TYN16-600CT,127 - NXP Semiconductors

1. Product profile

1.1 General description

Planar passivated Silicon Controlled Rectifier (SCR) in a SOT78 (TO-220AB) plastic

package intended for use in applications requiring high thermal cycling performance and

high junction temperature capability (Tj(max) = 150 °C).

1.2 Features and benefits

High junction operating temperature

capability

High thermal cyclin g pe rf or m anc e

High voltage capability

Planar passivated for voltage

ruggedness and reliability

1.3 Applications

Ignition circuits

Motor control

Protection circuits e.g. SMPS inrush

current

Voltage regulation

1.4 Quick reference data

TYN16-600CT

SCR

Rev. 1 — 20 March 2012 Product data sheet

TO-220AB

Table 1. Quick reference data

Symbol Parameter Conditions Min Typ Max Unit

VDRM repetitive peak off-state

voltage - - 600 V

VRRM repetitive peak reverse

voltage - - 600 V

ITSM non-repetitive peak

on-state current half sine wave; Tj(init) =25°C;

tp= 10 ms; see Figure 4; see Figure 5 - - 180 A

half sine wave; Tj(init) =25°C;

tp=8.3ms - - 198 A

Tjjunction temperature - - 150 °C

IT(AV) average on-state

current half sine wave; Tmb ≤133 °C;

see Figure 3 - - 10.2 A

IT(RMS) RMS on-state current half sine wave; Tmb ≤133 °C;

see Figure 1; see Figure 2 --16A

Product data sheet Rev. 1 — 20 March 2012 2 of 12

NXP Semiconductors TYN16-600CT

SCR

2. Pinning information

3. Ordering information

Static characteristics

IGT gate trigger current VD=12V; I

T= 0.1 A; Tj=25°C;

see Figure 7 --15mA

Dynamic charateristics

dVD/dt rate of rise of off-state

voltage VDM =402V; T

j=150°C; (V

DM = 67%

of VDRM); exponential waveform; gate

open circuit

500 - - V/µs

Table 1. Quick reference data …continued

Symbol Parameter Conditions Min Typ Max Unit

Tabl e 2. Pinning info rmation

Pin Symbol Description Simplified outline Graphi c sy mbol

1 K cathode

SOT78 (TO-220AB)

2 A anode

3 G gate

mb A mountin g ba se ;

connected to anode

sym037

Table 3. Ordering information

Type number Package

Name Description Version

TYN16-600CT TO-220AB plastic single-ended package; heatsink mounted;

1 mounting hole; 3-lead TO-220AB SOT78

Product data sheet Rev. 1 — 20 March 2012 3 of 12

NXP Semiconductors TYN16-600CT

SCR

4. Limiting values

Table 4. Limiting values

In accordance with the Absolute Maximum Rating System (IEC 60134).

Symbol Parameter Conditions Min Max Unit

VDRM repetitive peak off-state voltage - 600 V

VRRM repetitive peak reverse voltage - 600 V

IT(AV) average on-state current half sine wave; Tmb ≤133 °C;

see Figure 3 - 10.2 A

IT(RMS) RMS on-state current half sine wave; Tmb ≤133 °C;

see Figure 1; see Figure 2 -16A

ITSM non-repetitive peak on-state

current half sine wave; Tj(init) =25°C;

tp= 10 ms; see Figure 4; see Figure 5 - 180 A

half sine wave; Tj(init) =25°C;

tp=8.3ms - 198 A

I2tI

2t for fusing tp= 10 ms; sine-wave pulse - 162 A2s

dIT/dt rate of rise of on-state current IT=40A; I

G=200mA;

dIG/dt = 200 mA/µs -50A/µs

IGM peak gate current - 4 A

VRGM peak reverse gate voltage - 5 V

PGM peak gate power - 10 W

PG(AV) a v erage gate power over any 20 ms period - 1 W

Tstg storage temperature -40 150 °C

Tjjunction temperature - 150 °C

Fig 1. RMS on-state current as a function of mounting

base temperature; maximum values Fig 2. RMS on-state current as a function of surge

duration; maximum values

003aaj479

-50 0 50 100 150

(°C)

