Extended Temperature Pentium(R) Processor with MMXTM Technology Advance Information Datasheet Product Features Support for MMXTM Technology Low-Power 0.25 Micron Process Technology -- 1.8 V Core Supply for HLPBGA -- 2.5 V I/O Interface 32-Bit CPU with 64-Bit Data Bus Fractional Bus Operation -- 166-MHz Core/66-MHz Bus Superscalar Architecture -- Enhanced Pipelines -- Two Pipelined Integer Units Capable of Two Instructions/Clock -- Pipelined MMX Technology -- Pipelined Floating-Point Unit Separate Code and Data Caches -- 16-Kbyte Code, 16-Kbyte Write-Back Data -- MESI Cache Protocol Compatible with Large Software Base -- MS-DOS*, Windows*, OS/2*, UNIX* 4-Mbyte Pages for Increased TLB Hit Rate IEEE 1149.1 Boundary Scan Advanced Design Features -- Deeper Write Buffers -- Enhanced Branch Prediction Feature -- Virtual Mode Extensions Internal Error Detection Features On-Chip Local APIC Controller Power Management Features -- System Management Mode -- Clock Control 352-ball HL-PBGA Notice: This document contains information on products in the sampling and initial production phases of development. The specifications are subject to change without notice. Verify with your local Intel sales office that you have the latest datasheet before finalizing a design. Order Number: 273232-001 February, 1999 Information in this document is provided in connection with Intel products. No license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted by this document. Except as provided in Intel's Terms and Conditions of Sale for such products, Intel assumes no liability whatsoever, and Intel disclaims any express or implied warranty, relating to sale and/or use of Intel products including liability or warranties relating to fitness for a particular purpose, merchantability, or infringement of any patent, copyright or other intellectual property right. Intel products are not intended for use in medical, life saving, or life sustaining applications. Intel may make changes to specifications and product descriptions at any time, without notice. Designers must not rely on the absence or characteristics of any features or instructions marked "reserved" or "undefined." Intel reserves these for future definition and shall have no responsibility whatsoever for conflicts or incompatibilities arising from future changes to them. The Extended Temperature Pentium(R) Processor with MMXTM Technology may contain design defects or errors known as errata which may cause the product to deviate from published specifications. Current characterized errata are available on request. Contact your local Intel sales office or your distributor to obtain the latest specifications and before placing your product order. Copies of documents which have an ordering number and are referenced in this document, or other Intel literature may be obtained by calling 1-800548-4725 or by visiting Intel's website at http://www.intel.com. Copyright (c) Intel Corporation, 1999 *Third-party brands and names are the property of their respective owners. Extended Temperature Pentium(R) Processor with MMXTM Technology Contents 1.0 Introduction......................................................................................................................... 7 1.1 2.0 Architecture Overview ........................................................................................................8 2.1 2.2 2.3 3.0 Pentium(R) Processor Family Architecture .............................................................. 8 Pentium(R) Processor with MMXTM Technology ....................................................11 2.2.1 Full Support for Intel MMXTM Technology ..............................................11 2.2.2 16-Kbyte Code and Data Caches...........................................................12 2.2.3 Improved Branch Prediction ...................................................................12 2.2.4 Enhanced Pipeline .................................................................................12 2.2.5 Deeper Write Buffers..............................................................................12 0.25 Micron Technology ......................................................................................12 Extended Temperature Pentium(R) Processor with MMXTM Technology Packaging Information .......................................................................................................................13 3.1 3.2 3.3 3.4 3.5 3.6 3.7 3.8 3.9 3.10 3.11 4.0 Processor Features ............................................................................................... 7 Differences from Desktop Processors.................................................................13 HL-PBGA Pinout and Pin Descriptions ...............................................................14 Design Notes.......................................................................................................18 Pin Quick Reference ...........................................................................................18 Bus Fraction (BF) Selection ................................................................................24 The CPUID Instruction ........................................................................................25 Boundary Scan Chain List...................................................................................27 Pin Reference Tables..........................................................................................28 Pin Grouping According to Function....................................................................30 Mechanical Specifications ...................................................................................31 3.10.1 HL-PBGA Package Mechanical Diagrams .............................................31 Thermal Specifications ........................................................................................32 3.11.1 Measuring Thermal Values ....................................................................32 3.11.2 Thermal Equations and Data..................................................................32 3.11.3 Airflow Calculations for Maximum and Typical Power............................33 3.11.4 HL-PBGA Package Thermal Resistance Information.............................34 Extended Temperature Pentium(R) Processor with MMXTM Technology Electrical Specifications ...................................................................................................................35 4.1 4.2 4.3 4.4 4.5 Absolute Maximum Ratings.................................................................................35 DC Specifications ................................................................................................35 4.2.1 Power Sequencing .................................................................................35 AC Specifications ................................................................................................38 4.3.1 Power and Ground .................................................................................38 4.3.2 Decoupling Recommendations ..............................................................38 4.3.3 Connection Specifications ......................................................................38 4.3.4 AC Timings.............................................................................................39 I/O Buffer Models ................................................................................................46 4.4.1 Buffer Model Parameters .......................................................................48 Signal Quality Specifications ...............................................................................49 4.5.1 Overshoot...............................................................................................49 Advance Information Datasheet 3 Extended Temperature Pentium(R) Processor with MMXTM Technology 5.0 Extended Temperature Pentium(R) Processor with MMXTM Technology Errata Information ....................................................................................................................... 51 5.1 5.2 Nomenclature...................................................................................................... 51 Summary Table of Changes ............................................................................... 52 5.2.1 Codes Used in Summary Table ............................................................. 52 5.2.2 Documentation Changes........................................................................ 55 6.0 Extended Temperature Pentium(R) Processor with MMXTM Technology Specification Changes........................................................................................................................... 56 7.0 Extended Temperature Pentium(R) Processor with MMXTM Technology Errata ................ 56 8.0 Extended Temperature Pentium(R) Processor with MMXTM Technology Specification Clarifications..................................................................................................................... 80 9.0 Extended Temperature Pentium(R) Processor with MMXTM Technology Documentation Changes........................................................................................................................... 86 10.0 Pentium(R) Processor Related Technical Collateral ........................................................... 88 Figures 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 4 Pentium(R) Processor with MMXTM Technology Block Diagram............................ 10 HL-PBGA Package Top Side View ..................................................................... 14 HL-PBGA Package Pin Side View ...................................................................... 15 EAX Bit Assignments for CPUID......................................................................... 25 EDX Bit Assignments for CPUID......................................................................... 25 HL-PBGA Package Dimensions.......................................................................... 31 Technique for Measuring TC ............................................................................... 33 Thermal Resistance vs. Airflow for HL-PBGA Package...................................... 34 Clock Waveform.................................................................................................. 44 Valid Delay Timings ............................................................................................ 44 Float Delay Timings ............................................................................................ 44 Setup and Hold Timings...................................................................................... 45 Reset and Configuration Timings........................................................................ 