Description
The MoonstoneTM 1W Power LED Light Source is a high
performance energy efficient device which can handle
high thermal and high driving current. The exposed pad
design has excellent heat transfer from the package to
the motherboard.
The Cool White Power LED is available in various color
temperature ranging from 4000K to 10000K and Warm
White Power LED ranging from 2600K to 4000K.
The low profile package design is suitable for a wide
variety of applications especially where height is a
constraint.
The package is compatible with reflow soldering
process. This will give more freedom and flexibility to
the light source designer.
Applications
• Portable (flash light, bicycle head light)
• Reading light
• Architectural lighting
• Garden lighting
• Decorative lighting
ASMT-Mx00
MoonstoneTM 1 W Power LED Light Source
Data Sheet
Features
• Available in Red, Amber, Green, Blue, Cool White and
Warm White color
• Energy efficient
• Exposed pad for excellent heat transfer
• Suitable for reflow soldering process
• High current operation
• Long operation life
• Wide viewing angle
• Silicone encapsulation
• ESD Class HBM Class 3B (threshold > 8 kV)
• MSL 2A for InGaN products
• MSL 4 for AlInGaP products
Specifications
• AlInGaP technology for Red and Amber
• 2.4 V (typ) at 350 mA for AlInGaP
• InGaN technology for Green, Blue, Cool White and
Warm White
• 3.6 V (typ) at 350 mA for InGaN
• 120 viewing angle
2
Package Dimensions
Device Selection Guide ( Tj = 25°C)
Part Number Color
Luminous Flux, fV
[1,2] (lm) Test Current
(mA)
Dice
TechnologyMin. Typ. Max.
ASMT-MR00-AGH00 Red 25.5 35.0 43.0 350 AlInGaP
ASMT-MR00-AHJ00 33.0 40.0 56.0 350 AlInGaP
ASMT-MA00-AGH00 Amber 25.5 35.0 43.0 350 AlInGaP
ASMT-MG00 Green 43.0 60.0 73.0 350 InGaN
ASMT-MB00 Blue 11.5 15.0 25.5 350 InGaN
ASMT-MW00 Cool White 43.0 60.0 73.0 350 InGaN
ASMT-MY00 Warm White 43.0 50.0 73.0 350 InGaN
ASMT-MWB1 Cool White Diffused 43.0 55.0 73.0 350 InGaN
ASMT-MYB1 Warm White Diffused 43.0 46.0 73.0 350 InGaN
Notes
1. fV is the total luminous flux output as measured with an integrating sphere at 25 ms mono pulse condition.
2. Flux tolerance is ± 10%.
Metal Slug
Cathode
Anode1
2
3
10.00
8.50
3
12
8.50
Ø 5.26
Ø 8.00
5.08 0.81
2.00 5.25
1.30
10.60
1.27
3.30
Heat Sink
LED
ZENER
+
−
Notes:
1. All dimensions are in millimeters.
2. Tolerance is ±0.1 mm unless otherwise specified.
3. Metal slug is connected to anode for electrically non-isolated option.
3
Part Numbering System
Absolute Maximum Ratings (TA = 25°C)
Parameter ASMT-Mx00 / ASMT-MxB1 Units
DC Forward Current [1] 350 mA
Peak Pulsing Current [2] 1000 mA
Power Dissipation for AlInGaP 1050 mW
Power Dissipation for InGaN 1400 mW
LED Junction Temperature for AlInGaP 125 °C
LED Junction Temperature for InGaN 110 °C
Operating Ambient Temperature Range -40 to +100 °C
Storage Temperature Range -40 to +120 °C
Notes:
1. DC forward current – derate linearly based on Figure 5 for AlInGaP & Figure 11 for InGaN.
2. Pulse condition duty factor = 10%, Frequency = 1kHz.
Note:
1. Please refer to Page 8 for selection details.
ASMT-M x xx – x x1 x2 x3 x4
Packaging Option
Color
R – Red
A – Amber
G - Green
B - Blue
W - Cool White
Y - Warm White
Color Bin Selection
Maximum Flux Bin Selection
Minimum Flux Bin Selection
Dice Type
N – InGaN
A – AllnGaP
Silicone Type
00 – Non-diffused
B1 – Diffused
4
Optical Characteristics at 350 mA (TJ = 25°C)
Part Number Color
Peak Wavelength
lPEAK (nm)
Typ.
