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FEATURES
DGG OR DGV PACKAGE
(TOP VIEW)
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
48
47
46
45
44
43
42
41
40
39
38
37
36
35
34
33
32
31
30
29
28
27
26
25
VDD
A0
GND
A1
GND
VDD
GND
A2
GND
A3
GND
VDD
GND
NC
A4
GND
A5
GND
VDD
GND
A6
GND
A7
SEL
0B1
1B1
GND
0B2
1B2
GND
2B1
3B1
GND
2B2
3B2
GND
VDD
4B1
5B1
GND
4B2
5B2
GND
6B1
7B1
GND
6B2
7B2
NC − No internal connection
APPLICATIONS
DESCRIPTION/ORDERING INFORMATION
TS3DV4164-CHANNEL DIFFERENTIAL 8:16 MULTIPLEXER SWITCHFOR DVI/HDMI APPLICATIONS
SCDS198C – OCTOBER 2005 – REVISED MAY 2006
•Compatible With HDMI v1.2a (Type A) DVI 1.0High-Speed Digital Interface– Wide Bandwidth of Over 1.65 Gbps(Bandwidth 1.8 Gbps Typ)– 165-MHz Speed Operation– Serial Data Stream at 10 ×Pixel Clock Rate– Supports All Video Formats up to 1080pand SXGA (1280 ×1024 at 75 Hz)– Total Raw Capacity 4.95 Gbps (Single Link)– HDCP Compatible•Low Crosstalk (X
TALK
= –41 dB Typ)•Low Bit-to-Bit Skew (t
sk(o)
= 0.2 ns Max)•Low and Flat ON-State Resistance(r
on
= 4 ΩTyp, r
on(flat)
= 0.7 ΩTyp)•Low Input/Output Capacitance(C
ON
= 10 pF Typ)•Rail-to-Rail Switching on Data I/O Ports(0 to 5 V)•V
DD
Operating Range From 3 V to 3.6 V•I
off
Supports Partial-Power-Down ModeOperation
•Latch-Up Performance Exceeds 100 mA PerJESD 78, Class II•ESD Performance Tested Per JESD 22– 2000-V Human-Body Model(A114-B, Class II)– 1000-V Charged-Device Model (C101)
•Digital Video Signal Switching•Differential DVI, HDMI Signal Multiplexing forAudio/Video Receivers and High-DefinitionTelevision (HDTV)
The TS3DV416 is a 16-bit to 8-bit multiplexer/demultiplexer digital video switch with a single select (SEL) input.SEL controls the data path of the multiplexer/demultiplexer.
The device provides a low and flat ON-state resistance (r
on
) and an excellent ON-state resistance match. Lowinput/output capacitance, high bandwidth, low skew, and low crosstalk among channels make this devicesuitable for various digital video applications, such as DVI and HDMI.
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of TexasInstruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
PRODUCTION DATA information is current as of publication date.
Copyright © 2005–2006, Texas Instruments IncorporatedProducts conform to specifications per the terms of the TexasInstruments standard warranty. Production processing does notnecessarily include testing of all parameters.
www.ti.com
DigitalTV
DVI
Receiver
DVDPlayer
S T B
TS3DV416
TS3DV416
4-CHANNEL DIFFERENTIAL 8:16 MULTIPLEXER SWITCHFOR DVI/HDMI APPLICATIONS
SCDS198C – OCTOBER 2005 – REVISED MAY 2006
ORDERING INFORMATION
T
A
PACKAGE
(1)
ORDERABLE PART NUMBER TOP-SIDE MARKING
TSSOP – DGG Tape and reel TS3DV416DGGR TS3DV416–40 °C to 85 °C
TVSOP – DGV Tape and reel TS3DV416DGVR SD416
(1) Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are available atwww.ti.com/sc/package.