45 Test Timings........................................................................................................ 46 Test Reset Timings ............................................................................................. 46 First Order Input Buffer Model............................................................................. 47 First Order Output Buffer Model.......................................................................... 48 Pending Bus Cycle Timing Diagram ................................................................... 72 Snoop Writeback Cycle Timing Diagram ............................................................ 73 Advance Information Datasheet Extended Temperature Pentium(R) Processor with MMXTM Technology Tables 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32 Signals Removed from the Extended Temperature Pentium(R) Processor with MMXTM Technology .....................................................................................13 Pin Cross Reference by Pin Name .....................................................................16 No Connect, Power Supply and Ground Pin Cross Reference ..........................17 Quick Pin Reference .........................................................................................18 Bus Frequency Selection ....................................................................................25 EDX Bit Assignment Definitions for CPUID.........................................................26 Output Pins..........................................................................................................28 Input Pins ............................................................................................................29 Input/Output Pins.................................................................................................30 Pin Functional Grouping......................................................................................30 HL-PBGA Package Dimensions..........................................................................31 Thermal Resistances for HL-PBGA Packages....................................................34 Absolute Maximum Ratings.................................................................................35 VCC and TCASE Specifications.............................................................................36 DC Specifications ................................................................................................36 ICC Specifications ................................................................................................36 Power Dissipation Requirements for Thermal Design.........................................37 Input and Output Characteristics.........................................................................37 Extended Temperature AC Specifications .........................................................40 APIC AC Specifications.......................................................................................43 Notes to Tables 19 and 20...................................................................................43 Parameters Used in the Specification of the First Order Input Buffer Model.......47 Parameters Used in the Specification of the First Order Output Buffer Model....48 Signal to Buffer Type...........................................................................................48 Preliminary Input, Output and Bidirectional Buffer Model Parameters for HL-PBGA Package..............................................................................................49 Input Buffer Model Parameters: D (Diodes) ........................................................49 Overshoot Specification Summary ......................................................................50 Specification Changes.........................................................................................53 Errata...................................................................................................................53 Specification Clarifications ..................................................................................55 Documentation Changes.....................................................................................55 Pentium(R) Processor Related Technical Collateral ..............................................88 Advance Information Datasheet 5 Extended Temperature Pentium(R) Processor with MMXTM Technology 1.0 Introduction The Extended Temperature Pentium(R) Processor with MMXTM Technology extends the Pentium processor family, by providing additional performance for extended temperature applications. Furthermore, the Extended Temperature Pentium processor with MMX technology has superscalar architecture which can execute two instructions per clock cycle, and enhanced branch prediction and separate caches also increase performance. The pipelined floating-point unit delivers workstation level performance. Separate code and data caches reduce cache conflicts while remaining software transparent. The Extended Temperature Pentium processor with MMX technology has 4.5 million transistors, is built on Intel's 0.25 micron manufacturing process technology and has full SL Enhanced power management features including System Management Mode (SMM) and clock control. The Extended Temperature Pentium processor with MMX technology is available in a 352-ball HighThermal Low-Profile-Plastic Ball Grid Array (HL-PBGA). The HL-PBGA package allows designers to use surface mount technology to create small form-factor designs. The additional SL Enhanced features and extended temperature HL-PBGA package make the Extended Temperature Pentium processor with MMX technology ideal for automotive multimedia designs. 1.1 Processor Features The Extended Temperature Pentium processor with MMX technology has all the advanced architectural and internal features of the desktop version of the Pentium processor with MMX technology, except that several features have been eliminated. The differences are specified in "Differences from Desktop Processors" on page 13. The Extended Temperature Pentium processor with MMX technology has several features which allow for automotive multimedia designs. These features include the following: * 1.8 V core * 2.5 V I/O buffer VCC3 inputs to reduce power consumption * SL Enhanced feature set This document should be used in conjunction with Embedded Pentium(R) Processor Family Developer's Manual (order number 273204). Advance Information Datasheet 7 Extended Temperature Pentium(R) Processor with MMXTM Technology 2.0 Architecture Overview The Extended Temperature Pentium processor with MMX technology extends the family of Pentium processors with MMX technology. It is binary compatible with the 8086/88, 80286, Intel386TM DX, Intel386 SX, Intel486TM SX, IntelDX2TM, IntelDX4TM, and Pentium processors with voltage reduction technology (75-150 MHz). The Extended Temperature Pentium processor with MMX technology contains all of the features of previous Intel architecture processors and provides significant enhancements and additions, including the following: * * * * * * * * * * * * * * * * * * * 2.1 Support for MMXTM Technology Superscalar Architecture Enhanced Branch Prediction Algorithm Pipelined Floating-Point Unit Improved Instruction Execution Time Separate 16-Kbyte Code Cache and 16-Kbyte Data Cache Writeback MESI Protocol in the Data Cache 64-Bit Data Bus Enhanced Bus Cycle Pipelining Address Parity Internal Parity Checking Execution Tracing Performance Monitoring IEEE 1149.1 Boundary Scan System Management Mode Virtual Mode Extensions 0.25 Micron Process Technology SL Power Management Features Pool of Four Write Buffers Used by Both Pipes Pentium(R) Processor Family Architecture The application instruction set of the Pentium processor family includes the complete Intel486 CPU family instruction set with extensions to accommodate some of the additional functionality of the Pentium processors. All application software written for the Intel386 and Intel486 family microprocessors will run on the Pentium processors without modification. The on-chip memory management unit (MMU) is completely compatible with the Intel386 and Intel486 families of processors. 8 Advance Information Datasheet Extended Temperature Pentium(R) Processor with MMXTM Technology The Pentium processors implement several enhancements to increase performance. The two instruction pipelines and the floating-point unit on Pentium processors are capable of independent operation. Each pipeline issues frequently used instructions in a single clock. Together, the dual pipes can issue two integer instructions in one clock, or one floating-point instruction (under certain circumstances, two floating-point instructions) in one clock. Branch prediction is implemented in the Pentium processors. To support this, Pentium processors implement two prefetch buffers, one that prefetches code in a linear fashion, and one that prefetches code according to the Branch Target Buffer (BTB) so that code is almost always prefetched before it is needed for execution. The floating-point unit has been completely redesigned over the Intel486 processor. Faster algorithms provide up to 10x speed-up for common operations including add, multiply, and load. Pentium processors include separate code and data caches integrated on-chip to meet performance goals. Each cache has a 32-byte line size and is 4-way set associative. Each cache has a dedicated Translation Lookaside Buffer (TLB) to translate linear addresses to physical addresses. The data cache is configurable to be writeback or writethrough on a line-by-line basis and follows the MESI protocol. The data cache tags are triple ported to support two data transfers and an inquire cycle in the same clock. The code cache is an inherently write-protected cache. The code cache tags are also triple ported to support snooping and split line accesses. Individual pages can be configured as cacheable or non-cacheable by software or hardware. The caches can be enabled or disabled by software or hardware. The Pentium processors have increased the data bus to 64 bits to improve the data transfer rate. Burst read and burst writeback cycles are supported by the Pentium processors. In addition, bus cycle pipelining has been added to allow two bus cycles to be in progress simultaneously. The Pentium processors' MMU contains optional extensions to the architecture that allow 4-Kbyte and 4-Mbyte page sizes. The Pentium processors have added significant data integrity and error detection capability. Data parity checking is still supported on a byte-by-byte basis. Address parity checking and internal parity checking features have been added along with a new exception, the machine check exception. As more and more functions are integrated on-chip, the complexity of board level testing is increased. To address this, the