Dominant
Wavelength
lD [1] (nm)
Typ.
Viewing Angle
2q1/2 [2] (°)
Typ.
Luminous
Efficiency (lm/W)
Typ.
ASMT-MR00-AGH00 Red 635 625 120 42
ASMT-MR00-AHJ00 Red 635 625 120 48
ASMT-MA00-AGH00 Amber 598 590 120 42
ASMT-MG00 Green 519 525 120 48
ASMT-MB00 Blue 460 467 120 12
Part Number Color
Correlated Color Temperature,
CCT (Kelvin)
Viewing Angle
2q½
[2] (°)
Luminous
Efficiency (lm/W)
Min. Max. Typ. Typ.
ASMT-MW00 Cool White 4000 10000 110 48
ASMT-MY00 Warm White 2600 4000 110 40
ASMT-MWB1 Cool White Diffused 4000 10000 110 44
ASMT-MYB1 Warm White Diffused 2600 4000 110 37
Notes:
1. The dominant wavelength, lD, is derived from the CIE Chromaticity Diagram and represents the color of the device.
2. q1/2 is the off-axis angle where the luminous intensity is 1/2 the peak intensity.
Electrical Characteristic at 350 mA (TJ = 25°C)
Dice Type
Forward Voltage
VF (Volts) at IF = 350mA
Reverse Voltage
VR (Volts)
Thermal Resistance
Rqj-ms (°C/W) [1]
Min Typ. Max. Max. Typ.
AlInGaP 2.0 2.4 3.0 5 12
InGaN 3.2 3.6 4.0 5 10
Notes:
1. RqJ-ms is Thermal Resistance from LED junction to metal slug.
5
Figure 1. Relative Intensity vs. Wavelength for AlInGaP Figure 2. Forward Current vs Forward Voltage for AlInGaP
Figure 3. Relative Luminous Flux vs. Mono Pulse Current for AlInGaP Figure 4. Radiation Pattern for AlInGaP
Figure 5. Maximum forward current vs. ambient temperature for AlInGaP
Derated based on TJMAX = 125°C, RθJA = 40°C/W / 50°C/W and 60°C/W
Figure 6. Relative LOP (Normalized at 25°C) vs. junction temperature for
AlInGaP
JUNCTION TEMPERATURE - °C
RELATIVE LOP (Normalized at 25°C)
0
0.5
1
1.5
2
-40 -25 -10 5 20 35 50 65 80 95 110 125
RED
AMBER
0
50
100
150
200
250
300
350
400
0 10 20 30 40 50 60 70 80 90
TA- AMBIENT TEMPERATURE - °C
IF - MAX FORWARD CURRENT - mA
RJA = 60°C/W
RJA = 40°C/W
= 50°C/WR JA
0.0
0.1
0.2
0.3
0.4
0.5
0.6
0.7
0.8
0.9
1.0
380 430 480 530 580 630 680 730 780
WAVELENGTH - nm
RELATIVE INTENSITY
RED
AMBER
0
50
100
150
200
250
300
350
400
450
500
0.00 0.50 1.00 1.50 2.00 2.50 3.00
FORWARD VOLTAGE - V
FORWARD CURRENT - mA
0.0
0.2
0.4
0.6
0.8
1.0
1.2
1.4
0 50 100 150 200 250 300 350 400 450 500
MONO PULSE CURRENT - mA
RELATIVE LUMINOUS FLUX (-v) - lm
0
0.1
0.2
0.3
0.4
0.5
0.6
0.7
0.8
0.9
1
-90 -70 -50 -30 -10 10 30 50 70 90
OFF-AXIS ANGLE(°)
RELATIVE INTENSITY
6
DOMINANT WAVELENGTH – nm
100
450
FORWARD CURRENT – mA
400
510
520
200150
540
530
250 300
490
350
480
470
460
500
GREEN
BLUE
IF – MAXIMUM FORWARD CURRENT – mA
0
0
TA – AMBIENT TEMPERATURE – °C
90
300
350
2010 30
400
40 50 60
200
70 80
150
100
50
250
Rθ
JA
= 50 C/W
Rθ
JA
= 40 C/W
Rθ
JA
= 30 C/W
0
50
100
150
200
250
300
350
400
450
500
0.00 0.50 1.00 1.50 2.00 2.50 3.00 3.50 4.00
FORWARD VOLTAGE - V
FORWARD CURRENT - mA
0.0
0.1
0.2
0.3
0.4
0.5
0.6
0.7
0.8
0.9
1.0
380 430 480 530 580 630 680 730 780
WAVELENGTH - nm
RELATIVE INTENSITY
GREEN
BLUE