TYPICAL APPLICATION
FUNCTION TABLE
INPUT/INPUT
OUTPUT FUNCTIONSEL
A
n
L nB
1
A
n
= nB
1
nB
2
high-impedance modeH nB
2
A
n
= nB
2
nB
1
high-impedance mode
PIN DESCRIPTION
NAME DESCRIPTION
A
n
Data I/OnB
m
Data I/OSEL Select input
2
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A00B1
0B2
SEL
248
45
24
1B2
44
A11B1
447
A22B1
2B2
8 42
39
3B2
38
A33B1
10 41
A44B1
4B2
15 35
32
5B2
31
A55B1
17 34
A66B1
6B2
21 29
26
7B2
25
A77B1
23 28
TS3DV4164-CHANNEL DIFFERENTIAL 8:16 MULTIPLEXER SWITCHFOR DVI/HDMI APPLICATIONS
SCDS198C – OCTOBER 2005 – REVISED MAY 2006
LOGIC DIAGRAM (POSITIVE LOGIC)
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Absolute Maximum Ratings
(1)
Recommended Operating Conditions
(1)
TS3DV416
4-CHANNEL DIFFERENTIAL 8:16 MULTIPLEXER SWITCHFOR DVI/HDMI APPLICATIONS
SCDS198C – OCTOBER 2005 – REVISED MAY 2006
over operating free-air temperature range (unless otherwise noted)
MIN MAX UNIT
V
DD
Supply voltage range –0.5 4.6 VV
IN
Control input voltage range
(2) (3)
–0.5 7 VV
I/O
Switch I/O voltage range
(2) (3) (4)
–0.5 7 VI
IK
Control input clamp current V
IN
< 0 –50 mAI
I/OK
I/O port clamp current V
I/O
< 0 –50 mAI
I/O
ON-state switch current
(5)
±128 mAContinuous current through V
DD
or GND ±100 mADGG package 70θ
JA
Package thermal impedance
(6)
°C/WDGV package 58T
stg
Storage temperature range –65 150 °C
(1) Stresses beyond those listed under "absolute maximum ratings" may cause permanent damage to the device. These are stress ratingsonly, and functional operation of the device at these or any other conditions beyond those indicated under "recommended operatingconditions" is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.(2) All voltages are with respect to ground, unless otherwise specified.(3) The input and output voltage ratings may be exceeded if the input and output clamp-current ratings are observed.(4) V
I
and V
O
are used to denote specific conditions for V
I/O
.(5) I
I
and I
O
are used to denote specific conditions for I
I/O
.(6) The package thermal impedance is calculated in accordance with JESD 51-7.
MIN MAX UNIT
V
DD
Supply voltage 3 3.6 VV
IH
High-level control input voltage (SEL) 2 5.5 VV
IL
Low-level control input voltage (SEL) 0 0.8 VV
I/o
Input/output voltage 0 5.5 VT
A
Operating free-air temperature –40 85 °C
(1) All unused inputs of the device must be held at V
DD
or GND to ensure proper device operation. Refer to the TI application report,Implications of Slow or Floating CMOS Inputs, literature number SCBA004.
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Electrical Characteristics
(1)
Switching Characteristics
Dynamic Characteristics
TS3DV4164-CHANNEL DIFFERENTIAL 8:16 MULTIPLEXER SWITCHFOR DVI/HDMI APPLICATIONS
SCDS198C – OCTOBER 2005 – REVISED MAY 2006
for high-frequency switching over recommended operating free-air temperature range, V
DD
= 3.3 V ±0.3 V(unless otherwise noted)
PARAMETER TEST CONDITIONS MIN TYP
(2)
MAX UNIT
V
IK
SEL V
DD
= 3.6 V, I
IN
= –18 mA –0.7 –1.2 VI
IH
SEL V
DD
= 3.6 V, V
IN
= V
DD
±1µAI
IL
SEL V
DD
= 3.6 V, V
IN
= GND ±1µAI
off
V
DD
= 0, V
O
= 0 to 3.6 V, V
I
= 0 1 µAI
DD
V
DD
= 3.6 V, I
I/O
= 0, Switch ON or OFF 250 600 µAC
IN
SEL f = 1 MHz, V
IN
= 0 2.5 3 pFC
OFF
B port V
I
= 0, f = 1 MHz, Outputs open, Switch OFF 3.5 4 pFC
ON
V
I
= 0, f = 1 MHz, Outputs open, Switch ON 10 10.9 pFr
on
V
DD
= 3 V, 1.5 V ≤V
I
≤V
DD
, I
O
= –40 mA 4 8 Ωr
on(flat)
(3)
V
DD
= 3 V, V
I
= 1.5 V and V
DD
, I
O
= –40 mA 0.7 Ω∆r
on
(4)
V
DD
= 3 V, 1.5 V ≤V
I
≤V
DD
, I
O
= –40 mA 0.2 1.2 Ω
(1) V
I
, V
O
, I
I
, and I
O
refer to I/O pins. V
IN
refers to the control inputs.(2) All typical values are at V
DD
= 3.3 V (unless otherwise noted), T
A
= 25 °C.(3) r
on(flat)
is the difference of r
on
in a given channel at specified voltages.(4) ∆r
on
is the difference of r
on
from center (A
4
, A
5
) ports to any other port.
