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FEATURES
· Unique 1-Wire® interface requires only one
port pin for communication
· Derives power from data line (“parasite
power”)—does not need a local power supply
· Multi-drop capability simplifies distributed
temperature sensing applications
· Requires no external components
· ±0.5°C accuracy from –10°C to +85°C
· Measures temperatures from –55°C to
+100°C (–67°F to +212°F)
· 9-bit thermometer resolution
· Converts temperature in 750 ms (max.)
· User–definable non-volatile temperature
alarm settings
· Alarm search command identifies and
addresses devices whose temperature is
outside of programmed limits (temperature
alarm condition)
· Ideal for use in remote sensing applications
(e.g., temperature probes) that do not have a
local power source
PIN ASSIGNMENT
PIN DESCRIPTION
GND - Ground
DQ - Data In/Out
NC - No Connect
DESCRIPTION
The DS18S20-PAR digital thermometer provides 9–bit centigrade temperature measurements and has an
alarm function with nonvolatile user-programmable upper and lower trigger points. The DS18S20-PAR
does not need an external power supply because it derives power directly from the data line (“parasite
power”). The DS18S20-PAR communicates over a 1-Wire bus, which by definition requires only one
data line (and ground) for communication with a central microprocessor. It has an operating temperature
range of –55°C to +100°C and is accurate to ±0.5°C over a range of –10°C to +85°C.
Each DS18S20-PAR has a unique 64-bit identification code, which allows multiple DS18S20-PARs to
function on the same 1–wire bus; thus, it is simple to use one microprocessor to control many
DS18S20-PARs distributed over a large area. Applications that can benefit from this feature include
HVAC environmental controls, temperature monitoring systems inside buildings, equipment or
machinery, and process monitoring and control systems.
DS18S20-PAR
1-Wire Parasite-Powe
r
Digital Thermomete
r
www.maxim
-
ic.com
TO-92
(
DS18S20-PAR
)
1
(
BOTTOM VIEW
)
23
DALLAS
18S20P
1
GND
DQ
NC
23
1-Wire is a registered trademark of Dallas Semiconductor.
DS18S20-PAR
2 of 20
DETAILED PIN DESCRIPTIONS Table 1
PIN SYMBOL DESCRIPTION
1 GND Ground.
2DQ
Data Input/Output pin. Open-drain 1-Wire interface pin. Also provides power
to the device when used in parasite power mode (see “Parasite Power” section.)
3NCNo Connect. Doesn’t connect to internal circuit.
OVERVIEW
The DS18S20-PAR uses Dallas’ exclusive 1-Wire bus protocol that implements bus communication
using one control signal. The control line requires a weak pullup resistor since all devices are linked to
the bus via a 3-state or open-drain port (the DQ pin in the case of the DS18S20-PAR). In this bus system,
the microprocessor (the master device) identifies and addresses devices on the bus using each device’s
unique 64-bit code. Because each device has a unique code, the number of devices that can be addressed
on one bus is virtually unlimited. The 1-Wire bus protocol, including detailed explanations of the
commands and “time slots,” is covered in the 1-WIRE BUS SYSTEM section of this datasheet.
An important feature of the DS18S20-PAR is its ability to operate without an external power supply.
Power is instead supplied through the 1-Wire pullup resistor via the DQ pin when the bus is high. The
high bus signal also charges an internal capacitor (CPP), which then supplies power to the device when the
bus is low. This method of deriving power from the 1-Wire bus is referred to as “parasite power.”
Figure 1 shows a block diagram of the DS18S20-PAR, and pin descriptions are given in Table 1. The
64-bit ROM stores the device’s unique serial code. The scratchpad memory contains the 2-byte
temperature register that stores the digital output from the temperature sensor. In addition, the scratchpad
provides access to the 1-byte upper and lower alarm trigger registers (TH and TL). The TH and TL
registers are nonvolatile (EEPROM), so they will retain their data when the device is powered down.
DS18S20-PAR BLOCK DIAGRAM Figure 1
CPP
VPU
4.7K
64-BIT ROM
AND
1-wire PORT
D
Q
INTERNAL VDD
PARASITE POWER
CIRCUIT MEMORY CONTROL
LOGIC
SCRATCHPAD
8-BIT CRC GENERATOR
TEMPERATURE SENSOR
ALARM HIGH TRIGGER (TH)
REGISTER (EEPROM)
ALARM LOW TRIGGER (TL)
REGISTER (EEPROM)
GND
DS18S20-PAR
DS18S20-PAR
3 of 20
PARASITE POWER
The DS18S20-PAR’s parasite power circuit allows the DS18S20-PAR to operate without a local external
power supply. This ability is especially useful for applications that require remote temperature sensing or
that are very space constrained. Figure 1 shows the DS18S20-PAR’s parasite-power control circuitry,
which “steals” power from the 1-Wire bus via the DQ pin when the bus is high. The stolen charge
powers the DS18S20-PAR while the bus is high, and some of the charge is stored on the parasite power
capacitor (CPP) to provide power when the bus is low.
The 1-Wire bus and CPP can provide sufficient parasite power to the DS18S20-PAR for most operations
as long as the specified timing and voltage requirements are met (refer to the DC ELECTRICAL
CHARACTERISTICS and the AC ELECTRICAL CHARACTERISTICS sections of this data sheet).