COOL WHITE
WARM WHITE
0.0
0.2
0.4
0.6
0.8
1.0
1.2
1.4
0 5 0 100 150 200 250 300 350 400 450 500
MONO PULSE CURRENT - mA
RELATIVE LUMINOUS FLUX (φV) - lm
0.0
0.1
0.2
0.3
0.4
0.5
0.6
0.7
0.8
0.9
1.0
-90 -70 -50 -30 -10 10 30 50 70 90
OFF-AXIS ANGLE (°)
RELATIVE INTENSITY
GREEN
BLUE
COOL WHITE
WARM WHITE
Figure 7. Relative Intensity vs. Wavelength for InGaN Figure 8. Forward Current vs. Forward Voltage for InGaN
Figure 9. Relative Luminous Flux vs Mono Pulse Current for InGaN Figure 10. Radiation Pattern for InGaN
Figure 11. Maximum Forward Current vs. Ambient Temperature for InGaN
Derated based on TJMAX = 110°C, RqJA = 30°C/W, 40°C/W and 50°C/W
Figure 12. Dominant wavelength vs. forward current – InGaN devices
7
Figure 13. Chromaticity shift vs. current
*Note: (x,y) values @ 350 mA reference to (0.0)
Figure 14. Recommended reflow soldering profile Figure 15. Recommended soldering land pattern
Figure 16. Temperature vs. relative forward voltage shift Figure 17. Relative LOP vs Junction Temperature for InGaN Devices
Note:
For detail information on reflow soldering of Avago surface mount LEDs, do refer to Avago Application Note AN1060 Surface Mounting SMT LED
Indicator Components.
217 °C
200 °C
150 °C
60 - 120 SEC.
-6 °C/SEC. MAX.
3 °C/SEC. MAX.
3 °C/SEC. MAX.
255 - 260 °C
100 SEC. MAX.
10 - 30 SEC.
TIME
TEMPERATURE
(Acc. to J-STD-020C)
17.00 ± 0.20
1.00 ± 0.10
3.1 ± 0.10
8.40 ± 0.10
5.08 ± 0.10
10.70 ± 0.10
Y-COORDINATES
0
0.002
0
X-COORDINATES
0.008
0.014
0.0030.0020.001
0.016
0.004 0.005 0.006
0.01
0.007
0.008
0.006
0.004
0.012
100 mA
150 mA
250 mA
300 mA
350 mA
-300
-250
-200
-150
-100
-50
0
50
100
150
200
250
300
-40 -15 10 35 60 85
TEMPERATURE - °C
RELATIVE FORWARD VOLTAGE SHIFT (mV)
0
10
20
30
40
50
60
70
80
90
100
25 30 35 40 45 50 55 60 65 70 75 80 85 90 95 100105110
JUNCTION TEMPERATURE (°C)
RELATIVE LOP (%)
GREEN
BLUE
COOL WHITE
WARM WHITE
8
Color Bin Selection [x3]
Individual reel will contain parts from one full bin only.
Option Selection Details
ASMT-Mxxx – x x1 x2 x3 x4
x1 – Minimum Flux Bin Selection
x2 – Maximum Flux Bin Selection
x3 – Color Bin Selection
x4 – Packaging Option
Cool White
0 Full Distribution
A A only
B B only
C C only
D D only
E E only
F F only
G G only
H H only
L A and G only
M B and H only
N A and C only
P B and D only
Q E and C only
R F and D only
S G and H only
U E and F only
W C and D only
Z A and B only
1 A, B, C and D only
2 G, H, A and B only
4 C, D, E and F only
Warm White
0 Full Distribution
A A only
B B only
C C only
D D only
E E only
F F only
N A and C only
P B and D only
Q E and C only
R F and D only
U E and F only
W C and D only
Z A and B only
1 A, B, C and D only
4 C, D, E and F only
Other Colors
0 Full Distribution
Z A and B
Y B and C
W C and D
V D and E
Q A, B and C
P B, C and D
N C, D and E
Flux Bin Limit [x1 x2]
Bin
Luminous Flux (lm) at IF = 350mA
Min. Max.