T(RMS )

(A)

133 °C

003aaj481

-2

-1

1 10

su rge duration (s)

T(RMS )

(A)

Product data sheet Rev. 1 — 20 March 2012 4 of 12

NXP Semiconductors TYN16-600CT

SCR

Fig 3. Total power dissipation as a function of average on-state current; maximum values

Fig 4. Non-repetitive peak on-state current as a fun ction of the number of sinusoidal current cycles; maximum

values

003aaj483

024681012

T(AV)

(A)

tot

(W)

a=1.57

1.9

2.2

2.8

150

141.2

136.8

128

Tmb(max)

(°C)

145.6

132.4

conduction

angle

(degrees)

form

factor

120

180

2.8

2.2

1.9

1.57

003aaj486

120

160

200

1 10 10

n (number of cycles)

TSM

(A)

Tj(init) = 25 °C max

ITITSM

Product data sheet Rev. 1 — 20 March 2012 5 of 12

NXP Semiconductors TYN16-600CT

SCR

5. Thermal characteristics

Fig 5. Non-repetitive peak on-state current as a function of pulse width for sinusoidal currents; maximum values

003aaj485

-5

-4

-3

-2

(s)

TSM

(A)

j(init)

= 25 °C max

TSM

(1)

Table 5. Thermal characteristics

Symbol Parameter Conditions Min Typ Max Unit

Rth(j-mb) thermal resistance from junction to

mounting base see Figure 6 --1.1K/W

Rth(j-a) thermal resistance from junction to

ambient in free air - 60 - K/W

Fig 6. Transient thermal impedance from junction to mounting base as a function of pulse width

10-1

10-2

Zth(j-mb)

(K/W)

10-3

tp (s)

10-5 11010-1

10-2

10-4 10-3

d =

003aaj448

Product data sheet Rev. 1 — 20 March 2012 6 of 12

NXP Semiconductors TYN16-600CT

SCR

6. Characteristics

Table 6. Characteristics

Symbol Parameter Conditions Min Typ Max Unit

Static characteristics

IGT gate trigger current VD=12V; I

T= 0.1 A; Tj=25°C;

see Figure 7 --15mA

ILlatching current VD=12V; I

G=0.1A; T

j=25°C;

see Figure 8 --60mA

IHholding current VD=12V; T

j=25°C; see Figure 9 --40mA

VTon-stat e vo ltage IT=32A; T

j= 25 °C; see Figure 10 -1.21.6V

VGT gate trigger voltage VD=12V; I

T= 0.1 A; Tj=25°C;

see Figure 11 -0.71.3V

VD=400V; I

T= 0.1 A; Tj=150°C;

see Figure 11 0.2 0.4 - V

IDoff-state current VD=600 V; T

j= 150 °C - 0.2 1 mA

IRreverse current Tj= 150 °C; VR= 600 V - 0.2 1 mA

Dynamic charateristics

dVD/dt rate of rise of off-state

voltage VDM =402V; T

j=150°C; (V

DM = 67%

of VDRM); exponential waveform; gate

open circuit

500 - - V/µs

Fig 7. Normalized gate trigger current as a function of

junction temperature Fig 8. Normalized latching current as a function of

junction temperature

Tj (°C)

-50 150100050

003aaj449

IGT

IGT(25°C)

Tj (°C)

-50 150100050

003aaj450

IL(25°C)

Product data sheet Rev. 1 — 20 March 2012 7 of 12

NXP Semiconductors TYN16-600CT

SCR

Vo = 1.08 V; R s = 0.0165 Ω

(1) Tj = 150 °C; typical values

(2) Tj = 150 °C; maximum values

(3) Tj = 25 °C; maximum values

Fig 9. Normalized holding current as a function of

junction temperature Fig 10. On-state current as a function of on-state

voltage

Fig 11. Normalized gate trigger voltage as a function of ju nction temperature

Tj (°C)

