 LOGIC "0" 10 GOOD BLOCK TRANSFER 10 LOGIC "0" 9 FORMAT ERROR 9 LOGIC "0" 8 NO RESPONSE 8 LOGIC "0" 7 GENERAL PURPOSE FLAG 7 7 RAM BUILT-IN TEST COMPLETE 6 GENERAL PURPOSE FLAG 6 6 RAM BUILT-IN TEST IN-PROGRESS 5 GENERAL PURPOSE FLAG 5 5 RAM BUILT-IN TEST IN-PASSED 4 GENERAL PURPOSE FLAG 4 4 LOGIC "0" 3 GENERAL PURPOSE FLAG 3 3 LOGIC "0" 2 GENERAL PURPOSE FLAG 2 2 LOGIC "0" 1 LESS THAN FLAG / GENERAL PURPOSE FLAG 1 1 LOGIC "0" 0(LSB) EQUAL FLAG / GENERAL PURPOSE FLAG 1 0(LSB) LOGIC "0" Note: If the Enhanced Mini-ACE is not online in enhanced BC mode (i.e., processing instructions), the BC condition code register will always return a value of 0000. Data Device Corporation www.ddc-web.com 19 BU-65743/65843/65863/65864 AC-6/11-0 TABLE 44. BC GENERAL PURPOSE QUEUE POINTER REGISTER RT, MT INTERRUPT STATUS QUEUE POINTER REGISTER (READ/WRITE 1FH, PCI 7CH) TABLE 42. INTERRUPT MASK REGISTER #2 (READ/WRITE 1DH, PCI 74H) BIT DESCRIPTION 15(MSB) NOT USED 14 BC OP CODE PARITY ERROR 13 ILLEGAL COMMAND 15(MSB) QUEUE POINTER BASE ADDRESS 15 12 GENERAL PURPOSE QUEUE / INTERRUPT STATUS QUEUE ROLLOVER 14 QUEUE POINTER BASE ADDRESS 14 13 QUEUE POINTER BASE ADDRESS 13 11 CALL STACK POINTER REGISTER ERROR 12 QUEUE POINTER BASE ADDRESS 12 10 BC TRAP OP CODE 11 QUEUE POINTER BASE ADDRESS 11 9 RT COMMAND STACK 50% ROLLOVER 10 QUEUE POINTER BASE ADDRESS 10 8 RT CIRCULAR BUFFER 50% ROLLOVER 9 QUEUE POINTER BASE ADDRESS 9 7 MONITOR COMMAND STACK 50% ROLLOVER 8 QUEUE POINTER BASE ADDRESS 8 6 MONITOR DATA STACK 50% ROLLOVER 7 QUEUE POINTER BASE ADDRESS 7 5 ENHANCED BC IRQ3 6 QUEUE POINTER BASE ADDRESS 6 4 ENHANCED BC IRQ2 5 QUEUE POINTER BASE ADDRESS 5 3 ENHANCED BC IRQ1 4 QUEUE POINTER BASE ADDRESS 4 2 ENHANCED BC IRQ0 3 QUEUE POINTER BASE ADDRESS 3 1 BIT TEST COMPLETE 2 QUEUE POINTER BASE ADDRESS 2 0(LSB) NOT USED 1 QUEUE POINTER BASE ADDRESS 1 0(LSB) QUEUE POINTER BASE ADDRESS 0 BIT DESCRIPTION TABLE 43. INTERRUPT STATUS REGISTER #2 (READ 1EH, PCI 78H) BIT DESCRIPTION 15(MSB) MASTER INTERRUPT 14 BC OP CODE PARITY ERROR 13 ILLEGAL COMMAND 12 GENERAL PURPOSE QUEUE / INTERRUPT STATUS QUEUE ROLLOVER 11 CALL STACK POINTER REGISTER ERROR 10 BC TRAP OP CODE 9 RT COMMAND STACK 50% ROLLOVER 8 RT CIRCULAR BUFFER 50% ROLLOVER 7 MONITOR COMMAND STACK 50% ROLLOVER 6 MONITOR DATA STACK 50% ROLLOVER 5 ENHANCED BC IRQ3 4 ENHANCED BC IRQ2 3 ENHANCED BC IRQ1 2 ENHANCED BC IRQ0 1 BIT TEST COMPLETE 0(LSB) INTERRUPT CHAIN BIT Data Device Corporation www.ddc-web.com 20 BU-65743/65843/65863/65864 AC-6/11-0 NOTE: TABLES 45 TO 51 ARE NOT REGISTERS, BUT THEY ARE WORDS STORED IN RAM. TABLE 45. BC MODE BLOCK STATUS WORD BIT TABLE 47. 1553 COMMAND WORD DESCRIPTION BIT DESCRIPTION 15(MSB) EOM 15(MSB) REMOTE TERMINAL ADDRESS BIT 4 14 SOM 14 REMOTE TERMINAL ADDRESS BIT 3 13 CHANNEL B/A 13 REMOTE TERMINAL ADDRESS BIT 2 12 ERROR FLAG 12 REMOTE TERMINAL ADDRESS BIT 1 11 STATUS SET 11 REMOTE TERMINAL ADDRESS BIT 0 10 FORMAT ERROR 10 TRANSMIT / RECEIVE 9 NO RESPONSE TIMEOUT 9 SUBADDRESS / MODE CODE BIT 4 8 LOOP TEST FAIL 8 SUBADDRESS / MODE CODE BIT 3 7 MASKED STATUS SET 7 SUBADDRESS / MODE CODE BIT 2 6 RETRY COUNT 1 6 SUBADDRESS / MODE CODE BIT 1 5 RETRY COUNT 0 5 SUBADDRESS / MODE CODE BIT 0 4 GOOD DATA BLOCK TRANSFER 4 DATA WORD COUNT / MODE CODE BIT 4 3 WRONG STATUS ADDRESS / NO GAP 3 DATA WORD COUNT / MODE CODE BIT 3 2 WORD COUNT ERROR 2 DATA WORD COUNT / MODE CODE BIT 2 1 INCORRECT SYNC TYPE 1 DATA WORD COUNT / MODE CODE BIT 1 0(LSB) INVALID WORD 0(LSB) DATA WORD COUNT / MODE CODE BIT 0 TABLE 46. RT MODE BLOCK STATUS WORD BIT TABLE 48. WORD MONITOR IDENTIFICATION WORD DESCRIPTION 15(MSB) EOM BIT 14 SOM 15(MSB) 13 CHANNEL B/A * * 12 ERROR FLAG * * 11 RT-to-RT FORMAT 10 FORMAT ERROR 8 GAP TIME 9 NO RESPONSE TIMEOUT 7 WORD FLAG 8 LOOP TEST FAIL 6 THIS RT 7 DATA STACK ROLLOVER 5 BROADCAST 6 ILLEGAL COMMAND WORD 4 ERROR 5 WORD COUNT ERROR 3 COMMAND / DATA 4 INCORRECT DATA SYNC 2 CHANNEL B/A 3 INVALID WORD 1 CONTIGUOUS DATA / GAP 2 RT-to-RT GAP / SYNC / ADDRESS ERROR 0(LSB) MODE_CODE 1 RT-to-RT 2ND COMMAND ERROR 0(LSB) COMMAND WORD CONTENTS ERROR Data Device Corporation www.ddc-web.com * 21 DESCRIPTION GAP TIME * BU-65743/65843/65863/65864 AC-6/11-0 TABLE 49. MESSAGE MONITOR MODE BLOCK STATUS WORD BIT TABLE 50. 1553B STATUS WORD DESCRIPTION BIT DESCRIPTION 15(MSB) EOM 15(MSB) REMOTE TERMINAL ADDRESS BIT 4 14 SOM 14 REMOTE TERMINAL ADDRESS BIT 3 13 CHANNEL B/A 13 REMOTE TERMINAL ADDRESS BIT 2 12 ERROR FLAG 12 REMOTE TERMINAL ADDRESS BIT 1 11 RT-to-RT TRANSFER 11 REMOTE TERMINAL ADDRESS BIT 0 10 FORMAT ERROR 10 MESSAGE ERROR 9 NO RESPONSE TIMEOUT 9 INSTRUMENTATION 8 GOOD DATA BLOCK TRANSFER 8 SERVICE REQUEST 7 DATA STACK ROLLOVER 7 RESERVED 6 RESERVED 6 RESERVED 5 WORD COUNT ERROR 5 RESERVED 4 INCORRECT SYNC 4 BROADCAST COMMAND RECEIVED 3 INVALID WORD 3 BUSY 2 RT-to-RT GAP / SYNC / ADDRESS ERROR 2 SSFLAG 1 RT-to-RT 2ND COMMAND ERROR 1 DYNAMIC BUS CONTROL ACCEPTANCE 0(LSB) COMMAND WORD CONTENTS ERROR 0(LSB) TERMINAL FLAG TABLE 51. RT/MONITOR INTERRUPT STATUS WORD (FOR INTERRUPT STATUS QUEUE) BIT DEFINITION FOR MESSAGE INTERRUPT EVENT DEFINITION FOR NON-MESSAGE INTERRUPT EVENT 15 TRANSMITTER TIMEOUT NOT USED 14 ILLEGAL COMMAND NOT USED 13 MONITOR DATA STACK 50% ROLLOVER NOT USED 12 MONITOR DATA STACK ROLLOVER NOT USED 11 RT CIRCULAR BUFFER 50% ROLLOVER NOT USED 10 RT CIRCULAR BUFFER ROLLOVER NOT USED 9 MONITOR COMMAND (DESCRIPTOR) STACK 50% ROLLOVER NOT USED 8 MONITOR COMMAND (DESCRIPTOR) STACK ROLLOVER NOT USED 7 RT COMMAND (DESCRIPTOR) STACK 50% ROLLOVER NOT USED 6 RT COMMAND (DESCRIPTOR) STACK ROLLOVER NOT USED 5 HANDSHAKE FAIL NOT USED 4 FORMAT ERROR TIME TAG ROLLOVER 3 MODE CODE INTERRUPT RT ADDRESS PARITY ERROR 2 SUBADDRESS CONTROL WORD EOM NOT USED 1 END-OF-MESSAGE (EOM) RAM PARITY ERROR 0 "1" FOR MESSAGE INTERRUPT EVENT "0" FOR NON-MESSAGE INTERRUPT EVENT Data Device Corporation www.ddc-web.com NON-TEST REGISTER FUNCTION SUMMARY A summary of the PCI Mini-ACE Mark3/Micro-ACE TE's 24 nontest registers follows. INTERRUPT MASK REGISTERS #1 AND #2 Interrupt Mask Registers #1 and #2 are used to enable and disable interrupt requests for various events and conditions. NOTE: Please see Appendix "F" of the Enhanced Mini-ACE User's Guide for important information applicable only to RT MODE operation, enabling of the interrupt status queue and use of specific non-message interrupts. CONFIGURATION REGISTERS #1 AND #2 Configuration Registers #1 and #2 are used to select the PCI Mini-ACE Mark3/Micro-ACE TE's mode of operation, and for software control of RT Status Word bits, Active Memory Area, BC Stop-On-Error, RT Memory Management mode selection, and control of the Time Tag operation. Note that the LEVEL/PULSE INTERRUPT REQUEST bit in Configuration Register #2 MUST be set to 1 for correct PCI operation. START/RESET REGISTER The Start/Reset Register is used for "command" type functions such as software reset, BC/MT Start, Interrupt reset, Time Tag Reset, Time Tag Register Test, Initiate RAM self-test, Clear selftest register, and Clear RT Halt. The Start/Reset Register also includes provisions for stopping the BC in its auto-repeat mode, either at the end of the current message or at the end of the current BC frame. 22 BU-65743/65843/65863/65864 AC-6/11-0 BC/RT COMMAND STACK REGISTER The BC/RT Command Stack Register allows the host CPU to determine the pointer location for the current or most recent message. alternate (fully software programmable) RT Status Word. For MT mode, use of the Enhanced Mode enables the Selective Message Monitor, the combined RT/Selective Monitor modes, and the monitor triggering capability. BC INSTRUCTION LIST POINTER REGISTER RT/MONITOR DATA STACK ADDRESS REGISTER The BC Instruction List Pointer Register may be read to determine the current location of the Instruction List Pointer for the Enhanced BC mode. The RT/Monitor Data Stack Address Register provides a read/ writable indication of the last data word stored for RT or Monitor modes. BC CONTROL WORD/RT SUBADDRESS CONTROL WORD REGISTER BC FRAME TIME REMAINING REGISTER The BC Frame Time Remaining Register provides a read-only indication of the time remaining in the current BC frame. In the enhanced BC mode, this timer may be used for minor or major frame control, or as a watchdog timer for the BC message sequence control processor. The resolution of this register is 100 s/LSB. In BC mode, the BC Control Word/RT Subaddress Control Word Register allows host access to the current word or most recent BC Control Word. The BC Control Word contains bits that select the active bus and message format, enable off-line self-test, masking of Status Word bits, enable retries and interrupts, and specify MIL-STD-1553A or -1553B error handling. In RT mode, this register allows host access to the current or most recent Subaddress Control Word. The Subaddress Control Word is used to select the memory management scheme and enable interrupts for the current message. BC TIME REMAINING TO NEXT MESSAGE REGISTER The BC Time Remaining to Next Message Register provides a read-only indication of the time remaining before the start of the next message in a BC frame. In the enhanced BC mode, this timer may also be used for the BC message sequence control processor's Delay (DLY) instruction, or for minor or major frame control. The resolution of this register is 1 s/LSB. TIME TAG REGISTER The Time Tag Register maintains the value of a real-time clock. The resolution of this register is programmable from among 2, 4, 8, 16, 32, and 64 s/LSB. The Start-of-Message (SOM) and End-of-Message (EOM) sequences in BC, RT, and Message Monitor modes cause a write of the current value of the Time Tag Register to the stack area of the RAM. BC FRAME TIME/ RT LAST COMMAND /MT TRIGGER WORD REGISTER In BC mode, this register is used to program the BC frame time, for use in the frame auto-repeat mode. The resolution of this register is 100 s/LS, with a range up to 6.55 seconds. In RT mode, this register stores the current (or most previous) 1553 Command Word processed by the PCI Mini-ACE Mark3/MicroACE TE RT. In the Word Monitor mode, this register is used to specify a 16-bit Trigger (Command) Word. The Trigger Word may be used to start or stop the monitor, or to generate interrupts. INTERRUPT STATUS REGISTERS #1 AND #2 Interrupt Status Registers #1 and #2 allow the host processor to determine the cause of an interrupt request by means of one or two read accesses. The interrupt events of the two Interrupt Status Registers are mapped to correspond to the respective bit positions in the two Interrupt Mask Registers. Interrupt Status Register #2 contains an INTERRUPT CHAIN bit, used to indicate an interrupt event from Interrupt Status Register #1. BC INITIAL INSTRUCTION LIST POINTER REGISTER The BC Initial Instruction List Pointer Register enables the host to assign the starting address for the enhanced BC Instruction List. CONFIGURATION REGISTERS #3, #4, AND #5 Configuration Registers #3, #4, and #5 are used to enable many of the Mini-ACE Mark3/Micro-ACE TE's advanced features that were implemented by the prior generation products, the ACE and Mini-ACE (Plus). For BC, RT, and MT modes, use of the Enhanced Mode enables the various read-only bits in Configuration Register #1. For BC mode, Enhanced Mode features include the expanded BC Control Word and BC Block Status Word, additional Stop-On-Error and Stop-On-Status Set functions, frame auto-repeat, programmable intermessage gap times, automatic retries, expanded Status Word Masking, and the capability to generate interrupts following the completion of any selected message. For RT mode, the Enhanced Mode features include the expanded RT Block Status Word, combined RT/ Selective Message Monitor mode, internal wrapping of the RTFAIL output signal to the RTFLAG RT Status Word bit, and the Data Device Corporation www.ddc-web.com RT STATUS WORD REGISTER AND BIT WORD REGISTERS The RT Status Word Register and BIT Word Registers provide read-only indications of the RT Status and BIT Words. CONFIGURATION REGISTERS #6 AND #7 Configuration Registers #6 and #7 are used to enable the PCI Mini-ACE Mark3/Micro-ACE TE features that extend beyond the architecture of the ACE/Mini-ACE (Plus). These include the Enhanced BC mode; Enhanced CPU Access (note that this bit is the only configuration bit that is SET after reset), RT Global Circular Buffer (including buffer size); the RT/MT Interrupt Status Queue, including valid/invalid message filtering; enabling a software-assigned RT address; clock frequency selection; a base 23 BU-65743/65843/65863/65864 AC-6/11-0 address for the "non-data" portion of Mini-ACE Mark3/MicroACE TE memory; LSB filtering for the Synchronize (with data) time tag operations; and enabling a watchdog timer for the Enhanced BC message sequence control engine. determine the current location of the Interrupt Status Queue pointer, which is incremented by the RT/MT message processor. BUS CONTROLLER (BC) ARCHITECTURE NOTE: Please see Appendix "F" of the Enhanced Mini-ACE User's Guide for important information applicable only to RT MODE operation, enabling of the interrupt status queue and use of specific non-message interrupts. The BC functionality for the PCI Mini-ACE Mark3/Micro-ACE TE includes two separate architectures: (1) the older, non-Enhanced Mode, which provides complete compatibility with the previous ACE and Mini-ACE (Plus) generation products; and (2) the newer, Enhanced BC mode. The Enhanced BC mode offers several new powerful architectural features. These include the incorporation of a highly autonomous BC message sequence control engine, which greatly serves to offload the operation of the host CPU. BC CONDITION CODE REGISTER The BC Condition Code Register is used to enable the host processor to read the current value of the Enhanced BC Message Sequence Control Engine's condition flags. BC GENERAL PURPOSE FLAG REGISTER The BC General Purpose Flag Register allows the host processor to be able to set, clear, or toggle any of the Enhanced BC Message Sequence Control Engine's General Purpose condition flags. The Enhanced BC's message sequence control engine provides a high degree of flexibility for implementing major and minor frame scheduling; capabilities for inserting asynchronous messages in the middle of a frame; to separate 1553 message data from control/status data for the purpose of implementing double buffering and performing bulk data transfers; for implementing message retry schemes, including the capability for automatic bus channel switchover for failed messages; and for reporting various conditions to the host processor by means of 4 userdefined interrupts and a general purpose queue. BIT TEST STATUS REGISTER The BIT Test Status Register is used to provide read-only access to the status of the RAM built-in self-tests (BIT). BC GENERAL PURPOSE QUEUE POINTER The BC General Purpose Queue Pointer provides a means for initializing the pointer for the General Purpose Queue, for the Enhanced BC mode. In addition, this register enables the host to determine the current location of the General Purpose Queue pointer, which is incremented internally by the Enhanced BC message sequence control engine. In both the non-Enhanced and Enhanced BC modes, the PCI Mini-ACE Mark3/Micro-ACE TE BC implements all MIL-STD1553B message formats. Message format is programmable on a message-by-message basis by means of the BC Control Word and the T/R bit of the Command Word for the respective message. The BC Control Word allows 1553 message format, 1553A/B type RT, bus channel, self-test, and Status Word masking to be specified on an individual message basis. In addition, automatic retries and/or interrupt requests may be enabled or disabled for individual messages. The BC performs all error checking required by MIL-STD-1553B. This includes validation of response time, sync type and sync encoding, Manchester II encoding, parity, bit count, word count, Status Word RT Address field, and various RT-to-RT transfer errors. The PCI Mini-ACE Mark3/Micro-ACE TE BC response timeout value is programmable with choices of 18, 22, 50, and 130 s. The longer response timeout values allow for operation over long buses and/ or the use of repeaters. RT/MT INTERRUPT STATUS QUEUE POINTER The RT/MT Interrupt Status Queue Pointer provides a means for initializing the pointer for the Interrupt Status Queue, for RT, MT, and RT/MT modes. In addition, this register enables the host to BC INSTRUCTION LIST BC INSTRUCTION LIST POINTER REGISTER INITIALIZE BY REGISTER 0D (RD/WR); READ CURRENT VALUE VIA REGISTER 03 (RD ONLY) MESSAGE CONTROL/STATUS BLOCK OP CODE PARAMETER (POINTER) BC CONTROL WORD COMMAND WORD (Rx Command for RT-to-RT transfer) DATA BLOCK POINTER DATA BLOCK In its non-Enhanced Mode, the PCI Mini-ACE Mark3/Micro-ACE TE may be programmed to process BC frames of up to 512 messages with no processor intervention. In the Enhanced BC mode, there is no explicit limit to the number of messages that may be processed in a frame. In both modes, it is possible to program for either single frame or frame auto-repeat operation. In the autorepeat mode, the frame repetition rate may be controlled either internally, using a programmable BC frame timer, or from an external trigger input. TIME-TO-NEXT MESSAGE TIME TAG WORD BLOCK STATUS WORD LOOPBACK WORD RT STATUS WORD 2nd (Tx) COMMAND WORD (for RT-to-RT transfer) 2nd RT STATUS WORD (for RT-to-RT transfer) FIGURE 2. BC MESSAGE SEQUENCE CONTROL Data Device Corporation www.ddc-web.com 24 BU-65743/65843/65863/65864 AC-6/11-0 ENHANCED BC MODE: MESSAGE SEQUENCE CONTROL toggled by the BC message sequence control processor, by means of the GP Flag Bits (FLG) instruction; and (3) GP0 and GP1 only (but none of the others) may be set or cleared by means of the BC message sequence control processor's Compare Frame Timer (CFT) or Compare Message Timer (CMT) instructions. One of the major new architectural features of the PCI Mini-ACE Mark3/Micro-ACE TE series is its advanced capability for BC message sequence control. The PCI Mini-ACE Mark3/MicroACE TE supports highly autonomous BC operation, which greatly offloads the operation of the host processor. The host processor also has read-only access to the BC condition codes by means of the BC CONDITION CODE REGISTER. The operation of the PCI Mini-ACE Mark3/Micro-ACE TE's message sequence control engine is illustrated in FIGURE 2. The BC message sequence control involves an instruction list pointer register; an instruction list which contains multiple 2-word entries; a message control/status stack, which contains multiple 8-word