over recommended operating free-air temperature range, V
DD
= 3.3 V ±0.3 V, R
L
= 200 Ω, C
L
= 10 pF(unless otherwise noted) (see Figure 4 and Figure 5 )
FROM TOPARAMETER MIN TYP
(1)
MAX UNIT(INPUT) (OUTPUT)
t
pd
(2)
A or B B or A 0.04 nst
PZH
, t
PZL
SEL A or B 1.5 11.5 nst
PHZ
, t
PLZ
SEL A or B 1 8.5 nst
sk(o)
(3)
A or B B or A 0.1 0.2 nst
sk(p)
(4)
0.1 0.2 ns
(1) All typical values are at V
DD
= 3.3 V (unless otherwise noted), T
A
= 25 °C.(2) The propagation delay is the calculated RC time constant of the typical ON-state resistance of the switch and the specified loadcapacitance when driven by an ideal voltage source (zero output impedance).(3) Output skew between center port (A
4
to A
5
) to any other port(4) Skew between opposite transitions of the same output in a given device |t
PHL
– t
PLH
|
over recommended operating free-air temperature range, V
DD
= 3.3 V ±0.3 V (unless otherwise noted)
PARAMETER TEST CONDITIONS TYP
(1)
UNIT
X
TALK
R
L
= 100 Ω, f = 250 MHz, See Figure 7 –41 dBO
IRR
R
L
= 100 Ω, f = 250 MHz, See Figure 8 –39 dBBW See Figure 6 900 MHz
(1) All typical values are at V
DD
= 3.3 V (unless otherwise noted), T
A
= 25 °C.
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OPERATING CHARACTERISTICS
−9
−8
−7
−6
−5
−4
−3
−2
−1
0
Gain − dB
Frequency − MHz
1 10 10,000100 1,000
Gain at 900 MHz, −3 dB
−120
−100
−80
−60
−40
−20
0
Off-Isolation − dB
Frequency − MHz
1 10 10,000100 1,000
OFF Isolation at 250 MHz, −39 dB
TS3DV416
4-CHANNEL DIFFERENTIAL 8:16 MULTIPLEXER SWITCHFOR DVI/HDMI APPLICATIONS
SCDS198C – OCTOBER 2005 – REVISED MAY 2006
Figure 1. Gain vs Frequency
Figure 2. OFF Isolation vs Frequency
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OPERATING CHARACTERISTICS (continued)
−120
−100
−80
−60
−40
−20
0
Crosstalk − dB
Frequency − MHz
1 10 10,000100 1,000
Crosstalk at 250 MHz, −41 dB
TS3DV4164-CHANNEL DIFFERENTIAL 8:16 MULTIPLEXER SWITCHFOR DVI/HDMI APPLICATIONS
SCDS198C – OCTOBER 2005 – REVISED MAY 2006
Figure 3. Crosstalk vs Frequency
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APPLICATION INFORMATION
TMDS Data 2 −
TMDS Data 2+
TMDS Data 1 −
TMDS Data 1+
TMDS Data 0 −
TMDS Data 0+
TMDS Clock+
TMDS Clock −
TS3DV416
To DVI Receiver
1 2 3 4 5 6 7 8 C1 C2
910 11 12 13 14 15 16
17 18 19 20 21 22 23 24 C3 C4
C5
Typical DVI Connector
Pin Name Function
1TMDS Data 2− Digital red − (Link 1)
2TMDS Data 2+ Digital red + (Link 1)
3TMDS Data 2/4 shield
4TMDS Data 4− Digital green − (Link 2)
5TMDS Data 4+ Digital green + (Link 2)
6DDC clock
7DDC data
8Analog Vertical Sync
9TMDS Data 1− Digital green − (Link 1)
10 TMDS Data 1+ Digital green + (Link 1)
11 TMDS Data 1/3 shield
12 TMDS Data 3− Digital blue − (Link 2)
13 TMDS Data 3+ Digital blue + (Link 2)
14 +5V Power for monitor when in standby
15 Ground Return for pin 14 and analog sync
16 Hot Plug Detect
17 TMDS data 0− Digital blue − (Link 1) and digital sync
18 TMDS data 0+ Digital blue + (Link 1) and digital sync
19 TMDS data 0/5 shield
20 TMDS data 5− Digital red − (Link 2)
21 TMDS data 5+ Digital red + (Link 2)
22 TMDS clock shield
