CY28346ZI-2T - SILICON LABS

Clock Synthesizer with Differential CPU Outputs

CY28346-2

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400 West Cesar Chavez, Austin, TX 78701 1+(512) 416-8500 1+(512) 416-9669 www.silabs.com

Features

• Compliant with Intel® CK 408 Mobile Clock Synthesizer

specifications

• 3.3V power su pply

• 3 differential CPU clocks

• 10 copies of PCI clocks

• 5/6 copies of 3V66 clocks

• SMBus support with Read Back capabilities

• Spread Spectrum electromagnetic interference (EMI)

reduction

• Dial-a-Frequency features

• Dial-a-dB™ features

• Extended op era ting temperature rang e, 0C to 85C

• 56-pin TSSOP packages

Note:

1. TCLK is a test clock driven on the XTAL_IN input during test mode. M = driven to a level between 1.0V and 1.8V. If the S2 pin is at a M level dur ing power-up, a

0 state will be latched into the devices internal state register.

Table 1. Frequency Table[1]

S2 S1 S0 CPU

(0:2) 3V66 66BUFF(0:2)/

3V66(0:4) 66IN/

3V66-5 PCIF/PCI REF USB/

DOT

1 0 0 66M 66M 66IN 66-MHz clock input 66IN/2 14.318M 48M

1 0 1 100M 66M 66IN 66-MHz clock input 66IN/2 14.318M 48M

1 1 0 200M 66M 66IN 66-MHz clock input 66IN/2 14.318M 48M

1 1 1 133M 66M 66IN 66-MHz clock input 66IN/2 14.318M 48M

0 0 0 66M 66M 66M 66M 33 M 14.318M 48M

0 0 1 100M 66M 66M 66M 33 M 14.318M 48M

0 1 0 200M 66M 66M 66M 33 M 14.318M 48M

0 1 1 133M 66M 66M 66M 33 M 14.318M 48M

M 0 0 Hi-Z Hi-Z Hi-Z Hi-Z Hi-Z Hi-Z Hi-Z

M 0 1 TCLK/2 TCLK/4 TCLK/4 TCLK/4 TCLK/8 TCLK TCLK/2

PLL1

PLL2

Logic

Power

Up Logic

XIN

XOUT

CPU_STP#

IREF

VSSIREF

S(0:2)

MULT0

VTT_PWRGD#

PCI_STP#

PD#

SDATA

SCLK

VDDA 66B[0:2]/3V66[2:4]

48M_DOT

48M_USB

PCI_F(0:2)

PCI(0:6)

3V66_1/VCH

3V66_0

CPUC(0:2)

CPUT(0:2)

REF

66IN/3V66-5

I2C

Logic

VDD

XIN

XOUT

VSS

PCIF0

PCIF1

PCIF2

VDD

VSS

PCI0

PCI1

PCI2

PCI3

VDD

VSS

PCI4

PCI5

PCI6

VDD

VSS

66B0/3V66_2

66B1/3V66_3

66B2/3V66_4

66IN/3V66_5

PD#

VDDA

VSSA

VTT_PWRGD#

REF

CPU_STP#

CPUT0

CPUC0

VDD

CPUT1

CPUC1

VSS

VDD

CPUT2

CPUC2

MULT0

IREF

VSSIREF

48M_USB

48M_DOT

VDD

VSS

3V66_1/VCH

PCI_STP#

3V66_0

VDD

VSS

SCLK

SDATA

CY28346-2

Block Diagram Pin Configuration

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Pin Description

Pin Name PWR I/O Description

2XIN VDDIOscillator Buffer Input. Connect to a crystal or to an external clock.

3XOUT VDDOOscillator Buffer Output. Connect to a crystal. Do not connect when an

external clock is applied at XIN.

52, 51, 49, 48,

45, 44 CPUT(0:2),

CPUC(0:2) VDD O Differential host output clock pairs. See Table 1 for frequencies and

functionality.

10, 11, 12, 13,

16, 17, 18 PCI(0:6) VDDP O PCI clock outputs. Are synchronous to 66IN or 3V66 clock. See Table 1.

5, 6, 7 PCIF (0:2) VDD O 33-MHz PCI clocks, which are 2 copies of 66IN or 3V66 clocks, may

be free running (not stopped when PCI_STP# is asserted LOW) or

may be stoppable depending on the programming of SMBus

56 REF VDD O Buffered output copy of the device’s XIN clock.

42 IREF VDD I Current reference programming input for CPU buffers. A resistor is

connected between this pin and VSSIREF.

28 VTT_PWRGD# VDD I Qualifying input that latches S(0:2 ) and MULT0. When this input is at

a logic low, the S(0:2) and MULT0 are latched.

39 48M_USB VDD48 O Fixed 48-MHz USB clock outputs.

38 48M_DOT VDD48 O Fixed 48-MHZ DOT clock outputs.

33 3V66_0 VDD O 3.3V 66-MHz fixed frequency clock.

35 3V66_1/VCH VDD O 3.3V clock selectable with SMBus byte0, Bit5, when Byte5, Bit5.

When Byte 0 Bit 5 is at a logic 1, then this pin is a 48M output clock. When

byte0, Bit5 is a logic 0, then this is a 66M output clock (de fault).

25 PD# VDD I

PU This pin is a power-down mode pin. A logic LOW level causes the

device to enter a power-down state. All internal logic is turned off except

for the SMBus logic. All output buffers are stopped.

43 MULT0 VDD I

PU Programming input selection for CPU clock curr ent multiplier.

55, 54 S(0,1) I I Frequency select inputs. See Table 1

29 SDATA I I Serial data input. Conforms to the SMBus specification of a Slave

Receive/T ransmit device. It is an input when receiving data. It is an open

drain output when acknowledging or transmitting data.