However, when the DS18S20-PAR is performing temperature conversions or copying data from the
scratchpad memory to EEPROM, the operating current can be as high as 1.5 mA. This current can cause
an unacceptable voltage drop across the weak 1-Wire pullup resistor and is more current than can be
supplied by CPP. To assure that the DS18S20-PAR has sufficient supply current, it is necessary to
provide a strong pullup on the 1-Wire bus whenever temperature conversions are taking place or data is
being copied from the scratchpad to EEPROM. This can be accomplished by using a MOSFET to pull
the bus directly to the rail as shown in Figure 2. The 1-Wire bus must be switched to the strong pullup
within 10 ms (max) after a Convert T [44h] or Copy Scratchpad [48h] command is issued, and the bus
must be held high by the pullup for the duration of the conversion (tconv) or data transfer (twr = 10 ms).
No other activity can take place on the 1-Wire bus while the pullup is enabled.
SUPPLYING THE DS18S20-PAR DURING TEMPERATURE CONVERSIONS
Figure 2
OPERATION – MEASURING TEMPERATURE
The core functionality of the DS18S20-PAR is its direct-to-digital temperature sensor. The temperature
sensor output has 9-bit resolution, which corresponds to 0.5°C steps. The DS18S20-PAR powers-up in a
low-power idle state; to initiate a temperature measurement and A-to-D conversion, the master must issue
a Convert T [44h] command. Following the conversion, the resulting thermal data is stored in the 2-byte
temperature register in the scratchpad memory and the DS18S20-PAR returns to its idle state. The
DS18S20-PAR output data is calibrated in degrees centigrade; for Fahrenheit applications, a lookup table
or conversion routine must be used. The temperature data is stored as a 16-bit sign-extended two’s
complement number in the temperature register (see Figure 3). The sign bits (S) indicate if the
temperature is positive or negative: for positive numbers S = 0 and for negative numbers S = 1. Table 2
gives examples of digital output data and the corresponding temperature reading.
Resolutions greater than 9 bits can be calculated using the data from the temperature, COUNT REMAIN
and COUNT PER °C registers in the scratchpad. Note that the COUNT PER °C register is hard-wired to
VPU
VPU
4.7K
1-Wire Bus
Micro-
processor
DS18S20-PA
R
GND DQ
To Other
1-Wire Devices
DS18S20-PAR
4 of 20
16 (10h). After reading the scratchpad, the TEMP_READ value is obtained by truncating the 0.5°C bit
(bit 0) from the temperature data (see Figure 3). The extended resolution temperature can then be
calculated using the following equation:
CPERCOUNT
REMAINCOUNTCPERCOUNT
READTEMPETEMPERATUR
__
___
25.0_ -
+-=
TEMPERATURE REGISTER FORMAT Figure 3
bit 7 bit 6 bit 5 bit 4 bit 3 bit 2 bit 1 bit 0
LS Byte 262524232221202-1
bit 15 bit 14 bit 13 bit 12 bit 11 bit 10 bit 9 bit 8
MS Byte SSSSSSSS
TEMPERATURE/DATA RELATIONSHIP Table 2
TEMPERATURE DIGITAL OUTPUT
(Binary)
DIGITAL OUTPUT
(Hex)
+85.0°C* 0000 0000 1010 1010 00AAh
+25.0°C 0000 0000 0011 0010 0032h
+0.5°C 0000 0000 0000 0001 0001h
0°C 0000 0000 0000 0000 0000h
-0.5°C 1111 1111 1111 1111 FFFFh
-25.0°C 1111 1111 1100 1110 FFCEh
-55.0°C 1111 1111 1001 0010 FF92h
*The power-on reset value of the temperature register is +85°C
OPERATION ALARM SIGNALING
After the DS18S20-PAR performs a temperature conversion, the temperature value is compared to the
user-defined two’s complement alarm trigger values stored in the 1-byte TH and TL registers (see Figure
4). The sign bit (S) indicates if the value is positive or negative: for positive numbers S = 0 and for
negative numbers S = 1. The TH and TL registers are nonvolatile (EEPROM) so they will retain data
when the device is powered down. TH and TL can be accessed through bytes 2 and 3 of the scratchpad as
explained in the MEMORY section of this datasheet.
TH AND TL REGISTER FORMAT Figure 4
bit 7 bit 6 bit 5 bit 4 bit 3 bit 2 bit 1 bit 0
S2
6252525222120
Only bits 8 through 1 of the temperature register are used in the TH and TL comparison since TH and TL
are 8-bit registers. If the result of a temperature measurement is higher than TH or lower than TL, an
alarm condition exists and an alarm flag is set inside the DS18S20-PAR. This flag is updated after every
temperature measurement; therefore, if the alarm condition goes away, the flag will be turned off after the
next temperature conversion.
The master device can check the alarm flag status of all DS DS18S20-PARs on the bus by issuing an
Alarm Search [ECh] command. Any DS18S20-PARs with a set alarm flag will respond to the command,
DS18S20-PAR
5 of 20
so the master can determine exactly which DS18S20-PARs have experienced an alarm condition. If an
alarm condition exists and the TH or TL settings have changed, another temperature conversion should be
done to validate the alarm condition.
