© 2001 California Micro Devices Corp. All rights reserved.
5/21/2001 1
TX
CALIFORNIA MICRO DEVICES
215 Topaz Street, Milpitas, California 95035 Tel: (408) 263-3214 Fax: (408) 263-7846 www.calmicro.com
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Back-Contact Thin Film Resistor Series
California Micro Devices TX Series back contact 20 mil
resistor chips offer the superior properties of Tantalum
Nitride material in a single-bond design. Conductive
epoxy or eutectic die-attachment to an active substrate
C1350800
area eliminates the need for a second wire bond. TX
Series chips are available in resistance values up to one
meg ohm and in tolerances to one percent.
Bonding Area
Laser Code Area
Formats
Die Size: 20±3 mils square
Bonding Pads: 4x4 mils typical
10ΩΩ
ΩΩ
Ω to 470ΩΩ
ΩΩ
Ω
470ΩΩ
ΩΩ
Ω to 1MEG ΩΩ
ΩΩ
Ω
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Notes: 1. This document supercedes all previous specifications.
2. Specifications are subject to change without notice or obligation.
* Best tolerance for < 25 Ω is + 5%
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