30 SCLK I I Serial clock input. Conforms to the SMBus specification.

40 S2 VDD I

TFrequency select input. See Table 1. This is a Tri-level input that is

driven HIGH, LOW, or driven to a intermediate level.

34 PCI_STP# VDD I

PU PCI clock disable input. When asserted LOW, PCI (0:6) clocks are

synchronously disabled in a LOW state. This pin does not effect PCIF

(0:2) clocks’ outputs if they are programmed to be PCIF clocks via the

device’s SMBus interface.

53 CPU_STP# VDD I

PU CPU clock disable input. When asserted LOW , CPUT (0:2) clocks are

synchronously disabled in a HIGH state and CPUC(0:2) clocks are

synchronously disabled in a LOW state.

24 66IN/3V66_5 VDD I/O Input connection for 66CLK(0:2) output clock buffers if S2 = 1, or

output clock for fixed 66-MHz clock if S2 = 0. See Table 1.

21, 22, 23 66B(0:2)/

3V66(2:4) VDD O 3.3V clock outputs. These clocks are buf fered copies of the 66IN clock

or fixed at 66 MHz. See Table 1.

1, 8, 14, 19, 32,

37, 46, 50 VDD – PWR 3.3V power supply.

4, 9, 15, 20, 27,

31, 36, 47 VSS – PWR Common ground.

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Serial Dat a Interface

To enhance the flexibility and function of the clock synthesizer ,

a two-signal serial interface is provided. Through the Serial

Data Interface, various device functions, such as individual

clock output buffers, can be individually enabled or disabled.

The registers associated with the Serial Data Interface

initializes to their default setting upon power-up, and therefore

use of this interface is optional. Clock device register changes

are normally made upon system initialization, if any are

required. The interface can also be used during system

operation for power management functions.

Data Protocol

The clock driver serial protocol accepts block write and block

read operations from the controller. For block write/read

operation, the bytes must be accessed in sequential order

from lowest to highest byte (most significant bit first) with the

ability to stop after any complete byte has been transferred.

The block write and block read protocol is outli ned in Table 2.

The slave receiver address is 11010010 (D2h).

41 VSSIREF – PWR Current reference programming input for CPU buffers. A resistor is

connected between this pin and IREF. This pin should also be returned

to device VSS.

26 VDDA – PWR Analog power input. Used for PLL and internal analog circuits. It is also

specifically used to detect and determine when power is at an acceptable

level to enable the device to operate.

Pin Description (continued)

Pin Name PWR I/O Description

Table 2. Block Read and Block Write Protocol

Block Write Protocol Block Read Protocol

Bit Description Bit Description

1Start 1Start

2:8 Slave address – 7 bits 2:8 Slave address – 7 bits

9 Write = 0 9 Write = 0

10 Acknowledge from slave 10 Acknowledge from slave

11:18 Command Code – 8 bit

‘00000000’ stands for block operation 11:18 Command Code – 8 bit

‘00000000’ stands for block operation

19 Acknowledge from slave 19 Acknowledge from slave

20:27 Byte Count – 8 bits 20 Repeat start

28 Acknowledge from slave 21:27 Slave address – 7 bits

29:36 Data byte 1 – 8 bits 28 Read = 1

37 Acknowledge from slave 29 Acknowledge from slave

38:45 Data byte 2 – 8 bits 30:37 B yte count from slave – 8 bits

46 Acknowledge from slave 38 Acknowledge

.... ...................... 39:46 Data byte from slave – 8 bits

.... Data Byte (N–1) –8 bits 47 Acknowledge

.... Acknowledge from slave 48:55 Data byte from slave – 8 bits

.... Data Byte N –8 bits 56 Acknowledge

.... Acknowledge from slave .... Data bytes from slave/Acknowledge

.... Stop .... Data byte N from slave – 8 bits

.... Not Acknowledge

.... Stop

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Byte 0: CPU Clock Register

Bit @Pup Name Description

7 0 Spread Spectrum Enable, 0 = Spread Off, 1 = Spread On. This is a Read and Write control bit.

60 CPU clock Power-down Mode Select.

0 = Drive CPUT(0:2) to 4 or 6 IREF and drive CPUC(0:2) to low when PD# is asserted LOW.

1 = Three-state all CPU outputs. This is only applicable when PD# is LOW . It is not applicable to

CPU_STP#.

503V66_1/VCH 3V66_1/VCH frequency Select, 0 = 66M selected, 1 = 48M selected

This is a Read and Write control bit.

4 Pin 53 CPUT,CPUC CPU_STP#. Reflects the current value of the external CPU_STP# (pin 53) This bit is Read-only.

3Pin 34 PCI Reflects the current value of the internal PCI_STP# function when read. Internally PCI_STP# is

a logical AND function of the internal SMBus register bit and the external PCI_STP# pin.

2 Pin 40 Frequency Select Bit 2. Reflects the value of SEL2 (pin 40). This bit is Read-only.

1 Pin 55 Frequency Select Bit 1. Reflects the value of SEL1 (pin 55). This bit is Read-only.

0 Pin 54 Frequency Select Bit 0. Reflects the value of SEL0 (pin 54). This bit is Read-only.

Byte 1: CPU Clock Register

Bit @Pup Name Description

7 Pin 43 MULT0 MULT0 (Pin 43) Value. This bit is Read-only.

6 0 CPU_STP# Controls functionality of CPUT/C(0:2) outputs when CPU_STP# is asserted. 0 = Drive CPUT(0:2 ) to

4 or 6 IREF and drive CPUC(0:2) to low when CPU_STP# asserted LOW. 1 = Three-state all CPU

outputs. This bit will override Byte0, Bit6 such that even if it is a 0, when PD# goes low the CPU outputs

will be three-stated.

50 CPUT2

CPUC2 Controls CPU2 functionality when CPU_STP# is asserted LOW

1 = Free Running, 0 = Stopped LOW with CPU_STP# asserted LOW

This is a Read and Write control bit.

