MMBZ5245BWQ 200mW SURFACE MOUNT ZENER DIODE Features Mechanical Data Small Surface Mount Package Ideally Suited for Automated Assembly Processes Totally Lead-Free & Fully RoHS Compliant (Notes 1 & 2) Halogen and Antimony Free. "Green" Device (Note 3) Qualified to AEC-Q101 Standards for High Reliability PPAP Capable (Note 4) Case: SOT323 Case Material: Molded Plastic, "Green" Molding Compound. UL Flammability Classification Rating 94V-0 Moisture Sensitivity: Level 1 per J-STD-020 Terminals: Matte Tin Finish Annealed over Alloy 42 Leadframe (Lead Free Plating). Solderable per MIL-STD-202, Method 208 e3 Polarity: See Diagram Weight: 0.006 grams (Approximate) Top View Device Schematic Ordering Information (Notes 4 & 5) Part Number MMBZ5245BWQ-7-F Notes: Qualification Automotive Packaging SOT323 Shipping 3000/Tape & Reel 1. No purposely added lead. Fully EU Directive 2002/95/EC (RoHS) & 2011/65/EU (RoHS 2) compliant. 2. See http://www.diodes.com/quality/lead_free.html for more information about Diodes Incorporated's definitions of Halogen- and Antimony-free, "Green" and Lead-free. 3. Halogen- and Antimony-free "Green" products are defined as those which contain <900ppm bromine, <900ppm chlorine (<1500ppm total Br + Cl) and <1000ppm antimony compounds. 4. Automotive products are AEC-Q101 qualified and are PPAP capable. Refer to https://www.diodes.com/quality/product-compliance-definitions/ 5. For packaging details, go to our website at https://www.diodes.com/design/support/packaging/diodes-packaging/. Marking Information KH5 = Product Type Marking Code (See Electrical Characteristics Table) YM = Date Code Marking Y = Year (ex: E = 2017) M = Month (ex: 9 = September) Date Code Key Year Code Month Code 2017 E Jan 1 2018 F Feb 2 MMBZ5245BWQ Document number: DS40377 Rev. 1 - 2 2019 G Mar 3 2020 H Apr 4 May 5 2021 I Jun 6 1 of 4 www.diodes.com 2022 J Jul 7 2023 K Aug 8 2024 L Sep 9 2025 M Oct O 2026 N Nov N Dec D November 2017 (c) Diodes Incorporated MMBZ5245BWQ Maximum Ratings (@TA = +25C, unless otherwise specified.) Characteristic Forward Voltage @ IF = 10mA Symbol VF Value 0.9 Unit V Symbol PD RJA TJ, TSTG Value 200 625 -65 to +150 Unit mW C/W C Thermal Characteristics Characteristic Power Dissipation (Note 6) Thermal Resistance, Junction to Ambient Air (Note 6) Operating and Storage Temperature Range Notes: 6. Mounted on FR-4 PC Board with recommended pad layout which can be found on our website at http://www.diodes.com/package-outlines.html. Electrical Characteristics Zener Voltage Range (Note 7) Test Current VZ @ IZT IZT Type Number Nom (V) 15 MMBZ5245BWQ Notes: (@TA = +25C, unless otherwise specified.) Min (V) 14.25 Max (V) 15.75 mA 8.5 Maximum Zener Impedance (Note 8) ZZK @ IZK ZZT @ IZT = 0.25mA 16 600 Maximum Reverse Leakage Current (Note 7) IR @ VR A 0.1 V 11 7. Short duration pulse test used to minimize self-heating effect. 8. f = 1KHz. 0.4 1000 Note 6 0.3 IZ, ZENER CURRENT (mA) P D, POWER DISSIPATION (W) 100 0.2 0.1 10 1 0.1 0.01 0.001 0 0 100 125 25 50 75 TA, AMBIENT TEMPERATURE (C) Fig. 1 Power Derating Curve MMBZ5245BWQ Document number: DS40377 Rev. 1 - 2 150 2 of 4 www.diodes.com 10 11 12 13 14 15 16 17 18 19 20 VZ, ZENER VOLTAGE (V) Fig.2 Typical Zener Breakdown Characteristics November 2017 (c) Diodes Incorporated MMBZ5245BWQ Package Outline Dimensions Please see http://www.diodes.com/package-outlines.html for the latest version. SOT323 D A2 c A1 a e L b E E1 F SOT323 Dim Min Max Typ A1 0.00 0.10 0.05 A2 0.90 1.00 0.95 b 0.25 0.40 0.30 c 0.10 0.18 0.11 D 1.80 2.20 2.15 E 2.00 2.20 2.10 E1 1.15 1.35 1.30 e 0.650 BSC e1 1.20 1.40 1.30 F 0.375 0.475 0.425 L 0.25 0.40 0.30 a 0 8 -All Dimensions in mm e1 Suggested Pad Layout Please see http://www.diodes.com/package-outlines.html for the latest version. SOT323 X Y Dimensions