SN65LBC174A SN75LBC174A www.ti.com SLLS446F - OCTOBER 2000 - REVISED OCTOBER 2009 QUADRUPLE RS-485 DIFFERENTIAL LINE DRIVERS Check for Samples: SN65LBC174A SN75LBC174A FEATURES 1 * 2 * * * (1) Designed for TIA/EIA-485, TIA/EIA-422 and ISO 8482 Applications Signaling Rates (1) up to 30 Mbps Propagation Delay Times < 11 ns Low Standby Power Consumption 1.5-mA Max * * * * * The signaling rate of a line is the number of voltage transitions that are made per second expressed in the units bps (bits per second). Output ESD Protection: 12 kV Driver Positive- and Negative-Current Limiting Power-Up and Power-Down Glitch-Free for Line Insertion Applications Thermal Shutdown Protection Industry Standard Pin-Out, Compatible With SN75174, MC3487, DS96174, LTC487, and MAX3042 DESCRIPTION The SN65LBC174A and SN75LBC174A are quadruple differential line drivers with 3-state outputs, designed for TIA/EIA-485 (RS-485), TIA/EIA-422 (RS-422), and ISO 8482 applications. These devices are optimized for balanced multipoint bus transmission at signaling rates up to 30 million bits per second. The transmission media may be printed-circuit board traces, backplanes, or cables. The ultimate rate and distance of data transfer is dependent upon the attenuation characteristics of the media and the noise coupling to the environment. N PACKAGE (TOP VIEW) 1A 1Y 1Z 1,2EN 2Z 2Y 2A GND 1 16 2 15 3 14 4 13 5 12 6 11 7 10 8 9 16-DW PACKAGE (TOP VIEW) VCC 4A 4Y 4Z 3,4EN 3Z 3Y 3A 1A 1Y 1Z 1,2EN 2Z 2Y 2A GND 1 2 3 4 5 6 7 8 16 15 14 13 12 11 10 9 logic diagram (positive logic) VCC 4A 4Y 4Z 3,4EN 3Z 3Y 3A 1A 1,2EN 2A 3A 3,4EN 4A 20-DW PACKAGE (TOP VIEW) 1A 1Y NC 1Z 1,2EN 2Z NC 2Y 2A GND 1 2 3 4 5 6 7 8 9 10 20 19 18 17 16 15 14 13 12 11 1 2 3 4 7 9 6 5 10 11 12 15 14 13 1Y 1Z 2Y 2Z 3Y 3Z 4Y 4Z logic diagram (positive logic) VCC 4A 4Y NC 4Z 3,4EN 3Z NC 3Y 3A 1A 1,2EN 2A 3A 3,4EN 4A 1 2 4 5 9 11 8 6 12 14 15 19 18 16 1Y 1Z 2Y 2Z 3Y 3Z 4Y 4Z 1 2 Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. LinBiCMOS is a registered trademark of Texas Instruments. PRODUCTION DATA information is current as of publication date. Products conform to specifications per the terms of the Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters. Copyright (c) 2000-2009, Texas Instruments Incorporated SN65LBC174A SN75LBC174A SLLS446F - OCTOBER 2000 - REVISED OCTOBER 2009 www.ti.com This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with appropriate precautions. Failure to observe proper handling and installation procedures can cause damage. ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more susceptible to damage because very small parametric changes could cause the device not to meet its published specifications. DESCRIPTION (CONTINUED) Each driver features current limiting and thermal-shutdown circuitry making it suitable for high-speed multipoint applications in noisy environments. These devices are designed using LinBiCMOS(R), facilitating low power consumption and robustness. The two EN inputs provide pair-wise driver enabling, or can be externally tied together to provide enable control of all four drivers with one signal. When disabled or powered off, the driver outputs present a high-impedance to the bus for reduced system loading. The SN75LBC174A is characterized for operation over the temperature range of 0C to 70C. The SN65LBC174A is