40 CPUT1

CPUC1 Controls CPU1 functionality when CPU_STP# is asserted LOW

1 = Free Running, 0 = Stopped LOW with CPU_STP# asserted LOW

This is a Read and Write control bit.

30 CPUT0

CPUC0 Controls CPUT0 functionality when CPU_STP# is asserted LOW

1 = Free Running, 0 = Stopped LOW with CPU_STP# asserted LOW

This is a Read and Write control bit.

21 CPUT2

CPUC2 CPUT/C2 Output Control, 1 = enabled, 0 = disable HIGH and CPUC2 di sables LOW

This is a Read and Write control bit.

11 CPUT1

CPUC1 CPUT/C1 Output Control, 1 = enabled, 0 = disable HIGH and CPUC1 di sables LOW

This is a Read and Write control bit.

01 CPUT0

CPUC0 CPUT/C0 Output Control, 1 = enabled, 0 = disable HIGH and CPUC0 di sables LOW

This is a Read and Write control bit.

Byte 2: PCI Clock Control Register (all bits are read and write functional)

Bit @Pup Name Description

7 0 REF REF Output Control. 0 = high strength, 1 = low strength

6 1 PCI6 PCI6 Output Control. 1 = enabled, 0 = forced LOW

5 1 PCI5 PCI5 Output Control. 1 = enabled, 0 = forced LOW

4 1 PCI4 PCI4 Output Control. 1 = enabled, 0 = forced LOW

3 1 PCI3 PCI3 Output Control. 1 = enabled, 0 = forced LOW

2 1 PCI2 PCI2 Output Control. 1 = enabled, 0 = forced LOW

1 1 PCI1 PCI1 Output Control. 1 = enabled, 0 = forced LOW

0 1 PCI0 PCI0 Output Control. 1 = enabled, 0 = forced LOW

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Byte 3: PCIF Clock and 48M Control Register (all bits are read and write functional)

Bit @Pup Name Description

7 1 48M_DOT 48M_DOT Output Control,1 = enabled, 0 = forced LOW

6 1 48M_USB 48M_USB Outp ut Control,1 = enabled, 0 = forced LOW

5 0 PCIF2 PCI_STP#, control of PCIF2.

0 = Free Running, 1 = Stopped when PCI_STP# is LOW

4 0 PCIF1 PCI_STP#, control of PCIF1.

0 = Free Running, 1 = Stopped when PCI_STP# is LOW

3 0 PCIF0 PCI_STP#, control of PCIF0.

0 = Free Running, 1 = Stopped when PCI_STP# is LOW

2 1 PCIF2 PCIF2 Output Control. 1=running, 0=forced LOW

1 1 PCIF1 PCIF1 Output Control. 1= running, 0=forced LOW

0 1 PCIF0 PCIF0 Output Control. 1= running, 0=forced LOW

Byte 4: DRCG Control Register(all bits are read and write functional)

Bit @Pup Name Description

7 0 SS2 Spread Spectrum control bit (0 = down spread, 1 = center spread)

60 Reserved

5 1 3V66_0 3V66_0 Output Enabled. 1 = enabled, 0 = disabled

4 1 3V66_1/VCH 3V66_1/VCH Output Enable. 1 = enabled, 0 = disabled

3 1 3V66_5 3V66_5 Output Enable. 1 = enabled, 0 = disabled

2 1 66B2/3V66_4 66B2/3V66_4 Output Enabled. 1 = enabled, 0 = disabled

1 1 66B1/3V66_3 66B1/3V66_3 Output Enabled. 1 = enabled, 0 = disabled

0 1 66B0/3V66_2 66B0/3V66_2 Output Enabled. 1 = enabled, 0 = disabled

Byte 5: Clock Control Register (all bits are read and write functional)

Bit @Pup Name Description

7 0 SS1 Spread Spectrum control bit

6 1 SS0 Spread Spectrum control bit

5 0 66IN to 66M delay Control MSB

4 0 66IN to 66M delay Control LSB

30 Reserved

2 0 48M_DOT edge rate control. When set to 1, the edge is slowed by 15%.

10 Reserved

0 0 USB edge rate control. When set to 1, the edge is slowed by 15%

Byte 6: Silicon Signature Register[2] (all bits are read-only)

Bit @Pup Name Description

3 0 Vendor Code, 011 = IMI

Note:

2. When writing to this register the devi ce will acknowledge the write operation, but the data itself will be ignored.

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Dial-a-Frequency Feature

SMBus Dial-a-Frequency feature is available in this device via

Byte8 and Byte9. See our App Note AN-0025 for details on our

Dial-a-Frequency feature.

P is a large value PLL constant that depends on the frequency

selection achieved through the hardware selectors (S1, S0).

P value may be determined from Table 3.

Dial-a-dB Features

SMBus Dial-a-dB fea ture is available in this device via Byte8

and Byte9.

Spread Spectrum Clock Generation (SSCG)

Spread Spectrum is a modulation technique used to

minimizing EMI radiation generated by repetitive digital

signals. A clock presents the greatest EMI energy at the center

frequency it is generating. Spread Spectrum distributes this

energy over a specific and controlled frequency bandwidth

therefore causing the average energy at any one point in this

band to decrease in value. This technique is achieved by

modulating the clock away from its resting frequency by a

certain percentage (which also determines the amount of EMI

reduction). In this device, Spread Spectrum is enabled by

setting specific register bits in the SMBus control Bytes.

Table 4 is a listing of the modes and percentages of Spread

Spectrum modulation that this device incorporates.