Pentium processors have increased test and debug capability. The Pentium processors implement IEEE Boundary Scan (Standard 1149.1). In addition, the Pentium processors have specified four breakpoint pins that correspond to each of the debug registers and externally indicate a breakpoint match. Execution tracing provides external indications when an instruction has completed execution in either of the two internal pipelines, or when a branch has been taken. System Management Mode (SMM) has been implemented along with some extensions to the SMM architecture. Enhancements to virtual 8086 mode have been made to increase performance by reducing the number of times it is necessary to trap to a virtual 8086 monitor. Figure 1 shows a block diagram of the Pentium processor with MMX technology. The block diagram shows the two instruction pipelines, the "u" pipe and "v" pipe. The u-pipe can execute all integer and floating-point instructions. The v-pipe can execute simple integer instructions and the FXCH floating-point instructions. Advance Information Datasheet 9 Extended Temperature Pentium(R) Processor with MMXTM Technology The separate code and data caches are shown. The data cache has two ports, one for each of the two pipes (the tags are triple ported to allow simultaneous inquire cycles). The data cache has a dedicated Translation Lookaside Buffer (TLB) to translate linear addresses to the physical addresses used by the data cache. Figure 1. Pentium(R) Processor with MMXTM Technology Block Diagram Branch Prefetch Target Buffer Address TLB Code Cache 16 Kbytes 128 Instruction Pointer Control ROM Instruction Decode Branch Verif. & Target Addr. 64-Bit Data Bus 32-Bit Address Bus Prefetch Buffers Control Unit Page Unit V Pipeline Connection U Pipeline Connection Bus Unit Floating-Point Unit Control Control Address Generate Register File MMXTM Technology Unit Address Generate Add (U Pipeline) (V Pipeline) Divide 80 Multiply 80 Integer Register File ALU ALU (U Pipeline) (V Pipeline) Barrel Shifter 64 64-Bit Data Bus Data Control 32-Bit Address Bus 32 APIC Data Cache 16 Kbytes 32 32 TLB 32 32 32 A5920-01 10 Advance Information Datasheet Extended Temperature Pentium(R) Processor with MMXTM Technology The code cache, branch target buffer and prefetch buffers are responsible for getting raw instructions into the execution units of the Pentium processor. Instructions are fetched from the code cache or from the external bus. Branch addresses are remembered by the branch target buffer. The code cache TLB translates linear addresses to physical addresses used by the code cache. The decode unit decodes the prefetched instructions so the Pentium processor can execute the instruction. The control ROM contains the microcode which controls the sequence of operations that must be performed to implement the Pentium processor architecture. The control ROM unit has direct control over both pipelines. The Pentium processor contains a pipelined floating-point unit that provides a significant floatingpoint performance advantage over previous generations of processors. In addition to the SMM features described above, the Pentium processor supports clock control. When the clock to the processor is stopped, power dissipation is virtually eliminated. The combination of these improvements makes the Pentium processor a good choice for low-power designs. The Pentium processor supports fractional bus operation. This allows the internal processor core to operate at high frequencies, while communicating with the external bus at lower frequencies. The Extended Temperature Pentium processor with MMX technology contains an on-chip advanced programmable interrupt controller (APIC). This function is reserved for future multiprocessing function. The architectural features introduced in this section are more fully described in the Embedded Pentium(R) Processor Family Developer's Manual (order number 273204). 2.2 Pentium(R) Processor with MMXTM Technology The Pentium processor with MMX technology for high-performance extended temperature designs is a significant addition to the Pentium processor family. Available at 166 MHz, it is the first extended temperature microprocessor to support Intel MMX technology. The Pentium processor with MMX technology is both software and pin compatible with previous members of the Pentium processor family. It contains 4.5 million transistors and is manufactured on 0.25 micron CMOS process, which allows voltage reduction technology for low power and high density. In addition to the architecture described in the previous section for the Pentium processor family, the Pentium processor with MMX technology has several additional micro-architectural enhancements, which are described in the next section. 2.2.1 Full Support for Intel MMXTM Technology MMX technology is based on the SIMD technique (Single Instruction, Multiple Data) which enables increased performance on a wide variety of multimedia and communications applications. Fifty-seven new instructions and four new 64-bit data types are supported in the Pentium processor with MMX technology. All existing operating system and application software are fullycompatible. Advance Information Datasheet 11 Extended Temperature Pentium(R) Processor with MMXTM Technology 2.2.2 16-Kbyte Code and Data Caches On-chip level-1 data and code cache sizes are 16 Kbytes each and are 4-way set associative on the Pentium processor with MMX technology. Large separate internal caches improve performance by reducing average memory access time and providing fast access to recently-used instructions and data. The instruction and data caches can be accessed simultaneously while the data cache supports two data references simultaneously. The data cache supports a write-back (or alternatively, writethrough, on a line-by-line basis) policy for memory updates. 2.2.3 Improved Branch Prediction Dynamic branch prediction uses the Branch Target Buffer (BTB) to boost performance by predicting the most likely set of instructions to be executed. The BTB has been improved on the Pentium processor with MMX technology to increase its accuracy. This processor has four prefetch buffers that can hold up to four successive code streams. 2.2.4 Enhanced Pipeline An additional pipeline stage has been added and the pipeline has been enhanced to improve performance. The integration of the MMX technology pipeline with the integer pipeline is very similar to that of the floating-point pipeline. Under some circumstances, two MMX instructions or one integer and one MMX instruction can be paired and issued in one clock cycle to increase throughput. The enhanced pipeline is described in more detail in the Embedded Pentium(R) Processor Family Developer's Manual (order number 273204). 2.2.5 Deeper Write Buffers A pool of four write buffers is now shared between the dual pipelines to improve memory write performance. 2.3 0.25 Micron Technology The 0.25 micron technology is the state-of-the-art CMOS manufacturing process Intel unveiled on April 12, 1997, enabling the use of lower core supply to sub-2 V. As a result, the Extended Temperature Pentium processor with MMX technology consumes significantly less power at even higher speeds. 12 Advance Information Datasheet Extended Temperature Pentium(R) Processor with MMXTM Technology 3.0 Extended Temperature Pentium(R) Processor with MMXTM Technology Packaging Information 3.1 Differences from Desktop Processors The following features have been eliminated in the Extended Temperature Pentium processor with MMX technology: Upgrade, Dual Processing (DP), and Master/Checker functional redundancy. Table 1 lists the corresponding pins that exist on the Pentium processor with MMX technology but have been removed on the Extended Temperature Pentium processor with MMX technology. Table 1. Signals Removed from the Extended Temperature Pentium(R) Processor with MMXTM Technology Signal Function ADSC# Additional Address Status. This signal is mainly used for large or standalone L2 cache memory subsystem support required for high-performance desktop or server models. BRDYC# Additional Burst Ready. This signal is mainly used for large or standalone L2 cache memory subsystem support required for high-performance desktop or server models. CPUTYP CPU Type. This signal is used for dual processing systems. D/P# Dual/Primary processor identification. This signal is only used for an upgrade processor. FRCMC# Functional Redundancy Checking. This signal is only used for error detection via processor redundancy and requires two Pentium processors (master/checker). PBGNT# Private Bus Grant. This signal is only used for dual processing systems. PBREQ# Private Bus Request. This signal is used only for dual processing systems. PHIT# Private Hit. This signal is only used for dual processing systems. PHITM# Private Modified Hit. This signal is only used for dual processing systems. Advance Information Datasheet 13 Extended Temperature Pentium(R) Processor with MMXTM Technology 3.2 HL-PBGA Pinout and Pin Descriptions Figure 2. HL-PBGA Package Top Side View A B C 1 2 3 4 5 INC INC INC INC HOLD INC INC APCHK# PRDY HLDA BREQ VSS PCHK# D E F G H J K L M N P R T U V W Y AA AB AC AD AE AF 6 SMIACT# VSS 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 BOFF# KEN# AHOLD M/IO# PM1/BP1 IERR# WB/WT# EWBE# PM0/BP0 VSS NA# BRDY# INV VCC2 VSS VCC2 VSS VSS VSS D61 D59 D57 DP6 D54 VSS BP2 FERR# DP7 D62 D60 D58 D56 D55 D53 BP3 VSS VSS VSS VSS VSS VSS VSS VCC3 VCC2 VCC3 VCC3 VSS VCC3 VCC2 VCC3 VCC2 D52 D51 D50 D49 VCC2 VCC3 INC INC INC D48 D47 D46 D43 DP5 VSS D44 D41 INC AP VSS VCC3 VCC3 D45 D42 DP4 INC VSS VSS VCC2 VCC3 VSS D40 D38 D/C# VSS VCC2 VCC3 VCC3 VSS D39 D37 PWT PCD VCC3 VCC3 VSS D35 D36 ADS# VSS INC VCC3 VSS D32 D34 FLUSH# HIT# HITM# VCC3 VCC3 VSS D31 D33 VCC3 VCC3 D26 D29 DP3 INC VCC2 VSS D27 D30 VSS D24 D25 D28 VCC3 W/R# BE0# BUSCHK# VSS BE2# BE1# A20M# BE3# BE4# VSS VCC3 BE5# BE7# VSS VCC3 CLK VSS VSS BE6# SCYC RESET VCC2 VCC2 VCC2 VCC3 VCC2 VSS VSS VSS Top View D22 D23 DP2 VSS D21 D20 D19 VCC2 VCC3 VSS D17 D18 A19 VSS VCC3 VCC3 VSS DP1 D16 A20 A18 VSS VCC2 VCC3 VSS D13 D15 VSS VCC3 D9 D11 D14 VSS VSS DP0 D10 D12 A17 A16 VSS VCC3 VCC2 V CC3 VSS VCC3 D5 D7 D8 A14 VSS VCC2 VCC3 VSS D4 D6 INC A13 VCC2 VSS VCC3 VCC2 D2 D3 INC A12 A11 VSS VCC2 VCC3 VCC2 VCC3 VCC2 D0 D1 INC INC A10 VSS VSS VCC3 VSS INC A9 A8 A7 A5 INC INC INC A6 1 2 3 4 A15 VCC3 VCC2 VCC3 VCC3 VCC3 INC VCC2 VCC2 VCC2 VCC2 INC VSS VSS VSS SMI# NMI/LINT1 INIT BF[0] BF[2] VSS VCC3 VCC2 VCC2 VSS VSS VCC2 VCC2 VCC2 VSS VSS VSS PICD[0] VSS INC INC VSS VSS TDI TCK PICCLK INC INC INC TRST# TMS TD0 INC INC VSS VSS VSS VSS VSS A3 A31 A29 A27 A25 A22 A4 A30 A28 A26 A24 A23 A21 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 RS# VCC2 VCC2 IGNNE# PEN# BF[1] STPCLK# NC INTR/LINT0 PICD[1] INC B C E NC VCC3 V CC2 A D LOCK# EADS# VCC2 VCC3 VCC2 CACHE# D63 INC F G H J K L M