or 10-word descriptors; and data blocks for individual messages. Note that four (4) instructions are unconditional. These are Compare to Frame Timer (CFT), Compare to Message Timer (CMT), GP Flag Bits (FLG), and Execute and Flip (XQF). For these instructions, the Condition Code Field is "don't care". That is, these instructions are always executed, regardless of the result of the condition code test. The initial value of the instruction list pointer register is initialized by the host processor (via Register 0D), and is incremented by the BC message sequence processor (host readable via Register 03). During operation, the message sequence control processor fetches the operation referenced by the instruction list pointer register from the instruction list. All of the other instructions are conditional. That is, they will only be executed if the condition code specified by the condition code field in the op code word tests true. If the condition code field tests false, the instruction list pointer will skip down to the next instruction. Note that the pointer parameter referencing the first word of a message's control/status block (the BC Control Word) must contain an address value that is modulo 8. Also, note that if the message is an RT-to-RT transfer, the pointer parameter must contain an address value that is modulo 16. As shown in TABLE 52, many of the operations include a singleword parameter. For an XEQ (execute message) operation, the parameter is a pointer to the start of the message's Control / Status block. For other operations, the parameter may be an address, a time value, an interrupt pattern, a mechanism to set or clear general purpose flag bits, or an immediate value. For several op codes, the parameter is "don't care" (not used). OP CODES The instruction list pointer register references a pair of words in the BC instruction list: an op code word, followed by a parameter word. The format of the op code word, which is illustrated in FIGURE 3, includes a 5-bit op code field and a 5-bit condition code field. The op code identifies the instruction to be executed by the BC message sequence controller. As described above, some of the op codes will cause the message sequence control processor to execute messages. In this case, the parameter references the first word of a message Control/Status block. With the exception of RT-to-RT transfer messages, all message status/control blocks are eight words long: a block control word, time-to-next-message parameter, data block pointer, command word, status word, loopback word, block status word, and time tag word. Most of the operations are conditional, with execution dependent on the contents of the condition code field. Bits 3-0 of the condition code field identifies a particular condition. Bit 4 of the condition code field identifies the logic sense ("1" or "0") of the selected condition code on which the conditional execution is dependent. TABLE 52 lists all the op codes, along with their respective mnemonic, code value, parameter, and description. TABLE 53 defines all the condition codes. In the case of an RT-to-RT transfer message, the size of the message control/status block increases to 16 words. However, in this case, the last six words are not used; the ninth and tenth words are for the second command word and second status word. Eight of the condition codes (8 through F) are set or cleared as the result of the most recent message. The other eight are defined as "General Purpose" condition codes GP0 through GP7. There are three mechanisms for programming the values of the General Purpose Condition Code bits: (1) They may be set, cleared, or toggled by the host processor, by means of the BC GENERAL PURPOSE FLAG REGISTER; (2) they may be set, cleared, or 15 Odd Parity 14 13 12 11 OpCode Field 10 The third word in the message control/status block is a pointer that references the first word of the message's data word block. Note that the data word block stores only data words, which are to be either transmitted or received by the BC. By segregating data words from command words, status words, and other control and "housekeeping" functions, this architecture enables the 9 8 7 6 5 0 1 0 1 0 4 3 2 1 0 Condition Code Field FIGURE 3. BC OP CODE FORMAT Data Device Corporation www.ddc-web.com 25 BU-65743/65843/65863/65864 AC-6/11-0 TABLE 52. BC OPERATIONS FOR MESSAGE SEQUENCE CONTROL INSTRUCTION MNEMONIC OP CODE (HEX) CONDITIONAL OR DESCRIPTION UNCONDITIONAL Message Control / Conditional Executes the message at the specified Message Control/Status Status Block (See Note) Block Address if the condition flag tests TRUE, otherwise conAddress tinue execution at the next OpCode in the instruction list. PARAMETER Execute Message XEQ 0001 Jump JMP 0002 Instruction List Address Conditional Subroutine Call CAL 0003 Instruction List Address Conditional Subroutine Return RTN 0004 Not Used (Don't Care) Conditional Interrupt Request IRQ 0006 Interrupt Bit Pattern in 4 LS bits Conditional Halt HLT 0007 Not Used (Don't Care) Conditional Delay DLY 0008 Delay Time Value (Resolution = 1S / LSB) Conditional Wait Until Frame Timer =0 WFT 0009 Not Used (Don't Care) Conditional Compare to Frame Timer CFT 000A Delay Time Value (Resolution = 100S / LSB) Unconditional Compare to Message Timer CMT 000B Delay Time Value (Resolution = 1S / LSB) Unconditional Compare Time Value to Frame Time Counter, and set or clear the LT and EQ flag based on the results of the compare. GP Flag Bits FLG 000C Used to set, clear, or toggle GP(General Purpose) Flag bits (See description) Unconditional Used to set, toggle, or clear any or all of the eight general purpose flags. The table below illustrates the use of the GP Flag Bits instruction for the case of GP0 (General Purpose Flag 0). Bits 1 and 9 of the parameter byte affect flag GP1, bits 2 and 10 effect GP2, etc., according to the following rules: Data Device Corporation www.ddc-web.com 26 Jump to the OpCode specified in the Instruction List if the condition flag tests TRUE, otherwise continue execution at the next OpCode in the instruction list. Jump to the OpCode specified by the Instruction List Address and push the Address of the Next OpCode on the Call Stack if the condition flag tests TRUE, otherwise continue execution at the next OpCode in the instruction list. Note that the maximum depth of the subroutine call stack is four. Return to the OpCode popped off the Call Stack if the condition flag tests TRUE, otherwise continue execution at the next OpCode in the instruction list. Generate an interrupt if the condition flag tests TRUE, otherwise continue execution at the next OpCode in the instruction list. The passed parameter (Interrupt Bit Pattern) specifies which of the ENHANCED BC IRQ bit(s) (bits 5-2) will be set in Interrupt Status Register #2. Only the four LSBs of the passed parameter are used. A parameter where the four LSBs are logic "0" will not generate an interrupt. Stop execution of the Message Sequence Control Program until a new BC Start is issued by the host if the condition flag tests TRUE, otherwise continue execution at the next OpCode in the instruction list. Delay the time specified by the Time parameter before executing the next OpCode if the condition flag tests TRUE, otherwise continue execution at the next OpCode without delay. The delay generated will use the Time to Next Message Timer. Wait until Frame Time counter is equal to Zero before continuing execution of the Message Sequence Control Program if the condition flag tests TRUE, otherwise continue execution at the next OpCode without delay. Compare Time Value to Frame Time Counter, and set or clear the LT and EQ flag based on the results of the compare. Bit 8 Bit 0 Effect on GP0 0 0 No Change 0 1 Set Flag 1 0 Clear Flag 1 1 Toggle Flag BU-65743/65843/65863/65864 AC-6/11-0 TABLE 52. BC OPERATIONS FOR MESSAGE SEQUENCE CONTROL (CONT.) CONDITIONAL OR UNCONDITIONAL INSTRUCTION MNEMONIC OP CODE (HEX) Load Time Tag Counter LTT 000D Time Value. Resolution (s/ LSB) is defined by bits 9, 8, and 7 of Configuration Register #2. Conditional Load Time Tag Counter with Time Value if the condition flag tests TRUE, otherwise continue execution at the next OpCode in the instruction list. Load Frame Timer LFT 000E Time Value (resolution = 100 s/LSB) Conditional Load Frame Timer Register with the Time Value parameter if the condition flag tests TRUE, otherwise continue execution at the next OpCode in the instruction list. Start Frame Timer SFT 000F Not Used (Don't Care) Conditional Start Frame Time Counter with Time Value in Time Frame register if the condition flag tests TRUE, otherwise continue execution at the next OpCode in the instruction list. Push Time Tag Register PTT 0010 Not Used (Don't Care) Conditional Push the value of the Time Tag Register on the General Purpose Queue if the condition flag tests TRUE, otherwise continue execution at the next OpCode in the instruction list. Push Block Status Word PBS 0011 Not Used (Don't Care) Conditional Push the Block Status Word for the most recent message on the General Purpose Queue if the condition flag tests TRUE, otherwise continue execution at the next OpCode in the instruction list. Push Immediate Value PSI 0012 Immediate Value Conditional Push Immediate data on the General Purpose Queue if the condition flag tests TRUE, otherwise continue execution at the next OpCode in the instruction list. Push Indirect PSM 0013 Memory Address Conditional Push the data stored at the specified memory location on the General Purpose Queue if the condition flag tests TRUE, otherwise continue execution at the next OpCode in the instruction list. Wait for External Trigger WTG 0014 Not Used (Don't Care) Conditional Wait for a logic "0"-to-logic "1" transition on the EXT_TRIG input signal before proceeding to the next OpCode in the instruction list if the condition flag tests TRUE, otherwise continue execution at the next OpCode without delay. Execute and Flip XQF 0015 Message Control / Status Block Address Unconditional PARAMETER DESCRIPTION Execute (unconditionally) the message referenced by the Message Control/Status Block Address. Following the processing of this message, if the condition flag tests TRUE, then flip bit 4 in the Message Control/Status Block Address, and store the new Message Block Address as the updated value of the parameter following the XQF instruction code. As a result, the next time that this line in the instruction list is executed, the Message Control/Status Block at the updated address (old address XOR 0010h), rather than the old address, will be processed. If the condition flag tests FALSE, the value of the Message Control/Status Block Address parameter will not change. NOTE: While the XEQ (Execute Message) instruction is conditional, not all condition codes may be used to enable its use. The ALWAYS and NEVER condition codes may be used. The eight general purpose flag bits, GP0 through GP7, may also be used. However, if GP0 through GP7 are used, it is imperative that the host processor not modify the value of the specific general purpose flag bit that enabled a particular message while that message is being processed. Similarly, the LT, GT-EQ, EQ, and NE flags, which the BC only updates by means of the CFT and CMT instructions, may also be used. However, these two flags are dual use. Therefore, if these are used, it is imperative that the host processor not modify the value of the specific flag (GP0 or GP1) that enabled a particular message while that message is being processed. The NORESP, FMT ERR, GD BLK XFER, MASKED STATUS SET, BAD MESSAGE, RETRY0, and RETRY1 condition codes are not available for use with the XEQ instruction and should not be used to enable its execution. Data Device Corporation www.ddc-web.com 27 BU-65743/65843/65863/65864 AC-6/11-0 TABLE 53. CONDITION CODES BIT CODE NAME (BIT 4 = 0) INVERSE (BIT 4 = 1) FUNCTIONAL DESCRIPTION 0 LT/GP0 GT/ GP0 Less Than Flag set or cleared after CFT or CMT operation. Also, General Purpose Flag 0 may be set or cleared by a FLG operation. 1 EQ/GP1 NE/GP1 Equal Flag set or cleared after CFT or CMT operation. Also, General Purpose Flag 1 may also be set or cleared by a FLG operation. 2 3 4 5 6 7 GP2 GP3 GP4 GP5 GP6 GP7 GP2 GP3 GP4 GP5 GP6 GP7 General Purpose Flags may be set, cleared, or toggled by a FLG operation. The host processor can set, clear, or toggle these flags in the same way as the FLG instruction by means of the BC GENERAL PURPOSE FLAG REGISTER. 8 NORESP RESP 9 FMT ERR FMT ERR FMT ERR indicates that the received portion of the most recent message contained one or more violations of the 1553 message validation criteria (sync, encoding, parity, bit count, word count, etc.), or the RT's status word received from a responding RT contained an incorrect RT address field. A GD BLK XFER GD BLK XFER For the most recent message, GD BLK XFER will be set to logic "1" following completion of a valid (error-free) RT-to-BC transfer, RT-to-RT transfer, or transmit mode code with data message. This bit is set to logic "0" following an invalid message. GOOD DATA BLOCK TRANSFER is always logic "0" following a BC-to-RT transfer, a mode code with data, or a mode code without data. The Loop Test has no effect on GOOD DATA BLOCK TRANSFER. GOOD DATA BLOCK TRANSFER may be used to determine if the transmitting portion of an RT-to-RT transfer was error free. B MASKED STATUS BIT MASKED STATUS BIT Indicates that one or both of the following conditions have occurred for the most recent message: (1) If one (or more) of the Status Mask bits (14 through 9) in the BC Control Word is logic "0" and the corresponding bit(s) is (are) set (logic "1") in the received RT Status Word. In the case of the RESERVED BITS MASK (bit 9) set to logic "0", any or all of the 3 Reserved Status Word bits being set will result in a MASKED STATUS SET condition; and/or (2) If BROADCAST MASK ENABLED/XOR (bit 11 of Configuration Register #4) is logic "1" and the MASK BROADCAST bit of the message's BC Control Word is logic "0" and the BROADCAST COMMAND RECEIVED bit in the received RT Status Word is logic "1". C BAD MESSAGE GOOD MESSAGE BAD MESSAGE indicates either a format error, loop test fail, or no response error for the most recent message. Note that a "Status Set" condition has no effect on the "BAD MESSAGE/GOOD MESSAGE" condition code. D RETRY0 RETRY0 E RETRY1 RETRY1 These two bits reflect the retry status of the most recent message. The number of times that the message was retried is delineated by these two bits as shown below: RETRY COUNT 1 RETRY COUNT 0 Number of (bit 14) (bit 13) Message Retries 0 0 0 0 1 1 1 0 N/A 1 1 2 F ALWAYS NEVER Data Device Corporation www.ddc-web.com NORESP indicates that an RT has either not responded or has responded later than the BC No Response Timeout time. The PCI Mini-ACE Mark3/Micro-ACE TE's No Response Timeout Time is defined per MIL-STD-1553B as the time from the mid-bit crossing of the parity bit to the mid-sync crossing of the RT Status Word. The value of the No Response Timeout value is programmable from among the nominal values 18.5, 22.5, 50.5, and 130 s (1 s) by means of bits 10 and 9 of Configuration Register #5. The ALWAYS bit should be set (bit 4 = 0) to designate an instruction as unconditional. The NEVER bit (bit 4 =1) can be used to implement an NOP instruction. 28 BU-65743/65843/65863/65864 AC-6/11-0 use of convenient, usable data structures, such as circular buffers and double buffers. The op code parity bit encompasses all sixteen bits of the op code word. This bit must be programmed for odd parity. If the message sequence control processor fetches an undefined op code word, an op code word with even parity, or bits 9-5 of an op code word do not have a binary pattern of 01010, the message sequence control processor will immediately halt the BC's operation. In addition, if enabled, a BC TRAP OP CODE interrupt will be issued. Also, if enabled, a parity error will result in an OP CODE PARITY ERROR interrupt. TABLE 53 describes the Condition Codes. Other operations support program flow control; i.e., jump and call capability. The call capability includes maintenance of a call stack which supports a maximum of four (4) entries; there is also a return instruction. In the case of a call stack overrun or underrun, the BC will issue a CALL STACK POINTER REGISTER ERROR interrupt, if enabled. Other op codes may be used to delay for a specified time; start a new BC frame; wait for an external trigger to start a new frame; perform comparisons based on frame time and time-to-next message; load the time tag or frame time registers; halt; and issue host interrupts. In the case of host interrupts, the message control processor passes a 4-bit user-defined interrupt vector to the host, by means of the PCI Mini-ACE Mark3/Micro-ACE TE's Interrupt Status Register. BC MESSAGE SEQUENCE CONTROL The PCI Mini-ACE Mark3/Micro-ACE TE BC message sequence control capability enables a high degree of offloading of the host processor. This includes using the various timing functions to enable autonomous structuring of major and minor frames. In addition, by implementing conditional jumps and subroutine calls, the message sequence control processor greatly simplifies the insertion of asynchronous, or "out-of-band" messages. The purpose of the FLG instruction is to enable the message sequence controller to set, clear, or toggle the value(s) of any or all of the eight general purpose condition flags. (part of) BC INSTRUCTION LIST XQF MESSAGE CONTROL/STATUS BLOCK 0 POINTER XX00h POINTER Execute and Flip Operation. The PCI Mini-ACE Mark3/MicroACE TE BC's XQF, or "Execute and Flip" operation, provides some unique capabilities. Following execution of this unconditional instruction, if the condition code tests TRUE, the BC will modify the value of the current XQF instruction's pointer parameter by toggling bit 4 of the pointer. That is, if the selected condition flag tests true, the value of the parameter will be updated to the value = old address XOR 0010h. As a result, the next time that this line in the instruction list is executed, the Message Control/Status Block at the updated address (old address XOR 0010h) will be processed, rather than the one at the old address. The operation of the XQF instruction is illustrated in FIGURE 4. There are multiple ways of utilizing the "execute and flip" instruction. One is to facilitate the implementation of a double buffering data scheme for individual messages. This allows the message sequence control processor to "ping-pong" between