64-BIT LASERED ROM CODE
Each DS18S20-PAR contains a unique 64–bit code (see Figure 5) stored in ROM. The least significant 8
bits of the ROM code contain the DS18S20-PAR’s 1–wire family code: 10h. The next 48 bits contain a
unique serial number. The most significant 8 bits contain a cyclic redundancy check (CRC) byte that is
calculated from the first 56 bits of the ROM code. A detailed explanation of the CRC bits is provided in
the CRC GENERATION section. The 64–bit ROM code and associated ROM function control logic
allow the DS18S20-PAR to operate as a 1–wire device using the protocol detailed in the 1-WIRE BUS
SYSTEM section of this datasheet.
64-BIT LASERED ROM CODE Figure 5
8-BIT CRC 48-BIT SERIAL NUMBER 8-BIT FAMILY CODE (10h)
MEMORY
The DS18S20-PAR’s memory is organized as shown in Figure 6. The memory consists of an SRAM
scratchpad with nonvolatile EEPROM storage for the high and low alarm trigger registers (TH and TL).
Note that if the DS18S20-PAR alarm function is not used, the TH and TL registers can serve as general-
purpose memory. All memory commands are described in detail in the DS18S20-PAR FUNCTION
COMMANDS section.
Byte 0 and byte 1 of the scratchpad contain the LSB and the MSB of the temperature register,
respectively. These bytes are read-only. Bytes 2 and 3 provide access to TH and TL registers. Bytes 4
and 5 are reserved for internal use by the device and cannot be overwritten; these bytes will return all 1s
when read. Bytes 6 and 7 contain the COUNT REMAIN and COUNT PER ºC registers, which can be
used to calculate extended resolution results as explained in the OPERATION – MEASURING
TEMPERATURE section. Byte 8 of the scratchpad is read-only and contains the cyclic redundancy
check (CRC) code for bytes 0 through 7 of the scratchpad. The DS18S20-PAR generates this CRC using
the method described in the CRC GENERATION section.
Data is written to bytes 2 and 3 of the scratchpad using the Write Scratchpad [4Eh] command; the data
must be transmitted to the DS18S20-PAR starting with the least significant bit of byte 2. To verify data
integrity, the scratchpad can be read (using the Read Scratchpad [BEh] command) after the data is
written. When reading the scratchpad, data is transferred over the 1-Wire bus starting with the least
significant bit of byte 0. To transfer the TH and TL data from the scratchpad to EEPROM, the master
must issue the Copy Scratchpad [48h] command.
Data in the EEPROM registers is retained when the device is powered down; at power-up the EEPROM
data is reloaded into the corresponding scratchpad locations. Data can also be reloaded from EEPROM
to the scratchpad at any time using the Recall E2 [B8h] command. The master can issue “read time slots”
(see the 1-WIRE BUS SYSTEM section) following the Recall E2 command and the DS18S20-PAR will
indicate the status of the recall by transmitting 0 while the recall is in progress and 1 when the recall is
done.
MSB MSBLSB LSB LSBMSB
DS18S20-PAR
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DS18S20-PAR MEMORY MAP Figure 6
SCRATCHPAD (Power-up State)
byte 0 Temperature LSB (AAh)
byte 1 Temperature MSB (00h) EEPROM
byte 2 TH Register or User Byte 1* TH Register or User Byte 1
byte 3 TL Register or User Byte 2* TL Register or User Byte 2
byte 4 Reserved (FFh)
byte 5 Reserved (FFh)
byte 6 COUNT REMAIN (0Ch)
byte 7 COUNT PER °C (10h)
byte 8 CRC*
*Power-up state depends on value(s) stored
in EEPROM
CRC GENERATION
CRC bytes are provided as part of the DS18S20-PAR’s 64-bit ROM code and in the 9th byte of the
scratchpad memory. The ROM code CRC is calculated from the first 56 bits of the ROM code and is
contained in the most significant byte of the ROM. The scratchpad CRC is calculated from the data
stored in the scratchpad, and therefore it changes when the data in the scratchpad changes. The CRCs
provide the bus master with a method of data validation when data is read from the DS18S20-PAR. To
verify that data has been read correctly, the bus master must re-calculate the CRC from the received data
and then compare this value to either the ROM code CRC (for ROM reads) or to the scratchpad CRC (for
scratchpad reads). If the calculated CRC matches the read CRC, the data has been received error free. The
comparison of CRC values and the decision to continue with an operation are determined entirely by the
bus master. There is no circuitry inside the DS18S20-PAR that prevents a command sequence from
proceeding if the DS18S20-PAR CRC (ROM or scratchpad) does not match the value generated by the
bus master.
The equivalent polynomial function of the CRC (ROM or scratchpad) is: CRC = X8 + X5 + X4 + 1
The bus master can re-calculate the CRC and compare it to the CRC values from the DS18S20-PAR
using the polynomial generator shown in Figure 7. This circuit consists of a shift register and XOR gates,
and the shift register bits are initialized to 0. Starting with the least significant bit of the ROM code or the
least significant bit of byte 0 in the scratchpad, one bit at a time should shifted into the shift register.
After shifting in the 56th bit from the ROM or the most significant bit of byte 7 from the scratchpad, the
polynomial generator will contain the re-calculated CRC. Next, the 8-bit ROM code or scratchpad CRC
from the DS18S20-PAR must be shifted into the circuit. At this point, if the re-calculated CRC was
correct, the shift register will contain all 0s. Additional information about the Dallas 1-Wire cyclic
redundancy check is available in Application Note 27 entitled “Understanding and Using Cyclic
Redundancy Checks with Dallas Semiconductor Touch Memory Products.”