N P R T U V W Y AA AB AC AD AE AF A4694-01 14 Advance Information Datasheet Extended Temperature Pentium(R) Processor with MMXTM Technology Figure 3. HL-PBGA Package Pin Side View 26 25 24 23 22 21 20 19 18 17 16 15 14 13 12 11 10 9 A B C INC INC INC INC D51 D52 D54 DP6 D57 D59 D43 D46 D47 D48 D49 D50 D53 D55 D56 D58 VSS VSS D41 D44 VSS DP5 VCC3 DP4 D42 D45 VCC3 D38 D40 VSS D37 D39 D36 D G H J K L M N P R T U V W Y AA AB AC AD AE AF VSS D63 IERR# 7 6 5 PM1/BP1 M/IO# EWBE# AHOLD KEN# BOFF# HOLD PM0/BP0 WB/WT# D60 D62 DP7 FERR# BP2 VSS VSS VSS VSS BP3 VSS VSS CACHE# VSS VCC3 VCC2 VCC3 VCC2 VCC2 VCC3 VCC3 INV BRDY# NA# VSS VCC2 VSS VCC2 VSS VCC2 VSS VCC2 SMIACT# 4 3 INC INC INC INC PRDY APCHK# INC INC VSS PCHK# VSS BREQ HLDA AP LOCK# VCC3 VCC2 VSS VSS INC VSS VCC3 VCC3 VCC2 VSS D/C# D35 VSS VCC3 VCC3 PCD PWT EADS# D34 D32 VSS VCC3 INC VSS ADS# W/R# VSS VSS VCC2 VCC3 VCC2 D33 D31 VSS VCC3 VCC3 HITM# HIT# FLUSH# DP3 D29 D26 VCC3 VCC3 D30 D27 VSS VCC2 INC D28 D25 D24 VSS VCC3 VSS BE4# BE3# VCC3 VSS BE7# BE5# VSS VSS CLK BE6# Bottom View VSS BE0# BUSCHK# A20M# BE1# BE2# DP2 D23 D22 VCC3 D19 D20 D21 VSS D18 D17 VSS VCC3 VCC2 VCC2 RESET SCYC D16 DP1 VSS VCC3 VCC3 VSS A19 NC D15 D13 VSS VCC3 VCC2 VSS A18 A20 VCC3 VSS VCC2 VCC3 D14 D11 D9 D12 D10 DP0 VSS VSS VCC3 VSS VCC3 VCC2 A15 VSS A17 A16 D8 D7 D5 VCC3 INC D6 D4 VSS VCC3 VCC2 VSS A14 INC D3 D2 VCC2 VCC3 VSS VCC2 A13 INC D1 D0 VCC2 VCC3 VCC2 VCC2 VCC2 VCC2 VCC3 VCC2 VCC2 VCC2 VCC2 VSS VSS VCC2 VSS VSS VSS VSS VSS VSS TDI VSS VSS VCC2 VCC2 BF[2] BF[0] INIT SMI# INC PICD[1] TD0 TMS INC INC VSS PICD[0] VSS INC INC INC PICCLK TCK INC INC INC TRST# INC VCC3 VCC3 VCC3 VCC2 VCC3 VCC2 VCC3 VCC2 VSS A11 A12 INC VSS VSS VSS VSS VSS VSS VCC3 VSS VSS A10 INC A22 A25 A27 A29 A31 A3 A5 A7 A8 A9 INC A21 A23 A24 A26 A28 A30 A4 A6 INC INC INC 5 4 3 NMI/LINT1 NC STPCLK# BF[1] PEN# IGNNE# RS# INTR/LINT0 26 25 24 23 22 21 20 19 18 17 16 15 14 13 12 11 10 9 8 7 6 A B C D VSS VSS VCC3 VCC2 2 1 VCC3 E F VCC2 VCC3 D61 8 E F G H J K L M N P R T U V W Y AA AB AC AD AE AF 2 1 A4695-01 Advance Information Datasheet 15 Extended Temperature Pentium(R) Processor with MMXTM Technology Table 2. Pin Cross Reference by Pin Name (Sheet 1 of 2) Pin Location Pin Location Pin Location Pin Location Address A3 AE6 A11 AC2 A19 T2 A27 AE9 A4 AF5 A12 AC1 A20 U1 A28 AF7 A5 AE5 A13 AB1 A21 AF11 A29 AE8 A6 AF4 A14 AA1 A22 AE11 A30 AF6 A7 AE4 A15 Y1 A23 AF10 A31 AE7 A8 AE3 A16 W1 A24 AF9 A9 AE2 A17 V1 A25 AE10 A10 AD2 A18 U2 A26 AF8 D0 AC24 D16 T26 D32 H25 D48 B23 D1 AC25 D17 R25 D33 J26 D49 B22 D2 AB24 D18 R26 D34 H26 D50 B21 D3 AB25 D19 P26 D35 G25 D51 A22 D4 AA24 D20 P25 D36 G26 D52 A21 D5 Y24 D21 P24 D37 F26 D53 B20 D6 AA25 D22 N24 D38 E26 D54 A20 Data D7 Y25 D23 N25 D39 F25 D55 B19 D8 Y26 D24 M24 D40 E25 D56 B18 D9 V24 D25 M25 D41 C26 D57 A18 D10 W25 D26 K24 D42 D25 D58 B17 D11 V25 D27 L25 D43 B26 D59 A17 D12 W26 D28 M26 D44 C25 D60 B16 D13 U25 D29 K25 D45 D24 D61 A16 D14 V26 D30 L26 D46 B25 D62 B15 D15 U26 D31 J25 D47 B24 D63 A15 A12 Control A20M# L3 BREQ C2 HITM# J3 PM1/BP1 ADS# H2 BUSCHK# K2 HLDA C1 PRDY B4 AHOLD A9 CACHE# B10 HOLD A5 PWT G2 AP D2 D/C# F1 IERR# A14 R/S# AF12 APCHK# B3 DP0 W24 IGNNE# AF14 RESET R2 BE0# K1 DP1 T25 INIT AE14 SCYC R1 N26 INTR/ LINT0 AF13 SMI# AE13 BE1# 16 L2 DP2 BE2# L1 DP3 K26 INV B9 SMIACT# B5 BE3# M1 DP4 D26 KEN# A8 TCK AE22 BE4# M2 DP5 C23 LOCK# D1 TDI AE21 BE5# N1 DP6 A19 M/IO# A11 TDO AF21 BE6# P1 DP7 B14 NA# B7 TMS AF20 BE7# N2 EADS# G1 NMI/LINT1 AE12 TRST# AF19 BOFF# A7 EWBE# A10 PCD G3 W/R# H1 BP2 B12 FERR# B13 PCHK# C4 WB/WT# A6 Advance Information Datasheet Extended Temperature Pentium(R) Processor with MMXTM Technology Table 2. Pin Cross Reference by Pin Name (Sheet 2 of 2) Pin Location Pin Location Pin Location BP3 C11 FLUSH# BRDY# B8 HIT# J1 PEN# AF15 J2 PM0/BP0 A13 Pin Location CLK P2 APIC PICCLK AE23 PICD0 AD23 BF0 AE15 BF1 AF16 STPCLK# AF17 PICD1 [APICEN] AF22 Clock Control Table 3. BF2 AE16 No Connect, Power Supply and Ground Pin Cross Reference VCC2 C6 D9 D19 R4 AB2 AC13 AC19 AE17 C8 D12 E4 U4 AB23 AC14 AC20 AE18 C21 D13 F3 V3 AC4 AC15 AC21 D5 D15 L23 Y2 AC6 AC16 AC23 D7 D17 R3 AA3 AC8 AC18 AD19 VCC3 C20 D14 F23 J23 N23 V2 AA4 C22 D16 G4 K4 R23 V23 AB4 AC10 AC11 D4 D18 G23 K23 T4 W3 AC5 AC17 D6 D23 H23 M4 T23 Y3 AC7 AC22 D10 E23 J4 N4 U23 Y23 AC9 AD5 D11 F4 B6 C14 D20 H3 P4 W4 AD6 AD16 VSS B11 C15 D21 H24 P23 W23 AD7 AD17 C3 C16 D22 J24 R24 Y4 AD8 AD18 C5 C17 E2 K3 T3 AA2 AD9 AD20 C7 C18 E3 L24 T24 AA23 AD10 AD21 C9 C19 E24 M3 U3 AB3 AD11 AD22 C10 C24 F2 M23 U24 AC3 AD13 AD24 C12 D3 F24 N3 V4 AD3 AD14 AE19 C13 D8 G24 P3 W2 AD4 AD15 AE20 AD26 AE26 AF23 AF24 No Connect (NC) AF18 T1 A1 A23 B1 L4 A2 A24 B2 AA26 AD1 AE1 AF1 A3 A25 E1 AB26 AD12 AE24 AF2 AF25 A4 A26 H4 AC12 AD25 AE25 AF3 AF26 Internal No Connect (INC) Advance Information Datasheet AC26 17 Extended Temperature Pentium(R) Processor with MMXTM Technology 3.3 Design Notes For reliable operation, always connect unused inputs to an appropriate signal level. Unused active low inputs should be connected to VCC3. Unused active high inputs should be connected to GND (VSS). No Connect (NC) pins must remain unconnected. Connection of NC pins may result in component failure or incompatibility with processor steppings. 3.4 Pin Quick Reference This section gives a brief functional description of each pin. For a detailed description, see the Hardware Interface chapter in the Embedded Pentium(R) Processor Family Developer's Manual. Note: All input pins must meet their AC/DC specifications to guarantee proper functional behavior. The # symbol at the end of a signal name indicates that the active or asserted state occurs when the signal is at a low voltage. When a # symbol is not present after the signal name, the signal is active, or asserted at the high voltage level. Square brackets around a signal name indicate that the signal is defined only at RESET. The pins are classified as Input or Output based on their function in Master Mode. See the Error Detection chapter of the Embedded Pentium(R) Processor Family Developer's Manual (order number 273204) for further information. Table 4. Quick Pin Reference (Sheet 1 of 6) Symbol 18 Type Name and Function A20M# I When the address bit 20 mask pin is asserted, the Pentium(R) processor with MMXTM technology emulates the address wraparound at 1 Mbyte, which occurs on the 8086. When A20M# is asserted, the processor masks physical address bit 20 (A20) before performing a lookup to the internal caches or driving a memory cycle on the bus. The effect of A20M# is undefined in protected mode. A20M# must be asserted only when the processor is in real mode. A31-A3 I/O As outputs, the address lines of the processor along with the byte enables define the physical area of memory or I/O accessed. The external system drives the inquire address to the processor on A31-A5. ADS# O The address status indicates that a new valid bus cycle is currently being driven by the processor. AHOLD I In response to the assertion of address hold, the processor will stop driving the address lines (A31-A3) and AP in the next clock. The rest of the bus will remain active so data can be returned or driven for previously issued bus cycles. AP I/O Address parity is driven by the processor with even parity information on all processor generated cycles in the same clock that the address is driven. Even parity must be driven back to the processor during inquire cycles on this pin in the same clock as EADS# to ensure that correct parity check status is indicated. APCHK# O The address parity check status pin is asserted two clocks after EADS# is sampled active if the processor has detected a parity error on the address bus during inquire cycles. APCHK# will remain active for one clock each time a parity error is detected. BE7#-BE5# BE4#-BE0# O I/O The byte enable pins are used to determine which bytes must be written to external memory, or which bytes were requested by the CPU for the current cycle. The byte enables are driven in the same clock as the address lines (A31-3). Advance Information Datasheet Extended Temperature Pentium(R) Processor with MMXTM Technology Table 4. Quick Pin Reference (Sheet 2 of 6) Symbol Type Name and Function The Bus Frequency pins determine the bus-to-core frequency ratio. BF [2:0] are sampled at RESET, and cannot be changed until another non-warm (1 ms) assertion of RESET. Additionally, BF[2:0] must not change values while RESET is active. See Table 5 for Bus Frequency Selection. BF2-BF0 I In order to override the internal defaults and guarantee that the BF[2:0] inputs remain stable while RESET is active, these pins should be strapped directly to or through a pullup/pulldown resistor to VCC3 or ground. Driving these pins with active logic is not recommended unless stability during RESET can be guaranteed. During power up, RESET should be asserted prior to or ramped simultaneously with the core voltage supply to the processor. BOFF# [APICEN] PICD1 BP3-BP2 PM/BP1-BP0 I The backoff input is used to abort all outstanding bus cycles that have not yet completed. In response to BOFF#, the processor will float all pins normally floated during bus hold in the next clock. The processor remains in bus hold until BOFF# is negated, at which time the processor restarts the aborted bus cycle(s) in their entirety. I Advanced Programmable Interrupt Controller Enable enables or disables the on-chip APIC interrupt controller. If sampled high at the falling edge of RESET, the APIC is enabled. APICEN shares a pin with the PICD1 signal. The breakpoint pins (BP3-0) correspond to the debug registers, DR3-DR0. These pins externally indicate a breakpoint match when the debug registers are programmed to test for breakpoint matches. O BP1 and BP0 are multiplexed with the performance monitoring pins (PM1 and PM0). The PB1 and PB0 bits in the Debug Mode Control Register determine if the pins are configured as breakpoint or performance monitoring pins. The pins come out of RESET configured for performance monitoring. BRDY# I The burst ready input indicates that the external system has presented valid data on the data pins in response to a read or that the external system has accepted the processor data in response to a write request. This signal is sampled in the T2, T12 and T2P bus states. BREQ O The bus request output indicates to the external system that the processor has internally generated a bus request. This signal is always driven whether or not the processor is driving its bus. The bus check input allows the system to signal an unsuccessful completion of a bus cycle. If this pin is sampled active, the processor will latch the address and control signals in the machine check registers. If, in addition, the MCE bit in CR4 is set, the processor will vector to the machine check exception. BUSCHK# CACHE# I O To assure that BUSCHK# will always be recognized, STPCLK# must be deasserted any time BUSCHK# is asserted by