-50 150100050

003aaj451

IH(25°C)

003aaj452

012

(V)

(A)

(1) (2) (3)

Tj (°C)

-50 150100050

003aaj453

0.8

1.2

1.6

0.4

VGT

VGT(25°C)

Product data sheet Rev. 1 — 20 March 2012 8 of 12

NXP Semiconductors TYN16-600CT

SCR

7. Package outline

Fig 12. Package outline SOT78 (TO-220AB)

REFERENCES

OUTLINE

VERSION EUROPEAN

PROJECTION ISSUE DATE

IEC JEDEC JEITA

SOT78 SC-46

3-lead TO-220AB

SOT78

08-04-23

08-06-13

Notes

1. Lead shoulder designs may vary.

2. Dimension includes excess dambar.

UNIT A

mm 4.7

4.1 1.40

1.25 0.9

0.6 0.7

0.4 16.0

15.2 6.6

5.9 10.3

9.7 15.0

12.8 3.30

2.79 3.8

3.5

DIMENSIONS (mm are the original dimensions)

Plastic single-ended package; heatsink mounted; 1 mounting hole; 3-lead TO-220AB

0 5 10 mm

scale

b b1(2)

1.6

1.0

c D

1.3

1.0

b2(2) D1E e

2.54

L L1(1) L2(1)

max.

3.0

p q

3.0

2.7

2.6

2.2

123

L1(1)

b1(2)

(3×)

b2(2)

(2×)

b(3×)

L2(1)

mounting

base

Product data sheet Rev. 1 — 20 March 2012 9 of 12

NXP Semiconductors TYN16-600CT

SCR

8. Revision history

Table 7. Revision history

Document ID Release date Data sheet status Change notice Supersedes

TYN16-600CT v.1 20120320 Product data sheet - -

Product data sheet Rev. 1 — 20 March 2012 10 of 12

NXP Semiconductors TYN16-600CT

SCR

9. Legal information

9.1 Data sheet status

[1] Please consult the most recently issued document before initiating or completing a design.

[2] The term 'short data sheet' is explained in section "Definitions".

[3] The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product

status information is available on the Internet at URLhttp://www.nxp.com.

9.2 Definitions

Preview — The document is a preview version only. The document is still

subject to formal approval, which may result in modificati ons or additions.

NXP Semiconductors does not give any representations or warranties as to

the accuracy or completeness of informati on included herein and shall have

no liability for the consequences of use of such info rmation.

Draft — The document is a draft version only. The content is still under

internal review and subject to formal approval, which may result in

modifications or additions. NXP Semiconductors does not give any

representations or warranties as to the accuracy or completeness of

information included herein and shall have no liab ility for the consequences of

use of such information.

Short data sheet — A short data sheet is an extract from a full data sheet

with the same product type number(s) and tit le. A short data sh eet is intended

for quick reference only and shou ld not be rel ied u pon to cont ain det ailed and

full information. For detailed and full information see the relevant full data

sheet, which is available on request via the local NXP Semiconductors sales

office. In case of any inconsistency or conflict with the short data sheet, the

full data sheet shall pre vail.

Product specifica t io n — The information and data provide d in a Product

data sheet shall define the specification of the product as agreed between

NXP Semiconductors and its customer, unless NXP Semiconductors and

customer have explicitly agreed otherwise in writing. In no event however,

shall an agreement be valid in which the NXP Semiconductors product is

deemed to off er functions and qualities beyond those described in the

Product data sheet.

9.3 Disclaimers

Limited warranty and liability — Information in this document is be lieved to

be accurate and reliable. However, NXP Semiconductors does not give any

representations or warranties, expressed or implied, as to the accuracy or

completeness of such information and shall have no liability for the

consequences of use of such information. NXP Se miconductors takes no

responsibility for the content in this document if provided by an inf ormation

source outside of NXP Semiconductors.