characterized for operation over the temperature range of -40C to 85C. Table 1. AVAILABLE OPTIONS PACKAGE TA 0C to 70C -40C to 85C (1) 16-PIN PLASTIC SMALL OUTLINE (JEDEC MS-013) (1) 20-PIN PLASTIC SMALL OUTLINE (JEDEC MS-013) SN75LBC174A16DW 16-PIN PLASTIC THROUGH-HOLE (JEDEC MS-001) (1) SN75LBC174ADW SN75LBC174AN MARKED AS 75LBC174A SN65LBC174A16DW SN65LBC174DW SN65LBC174AN MARKED AS 65LBC174A Add R suffix for taped and reeled version. Table 2. FUNCTION TABLE (EACH DRIVER) (1) (1) 2 INPUT ENABLE OUTPUT OUTPUT A EN Y Z L H L H H H H L OPEN H H L L OPEN L H H OPEN H L OPEN OPEN H L X L Z Z H = high level, L = low level, X = irrelevant, Z = high impedance (off) Submit Documentation Feedback Copyright (c) 2000-2009, Texas Instruments Incorporated Product Folder Link(s): SN65LBC174A SN75LBC174A SN65LBC174A SN75LBC174A www.ti.com SLLS446F - OCTOBER 2000 - REVISED OCTOBER 2009 ABSOLUTE MAXIMUM RATINGS over operating free-air temperature range (unless otherwise noted) (1) VALUE / UNIT Supply voltage range, VCC (2) -0.3 V to 6 V Voltage range at any bus (DC) -10 V to 15 V Voltage range at any bus (transient pulse through 100 , see Figure 8) -30 V to 30 V Input voltage range at any A or EN terminal, VI Human body model Electrostatic discharge -0.5 V to VCC + 0.5 V (3) Charged-device model (4) Y, Z, and GND 12 kV All pins 5 kV All pins 1 kV Storage temperature range, Tstg -65C to 150C Continuous power dissipation (1) (2) (3) (4) See Dissipation Rating Table Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. All voltage values, except differential I/O bus voltages, are with respect to GND. Tested in accordance with JEDEC standard 22, Test Method A114-A. Tested in accordance with JEDEC standard 22, Test Method C101. Table 3. DISSIPATION RATING TABLE PACKAGE (1) JEDEC BOARD MODEL 16 DW 20 DW 16 N (1) (2) TA 25C POWER RATING DERATING FACTOR ABOVE TA = 25C (2) TA = 70C POWER RATING TA = 85C POWER RATING LOW K 1200 mW 9.6 mW/C 769 mW 625 mW HIGH K 2240 mW 17.9 mW/C 1434 mW 1165 mW LOW K 1483 mW 11.86 mW/C 949 mW 771 mW HIGH K 2753 mW 22 mW/C 1762 mW 1432 mW LOW K 1150 mW 9.2 mW/C 736 mW 598 mW For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI website at www.ti.com. This is the inverse of the junction-to-ambient thermal resistance when board-mounted and with no air flow. RECOMMENDED OPERATING CONDITIONS Supply voltage, VCC Voltage at any bus terminal High-level input voltage, VIH Low-level input voltage, VIL Y, Z A, EN Output current Operating free-air temperature, TA MIN NOM MAX UNIT 4.75 5 5.25 V -7 12 V 2 VCC 0 0.8 -60 60 SN75LBC174A 0 70 SN65LBC174A -40 85 Copyright (c) 2000-2009, Texas Instruments Incorporated Product Folder Link(s): SN65LBC174A SN75LBC174A Submit Documentation Feedback V mA C 3 SN65LBC174A SN75LBC174A SLLS446F - OCTOBER 2000 - REVISED OCTOBER 2009 www.ti.com ELECTRICAL CHARACTERISTICS over recommended operating conditions PARAMETER TEST CONDITIONS MIN TYP MAX VIK Input clamp voltage II = -18 mA VO Open-circuit output voltage Y or Z, No load 0 VCC No load (open circuit) 3 VCC RL = 54 , See Figure 1 1 1.6 2.5 With common-mode loading, See Figure 2 1 1.6 2.5 |VOD(SS)| Steady-state differential output voltage magnitude (2) -1.5 (1) VOD(SS) Change in steady-state differential output voltage between logic states See Figure 1 -0.1 VOC(SS) Steady-state common-mode output voltage See Figure 3 2 