CRC GENERATOR Figure 7
(MSB) (LSB)
XOR XOR XOR
INPUT
(85°C)
DS18S20-PAR
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1-WIRE BUS SYSTEM
The 1-Wire bus system uses a single bus master to control one or more slave devices. The DS18S20-
PAR is always a slave. When there is only one slave on the bus, the system is referred to as a “single-
drop” system; the system is “multi-drop” if there are multiple slaves on the bus. All data and commands
are transmitted least significant bit first over the 1-Wire bus.
The following discussion of the 1-Wire bus system is broken down into three topics: hardware
configuration, transaction sequence, and 1-Wire signaling (signal types and timing).
HARDWARE CONFIGURATION
The 1-Wire bus has by definition only a single data line. Each device (master or slave) interfaces to the
data line via an open drain or 3–state port. This allows each device to “release” the data line when the
device is not transmitting data so the bus is available for use by another device. The 1-Wire port of the
DS18S20-PAR (the DQ pin) is open drain with an internal circuit equivalent to that shown in Figure 8.
The 1-Wire bus requires an external pullup resistor of approximately 5 kW; thus, the idle state for the 1-
Wire bus is high. If for any reason a transaction needs to be suspended, the bus MUST be left in the idle
state if the transaction is to resume. Infinite recovery time can occur between bits so long as the 1-Wire
bus is in the inactive (high) state during the recovery period. If the bus is held low for more than 480 ms,
all components on the bus will be reset. In addition, to assure that the DS18S20-PAR has sufficient
supply current during temperature conversions, it is necessary to provide a strong pullup (such as a
MOSFET) on the 1-Wire bus whenever temperature conversions or EEPROM writes are taking place (as
described in the PARASITE POWER section).
HARDWARE CONFIGURATION Figure 8
TRANSACTION SEQUENCE
The transaction sequence for accessing the DS18S20-PAR is as follows:
Step 1. Initialization
Step 2. ROM Command (followed by any required data exchange)
Step 3. DS18S20-PAR Function Command (followed by any required data exchange)
5 µA
Typ.
DS18S20-PAR 1-WIRE PORT
100 W
M
OS
FET
TX
RX
DQ
Pin
VPU
4.7K
RX
TX
RX = RECEIVE
TX = TRANSMIT
1-wire bus
VPU
Micro-
processor Strong
Pullup
DS18S20-PAR
8 of 20
It is very important to follow the transaction sequence every time the DS18S20-PAR is accessed, as the
DS18S20-PAR will not respond if any steps in the sequence are missing or out of order. Exceptions to
this rule are the Search ROM [F0h] and Alarm Search [ECh] commands. After issuing either of these
ROM commands, the master must return to Step 1 in the sequence.
INITIALIZATION
All transactions on the 1-Wire bus begin with an initialization sequence. The initialization sequence
consists of a reset pulse transmitted by the bus master followed by presence pulse(s) transmitted by the
slave(s). The presence pulse lets the bus master know that slave devices (such as the DS18S20-PAR) are
on the bus and are ready to operate. Timing for the reset and presence pulses is detailed in the
1-WIRE SIGNALING section.
ROM COMMANDS
After the bus master has detected a presence pulse, it can issue a ROM command. These commands
operate on the unique 64–bit ROM codes of each slave device and allow the master to single out a
specific device if many are present on the 1-Wire bus. These commands also allow the master to
determine how many and what types of devices are present on the bus or if any device has experienced an
alarm condition. There are five ROM commands, and each command is 8 bits long. The master device
must issue an appropriate ROM command before issuing a DS18S20-PAR function command. A
flowchart for operation of the ROM commands is shown in Figure 9.
SEARCH ROM [F0h]
When a system is initially powered up, the master must identify the ROM codes of all slave devices on
the bus, which allows the master to determine the number of slaves and their device types. The master
learns the ROM codes through a process of elimination that requires the master to perform a Search ROM
cycle (i.e., Search ROM command followed by data exchange) as many times as necessary to identify all
of the slave devices. If there is only one slave on the bus, the simpler Read ROM command (see below)
can be used in place of the Search ROM process. For a detailed explanation of the Search ROM
procedure, refer to the iButton® Book of Standards at www.ibutton.com/ibuttons/standard.pdf. After
every Search ROM cycle, the bus master must return to Step 1 (Initialization) in the transaction sequence.
READ ROM [33h]
This command can only be used when there is one slave on the bus. It allows the bus master to read the
slave’s 64-bit ROM code without using the Search ROM procedure. If this command is used when there
is more than one slave present on the bus, a data collision will occur when all the slaves attempt to
respond at the same time.
MATCH ROM [55h]
The match ROM command followed by a 64–bit ROM code sequence allows the bus master to address a
specific slave device on a multi-drop or single-drop bus. Only the slave that exactly matches the 64–bit
ROM code sequence will respond to the function command issued by the master; all other slaves on the
bus will wait for a reset pulse.
SKIP ROM [CCh]
The master can use this command to address all devices on the bus simultaneously without sending out
any ROM code information. For example, the master can make all DS18S20-PARs on the bus perform
simultaneous temperature conversions by issuing a Skip ROM command followed by a Convert T [44h]
command. Note, however, that the Skip ROM command can only be followed by the Read Scratchpad
[BEh] command when there is one slave on the bus. This sequence saves time by allowing the master to
iButton is a registered trademark of Dallas Semiconductor.