Byte 7: Watchdog Time Stamp Register

Bit @Pup Name Description

70 Reserved

60 Reserved

50 Reserved

40 Reserved

30 Reserved

20 Reserved

10 Reserved

00 Reserved

Byte 8: Dial-a-Frequency Control Register N (all bits are read and write functional)

Bit @Pup Name Description

70 N7, MSB

60 N6

50 N5

40 N4

30 N3

20 N2

10 N3

00 N0, LSB

Byte 9: Dial-a-Frequency Control Register R (all bits are read and write functional)

Bit @Pup Name Description

70 R6 MSB

60 R5

50 R4

40 R3

30 R2

20 R1

10 R0, LSB

0 0 R and N register load gate 0 = gate closed (data is latched), 1 = gate open

(data is loading from SMBus registers into R and N)

Table 3. P Value

S(1:0) P

0 0 32005333

0 1 48008000

1 0 96016000

1 1 64010667

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Special Functions

PCIF and IOAPIC Clo ck Outputs

The PCIF clock outputs are intend ed to be used, if required,

for systems IOAPIC clock functionality. ANY two of the PCIF

clock outputs can be used as IOAPIC 33-MH z clock outputs.

They are 3.3V outputs will be divided down via a simple

resistive voltage divider to meet specific system IOAPIC clock

voltage requirements. In the event these clocks are not

required, then these clocks can be used as general PCI clocks

or disabled via the assertion of the PCI_STP# pin.

3V66_1/VCH Clock Output

The 3V66_1/VCH pin has a dual functionality that is selectable

via SMBus.

Configured as DRCG (66M), SMBus Byte0, Bit 5 = ‘0’

The default condition for this pin is to power up in a 66M

operation. In 66M operation thi s outpu t i s SSCG capable and

when spreading is turned on , this clock will be modulated.

Configured as VCH (48M), SMBus Byte0, Bit 5 = ‘1’

In this mode, the output is configured as a 48-MHz non-spread

spectrum output. This output is phase aligned with the other

48M outputs (USB and DOT), to within 1 ns pin-to-pin skew.

The switching of 3V66_1/VCH into VCH mode occurs at

system power on. When the SMBus Bit 5 of Byte 0 is

programmed from a ‘0’ to a ‘1’, the 3V66_1/VCH ou tput may

glitch while transitioning to 48M output mode.

PD# (Power-down) Clarification

The PD# (Power-down) pin is used to shut off ALL clocks prior

to shutting off power to the device. PD# is an asynchronous

active LOW input. This signal is synchronized internally to the

device powering down the clock synthesizer. PD# is an

asynchronous function for powering up the system. When PD#

is low , all clocks are driven to a LOW value and held there and

the VCO and PLLs are also powered down. All clocks are shut

down in a synchro nous manner so has not to cause glitches

while transitioning to the low ‘stopped’ state.

PD#—Assertion

When PD# is sampled LOW by two consecutive rising ed ges

of the CPUC clock, then on the next HIGH-to-LOW transition

of PCIF, the PCIF clock is stopped LOW. On the next

HIGH-to-LOW transition of 66Buff, the 66Buff clock is stopped

LOW. From this time, each clock will stop LOW on its next

HIGH-to-LOW transition, except the CPUT clock. The CPU

clocks are held with the CPUT clock pin driven HIGH with a

value of 2 x Iref, and CPUC undriven. After the last clock has

stopped, the rest of the generator will be shut down.

Table 4. Spread Spectrum

SS2 SS1 SS0 Spread Mode Spread%

0 0 0 Down +0.00, –0.25

0 0 1 Down +0.00, –0.50

0 1 0 Down +0.00, –0.75

0 1 1 Down +0.00, –1.00

1 0 0 Center +0.13, –0.13

1 0 1 Center +0.25, –0.25

1 1 0 Center +0.37, –0.37

1 1 1 Center +0.50, –1.50

66Buff

PCIF

PWRDWN#

CPU 133MHz

CPU# 133MHz

3V66

66In

REF 14.318MHz

USB 48MHz

Figure 1. Power-down Assertion T im i n g Waveforms—Buffered Mode

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PD# Deassertion

The power-up latency between PD# ri sing to a valid logic ‘1’

level and the starting of all clocks is less than 3.0 ms.

PCI 33MHz

PWRDWN#

CPUT 133MHz

CPUC 133MHz

REF 14.318MHz

USB 48MHz

SDRAM 133MHz

DDRT 133M Hz

DDRC 133MHz

AGP 66MHz

Figure 2. Power-down Assertion Timing Waveforms—Unbuffered Mode

CPU 133M Hz

3V66

CPU# 133M Hz

REF 14.318M Hz

USB 48M Hz

PC IF / AP IC

33MHz

66In

66Buff

PWRDWN#

66 Bu ff1 / GMCH

400uS max<1.8mS

PCI 33MH z

30uS min

Figure 3. Power-down Deassertion Timing Waveforms

Table 5. PD# Functionality

PD# DRCG 66CLK (0:2) PCIF/PCI PCI USB/DOT

1 66M 66Input 66Input/2 66Input/2 48M

0 Low Low Low Low Low

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CPU_STP# Clarification

The CPU_STP# signal is an active LOW input used for

synchronous stopping and starting the CPU output clocks

while the rest of the clock generator continues to function.

CPU_STP# Assertion

When CPU_STP# pin is asserted, all CPUT/C outputs that are

set with the SMBus configuration to be stoppable via assertion

of CPU_STP# will be stopped after being sampled by two

falling CPUT/C clock edges. The final state of the stopped

CPU signals is CPUT = HIGH and CPU0C = LOW . There is no

change to the output drive current valu es during the stopped

state. The CPUT is driven HIGH with a current value equal to

(Mult 0 ‘select’) x (Iref), and the CPUC signal will not be driven.

Due to external pu ll-down circuitry CPUC wi ll be LOW during

this stopped state.