VOC(SS) Change in steady-state common-mode See Figure 3 output voltage between logic states II Input current IOS Short-circuit output current High-impedance-state output current IO(OFF) Output current with power off ICC Supply current CIN Input Capacitance (1) (2) VI = 0 V or VCC, No load V V V V 2.8 V -0.02 0.02 V -50 50 A -200 200 mA EN at 0 V -50 50 VCC = 0 V -10 10 VI = 0 V IOZ UNIT 0.1 A, EN VTEST = -7 V to 12 V, See Figure 7 -0.77 VI = VCC 2.4 All drivers enabled 23 All drivers disabled 1.5 A mA A inputs 13 pF EN inputs 21 pF All typical values are at VCC = 5 V and 25C. The minimum VOD may not fully comply with TIA/EIA-485-A at operating temperatures below 0C. System designers should take the possibly lower output signal into account in determining the maximum signal transmission distance. SWITCHING CHARACTERISTICS over recommended operating conditions PARAMETER TEST CONDITIONS MIN TYP MAX UNIT tPLH Propagation delay time, low-to-high level output 5.5 8 11 ns tPHL Propagation delay time, high-to-low level output 5.5 8 11 ns tr Differential output voltage rise time 3 7.5 11 ns tf Differential output voltage fall time 3 7.5 11 ns 0.6 2 0.6 2 RL = 54 , CL = 50 pF, See Figure 4 tsk(p) Pulse skew |tPLH - tPHL| tsk(o) Output skew (1) 2 ns tsk(pp) Part-to-part skew (2) 3 ns tPZH Propagation delay time, high-impedance-to-high-level output 25 ns tPHZ Propagation delay time, high-level-output-to-high impedance 25 ns tPZL Propagation delay time, high-impedance-to-low-level output 30 ns tPLZ Propagation delay time, low-level-output-to-high impedance 20 ns (1) (2) 4 See Figure 5 See Figure 6 ns Output skew (tsk(o)) is the magnitude of the time delay difference between the outputs of a single device with all of the inputs connected together. Part-to-part skew (tsk(pp)) is the magnitude of the difference in propagation delay times between any specified terminals of two devices when both devices operate with the same input signals, the same supply voltages, at the same temperature, and have identical packages and test circuits. Submit Documentation Feedback Copyright (c) 2000-2009, Texas Instruments Incorporated Product Folder Link(s): SN65LBC174A SN75LBC174A SN65LBC174A SN75LBC174A www.ti.com SLLS446F - OCTOBER 2000 - REVISED OCTOBER 2009 PARAMETER MEASUREMENT INFORMATION IOY Y II A Z IOZ VOD 54 VOY GND VI VOZ Figure 1. Test Circuit, VOD Without Common-Mode Loading 375 Y A Input VOD 60 Z VTEST = -7 V to 12 V 375 VTEST VI Figure 2. Test Circuit, VOD With Common-Mode Loading Y 27 A Z Signal Generator 27 CL = 50 pF 50 VOC PRR = 1 MHz, 50% Duty Cycle, tr < 6 ns, tf < 6 ns, ZO = 50 Includes probe and jig capacitance Figure 3. VOC Test Circuit Copyright (c) 2000-2009, Texas Instruments Incorporated Product Folder Link(s): SN65LBC174A SN75LBC174A Submit Documentation Feedback 5 SN65LBC174A SN75LBC174A SLLS446F - OCTOBER 2000 - REVISED OCTOBER 2009 www.ti.com PARAMETER MEASUREMENT INFORMATION (continued) Y A RL = 54 CL = 50 pF VOD Z Signal Generator 50 PRR = 1 MHz, 50% Duty Cycle, tr < 6 ns, tf < 6 ns, ZO = 50 Includes probe and jig capacitance 3V 1.5 V Input 0V tPLH tPHL 1.5 V 90% 0V 10% Output tr -1.5 V tf Figure 4. Output Switching Test Circuit and Waveforms 6 Submit Documentation Feedback Copyright (c) 2000-2009, Texas Instruments Incorporated Product Folder Link(s): SN65LBC174A SN75LBC174A SN65LBC174A SN75LBC174A