DS18S20-PAR
9 of 20
read from the device without sending its 64–bit ROM code. This sequence will cause a data collision on
the bus if there is more than one slave since multiple devices will attempt to transmit data simultaneously.
ALARM SEARCH [ECh]
The operation of this command is identical to the operation of the Search ROM command except that
only slaves with a set alarm flag will respond. This command allows the master device to determine if
any DS18S20-PARs experienced an alarm condition during the most recent temperature conversion.
After every Alarm Search cycle (i.e., Alarm Search command followed by data exchange), the bus master
must return to Step 1 (Initialization) in the transaction sequence. Refer to the OPERATION – ALARM
SIGNALING section for an explanation of alarm flag operation.
DS18S20-PAR FUNCTION COMMANDS
After the bus master has used a ROM command to address the DS18S20-PAR with which it wishes to
communicate, the master can issue one of the DS18S20-PAR function commands. These commands
allow the master to write to and read from the DS18S20-PAR’s scratchpad memory, initiate temperature
conversions and determine the power supply mode. The DS18S20-PAR function commands, which are
described below, are summarized in Table 4 and illustrated by the flowchart in Figure 10.
CONVERT T [44h]
This command initiates a single temperature conversion. Following the conversion, the resulting thermal
data is stored in the temperature register, COUNT REMAIN register and COUNT PER °C register in the
scratchpad memory, and the DS18S20-PAR returns to its low-power idle state. Within 10 ms (max) after
this command is issued the master must enable a strong pullup on the 1-Wire bus for the duration of the
conversion (tconv) as described in the PARASITE POWER section.
WRITE SCRATCHPAD [4Eh]
This command allows the master to write 2 bytes of data to the DS18S20-PAR’s scratchpad. The first
byte is written into the TH register (byte 2 of the scratchpad), and the second byte is written into the TL
register (byte 3 of the scratchpad). Data must be transmitted least significant bit first. Both bytes MUST
be written before the master issues a reset, or the data may be corrupted.
READ SCRATCHPAD [BEh]
This command allows the master to read the contents of the scratchpad. The data transfer starts with the
least significant bit of byte 0 and continues through the scratchpad until the 9th byte (byte 8 – CRC) is
read. If only part of the scratchpad contents is required, the master may issue a reset to terminate reading
at any time.
COPY SCRATCHPAD [48h]
This command copies the contents of the scratchpad TH and TL registers (bytes 2 and 3) to EEPROM.
Within 10 ms (max) after this command is issued the master must enable a strong pullup on the 1-Wire
bus for at least 10 ms as described in the PARASITE POWER section.
RECALL E2 [B8h]
This command recalls the alarm trigger values (TH and TL) from EEPROM and places the data in bytes 2
and 3, respectively, in the scratchpad memory. The master device can issue “read time slots” (see the 1-
WIRE BUS SYSTEM section) following the Recall E2 command and the DS18S20-PAR will indicate the
status of the recall by transmitting 0 while the recall is in progress and 1 when the recall is done. The
recall operation happens automatically at power-up, so valid data is available in the scratchpad as soon as
power is applied to the device.
DS18S20-PAR
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DS18S20-PAR FUNCTION COMMAND SET Table 4
Command Description Protocol
1-Wire Bus Activity
After Command is Issued Notes
TEMPERATURE CONVERSION COMMANDS
Convert T Initiates temperature
conversion.
44h None 1
MEMORY COMMANDS
Read Scratchpad Reads the entire scratchpad
including the CRC byte.
BEh DS18S20-PAR transmits up
to 9 data bytes to master.
2
Write Scratchpad Writes data into scratchpad
bytes 2 and 3 (TH and TL).
4Eh Master transmits 2 data
bytes to DS18S20-PAR.
3
Copy Scratchpad Copies TH and TL data from the
scratchpad to EEPROM.
48h None 1
Recall E2Recalls TH and TL data from
EEPROM to the scratchpad.
B8h DS18S20-PAR transmits
recall status to master.
NOTES:
1. The master must enable a strong pullup on the 1-Wire bus during temperature conversions and copies
from the scratchpad to EEPROM. No other bus activity may take place during this time.
2. The master can interrupt the transmission of data at any time by issuing a reset.
3. Both bytes must be written before a reset is issued.
DS18S20-PAR
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ROM COMMANDS FLOW CHART Figure 9
CCh
SKIP ROM
COMMAND
MASTER TX
RESET PULSE
DS18S20-PAR
TX PRESENCE
PULSE
MASTER TX ROM
COMMAND
33h
READ ROM
COMMAND
55h
MATCH ROM
COMMAND
F0h
SEARCH ROM
COMMAND
ECh
ALARM SEARCH
COMMAND
MASTER TX
BIT 0
BIT 0
MAT
H?
MASTER TX
BIT 1
BIT 1
MAT
H?
BIT 63
MATCH?
MASTER TX
BIT 63
N
YYYY
Y
NN
NN
N
N
N
Y
Y
Y
BIT 0
MAT
H?
BIT 1
MAT
H?
BIT 63
MATCH?