a pair of data buffers for a particular message. By doing so, the host processor can access one of the two Data Word blocks, while the BC reads or writes the alternate Data Word block. DATA BLOCK 0 A second application of the "execute and flip" capability is in conjunction with message retries. This allows the BC to not only switch buses when retrying a failed message, but to automatically switch buses permanently for all future times that the same message is to be processed. This not only provides a high degree of autonomy from the host CPU, but saves BC bandwidth, by eliminating the need for future attempts to process messages on an RT's failed channel. MESSAGE CONTROL/STATUS BLOCK 1 XX10h POINTER DATA BLOCK 1 FIGURE 4. EXECUTE and FLIP (XQF) OPERATION Data Device Corporation www.ddc-web.com 29 BU-65743/65843/65863/65864 AC-6/11-0 General Purpose Queue. The PCI Mini-ACE Mark3/Micro-ACE TE BC allows for the creation of a general purpose queue. This data structure provides a means for the message sequence processor to convey information to the BC host. The BC op code repertoire provides mechanisms to push various items on this queue. These include the contents of the Time Tag Register, the Block Status Word for the most recent message, an immediate data value, or the contents of a specified memory address. MIL-STD-1553A, MIL-STD-1553B Notice 2, STANAG 3838, General Dynamics 16PP303, and McAirA3818, A5232, and A5690. For the PCI Mini-ACE Mark3/Micro-ACE TE RT mode, there is programmable flexibility enabling the RT to be configured to fulfill any set of system requirements. This includes the capability to meet the MIL-STD-1553A response time requirement of 2 to 5 s, and multiple options for mode code subaddresses, mode codes, RT status word, and RT BIT word. The PCI Mini-ACE Mark3/Micro-ACE TE RT protocol design implements all of the MIL-STD-1553B message formats and dual redundant mode codes. The design has passed validation testing for MIL-STD-1553B compliance. The PCI Mini-ACE Mark3/MicroACE TE RT performs comprehensive error checking including word and format validation, and checks for various RT-to-RT transfer errors. One of the main features of the PCI Mini-ACE Mark3/Micro-ACE TE RT is its choice of memory management options. These include single buffering by subaddress, circular buffering by individual subaddresses, and global circular buffering for multiple (or all) subaddresses. FIGURE 5 illustrates the operation of the BC General Purpose Queue. Note that the BC General Purpose Queue Pointer Register will always point to the next address location (modulo 64); that is, the location following the last location written by the BC message sequence control engine. If enabled, a BC GENERAL PURPOSE QUEUE ROLLOVER interrupt will be issued when the value of the queue pointer address rolls over at a 64-word boundary. The rollover will always occur at a modulo 64 address. Other features of the PCI Mini-ACE Mark3/Micro-ACE TE RT include a set of interrupt conditions, an interrupt status queue with filtering based on valid and/or invalid messages, internal command illegalization, programmable busy by subaddress, multiple options on time tagging. REMOTE TERMINAL (RT) ARCHITECTURE The PCI Mini-ACE Mark3/Micro-ACE TE's RT architecture builds upon that of the ACE and Mini-ACE. The PCI Mini-ACE Mark3/ Micro-ACE TE provides multiprotocol support, with full compliance to all of the commonly used data bus standards, including BC GENERAL PURPOSE QUEUE (64 Locations) BC GENERAL PURPOSE QUEUE POINTER REGISTER LAST LOCATION NEXT LOCATION FIGURE 5. BC GENERAL PURPOSE QUEUE Data Device Corporation www.ddc-web.com 30 BU-65743/65843/65863/65864 AC-6/11-0 RT MEMORY ORGANIZATION TABLE 54 illustrates a typical memory map for a PCI Mini-ACE Mark3/Micro-ACE TE RT with 4K RAM. Note that this table and subsequent references to it are using word addressing: PCI BAR0 address offsets (byte addresses) are TWO times the word addresses indicated. The two Stack Pointers reside in fixed locations in the shared RAM address space: address 0100h (PCI BAR0 offset 0200h) for the Area A Stack Pointer and address 0104h (PCI BAR0 offset 208h) for the Area B Stack Pointer. In addition to the Stack Pointer, there are several other areas of the shared RAM address space that are designated as fixed locations (all shown in bold). These are for the Area A and Area B lookup tables, the illegalization lookup table, the busy lookup table, and the mode code data tables. es. The RT lookup tables include subaddress control words as well as the individual data block pointers. If command illegalization is used, address range 0300-03FF is used for command illegalizing. The descriptor stack RAM area, as well as the individual data blocks, may be located in any of the non-fixed areas in the shared RAM address space. Note that in TABLE 54, there is no area allocated for "Stack B". This is shown for purpose of illustration. Also, note that in TABLE 54, the allocated area for the RT command stacks is 256 words. However, larger stack sizes are possible. That is, the RT command stack size may be programmed for 256 words (64 messages), 512, 1024, or 2048 words (512 messages) by means of bits 14 and 13 of Configuration Register 3. The RT lookup tables provide a mechanism for allocating data blocks for individual transmit, receive, or broadcast subaddress- TABLE 54. TYPICAL RT MEMORY MAP (SHOWN AS 4K RAM) Data Device Corporation www.ddc-web.com WORD ADDRESS (HEX) PCI BAR0 OFFSET(HEX) 0000-00FF DESCRIPTION 0000-01FE STACK A 0100 0200 STACK POINTER A 0101 0202 0102-0103 GLOBAL CIRCULAR BUFFER A POINTER 0204-0206 RESERVED 0104 0208 STACK POINTER B 0105 020A 0106-0107 020C-020E RESERVED 0108-010F 0210-021E MODE CODE SELECTIVE INTERRUPT TABLE 0110-013F 0220-027E MODE CODE DATA 0140-01BF 0280-037E LOOKUP TABLE A 01C0-023F GLOBAL CIRCULAR BUFFER B POINTER 0380-047E LOOKUP TABLE B 0240-0247 0480-048E BUSY BIT LOOKUP TABLE 0248-025F 0490-04BE (NOT USED) 0260-027F 04C0-04FE DATA BLOCK 0 0280-02FF 0500-05FE DATA BLOCK 1-4 0300-03FF 0600-07FE COMMAND ILLEGALIZING TABLE 0400-041F 0800-083E DATA BLOCK 5 0420-043F 0840-087E DATA BLOCK 6 * * * * * * * * * 0FE0-0FFF 1FC0-1FFE DATA BLOCK 100 31 BU-65743/65843/65863/65864 AC-6/11-0 RT MEMORY MANAGEMENT host processor to determine the cause of all interrupts by means of a single read operation. The PCI Mini-ACE Mark3/Micro-ACE TE provides a variety of RT memory management capabilities. As with the ACE and MiniACE (Plus), and Enhanced Mini-ACE the choice of memory management scheme is fully programmable on a transmit/ receive/broadcast subaddress basis. SINGLE BUFFERED MODE The operation of the single buffered RT mode is illustrated in FIGURE 6. In the single buffered mode, the respective lookup table entry must be written by the host processor. Received data words are written to, or transmitted data words are read from the data word block with starting address referenced by the lookup table pointer. In the single buffered mode, the current lookup table pointer is not updated by the PCI Mini-ACE Mark3/MicroACE TE memory management logic. Therefore, if a subsequent message is received for the same subaddress, the same Data Word block will be overwritten or overread. In compliance with MIL-STD-1553B Notice 2, received data from broadcast messages may be optionally separated from nonbroadcast received data. For each transmit, receive or broadcast subaddress, either a single-message data block, or a variablesized (128 to 8192 words) subaddress circular buffer may be allocated for data storage. The memory management scheme for individual subaddresses is designated by means of the subaddress control word (reference TABLE 56). CIRCULAR BUFFER MODE For received data, there is also a global circular buffer mode. In this configuration, the data words received from multiple (or all) subaddresses are stored in a common circular buffer structure. Like the subaddress circular buffer, the size of the global circular buffer is programmable, with a range of 128 to 8192 data words. The operation of the PCI Mini-ACE Mark3/Micro-ACE TE circular buffer RT memory management mode is illustrated in FIGURE 7. As in the single buffered mode, the individual lookup table entries are initially loaded by the host processor. At the start of each message, the lookup table entry is stored in the third position of the respective message block descriptor in the descriptor stack area of RAM. Receive or transmit data words are transferred to (from) the circular buffer, starting at the location referenced by the lookup table pointer. In addition to helping ensure data sample consistency, the circular buffer options provide a means for greatly reducing host processor overhead for multi-message bulk data transfer applications. In general, the location after the last data word written or read (modulo the circular buffer size) during the message is written to the respective lookup table location during the end-of-message sequence. By so doing, data for the next message for the respective transmit, receive(/broadcast), or broadcast subaddress will be accessed from the next lower contiguous block of locations in the circular buffer. End-of-message interrupts may be enabled either globally (following all messages), following error messages, on a transmit/ receive/broadcast subaddress or mode code basis, or when a circular buffer reaches its midpoint (50% boundary) or lower (100%) boundary. A pair of interrupt status registers allow the CONFIGURATION REGISTER 15 13 STACK POINTERS LOOK-UP TABLE (DATA BLOCK ADDR) DESCRIPTOR STACKS 0 CURRENT AREA B/A DATA BLOCKS BLOCK STATUS WORD TIME TAG WORD LOOK-UP TABLE ADDR DATA BLOCK POINTER (See note) DATA BLOCK RECEIVED COMMAND WORD DATA BLOCK Note: Lookup table is not used for mode commands when enhanced mode codes are enabled. FIGURE 6. RT SINGLE BUFFERED MODE Data Device Corporation www.ddc-web.com 32 BU-65743/65843/65863/65864 AC-6/11-0 GLOBAL CIRCULAR BUFFER For the case of a receive (or broadcast receive) message with a data word error, there is an option such that the lookup table pointer will only be updated following receipt of a valid message. That is, the pointer will not be updated following receipt of a message with an error in a data word. This allows failed messages in a bulk data transfer to be retried without disrupting the circular buffer data structure, and without intervention by the RT's host processor. Beyond the programmable choice of single buffer mode or circular buffer mode, programmable on an individual subaddress basis, the PCI Mini-ACE Mark3/Micro-ACE TE architecture provides an additional option, a variable sized global circular buffer. TABLE 55. RT LOOK-UP TABLES (ALL ADDRESSES IN HEX) AREA A (INTERNAL MEMORY OFFSET AREA A (PCI BAR0 OFFSET) AREA B (INTERNAL MEMORY OFFSET) AREA B (PCI BAR0 OFFSET) DESCRIPTION COMMENT 0140 * * * 015F 0280 * * * 02BE 01C0 * * * 01DF 0380 * * * 03BE Rx(/Bcst) SA0 * * * Rx(/Bcst) SA31 Receive (/Broadcast) Lookup Pointer Table 0160 * * * 017F 02C0 * * * 02FE 01E0 * * * 01FF 03C0 * * * 03FE Tx SA0 * * * Tx SA31 Transmit Lookup Pointer Table 0180 * * * 019F 0300 * * * 033E 0200 * * * 021F 0400 * * * 043F Bcst SA0 * * * Bcst SA31 Broadcast Lookup Pointer Table (Optional) 01A0 * * * 01BF 0340 * * * 037E 0220 * * * 023F 0440 * * * 047E SACW SA0 * * * SACW SA31 Subaddress Control Word Lookup Table (Optional) TABLE 56. RT SUBADDRESS CONTROL WORD - MEMORY MANAGEMENT OPTIONS GLOBAL CIRCULAR BUFFER (bit 15) SUBADDRESS CONTROL WORD BITS MM2 MM1 MM0 MEMORY MANAGEMENT SUBADDRESS BUFFER SCHEME DESCRIPTION 0 0 0 0 Single Message 1 0 0 0 Reserved for future use 0 0 0 1 128-Word 0 0 1 0 256-Word 0 0 1 1 512-Word 0 1 0 0 1024-Word 0 1 0 1 2048-Word 0 1 1 0 4096-Word 0 1 1 1 8192-Word 1 Data Device Corporation www.ddc-web.com 1 1 Subaddress specific circular buffer of specified size. (for receive and / or broadcast subaddresses only) Global Circular Buffer: The buffer size is specified by Configuration Register #6, bits 11-9. The pointer to the global circular buffer is stored at address 0101h (for Area A, PCI BAR0 offset 0202h) or address 0105h (for Area B, PCI BAR0 offset 020Ah) 1 33 BU-65743/65843/65863/65864 AC-6/11-0 In the global circular buffer mode, the data for multiple receive subaddresses is stored in the same circular buffer data structure. The size of the global circular buffer may be programmed for 128, 256, 512, 1024, 2048, 4096, or 8192 words, by means of bits 11, 10, and 9 of Configuration Register #6. As shown in TABLE 56, individual subaddresses may be mapped to the global circular buffer by means of their respective subaddress control words. The global circular buffer option provides a highly efficient method for storing received message data. It allows for frequently used subaddresses to be mapped to individual data blocks, while also providing a method for asynchronously received messages to infrequently used subaddresses to be logged to a common area. Alternatively, the global circular buffer provides an efficient means for storing the received data words for all subaddresses. Under this method, all received data words are stored chronologically, regardless of subaddress. The pointer to the Global Circular Buffer will be stored in location 0101 (for Area A, PCI BAR0 offset 0202h), or location 0105h (for Area B, PCI BAR0 offset 020Ah). CONFIGURATION REGISTER 15 13 STACK POINTERS DESCRIPTOR STACK CIRCULAR DATA BUFFER LOOK-UP TABLES 0 CURRENT AREA B/A BLOCK STATUS WORD TIME TAG WORD DATA BLOCK POINTER RECEIVED COMMAND WORD LOOK-UP TABLE ADDRESS LOOK-UP TABLE ENTRY POINTER TO CURRENT DATA BLOCK POINTER TO NEXT DATA BLOCK * RECEIVED (TRANSMITTED) MESSAGE DATA (NEXT LOCATION) 128, 256 8192 WORDS Notes: CIRCULAR BUFFER ROLLOVER 1. TX/RS/BCST_SA look-up table entry is updated following valid receive (broadcast) message or following completion of transit message 2. For the Global Circular Buffer Mode, the pointer is read from and re-written to Address 0101 (for Area A) or Address 0105 (for Area B). FIGURE 7. RT CIRCULAR BUFFERED MODE DESCRIPTOR STACK CIRCULAR BUFFER* (128,256,...8192 WORDS) LOOK-UP TABLE BLOCK STATUS WORD TIME TAG WORD DATA BLOCK POINTER RECEIVED COMMAND WORD DATA POINTER RECEIVED (TRANSMITTED) MESSAGE DATA 50% 50% ROLLOVER INTERRUPT Note The example shown is for an RT Subaddress Circular Buffer. The 50% and 100% Rollover Interrupts are also applicable to the RT Global Circulat Buffer, RT Command Stack, Monitor Command Stack, and Monitor Data Stack. 100% 100% ROLLOVER INTERRUPT FIGURE 8. 50% and 100% ROLLOVER INTERRUPTS Data Device Corporation www.ddc-web.com 34 BU-65743/65843/65863/65864 AC-6/11-0 RT DESCRIPTOR STACK RT INTERRUPTS The descriptor stack provides a chronology of all messages processed by the PCI Mini-ACE Mark3/Micro-ACE TE RT. Reference FIGURES 6 and 7. Similar to BC mode, there is a four-word block descriptor in the Stack for each message processed. The four entries to each block descriptor are the Block Status Word, Time Tag Word, the pointer to the start of the message's data block, and the 16-bit received Command Word. The PCI Mini-ACE Mark3/Micro-ACE TE offers a great deal of flexibility in terms of RT interrupt processing. By means of the Enhanced Mini-ACE/Micro-ACE's two Interrupt Mask Registers, the PCI Mini-ACE Mark3/Micro-ACE TE's RT may be programmed to issue interrupt requests for the following events/conditions: End-of-(every)Message, Message Error, Selected (transmit or receive) Subaddress, 100% Circular Buffer Rollover, 50% Circular Buffer Rollover, 100% Descriptor Stack Rollover, 50% Descriptor Stack Rollover, Selected Mode Code, Transmitter Timeout, Illegal Command, and Interrupt Status Queue Rollover. The RT Block Status Word includes indications of whether a particular message is ongoing or has been completed, what bus channel it was received on, indications of illegal commands, and flags denoting various message error conditions. For the subaddress circular buffering, and global circular buffering modes, the data block pointer may be used for locating the data blocks for specific messages. Note that for mode code commands, there is an option to store the transmitted or received data word as the third word of the descriptor, in place of the data block pointer. Interrupts for 50% Rollovers of Stacks and Circular Buffers. The PCI Mini-ACE Mark3/Micro-ACE TE RT and Monitor are capable of issuing host interrupts when a subaddress circular buffer pointer or stack pointer crosses its mid-point boundary. For RT circular buffers, this is applicable for both transmit and receive subaddresses. Reference FIGURE 8. There are four interrupt mask and interrupt status register bits associated with the 50% rollover function: (1) RT circular buffer; (2) RT command (descriptor) stack; (3) Monitor command (descriptor) stack; and (4) Monitor data stack. The Time Tag Word provides a 16-bit indication of relative time for individual messages. The resolution of the PCI Mini-ACE Mark3/Micro-ACE TE's time tag is programmable from among 2, 4, 8, 16, 32, or 64 s/LSB using the internal clock, or it can be programmed to increment directly from the TAG_CLK input by writing all ones to the time tag resolution bits. If enabled, there is a time tag rollover interrupt, which is issued when the value of the time tag rolls over from FFFF(hex) to 0. Other time tag options include the capabilities to clear the time tag register following receipt of a Synchronize (without data) mode command and/or to set the time tag following receipt of a Synchronize (with data) mode command. For that latter, there is an added option to filter the "set" capability based on the LSB of the received data word being equal to logic "0". The 50% rollover interrupt is beneficial for performing bulk data transfers. For example, when using circular buffering for a particular receive subaddress, the 50% rollover interrupt will inform the host processor when the circular buffer is half full. At that time, the host may proceed to read the received data words in the upper half of the buffer, while the PCI Mini-ACE Mark3/MicroACE TE RT writes received data words to the lower half of the circular buffer. Later, when the RT issues a 100% circular buffer rollover interrupt, the host can proceed to read the received data from the lower half of the buffer, while the PCI Mini-ACE Mark3/ INTERRUPT STATUS QUEUE (64 Locations) DESCRIPTOR STACK INTERRUPT VECTOR INTERRUPT VECTOR QUEUE POINTER REGISTER (IF) PARAMETER (POINTER) NEXT VECTOR BLOCK STATUS WORD TIME TAG DATA BLOCK POINTER DATA WORD