www.ti.com SLLS446F - OCTOBER 2000 - REVISED OCTOBER 2009 PARAMETER MEASUREMENT INFORMATION (continued) Y S1 A 3 V or 0 V w Output Z CL = 50 pF RL = 110 Input EN Signal Generator 50 PRR = 1 MHz, 50% Duty Cycle, tr < 6 ns, tf < 6 ns, ZO = 50 Includes probe and jig capacitance 3 V if testing Y output, 0 V if testing Z output 3V 1.5 V Input 0V tPZH 0.5 V VOH 2.3 V 0V Output tPHZ Figure 5. Enable Timing Test Circuit and Waveforms, tPZH and tPHZ Copyright (c) 2000-2009, Texas Instruments Incorporated Product Folder Link(s): SN65LBC174A SN75LBC174A Submit Documentation Feedback 7 SN65LBC174A SN75LBC174A SLLS446F - OCTOBER 2000 - REVISED OCTOBER 2009 www.ti.com PARAMETER MEASUREMENT INFORMATION (continued) 5V RL = 110 Y S1 A 0 V or 3 V w Output Z CL = 50 pF Input EN Signal Generator 50 PRR = 1 MHz, 50% Duty Cycle, tr < 6 ns, tf < 6 ns, ZO = 50 Includes probe and jig capacitance 3 V if testing Y output, 0 V if testing Z output 3V 1.5 V Input 0V tPZL tPLZ 5V Output 2.3 V VOL 0.5 V Figure 6. Enable Timing Test Circuit and Waveforms, tPZL and tPLZ 8 Submit Documentation Feedback Copyright (c) 2000-2009, Texas Instruments Incorporated Product Folder Link(s): SN65LBC174A SN75LBC174A SN65LBC174A SN75LBC174A www.ti.com SLLS446F - OCTOBER 2000 - REVISED OCTOBER 2009 PARAMETER MEASUREMENT INFORMATION (continued) Y IO VI Z VTEST Voltage Source VTEST = -7 V to 12 V Slew Rate 1.2 V/s Figure 7. Test Circuit, Short-Circuit Output Current Y Z 100 VTEST 0V 15 s Pulse Generator 15 s Duration, 1% Duty Cycle -VTEST 1.5 ms Figure 8. Test Circuit Waveform, Transient Overvoltage Test EQUIVALENT INPUT AND OUTPUT SCHEMATIC DIAGRAMS Y or Z Output A or EN Input VCC VCC 16 V 20 V 100 k 16 V 1 k Input Output 16 V 9V 17 V 16 V Copyright (c) 2000-2009, Texas Instruments Incorporated Product Folder Link(s): SN65LBC174A SN75LBC174A Submit Documentation Feedback 9 SN65LBC174A SN75LBC174A SLLS446F - OCTOBER 2000 - REVISED OCTOBER 2009 www.ti.com TYPICAL CHARACTERISTICS DIFFERENTIAL OUTPUT VOLTAGE vs OUTPUT CURRENT DIFFERENTIAL OUTPUT VOLTAGE vs FREE-AIR TEMPERATURE 2.5 3.5 VOD - Differential Output Voltage - V VOD - Differential Output Voltage - V 4 3 2.5 VCC = 5.25 V VCC = 5 V 2 1.5 VCC = 4.75 V 1 0.5 0 0 20 40 80 60 VCC = 5.25 V 2 VCC = 5 V 1.5 VCC = 4.75 V 1 0.5 0 -60 100 IO - Output Current - mA 20 40 60 Figure 9. Figure 10. PROPAGATION DELAY TIME vs FREE-AIR TEMPERATURE SUPPLY CURRENT (FOUR CHANNELS) vs SIGNALING RATE 80 100 144 ICC - Supply Current (Four Channels) - mA VCC = 5.25 V 7.5 VCC = 4.75 V 7 6.5 6 5.5 RL = 54 W CL = 50 pF (Each Channel) 142 140 138 136 134 132 130 128 -20 0 20 40 60 80 1 10 Signaling Rate - Mbps o TA - Free- Air Temperature - C Figure 11. 10 0 TA - Free-Air Temperature - C 8 Propigation Delay Time - ns -20 o 8.5 5 -40 -40 Submit Documentation Feedback 100 Figure 12. Copyright (c) 2000-2009, Texas Instruments Incorporated Product Folder Link(s): SN65LBC174A SN75LBC174A SN65LBC174A SN75LBC174A www.ti.com SLLS446F - OCTOBER 2000 - REVISED OCTOBER 2009 TYPICAL CHARACTERISTICS (continued) DIFFERENTIAL OUTPUT VOLTAGE vs SUPPLY VOLTAGE EYE PATTERN, PSEUDORANDOM DATA AT+ 30 Mbps 3 RL = 54 CL = 50 pF VOD - Differential Output Voltage - V RL = 54 W 2.5 2 1.5 1 0.5 0 0 0.5 1 1.5 2 2.5 3 3.5 4 4.5 5 5.5 6 VCC - Supply Voltage - V Figure 13. Figure 14. Copyright (c) 2000-2009, Texas Instruments Incorporated Product