N
N
N
Y
Y
Y
DS18S20-PAR TX
FAMILY CODE
1 BYTE
DS18S20-PAR TX
SERIAL NUMBER
6 BYTES
DS18S20-PAR TX
CRC BYTE
DS18S20-PAR T
X
BIT 0
DS18S20-PAR TX BIT 0
MASTER TX BIT 0
N
Y
DEVICE(S)
WITH ALARM
FLAG SET?
Initialization
Sequence
MASTER TX
FUNCTION
COMMAND
(FIGURE 10)
DS18S20-PAR T
X
BIT 0
DS18S20-PAR TX BIT 0
MASTER TX BIT 0
DS18S20-PAR T
X
BIT 1
DS18S20-PAR TX BIT 1
MASTER TX BIT 1
DS18S20-PAR T
X
BIT 63
DS18S20-PAR TX BIT 63
MASTER TX BIT 63
DS18S20-PAR
12 of 20
DS18S20-PAR FUNCTION COMMANDS FLOW CHART Figure 10
MASTER TX
FUNCTION
COMMAND
Y
N
44h
CONVERT
TEMPERATURE
?
MASTER ENABLES
STRONG PULLUP ON DQ
DS18S20-PAR CONVERTS
TEMPERATURE
MASTER DISABLES
STRONG PULLUP
Y
N
48h
COPY
SCRATCHPAD
?
MASTER ENABLES
STRONG PULL-UP ON DQ
DATA COPIED FROM
SCRATCHPAD TO EEPROM
MASTER DISABLES
STRONG PULLUP
RETURN TO INITIALIZATION
SEQUENCE (FIGURE 9) FOR
NEXT TRANSACTION
Y
N
Y
BEh
READ
SCRATCHPAD
?
HAVE 8 BYTES
BEEN READ
?
N
MASTER
TX RESET
?
MASTER RX DATA BYTE
FROM SCRATCHPAD
N
Y
MASTER RX SCRATCHPAD
CRC BYTE
MASTER
RX “1s”
Y
NB8h
RECALL E2
?
MASTER BEGINS DATA
RECALL FROM E2 PROM
DEVICE
BUSY RECALLING
DATA
?
N
Y
MASTER
RX “0s”
MASTER TX TH BYTE
TO SCRATCHPAD
Y
N
4Eh
WRITE
SCRATCHPAD
?
MASTER TX TL BYTE
TO SCRATCHPAD
DS18S20-PAR
13 of 20
1-WIRE SIGNALING
The DS18S20-PAR uses a strict 1-Wire communication protocol to insure data integrity. Several signal
types are defined by this protocol: reset pulse, presence pulse, write 0, write 1, read 0, and read 1. All of
these signals, with the exception of the presence pulse, are initiated by the bus master.
INITIALIZATION PROCEDURE: RESET AND PRESENCE PULSES
All communication with the DS18S20-PAR begins with an initialization sequence that consists of a reset
pulse from the master followed by a presence pulse from the DS18S20-PAR. This is illustrated in
Figure 11. When the DS18S20-PAR sends the presence pulse in response to the reset, it is indicating to
the master that it is on the bus and ready to operate.
During the initialization sequence the bus master transmits (TX) the reset pulse by pulling the 1-Wire bus
low for a minimum of 480 ms. The bus master then releases the bus and goes into receive mode (RX).
When the bus is released, the 5k pullup resistor pulls the 1-Wire bus high. When the DS18S20-PAR
detects this rising edge, it waits 15–60 ms and then transmits a presence pulse by pulling the 1-Wire bus
low for 60–240 ms.
INITIALIZATION TIMING Figure 11
READ/WRITE TIME SLOTS
The bus master writes data to the DS18S20-PAR during write time slots and reads data from the
DS18S20-PAR during read time slots. One bit of data is transmitted over the 1-Wire bus per time slot.
WRITE TIME SLOTS
There are two types of write time slots: “Write 1” time slots and “Write 0” time slots. The bus master
uses a Write 1 time slot to write a logic 1 to the DS18S20-PAR and a Write 0 time slot to write a logic 0
to the DS18S20-PAR. All write time slots must be a minimum of 60 ms in duration with a minimum of a
1 ms recovery time between individual write slots. Both types of write time slots are initiated by the
master pulling the 1-Wire bus low (see Figure 12).
To generate a Write 1 time slot, after pulling the 1-Wire bus low, the bus master must release the 1-Wire
bus within 15 ms. When the bus is released, the 5k pullup resistor will pull the bus high. To generate a
Write 0 time slot, after pulling the 1-Wire bus low, the bus master must continue to hold the bus low for
the duration of the time slot (at least 60 ms).
LINE TYPE LEGEND
Bus master pulling low
DS18S20-PAR pulling low
Resistor
p
ullu
p
VPU
GND
1-WIRE BUS
480 ms minimum 480 ms minimum
DS18S20-PAR TX
presence pulse
60-240 ms
MASTER TX RESET PULSE MASTER
R
X
DS18S20-PA
R
waits 15-60 ms
DS18S20-PAR
14 of 20
The DS18S20-PAR samples the 1-Wire bus during a window that lasts from 15 ms to 60 ms after the
master initiates the write time slot. If the bus is high during the sampling window, a 1 is written to the
DS18S20-PAR. If the line is low, a 0 is written to the DS18S20-PAR.
READ/WRITE TIME SLOT TIMING DIAGRAM Figure 12
READ TIME SLOTS
The DS18S20-PAR can only transmit data to the master when the master issues read time slots.