BLOCK RECEIVED COMMAND FIGURE 9. RT (and MONITOR) INTERRUPT STATUS QUEUE (shown for message Interrupt event) Data Device Corporation www.ddc-web.com 35 BU-65743/65843/65863/65864 AC-6/11-0 Micro-ACE TE RT continues to write received data words to the upper half of the buffer. For a RAM Parity Error non-message interrupt, the parameter will be the RAM address where the parity check failed. For the RT address Parity Error, and Time Tag rollover non-message interrupts, the parameter is not used; it will have a value of 0000. Interrupt status queue. The PCI Mini-ACE Mark3/Micro-ACE TE RT, Monitor, and combined RT/Monitor modes include the capability for generating an interrupt status queue. As illustrated in FIGURE 9, this provides a chronological history of interrupt generating events and conditions. In addition to the Interrupt Mask Register, the Interrupt Status Queue provides additional filtering capability, such that only valid messages and/or only invalid messages may result in the creation of an entry to the Interrupt Status Queue. Queue entries for invalid and/or valid messages may be disabled by means of bits 8 and 7 of configuration register #6. If enabled, an INTERRUPT STATUS QUEUE ROLLOVER interrupt will be issued when the value of the queue pointer address rolls over at a 64-word address boundary. RT COMMAND ILLEGALIZATION The PCI Mini-ACE Mark3/Micro-ACE TE provides an internal mechanism for RT Command Word illegalizing. By means of a 256-word area in shared RAM, the host processor may designate that any message be illegalized, based on the command word T/R bit, subaddress, and word count/mode code fields. The PCI Mini-ACE Mark3/Micro-ACE TE illegalization scheme provides the maximum in flexibility, allowing any subset of the 4096 possible combinations of broadcast/own address, T/R bit, subaddress, and word count/mode code to be illegalized. The pointer to the Interrupt Status Queue is stored in the INTERRUPT VECTOR QUEUE POINTER REGISTER (register address 1F). This register must be initialized by the host, and is subsequently incremented by the RT message processor. The interrupt status queue is 64 words deep, providing the capability to store entries for up to 32 messages. The address map of the PCI Mini-ACE Mark3/Micro-ACE TE's illegalizing table is illustrated in TABLE 57. The queue rolls over at addresses of modulo 64. The events that result in queue entries include both message-related and nonmessage-related events. Note that the Interrupt Vector Queue Pointer Register will always point to the next location (modulo 64) following the last vector/pointer pair written by the PCI MiniACE Mark3/Micro-ACE TE RT, Monitor, or RT/Monitor. BUSY BIT The PCI Mini-ACE Mark3/Micro-ACE TE RT provides two different methods for setting the Busy status word bit: (1) globally, by means of Configuration Register #1; or (2) on a T/R-bit/subaddress basis, by means of a RAM lookup table. If the host CPU asserts the BUSY bit low in Configuration Register #1, the PCI Mini-ACE Mark3/Micro-ACE TE RT will respond to all nonbroadcast commands with the Busy bit set in its RT Status Word. Each event that causes an interrupt results in a two-word entry to be written to the queue. The first word of the entry is the interrupt vector. The vector indicates which interrupt event(s)/ condition(s) caused the interrupt. The interrupt events are classified into two categories: message interrupt events and non-message interrupt events. Messagebased interrupt events include End-of-Message, Selected mode code, Format error, Subaddress control word interrupt, RT Circular buffer Rollover, Handshake failure, RT Command stack rollover, transmitter timeout, MT Data Stack rollover, MT Command Stack rollover, RT Command Stack 50% rollover, MT Data Stack 50% rollover, MT Command Stack 50% rollover, and RT Circular buffer 50% rollover. Non-message interrupt events/conditions include time tag rollover, RT address parity error, RAM parity error, and BIT completed. Alternatively, there is a Busy lookup table in the PCI Mini-ACE Mark3/Micro-ACE TE shared RAM. By means of this table, it is possible for the host processor to set the busy bit for any selectable subset of the 128 combinations of broadcast/own address, T/R bit, and subaddress. If the busy bit is set for a transmit command, the PCI Mini-ACE Mark3/Micro-ACE TE RT will respond with the busy bit set in the status word, but will not transmit any data words. If the busy bit is set for a receive command, the RT will also respond with the busy status bit set. There are two programmable options regarding the reception of data words for a non-mode code receive command for which the RT is busy: (1) to transfer the received data words to shared RAM; or (2) to not transfer the data words to shared RAM. Bit 0 of the interrupt vector (interrupt status) word indicates whether the entry is for a message interrupt event (if bit 0 is logic "1") or a non-message interrupt event (if bit 0 is logic "0"). It is not possible for one entry on the queue to indicate both a message interrupt and a non-message interrupt. RT ADDRESS The PCI Mini-ACE Mark3/Micro-ACE TE offers several different options for designating the Remote Terminal address. These include the following: (1) hardwired, by means of the 5 RT ADDRESS inputs, and the RT ADDRESS PARITY input; (2) by means of the RT ADDRESS (and PARITY) inputs, but latched via As illustrated in FIGURE 9, for a message interrupt event, the parameter word is a pointer. The pointer will reference the first word of the RT or MT command stack descriptor (i.e., the Block Status Word). Data Device Corporation www.ddc-web.com 36 BU-65743/65843/65863/65864 AC-6/11-0 TABLE 57. ILLEGALIZATION TABLE MEMORY MAP ADDRESS PCI BAR0 OFFSET DESCRIPTION 300 301 302 303 * * * 33F 340 341 342 * * * 37D 37E 37F 380 381 382 383 * * * 3BE 3BF 3C0 3C1 3C2 3C3 * * * 3FC 3FD 3FE 3FF 600 602 604 606 * * * 67E 680 682 684 * * * 6FA 6FC 6FE 700 702 704 706 * * * 77C 77E 780 782 784 786 * * * 7F8 7FA 7FC 7FE Brdcst / Rx, SA 0, MC15-0 Brdcst / SA 0, MC31-16 Brdcst / Rx, SA 1, WC15-0 Brdcst / Rx, SA 1, WC31-16 * * * Brdcst / Rx, SA 0, MC15-0 Brdcst / Tx, SA 0, MC31-16 Brdcst / Tx, SA 1,WC15-0 Brdcst / Tx, SA 1, WC31-16 * * * Brdcst / Tx, SA 30, WC31-16 Brdcst / Tx, SA 31, MC15-0 Brdcst / Tx, SA 31, MC31-16 Own Addr / Rx, SA 0, MC15-0 Own Addr / Rx, SA 0, MC31-16 Own Addr / Rx, SA 1, WC15-0 Own Addr / Rx, SA 1, WC31-15 * * * Own Addr / Rx, SA 31, MC15-0 Own Addr / Rx, SA 31, MC31-16 Own Addr / Tx, SA 0, MC15-0 Own Addr / Tx, SA 0, MC31-16 Own Addr / Tx, SA 1, WC15-0 Own Addr / Tx, SA 1, WC31-16 * * * Own Addr / Tx, SA 30, WC15-0 Own Addr / Tx, SA 30, WC31-16 Own Addr / Tx, SA 31, MC15-0 Own Addr / Tx, SA 31, MC31-16 hardware, on the rising edge of the RT_AD_LAT input signal; (3) input by means of the RT ADDRESS (and PARITY) inputs, but latched via host software; and (4) software programmable, by means of an internal register. In all four configurations, the RT address is readable by the host processor. the Busy and Message error (illegal) Status word bits, and options for the handling of 1553A and reserved mode codes. RT BUILT-IN-TEST (BIT) WORD The PCI Mini-ACE Mark3/Micro-ACE TE includes three monitor modes: (1) A Word Monitor mode (2) A selective message monitor mode (3) A combined RT/message monitor mode MONITOR ARCHITECTURE The bit map for the PCI Mini-ACE Mark3/Micro-ACE TE's internal RT Built-in-Test (BIT) Word is indicated in TABLE 58. OTHER RT FEATURES The PCI Mini-ACE Mark3/Micro-ACE TE includes options for the Terminal flag status word bit to be set either under software control and/or automatically following a failure of the loopback selftest. Other software programmable RT options include software programmable RT status and RT BIT words, automatic clearing of the Service Request bit following receipt of a Transmit vector word mode command, options regarding Data Word transfers for Data Device Corporation www.ddc-web.com For new applications, it is recommended that the selective message monitor mode be used, rather than the word monitor mode. Besides providing monitor filtering based on RT address, T/R bit, and subaddress, the message monitor eliminates the need to determine the start and end of messages by software. 37 BU-65743/65843/65863/65864 AC-6/11-0 WORD MONITOR MODE PCI Mini-ACE Mark3/Micro-ACE TE with 4K RAM), the counter rolls over to 0000. In the Word Monitor Terminal mode, the PCI Mini-ACE Mark3/ Micro-ACE TE monitors both 1553 buses. After the software initialization and Monitor Start sequences, the PCI Mini-ACE Mark3/Micro-ACE TE stores all Command, Status, and Data Words received from both buses. For each word received from either bus, a pair of words is stored to the PCI Mini-ACE Mark3/ Micro-ACE TE's shared RAM. The first word is the word received from the 1553 bus. The second word is the Monitor Identification (ID), or "Tag" word. The ID word contains information relating to bus channel, word validity, and inter-word time gaps. The data and ID words are stored in a circular buffer in the shared RAM address space. WORD MONITOR TRIGGER In the Word Monitor mode, there is a pattern recognition trigger and a pattern recognition interrupt. The 16-bit compare word for both the trigger and the interrupt is stored in the Monitor Trigger Word Register. The pattern recognition interrupt is enabled by setting the MT Pattern Trigger bit in Interrupt Mask Register. The pattern recognition trigger is enabled by setting the Trigger Enable bit in Configuration Register #1 and selecting either the Start-ontrigger or the Stop-on-trigger bit in Configuration Register #1. The Word Monitor may also be started by means of a low-to-high transition on the EXT_TRIG input signal. WORD MONITOR MEMORY MAP SELECTIVE MESSAGE MONITOR MODE A typical word monitor memory map is illustrated in TABLE 59. TABLE 59 assumes a 64K address space for the PCI Mini-ACE Mark3/Micro-ACE TE's monitor. The Active Area Stack pointer provides the address where the first monitored word is stored. In the example, it is assumed that the Active Area Stack Pointer for Area A (location 0100) is initialized to 0000. The first received data word is stored in location 0000, the ID word for the first word is stored in location 0001, etc. The PCI Mini-ACE Mark3/Micro-ACE TE Selective Message Monitor provides monitoring of 1553 messages with filtering based on RT address, T/R bit, and subaddress with no host processor intervention. By autonomously distinguishing between 1553 command and status words, the Message Monitor determines when messages begin and end, and stores the messages into RAM, based on a programmable filter of RT address, T/R bit, and subaddress. The current Monitor address is maintained by means of a counter register. This value may be read by the CPU by means of the Data Stack Address Register. It is important to note that when the counter reaches the Stack Pointer address of 0100 or 0104, the initial pointer value stored in this shared RAM location will be overwritten by the monitored data and ID Words. When the internal counter reaches an address of FFFF (or 0FFF, for an The selective monitor may be configured as just a monitor, or as a combined RT/Monitor. In the combined RT/Monitor mode, the PCI Mini-ACE Mark3/Micro-ACE TE functions as an RT for one RT address (including broadcast messages), and as a selective message monitor for the other 30 RT addresses. The PCI MiniACE Mark3/Micro-ACE TE Message Monitor contains two stacks, a command stack and a data stack, that are independent from the TABLE 58. RT BIT WORD BIT TABLE 59. TYPICAL WORD MONITOR MEMORY MAP DESCRIPTION 15(MSB) TRANSMITTER TIMEOUT 14 LOOP TEST FAILURE B 13 LOOP TEST FAILURE A 12 HANDSHAKE FAILURE 11 TRANSMITTER SHUTDOWN B 10 TRANSMITTER SHUTDOWN A 9 8 HEX ADDRESS FUNCTION 0000 First Received 1553 Word 0001 First Identification Word 0002 Second Received 1553 Word 0003 Second Identification Word TERMINAL FLAG INHIBITED 0004 Third Received 1553 Word BIT TEST FAILURE 005 Third Identification Word * * * * * * 7 HIGH WORD COUNT 6 LOW WORD COUNT 5 INCORRECT SYNC RECEIVED 4 PARITY / MANCHESTER ERROR RECEIVED 0100 Stack Pointer (Fixed Location - gets overwritten) 3 RT-to-RT GAP / SYNC ADDRESS ERROR 2 RT-to-RT NO RESPONSE ERROR 1 RT-to-RT 2ND COMMAND WORD ERROR 0(LSB) COMMAND WORD CONTENTS ERROR * * * FFFF * * * Received 1553 Words and Identification Word Data Device Corporation www.ddc-web.com 38 BU-65743/65843/65863/65864 AC-6/11-0 RT command stack. The pointers for these stacks are located at fixed locations in RAM. Micro-ACE TE will reference the Selective Monitor Lookup Table to determine if the current command is enabled. If the current command is disabled, the PCI Mini-ACE Mark3/Micro-ACE TE monitor will ignore (and not store) the current message. If the command is enabled, the monitor will create an entry in the Monitor Command Stack at the address location referenced by the Monitor Command Stack Pointer, and an entry in the monitor data stack starting at the location referenced by the Monitor Data Stack Pointer. MONITOR SELECTION FUNCTION Following receipt of a valid command word in Selective Monitor mode, the PCI Mini-ACE Mark3/Micro-ACE TE will reference the selective monitor lookup table to determine if the particular command is enabled. The address for this location in the table is determined by means of an offset based on the RT Address, T/R bit, and Subaddress bit 4 of the current command word, and concatenating it to the monitor lookup table base address of 0280 (hex). The bit location within this word is determined by subaddress bits 3-0 of the current command word. The format of the information in the data stack depends on the format of the message that was processed. For example, for a BC-to-RT transfer (receive command), the monitor will store the command word in the monitor command descriptor stack, with the data words and the receiving RT's status word stored in the monitor data stack. If the specified bit in the lookup table is logic "0", the command is not enabled, and the PCI Mini-ACE Mark3/Micro-ACE TE will ignore this command. If this bit is logic "1", the command is enabled and the PCI Mini-ACE Mark3/Micro-ACE TE will create an entry in the monitor command descriptor stack (based on the monitor command stack pointer), and store the data and status words associated with the command into sequential locations in the monitor data stack. In addition, for an RT-to-RT transfer in which the receive command is selected, the second command word (the transmit command) is stored in the monitor data stack. The size of the monitor command stack is programmable, with choices of 256, 1K, 4K, or 16K words. The monitor data stack size is programmable with choices of 512, 1K, 2K, 4K, 8K, 16K, 32K or 64K words. MONITOR INTERRUPTS Selective monitor interrupts may be issued for End-of-message and for conditions relating to the monitor command stack pointer and monitor data stack pointer. The latter, which are shown in FIGURE 8, include Command Stack 50% Rollover, Command Stack 100% Rollover, Data Stack 50% Rollover, and Data Stack 100% Rollover. NOTE: After a command is discarded the monitor will immediately look for another "Command." Where only a subset of Subaddresses are enabled, it is possible that a succeeding Status words may be captured as a "Command". This will always be flagged as an error because the Word Count or timing will fail. The 50% rollover interrupts may be used to inform the host processor when the command stack or data stack is half full. At that time, The address definition for the Selective Monitor Lookup TABLE is illustrated in TABLE 60. TABLE 60. MONITOR SELECTION TABLE LOOKUP ADDRESS SELECTIVE MESSAGE MONITOR MEMORY ORGANIZATION BIT DESCRIPTION 15(MSB) Logic "0" 14 Logic "0" 13 Logic "0" 12 Logic "0" 11 Logic "0" 10 Logic "0" 9 Logic "1" The fixed memory map consists of two Monitor Command Stack Pointers (locations 102 and 106 hex), two Monitor Data Stack Pointers (locations 103 and 107 hex), and a Selective Message Monitor Lookup Table (locations 0280 through 02FF hex). For this example, the Monitor Command Stack size is assumed to be 1K words, and the Monitor Data Stack size is assumed to be 2K words. 