Folder Link(s): SN65LBC174A SN75LBC174A Submit Documentation Feedback 11 SN65LBC174A SN75LBC174A SLLS446F - OCTOBER 2000 - REVISED OCTOBER 2009 www.ti.com APPLICATION INFORMATION TMS320F243 DSP (Controller) SN65LBC174A SN65LBC175A TMS320F241 DSP (Embedded Application) SPISIMO SPISIMO IOPA1 (Enable) IOPA1 SPISTE SPISTE SPICLK SPICLK IOPA2 (Enable) IOPA2 IOPA0 (Handshake /Status) IOPA0 SPISOMI SPISOMI Figure 15. Typical Application Circuit, DSP-to-DSP Link via Serial Peripheral Interface REVISION HISTORY Changes from Original (October 2000) to Revision A * Page Changed multiple items throught the data sheet. ................................................................................................................. 1 Changes from Revision A (February 2001) to Revision B Page * Changed DW Package appearance ..................................................................................................................................... 1 * Added Figure 13 ................................................................................................................................................................. 11 Changes from Revision B (June 2001) to Revision C Page * Changed Features bullet From: Output ESD Protection Exceeds 13 kV To: Output ESD Protection: 11 kV ...................... 1 * Changed Features bullet for Industry Standard From: Compatible With SN75174, MC3487, and DS96174 To: Compatible With SN75174, MC3487, DS96174, LTC487, and MAX3042 ........................................................................... 1 Changes from Revision C (May 2003) to Revision D Page * Changed the AVAILABLE OPTIONS table ........................................................................................................................... 2 * Changed Electrostatic discharge-Human body model-Y, Z, and GND From: 13kV To: 11kV ............................................. 3 * Changed the DISSIPATION RATING TABLE ...................................................................................................................... 3 12 Submit Documentation Feedback Copyright (c) 2000-2009, Texas Instruments Incorporated Product Folder Link(s): SN65LBC174A SN75LBC174A SN65LBC174A SN75LBC174A www.ti.com SLLS446F - OCTOBER 2000 - REVISED OCTOBER 2009 Changes from Revision D (June 2008) to Revision E Page * Changed Features bullet From: Output ESD Protection Exceeds 11 kV To: Output ESD Protection: 12 kV ...................... 1 * Changed Electrostatic discharge-Human body model-Y, Z, and GND From: 11kV To: 12kV ............................................. 3 * From: A, G, G To: A, EN ....................................................................................................................................................... 4 Changes from Revision E (July 2008) to Revision F Page * Changed FUNCTION TABLE header From: ENABLE G To: ENABLE EN .......................................................................... 2 * Added CIN - Input Capacitance to the Electrical Characteristics table .................................................................................. 4 * Changed the location of the EQUIVALENT INPUT AND OUTPUT SCHEMATIC DIAGRAM ............................................. 