
2016/09/01
Notes:
Revision: B
Electrical Characteristics (TA=25℃unless otherwise noted)
Parameter Symbol Condition Min Typ Max Unit
Off Characteristics
Drain-Source Breakdown Voltage BVDSS GS=0VV ID=-250μA --20- V
Zero Gate Voltage Drain Current IDSS DS=-V20V,VGS=0V - - 1 μA
Gate-Body Leakage Current IGSS GS=±V10V,VDS=0V - - ±10 μA
On Characteristics (Note 3)
Gate Threshold Voltage VGS(th) DS=VV
GS,ID=-250μA --0.35--0.55--0.9V
VGS=-4.5V, ID=-4A - 34 45 mΩ
Drain-Source On-State Resistance RDS(ON) VGS=-2.5V, ID=-4A - 44 60 mΩ
Forward Transconductance gFS DS=-5VV,ID=-4A 8 - - S
Dynamic Characteristics (No t e4)
Input Capacitance Clss - - 950 PF
Output Capacitance Coss - - PF 165
Reverse Transfer Capacitance Crss
VDS=-10V,VGS=0V,
F=1.0MHz
- 120 - PF
Switching Characteristics (Note 4)
Turn-on Delay Time td(on) - 12 nS
Turn-on Rise Time tr- 10 nS
Turn-Off Delay Time td(off) - 19 nS
Turn-Off Fall Time tf
VDD=-
10V,RL=2. 5Ω
VGS=-4.5V,R
GEN=3Ω
- 25 nS
Total Gate Charge Qg- 12 nC
Gate-Source Charge Qgs - - 1.4 nC
Gate-Drain Charge Qgd
VDS=-10V,ID=-4A,
VGS=-4.5V - 3.6 - nC
Drain-Source Diode Characteristics
Diode Forward Voltage (Note 3) VSD GS=0VV,IS=-4A - - --1.2 V
Diode Forward Current (Note 2) IS- -- - A4
1. Repetitive Rating: Pulse width limited by maximum junction temperature.
2. Surface Mounted on FR4 Board, t ≤ 10 sec.
3. Pulse Test: Pulse Width ≤ 300μs, Duty Cycle ≤ 2%.
4. Guaranteed by design, not subject to production
Micro Commercial Components
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