8 Logic "0" 7 Logic "1" 6 RTAD_4 5 RTAD_3 4 RTAD_2 3 RTAD_1 2 RTAD_0 FIGURE 10 illustrates the Selective Message Monitor operation. Upon receipt of a valid Command Word, the PCI Mini-ACE Mark3/ 1 TRANSMIT / RECEIVE A typical memory map for the PCI Mini-ACE Mark3/Micro-ACE TE in the Selective Message Monitor mode, assuming a 4K RAM space, is illustrated in TABLE 61. This mode of operation defines several fixed locations in the RAM. These locations are allocated in a way in which none of them overlap with the fixed RT locations. This allows for the combined RT/Selective Message Monitor mode. Data Device Corporation www.ddc-web.com 0(LSB) 39 SUBADDRESS 4 BU-65743/65843/65863/65864 AC-6/11-0 the host may proceed to read the received messages in the upper half of the respective stack, while the PCI Mini-ACE Mark3/MicroACE TE monitor writes messages to the lower half of the stack. Later, when the monitor issues a 100% stack rollover interrupt, the host can proceed to read the received data from the lower half of the stack, while the PCI Mini-ACE Mark3/Micro-ACE TE monitor continues to write received data words to the upper half of the stack. rupt request and set a bit in the Interrupt Status Register when the Time Tag Register rolls over FFFF to 0000; for RT mode, the capability to automatically clear the Time Tag Register following reception of a Synchronize (without data) mode command, or to load the Time Tag Register following a Synchronize (with data) mode command. Additional time tag features supported by the PCI Mini-ACE Mark3/Micro-ACE TE include the capability for the BC to transmit the contents of the Time Tag Register as the data word for a Synchronize (with data) mode command; the capability for the RT to "filter" the data word for the Synchronize with data mode command, by only loading the Time Tag Register if the LSB of the received data word is "0"; an instruction enabling the BC Message Sequence Control engine to autonomously load the Time Tag Register with a specified value; and an instruction enabling the BC Message Sequence Control engine to write the value of the Time Tag Register to the General Purpose Queue. INTERRUPT STATUS QUEUE Like the PCI Mini-ACE Mark3/Micro-ACE TE RT, the Selective Monitor mode includes the capability for generating an interrupt status queue. As illustrated in FIGURE 9, this provides a chronological history of interrupt generating events. Besides the two Interrupt Mask Registers, the Interrupt Status Queue provides additional filtering capability, such that only valid messages and/ or only invalid messages may result in entries to the Interrupt Status Queue. The interrupt status queue is 64 words deep, providing the capability to store entries for up to 32 monitored messages. INTERRUPTS The PCI Mini-ACE Mark3/Micro-ACE TE series terminals provide many programmable options for interrupt generation and handling. The interrupt output pin (INT) has two software programmable modes of operation: a level output cleared under software control, or a level output automatically cleared following a read of the Interrupt Status Register (#1 or #2). MISCELLANEOUS 1553 CLOCK INPUT The PCI Mini-ACE Mark3/Micro-ACE TE decoder is capable of operating from a 10, 12, 16, or 20 MHz clock input. The clock frequency may be specified by means of the host processor writing to Configuration Register #6. In addition when PCI MicroACE TE parts have their RTBOOT_L ball asserted, the 1553 input clock divider is controlled by the CLK_SEL 0 and CLK_ SEL_1 balls. Individual interrupts are enabled by the two Interrupt Mask Registers. The host processor may determine the cause of the interrupt by reading the two Interrupt Status Registers, which provide the current state of interrupt events and conditions. The Interrupt Status Registers may be updated in two ways. In one interrupt handling mode, a particular bit in Interrupt Status Register #1 or #2 will be updated only if the event occurs and the corresponding bit in Interrupt Mask Register #1 or #2 is enabled. In the enhanced interrupt handling mode, a particular bit in one of the Interrupt Status Registers will be updated if the event/ condition occurs regardless of the value of the corresponding ENCODER/DECODERS For the selected clock frequency, there is internal logic to derive the necessary clocks for the Manchester encoder and decoders. For all clock frequencies, the decoders sample the receiver outputs on both edges of the input clock. By in effect doubling the decoders' sampling frequency, this serves to widen the tolerance to zero-crossing distortion, and reduce the bit error rate. TABLE 61. TYPICAL SELECTIVE MESSAGE MONITOR MEMORY MAP (shown for 4K RAM for "Monitor only" mode) TIME TAG The PCI Mini-ACE Mark3/Micro-ACE TE includes an internal read/writable Time Tag Register. This register is a CPU read/writable 16-bit counter with a programmable resolution of either 2, 4, 8, 16, 32, or 64 ms per LSB. In addition, this register can be incremented directly by the TAG_CLK input pin by writing all ones to the time tag resolution bits. Another option allows software controlled incrementing of the Time Tag Register. This supports self-test for the Time Tag Register. For each message processed, the value of the Time Tag Register is loaded into the second location of the respective descriptor stack entry ("TIME TAG WORD") for BC/RT/MT modes. ADDRESS (HEX) The functionality of the Time Tag Register is compatible with ACE/Mini-ACE (Plus) includes: the capability to issue an interData Device Corporation www.ddc-web.com 40 DESCRIPTION 0100-0101 Not Used 0102 Monitor Command Stack Pointer A (fixed location) 0103 Monitor Data Stack Pointer A (fixed location) 0104-0105 Not Used 0106 Monitor Command Stack Pointer B (fixed location) 0107 Monitor Data Stack Pointer B (fixed location) 0108-027F Not Used 0280-02FF Selective Monitor Lookup Table 0300-03FF Not Used 0400-07FF Monitor Command Stack A 0800-0FFF Monitor Data Stack A BU-65743/65843/65863/65864 AC-6/11-0 CONFIGURATION REGISTER #1 15 13 MONITOR COMMAND STACK POINTERS MONITOR COMMAND STACKS MONITOR DATA STACKS 0 CURRENT AREA B/A BLOCK STATUS WORD CURRENT COMMAND WORD MONITOR DATA BLOCK #N TIME TAG WORD DATA BLOCK POINTER MONITOR DATA BLOCK #N + 1 RECEIVED COMMAND WORD MONITOR DATA STACK POINTERS NOTE IF THIS BIT IS "0" (NOT SELECTED) NO WORDS ARE STORED IN EITHER THE COMMAND STACK OR DATA STACK. IN ADDITION, THE COMMAND AND DATA STACK POINTERS WILL NOT BE UPDATED. SELECTIVE MONITOR LOOKUP TABLES OFFSET BASED ON RTA4-RTA0, T/R, SA4 SELECTIVE MONITOR ENABLE (SEE NOTE) FIGURE 10. SELECTIVE MESSAGE MONITOR MEMORY MANAGEMENT Interrupt Mask Register bit. In either case, the respective Interrupt Mask Register (#1 or #2) bit is used to enable an interrupt for a particular event/condition. BC Control Interrupts, 50% Rollover interrupts for RT Command Stack, RT Circular Buffers, MT Command Stack, and MT Data Stack; BC Op Code Parity Error, (RT) Illegal Command, (BC) General Purpose Queue or (RT/MT) Interrupt Status Queue Rollover, Call Stack Pointer Register Error, BC Trap Op Code, and four User-Defined interrupts for the Enhanced BC mode. The PCI Mini-ACE Mark3/Micro-ACE TE supports all the interrupt events from ACE/Mini-ACE (Plus) and Enhanced Mini-ACE including RAM Parity Error, Transmitter Timeout, BC/RT Command Stack Rollover, MT Command Stack and Data Stack Rollover, Handshake Error, BC Retry, RT Address Parity Error, Time Tag Rollover, RT Circular Buffer Rollover, BC Message, RT Subaddress, BC End-of-Frame, Format Error, BC Status Set, RT Mode Code, MT Trigger, and End-of-Message. RAM PARITY The BC/RT/MT version of the PCI Mini-ACE Mark3/Micro-ACE TE is available with options of 4K or 64K words of internal RAM. For the 64K option, the RAM is 17 bits wide. The 64K X 17 internal RAM allows for parity generation for RAM write accesses, and parity checking for RAM read accesses. When the PCI MiniACE Mark3/Micro-ACE TE detects a RAM parity error, it reports it to the host processor by means of an interrupt and a register bit. Also, for the RT and Selective Message Monitor modes, the RAM address(es) where a parity error(s) was detected will be stored on the Interrupt Status Queue (if enabled). For the PCI Mini-ACE Mark3/Micro-ACE TE's Enhanced BC mode, there are four user-defined interrupt bits. The BC Message Sequence Control Engine includes an instruction enabling it to issue these interrupts at any time. For RT and Monitor modes, the PCI Mini-ACE Mark3/Micro-ACE TE architecture includes an Interrupt Status Queue. This provides a mechanism for logging messages that result in interrupt requests. Entries to the Interrupt Status Queue may be filtered such that only valid and/or invalid messages will result in entries on the queue. FIGURE 11 illustrates a generic connection diagram between a PCI "Initiator" and a PCI Mini-ACE Mark3/Micro-ACE TE "Target." The following timing diagrams illustrate the PCI commands that the PCI Mini-ACE Mark3/Micro-ACE TE responds to. Note that these diagrams are meant to show the basic PCI bus operation of the PCI Mini-ACE Mark3/Micro-ACE TE itself and do not show masters inserting wait states, masters burst reading or writing past address boundaries, masters writing into a full FIFO, etc. The PCI Mini-ACE Mark3/Micro-ACE TE incorporates additional interrupt conditions beyond ACE/Mini-ACE (Plus), based on the addition of Interrupt Mask Register #2 and Interrupt Status Register #2. This is accomplished by chaining the two Interrupt Status Registers using the INTERRUPT CHAIN BIT (bit 0) in Interrupt Status Register #2 to indicate that an interrupt has occurred in Interrupt Status Register #1. Additional interrupts include "Self-Test Completed", masking bits for the Enhanced Data Device Corporation www.ddc-web.com To help understand the following timing diagrams an explanation of the basic architecture of the PCI Mini-ACE Mark3/Micro-ACE TE is helpful. The PCI Mini-ACE Mark3/Micro-ACE TE can be 41 BU-65743/65843/65863/65864 AC-6/11-0 thought of as the very successful Mini-ACE terminal family integrated with a 3.3V 33MHz PCI target interface. To simplify descriptions of the PCI Mini-ACE Mark3/Micro-ACE TE architecture, the term ACE will be used as a substitute for "enhanced Mini-ACE" even though the 1553 terminal function is really an enhanced Mini-ACE. When reference is made to ACE memory (BAR0) or ACE registers (BAR1 00-FCh) these functions are part of the ACE portion of the die. These ACE functions are accessed via the write FIFO (for writes) and delayed read request logic (for reads). The "PCI interface registers" (BAR1 800-81Ch) are part of the PCI interface portion of the die and are written and read directly from the PCI bus, without use of the write FIFO or delayed read request logic. The PCI Mini-ACE Mark3/Micro-ACE TE's basic PCI transaction takes 3 PCI clocks, on top of the command phase. For example, a single write to any location within the PCI Mini-ACE Mark3/ Micro-ACE TE's memory space takes 4 PCI clocks, as shown in FIGURE 12. Note that this is a single write, not an attempted burst write: FRAME# is not held asserted by the master. Also note that a write to the ACE registers or ACE memory is actually a write into the write FIFO whereas a write to the PCI interface Vcc/GND OSCILLATOR AD0-AD31 C/BE[0]#-C/BE[3]# TX/RXA PAR CH. A FRAME# TX/RXA TRDY# IRDY# STOP# DEVSEL# IDSEL TX/RXB INTA# CH. B TAG_CLK SSFLAG/EXT_TRIG PCI "MASTER" INCMD/MCRST PERR# SERR# PCI Mini-ACE Mark3/ Micro-ACE TE "Target" TX/RXB PCI_CLK MSTCLR (RST#) RTAD0-RTAD4 RTADP RT ADDRESS, PARITY RT_AD_LAT TX_INH_A/B FIGURE 11. PCI INITIATOR TO PCI MINI-ACE MARK3/MICRO-ACE TE TARGET INTERFACE Data Device Corporation www.ddc-web.com 42 BU-65743/65843/65863/65864 AC-6/11-0 registers (BAR1 800-81Ch) is a write to the registers themselves. TABLE 62. PCI INTERFACE TIMINGS SYMBOL Table 62 provides the timing parameters for 3.3V PCI signaling environments applicable to the PCI Mini-ACE Mark3/Micro-ACE TE, and FIGURE 13 shows the timing reference points. The timing parameters apply to the other timing diagrams, but are not illustrated. The PCI Mini-ACE Mark3/Micro-ACE TE conforms to revision 2.2 of the PCI Local Bus specification. The timing parameters are provided here for ease of reference only. I IO UNITS 11 ns tv CLK TO SIGNAL VALID DELAY 2 tsu INPUT SETUP TIME TO CLK 7 ns th INPUT HOLD TIME FROM CLK 0 ns The PCI Mini-ACE Mark3/Micro-ACE TE responds to the first read with a Retry. By PCI rules the master must repeat the same exact request until it completes. This is shown by the master's second read attempt, which also produces a Retry. Each repeated read request from the master will be target terminated with a Retry until the data from the enqued DRR is present in the PCI Mini-ACE Mark3/Micro-ACE TE's PCI interface. The successful completion is FIGURE 15 shows the specific case of memory reads from the PCI-ACE interface registers at BAR1 800h-81Ch. Note that these registers are accessed quickly and without the Delayed 50ns 2 MAX FIGURE 16 illustrates the process of reading an ACE memory (BAR0) or ACE register (BAR1 00-FCh) location. The actual read shown is that of a single word read, due to the ~600 nS response time shown, see following text and timing formula tables. If the write FIFO is empty and there isn't a previous Delayed Read Request (DRR) pending, a read from these locations enques a DRR, which is then processed by the PCI Mini-ACE Mark3/Micro-ACE TE. If either of these conditions is true, the PCI Mini-ACE Mark3/MicroACE TE will respond with a Retry, but will not enque any new DRR. FIGURE 14 illustrates a PCI single write to PCI Mini-ACE Mark3/ Micro-ACE TE configuration space. The PCI Mini-ACE Mark3/ Micro-ACE TE only responds to Type Zero configuration access: AD[1:0] must be 00 during the command phase. Note that all combinations of byte enables for configuration writes are supported. If no byte enables are asserted during a burst write to configuration space no internal write will occur, but the internal address will be incremented. 1 MIN Read Request mechanism required by reads from the other memory locations (see next section). FIGURE 13 illustrates a PCI read from the PCI Mini-ACE Mark3/ Micro-ACE TE's configuration space. The PCI Mini-ACE Mark3/ Micro-ACE TE only responds to Type Zero configuration access: AD[1:0] must be 00 during the command phase. The PCI MiniACE Mark3/Micro-ACE TE will drive a full Dword on the AD lines independent of which byte enables are asserted during the configuration read. 0ns PARAMETER 100ns 3 4 150ns 5 6 7 PCICLK AD I C/BE[3:0]# I FRAME# I IRDY# O TRDY# O STOP# O DEVSEL# ADRS 7h DATA Byte Enables PCI single write to any legal memory location (C/BE# = 7h) FIGURE 12. PCI SINGLE MEMORY WRITE TO PCI MINI-ACE MARK3/MICRO-ACE TE Data Device Corporation www.ddc-web.com 43 BU-65743/65843/65863/65864 AC-6/11-0 0ns 50ns 1 I 100ns 2 3 150ns 4 5 6 7 PCICLK th tsu IO tsu ADDRS AD DATA th tsu I C/BE[3:0]# tsu th Ah ByteEnables th tsu I FRAME# I IRDY# O TRDY# O STOP# O DEVSEL# tsu th tv tv th tsu I IDSEL PCI single read from PACE configuration space (C/BE# = Ah) with PCI timing parameters. AD[31:0]: address driven by master; data driven by PACE FIGURE 13. PCI SINGLE READ OF CONFIGURATION SPACE WITH TIMING 0ns 50ns 1 I PCICLK IO AD[31:0] I C/BE[3:0]# I FRAME# I IRDY# O TRDY# O STOP# O DEVSEL# I IDSEL 2 ADRS 100ns 3 4 150ns 5 6 DATA Bh PCI single write to PACE configuration space (C/BE# = Bh) Figure 14. writ WRITE e toTO configuration space SPACE FIGURE 14.PCI PCIsingle SINGLE CONFIGURATION Data Device Corporation www.ddc-web.com 44 BU-65743/65843/65863/65864 AC-6/11-0 0ns 50ns 1 I IO 2 100ns 3 4 150ns 5 6 7 PCICLK AD I C/BE[3:0]# I FRAME# I IRDY# O TRDY# O STOP# O DEVSEL# ADRS 6h DATA BYTE ENABLES PCI memory read from PCI-ACE interface register space (BAR1 800-81Ch) FIGURE 15. PCI READ OF PCI-ACE IF REGISTERS (BAR1 800-81CH) shown at the third read request, which produces a Disconnect with Data. When reading ACE memory (BAR0), any combination of byte enables is supported, but the PCI Mini-ACE Mark3/Micro-ACE TE will drive the entire word onto the AD lines when only a single byte enable in the word is asserted. This process applies to any memory read from legal address space other than the PCI-ACE interface registers at BAR1 offset 800-81Ch. When reading ACE registers (BAR 00-FCh), byte enable combinations where only a single byte within a word is requested will cause the PCI Mini-ACE Mark3/Micro-ACE TE to terminate the transaction with a target abort. The PCI Mini-ACE Mark3/MicroACE TE will drive all zeros onto the AD lines if only the upper word byte enables or no byte enables are asserted. Note that one of the conditions for enquing a DRR is that the write FIFO must be empty. For efficient use of PCI bus bandwidth, the driver software should be written such that it checks the FIFO condition (BAR1 800-81CH registers are directly readable, bypassing the DRR mechanism) before reading from the other PCI Mini-ACE Mark3/Micro-ACE TE locations. If the FIFO is not empty (BAR1 800h bit 30 is the FIFO not empty flag) and a read is attempted, the bus master will be using PCI bandwidth repeating the read request while the FIFO empties, BEFORE the read request is actually enqued as a DRR. Data Device Corporation www.ddc-web.com With relation to actual timing, PCI double word reads of ACE memory (BAR0) will take longer to complete than single word ACE memory reads because the internal ACE memory data path is 16 bits wide. In addition, read cycles will take longer to complete with slower ACE clocks. See Table 63 for min/max formulas for calculating completion time for the various types of reads. 45 BU-65743/65843/65863/65864 AC-6/11-0 0ns 250ns 500ns 750ns 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 2829 I PCICLK IO AD[31:0] A A A I C/BE[3:0]# 6h 6h 6h I FRAME# I IRDY# O TRDY# O STOP# O DEVSEL# DAT PCI memory read from ACE registers/memory with no DRR pending & FIFO empty produces Retry & enques DRR. Master should attempt read as soon as possible (preferably within 33 clocks). 3rd read produces disconnect with data, DRR complete FIGURE 16. PCI READ OF ACE MEMORY/REGISTER Double word read TABLE 63. MIN/MAX DELAYED READ FORMULAS TYPE OF READ MIN TIME FORMULA MAX TIME FORMULA Min time = 13 x 30 nS + 11 x 62.5 nS = 1077.5 nS ACE MEMORY (BAR0), DOUBLE WORD 13 x PCI_CLK PERIOD + 11 x ACE_CLK PERIOD 16 x PCI_CLK PERIOD + 14 x ACE_CLK PERIOD Max time = 16 x 30nS + 14 x 62.5 nS = 1167.5 nS ACE MEMORY (BAR0), SINGLE WORD OR ACE REGISTER (BAR1, DOUBLE WORD OR LOWER WORD 8 x PCI_CLK PERIOD + 5 x ACE_CLK PERIOD 10 x PCI_CLK PERIOD + 6 x ACE_CLK PERIOD No CBEN# ASSERTED OR ACE REGISTER (BAR1) UPPER WORD 3 x PCI_CLK PERIOD In addition, the following amount of ACE clocks should be added for maximum time if the ACE is active. TABLE 64. ADDITIONAL DRR DELAY FOR CONTESTED ACE RAM ACCESS 3 x PCI_CLK PERIOD The third case returns all zeroes and is shown only for completeness. The following examples have the same conditions: PCI clock = 33MHz, ACE clock = 16MHz, no ACE contention. ACE OPERATING MODE MAXIMUM ADDITIONAL ACE CLOCKS ENHANCED CPU ACCESS ENABLED, SINGLE WORD XFER 3 ENHANCED CPU ACCESS ENABLED, DOUBLE WORD XFER 6 ENHANCED CPU ACCESS DISABLED, SINGLE WORD XFER 67 ENHANCED CPU ACCESS DISABLED, DOUBLE WORD XFER 74 THE ENHANCED CPU ACCESS IC CONTROLLED BY BIT 14 OF CONFIGURATION REGISTER #6 Single word read Min time = 8 x 30 nS + 5 x 62.5 nS = 552.5 nS Max time = 10 x 30nS + 6 x 62.5 nS = 675 nS Data Device Corporation www.ddc-web.com 46 BU-65743/65843/65863/65864 AC-6/11-0 FIGURE 17 illustrates a 16 Dword (32 word) PCI memory write burst, with the write FIFO empty (or with enough free space to absorb the 16 Dwords in the FIFO). The write FIFO accepts PCI memory writes to the ACE memory (BAR0) and ACE registers (BAR1 offset 00h - FCh). It does not accept writes to the PCI interface registers at BAR1 offset 800-81Ch. Writes to the BAR1 800-81Ch space go directly into the PCI interface registers. The 32 byte write shown could be an entire 1553 message being written to ACE memory. Writes into the BAR 1 00-FCh space must be word or Dword. If only one byte enable is asserted in a word, the PCI MiniACE Mark3/Micro-ACE TE terminates the transaction with a Target-Abort. Since the ACE registers in this space are really 16 bit registers packed into the lower word of a 32-bit structure, only lower word or Dword writes transfer bits into these ACE registers. In addition, as per PCI spec, a Memory Write and Invalidate (C/ BE[3:0]# = Fh) command will be aliased to the basic Memory Write command and the timing diagram would look the same as FIGURE 17. Writes into the BAR 0 space must be word or Dword. If only one byte enable is asserted in a word, the PCI Mini-ACE Mark3/ Micro-ACE TE terminates the transaction with a Target-Abort. 