9 Copyright (c) 2000-2009, Texas Instruments Incorporated Product Folder Link(s): SN65LBC174A SN75LBC174A Submit Documentation Feedback 13 PACKAGE OPTION ADDENDUM www.ti.com 23-Oct-2009 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Drawing Pins Package Eco Plan (2) Qty SN65LBC174A16DW ACTIVE SOIC DW 16 40 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN65LBC174A16DWG4 ACTIVE SOIC DW 16 40 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN65LBC174A16DWR ACTIVE SOIC DW 16 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN65LBC174A16DWRG4 ACTIVE SOIC DW 16 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN65LBC174ADW ACTIVE SOIC DW 20 25 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN65LBC174ADWG4 ACTIVE SOIC DW 20 25 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN65LBC174ADWR ACTIVE SOIC DW 20 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN65LBC174ADWRG4 ACTIVE SOIC DW 20 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN65LBC174AN ACTIVE PDIP N 16 25 Pb-Free (RoHS) CU NIPD SN75LBC174A16DW ACTIVE SOIC DW 16 40 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN75LBC174A16DWG4 ACTIVE SOIC DW 16 40 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN75LBC174A16DWR ACTIVE SOIC DW 16 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN75LBC174A16DWRG4 ACTIVE SOIC DW 16 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN75LBC174ADW ACTIVE SOIC DW 20 25 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN75LBC174ADWG4 ACTIVE SOIC DW 20 25 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN75LBC174ADWR ACTIVE SOIC DW 20 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN75LBC174ADWRG4 ACTIVE SOIC DW 20 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN75LBC174AN ACTIVE PDIP N 16 25 Pb-Free (RoHS) CU NIPD N / A for Pkg Type SN75LBC174ANE4 ACTIVE PDIP N 16 25 Pb-Free (RoHS) CU NIPD N / A for Pkg Type Lead/Ball Finish MSL Peak Temp (3) N / A for Pkg Type (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered Addendum-Page 1 PACKAGE OPTION ADDENDUM www.ti.com 23-Oct-2009 at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material) (3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis. OTHER QUALIFIED VERSIONS OF SN65LBC174A : * Enhanced Product: SN65LBC174A-EP NOTE: Qualified Version Definitions: * Enhanced Product - Supports Defense, Aerospace and Medical Applications Addendum-Page 2 PACKAGE MATERIALS INFORMATION www.ti.com 14-Jul-2012 TAPE AND REEL INFORMATION *All dimensions are nominal Device Package Package Pins Type Drawing SPQ Reel Reel A0 Diameter Width (mm) (mm) W1 (mm) B0 (mm) K0 (mm) P1 (mm) W Pin1 (mm) Quadrant 10.75 10.7 2.7 12.0 16.0 Q1 SN65LBC174A16DWR SOIC DW 16 2000 330.0 16.4 SN65LBC174ADWR SOIC DW 20 2000 330.0 24.4 10.8 13.0 2.7 12.0 24.0 Q1 SN75LBC174A16DWR SOIC DW 16 2000 330.0 16.4 10.75 10.7 2.7 12.0 16.0 Q1 Pack Materials-Page 1 PACKAGE MATERIALS INFORMATION www.ti.com 14-Jul-2012 *All dimensions are nominal Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm) SN65LBC174A16DWR SOIC DW 16 2000 367.0 367.0 38.0 SN65LBC174ADWR SOIC DW 20 2000 367.0 367.0 45.0 SN75LBC174A16DWR SOIC DW 16 2000 367.0 367.0 38.0 Pack Materials-Page 2 IMPORTANT NOTICE Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, enhancements, improvements and other changes to its semiconductor products and services per JESD46C and to discontinue any product or service per JESD48B. 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