Y1 C G X Y Y1 G Value (in mm) 0.650 1.300 0.470 0.600 2.500 C MMBZ5245BWQ Document number: DS40377 Rev. 1 - 2 3 of 4 www.diodes.com November 2017 (c) Diodes Incorporated MMBZ5245BWQ IMPORTANT NOTICE DIODES INCORPORATED MAKES NO WARRANTY OF ANY KIND, EXPRESS OR IMPLIED, WITH REGARDS TO THIS DOCUMENT, INCLUDING, BUT NOT LIMITED TO, THE IMPLIED WARRANTIES OF MERCHANTABILITY AND FITNESS FOR A PARTICULAR PURPOSE (AND THEIR EQUIVALENTS UNDER THE LAWS OF ANY JURISDICTION). Diodes Incorporated and its subsidiaries reserve the right to make modifications, enhancements, improvements, corrections or other changes without further notice to this document and any product described herein. Diodes Incorporated does not assume any liability arising out of the application or use of this document or any product described herein; neither does Diodes Incorporated convey any license under its patent or trademark rights, nor the rights of others. Any Customer or user of this document or products described herein in such applications shall assume all risks of such use and will agree to hold Diodes Incorporated and all the companies whose products are represented on Diodes Incorporated website, harmless against all damages. Diodes Incorporated does not warrant or accept any liability whatsoever in respect of any products purchased through unauthorized sales channel. Should Customers purchase or use Diodes Incorporated products for any unintended or unauthorized application, Customers shall indemnify and hold Diodes Incorporated and its representatives harmless against all claims, damages, expenses, and attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized application. Products described herein may be covered by one or more United States, international or foreign patents pending. Product names and markings noted herein may also be covered by one or more United States, international or foreign trademarks. This document is written in English but may be translated into multiple languages for reference. Only the English version of this document is the final and determinative format released by Diodes Incorporated. LIFE SUPPORT Diodes Incorporated products are specifically not authorized for use as critical components in life support devices or systems without the express written approval of the Chief Executive Officer of Diodes Incorporated. As used herein: A. Life support devices or systems are devices or systems which: 1. are intended to implant into the body, or 2. support or sustain life and whose failure to perform when properly used in accordance with instructions for use provided in the labeling can be reasonably expected to result in significant injury to the user. B. A critical component is any component in a life support device or system whose failure to perform can be reasonably expected to cause the failure of the life support device or to affect its safety or effectiveness. Customers represent that they have all necessary expertise in the safety and regulatory ramifications of their life support devices or systems, and acknowledge and agree that they are solely responsible for all legal, regulatory and safety-related requirements concerning their products and any use of Diodes Incorporated products in such safety-critical, life support devices or systems, notwithstanding any devices- or systems-related information or support that may be provided by Diodes Incorporated. Further, Customers must fully indemnify Diodes Incorporated and its representatives against any damages arising out of the use of Diodes Incorporated products in such safety-critical, life support devices or systems. Copyright (c) 2017, Diodes Incorporated www.diodes.com MMBZ5245BWQ Document number: DS40377 Rev. 1 - 2 4 of 4 www.diodes.com November 2017 (c) Diodes Incorporated