0ns 1 2 3 500ns 4 5 6 1000ns 1 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32 33 34 35 36 37 38 39 40 41 42 43 44 45 46 47 48 49 50 PCICLK AD A DAT1 DAT2 DAT3 DAT4 DAT5 DAT6 DAT7 DAT8 DAT9 DAT10 DAT11 DAT12 DAT13 DAT14 DAT15 DAT16 FRAME# IRDY# TRDY# STOP# DEVSEL# FIGURE 17. PCI WRITE BURST TO ACE MEMORY WITH FIFO EMPTY Data Device Corporation www.ddc-web.com 47 BU-65743/65843/65863/65864 AC-6/11-0 INTERFACE TO MIL-STD-1553 BUS WITH 3.3V TRANSCEIVERS (BU-65XXXX8/9) the 3.3V plane. Additionally, a 10F low inductance tantalum capacitor and 0.01F ceramic capacitor must be mounted as close as possible and with the shortest leads to the center tap of the transformer(s) and the ground plane. FIGURE 18 illustrates the interface between the BU-65XXXX8/9 (3.3V transceivers) and a MIL-STD-1553 bus. Connections for both direct (short stub) and transformer (long stub) coupling, as well as the peak to peak voltage levels at various points (when transmitting), are indicated in the diagram. Furthermore, when the transmitter is transmitting, large currents will flow from the 3.3V plane, into the transformer center tap, thru the primaries, into the TX/RX pins and then out thru the transceiver ground pins into the ground plane. The traces in this path should be sized accordingly and the connections to the ground plane should be as short as possible. The center tap of the primary winding (the side of the transformer that connects to the device) must be directly connected to 10F + DATA BUS Z0 .01F 3.3V (1:3.75) 7.4 Vpp 7 Vpp 28 Vpp TX/RX 10F 1 FT MAX 55 W TX/RX PCI Mini-ACE Mark3 SHORT STUB (DIRECT COUPLED) 55 W + DIRECT-COUPLED ISOLATION TRANSFORMER .01F OR 3.3V (1:2.7) LONG STUB (TRANSFORMER COUPLED) (1:1.41) 0.75 Z0 20 FT MAX 28 Vpp 20 Vpp 7.4 Vpp PCI Mini-ACE Mark3 7 Vpp 0.75 Z0 TRANSFORMER-COUPLED ISOLATION TRANSFORMER COUPLING TRANSFORMER Z0 Z 0 = 70 TO 85 OHMS FIGURE 18. BU-65XXXX8/9 (3.3V TRANSCEIVER) INTERFACE TO MIL-STD-1553 BUS Data Device Corporation www.ddc-web.com 48 BU-65743/65843/65863/65864 AC-6/11-0 INTERFACE TO MIL-STD-1553 BUS WITH 3.3V TRANSCEIVERS (BU-65XXXXC/D) Additionally, during transmission, large currents flow from the transceiver power supply through the TX/RX pins into the transformer primaries and then out the center tap into the ground plane. The traces in this path should be sized accordingly and the connections to the ground plane should be as short as possible. FIGURE 19 illustrates the two possible interface methods between the BU-65XXXXC/D and a MIL-STD-1553 bus. Connections for both direct (short stub, 1:2.65) and transformer (long stub, 1:2.038) coupling, as well as nominal peak-to-peak voltage levels at various points (when transmitting), are indicated in the diagram. A 10f, low inductance tantalum capacitor and a 0.01f ceramic capacitor must be mounted as close as possible and with the shortest leads to the transceiver power input of the Mini-ACE Mark 3. The center tap of the primary winding (the side of the transformer that connects to the Mark3) must be directly connected to ground. 10F DATA BUS Z0 3.3V + .01F (1:2.65) SHORT STUB (DIRECT COUPLED) 1 FT MAX 55 TX/RX 7 Vpp 28 Vpp PCI Mini-ACE Mark3 55 TX/RX DIRECT-COUPLED ISOLATION TRANSFORMER OR 10F 3.3V + .01F (1:2.038) LONG STUB (TRANSFORMER COUPLED) (1:1.41) 0.75 Z0 20 FT MAX 28 Vpp 20 Vpp PCI Mini-ACE Mark3 7 Vpp 0.75 Z0 TRANSFORMER-COUPLED ISOLATION TRANSFORMER COUPLING TRANSFORMER Z0 Z 0 = 70 TO 85 OHMS FIGURE 19. BU-65XXXXC/D (3.3V TRANSCEIVER) INTERFACE TO MIL-STD-1553 BUS 3.3V TRANSFORMERS (PCI MINI-ACE MARK3/PCI MICRO-ACE TE WITH 3.3V TRANSCEIVER OPTION) This inductance must be less than 5.0 H (Transformer Coupled) and 10.0 H (Direct Coupled). Similarly, if the other side of the primary is shorted to the primary center-tap, the inductance measured across the "secondary" (stub side) winding must also be less than 5.0 H (Transformer Coupled) and 10.0 H (Direct Coupled). In selecting 3.3V isolation transformers to be used with the PCI Mini-ACE Mark3/Micro-ACE TE, there is a limitation on the maximum amount of leakage inductance. If this limit is exceeded, the transmitter rise and fall times may increase, possibly causing the bus amplitude to fall below the minimum level required by MILSTD-1553. In addition, an excessive leakage imbalance may result in a transformer dynamic offset that exceeds 1553 specifications. The difference between these two measurements is the "differential" leakage inductance. This value must be less than 1.0 H (Transformer Coupled) and 2.0 H (Direct Coupled). The maximum allowable leakage inductance is a function of the coupling method. For Transformer Coupled applications, it is a maximum of 5.0 H. For Direct it is a maximum of 10.0 H, and is measured as follows: Beta Transformer Technology Corporation (BTTC), a subsidiary of DDC, manufactures 3.3V transformers in a variety of mechanical configurations with the required turns ratios of 1:3.75 direct coupled, and 1:2.7 transformer coupled for the BU-6XXXX8/9 or 1:2.65 direct coupled and 1:2.038 transformer coupled for the BU-6XXXXC/D. Table 65 provides a listing of these transformers. The side of the transformer that connects to the device is defined as the "primary" winding. If one side of the primary is shorted to the primary center-tap, the inductance should be measured across the "secondary" (stub side) winding. Data Device Corporation www.ddc-web.com For further information, contact BTTC at 631-244-7393 or at www.bttc-beta.com. 49 BU-65743/65843/65863/65864 AC-6/11-0 10F 5V + .01F (1:2.5) 1 FT MAX 55 PCI Mini-ACE Mark3/ PCI Micro-ACE TE with 5V Transceiver OR 10F 11.6 Vpp Z0 SHORT STUB (DIRECT COUPLED) 28 Vpp 55 ISOLATION TRANSFORMER 5V + .01F (1:1.79) LONG STUB (TRANSFORMER COUPLED) (1:1.4) 0.75 Z0 20 FT MAX PCI Mini-ACE Mark3/ PCI Micro-ACE TE with 5V Transceiver 28 Vpp 20 Vpp 11.6 Vpp 0.75 Z0 COUPLING TRANSFORMER ISOLATION TRANSFORMER Z0 Z 0 = 70 TO 85 OHMS FIGURE 20. BU-65XXXX3/4 (5V TRANSCEIVER) INTERFACE TO MIL-STD-1553 BUS THERMAL MANAGEMENT FOR PCI MICRO-ACE TE (BGA PACKAGE) 24 for a visual representation of the thermal ball locations. It is mandatory that these thermal balls be directly soldered to a circuit ground plane (a circuit trace is insufficient). Operation without an adequate ground/thermal plane is not recommended and extended exposure to these conditions may affect device reliability. Ball Grid Array (BGA) components necessitate that thermal management issues be considered early in the design stage for MILSTD-1553 terminals. This is especially true if high transmitter duty cycles are expected. The temperature range specified for the PCI Micro-ACE TE devices refer to the temperature at the ball, not the case. The purpose of this ground/thermal plane is to conduct the heat being generated by the transceivers within the package away from the PCI Micro-ACE-TE. Since the thermal balls are contiguous, a mini-plane can be created on the PCB top layer and thermal vias can then be sunk down thru the top-side mini-plane into the appropriate thermal plane. All PCI Micro-ACE TE devices incorporate multiple package connections (28-balls for 3.3V transceiver, 34 balls for 5V transceivers) which perform the dual function of transceiver circuit ground and thermal heat sink. Each transceiver has 14 or 17 contiguous balls arranged in a rectangle. Refer to FIGURE 21 and FIGURE 18 17 16 15 14 13 12 11 10 9 8 7 6 5 4 3 2 1 S/N D/C V U T R P N M L K J H G F E D C B A ESD and Pin 1 Identifier BOTTOM VIEW TOP VIEW Notes: 1) For BU-65843B8/BU-65863B8, balls D3, D4, D5, E3, E4, E5, F1, F2, F3, F4, F5, G3, G4, G5, L3, L4, L5, M3, M4, M5, N1, N2, N3, N4, N5, P3, P4, P5 must be connected to a thermal plane to maintain recommended operating temperature. 2) For BU-65843B3/BU-65863B3, D3, D4, D5, E2, E3, E4, E5, F3, F4, F5, G2, G3, G4, G5, H3, H4, H5, P11, P12, P13, P14, P15, R11, R12, R13, R14, R15, T11, T12, T13, T14, T15, U12, U14 must be connected to a thermal plane to maintain recommended operating temperature FIGURE 21. THERMAL BALL LOCATIONS FOR PCI MICRO-ACE-TE (BGA PACKAGE) Data Device Corporation www.ddc-web.com 50 BU-65743/65843/65863/65864 AC-6/11-0 TABLE 65. BTTC TRANSFORMERS FOR USE WITH +3.3 VOLT PCI Mini-ACE Mark3 AND PCI MICRO-ACE-TE BTTC PART NUMBER # OF CHANNELS, CONFIGURATION COUPLING RATIO DESCRIPTION COUPLING RATIO (1:X) MOUNTING MAX HEIGHT WIDTH (INCLUDING LEADS) LENGTH (INCLUDING LEADS) BU-6XXXXX8/9 MLP-2033 Single Direct (1:3.75) SMT 0.185" 0.4" 0.52" BU-6XXXXXC/D MLP-2030 Single Direct (1:2.65) SMT 0.185" 0.4" 0.52" BU-6XXXXX8/9 MLP-3033 Single Direct (1:3.75) Through Hole 0.185" 0.4" 0.4" BU-6XXXXX8/9 MLP-2233 Single Transformer (1:2.7) SMT 0.185" 0.4" 0.52" BU-6XXXXXC/D MLP-2230 Single Transformer (1:2.038) SMT 0.185" 0.4" 0.52" BU-6XXXXX8/9 MLP-3233 Single Transformer (1:2.7) Through Hole 0.185" 0.4" 0.4" BU-6XXXXX8/9 MLP-3333 Single Direct & Transformer (1:3.75) & (1:2.7) Through Hole 0.185" 0.4" 0.4" BU-6XXXXXC/D DSS-3330 Dual (Side-by-Side) Direct & Transformer (1:2.65) & (1:2.038) SMT 0.185" 0.52" 0.675" BU-6XXXXX8/9 DSS-2033 Dual (Side-by-Side) Direct (1:3.75) SMT 0.13" 0.72" 0.96" BU-6XXXXX8/9 DSS-2233 Dual (Side-by-Side) Transformer (1:2.7) SMT 0.13" 0.72" 0.96" BU-6XXXXX8/9 DSS-1003 Dual (Side-by-Side) Direct & Transformer (1:3.75) & (1:2.7) SMT 0.165" 0.72" 0.96" BU-6XXXXX8/9 TSM-2033 Dual (Stacked) Direct (1:3.75) SMT 0.32" 0.4" 0.52" BU-6XXXXX8/9 TSM-2233 Dual (Stacked) Transformer (1:2.7) SMT 0.32" 0.4" 0.52" BU-6XXXXXC/D TSM-2230 Dual (Stacked) Transformer (1:2.038) SMT 0.32" 0.4" 0.52" MODEL NUMBER INTERFACE TO MIL-STD-1553 BUS (PCI MINI-ACE MARK3/PCI MICRO-ACE TE WITH 5V TRANSCEIVER OPTION) Defining the side of the transformer that connects to the device as the "primary" winding, if one side of the primary is shorted to the primary center-tap, the inductance should be measured across the "secondary" (stud side) winding. This inductance must be less than 6.0H. Similarly, if the other side of the primary is shorted to the primary center-tap, the inductance measured across the "secondary" (stub side) winding must also be less than 6.0H. FIGURE 20 illustrates the interface between the PCI Mini-ACE Mark3/PCI Micro-ACE TE with 5V transceiver option, and a MILSTD-1553 bus. Connections for both direct (short stub) and transformer (long stub) coupling, as well as the peak to peak voltage levels at various points (when transmitting), are indicated in the diagram. The difference between those two measurement is the "differential" leakage inductance. This value must be less than 1.0H. 5V TRANSFORMERS In selecting 5V isolation transformers to be used with the PCI Mini-ACE Mark3/Micro-ACE TE, there is a limitation on the maximum amount of leakage inductance. If this limit is exceeded, the transmitter rise and fall times may increase, possibly causing the bus amplitude to fall below the minimum level required by MILSTD-1553. In addition, an excessive leakage inductance imbalance may result in a transmitter dynamic offset that exceeds 1553 specifications. Beta Transformer Technology Corporation (BTTC), a subsidiary of DDC, manufactures 5V transformers in a variety of mechanical configurations with the required turns ratios of 1:2.5 direct coupled, and 1:1.79 transformer coupled. Table 66 provides a listing of these transformers. For further information, contact BTTC at 631-244-7393 or at www.bttc-beta.com. The maximum allowable leakage inductance is 6.0H. It is measured as follows: Data Device Corporation www.ddc-web.com 51 BU-65743/65843/65863/65864 AC-6/11-0 TABLE 66. BTTC TRANSFORMERS FOR USE WITH +5.0 VOLT PCI Mini-ACE Mark3 / PCI MICRO-ACE-TE MOUNTING MAX HEIGHT WIDTH (INCLUDING LEADS) LENGTH (INCLUDING LEADS) (1:2.5) SMT 0.185" 0.4" 0.52" (1:2.5) Through Hole 0.185" 0.4" 0.4" Direct (1:2.5) Through Hole 0.25" 0.35" 0.5" Transformer (1:1.79) SMT 0.185" 0.4" 0.52" (1:1.79) Through Hole 0.185" 0.4" 0.4" Transformer (1:1.79) Through Hole 0.25" 0.35" 0.5" SMT 0.19" 0.63" 1.13" BTTC PART NUMBER # OF CHANNELS, CONFIGURATION COUPLING RATIO DESCRIPTION COUPLING RATIO (1:X) MLP-2005 Single Direct MLP-3005 Single Direct B-3230 (-30) # Single MLP-2205 Single MLP-3205 Single Transformer B-3229 (-29) # Single HLP-6015 # Single Direct & Transformer (1:2.5) & (1:1.79) B-3227 (-27) # Single Direct & Transformer (1:2.5) & (1:1.79) SMT 0.29" 0.63" 1.13" MLP-3305 Single Direct & Transformer (1:2.5) & (1:1.79) Through Hole 0.185" 0.4" 0.4" B-3226 (-26) # Single Direct & Transformer (1:2.5) & (1:1.79) Through Hole 0.25" 0.625" 0.625" HLP-6014 # Single Direct & Transformer (1:2.5) & (1:1.79) Flat Pack 0.19" 0.63" 1.13" B-3231 (-31) # Single Direct & Transformer (1:2.5) & (1:1.79) Flat Pack 0.29" 0.63" 1.13" DSS-2005 Dual (Side-by-Side) Direct (1:2.5) SMT 0.13" 0.72" 0.96" DSS-2205 Dual (Side-by-Side) Transformer (1:1.79) SMT 0.13" 0.72" 0.96" DSS-1005 Dual (Side-by-Side) Direct & Transformer (1:2.5) & (1:1.79) SMT 0.165" 0.72" 0.96" TSM-2005 Dual (Stacked) Direct (1:2.5) SMT 0.32" 0.4" 0.52" TSM-2205 Dual (Stacked) Transformer (1:1.79) SMT 0.32" 0.4" 0.52" TST-9117 # Dual (Stacked) Direct & Transformer (1:2.5) & (1:1.79) SMT 0.335" 1.125" 1.125" TST-9107 # Dual (Stacked) Direct & Transformer (1:2.5) & (1:1.79) Through Hole 0.335" 0.625" 0.625" TST-9127 # Dual (Stacked) Direct & Transformer (1:2.5) & (1:1.79) Flat Pack 0.335" 0.625" 0.625" Notes: 1. All Transformers in the table above can be used with BU-6XXXXX3/6 (1553B transceivers). 2. Transformers identified with "#" in the table above are not recommended for use with the BU-6XXXXX4 (McAir-Compatable transceivers) TABLE 67. POWER AND GROUND, CQFP SIGNAL NAME BU-65743X3/X4 BU-65843X3/X4 BU-65863X3/X4 BU-65743X8/X9 BU-65843X8/X9 BU-65863X8/X9 BU-65743X0 BU-65843X0 BU-65863X0 PIN PIN PIN 10 - - + 5.0 Volt Transceiver Power +3.3 Volt Transceiver Power + 5.0V_Xcvr + 3.3V_Xcvr - 10 - + 3.3V_Logic 30,51,69 30, 51, 69 10, 30, 51, 69 Gnd_Xcvr 22, 79 22, 79 - DESCRIPTION Logic Power Transceiver Ground 22, 79, 31, 50, 70 Logic Ground Gnd_Logic 31, 50, 70 31, 50, 70 NOTE: Logic ground and transceiver ground are NOT tied together inside the package. Data Device Corporation www.ddc-web.com 52 BU-65743/65843/65863/65864 AC-6/11-0 TABLE 68. POWER AND GROUND, BGA WITH 3.3V TRANSCEIVERS BU-65843B8 BU-65863B8 SIGNAL NAME DESCRIPTION BALL 3.3V_XCVR A4, A5, B4, B5, J1, J2, J3, J4, J5, K1, K2, K3, K4, K5 , U4, U5, V4, V5 TRANSCEIVER POWER 3.3V_LOGIC A8, A9, B8, B9, L16, L17, M16, M17, N12, N13, P12, P13, R6, R7, T6, T7, U6, U7, V6, V7 LOGIC POWER GND_XCVR D3, D4, D5, E3, E4, E5, F1, F2, F3, F4, F5, G3, G4, G5, L3, L4, L5, M3, M4, M5, N1, N2, N3, N4, N5, P3, P4, P5 TRANSCEIVER GROUND (THERMAL BALLS) GND_LOGIC E10, E11, E12, F10, F11, F12, G10, G11, G12, H10, H11, H12, R11, R12, R13, T11, T12, T13, U11, U12, U13 LOGIC GROUND NOTE: Logic ground and transceiver ground are NOT tied together inside the package. TABLE 69. POWER AND GROUND, BGA WITH 5V TRANSCEIVERS BU-65843B3 BU-65864B3 SIGNAL NAME DESCRIPTION BALL 5V_VCC_CHA F1, F2 TRANSCEIVER "A" POWER 5V_VCC_CHB U13, V13 TRANSCEIVER "B" POWER 5V_RAM P4, R4 5V RAM (BU-65864B3 ONLY) 3.3V_LOGIC A7, L1, L2, L15, L16, M3, P7, P9, R9, V8 LOGIC POWER GND_XCVR D3, D4, D5, E2, E3, E4, E5,F3, F4, F5, G2, G3, G4, G5, H3, H4, H5, P11, P12, P13, P14, P15, R11, R12, R13, R14, R15, T11, T12, T13, T14, T15, U12, U14 TRANSCEIVER GROUND (THERMAL BALLS) GND_LOGIC E12, E13, E14, F12, F13, F14, G12, G13, G14, H12, H13, H14 LOGIC GROUND NOTE: Logic ground and transceiver ground ARE tied together inside the package. Data Device Corporation www.ddc-web.com 53 BU-65743/65843/65863/65864 AC-6/11-0 TABLE 70. 1553 ISOLATION TRANSFORMER INTERFACE (BU-65XXXX8/X9/X3/X4 VERSIONS) SIGNAL NAME 5V PIN 3V DESCRIPTION BALL BALL TX/RX-A (I/O) 3 D1, D2, E1 D1, D2, E1, E2 TX/RX-A (I/O) 5 G1, H1, H2 G1, G2, H1, H2 TX/RX-B (I/O) 15 U11, V11, V12 L1, L2, M1, M2 TX/RX-B (I/O) 17 U15, V14, V15 P1, P2, R1, R2 Analog Transmit/Receive Input/Outputs. Connect directly to 1553 isolation transformers. For BGA versions, connect all balls of the signal together. TABLE 71. INTERFACE TO EXTERNAL TRANSCEIVER (BU-65XXXF(G)0 VERSIONS) SIGNAL NAME PIN TXDATA_A (O) 3 TXDATA_A (O) 5 RXDATA_A (I) 8 RXDATA_A (I) 4 TX_INH_A_OUT (O) 11 TXDATA_B (O) 15 TXDATA_B (O) 17 RXDATA_B (I) 21 RXDATA_B (I) 16 9 TX_INH_B_OUT (O) DESCRIPTION DIGITAL MANCHESTER BIPHASE TRANSMIT OUTPUTS, A BUS DIGITAL MANCHESTER BIPHASE RECEIVE INPUTS, A BUS DIGITAL OUTPUT TO INHIBIT EXTERNAL TRANSMITTER, A BUS DIGITAL MANCHESTER BIPHASE TRANSMIT OUTPUTS, B BUS DIGITAL MANCHESTER BIPHASE RECEIVE INPUTS, B BUS DIGITAL OUTPUT TO INHIBIT EXTERNAL TRANSMITTER, B BUS TABLE 72. MANDATORY ADDITIONAL CONNECTIONS & INTERFACE TO EXTERNAL TRANSCEIVER (BGA'S ONLY) SIGNAL NAME SNGL_END (I) TXINH_IN_A (I) TXINH_OUT_A (O) DESIGN USES INTERNAL TRANSCEIVERS No Connect "NC" These two signals MUST be directly connected for normal "Built-In" transceiver operation. BU-65843B3 BU-65864B3 BU-65843B8 BU-65863B8 BALL BALL A15 D14 A4 E7 A5 FOR USE WITH EXTERNAL TRANSCEIVERS "TRANSCEIVERLESS" If SNGL_END is connected to logic "0" the Manchester decoder inputs (RX_DATA_IN_X) will be configured to accept single-ended input signals (e.g.,MIL-STD-1773 fiber optic receiver outputs). If SNGL_END is connected to logic "1," the decoder inputs will be configured to accept standard double-ended Manchester bi-phase input signals (i.e., MILSTD-1553 receiver outputs). Do NOT connect these two signals together. Connect TXINH_OUT (Digital transmit inhibit output) to the TX INH input of external MIL-STD-1553 transceivers. Asserted high to inhibit when not transmitting on the respective bus. E8 NOTE: The BGA versions can be operated with either their internal transceivers or with external transceivers. When the devices are operated with their internal transceivers the customer must supply PCB traces that connect the device's "inputs to outputs" (within the correct column) as described in this table. For example, to operate the BU-65843B8/BU-65863B8 with their internal transceivers, PCB traces must connect E7 to E8, C7 to C8, D7 to D8, etc.. Data Device Corporation www.ddc-web.com 54 BU-65743/65843/65863/65864 AC-6/11-0 TABLE 72. MANDATORY ADDITIONAL CONNECTIONS & INTERFACE TO EXTERNAL TRANSCEIVER (BGA'S ONLY) (CONT) SIGNAL NAME TXDATA_IN_A (I) TXDATA_OUT_A (O) TXDATA_IN_A (I) TXDATA_OUT_A (O) RXDATA_IN_A (I) RXDATA_OUT_A (O) RXDATA_IN_A (I) RXDATA_OUT_A (O) TXINH_IN_B (I) TXINH_OUT_B (O) TXDATA_IN_B (I) TXDATA_OUT_B (O) TXDATA_IN_B (I) TXDATA_OUT_B (O) RXDATA_IN_B (I) RXDATA_OUT_B (O) RXDATA_IN_B (I) RXDATA_OUT_B (O) DESIGN USES INTERNAL TRANSCEIVERS These two signals MUST be directly connected for normal "Built-In" transceiver