the system, before the system allows another external bus cycle. If BUSCHK# is asserted by the system for a snoop cycle while STPCLK# remains asserted, usually (if MCE=1) the processor will vector to the exception after STPCLK# is deasserted. But if another snoop to the same line occurs during STPCLK# assertion, the processor can lose the BUSCHK# request. For processor-initiated cycles, the cache pin indicates internal cacheability of the cycle (if a read), and indicates a burst writeback cycle (if a write). If this pin is driven inactive during a read cycle, the processor will not cache the returned data, regardless of the state of the KEN# pin. This pin is also used to determine the cycle length (number of transfers in the cycle). The clock input provides the fundamental timing for the processor. Its frequency is the operating frequency of the processor external bus and requires TTL levels. All external timing parameters except TDI, TDO, TMS, TRST# and PICD0-1 are specified with respect to the rising edge of CLK. CLK I This pin is 2.5 V-tolerant-only on the Extended Temperature Pentium processor with MMX technology. It is recommended that CLK begin 150 ms after VCC reaches its proper operating level. This recommendation is only to assure the long term reliability of the device. Advance Information Datasheet 19 Extended Temperature Pentium(R) Processor with MMXTM Technology Table 4. Quick Pin Reference (Sheet 2 of 6) Symbol Type Name and Function The Bus Frequency pins determine the bus-to-core frequency ratio. BF [2:0] are sampled at RESET, and cannot be changed until another non-warm (1 ms) assertion of RESET. Additionally, BF[2:0] must not change values while RESET is active. See Table 5 for Bus Frequency Selection. BF2-BF0 I In order to override the internal defaults and guarantee that the BF[2:0] inputs remain stable while RESET is active, these pins should be strapped directly to or through a pullup/pulldown resistor to VCC3 or ground. Driving these pins with active logic is not recommended unless stability during RESET can be guaranteed. During power up, RESET should be asserted prior to or ramped simultaneously with the core voltage supply to the processor. BOFF# [APICEN] PICD1 BP3-BP2 PM/BP1-BP0 I The backoff input is used to abort all outstanding bus cycles that have not yet completed. In response to BOFF#, the processor will float all pins normally floated during bus hold in the next clock. The processor remains in bus hold until BOFF# is negated, at which time the processor restarts the aborted bus cycle(s) in their entirety. I Advanced Programmable Interrupt Controller Enable enables or disables the on-chip APIC interrupt controller. If sampled high at the falling edge of RESET, the APIC is enabled. APICEN shares a pin with the PICD1 signal. The breakpoint pins (BP3-0) correspond to the debug registers, DR3-DR0. These pins externally indicate a breakpoint match when the debug registers are programmed to test for breakpoint matches. O BP1 and BP0 are multiplexed with the performance monitoring pins (PM1 and PM0). The PB1 and PB0 bits in the Debug Mode Control Register determine if the pins are configured as breakpoint or performance monitoring pins. The pins come out of RESET configured for performance monitoring. BRDY# I The burst ready input indicates that the external system has presented valid data on the data pins in response to a read or that the external system has accepted the processor data in response to a write request. This signal is sampled in the T2, T12 and T2P bus states. BREQ O The bus request output indicates to the external system that the processor has internally generated a bus request. This signal is always driven whether or not the processor is driving its bus. The bus check input allows the system to signal an unsuccessful completion of a bus cycle. If this pin is sampled active, the processor will latch the address and control signals in the machine check registers. If, in addition, the MCE bit in CR4 is set, the processor will vector to the machine check exception. BUSCHK# CACHE# I O To assure that BUSCHK# will always be recognized, STPCLK# must be deasserted any time BUSCHK# is asserted by the system, before the system allows another external bus cycle. If BUSCHK# is asserted by the system for a snoop cycle while STPCLK# remains asserted, usually (if MCE=1) the processor will vector to the exception after STPCLK# is deasserted. But if another snoop to the same line occurs during STPCLK# assertion, the processor can lose the BUSCHK# request. For processor-initiated cycles, the cache pin indicates internal cacheability of the cycle (if a read), and indicates a burst writeback cycle (if a write). If this pin is driven inactive during a read cycle, the processor will not cache the returned data, regardless of the state of the KEN# pin. This pin is also used to determine the cycle length (number of transfers in the cycle). The clock input provides the fundamental timing for the processor. Its frequency is the operating frequency of the processor external bus and requires TTL levels. All external timing parameters except TDI, TDO, TMS, TRST# and PICD0-1 are specified with respect to the rising edge of CLK. CLK I This pin is 2.5 V-tolerant-only on the Extended Temperature Pentium processor with MMX technology. It is recommended that CLK begin 150 ms after VCC reaches its proper operating level. This recommendation is only to assure the long term reliability of the device. 20 Advance Information Datasheet Extended Temperature Pentium(R) Processor with MMXTM Technology Table 4. Quick Pin Reference (Sheet 3 of 6) Symbol D/C# D63-D0 DP7-DP0 EADS# EWBE# FERR# FLUSH# Type Name and Function O The data/code output is one of the primary bus cycle definition pins. It is driven valid in the same clock as the ADS# signal is asserted. D/C# distinguishes between data and code or special cycles. I/O These are the 64 data lines for the processor. Lines D7-D0 define the least significant byte of the data bus; lines D63-D56 define the most significant byte of the data bus. When the CPU is driving the data lines, they are driven during the T2, T12 or T2P clocks for that cycle. During reads, the CPU samples the data bus when BRDY# is returned. I/O These are the data parity pins for the processor. There is one for each byte of the data bus. They are driven by the processor with even parity information on writes in the same clock as write data. Even parity information must be driven back to the Pentium processor with voltage reduction technology on these pins in the same clock as the data to ensure that the correct parity check status is indicated by the processor. DP7 applies to D63-D56; DP0 applies to D7-D0. I This signal indicates that a valid external address has been driven onto the processor address pins to be used for an inquire cycle. I The external write buffer empty input, when inactive (high), indicates that a write cycle is pending in the external system. When the processor generates a write and EWBE# is sampled inactive, the processor will hold off all subsequent writes to all E- or M-state lines in the data cache until all write cycles have completed, as indicated by EWBE# being active. O The floating-point error pin is driven active when an unmasked floating-point error occurs. FERR# is similar to the ERROR# pin on the Intel387TM math coprocessor. FERR# is included for compatibility with systems using MS-DOS type floating-point error reporting. I When asserted, the cache flush input forces the processor to write back all modified lines in the data cache and invalidate its internal caches. A Flush Acknowledge special cycle will be generated by the processor indicating completion of the writeback and invalidation. If FLUSH# is sampled low when RESET transitions from high to low, three-state test mode is entered. O The hit indication is driven to reflect the outcome of an inquire cycle. If an inquire cycle hits a valid line in either the data or instruction cache, this pin is asserted two clocks after EADS# is sampled asserted. If the inquire cycle misses the cache, this pin is negated two clocks after EADS#. This pin changes its value only as a result of an inquire cycle and retains its value between the cycles. O The hit to a modified line output is driven to reflect the outcome of an inquire cycle. It is asserted after inquire cycles which resulted in a hit to a modified line in the data cache. It is used to inhibit another bus master from accessing the data until the line is completely written back. HLDA O The bus hold acknowledge pin goes active in response to a hold request driven to the processor on the HOLD pin. It indicates that the processor has floated most of the output pins and relinquished the bus to another local bus master. When leaving bus hold, HLDA will be driven inactive and the processor will resume driving the bus. If the processor has a bus cycle pending, it will be driven in the same clock that HLDA is de-asserted. HOLD I In response to the bus hold request, the processor will float most of its output and input/output pins and assert HLDA after completing all outstanding bus cycles. The processor will maintain its bus in this state until HOLD is de-asserted. HOLD is not recognized during LOCK cycles. The processor will recognize HOLD during reset. IERR# O The internal error pin is used to indicate internal parity errors. If a parity error occurs on a read from an internal array, the processor will assert the IERR# pin for one clock and then shutdown. HIT# HITM# Advance Information Datasheet 21 Extended Temperature Pentium(R) Processor with MMXTM Technology Table 4. Quick Pin Reference (Sheet 4 of 6) Symbol IGNNE# INIT Type I I Name and Function This is the ignore numeric error input. This pin has no effect when the NE bit in CR0 is set to 1. When the CR0.NE bit is 0, and the IGNNE# pin is asserted, the processor will ignore any pending unmasked numeric exception and continue executing floating-point instructions for the entire duration that this pin is asserted. When the CR0.NE bit is 0, IGNNE# is not asserted, a pending unmasked numeric exception exists (SW.ES = 1), and the floating-point instruction is one of FINIT, FCLEX, FSTENV, FSAVE, FSTSW, FSTCW, FENI, FDISI, or FSETPM, the processor will execute the instruction in spite of the pending exception. When the CR0.NE bit is 0, IGNNE# is not asserted, a pending unmasked numeric exception exists (SW.ES = 1), and the floating-point instruction is one other than FINIT, FCLEX, FSTENV, FSAVE, FSTSW, FSTCW, FENI, FDISI, or FSETPM, the processor will stop execution and wait for an external interrupt. The processor initialization input pin forces the processor to begin execution in a known state. The processor state after INIT is the same as the state after RESET except that the internal caches, write buffers, and floating-point registers retain the values they had prior to INIT. INIT may NOT be used in lieu of RESET after power up. If INIT is sampled high when RESET transitions from high to low, the processor will perform built-in self test prior to the start of program execution. 