23 TMDS clock+ Digital clock + (Links 1 and 2)
24 TMDS clock− Digital clock − (Links 1 and 2)
C1 Analog Red
C2 Analog Green
C3 Analog Blue
C4 Analog Horizontal Sync
C5 Analog Ground Return for R, G and B signals
TMDS Data 2 −
TMDS Data 2+
TMDS Data 1 −
TMDS Data 1+
TMDS Data 0 −
TMDS Data 0+
TMDS Clock+
TMDS Clock −
1
2
9
10
17
23
24
1
2
9
10
17
18
23
24
TMDS Data 2 −
TMDS Data 2+
TMDS Data 1 −
TMDS Data 1+
TMDS Data 0 −
TMDS Data 0+
TMDS Clock+
TMDS Clock −
DVI Connector 2
(Single Link)
TMDS Data 2 −
TMDS Data 2+
TMDS Data 1 −
TMDS Data 1+
TMDS Data 0 −
TMDS Data 0+
TMDS Clock+
TMDS Clock −
DVI Connector 1
(Single Link)
1
2
9
10
17
18
23
24
TMDS Data 2 −
TMDS Data 2+
TMDS Data 1 −
TMDS Data 1+
TMDS Data 0 −
TMDS Data 0+
TMDS Clock+
TMDS Clock −
TS3DV416
To DVI Receiver
1 2 3 4 5 6 7 8 C1 C2
910 11 12 13 14 15 16
17 18 19 20 21 22 23 24 C3 C4
C5
Typical DVI Connector
Pin Name Function
1TMDS Data 2− Digital red − (Link 1)
2TMDS Data 2+ Digital red + (Link 1)
3TMDS Data 2/4 shield
4TMDS Data 4− Digital green − (Link 2)
5TMDS Data 4+ Digital green + (Link 2)
6DDC clock
7DDC data
8Analog Vertical Sync
9TMDS Data 1− Digital green − (Link 1)
10 TMDS Data 1+ Digital green + (Link 1)
11 TMDS Data 1/3 shield
12 TMDS Data 3− Digital blue − (Link 2)
13 TMDS Data 3+ Digital blue + (Link 2)
14 +5V Power for monitor when in standby
15 Ground Return for pin 14 and analog sync
16 Hot Plug Detect
17 TMDS data 0− Digital blue − (Link 1) and digital sync
18 TMDS data 0+ Digital blue + (Link 1) and digital sync
19 TMDS data 0/5 shield
20 TMDS data 5− Digital red − (Link 2)
21 TMDS data 5+ Digital red + (Link 2)
22 TMDS clock shield
23 TMDS clock+ Digital clock + (Links 1 and 2)
24 TMDS clock− Digital clock − (Links 1 and 2)
C1 Analog Red
C2 Analog Green
C3 Analog Blue
C4 Analog Horizontal Sync
C5 Analog Ground Return for R, G and B signals
DVI Connector Pin Assignments
The TS3DV416 can be used to switch
between two digital video ports.
TMDS Data 2 −
TMDS Data 2+
TMDS Data 1 −
TMDS Data 1+
TMDS Data 0 −
TMDS Data 0+
TMDS Clock+
TMDS Clock −
1
2
9
10
17
23
24
1
2
9
10
17
18
23
24
TMDS Data 2 −
TMDS Data 2+
TMDS Data 1 −
TMDS Data 1+
TMDS Data 0 −
TMDS Data 0+
TMDS Clock+
TMDS Clock −
DVI Connector 2
(Single Link)
TMDS Data 2 −
TMDS Data 2+
TMDS Data 1 −
TMDS Data 1+
TMDS Data 0 −
TMDS Data 0+
TMDS Clock+
TMDS Clock −
DVI Connector 1
(Single Link)
1
2
9
10
17
18
23
24
TS3DV416
4-CHANNEL DIFFERENTIAL 8:16 MULTIPLEXER SWITCHFOR DVI/HDMI APPLICATIONS
SCDS198C – OCTOBER 2005 – REVISED MAY 2006
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PARAMETER MEASUREMENT INFORMATION
TS3DV4164-CHANNEL DIFFERENTIAL 8:16 MULTIPLEXER SWITCHFOR DVI/HDMI APPLICATIONS
SCDS198C – OCTOBER 2005 – REVISED MAY 2006
(Enable and Disable Times)
Figure 4. Test Circuit and Voltage Waveforms
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PARAMETER MEASUREMENT INFORMATION
CL
(see Note A)
TEST CIRCUIT
S1 2 × VDD
Open
GND
RL
RL
VOH
VOL
VOLTAGE WAVEFORMS
OUTPUT SKEW (tsk(o))
Data Out at
YB1 or YB2
NOTES: A. CL includes probe and jig capacitance.