operation. These two signals MUST be directly connected for normal "Built-In" transceiver operation. These two signals MUST be directly connected for normal "Built-In" transceiver operation. These two signals MUST be directly connected for normal "Built-In" transceiver operation. These two signals MUST be directly connected for normal "Built-In" transceiver operation. These two signals MUST be directly connected for normal "Built-In" transceiver operation. These two signals MUST be directly connected for normal "Built-In" transceiver operation. These two signals MUST be directly connected for normal "Built-In" transceiver operation. These two signals MUST be directly connected for normal "Built-In" transceiver operation. BU-65843B3 BU-65864B3 BU-65843B8 BU-65863B8 BALL BALL C8 C7 B8 C8 C4 D7 C5 D8 D10 G8 E10 G7 E9 H8 F9 H7 T8 N7 FOR USE WITH EXTERNAL TRANSCEIVERS "TRANSCEIVERLESS" Do NOT connect these two signals together. Connect TXDATA_OUT (Digital manchester biphase transmit data output) directly to the corresponding input of a MIL-STD-1553 or MIL-STD-1773 (fiber optic) transceiver. Do NOT connect these two signals. Connect TXDATA_OUT (Digital manchester biphase transmit data output) directly to the corresponding input of a MIL-STD-1553 or MIL-STD-1773 (fiber optic) transceiver. Do NOT connect these two signals together. Connect RXDATA_IN (Digital manchester biphase receive data input) directly to the corresponding output of a MIL-STD-1553 or MIL-STD-1773 (fiber optic) transceiver. Do NOT connect these two signals together. Connect RXDATA_IN (Digital manchester biphase receive data input) directly to the corresponding output of a MIL-STD-1553 or MIL-STD-1773 (fiber optic) transceiver. Do NOT connect these two signals together. Connect TXINH_OUT (Digital transmit inhibit output) to the corresponding input of external MIL-STD-1553 transceiver. Asserted high to inhibit when not transmitting on the respective bus. R8 N8 R10 L7 P10 L8 N12 M7 M12 M8 M13 P10 M14 P9 N13 R10 N14 R9 Do NOT connect these two signals together. Connect TXDATA_OUT (Digital manchester biphase transmit data output) to the corresponding input of a MIL-STD-1553 or MIL-STD-1773 (fiber optic) transceiver. Do NOT connect these two signals together. Connect TXDATA_OUT (Digital manchester biphase transmit data output) directly to corresponding inputs of a MIL-STD-1553 or MIL-STD-1773 (fiber optic) transceiver. Do NOT connect these two signals together. Connect RXDATA_IN (Digital manchester biphase receive data input) directly to the corresponding output of a MIL-STD-1553 or MIL-STD-1773 (fiber optic) transceiver Do NOT connect these two signals together. Connect RXDATA_IN (Digital manchester biphase receive data input) directly to the corresponding output of a MIL-STD-1553 or MIL-STD-1773 (fiber optic) transceiver. NOTE: The BGA versions can be operated with either their internal transceivers or with external transceivers. When the devices are operated with their internal transceivers the customer must supply PCB traces that connect the device's "inputs to outputs" (within the correct column) as described in this table. For example, to operate the BU-65843B8/BU-65863B8 with their internal transceivers, PCB traces must connect E7 to E8, C7 to C8, D7 to D8, etc.. Data Device Corporation www.ddc-web.com 55 BU-65743/65843/65863/65864 AC-6/11-0 TABLE 73. PROCESSOR INTERFACE CONTROL SIGNAL NAME SSFLAG (I)/ EXT_TRIG (I) PIN BALL BALL 3V 5V U10 L9 20 DESCRIPTION Subsystem Flag (RT) or External Trigger (BC/Word Monitor) input. In RT mode with standard status word, if this input is asserted low, the Subsystem Flag bit will be set in the PCI MINI-ACE MARK3/MICRO-ACE TE's RT Status Word. If the SSFLAG input is logic "0" while bit 8 of Configuration Register #1 has been programmed to logic "1" (cleared), the Subsystem Flag RT Status Word bit will become logic "1", but bit 8 of Configuration Register #1, SUBSYSTEM FLAG, will return logic "1" when read. That is, the sense on the SSFLAG input has no effect on the SUBSYSTEM FLAG register bit. This input has no meaning in RT mode with alternate status word. In the non-enhanced BC mode, this signal operates as an External Trigger input. In BC mode, if the external BC Start option is enabled (bit 7 of Configuration Register #1), a low to high transition on this input will issue a BC Start command, starting execution of the current BC frame. In the enhanced BC mode, during the execution of a Wait for External Trigger (WTG) instruction, the PCI Mini-ACE Mark3/Micro-ACE TE BC will wait for a low-to-high transition on EXT_TRIG before proceeding to the next instruction. In the Word Monitor mode, if the external trigger is enabled (bit 7 of Configuration Register #1), a low to high transition on this input will initiate a monitor start. (RT the monitor on low). In all modes this input operates as an external trigger, this signal should remain asserted for at least 4 1533_CLK ticks after it goes high. This input has no effect in Message Monitor mode. TABLE 74. RT ADDRESS SIGNAL NAME PIN BALL BALL 3V 5V RTAD4 (MSB) (I) 80 A7 A10 RTAD3 (I) 7 D10 C9 RTAD2 (I) 2 C15 A8 RTAD1 (I) 1 E6 B9 RTAD0 (LSB) (I) 6 A6 C11 RTADP (I) 13 E9 D6 DESCRIPTION RT Address inputs (5V tolerant). If bit 5 of Configuration Register #6, RT ADDRESS SOURCE, is programmed to logic "0" (default), then the PCI Mini-ACE Mark3/Micro-ACE TE's RT address is provided by means of these 5 input signals. In addition, if RT ADDRESS SOURCE is logic "0", the source of RT address parity is RTADP. There are many methods for using these input signals for designating the PCI Mini-ACE Mark3/MicroACE TE's RT address. For details, refer to the description of RT_AD_LAT. If RT ADDRESS SOURCE is programmed to logic "1", then the PCI Mini-ACE Mark3/Micro-ACE TE's source for its RT address and parity is under software control, when the SW writes to config reg #5 internal address bits 4-0 will be latched from PCI data bus bit AD5-1 and internal RTADP will be latched from PCI data bus bit AD0. In this case, the RTAD4-RTAD0 and RTADP signals are not used. Remote Terminal Address Parity. This input signal (5V tolerant) must provide an odd parity sum with RTAD4-RTAD0 in order for the RT to respond to non-broadcast commands. That is, there must be an odd number of logic "1"s from among RTAD-4-RTAD0 and RTADP RT Address Latch. Input signal (5V tolerant) used to control the PCI Mini-ACE Mark3/Micro-ACE TE's internal RT address latch. If RT_AD_LAT is connected to logic "0", then the PCI Mini-ACE Mark3/MicroACE TE RT is configured to accept a hardwired (transparent) RT address from RTAD4-RTAD0 and RTADP. If RT_AD_LAT is initially logic "0", and then transitions to logic "1", the values presented on RTAD4-RTAD0 and RTADP will be latched internally on the rising edge of RT_AD_LAT. RT_AD_LAT (I) 12 D9 C7 If RT_AD_LAT is connected to logic "1", then the PCI Mini-ACE Mark3/Micro-ACE TE's RT address is latchable under host processor control. In this case, there are two possibilities: (1) If bit 5 of Configuration Register #6, RT ADDRESS SOURCE, is programmed to logic "0" (default), then the source of the RT Address is the RTAD4-RTAD0 and RTADP input signals; (2) If RT ADDRESS SOURCE is programmed to logic "1", then the source of the RT Address is the lower 6 bits of the PCI data bus, D5-D1 (for RTAD4-0) and D0 (for RTADP). In either of these two cases (with RT_AD_LAT = "1"), the processor will cause the RT address to be latched by: (1) writing bit 15 of Configuration Register #3, ENHANCED MODE, to logic "1"; (2) writing bit 3 of Configuration Register #4, LATCH RT ADDRESS WITH CONFIGURATION REGISTER #5, to logic "1"; and (3) writing to Configuration Register #5. In the case of RT ADDRESS SOURCE = "1", then the values of RT address and RT address parity must be written to the lower 6 bits of Configuration Register #5, via D5-D0. In the case where RT ADDRESS SOURCE = "0", the bit values presented on D5-D0 become "don't care". Data Device Corporation www.ddc-web.com 56 BU-65743/65843/65863/65864 AC-6/11-0 TABLE 75. MISCELLANEOUS SIGNALS SIGNAL NAME PIN BALL 3V BALL 5V DESCRIPTION In-command or Mode Code Reset. The function of this pin is controlled by bit 0 of Configuration Register #7, MODE CODE RESET / INCMD SELECT. INCMD (O)/ MCRST (O) 19 E8 C9 If this register bit is logic "0" (default), INCMD will be active on this pin. For BC, RT, or Selective Message Monitor modes, INCMD is asserted low whenever a message is being processed by the PCI Mini-ACE Mark3/Micro-ACE TE. In Word Monitor mode, INCMD will be asserted low for as long as the monitor is online. For RT mode, if MODE CODE RESET/INCMD SELECT is programmed to logic "1", MCRST will be active. In this case, MCRST will be asserted low for two clock cycles following receipt of a Reset remote terminal mode command. In BC or Monitor modes, if MODE CODE RESET/INCMD SELECT is logic "1", this signal is inoperative; i.e., in this case, it will always output a value of logic "1". TAG_CLK (I) 23 F14 D18 Input (5V tolerant) for optional external tag clock. No connection needed if internal tag clock is used. Maximum TAG_CLK frequency is 1/4th of the 1553_CLK input. SLEEP_IN (I) 14 R4 -- Sleep input for both 3.3V transceivers. SLEEP_IN = 1 puts the 3.3V transceivers in sleep mode (receiver and transmitter disabled). 1553_CLK (I) 78 B7 D8 TX_INH A/B (I) 18 F8 F10 MSTCLR (RST#) (I) 25 R18 B11 20 MHz, 16 MHz, 12 MHz, or 10 MHz clock input. Transmitter inhibit input (5V tolerant) for the Channel A and Channel B MIL-STD-1553 transmitters. For normal operation, this input should be connected to logic "0". To force a shutdown of Channel A and Channel B, a value of logic "1" should be applied to the TX_INH input. Master Clear. Negative true Reset input, normally asserted low following power turn-on. This input conforms to PCI RST# convention. TABLE 76. MISCELLANEOUS SIGNALS, BGA ONLY SIGNAL NAME BALL BALL DESCRIPTION 3V XCVR 5V XCVR If RTBOOT is connected to Logic "0" the PCI Micro ACE TE will initialize in RT mode with the Busy status word bit set following power turn on. Received data will not be stored because the "BUSY RECEIVE TRANSFER DISABLE" bit will also be set following power turn on. In addition, CLK_SEL_0 and CLK_ SEL_1 are enabled and they select the divider for the 1553 clock circuitry: RTBOOT (I) F7 C12 CLK_SEL1 CLK_SEL0 1553 CLOCK FREQUENCY 0 0 10 MHz 0 1 20 MHz 1 0 12 MHz 1 1 16 MHz CLK_SEL_0 (I) L14 M18 1553 CLOCK SELECT 0, ACTIVE ONLY WHEN RTBOOT = 0 CLK_SEL_1 (I) E14 B15 1553 CLOCK SELECT 1, ACTIVE ONLY WHEN RTBOOT = 0 Data Device Corporation www.ddc-web.com 57 BU-65743/65843/65863/65864 AC-6/11-0 TABLE 77. PCI BUS ADDRESS AND DATA SIGNALS BALL BALL 3V 5V SIGNAL NAME PIN AD31 (I/O) 27 V9 D7 AD30 (I/O) 28 T8 M10 AD29 (I/O) 29 R17 L10 AD28 (I/O) 32 P17 H16 AD27 (I/O) 33 U8 E7 AD26 (I/O) 34 N17 L11 AD25 (I/O) 35 V8 N9 AD24 (I/O) 36 P18 L18 AD23 (I/O) 39 M18 K17 AD22 (I/O) 40 J15 J16 AD21 (I/O) 41 J18 G18 AD20 (I/O) 42 K16 J17 AD19 (I/O) 43 H18 G17 AD18 (I/O) 44 K18 J18 AD17 (I/O) 45 L18 K18 AD16 (I/O) 46 K17 H17 AD15 (I/O) 59 D16 D15 AD14 (I/O) 60 E18 F16 AD13 (I/O) 61 D17 D16 AD12 (I/O) 62 B15 C15 AD11 (I/O) 63 D18 D17 AD10 (I/O) 64 A15 C14 AD9 (I/O) 65 A14 A14 AD8 (I/O) 67 B14 C13 AD7 (I/O) 68 A12 A12 AD6 (I/O) 71 B11 A11 AD5 (I/O) 72 B6 J7 AD4 (I/O) 73 A11 C10 AD3 (I/O) 74 C12 C6 AD2 (I/O) 75 C10 B7 AD1 (I/O) 76 A10 A9 AD0 (I/O) (LSB) 77 B10 B10 Data Device Corporation www.ddc-web.com DESCRIPTION 32-Bit PCI Bus Address / Data lines. Address and Data are multiplexed on the same pins. Each bus operation consists of an address phase followed by one or more data phases. Address phases are identified when the control signal FRAME# is asserted. Data transfers occur during those clock cycles in which the control signals IRDY# and TRDY# are both asserted. 58 BU-65743/65843/65863/65864 AC-6/11-0 TABLE 77. PCI BUS ADDRESS AND DATA SIGNALS (CONT) BALL BALL 3V 5V SIGNAL NAME PIN C/BE[3]# (I) 37 R8 J8 C/BE[2]# (I) 47 J17 H18 C/BE[1]# (I) 58 E17 E15 C/BE[0]# (I) 66 B12 B12 DESCRIPTION Bus Command and Byte Enables. These signals are multiplexed on the same pins. During the address phase of a bus operation, these pins identify the bus command, as shown in the table below. During the data phase of a bus operation, these pins are used as Byte Enables, with C/BE[0]# enabling byte 0 (LSB) and C/ BE[3]# enabling byte 3 (MSB). The PCI Mini-ACE Mark3/Micro-ACE TE responds to the following PCI commands C/BE[3:0]# Description (during address phase) 0 1 1 0 Memory Read 0 1 1 1 Memory Write 1 0 1 0 Configuration Read 1 0 1 1 Configuration Write 1 1 0 0 Memory Read Multiple 1 1 1 0 Memory Read Line 1 1 1 1 Memory Write and Invalidate Note that the last three memory commands are aliased to the basic memory commands: Memory Read and Memory Write. PAR (I/O) 57 F16 F15 Parity. This signal is even parity across the entire AD[31:0] field along with the C/BE[3:0]# field. The parity is stable in the clock following the address phase and is sourced by the Bus Master. During the data phase for write operations, the Bus Master sources this signal on the clock following IRDY# active. During the data phase for read operations, this signal is sourced by the Target and is valid on the clock following TRDY# active. The PAR signal therefore has the same timing as AD[31:0], delayed by one clock. PCI_CLK (I) 26 T10 M9 Clock input. The rising edge of this signal is the reference upon which all other clock signals are based, with the exception of RST# and INTA#. The maximum frequency accepted is 33 MHz and the minimum is 0 Hz. TABLE 78. PCI CONTROL BUS SIGNALS (NOTE THAT ALL SIGNALS LISTED, EXCEPT INTA#, ARE SAMPLED ON THE RISING EDGE OF PCI_CLK) SIGNAL NAME PIN BALL BALL 3V 5V DESCRIPTION FRAME#(I) 48 G17 G15 IRDY#(I) 49 H17 G16 Frame. This signal is driven by the current bus master and identifies both the beginning and duration of a bus operation. When FRAME# is first asserted, it indicates that a bus transaction is beginning and that valid addresses and a corresponding bus command are present on the AD[31:0] and C/BE[3:0] lines, qualified by PCI _CLK. When FRAME# is deasserted the transaction is in the final data phase or has been completed. Initiator Ready. This signal is sourced by the bus master and indicates that the bus master is able to complete the current data phase of a bus transaction. For write operations, it indicates that valid data is on the AD[31:0] pins. Wait states occur until both TRDY# and IRDY# are asserted together. TRDY#(O) 52 G18 F18 Target Ready. This signal is sourced by the selected target and indicates that the target is able to complete the current data phase of a bus transaction. For read operations, it indicates that the target is providing valid data on the AD[31:0] pins. Wait states occur until both TRDY# and IRDY# are asserted together. STOP#(O) 54 E16 E16 Stop. The Stop signal is sourced by the selected target and conveys a request to the bus master to stop the current transaction. IDSEL#(I) 38 N18 K16 DEVSEL# (O) 53 F17 F17 Device Select. This signal is sourced by an active target upon decoding that its address and bus commands are valid. For bus masters, it indicates whether any device has decoded the current bus cycle. Parity Error. This pin is used for reporting parity errors during the data portion of the bus transaction for all cycles except a Special Cycle. It is sourced by the agent receiving data and driven active two clocks following the detection of an error. This signal is driven inactive (high) two clocks prior to returning to the tri-state condition. PERR# (O) 55 F18 E18 SERR# (O) 56 F15 E17 INTA# (O) 24 J16 L17 Data Device Corporation www.ddc-web.com Initialization Device Select. This pin is used as a chip select during configuration read or write operations. System Error. This pin is used for reporting address parity errors, data parity errors on Special Cycle commands, or any other condition having a catastrophic system impact. Interrupt A. This pin is a level sensitive, active low interrupt to the host 59 BU-65743/65843/65863/65864 AC-6/11-0 TABLE 79. PCI MINI-ACE MARK3 PINOUT PIN# SIGNAL NAME PIN# SIGNAL NAME 1 RTAD1 41 AD21 2 RTAD2 42 AD20 3 TX/RX A 43 AD19 4 DO NOT CONNECT, FACTORY TP 44 AD18 AD17 6 TX/RX_A RTAD0 45 46 AD16 7 RTAD3 47 C/BE[2]# 8 DO NOT CONNECT, FACTORY TP 48 FRAME# 9 DO NOT CONNECT, FACTORY TP 49 IRDY# 50 GND_LOGIC 51 3.3V_LOGIC 5 Data Device Corporation www.ddc-web.com 10 3.3V_XCVR FOR BU-65XXF(G)8(9)-XXX 5VXCVR FOR BU-65XXF(G)3(4)-XXX 52 TRDY# 11 DO NOT CONNECT, FACTORY TP 53 DEVSEL# 12 RTAD_LAT 54 STOP# 13 RTAD_PAR 55 PERR# 14 SLEEP_IN 56 SERR# 15 TX/RX_B 57 PAR 16 DO NOT CONNECT, FACTORY TP 58 C/BE[1]# 17 59 AD15 18 TX/RX_B TXINH_A/B 60 AD14 19 INCMD / MCRST 61 AD13 20 SSFLAG / EXT_TRIG 62 AD12 21 DO NOT CONNECT, FACTORY TP 63 AD11 22 GND_XCVR 64 AD10 23 TAG_CLK 65 AD9 24 INTA# 66 C/BE[0]# 25 67 AD08 26 MSTCLR PCI_CLOCK 68 AD07 27 AD31 69 3.3V_LOGIC 28 AD30 70 GND_LOGIC 29 AD29 71 AD06 30 3.3V_LOGIC 72 AD05 31 GND_LOGIC 73 AD04 32 AD28 74 AD03 33 AD27 75 AD02 34 AD26 76 AD01 35 AD25 77 AD00 36 AD24 78 1553_CLK 37 C/BE[3]# 79 GND_XCVR 38 IDSEL 80 RTAD4 39 AD23 40 AD22 60 BU-65743/65843/65863/65864 AC-6/11-0 TABLE 80. PCI MICRO-ACE-TE BU-65843B8/BU-65863B8 (3.3V TRANSCEIVER) PINOUTS BALL SIGNAL A1 NOTES BALL SIGNAL NOTES NC C10 AD02 A2 NC C11 NC A3 NC C12 AD03 A4 +3.3V_XCVR C13 NC A5 +3.3V_XCVR C14 NC A6 RTAD0 C15 RTAD2 A7 RTAD4 C16 NC A8 +3.3V LOGIC C17 NC A9 +3.3V LOGIC C18 NC A10 AD01 D1 TX/RX-A A11 AD04 D2 TX/RX-A A12 AD07 D3 GND_XCVR /2/ A13 NC D4 GND_XCVR /2/ A14 AD09 D5 GND_XCVR /2/ A15 AD10 D6 NC A16 NC D7 TXDATA_IN_A /1/ Connect to ball D8 A17 NC D8 TXDATA_OUT_A /1/ Connect to ball D7 A18 NC D9 RT_AD_LAT B1 NC D10 RTAD3 B2 NC D11 NC B3 NC D12 NC B4 +3.3V_XCVR D13 NC Thermal Ball, Connects to Thermal Via B5 +3.3V_XCVR D14 SNGL_END B6 AD05 D15 NC B7 1553_CLK D16 AD15 B8 +3.3V LOGIC D17 AD13 B9 +3.3V LOGIC D18 AD11 B10 AD00 E1 TX/RX_A B11 AD06 E2 TX/RX_A B12 C/BE[0]# E3 GND/XCVR /2/ B13 NC E4 GND/XCVR /2/ B14 AD08 E5 GND/XCVR /2/ B15 AD12 E6 RTAD1 B16 NC E7 TXINH_IN_A /1/ Connect to ball E8 B17 NC E8 TXINH_OUT_A /1/ Connect to ball E7 B18 NC E9 RTADPAR C1 NC E10 GND_LOGIC C2 NC E11 GND_LOGIC C3 NC E12 GND_LOGIC C4 NC E13 NC C5 NC E14 CLK_SEL_1 C6 NC E15 NC C7 TXDATA_IN_A /1/ Connect to ball C8 E16 STOP# C8 TXDATA_OUT_A /1/ Connect to ball C7 E17 C/BE[1]# C9 INCMD / MCRST E18 AD14 Data Device Corporation www.ddc-web.com 61 Thermal Ball, Connects to Thermal Via BU-65743/65843/65863/65864 AC-6/11-0 TABLE 80. PCI MICRO-ACE-TE BU-65843B8/BU-65863B8 (3.3V TRANSCEIVER) PINOUTS (CONT) BALL SIGNAL F1 F2 NOTES BALL SIGNAL GND_XCVR /2/ H10 GND_LOGIC GND_XCVR /2/ H11 GND_LOGIC H12 GND_LOGIC F3 GND_XCVR /2/ Thermal Ball, Connects to Thermal Via F4 GND_XCVR /2/ H13 NC F5 GND_XCVR /2/ H14 NC F6 NC H15 NC F7 RTBOOT H16 NC F8 TX_INH A/B H17 IRDY# NOTES F9 NC H18 AD19 F10 GND_LOGIC J1 3.3V_XCVR F11 GND_LOGIC J2 3.3V_XCVR F12 GND_LOGIC J3 3.3V_XCVR F13 NC J4 3.3V_XCVR F14 TAG_CLK J5 3.3V_XCVR F15 SERR#L J6 NC F16 PAR J7 NC F17 DEVSEL# J8 NC F18 PERR# J9 NC G1 TX/RX_A J10 NC G2 TX/RX_A J11 NC G3 GND_XCVR /2/ G4 GND_XCVR /2/ G5 J12 NC J13 NC GND_XCVR /2/ J14 NC G6 NC J15 AD22 G7 RXDATA_OUT_A /1/ Connect to ball G8 J16 INTA# RXDATA_IN_A /1/ Connect to ball G7 J17 C/BE[2]# G8 Thermal Ball, Connects to Thermal Via G9 NC J18 AD21 G10 GND_LOGIC K1 3.3V_XCVR G11 GND_LOGIC K2 3.3V_XCVR G12 GND_LOGIC K3 3.3V_XCVR G13 NC K4 3.3V_XCVR G14 NC K5 3.3V_XCVR G15 NC K6 NC G16 NC K7 NC G17 FRAME# K8 NC G18 TRDY# K9 NC H1 TX/RX_A K10 NC H2 TX/RX_A K11 NC H3 NC K12 NC H4 NC K13 NC H5 NC K14 NC H6 NC K15 NC H7 RXDATA_OUT /1/ Connect to ball H8 K16 AD20 H8 RXDATA_IN_A /1/ Connect to ball H7 K17 AD16 H9 NC K18 AD18 Data Device Corporation www.ddc-web.com 62 BU-65743/65843/65863/65864 AC-6/11-0 TABLE 80. PCI MICRO-ACE-TE BU-65843B8/BU-65863B8 (3.3V TRANSCEIVER) PINOUTS (CONT) BALL SIGNAL L1 L2 L3 GND_XCVR /2/ NOTES BALL SIGNAL TX/RX_B N10 NC TX/RX_B N11 NC N12 3.3V_LOGIC N13 3.3V_LOGIC Thermal Ball, Connects to Thermal Via L4 GND_XCVR /2/ L5 GND_XCVR /2/ N14 NC L6 NC N15 NC L7 TXDATA_IN_B /1/ Connect to ball L8 N16 NC L8 TXDATA_OUT_B /1/ Connect to ball L7 N17 AD26 L9 NC N18 IDSEL L10 NC P1 TX/RX_B L11 NC P2 TX/RX_B L12 NC P3 GND_XCVR /2/ L13 NC P4 GND_XCVR /2/ L14 CLK_SEL_0 P5 GND_XCVR /2/ L15 NC P6 NC L16 3.3V_LOGIC P7 NC NOTES Thermal Ball, Connects to Thermal Via L17 3.3V_LOGIC P8 NC L18 AD17 P9 RXDATA_OUT_B /1/ Connect to ball P10 M1 TX/RX_B P10 RXDATA_IN_B /1/ Connect to ball P9 M2 TX/RX_B P11 NC M3 GND_XCVR /2/ P12 3.3V_LOGIC M4 GND_XCVR /2/ P13 3.3V_LOGIC Thermal Ball, Connects to Thermal Via M5 GND_XCVR /2/ P14 NC M6 NC P15 NC M7 TXDATA_IN_B /1/ Connect to ball M8 P16 NC M8 TXDATA_OUT_B /1/ Connect to ball M7 P17 AD28 M9 NC P18 AD24 M10 NC R1 TX/RX_B M11 NC R2 TX/RX_B M12 NC R3 NC M13 NC R4 SLEEPIN M14 NC R5 NC M15 NC R6 3.3V_LOGIC M16 3.3V_LOGIC R7 3.3V_LOGIC M17 3.3V_LOGIC R8 C/BE[3]# M18 AD23 R9 RXDATA_OUT_B /1/ Connect to ball R10 N1 GND_XCVR /2/ R10 RXDATA_IN_B /1/ Connect to ball R9 N2 GND_XCVR /2/ R11 GND_LOGIC Thermal Ball, Connects to Thermal Via N3 GND_XCVR /2/ R12 GND_LOGIC N4 GND_XCVR /2/ R13 GND_LOGIC N5 GND_XCVR /2/ R14 NC N6 NC R15 NC N7 TXINH_IN_B /1/ Connect to ball N8 R16 NC N8 TXINH_OUT_B /1/ Connect to ball N7 R17 AD29 N9 NC R18 MSTCLR (RST#) Data Device Corporation www.ddc-web.com 63 BU-65743/65843/65863/65864 AC-6/11-0 TABLE 80. PCI MICRO-ACE-TE BU-65843B8/BU-65863B8 (3.3V TRANSCEIVER) PINOUTS (CONT) BALL SIGNAL NC V8 AD25 T2 NC V9 AD31 T3 NC V10 NC T4 NC V11 NC T5 NC V12 NC T6 3.3V_LOGIC V13 NC T7 3.3V_LOGIC V14 NC T8 AD30 V15 NC T9 NC V16 NC T10 PCI_CLK V17 NC T11 GND_LOGIC V18 NC BALL SIGNAL T1 T12 GND_LOGIC T13 GND_LOGIC T14 NC T15 NC T16 NC T17 NC T18 NC U1 NC U2 NC U3 NC U4 3.3V_XCVR U5 3.3V_XCVR U6 3.3V_LOGIC U7 3.3V_LOGIC U8 AD27 U9 NC U10 SSFLAG/EXTTRIG U11 GND_LOGIC U12 GND_LOGIC U13 GND_LOGIC U14 NC U15 NC U16 NC U17 NC U18 NC V1 NC V2 NC V3 NC V4 3.3V_XCVR V5 3.3V_XCVR V6 3.3V_LOGIC V7 3.3V_LOGIC Data Device Corporation www.ddc-web.com NOTES NOTES NOTES : /1/ -LOGIC-TRANSCEIVER INTERCONNECT SIGNALS: CONSULT Table 71 /2/ - THERMAL BALL - MUST BE CONNECTED TO PWB THERMAL PLANE (28) NC = DO NOT CONNECT, NO USER CONNECTIONS TO THESE BALLS ALLOWED 64 BU-65743/65843/65863/65864 AC-6/11-0 TABLE 81. PCI MICRO-ACE-TE BU-65843B3/BU-65864B3 (5V TRANSCEIVER) PINOUTS NOTES BALL SIGNAL BALL SIGNAL A1 NC C10 AD04 A2 NC C11 RTAD0 A3 NC C12 RT_BOOT A4 TXINH_IN_A /1/ C13 AD08 A5 TXINH_OUT_A /1/ C14 AD10 A6 NC C15 AD12 A7 +3.3V LOGIC C16 NC A8 RTAD2 C17 NC A9 AD01 C18 NC A10 RTAD4 D1 TX/RX-A NOTES A11 AD06 D2 TX/RX-A A12 AD07 D3 GND_XCVR /2/ A13 NC D4 GND_XCVR /2/ A14 AD09 D5 GND_XCVR /2/ A15 SNGL_END D6 RTAD_PAR A16 NC D7 AD31 A17 NC D8 1553_CLK A18 NC D9 NC B1 NC D10 RXDATA_IN_A /1/ B2 NC D11 NC B3 NC D12 NC B4 NC D13 NC B5 NC D14 NC B6 NC D15 AD15 B7 AD02 D16 AD13 B8 TXDATA_OUT_A /1/ D17 AD11 B9 RTAD1 D18 TAG_CLK B10 AD00 E1 TX/RX_A B11 MSTCLR (RST#) E2 GND/XCVR /2/ B12 C/BE[0]# E3 GND/XCVR /2/ B13 NC E4 GND/XCVR /2/ B14 NC E5 GND/XCVR /2/ B15 CLK_SEL1 E6 NC B16 NC E7 AD27 B17 NC E8 INCMD / MCRST B18 NC E9 RXDATA_IN_A /1/ C1 NC E10 RXDATA_OUT_A /1/ C2 NC E11 NC C3 NC E12 GND_LOGIC C4 TXDATA_IN_A /1/ E13 GND_LOGIC C5 TXDATA_OUT_A /1/ E14 GND_LOGIC C6 AD03 E15 C/BE[1]# C7 RT_AD_LAT E16 STOP# C8 TXDATA_IN_A /1/ E17 SERR# C9 RTAD3 E18 PERR# Data Device Corporation www.ddc-web.com 65 Thermal Ball, Connects to Thermal Via Thermal Ball, Connects to Thermal Via BU-65743/65843/65863/65864 AC-6/11-0 TABLE 81. PCI MICRO-ACE-TE BU-65843B3/BU-65864B3 (5V TRANSCEIVER) PINOUTS (CONT) BALL SIGNAL F1 NOTES NOTES BALL SIGNAL +5V VCC CH A H10 NC F2 +5V VCC CH A H11 NC F3 GND_XCVR /2/ H12 GND_LOGIC Thermal Ball, Connects to Thermal Via F4 GND_XCVR /2/ H13 GND_LOGIC F5 GND_XCVR /2/ H14 GND_LOGIC F6 NC H15 NC F7 NC H16 AD28 F8 NC H17 AD16 F9 RXDATA_OUT_A /1/ H18 C/BE[2]# F10 TX_INH A/B J1 NC F11 NC J2 NC F12 GND_LOGIC J3 NC F13 GND_LOGIC J4 NC F14 GND_LOGIC J5 NC F15 PAR J6 NC F16 AD14 J7 AD05 F17 DEVSEL# J8 C/BE[3]# F18 TRDY# J9 NC G1 TX/RX_A J10 NC G2 GND_XCVR /2/ J11 NC G3 GND_XCVR /2/ J12 NC G4 GND_XCVR /2/ J13 NC Thermal Ball, Connects to Thermal Via G5 GND_XCVR /2/ J14 NC G6 NC J15 NC G7 NC J16 AD22 G8 NC J17 AD20 G9 NC J18 AD18 G10 NC K1 NC G11 NC K2 NC G12 GND_LOGIC K3 NC G13 GND_LOGIC K4 NC G14 GND_LOGIC K5 NC G15 FRAME# K6 NC G16 IRDY# K7 NC G17 AD19 K8 NC RFU (JTAG) RFU (JTAG) G18 AD21 K9 NC H1 TX/RX_A K10 NC H2 TX/RX_A K11 NC H3 GND_XCVR /2/ K12 NC H4 GND_XCVR /2/ K13 NC H5 GND_XCVR /2/ K14 NC RFU (JTAG) H6 NC K15 NC RFU (JTAG) H7 NC K16 IDSEL H8 NC K17 AD23 H9 NC K18 AD17 Data Device Corporation www.ddc-web.com Thermal Ball, Connects to Thermal Via 66 BU-65743/65843/65863/65864 AC-6/11-0 TABLE 81. PCI MICRO-ACE-TE BU-65843B3/BU-65864B3 (5V TRANSCEIVER) PINOUTS (CONT) BALL SIGNAL L1 NOTES NOTES BALL SIGNAL 3.3V_LOGIC N10 NC L2 3.3V_LOGIC N11 NC L3 NC N12 TXDATA_IN_B /1/ L4 NC N13 RXDATA_IN_B /1/ L5 NC N14 RXDATA_OUT_B /1/ L6 NC N15 NC L7 NC N16 NC L8 NC N17 NC L9 SSFLAG / EXT_TRIG N18 NC L10 AD29 P1 NC L11 AD26 P2 NC L12 NC P3 NC L13 NC P4 5V_RAM L14 NC P5 NC L15 3.3V_LOGIC P6 NC L16 3.3V_LOGIC P7 3.3V_LOGIC 5V RAM BU-65864B3 ONLY L17 INTA# P8 NC L18 AD24 P9 3.3V_LOGIC M1 NC P10 TXDATA_OUT_B /1/ M2 NC P11 GND_XCVR /2/ M3 3.3V_LOGIC P12 GND_XCVR /2/ M4 NC P13 GND_XCVR /2/ M5 NC P14 GND_XCVR /2/ M6 NC P15 GND_XCVR /2/ M7 NC P16 NC M8 NC P17 NC M9 PCI_CLK P18 NC M10 AD30 R1 NC M11 NC R2 NC M12 TXDATA_OUT_B /1/ R3 NC M13 RXDATA_IN_B /1/ R4 5V_RAM M14 RXDATA_OUT_B /1/ R5 NC M15 NC M16 NC M17 5V RAM BU-65864B3 ONLY R6 NC R7 NC NC R8 TXINH_OUT_B /1/ M18 CLK_SEL_0 R9 3.3V_LOGIC N1 NC R10 TXDATA_IN_B /1/ N2 NC R11 GND_XCVR N3 NC R12 GND_XCVR N4 NC R13 GND_XCVR N5 NC R14 GND_XCVR N6 NC R15 GND_XCVR N7 NC R16 NC N8 NC R17 NC N9 AD25 R18 NC Data Device Corporation www.ddc-web.com RFU (JTAG) 67 Thermal Ball, Connects to Thermal Via Thermal Ball, Connects to Thermal Via BU-65743/65843/65863/65864 AC-6/11-0 TABLE 81. PCI MICRO-ACE-TE BU-65843B3/BU-65864B3 (5V TRANSCEIVER) PINOUTS (CONT) BALL SIGNAL T1 NOTES NOTES BALL SIGNAL NC V10 NC T2 NC V11 TX/RX_B T3 NC V12 TX/RX_B T4 NC V13 5V VCC CHB T5 NC V14 TX/RX_B T6 NC V15 TX/RX_B T7 NC V16 NC T8 TXINH_IN_B /1/ V17 NC T9 NC V18 NC T10 NC NOTES: T11 GND_XCVR T12 GND_XCVR T13 GND_XCVR T14 GND_XCVR T15 GND_XCVR T16 NC T17 NC T18 NC U1 NC U2 NC U3 NC U4 NC U5 NC U6 NC U7 NC U8 NC U9 NC U10 NC U11 TX/RX_B U12 GND_XCVR U13 5V VCC CHB U14 GND_XCVR U15 TX/RX_B U16 NC U17 NC U18 NC V1 NC V2 NC V3 NC V4 NC V5 NC V6 NC V7 NC V8 3.3V_LOGIC V9 NC Data Device Corporation www.ddc-web.com Thermal Ball, Connects to Thermal Via /1/ -LOGIC-TRANSCEIVER INTERCONNECT SIGNALS: CONSULT Table 71 /2/ -THERMAL BALL - MUST BE CONNECTED TO PWB THERMAL PLANE (34) NC = DO NOT CONNECT, NO USER CONNECTIONS TO THESE BALLS ALLOWED Thermal Ball, Connects to Thermal Via Thermal Ball, Connects to Thermal Via 68 BU-65743/65843/65863/65864 AC-6/11-0 2 X 2.36 (59.94) REF. 2 X 1.88 (47.75) 0.02 4 X 0.890 (22.606) MAX. 4 X 0.060 (1.524) #60 #41 #40 #61 0.015 (0.381) TYP. 4 X 19 EQUAL SP @ 0.040 (1.016) = 0.760 (19.304) (TOL. NON-CUM.) TOP VIEW #21 #80 #1 #20 PIN NUMBERS FOR REFERENCE ONLY 0.500 (12.7) REF 4 X 0.200 (5.08) 0.008 (0.2032) PIN #1 DENOTED BY INDEX MARK 0.002 0.025 (0.635) 0.910 (23.114) MAX. 0.130 (3.302) MAX. 0.050 (1.27) SIDE VIEW Notes: 1) Dimensions are in inches (mm). FIGURE 22. MECHANICAL OUTLINE DRAWING FOR 80-LEAD FLATPACK Data Device Corporation www.ddc-web.com 69 BU-65743/65843/65863/65864 AC-6/11-0 4 X 0.880 (22.35) REF #60 #41 #61 #40 0.015 (0.381) TYP. 4 X 19 EQUAL SP @ 0.040 (1.016) = 0.760 (19.304) (TOL. NON-CUM.) TOP VIEW #80 PIN #1 DENOTED BY INDEX MARK 4 X 0.060 (1.524) #21 #20 #1 PIN NUMBERS FOR REFERENCE ONLY 0.130 (3.302) MAX. PIN #1 DENOTED BY INDEX MARK 0.010 (0.254) MAX. 0.004 (0.102) 0.006 (0.152) +0.010 (+0.254) - 0.004 (- 0.102) 1.110 (28.194) 0.060 (1.524) MAX. 0.015 SIDE VIEW Notes: 1) Dimensions are in inches (mm). FIGURE 23. MECHANICAL OUTLINE DRAWING FOR 80-PIN GULL LEAD PACKAGE Data Device Corporation www.ddc-web.com 70 BU-65743/65843/65863/65864 AC-6/11-0 .815 [20.70] (MAX) SQUARE .670 [17.02] (TYP) .065 [1.65] (TYP) 18 17 16 15 14 13 12 11 10 9 8 7 6 5 4 3 2 1 17 EQ. SP. @ .0394 [1.00] = .670 [17.02] (TOL NONCUM) (TYP) V U T R P N M L K J H G F E D C B A .0394 [1.00] (TYP) .065 [1.65] (TYP) Triangle denotes Ball A1 BOTTOM VIEW Cover Material Diallyl Phthalate (DAP) 0.015 [0.38] (REF) 0.120 [3.05] (MAX) .022 [0.56] DIA FR4 P.C. Board B = Sn/Pb (63/37) BALL R = Sn/Ag/Cu (96.5/3.0/0.5) BALL SIDE VIEW Notes: 1) Dimensions are in inches (mm). 2) Cover material: Diallyl Phthalate (DAP). 3) Base material: FR4 PC board. 4) Solder Ball Cluster to be centralized within .010 of outline dimensions. 5) The copper pads (324 places) on the bottom of the BGA package are .025" (0.635 mm) in diameter prior to processing. Final ball size is .022" (0.56 mm) after processing (typical). FIGURE 24. MECHANICAL OUTLINE DRAWING FOR 324 BALL BGA PACKAGE Data Device Corporation www.ddc-web.com 71 BU-65743/65843/65863/65864 AC-6/11-0 ORDERING INFORMATION FOR PCI MINI-ACE MARK3 BU-6586 3F3-120X Supplemental Process Requirements: S = Pre-Cap Source Inspection L = 100% Pull Test Q = 100% Pull Test and Pre-Cap Source Inspection K = One Lot Date Code W = One Lot Date Code and Pre-Cap Source Inspection Y = One Lot Date Code and 100% Pull Test Z = One Lot Date Code, Pre-Cap Source Inspection and 100% Pull Test Blank = None of the Above Test Criteria: 0 = Standard Testing 1 = X-Ray 2 = MIL-STD-1760 Amplitude Compliant (not available with McAir compatible Outputs) See transceiver 4, 9 & D options 3 = MIL-STD-1760 and X-Ray Process Requirements: 0 = Standard DDC practices, no Burn-In 1 = MIL-PRF-38534 Compliant (note 2) 2 = B (note 1) 3 = MIL-PRF-38534 Compliant (note 2) with PIND Testing 4 = MIL-PRF-38534 Compliant (note 2) with Solder Dip 5 = MIL-PRF-38534 Compliant (note 2) with PIND Testing and Solder Dip 6 = B (note 1) with PIND Testing 7 = B (note 1) with Solder Dip 8 = B (note 1) with PIND Testing and Solder Dip 9 = Standard DDC Processing with Solder Dip, no Burn-In (see table on next page) Temperature Range/Data Requirements: 1 = -55C to +125C 2 = -40C to +85C 3 = 0C to +70C 4 = -55C to +125C with Variables Test Data 5 = -40C to +85C with Variables Test Data 6 = Custom Part (Reserved) 7 = Custom Part (Reserved) 8 = 0C to +70C with Variables Test Data Voltage/Transceiver Option: 0 = Transceiverless (contact factory for availability) 3 = +5.0 Volts rise/fall times = 100 to 300 ns (-1553B) 4 = +5.0 Volts rise/fall times = 200 to 300 ns (-1553B and McAir compatible) Note: Not available with "MIL-STD-1760 Amplitude Compliant Outputs") 8 = +3.3 Volts rise/fall times = 100 to 300 ns (-1553B) (note 4) 9 = +3.3 Volts rise/fall times = 200 to 300 ns (-1553B and McAir compatible) Note: Not available with "MIL-STD-1760 Amplitude Compliant Outputs") (note 4) C = +3.3 Volts rise/fall times = 100 to 300 ns (-1553B) (note 5) D = +3.3 Volts rise/fall times = 200 to 300 ns (-1553B and McAir compatible. Note: Not available with "MIL-STD-1760 Amplitude Compliant Outputs") (note 5) Package Type: F = 80-Lead Flat Pack G = 80-Lead "Gull Wing" (Formed Lead) Logic / RAM Voltage 3 = 3.3 Volt PCI-Mini-ACE/Mark3 Product Type: (See Product Matrix on Page 74) BU-6574 = RT only with 4K X 16 RAM BU-6584 = BC /RT / MT with 4K x 16 RAM BU-6586 = BC /RT / MT with 64K x 17 RAM Notes: 1. Standard DDC processing with burn-in and full temperature test. See table on next page. 2. MIL-PRF-38534 product grading is designated with the following dash numbers: Class H is a -11X, 13X, 14X, 15X, 41X, 43X, 44X, 45X Class G is a -21X, 23X, 24X, 25X, 51X, 53X, 54X, 55X Class D is a -31X, 33X, 34X, 35X, 81X, 83X, 84X, 85X Data Device Corporation www.ddc-web.com 3. The above products contain tin-lead solder finish as applicable to solder dip requirements. 4. Transformer center-tap connected to +3.3V_XCVR, see FIGURE 18 (Obsolete) 5. Transformer center-tap connected to GND, see FIGURE 19 72 BU-65743/65843/65863/65864 AC-6/11-0 ORDERING INFORMATION FOR PCI MICRO-ACE-TE* BU-6XXX3BX-E0X Test Criteria: 0 = 18V Amplitude. Only available with "Voltage transceiver option = 4" 2 = MIL-STD-1760 Amplitude Compliant, Standard Process Requirements: 0 = Standard DDC practices, no Burn-In Temperature Range/Data Requirements: E = -40C to +100C Voltage/Transceiver Option: 3 = +5.0 Volts rise/fall times = 100 to 300 ns (-1553B) 4 = +5.0 Volts 200 to 300 ns rise/fall times, -1553 and McAir compatible (not available with "Test Criteria option = 2") 8 = +3.3 Volts rise/fall times = 100 to 300 ns (-1553B) (note 3) C = +3.3 Volts rise/fall times = 100 to 300 ns (-1553B) (note 4) Package Type: B = 324-ball BGA Package R = RoHS Compliant 324-ball BGA Package Logic / RAM Voltage: 3 = 3.3 Volt 4 = 3.3 Volt Logic, 5.0 Volt RAM (for BU-65864, 64K x 17 RAM Voltage is always +5.0V) Product Type: (See Product Matrix) BU-6584 = PCI BC/RT/MT with 4K x 16 RAM BU-6586 = PCI BC/RT/MT with 64K x 17 RAM Note : Unless otherwise specified, these products contains tin-lead solder. *See PCI-MICRO-ACE-TE Product Matrix for valid ordering options ACCESSORIES: BU-64863B8-600 MICRO-ACE-TE (324 Ball BGA) Mechanical Sample, with "daisy chain" connections of alternating balls, for use in environmental (mechanical / thermal) integrity testing. STANDARD DDC PROCESSING FOR HYBRID AND MONOLITHIC HERMETIC PRODUCTS MIL-STD-883 TEST METHOD(S) CONDITION(S) INSPECTION 2009, 2010, 2017, and 2032 -- A and C SEAL 1014 TEMPERATURE CYCLE 1010 C CONSTANT ACCELERATION 2001 3000g BURN-IN 1015 (note 1), 1030 (note 2) TABLE 1 Notes: 1. For Process Requirement "B*" (refer to ordering information), devices may be non-compliant with MIL-STD-883, Test Method 1015, Paragraph 3.2. Contact factory for details. 2. When applicable. 3. Transformer center-tap connected to +3.3V_XCVR, see FIGURE 18 (Obsolete) 4. Transformer center-tap connected to GND, see FIGURE 19 STANDARD DDC PROCESSING FOR BGA PRODUCTS TEST MIL-STD-883 METHOD(S) CONDITION(S) INSPECTION 2010, 2017, and 2032 -- TEMPERATURE CYCLE 1010 B Data Device Corporation www.ddc-web.com 73 BU-65743/65843/65863/65864 AC-6/11-0 PCI-MINI-ACE MARK3 PRODUCT MATRIX PART NUMBER LOGIC VOLTAGE MEMORY RAM VOLTAGE TRANSCEIVER VOLTAGE BU-65743X3 3.3V 4K x 16 3.3V 5.0V BU-65743X4 3.3V 4K x 16 3.3V 5.0V BU-65743X8 3.3V 4K x 16 3.3V 3.3V BU-65743X9 3.3V 4K x 16 3.3V 3.3V BU-65743XC 3.3V 4K x 16 3.3V 3.3V BU-65743XD 3.3V 4K x 16 3.3V 3.3V BU-65843X3 3.3V 4K x 16 3.3V 5.0V BU-65843X4 3.3V 4K x 16 3.3V 5.0V BU-65843X8 3.3V 4K x 16 3.3V 3.3V BU-65843X9 3.3V 4K x 16 3.3V 3.3V BU-65843XC 3.3V 4K x 16 3.3V 3.3V BU-65843XD 3.3V 4K x 16 3.3V 3.3V BU-65863X3 3.3V 64K x 17 3.3V 5.0V BU-65863X4 3.3V 64K x 17 3.3V 5.0V BU-65863X8 3.3V 64K x 17 3.3V 3.3V BU-65863X9 3.3V 64K x 17 3.3V 3.3V BU-65863XC 3.3V 64K x 17 3.3V 3.3V BU-65863XD 3.3V 64K x 17 3.3V 3.3V PCI-MICRO-ACE TE PRODUCT MATRIX PART NUMBER SPECIAL ORDER MIN QTY MAY APPLY BU-65843B3-E02 LOGIC VOLTAGE MEMORY RAM VOLTAGE TRANSCEIVER VOLTAGE 3.3V 4K x 16 3.3V 5.0V BU-65843B8-E02 X 3.3V 4K x 16 3.3V 3.3V BU-65843BC-E02 X 3.3V 4K x 16 3.3V 3.3V 3.3V 64K x 17 5.0V 5.0V BU-65864B(R)3-E02 BU-65863B8-E02 X 3.3V 64K x 17 3.3V 3.3V BU-65863BC-E02 X 3.3V 64K x 17 3.3V 3.3V 3.3V 64K x 17 5.0V 5.0V BU-65864B(R)4-E00 Data Device Corporation www.ddc-web.com 74 BU-65743/65843/65863/65864 AC-6/11-0 The information in this data sheet is believed to be accurate; however, no responsibility is assumed by Data Device Corporation for its use, and no license or rights are granted by implication or otherwise in connection therewith. Specifications are subject to change without notice. Please visit our Web site at www.ddc-web.com for the latest information. 105 Wilbur Place, Bohemia, New York, U.S.A. 11716-2426 For Technical Support - 1-800-DDC-5757 ext. 7771 RE G U (R) IST E IR M Headquarters, N.Y., U.S.A. - Tel: (631) 567-5600, Fax: (631) 567-7358 United Kingdom - Tel: +44-(0)1635-811140, Fax: +44-(0)1635-32264 France - Tel: +33-(0)1-41-16-3424, Fax: +33-(0)1-41-16-3425 Germany - Tel: +49-(0)89-15 00 12-11, Fax: +49-(0)89-15 00 12-22 Japan - Tel: +81-(0)3-3814-7688, Fax: +81-(0)3-3814-7689 Asia - Tel: +65-6489-4801 World Wide Web - http://www.ddc-web.com RED F DATA DEVICE CORPORATION REGISTERED TO ISO 9001:2008 REGISTERED TO AS9100:2004-01 FILE NO. A5976 AC-6/11-0 75 PRINTED IN THE U.S.A. RECORD OF CHANGE For BU-65743 Data Sheet Revision Date 11/2009 Pages 30, 32, 33, 35, 50, 51 62, 65, 67, 72 Description Removed "old" double-buffered references. Replaced table 65. Added a new Table (Table 66). Changed "Package Type" ordering description FROM: R = Lead Free 324-ball BGA Package TO: R = RoHS Compliant 324-ball BGA Package Added not bars to R1 R2 of table 80 and G1, H1, H2, U15, V14, V15 of table 81 W 6/2009 Y AA 4/2010 5, 48, 50 Edit to Soldering section of table 1. Edit to table 65 and Figure 18. AB AC 6/2011 47, 48, 49, 50, 71, 72 Updated Figures 18 and 20. Added Figure 19 (BU-64XXXXC/D). Incremented all following Figure numbers. Update to Figure 20. Replaced Table 65. Added Options "C" and "D", and notes 4 and 5 to Ordering Information for PCI Mini-ACE Mark3. Added Option "C" and notes to Ordering Information for PCI Micro-ACE-TE