22 INTR I An active maskable interrupt input indicates that an external interrupt has been generated. If the IF bit in the EFLAGS register is set, the processor will generate two locked interrupt acknowledge bus cycles and vector to an interrupt handler after the current instruction execution is completed. INTR must remain active until the first interrupt acknowledge cycle is generated to assure that the interrupt is recognized. INV I The invalidation input determines the final cache line state (S or I) in case of an inquire cycle hit. It is sampled together with the address for the inquire cycle in the clock EADS# is sampled active. KEN# I The cache enable pin is used to determine whether the current cycle is cacheable or not and is consequently used to determine cycle length. When the processor generates a cycle that can be cached (CACHE# asserted) and KEN# is active, the cycle will be transformed into a burst line fill cycle. LOCK# O The bus lock pin indicates that the current bus cycle is locked. The processor will not allow a bus hold when LOCK# is asserted (but AHOLD and BOFF# are allowed). LOCK# goes active in the first clock of the first locked bus cycle and goes inactive after the BRDY# is returned for the last locked bus cycle. LOCK# is guaranteed to be de-asserted for at least one clock between back-to-back locked cycles. M/IO# O The memory/input-output is one of the primary bus cycle definition pins. It is driven valid in the same clock as the ADS# signal is asserted. M/IO# distinguishes between memory and I/O cycles. NA# I An active next address input indicates that the external memory system is ready to accept a new bus cycle although all data transfers for the current cycle have not yet completed. The processor will issue ADS# for a pending cycle two clocks after NA# is asserted. The processor supports up to two outstanding bus cycles. NMI I The non-maskable interrupt request signal indicates that an external nonmaskable interrupt has been generated. PCD O The page cache disable pin reflects the state of the PCD bit in CR3; Page Directory Entry or Page Table Entry. The purpose of PCD is to provide an external cacheability indication on a page-by-page basis. PCHK# O The parity check output indicates the result of a parity check on a data read. It is driven with parity status two clocks after BRDY# is returned. PCHK# remains low one clock for each clock in which a parity error was detected. Parity is checked only for the bytes on which valid data is returned. Advance Information Datasheet Extended Temperature Pentium(R) Processor with MMXTM Technology Table 4. Quick Pin Reference (Sheet 5 of 6) Symbol Type Name and Function PEN# I The parity enable input (along with CR4.MCE) determines whether a machine check exception will be taken as a result of a data parity error on a read cycle. If this pin is sampled active in the clock, a data parity error is detected. The processor will latch the address and control signals of the cycle with the parity error in the machine check registers. If, in addition, the machine check enable bit in CR4 is set to "1", the processor will vector to the machine check exception before the beginning of the next instruction. PICCLK I The APIC interrupt controller serial data bus clock is driven into the programmable interrupt controller clock input of the Pentium processor with MMX technology. PICD0- PICD1 I/O Programmable interrupt controller data lines 0-1 of the Pentium processor with MMX technology comprise the data portion of the APIC 3-wire bus. They are opendrain outputs that require external pull-up resistor. These signals are multiplexed with APICEN. [APICEN] These pins function as part of the performance monitoring feature. The breakpoint 1-0 pins are multiplexed with the performance monitoring 1-0 pins. The PB1 and PB0 bits in the Debug Mode Control Register determine if the pins are configured as breakpoint or performance monitoring pins. The pins come out of RESET configured for performance monitoring. PM/BP[1:0] O PRDY O The probe ready output pin indicates that the processor has stopped normal execution in response to the R/S# pin going active or Probe Mode being entered. PWT O The page writethrough pin reflects the state of the PWT bit in CR3, the page directory entry, or the page table entry. The PWT pin is used to provide an external writeback indication on a page-by-page basis. R/S# I The run/stop input is provided for use with the Intel debug port. Please refer to the Embedded Pentium(R) Processor Family Developer's Manual (Order Number 273204) for more details. RESET I RESET forces the processor to begin execution at a known state. All the processor internal caches will be invalidated upon the RESET. Modified lines in the data cache are not written back. FLUSH# and INIT are sampled when RESET transitions from high to low to determine if three-state test mode will be entered or if BIST will be run. SCYC O The split cycle output is asserted during misaligned LOCKed transfers to indicate that more than two cycles will be locked together. This signal is defined for locked cycles only. It is undefined for cycles which are not locked. SMI# I The system management interrupt causes a system management interrupt request to be latched internally. When the latched SMI# is recognized on an instruction boundary, the processor enters System Management Mode. SMIACT# O An active system management interrupt active output indicates that the processor is operating in System Management Mode. STPCLK# I Assertion of the stop clock input signifies a request to stop the internal clock of the Pentium processor with voltage reduction technology thereby causing the core to consume less power. When the CPU recognizes STPCLK#, the processor will stop execution on the next instruction boundary, unless superseded by a higher priority interrupt, and generate a Stop Grant Acknowledge cycle. When STPCLK# is asserted, the processor will still respond to external snoop requests. TCK I The testability clock input provides the clocking function for the processor boundary scan in accordance with the IEEE Boundary Scan interface (Standard 1149.1). It is used to clock state information and data into and out of the processor during boundary scan. TDI I The test data input is a serial input for the test logic. TAP instructions and data are shifted into the processor on the TDI pin on the rising edge of TCK when the TAP controller is in an appropriate state. Advance Information Datasheet 23 Extended Temperature Pentium(R) Processor with MMXTM Technology Table 4. Quick Pin Reference (Sheet 6 of 6) Symbol Type Name and Function TDO O The test data output is a serial output of the test logic. TAP instructions and data are shifted out of the processor on the TDO pin on TCK's falling edge when the TAP controller is in an appropriate state. TMS I The value of the test mode select input signal sampled at the rising edge of TCK controls the sequence of TAP controller state changes. TRST# I When asserted, the test reset input allows the TAP controller to be asynchronously initialized. VCC2DET# 3.5 N/A Differentiate between the Pentium Processor with MMX technology and the Extended Temperature Pentium processor with MMX technology. This is an Internal No Connect (INC) pin on the Extended Temperature Pentium processor with MMX technology. This pin is not defined on the HL-PBGA package. VCC2 I These pins are the power inputs to the core: 1.9 V input for 166/266 MHz PPGA; 1.8 V for 166 MHz HL-PBGA; 2.0 V for 166 MHz HL-PBGA. VCC3 I These pins are the 2.5 V power inputs to the I/O. VSS I These pins are the ground inputs. W/R# O Write/read is one of the primary bus cycle definition pins. It is driven valid in the same clock as the ADS# signal is asserted. W/R# distinguishes between write and read cycles. WB/WT# I The writeback/writethrough input allows a data cache line to be defined as writeback or writethrough on a line-by-line basis. As a result, it determines whether a cache line is initially in the S or E state in the data cache. Bus Fraction (BF) Selection Each Extended Temperature Pentium processor with MMX technology must be externally configured with the BF2-BF0 pins to operate in the specified bus fraction mode. Operation out of the specification is not supported. For example, a 166 MHz Extended Temperature Pentium processor with MMX technology supports only 2/5 mode. The BF configuration pins are provided to select the allowable bus/core ratio of 2/5. The Extended Temperature Pentium processor with MMX technology multiplies the input CLK to achieve the higher internal core frequencies. The internal clock generator requires a constant frequency CLK input to within 250 ps; therefore, the CLK input cannot be changed dynamically. The external bus frequency is set during power-up Reset through the CLK pin. The Extended Temperature Pentium processor with MMX technology samples the BF0, BF1 and BF2 pins on the falling edge of RESET to determine which bus/core ratio to use. Table 5 summarizes the operation of the BF pins on the Extended Temperature Pentium processor with MMX technology. Note: 24 BF pins must meet a 1 ms setup time to the falling edge of RESET and must not change value while RESET is active. Once a frequency is selected, it may not be changed with a warm reset. Changing this speed or ratio requires a "power on" RESET pulse initialization. Advance Information Datasheet Extended Temperature Pentium(R) Processor with MMXTM Technology Table 5. Bus Frequency Selection BF2 BF1 BF0 Bus/Core Ratio Max Bus/Core Frequency (MHz) 0 0 0 2/5 66/166 NOTE: All other BF2-BF0 settings are reserved on the Extended Temperature Pentium processor with MMX technology. 