B. Waveform 1 is for an output with internal conditions such that the output is low, except when disabled by the output control.
Waveform 2 is for an output with internal conditions such that the output is high, except when disabled by the output control.
C. All input pulses are supplied by generators having the following characteristics: PRR ≤ 10 MHz, ZO = 50 Ω, tr ≤ 2.5 ns, tf ≤ 2.5 ns.
D. The outputs are measured one at a time, with one transition per measurement.
50 Ω
VG1
VDD
DUT
50 Ω
VIN
50 Ω
VG2 50 Ω
VI
TEST RL
S1 V∆
CL
3.3 V ± 0.3 V
VDD VI
tsk(p)
tsk(o)
3.3 V ± 0.3 V
Open
Open
200 Ω
200 Ω
VDD or GND
VDD or GND
10 pF
10 pF
Input Generator
Input Generator VO
(VOH + VOL)/2
VOH
VOL
Data Out at
XB1 or XB2
(VOH + VOL)/2
3.5 V
1.5 V
Data In at
Ax or Ay
2.5 V
tPLHx tPHLx
tsk(o) tsk(o)
tPLHy tPHLy
tsk(o) = |tPLHy − tPLHx| or |tPHLy − tPHLx|
VOH
VOL
VOLTAGE WAVEFORMS
PULSE SKEW (tsk(p))
Output (VOH + VOL)/2
Input 2.5 V
tPLH tPHL
tsk(p) = |tPHL − tPLH|
3.5 V
1.5 V
TS3DV416
4-CHANNEL DIFFERENTIAL 8:16 MULTIPLEXER SWITCHFOR DVI/HDMI APPLICATIONS
SCDS198C – OCTOBER 2005 – REVISED MAY 2006
(Skew)
Figure 5. Test Circuit and Voltage Waveforms
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PARAMETER MEASUREMENT INFORMATION
Network Analyzer
(HP8753ES)
EXT TRIGGER
BIAS
P1 P2
DUT
A0
SEL
0B1
VSEL
VDD
VBIAS
CL = 10 pF
(see Note A)
NOTE A: CL includes probe and jig capacitance.
TS3DV4164-CHANNEL DIFFERENTIAL 8:16 MULTIPLEXER SWITCHFOR DVI/HDMI APPLICATIONS
SCDS198C – OCTOBER 2005 – REVISED MAY 2006
Figure 6. Test Circuit for Frequency Response (BW)
Frequency response is measured at the output of the ON channel. For example, when V
SEL
= 0 and A
0
is theinput, the output is measured at 0B
1
. All unused analog I/O ports are left open.
HP8753ES Setup
Average = 4
RBW = 3 kHz
V
BIAS
= 0.35 V
ST = 2 s
P1 = 0 dBM
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PARAMETER MEASUREMENT INFORMATION
Network Analyzer
(HP8753ES)
RL = 100 Ω
EXT TRIGGER
BIAS
P1 P2
DUT
A0
SEL
0B1
VSEL
VDD
VBIAS
A1
1B2
NOTES: A. CL includes probe and jig capacitance.
B. A 50-Ω termination resistor is needed to match the loading of the network analyzer.
1B1
RL = 100 Ω
2B1
3B1
A2
A3
0B2
3B2
2B2
TS3DV416
4-CHANNEL DIFFERENTIAL 8:16 MULTIPLEXER SWITCHFOR DVI/HDMI APPLICATIONS
SCDS198C – OCTOBER 2005 – REVISED MAY 2006
Figure 7. Test Circuit for Crosstalk (X
TALK
)
Crosstalk is measured at the output of the nonadjacent ON channel. For example, when V
SEL
= 0 and A
1
is theinput, the output is measured at A
3
. All unused analog input (A) ports are connected to GND, and output (B)ports are left open.