In no event shall NXP Semiconductors be liable for any indirect, incidental,

punitive, special or consequ ential damages (including - wit hout limitatio n - lost

profits, lost savings, business interruption, costs related to the removal or

replacement of any products or rework charges) whether or not such

damages are based on tort (including negligence), warranty, breach of

contract or any other legal theory.

Notwithstanding any damages that customer might incur for any reason

whatsoever, NXP Semiconductors’ ag gregate and cumulati ve liability toward s

customer for the products described herein shall be limited in accordance

with theTerms and conditions of commercial sale of NXP Semiconductors.

Right to make changes — NXP Semiconductors reserves the right to make

changes to information published in this document, including without

limitation specifications and product descriptions, at any time and without

notice. This document supersed es an d r eplaces all inf ormation supplied pri or

to the publication hereof.

Suitability for use — NXP Semiconductors products are not designed,

authorized or warranted to be suitable for use in life support, life-critical or

safety-critical systems or equipment, nor in applications where failure or

malfunction of an NXP Semiconductors product can reasonably be expect ed

to result in perso nal injury, death or severe property or environmental

damage. NXP Semiconductors and its suppliers accept no liability for

inclusion and/or use of NXP Semiconducto rs products in such equipment or

applications and ther efore such inclu sion and/or use is at the cu stomer’s own

risk.

Quick reference data — The Quick reference data is an extract of the

product data given in the Limiting values and Characteristics sections of this

document, and as such is not complete, exhaustive or legally binding.

Applications — Applications that are described herein for any of these

products are for il lustrative purposes only. NXP Semiconductors makes no

representation or warranty tha t such application s will be suitable for the

specified use without further testing or modification.

Customers are responsible for the design and ope ration of their applications

and products using NXP Semiconductors product s, and NXP Semiconductors

accepts no liability for any assistance with applications or customer product

design. It is customer’s sole responsibility to determine whether the NXP

Semiconductors product is suit able and fit for the custome r’s applications and

products planned, as well as fo r the planned application and use of

customer’s third party customer(s). Customers should provide appropriate

design and operating safeguards to minimize the risks associate d with t heir

applications and products.

NXP Semiconductors does not accept any liabil ity related to any default,

damage, costs or problem which is based on any weakness or default in the

customer’s applications or products, or the application or use by customer’s

third party customer(s). Customer is responsible for doing all necessary

testing for th e customer’s applications and products using NXP

Semiconductors products in order to avoid a default of the applications and

the products or of the application or use by cust omer’s third party

customer(s). NXP does not accept any liability in this respect.

Limiting values — St ress above one or more limiting values (as defined in

the Absolute Maximum Ratings System of IEC 60134) will cause permanent

damage to the device. Limiting values are stress rating s only and (proper)

operation of the device at these or any other conditions above those given in

the Recommended operating conditions section (if present) or the

Characteristics sections of this document is not warranted. Constant or

repeated exposure to limiting values will permanent ly and irreversibly affect

the quality and reliability of the device.

Document status[1] [2] Product status[3] Definition

Objective [short] data sheet Development This document contains data from the objective specification for product development.

Preliminary [shor t] data sheet Qualification This document contains data from the preliminary specification.

Product [short] data sheet Production This document contains the product specification.

Product data sheet Rev. 1 — 20 March 2012 11 of 12

NXP Semiconductors TYN16-600CT

SCR

Terms and conditions of commercial sale — NXP Semiconductors

products are sold subject to the general terms and conditions of commercial

sale, as published athttp://www.nxp.com/profile/terms, unless otherwise

agreed in a valid written individual agreement. In case an individual

agreement is concluded only the terms and conditions of the respective

agreement shall apply. NXP Semiconductors hereby expressly objects to

applying the customer’s general terms and conditions with regard to the

purchase of NXP Semiconductors products by customer.