CPU_STP# Deassertion

The deassertion of the CPU_STP# signal will cause all

CPUT/C outputs that were stopped to resume normal

operation in a synchronous manner. Synchronous manner

meaning that no short or stretched clock pulses will be

produces when the clock resumes. The maximum latency

from the deassertion to active outputs is no more than two

CPUC clock cycles.

CPU_STP#

CPUT

CPUC

CPUT

CPUC

Figure 4. CPU_STP# Assertion Waveforms

CPU_STP#

CPUT

CPUC

CPUT

CPUC

Figure 5. CPU_STP# Deassertion Waveforms

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Three-st ate Control of CPU Clocks Clarification

During CPU_STP# and PD# modes, CPU clo ck outputs may

be set to driven or undriven (three-state) by setting the corre-

sponding SMBus entry in Bit6 of Byte0 and Bit6 of Byte1.

PCI_STP# Assertion

The PCI_STP# signal is an active LOW input used for

synchronous stopping and starting the PCI outputs while the

rest of the clock generator continues to function. The set-up

time for capturing PCI_STP# going LOW is 10 ns (tsetup). (See

Figure 2.) The PCIF (0:2) clocks will not be af fected by this pin

if their control bits in the SMBus register are set to allow them

to be free running.

PCI_STP# Deassertion

The deassertion of the PCI_STP# signal will cause all PCI and

stoppable PCIF clocks to resume running in a synchronous

manner within two PCI clock periods after PCI_STP# transi-

tions to a high level.

Note that the PCI STOP function is controlled by two inputs.

One is the device PCI_STP# pin number 34 a nd the other is

SMBus byte 0 bit 3. These two inputs to the function are

logically ANDed. If either the external pin or the internal

SMBus register bit is set low then the stopp able PCI clocks will

be stopped in a logic low state. Reading SMBus Byte 0 Bit 3

will return a 0 value if either of these control bits are set LOW

thereby indicating the devices stoppable PCI clocks are not

running.

Table 6. Cypress Clock Power Mana ge me nt Truth Table

B0b6 B1b6 PD# CPU_S TP# Stoppable CPUT Stoppable

CPUC Non-Stop CPUT Non-Stop CPUC

0 0 1 1 Running Running Running Running

0 0 1 0 Iref x6 Iref x6 Running Running

0 0 0 1 Iref x2 Low Iref x2 Low

0 0 0 0 Iref x2 Low Iref x2 Low

0 1 1 1 Running Running Running Running

0 1 1 0 Hi Z Hi Z Runni ng Runni ng

0 1 0 1 Hi Z Hi Z Hi Z Hi Z

0 1 0 0 Hi Z Hi Z Hi Z Hi Z

1 0 1 1 Running Running Running Running

1 0 1 0 Iref x6 Iref x6 Running Running

1 0 0 1 Hi Z Hi Z Hi Z Hi Z

1 0 0 0 Hi Z Hi Z Hi Z Hi Z

1 1 1 1 Running Running Running Running

1 1 1 0 Hi Z Hi Z Runni ng Runni ng

1 1 0 1 Hi Z Hi Z Hi Z Hi Z

1 1 0 0 Hi Z Hi Z Hi Z Hi Z

PCI_STP#

P CIF 3 3 M

PCI 33M

setup

Figure 6. PCI_STP# Assertion W aveforms

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Iout is selectable depending on implementation. The param-

eters above apply to all configurations. Vout is the voltage at

the pin of the device.

The various output current configurations are shown in the

host swing select functions table. For all configurations, the

deviation from the expected output current is ±7% as shown in

the current accuracy table.

PCI_STP#

PCIF

PCI

setup

Figure 7. PCI_STP# Deassertion W a veforms

Figure 8. VTT_PWRGD# Timing Diagram

VID

SEL

VTT_PWRGD#

PWRGD

VDD Clock Gen

Clock Sta te

Clock Outputs

Clock VC O

0.2-0.3mS

Delay

State 0 State 2 State 3

Wait for

VTT_PWRGD# Sam ple Sels

Off

State 1

Device is not affected,

VTT_PWRG D# is ignored.

VTT_PWR GD # = Low

Delay

>0.25mS

Power Off

VDDA = 2.0V

Sample

Inputs straps

Normal

Operation

W ait for <1 .8m s

Enable Outputs

VTT_PW RGD # = toggle

VDD3.3= off

Figure 9. Clock Generator Power-up/Run State Program

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USB and DOT 48M Phase Relationship

The 48M_USB and 48M_DOT clocks are in phase. It is under-

stood that the difference in edge rate will introduce some in

inherent offset. When 3V66_1/VCH clock is configured for

VCH (48-MHz) operation it is also in phase with the USB an d

DOT outputs. See Figure 10.

66IN to 66B Buffered Prop Delay

The 66IN to 66B(0:2) out put delay is shown in Figure 11.

The Tpd is the prop delay from the input pin (66IN) to the

output pins (66B[0:2]). The outputs’ variation of Tpd is

described in the AC parameters section of this data sheet. The

measurement is taken at 1.5V.

66B to PCI Buffered Clock Skew

Figure 12 shows the diff erence (skew) between the 3V33(0:5)

outputs when the 66M clocks are connected to 66IN. This

offset is described in the Group Timing Relationship and Toler-

ances section of this data sheet. The measurements were

taken at 1.5V.

3V66 to PCI Unbuffered Clock Skew

Figure 13 shows the timing relationship between 3V66(0:5)

and PCI(0:6) and PCI F when configured to run in the u nbuf-

fered mode.