3.6 The CPUID Instruction The CPUID instruction allows software to determine the type and features of the processor on which it is executing. When executing CPUID, the Extended Temperature Pentium processor with MMX technology behaves like the Pentium processor and the Pentium processor with MMX technology as follows: * If the value in EAX is `0', then the 12-byte ASCII string "Genuine Intel" (little endian) is returned in EBX, EDX and ECX. Also, a `1' is returned to EAX. * If the value in EAX is `1', then the processor version is returned in EAX and the processor capabilities are returned in EDX. The values of EAX and EDX for the Extended Temperature Pentium processor with MMX technology are given below. * If the value in EAX is neither `0' nor `1', the Extended Temperature Pentium processor with MMX technology writes `0' to all registers. The following EAX and EDX values are defined for the CPUID instruction executed with EAX = `1'. The processor version EAX bit assignments are given in Figure 4. The EDX bit assignments are shown in Figure 5. Figure 4. EAX Bit Assignments for CPUID 31 14 13 12 11 0 (Reserved) 87 Type Family 43 0 Model Stepping 000250 Figure 5. EDX Bit Assignments for CPUID 31 24 23 22 Reserved M M X 16 15 14 13 12 11 10 9 8 7 6 5 4 3 2 1 0 Reserved C M A M P C M P M T P V F M T P E Rsvd C G X C A S S S M P O R I D A E S E E R C E E U V R C 000251 Advance Information Datasheet 25 Extended Temperature Pentium(R) Processor with MMXTM Technology The type field for Extended Temperature Pentium processor with MMX technology is the same as Pentium processor with MMX technology (type = 00H). The family field is the same as all other Pentium processors (family = 5H). However, the model field is different: the Pentium processor model number is 2H, the Pentium processor with MMX technology model number is 4H, and the Extended Temperature Pentium processor with MMX technology model number is 8H. The stepping field indicates the revision number of a model. The stepping ID of A-step for the Extended Temperature Pentium processor with MMX technology is 1H. Stepping ID will be documented in the Extended Temperature Pentium processor with MMX technology stepping information. After masking the reserve bits, all Extended Temperature Pentium processor with MMX technology-based products will get a value of 0x008003BF (assuming the APIC is enabled at boot), or 0x008001BF (when the APIC is disabled, using the APICEN boot pin) in EDX upon completion of the CPUID instruction. Table 6. EDX Bit Assignment Definitions for CPUID 26 Bit Value Comments 0 1 FPU: Floating-point Unit on-chip 1 1 VME: Virtual-8086 Mode Enhancements 2 1 DE: Debugging Extensions 3 1 PSE: Page Size Extension 4 1 TSC: Time Stamp Counter 5 1 MSR Pentium(R) Processor MSR 6 0 PAE: Physical Address Extension 7 1 MCE: Machine Check Exception 8 1 CX8: CMPXCHG8B Instruction 9 1 APIC: APIC on-chip 10-11 R Reserved - Do not write to these bits or rely on their values 12 0 MTRR: Memory Type Range Registers 13 0 PGE: Page Global Enable 14 0 MCA: Machine Check Architecture 15-22 R Reserved - Do not write to these bits or rely on their values 23 1 Intel Architecture with MMXTM technology supported 24-31 R Reserved - Do not write to these bits or rely on their values Indicates that APIC is present and hardware enabled (software disabling does not affect this bit). Advance Information Datasheet Extended Temperature Pentium(R) Processor with MMXTM Technology 3.7 Boundary Scan Chain List The boundary scan chain list for the Extended Temperature Pentium processor with MMX technology is different than the Pentium processor with MMX technology due to the removal of some pins. The boundary scan register for the Extended Temperature Pentium processor with MMX technology contains a cell for each pin. Following is the bit order of the Extended Temperature Pentium processor with MMX technology boundary scan register (left to right, top to bottom): TDI disapsba, PICD1, PICD0, Reserved, PICCLK, D0, D1, D2, D3, D4, D5, D6, D7, DP0, D8, D9, D10, D11, D12, D13, D14, D15, DP1, D16, D17, D18, D19, D20, D21, D22, D23, DP2, D24, D25, D26, D27, D28, D29, D30, D31, DP3, D32, D33, D34, D35, D36, D37, D38, D39, DP4, D40, D41, D42, D43, D44, D45, D46, diswr , D47, DP5, D48, D49, D50, D51, D52, D53, D54, D55, DP6, D56, D57, D58, D59, D60, D61, D62, D63, DP7, IERR#, FERR#, PM0BP0, PM1BP1, BP2, BP3, MIO#, CACHE#, EWBE#, INV, AHOLD, KEN#, BRDYC#, BRDY#, BOFF#, NA#, WBWT#, HOLD, disbus, disbusl, dismisc, dismisca, SMIACT#, PRDY, PCHK#, APCHK#, BREQ, HLDA, AP, LOCK#, PCD, PWT, DC#, EADS#, ADS#, HITM#, HIT#, WR#, BUSCHK#, FLUSH#, A20M#, BE0#, BE1#, BE2#, BE3#, BE4#, BE5#, BE6#, BE7#, SCYC, CLK, RESET, disabus , A20, A19, A18, A17, A16, A15, A14, A13, A12, A11, A10, A9, A8, A7, A6, A5, A4, A3, A31, A30, A29, A28, A27, A26, A25, A24, A23, A22, A21, NMI, RS#, INTR, SMI#, IGNNE#, INIT, PEN#, Reserved, BF0, BF1, BF2, STPCLK#, Reserved, Reserved, Reserved, Reserved TDO "Reserved" includes the no connect "NC" signals on the Extended Temperature Pentium processor with MMX technology. The cells marked with a dagger () are control cells that are used to select the direction of bidirectional pins or three-state the output pins. If "1" is loaded into the control cell, the associated pin(s) are three-stated or selected as input. The following lists the control cells and their corresponding pins: Disabus: A31-A3, AP Disbus: BE7#-BE0#, CACHE#, SCYC, M/IO#, D/C#, W/R#, PWT, PCD Disbusl: ADS#, LOCK#, ADSC# Dismisc: APCHK#, PCHK#, PRDY, BP3, BP2, PM1/BP1, PM0/BP0, FERR#, SMIACT#, BREQ, HLDA, HIT#, HITM# Dismisca: IERR# Diswr: D63-D0, DP7-DP0 Disapsba: PICD1-PICD0 Advance Information Datasheet 27 Extended Temperature Pentium(R) Processor with MMXTM Technology 3.8 Table 7. Pin Reference Tables Output Pins Name (1) Active Level ADS# Low APCHK# Low BE7#-BE4# Low BREQ High CACHE# Low FERR# Low When Floated Bus Hold, BOFF# Bus Hold, BOFF# Bus Hold, BOFF# HIT# Low HITM#(2) Low HLDA High IERR# Low LOCK# Low Bus Hold, BOFF# M/IO#, D/C#, W/R# N/A Bus Hold, BOFF# PCHK# Low BP3-BP2, PM1/BP1, PM0/BP0 High PRDY High PWT, PCD High Bus Hold, BOFF# SCYC High Bus Hold, BOFF# SMIACT# Low TDO N/A All states except Shift-DR and Shift-IR VCC2DET#(3) N/A Differentiates between the Pentium(R) processor with MMXTM technology and the Extended Temperature Pentium processor with MMX technology NOTE: 1. All output and input/output pins are floated during three-state test mode (except TDO). 2. HITM# pin has an internal pull-up resistor. 3. This pin is not on the HL-PBGA pinout. 28 Advance Information Datasheet Extended Temperature Pentium(R) Processor with MMXTM Technology Table 8. Input Pins Name Active Level Synchronous/ Asynchronous Internal Resistor Qualified A20M# LOW Asynchronous AHOLD HIGH Synchronous BF0 N/A Synchronous/RESET Pulldown BF1 N/A Synchronous/RESET Pullup BF2 N/A Synchronous/RESET Pulldown BOFF# LOW Synchronous BRDY# LOW Synchronous Pullup Bus State T2,T12,T2P BUSCHK# LOW Synchronous Pullup BRDY# CLK N/A EADS# LOW Synchronous EWBE# LOW Synchronous FLUSH# LOW Asynchronous HOLD HIGH Synchronous IGNNE# LOW Asynchronous INIT HIGH Asynchronous INTR HIGH Asynchronous INV HIGH Synchronous EADS# KEN# LOW Synchronous First BRDY#/NA# NA# LOW Synchronous Bus State T2,TD,T2P BRDY# NMI HIGH Asynchronous PEN# LOW Synchronous PICCLK HIGH Asynchronous Pullup R/S# N/A Asynchronous Pullup BRDY# RESET HIGH Asynchronous SMI# LOW Asynchronous Pullup STPCLK# LOW Asynchronous Pullup TCK N/A Pullup TDI N/A Synchronous/TCK Pullup TCK TMS N/A Synchronous/TCK Pullup TCK TRST# LOW Asynchronous Pullup WB/WT# N/A Synchronous Advance Information Datasheet First BRDY#/NA# 29 Extended Temperature Pentium(R) Processor with MMXTM Technology Table 9. Input/Output Pins Active Level Name Qualified (when an input) When Floated(1) A31-A3 N/A Address Hold, Bus Hold, BOFF# EADS# AP N/A Address Hold, Bus Hold, BOFF# EADS# BE3#-BE0# LOW Bus Hold, BOFF# RESET Internal Resistor Pulldown(2) D63-D0 N/A Bus Hold, BOFF# BRDY# DP7-DP0 N/A Bus Hold, BOFF# BRDY# PICD0 N/A Pullup PICD1[APICEN] N/A Pulldown NOTE: 1. All output and input/output pins are floated during three-state test mode (except TDO). 2. BE3#-BE0# have pulldowns during RESET only. 3.9 Pin Grouping According to Function Table 10. Pin Functional Grouping Function Clock 30 Pins CLK Initialization RESET, INIT, BF[2:0] Address Bus A31-A3, BE7#-BE0# Address Mask A20M# Data Bus D63-D0 Address Parity AP, APCHK# APIC Support PICCLK, PICD0-PICD1 Data Parity DP7-DP0, PCHK#, PEN# Internal Parity Error IERR# System Error BUSCHK# Bus Cycle Definition M/IO#, D/C#, W/R#, CACHE#, SCYC, LOCK# Bus Control ADS#, BRDY#, NA# Page Cacheability PCD, PWT Cache Control KEN#, WB/WT# Cache Snooping/Consistency AHOLD, EADS#, HIT#, HITM#, INV Cache Flush FLUSH# Write Ordering EWBE# Bus Arbitration BOFF#, BREQ, HOLD, HLDA Interrupts INTR, NMI Floating-point Error Reporting FERR#, IGNNE# System Management Mode SMI#, SMIACT# TAP Port TCK, TMS, TDI, TDO, TRST# Breakpoint/Performance Monitoring PM0/BP0, PM1/BP1, BP3-BP2 Clock Control STPCLK# Debugging R/S#, PRDY Advance Information Datasheet Extended Temperature Pentium(R) Processor with MMXTM Technology 3.10 Mechanical Specifications The HL-PBGA package of the Extended Temperature Pentium processor with MMX technology is a new package type for the Pentium processor family. Package summary information for the HLPBGA device is provided in Table 11. Figure 6 shows the package dimensions. 3.10.1 HL-PBGA Package Mechanical Diagrams Figure 6 shows the HL-PBGA package. The dimensions are listed in Table 11. Figure 6. HL-PBGA Package Dimensions D Pin #1 Corner Pin #1 Corner b E Pin #1 I.D. 1.0 Dia. e S1 Top View Bottom View A C A1 Side View Seating Plane Note: 1. All Dimensions are in Millimeters A5830-01 Table 11. HL-PBGA Package Dimensions (Sheet 1 of 2) Millimeters Symbol Min Max A 1.41 1.67 A1 0.56 0.70 b 0.60 0.90 c 0.85 0.97 D 34.90 35.10 Advance Information Datasheet 31 Extended Temperature Pentium(R) Processor with MMXTM Technology Table 11. HL-PBGA Package Dimensions (Sheet 2 of 2) Millimeters Symbol E 3.11 Min Max 34.90 35.10 e 1.27 S1 1.63 REF Thermal Specifications The Extended Temperature Pentium processor with MMX technology in the HL-PBGA package is specified for proper operation with a case temperature, TCASE (TC ), range of - 40 C to 115 C . 3.11.1 Measuring Thermal Values To verify that the proper TC is maintained, it should be measured at the center of the package top surface (opposite of the pins). The measurement is made in the same way with or without a heatsink attached. When a heatsink is attached, a hole (smaller than 0.150" diameter) should be drilled through the heatsink to allow probing the center of the package. See Figure 7 for an illustration of how to measure TC. To minimize the measurement errors, it is recommended to use the following approach: * Use 36-gauge or finer diameter K, T, or J type thermocouples. The laboratory testing was done using a thermocouple made by Omega* (part number 5TC-TTK-36-36). * Attach the thermocouple bead or junction to the center of the package top surface using high thermal conductivity cements. The laboratory testing was done by using Omega Bond (part number OB-101). * The thermocouple should be attached at a 90-degree angle as shown in Figure 7. * The hole size should be smaller than 0.150" in diameter. * Make sure there is no contact between thermocouple cement and heatsink base. The contact will affect the thermocouple reading. 