Therefore, the master must generate read time slots immediately after issuing a Read Scratchpad [BEh]
command, so that the DS18S20-PAR can provide the requested data. In addition, the master can generate
read time slots after issuing a Recall E2 [B8h] command to find out the recall status as explained in the
DS18S20-PAR FUNCTION COMMAND section.
All read time slots must be a minimum of 60 ms in duration with a minimum of a 1 ms recovery time
between slots. A read time slot is initiated by the master device pulling the 1-Wire bus low for a
minimum of 1 ms and then releasing the bus (see Figure 12). After the master initiates the read time slot,
the DS18S20-PAR will begin transmitting a 1 or 0 on bus. The DS18S20-PAR transmits a 1 by leaving
the bus high and transmits a 0 by pulling the bus low. When transmitting a 0, the DS18S20-PAR will
LINE TYPE LEGEND
Bus master pulling low DS18S20-PAR pulling low
Resistor pullup
45 ms
15 ms
VPU
GND
1-WIRE BUS
60 ms < TX “0” < 120
1 ms < TREC < ¥
DS18S20-PAR samples
MIN TYP MA
X
15 ms30 ms
> 1 ms
MASTER WRITE “0” SLOT MASTER WRITE “1” SLOT
DS18S20-PAR samples
MIN TYP MA
X
VPU
GND
1-WIRE BUS
15 ms
MASTER READ “0” SLOT MASTER READ “1” SLOT
Master samples Master samples
START
OF SLOT
START
OF SLOT
> 1 ms
1 ms < TREC < ¥
15 ms15 ms30 ms
15 ms
> 1 ms
DS18S20-PAR
15 of 20
release the bus by the end of the time slot, and the bus will be pulled back to its high idle state by the
pullup resister. Output data from the DS18S20-PAR is valid for 15 ms after the falling edge that initiated
the read time slot. Therefore, the master must release the bus and then sample the bus state within 15 ms
from the start of the slot.
Figure 13 illustrates that the sum of TINIT, TRC, and TSAMPLE must be less than 15 ms for a read time slot.
Figure 14 shows that system timing margin is maximized by keeping TINIT and TRC as short as possible
and by locating the master sample time during read time slots towards the end of the 15 ms period.
DETAILED MASTER READ 1 TIMING Figure 13
RECOMMENDED MASTER READ 1 TIMING Figure 14
VPU
GND
1-WIRE BUS
15 ms
V
IH of Master
TRC
TINT > 1 msMaster samples
LINE TYPE LEGEND
Bus master pulling low
Resistor pullup
VPU
GND
1-WIRE BUS
15 ms
V
IH of Master
TRC =
small
TINT =
small
Master samples
DS18S20-PAR
16 of 20
DS18S20-PAR OPERATION EXAMPLE 1
In this example there is only one DS18S20-PAR on the bus. The master writes to the TH and TL registers
in the DS18S20-PAR scratchpad and then reads the scratchpad and recalculates the CRC to verify the
data. The master then copies the scratchpad contents to EEPROM.
MASTER MODE DATA (LSB FIRST) COMMENTS
TX Reset Master issues reset pulse.
RX Presence DS18S20-PAR responds with presence pulse.
TX CCh Master issues Skip ROM command.
TX 4Eh Master issues Write Scratchpad command.
TX 2 data bytes Master sends two data bytes to scratchpad (TH and TL).
TX Reset Master issues reset pulse.
RX Presence DS18S20-PAR responds with presence pulse.
TX CCh Master issues Skip ROM command.
TX BEh Master issues Read Scratchpad command.
RX 9 data bytes Master reads entire scratchpad including CRC. The master then
recalculates the CRC of the first eight data bytes from the
scratchpad and compares the calculated CRC with the read CRC
(byte 9). If they match, the master continues; if not, the read
operation is repeated.
TX Reset Master issues reset pulse.
RX Presence DS18S20-PAR responds with presence pulse.
TX CCh Master issues Skip ROM command.
TX 48h Master issues Copy Scratchpad command.
TX DQ line held high by
strong pullup
Master applies strong pullup to DQ for at least 10 ms while copy
operation is in progress.
DS18S20-PAR
17 of 20
DS18S20-PAR OPERATION EXAMPLE 2
In this example there are multiple DS18S20-PARs on the bus. The bus master initiates a temperature
conversion in a specific DS18S20-PAR and then reads its scratchpad and recalculates the CRC to verify
the data.
MASTER MODE DATA (LSB FIRST) COMMENTS
TX Reset Master issues reset pulse.
RX Presence DS18S20-PARs respond with presence pulse.
TX 55h Master issues Match ROM command.
TX 64-bit ROM code Master sends DS18S20-PAR ROM code.
TX 44h Master issues Convert T command.
TX DQ line held high by
strong pullup
Master applies strong pullup to DQ for the duration of the
conversion (tconv).
TX Reset Master issues reset pulse.
RX Presence DS18S20-PARs respond with presence pulse.
TX 55h Master issues Match ROM command.
TX 64-bit ROM code Master sends DS18S20-PAR ROM code.
TX BEh Master issues Read Scratchpad command.
RX 9 data bytes Master reads entire scratchpad including CRC. The master
then recalculates the CRC of the first eight data bytes from the
scratchpad and compares the calculated CRC with the read
CRC (byte 9). If they match, the master continues; if not, the
read operation is repeated.