Table 7. Host Clock (HCSL) Buffer Characteristics

Characteristic Minimum Maximum

Ro 3000 Ohms (recommended) N/A

Ros

Vout N/A 1.2V

Table 8. CPU Clock Current Select Function

Mult0 Board Target Trace/Term Z Reference R, Iref – Vdd (3*Rr) Output Current Voh @ Z

0 50 Ohms Rr = 221 1%, Iref = 5.00 mA Ioh = 4*Iref 1.0V @ 50

1 50 Ohms Rr = 475 1%, Iref = 2.32 mA Ioh = 6*Iref 0.7V @ 50

Table 9. Group Timing Relation ship and Tolerances

Description Offset Tolerance Conditions

3V66 to PCI 2.5 ns 1.0 ns 3V66 Leads PCI (unbuffered mode)

48M_USB to 48M_D O T Ske w 0.0 ns 1.0 ns 0 degrees phase shift

66B to PCI offset 2.5 ns 1.0 ns 66B leads PCI (buffered mode)

Table 10.Maximum Lumped Capacitive Output Loads

Clock M ax Lo ad Unit

PCI Clocks 30 pF

3V66 30 pF

66B 30 pF

48M_USB Clock 20 pF

48M_DOT 10 pF

REF Clock 50 pF

48MUSB

48MDOT

Figure 10. 48M_USB and 48M_DOT Phase Relationship

66IN

66B

Tpd

Figure 1 1. 66IN to 66B(0:2) Output Delay Figure

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Buffer Characteristics

Current Mode CPU Clock Buffer Characteristics

The current mode output buffer detail and current reference

circuit details are contained in the p revious table of this d ata

sheet. The following parameters are used to specify output

buffer characteristics:

1. Output impedance of the current mode buffer circuit – Ro

(see Figure 14).

2. Minimum and maximum required voltage operation range

of the circuit – Vop (see Figure 14).

3. Series resistance in the buffer circuit – Ros (see Figure 14).

4. Current accuracy at given configuration into nominal test

load for given configuration.

66B

PCI

PCIF

1.5-

3.5ns

Figure 12. Buffer Mode – 33V66(0:1); 66BUF(0:2) Phase Relationship

PCI

PCIF

Tpci

3V66

Figure 13. Unbuffered Mode – 3V66(0:5) to PCI (0:6) and PCIF(0:2) Phase Relationship

1.2V0V

Iout

Ros

VDD3 (3.3V +/- 5%)

Vout = 1.2V max Vout

Slope ~ 1/R

Figure 14.

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Absolute Maximum Conditions

Parameter Description Condition Min. Max. Unit

VDD Core Supply Vol tage –0.5 4.6 V

VDD_A Analog Supply Voltage –0.5 4.6 V

VIN Input Voltage Relative to VSS –0.5 VDD + 0.5 VDC

TSTemperature, Storage Non-functional –65 150 °C

TATemperature, Operating Ambient Functional 0 85 °C

TJTemperature, Junction Functional – 150 °C

ØJC Dissipation, Junction to Case Mil-Spec 883E Method 1012.1 – 45 °C/W

ØJA Dissipation, Junction to Ambient JEDEC (JESD 51) – 15 °C/W

ESDHBM ESD Protection (Human Body Model) MIL-STD-883, Method 3015 2000 – V

Ul-94 Flammability Rating V–0 @1/8 in. – 10 ppm

MSL Moisture Sensitivity Level 1

DC Parameters (VDD = VDDA = 3.3V ±5%)

Parameter Description Conditions Min. Typ. Max. Unit

Idd3.3V Dynamic Supply Current All frequencies at maximum values[3] 280 mA

Ipd3.3V Power-down Supply Current PD# Asserted Note 4 mA

Cin Inp ut Pin Capacitance 5pF

Cout Output Pin Capacitance 6pF

Lpin Pin Inductance 7nH

Cxtal Crystal Pin Capacitance Measured from the Xin or Xout Pin to Ground. 30 36 42 pF

AC Parameters (VDD = VDDA = 3.3V ±5%)

Parameter Description 66 MHz 100 MHz 133 MHz 200 MHz Unit NotesMin. Max. Min. Max. Min. Max. Min. Max.

Crystal

Tdc Xin Duty Cycle 47.5 52.5 47.5 52.5 47.5 52.5 47.5 52.5 % 5, 6, 7

Tperiod Xin Period 69.84 71.0 69.84 71.0 69.84 71.0 69.84 71.0 ns 5, 8, 9, 6

Vhigh Xin High Voltage 0.7Vdd Vdd 0.7Vdd Vdd 0.7Vdd Vdd 0.7Vdd Vdd V

Vlow Xin Low Voltage 0 0.3 Vdd 0 0.3Vdd 0 0.3Vdd 0 0.3Vdd V

Tr/Tf Xin Rise and Fall

Times 10.0 10.0 10.0 10.0 ns 10

Tccj Xin Cycle to Cycle

Jitter 500 500 500 500 ps 8, 11, 6

CPU at 0.7V Timing

Tdc CPUT and CPUC

Duty Cycle 45 55 45 55 45 55 45 55 % 11, 12, 13

Tperiod CPUT and CPUC

Period 14.85 15.3 9.85 10.2 7.35 7. 65 4.85 5.1 ns 11, 12, 13

Notes:

3. All outputs loaded as per maximum capacitive load table.

4. Absolute value = ((Programmed CPU Iref) x (2)) + 10 mA.

5. This parameter is measured as an average over 1-s duration, with a crystal center frequency of 14.31 818 MHz

6. When Xin is driven from an external clock source.

7. This is required for the duty cycle on the REF clock out to be as specified. The device will operate reliably with input duty cycles up to 30/70 but the REF clock

duty cycle will not be within data sheet specifications.

8. All outputs loaded as perTable 10.

9. Probes are placed on the pins and measurements are acquired at 1.5V for 3.3V signals (see test and measurement set-up section of this data sheet).

10.Measured between 0.2Vdd and 0.7Vdd.

11. This measurement is applicable with Spread ON or Spread OFF.

12.Measured at crossing point (Vx) or where subtraction of CLK-CLK# crosses 0 volts Measured from Vol = 0.175V to Voh = 0.525V.