3.11.2 Thermal Equations and Data For the Extended Temperature Pentium processor with MMX technology, an ambient temperature, TA (air temperature around the processor), is not specified directly. The only restriction is that TC is met. The equation used to calculate CA is: CA = TC - TA P Where: TA and TC 32 = Ambient and case temperature (C) Advance Information Datasheet Extended Temperature Pentium(R) Processor with MMXTM Technology CA = Case-to-ambient thermal resistance (C/Watt) P = Maximum power consumption (Watt) JC is thermal resistance from die to package case. JC values shown in Table 12 are typical values. The actual JC values depend on actual thermal conductivity and process of die attach. CA is thermal resistance from package case to the ambient. CA values shown in these tables are typical values. The actual CA values depend on the heatsink design, interface between heatsink and package, airflow in the system, and thermal interactions between processor and surrounding components through PCB and the ambient. Figure 7. Technique for Measuring TC 000262 3.11.3 Airflow Calculations for Maximum and Typical Power Below is an example of determining the airflow required during maximum power consumption for the 166 MHz Extended Temperature Pentium processor with MMX technology assuming an ambient air temperature of +85 C: TC = 115 C TA = 85 C PHL-PBGA = 4.1 W CA (HL-PBGA, without heat sink) = 7.3 C/W Figure 8 indicates that this example would require about 600 LFM without a heat sink, and about 150 LFM with a heat sink in the vertical orientation. Below is an example of determining the airflow required during typical power consumption for the 166 MHz Extended Temperature Pentium processor with MMX technology assuming an ambient air temperature of +85 C: TC = 115 C TA = 85 C PHL-PBGA = 2.9 W CA (HL-PBGA, without heat sink) = 10.34 C/W Figure 8 indicates that this example would require about 200 LFM without a heat sink, and about 25 LFM with a heat sink in vertical orientation, for typical power and 85 C ambient conditions. Advance Information Datasheet 33 Extended Temperature Pentium(R) Processor with MMXTM Technology 3.11.4 HL-PBGA Package Thermal Resistance Information Table 12 lists the JC values for the Extended Temperature Pentium processor with MMX technology in the HL-PBGA package. The thermal data collection conditions were: * * * * A bidirectional anodized aluminum alloy heat sink was used. Heat sink height was 7mm. In the horizontal orientation the component was mounted flush with the motherboard. In the vertical orientation the component was mounted on an add-in card perpendicular to the motherboard. Table 12. Thermal Resistances for HL-PBGA Packages Heatsink/ Orientation JC (C/watt) No Heat Sink CA (C/watt) vs. Laminar Airflow (linear ft/min) 0 100 200 400 600 0.76 15.66 12.33 10.3 8.85 7.89 Horizontal 0.76 12.09 8.57 6.52 4.82 4.06 Vertical 0.76 11.33 8.34 6.38 4.69 3.95 CA (C/W) Figure 8. Thermal Resistance vs. Airflow for HL-PBGA Package 18 16 14 12 10 8 6 4 2 0 0 100 200 300 400 500 600 Airflow (LFM) Horizontal Heat Sink 34 Vertical Heat Sink No Heat Sink Advance Information Datasheet Extended Temperature Pentium(R) Processor with MMXTM Technology 4.0 Extended Temperature Pentium(R) Processor with MMXTM Technology Electrical Specifications This section contains preliminary information on new products in production. The specifications are subject to change without notice. 4.1 Warning: Absolute Maximum Ratings The following values are stress ratings only. Functional operation at the maximum ratings is not implied nor guaranteed. Functional operating conditions are given in the AC and DC specification tables. Stressing the device beyond the "Absolute Maximum Ratings" may cause permanent damage. Extended exposure to the maximum ratings may affect device reliability. Furthermore, although the Pentium processor with MMX technology contains protective circuitry to resist damage from Electrostatic Discharge (ESD), always take precautions to avoid high static voltages or electric fields. Table 13. Absolute Maximum Ratings Parameter Case temperature under bias 4.2 Maximum Rating -65 C to 125 C Storage temperature -65 C to 150 C VCC3 supply voltage with respect to VSS -0.5 V to +3.2 V VCC2 supply voltage with respect to VSS -0.5 V to +2.8 V 2.5 V only buffer DC input voltage -0.5 V to VCC3+0.5 V (not to exceed VCC3 max) DC Specifications Tables 15, 16, 17 and 18 list the DC specifications which apply to the Extended Temperature Pentium processor with MMX technology. 4.2.1 Power Sequencing There is no specific sequence required for powering up or powering down the VCC2 and VCC3 power supplies. However, it is recommended that the VCC2 and VCC3 power supplies be either both ON or both OFF within one second of each other. The I/O voltage VCC3 is 2.5 V. The core voltage VCC2 for the HL-PBGA package type is 1.8 V (166 MHz). Advance Information Datasheet 35 Extended Temperature Pentium(R) Processor with MMXTM Technology Table 14. VCC and TCASE Specifications Package TCASE HL-PBGA -40C to 115C Supply Min Voltage Max Voltage Voltage Tolerance VCC2 1.665 V 1.935 V 1.8 V 7.5% 166 MHz VCC3 2.375 V 2.625 V 2.5 V 5% 166 MHz Frequency Table 15. DC Specifications Symbol Parameter Min Max Unit Notes VIL3 Input Low Voltage -0.3 0.5 V VIH3 Input High Voltage VCC3 - 0.7 VCC3 + 0.3 V TTL Level VOL3 Output Low Voltage 0.4 V TTL Level, (1) VOH3 Output High Voltage V V TTL Level, (2) VCC3 - 0.4 VCC3 - 0.2 TTL Level, (3) NOTES: 1. Parameter measured at -4 mA. 2. Parameter measured at 3 mA. 3. Parameter measured at 1 mA; not 100% tested, guaranteed by design. The values in Table 16 should be used for power supply design. The values were determined using a worst case instruction mix and maximum VCC. Power supply transient response and decoupling capacitors must be sufficient to handle the instantaneous current changes occurring during transitions from Stop Clock to full Active modes. Table 16. ICC Specifications Symbol 36 Parameter Min Max Unit Notes ICC2 Power Supply Current 2.35 (HL-PBGA) A 166 MHz ICC3 Power Supply Current 0.38 A 166 MHz Advance Information Datasheet Extended Temperature Pentium(R) Processor with MMXTM Technology Table 17. Power Dissipation Requirements for Thermal Design Typical(1) Parameter Thermal Design Power Max(2) 4.1 (3) 2.9 Active Power Unit Frequency Watts 166 MHz Watts 166 MHz Stop Grant/Auto Halt Powerdown Power Dissipation(4) 0.70 Watts 166 MHz Stop Clock Power(5) 0.06 Watts 166 MHz NOTES: 1. This is the typical power dissipation in a system. This value is expected to be the average value that will be measured in a system using a typical device at the specified voltage running typical applications. This value is dependent upon the specific system configuration. Typical power specifications are not tested. 2. Systems must be designed to thermally dissipate the maximum thermal design power unless the system uses thermal feedback to limit processor's maximum power. The maximum thermal design power is determined using a worst-case instruction mix and also takes into account the thermal time constant of the package. 3. Active power is the average power measured in a system using a typical device running typical applications under normal operating conditions at nominal VCC and room temperature. 4. Stop Grant/Auto Halt Powerdown Power Dissipation is determined by asserting the STPCLK# pin or executing the HALT instruction. When in this mode, the processor has a new feature which allows it to power down additional circuitry to enable lower power dissipation. This is the power without snooping at the specified voltage and with TR12 bit 21 set. In order to enable this feature, TR12 bit 21 must be set to 1 (the default is 0 or disabled). Stop grant/Auto Halt Powerdown power dissipation without TR12 bit 21 set may be higher. The Max rating may be changed in future specification updates. 5. Stop Clock Power Dissipation is determined by asserting the STPCLK# pin and then removing the external CLK input. This is specified at a TCASE of 50 C. Table 18. Input and Output Characteristics Symbol Parameter Min Max Unit Notes CIN Input Capacitance 15 pF (4) CO Output Capacitance 20 pF (4) CI/O I/O Capacitance 25 pF (4) CCLK CLK Input Capacitance 15 pF (4) CTIN Test Input Capacitance 15 pF (4) CTOUT Test Output Capacitance 20 pF (4) CTCK Test Clock Capacitance 15 pF (4) ILI Input Leakage Current 15 A 0 MAXINT for destination operand size. 6. Masked Response Return MAXNEG to destination operand. Incorrect Sequence of Registers Stored in PUSHA/PUSHAD In the Intel Architecture Software Developer's Manual, Volume 2, the section on PUSHA/ PUSHAD-Push All General Purpose Registers, the sentence, "The registers are stored on the stack in the following order: EAX, ECX, EDX, EBX, EBP, ESP (original value), EBP, ESI and EDI (if the current operand-size attribute is 32)" incorrectly states the sequence of the registers stored on the stack. The sentence should state, "The registers are stored on the stack in the following order: EAX, ECX, EDX, EBX, ESP (original value), EBP, ESI and EDI (if the current operand-size attribute is 32)". 7. One-Byte Opcode Map Correction In the Intel Architecture Software Developer's Manual, Volume 2, there are two corrections that need to be made to the Opcode Map: 1. In Appendix A, Opcode Map, Table A-1, Row 9, Column 8, only CBW is indicated. It should indicate both CBW and CWDE. 2. In Appendix A, Opcode Map, Table A-1, Row 9, Column A, the operand is defined as "aP". It should be defined as "Ap". Operand "Ap" selects a pointer, 32-/48-bits in size without specifying a MOD R/M byte. Advance Information Datasheet 87 Extended Temperature Pentium(R) Processor with MMXTM Technology 10.0 Pentium(R) Processor Related Technical Collateral Unless otherwise noted, the following documentation may be obtained by visiting Intel's website at http:\\www.intel.com or by contacting Intel's Literature Center at 1-800-879-4683 in the U.S. and Canada. In other geographies, please contact your local sales office. Table 32. Pentium(R) Processor Related Technical Collateral Document Title Order Number Embedded Pentium(R) Processor with MMXTM Technology Datasheet 273214 Embedded Pentium(R) Processor with MMXTM Technology Flexible Motherboard Design Guidelines 273206 Intel Architecture Software Developer's Manual, Volume 1: Basic Architecture 243190 Intel Architecture Software Developer's Manual, Volume 2: Instruction Set Reference 243191 Intel Architecture Software Developer's Manual, Volume 3: System Programming Guide 243192 Pentium(R) Processor Specification Update 242480 Pentium(R) Processor Family Product Brief 241561 Pentium(R) Processor Performance Brief 241557 Pentium(R) Processor Technical Overview 241610 AP-579: Pentium(R) Processor Flexible Motherboard Design Guidelines AP-479: Pentium(R) Processor Clock Design AP-480: 88 Pentium(R) 243187 241574 Processor Thermal Design Guidelines 241575 AP-485: Intel Processor Identification with the CPUID Instruction 241618 AP-500: Optimizations for Intel's 32-Bit Processors 241799 AP-578: Software and Hardware Considerations in Handling FPU Exceptions 242415 Advance Information Datasheet