DS18S20-PAR OPERATION EXAMPLE 3
In this example there is only one DS18S20-PAR on the bus. The bus master initiates a temperature
conversion then reads the DS18S20-PAR scratchpad and calculates a higher resolution result using the
data from the temperature, COUNT REMAIN and COUNT PER °C registers.
MASTER MODE DATA (LSB FIRST) COMMENTS
TX Reset Master issues reset pulse.
TR Presence DS18S20-PAR responds with presence pulse.
TX CCh Master issues Skip ROM command.
TX 44h Master issues Convert T command.
TX DQ line held high by
strong pullup
Master applies strong pullup to DQ for the duration of the
conversion (tconv).
TX Reset Master issues reset pulse.
RX Presence DS18S20-PAR responds with presence pulse.
TX CCh Master issues Skip ROM command.
TX BEh Master issues Read Scratchpad command.
RX 9 data bytes Master reads entire scratchpad including CRC. The master
then recalculates the CRC of the first eight data bytes from the
scratchpad and compares the calculated CRC with the read
CRC (byte 9). If they match, the master continues; if not, the
read operation is repeated. The master also calculates the
TEMP_READ value and stores the contents of the COUNT
REMAIN and COUNT PER °C registers.
TX Reset Master issues reset pulse.
RX Presence DS18S20-PAR responds with presence pulse.
- - CPU calculates extended resolution temperature using the
equation in the OPERATION - MEASURING
TEMPERATURE section of this datasheet.
DS18S20-PAR
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ABSOLUTE MAXIMUM RATINGS*
Voltage on any pin relative to ground –0.5V to +6.0V
Operating temperature –55°C to +100°C
Storage temperature –55°C to +125°C
Soldering temperature See J-STD-020A Specification
*These are stress ratings only and functional operation of the device at these or any other conditions
above those indicated in the operation sections of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods of time may affect reliability.
DC ELECTRICAL CHARACTERISTICS (-55°C to +100°C; VPU=3.0V to 5.5V)
PARAMETER SYMBOL CONDITION MIN TYP MAX UNITS NOTES
Pullup Supply Voltage VPU 3.0 5.5 V 1,2
Thermometer Error tERR -10°C to +85°C ±½ °C 3
-55°C to +100°C ±2
Input Logic Low VIL -0.3 +0.8 V 1,4,5
Input Logic High VIH 3.0 5.5 V 1,6
Sink Current ILVI/O=0.4V 4.0 mA 1
Active Current IDQA 1 1.5 mA 7
DQ Input Current IDQ A8
Drift ±0.2 °C 9
NOTES:
1. All voltages are referenced to ground.
2. The Pullup Supply Voltage specification assumes that the pullup device (resistor or transistor) is
ideal, and therefore the high level of the pullup is equal to VPU. In order to meet the VIH spec of the
DS18S20-PAR, the actual supply rail for the strong pullup transistor must include margin for the
voltage drop across the transistor when it is turned on; thus: VPU_ACTUAL = VPU_IDEAL + VTRANSISTOR.
3. See typical performance curve in Figure 15.
4. Logic low voltages are specified at a sink current of 4 mA.
5. To always guarantee a presence pulse under low voltage parasite power conditions, VILMAX may have
to be reduced to as low as 0.5V.
6. Logic high voltages are specified at a source current of 1 mA.
7. Active current refers to supply current during active temperature conversions or EEPROM writes.
8. DQ line is high (“hi-Z” state).
9. Drift data is based on a 1000 hour stress test at 125°C.
AC ELECTRICAL CHARACTERISTICS: NV MEMORY
(-55°C to +100°C; VPU=3.0V to 5.5V)
PARAMETER SYMB
OL CONDITION MIN TYP MAX UNITS
NV Write Cycle Time twr 210ms
EEPROM Writes NEEWR -55°C to +55°C 50k writes
EEPROM Data Retention tEEDR -55°C to +55°C 10 years
DS18S20-PAR
19 of 20
AC ELECTRICAL CHARACTERISTICS (-55°C to +100°C; VPU=3.0V to 5.5V)
PARAMETER SYMBOL CONDITION MIN TYP MAX UNITS NOTES
Temperature Conversion
Time
tCONV 750 ms 1
Time to Strong Pullup
On
tSPON Start Convert T or
Copy Scratchpad
Command Issued
10 µs
Time Slot tSLOT 60 120 µs 1
Recovery Time tREC s1
Write 0 Low Time rLOW0 60 120 µs 1
Write 1 Low Time tLOW1 115µs1
Read Data Valid tRDV 15 µs 1
Reset Time High tRSTH 480 µs 1
Reset Time Low tRSTL 480 960 µs 1,2
Presence Detect High tPDHIGH 15 60 µs 1
Presence Detect Low tPDLOW 60 240 µs 1
Capacitance CIN/OUT 25 pF
NOTES:
1. Refer to timing diagrams in Figure 16.
2. If tRSTL > 960 ms, a power on reset may occur.
TYPICAL PERFORMANCE CURVE Figure 15
DS18S20-PAR Typical Error Curve
-0.5
-0.4
-0.3
-0.2
-0.1
0
0.1
0.2
0.3
0.4
0.5
0 10203040506070
Reference Temp (°C)
Thermometer Error (°C)
Mean Error
+3s Error
-3s Error
DS18S20-PAR
20 of 20
TIMING DIAGRAMS Figure 16
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