13.Test load is Rta = 33.2 ohms, Rd = 49.9 ohms.

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Tskew Any CPU to CPU

Clock Skew 100 100 100 100 ps 8, 11, 12

Tccj CPU Cycle to Cycle

Jitter 150 15 0 150 150 ps 11, 12, 13

Tr/Tf CPUT and CPUC

Rise and Fall Times 175 700 175 700 175 700 175 700 ps 11, Notes:,

Rise/ Fa l l M a tc h in g 20% 20% 20% 20% Notes:, 15,

DeltaTr Rise T ime Variation 125 125 125 125 ps Notes:, 13

DeltaTf Fall Time Variation 125 125 125 125 ps Notes:, 13

Vcross Crossing Point

Voltage at 0.7V

Swing

280 4 30 280 430 280 430 280 430 mV 11, 13

CPU at 1.0V Timing

Tdc CPUT and CPUC

Duty Cycle 45 55 45 55 45 55 45 55 % 11 , 12

Tperiod CPUT and CPUC

Period 14.85 15.3 9.85 10.2 7.35 7.65 4.85 5.1 nS 11, 12

Tskew Any CPU to Any

CPU Clock Skew 100 100 100 100 pS 8, 11, 12

Tccj CPU Cycle to Cycle

Jitter 150 15 0 150 150 pS 8, 12

Differential

Tr/Tf CPUT and CPUC

Rise and Fall T imes 175 467 175 467 175 467 175 467 ps 11, 16

SE-

DeltaSlew Absolute Single-

ended Rise/Fall

Waveform

Symmetry

325 325 325 325 ps 17, 18

Vcross Cross Point at 1.0V

swing 510 760 510 760 510 760 510 760 mV 18

3V66

Tdc 3V66 Duty Cycle4555455545554555%8, 9

Tperiod 3V66 Period 15.0 1 5.3 15.0 15 .3 15.0 1 5.3 15.0 15.3 ns 5, 8, 9

Thigh 3V66 High Time 4.95 4.95 4.95 4.95 ns 19

Tlow 3V66 Low Time 4.55 4.55 4.55 4.55 ns 20

Tr / Tf 3V66 Rise and Fall

Times 0.5 2.0 0.5 2.0 0.5 2.0 0.5 2.0 ns 21

Notes:

14.Measured from Vol = 0.175V to Voh = 0.525V.

15.Determined as a fraction of 2*(Trise – Tfall)/ (Trise + Tfall).

16.Measurement taken from differential waveform, from –0.35V to +0.35V.

17.Measurements t aken from common mode waveforms, measure rise/fall time from 0.41 to 0.86V . Rise/fall time matching is defined as “the instantaneous difference

between maximum clk rise (fall) and minimum clk# fall (rise) time or minimum clk rise (f all) and maximum clk# fall (rise) time”. This parameter is designed form

waveform symmetry.

18.Measured in absolute voltage, i.e. single-ended measurement.

19.THIGH is measured at 2.4V for non host outputs.

20.TLOW is measured at 0.4V for all outputs.

21.Probes are placed on the pins, and measurement s are acquir ed between 0.4V an d 2.4V for 3.3V signals (se e test and measurement set-u p section of this dat a

sheet).

AC Parameters (VDD = VDDA = 3.3V ±5%) (continued)

Parameter Description 66 MHz 100 MHz 133 MHz 200 MHz Unit NotesMin. Max. Min. Max. Min. Max. Min. Max.

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Tskew

Unbuffered 3V66 to 3V66 Clock

Skew 500 500 500 500 ps 8, 9

Tskew

Buffered 3V66 to 3V66 Clock

Skew 250 250 250 250 ps 8, 9

Tccj DRCG Cycle to

Cycle Jitter 250 250 250 250 ps 8, 9

66B

Tdc 66B(0:2) Duty Cycle 45 55 45 55 45 55 45 55 % 8, 9

Tr / Tf 66B(0:2) Rise and

Fall Times 0.5 2.0 0.5 2.0 0 .5 2.0 0.5 2 .0 ns 8, 21

T skew Any 66B to Any 66B

Skew 175 175 175 175 ps 8, 9

Tpd 66IN to 66B(0:2)

Propagation Del ay 2.5 4.5 2.5 4.5 2.5 4.5 2.5 4.5 ns 8, 9

Tccj 66B(0:2) Cycle to

Cycle Jitter 100 100 100 100 ps 8, 9, 22

PCI

Tdc PCIF(0:2) PCI (0:6)

Duty Cycle 45 55 45 55 45 55 45 55 % 8, 9

Tperiod PCIF(0:2) PCI (0:6)

period 30.0 30.0 30.0 30 nS 5, 8, 9

Thigh PCIF(0:2) PCI (0:6)

high time 12.0 12.0 12.0 12.0 nS 19

Tlow PCIF(0:2) PCI (0 :6)

low time 12.0 12.0 12.0 12.0 nS 20

T r/Tf PCIF(0:2) PCI (0:6)

rise and fall times 0.5 2.0 0.5 2.0 0.5 2.0 0.5 2.0 nS 21

Tskew Any PCI clock to

Any PCI clock Skew 500 500 500 500 pS 8, 9

Tccj PCIF(0:2) PCI (0:6)

Cycle to Cycle Jitter 250 250 250 250 ps 8, 9

48M_USB

Tdc 4 8M_USB Duty

Cycle 45 55 45 55 45 55 45 55 % 8, 9

Tperiod 48M_USB Period 20.8299 20.8333 20.8299 20.8333 20.8299 20.8333 20.8299 20.8333 ns 8, 9

Tr/Tf 48M_USB Rise and

Fall Times 1.0 2.0 1.0 2.0 1.0 2.0 1.0 2.10 ns 8, 21

Tccj 48M_USB Cycle to

Cycle Jitter 350 350 350 350 ps 5, 8, 9

48M_DOT

Tdc 48M_DO T Du ty

Cycle 45 55 45 55 45 55 45 55 % 8, 9

Tperiod 48M_DOT Period 20.837 20.837 20.837 20.837 ns 8, 9

Tr/Tf 48M_DOT Rise and

Fall Times 0.5 1.0 0.5 1.0 0.5 1.0 0.5 1.0 ns 8, 9

Tccj 48M_DOT Cycle to

Cycle Jitter 350 350 350 350 ps 8, 9

Note:

22.This figure is additive to any jitter already present when the 66IN pin is being used as an input. Otherwise a 500-ps jitter figure is specified.