HP8753ES Setup
Average = 4
RBW = 3 kHz
V
BIAS
= 0.35 V
ST = 2 s
P1 = 0 dBM
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PARAMETER MEASUREMENT INFORMATION
Network Analyzer
(HP8753ES)
RL = 100 Ω
EXT TRIGGER
BIAS
P1 P2
DUT
A0
SEL
0B1
VSEL
VDD
VBIAS
0B2
NOTES: A. CL includes probe and jig capacitance.
B. A 50-Ω termination resistor is needed to match the loading of the network analyzer.
A11B1
1B2
TS3DV4164-CHANNEL DIFFERENTIAL 8:16 MULTIPLEXER SWITCHFOR DVI/HDMI APPLICATIONS
SCDS198C – OCTOBER 2005 – REVISED MAY 2006
Figure 8. Test Circuit for OFF Isolation (O
IRR
)
OFF isolation is measured at the output of the OFF channel. For example, when V
SEL
= GND and A
1
is theinput, the output is measured at 1B
2
. All unused analog input (A) ports are connected to ground, and output (B)ports are left open.
HP8753ES Setup
Average = 4
RBW = 3 kHz
V
BIAS
= 0.35 V
ST = 2 s
P1 = 0 dBM
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PACKAGING INFORMATION
Orderable Device Status (1) Package
Type Package
Drawing Pins Package
Qty Eco Plan (2) Lead/Ball Finish MSL Peak Temp (3)
TS3DV416DGGR ACTIVE TSSOP DGG 48 2000 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
TS3DV416DGGRE4 ACTIVE TSSOP DGG 48 2000 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
TS3DV416DGGRG4 ACTIVE TSSOP DGG 48 2000 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
TS3DV416DGVR ACTIVE TVSOP DGV 48 2000 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
TS3DV416DGVRG4 ACTIVE TVSOP DGV 48 2000 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in
a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check
http://www.ti.com/productcontent for the latest availability information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and
package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS
compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame
retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)
(3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder
temperature.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is
provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the
accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take
reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on
incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited
information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI
to Customer on an annual basis.
PACKAGE OPTION ADDENDUM
www.ti.com 27-Sep-2007
Addendum-Page 1
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device Package
Type Package
Drawing Pins SPQ Reel
Diameter
(mm)
Reel
Width
W1 (mm)
A0
(mm) B0
(mm) K0
(mm) P1
(mm) W
(mm) Pin1
Quadrant
TS3DV416DGGR TSSOP DGG 48 2000 330.0 24.4 8.6 15.8 1.8 12.0 24.0 Q1
TS3DV416DGVR TVSOP DGV 48 2000 330.0 16.4 7.1 10.2 1.6 12.0 16.0 Q1
PACKAGE MATERIALS INFORMATION
www.ti.com 11-Aug-2009
Pack Materials-Page 1
*All dimensions are nominal
Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm)
TS3DV416DGGR TSSOP DGG 48 2000 346.0 346.0 41.0
TS3DV416DGVR TVSOP DGV 48 2000 346.0 346.0 33.0
PACKAGE MATERIALS INFORMATION
www.ti.com 11-Aug-2009
Pack Materials-Page 2
MECHANICAL DATA
MTSS003D – JANUARY 1995 – REVISED JANUAR Y 1998
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
DGG (R-PDSO-G**) PLASTIC SMALL-OUTLINE PACKAGE
4040078/F 12/97
48 PINS SHOWN
0,25
0,15 NOM
Gage Plane
6,00
6,20 8,30
7,90
0,75
0,50
Seating Plane
25
0,27
0,17
24
A
48
1
1,20 MAX
M
0,08
0,10
0,50
0°–8°
56
14,10
13,90
48
DIM
A MAX
A MIN
PINS **
12,40
12,60
64
17,10
16,90
0,15
0,05
NOTES: A. All linear dimensions are in millimeters.
B. This drawing is subject to change without notice.
C. Body dimensions do not include mold protrusion not to exceed 0,15.
D. Falls within JEDEC MO-153
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