No offer to sell or license — Nothing in this document may b e interpreted or

construed as an of fer to sell product s that is op en for accept ance or the grant ,

conveyance or implication of any license under any copyrights, patents or

other industrial or intellectual property rights.

Export control — This document as well as the item(s) descri bed herein may

be subject to export control regulat i ons. Export might require a prior

authorization from competent authorities.

Non-automotive qualified products — Unless this data sheet expressly

states that this specific NXP Semiconductors prod uct is automotive qualified,

the product is not suitable for automotive use. It i s neit her qualif ied nor tested

in accordance with automotive testing or application requirements. NXP

Semiconductors accepts no liability for inclusion and/or use of

non-automotive qualified products in automotive equipment or applications.

In the event that customer uses the product for design-in and use in

automotive applications to automot ive specifications and standard s, customer

(a) shall use the product without NXP Semiconductors’ warranty of the

product for such automotive applications, use and specifications, and (b)

whenever customer uses the product for automotive applications beyond

NXP Semiconductors’ specifications such use shall be solely at customer’s

own risk, and (c) customer fully indemnifies NXP Semiconductors for any

liability, damages or failed product claims resulting from customer design and

use of the product for automotive applications beyond NXP Semiconductors’

standard warranty and NXP Semiconductors’ product specif ications.

Translations — A non-English (translated) version of a document is for

reference only. The English version shall prevail in case of any discrepancy

between the translated and English versions.

9.4 Trademarks

Notice: All refe renced brands, produc t names, service names and trademarks

are the property of their respect i ve ow ners.

Adelante,Bitport,Bitsound,CoolFlux,CoReUse,DESFire,EZ-HV,FabKey,G

reenChip,HiPerSmart,HITAG,I²C-bus

logo,ICODE,I-CODE,ITEC,Labelution,MIFARE,MIFARE Plus,MIFARE

Ultralight,MoReUse,QLPAK,Silicon

Tuner,SiliconMAX,SmartXA,STARplug,TOPFET,TrenchMOS,TriMedia

andUCODE — are trademarks of NXP B.V.

HD Radio andHD Radio logo — are trademarks of iBiquity Digital

Corporation.

10. Contact information

For more information, please visit:http://www.nxp.com

For sales office addresses, please send an email to:salesaddresses@nxp.com

NXP Semiconductors TYN16-600CT

SCR

For more information, please visit: http://www.nxp.co m

For sales office addresses, please send an email to: salesaddresses@nxp.com

Date of release: 20 March 2012

Document identifier: TY N16-600CT

Please be aware that important notices concerning this document and the product(s)

described herein, have been included in section ‘Legal information’.

11. Contents

1 Product profile . . . . . . . . . . . . . . . . . . . . . . . . . . .1

1.1 General description . . . . . . . . . . . . . . . . . . . . . .1

1.2 Features and benefits. . . . . . . . . . . . . . . . . . . . .1

1.3 Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . .1

1.4 Quick reference data . . . . . . . . . . . . . . . . . . . . .1

2 Pinning information. . . . . . . . . . . . . . . . . . . . . . .2

3 Ordering information. . . . . . . . . . . . . . . . . . . . . .2

4 Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . .3

5 Thermal characteristics . . . . . . . . . . . . . . . . . . .5

6 Characteristics. . . . . . . . . . . . . . . . . . . . . . . . . . .6

7 Package outline . . . . . . . . . . . . . . . . . . . . . . . . . .8

8 Revision history. . . . . . . . . . . . . . . . . . . . . . . . . .9

9 Legal information. . . . . . . . . . . . . . . . . . . . . . . .1 0

9.1 Data sheet status . . . . . . . . . . . . . . . . . . . . . . .10

9.2 Definitions. . . . . . . . . . . . . . . . . . . . . . . . . . . . .1 0

9.3 Disclaimers. . . . . . . . . . . . . . . . . . . . . . . . . . . .10

9.4 Trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . .11

10 Contact information. . . . . . . . . . . . . . . . . . . . . .11