AC Parameters (VDD = VDDA = 3.3V ±5%) (continued)

Parameter Description 66 MHz 100 MHz 133 MHz 200 MHz Unit NotesMin. Max. Min. Max. Min. Max. Min. Max.

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Test and Measurement Set-up

For Differential CPU Output Signals

The following dia gram shows lumped test load configurations

for the differential Host Clock Outputs.

Notes:

23.CPU_STP# and PCI _STP# setup time with respect to any PCIF clock to guarantee that the effected clock will stop or start at the next PCIF clock’ s ri sing edge.

24.When Crystal meets minimum 40-ohm device series resistance specificat ion.

REF

Tdc REF Duty Cycle 4555455545554555%8, 9

Tperiod REF Period 69.84 71.0 69.84 71.0 69.84 71.0 69.84 71.0 ns 8, 9

Tr / Tf REF Rise and Fall

Times 1.0 4.0 1.0 4.0 1.0 4.0 1.0 4.0 ns 8, 21

Tccj REF Cycle to Cycle

Jitter 1000 1000 1000 1000 ps 8, 9

Tpzl/Tpzh Output Enable

Delay (all outputs) 1.0 10.0 1.0 10.0 1.0 10.0 1.0 10.0 ns 6

Tplz/Tpzh Output disable

delay (all outputs) 1.0 10.0 1.0 10.0 1.0 10.0 1.0 10.0 ns 6

Tstable All Clock Stabili-

zation from

Power-up

3333ms6

Tss Stopclock Set-up

Time 10.0 10.0 10.0 10.0 ns 23

Tsh Stopclock Hold

Time 0 0 0 0 ns 23

Tsu Osci llator Start-up

Time 1.2 1.2 1.2 1.2 ms 24

AC Parameters (VDD = VDDA = 3.3V ±5%) (continued)

Parameter Description 66 MHz 100 MHz 133 MHz 200 MHz Unit NotesMin. Max. Min. Max. Min. Max. Min. Max.

M easurem ent Point

2pF

CPUT

MULTSEL

TPCB

CPUC



 





 Measurement P oint

2pF

Figure 15. 1.0V Test Load Termination

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For Single-Ended Output Signals

CPUT

MULTSEL

TPCB

CPUC



 Me asurement Point



 2pF

Measurement Point

2pF



VDD

Figure 16. 0.7V Test Load Termination

2.4V

0.4V

3.3V

Tr Tf

1.5V

3.3V signals

tDC

Probe

Output under Test

Load Cap

Figure 17.

CY28346-2

............ ..........Documen t #: 38-07509 Re v. *B Page 19 of 19

The information in this document is believed to be accurate in all respects at the time of publication but is subject to change without notice. Sil-

icon Laboratories assumes no responsibility for errors and omissions, and disclaims responsibility for any consequences resulting from the

use of information included herein. Additionally, Silicon Laboratories assumes no responsibility for the functioning of undescribed features or

parameters. Silicon Laboratories reserves the right to make changes without further notice. Silicon Laboratories makes no warranty, repre-

sentation or guarantee regarding the suitability of its products for any particular purpose, nor does Silicon Laboratories assume any liability

arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation conse-

quential or incidental damages. Silicon Laboratories products are not designed, intended, or authorized for use in applications intended to

support or sustain life, or for any other application in which the failure of the Silicon Laboratories product could create a situation where per-

sonal injury or death may occur. Should Buyer purchase or use Silicon Laboratories products for any such unintended or unauthorized appli-

cation, Buyer shall indemnify and hold Silicon Laboratories harmless against all claims and damages.

Package Drawings and Dimensions

Ordering Information

Part Number Package Type Product Flow

CY28346ZC-2 56-pin TSSOP–Tube Commercial, 0 to 70C

CY28346ZC-2T 56-pin TSSOP–Tape and Reel Commercial, 0 to 70C

CY28346ZI-2 56-pin TSSOP–Tube Industrial, 0 to 85C

CY28346ZI-2T 56-pin TSSOP–Tape and Reel Industrial, 0 to 85C

Lead-free

CY28346ZXC-2 56-pi n TSSOP–Tube Commercial, 0  to 70C

CY28346ZXC-2T 56-pin TSSOP–Tape and Reel Commercial, 0 to 70C

SEATING

PLANE

BSC

0°-8°

MAX.

GAUGE PLANE

29 56

1.100[0.043]

0.051[0.002]

0.851[0.033]

0.508[0.020]

0.249[0.009]

7.950[0.313]

0.25[0.010]

6.198[0.244]

13.894[0.547]

8.255[0.325]

5.994[0.236]

0.950[0.037]

0.500[0.020]

14.097[0.555]

0.152[0.006]

0.762[0.030]

DIMENSIONS IN MM[INCHES] MIN.

MAX.

0.170[0.006]

0.279[0.011]

0.20[0.008]

0.100[0.003]

0.200[0.008]

REFERENCE JEDEC MO-153

PACKAGE WEIGHT 0.42gms

PART #

Z5624 STANDARD PKG.

ZZ5624 LEAD FREE PKG.

56-Lead Thin Shrunk Small Outline Package, Type II (6 mm x 12 mm) Z56