D 11.5 15.0
E 15.0 19.5
F 19.5 25.5
G 25.5 33.0
H 33.0 43.0
J 43.0 56.0
K 56.0 73.0
Tolerance for each bin limits is ±10%
9
Cool
White
Color Limits
(Chromaticity Coordinates)
Bin A x
y
0.367
0.400
0.362
0.372
0.329
0.345
0.329
0.369
Bin B x
y
0.362
0.372
0.356
0.330
0.329
0.302
0.329
0.345
Bin C x
y
0.329
0.369
0.329
0.345
0.305
0.322
0.301
0.342
Bin D x
y
0.329
0.345
0.329
0.302
0.311
0.285
0.305
0.322
Bin E x
y
0.303
0.333
0.307
0.311
0.283
0.284
0.274
0.301
Bin F x
y
0.307
0.311
0.311
0.285
0.290
0.265
0.283
0.284
Bin G x
y
0.388
0.417
0.379
0.383
0.362
0.372
0.367
0.400
Bin H x
y
0.379
0.383
0.369
0.343
0.356
0.330
0.362
0.372
Tolerance: ± 0.01
Figure 19. Color bins (Warm White).
Figure 18. Color bins (Cool White).
0.24
0.26
0.28
0.30
0.32
0.34
0.36
0.38
0.40
0.42
0.44
0.24 0.26 0.28 0.30 0.32 0.34 0.36 0.38 0.40 0.42 0.44
X - COORDINATE
Y - COORDINATE
B
C
E
Black Body Curve
D
A
F
4.5k
5.6k
7k
10k
4.0k
G
H
0.32
0.34
0.36
0.38
0.40
0.42
0.44
0.46
0.48
0.34 0.36 0.38 0.40 0.42 0.44 0.46 0.48 0.50 0.52
X - COORDINATE
Y - COORDINATE
B
C
E
Black Body Curve
D
A
F
3.0k
3.5k
4.0k
2.6k
Color Bin Limits
Warm
White
Color Limits
(Chromaticity Coordinates)
Bin A x
y
0.452
0.434
0.488
0.447
0.470
0.414
0.438
0.403
Bin B x
y
0.438
0.403
0.470
0.414
0.452
0.384
0.424
0.376
Bin C x
y
0.407
0.393
0.418
0.422
0.452
0.434
0.438
0.403
Bin D x
y
0.395
0.362
0.407
0.393
0.438
0.403
0.424
0.376
Bin E x
y
0.381
0.377
0.387
0.404
0.418
0.422
0.407
0.393
Bin F x
y
0.373
0.349
0.381
0.377
0.407
0.393
0.395
0.362
Tolerance: ± 0.01
Color Bin Min. Max.
Red Full Distribution 620.0 635.0
Amber A 582.0 584.5
B 584.5 587.0
C 587.0 589.5
D 589.5 592.0
E 592.0 594.5
Blue A 460.0 465.0
B 465.0 470.0
C 470.0 475.0
D 475.0 480.0
Green A 515.0 520.0
B 520.0 525.0
C 525.0 530.0
D 530.0 535.0
Tolerance: ± 1 nm
10
Sub-Color Binning
(Only Applicable for Color Bin A to Bin D and Bin G to Bin H)
Cool White (Chromaticity Coordinates)
Bin D1
X
Y
0.329
0.345
0.329
0.331
0.317
0.320
0.316
0.333
Bin D2
X
Y
0.329
0.331
0.329
0.320
0.318
0.310
0.317
0.320
Bin D3
X
Y
0.329
0.320
0.329
0.302
0.320
0.293
0.318
0.310
Bin D4
X
Y
0.316
0.333
0.317
0.320
0.307
0.311
0.305
0.322
Bin D5
X
Y
0.317
0.320
0.318
0.310
0.309
0.300
0.307
0.311
Bin D6
X
Y
0.318
0.310
0.320
0.293
0.311
0.285
0.309
0.300
Bin G1
X
Y
0.392
0.421
0.386
0.400
0.364
0.383
0.367
0.400
Bin G2
X
Y
0.386
0.400
0.382
0.385
0.362
0.372
0.364
0.383
Bin H1
X
Y
0.382
0.385
0.378
0.370
0.360
0.357
0.362
0.372
Bin H2
X
Y
0.378
0.370
0.375
0.358
0.358
0.343
0.360
0.357
Bin H3
X
Y
0.375
0.358
0.371
0.344
0.356
0.330
0.358
0.343
Tolerances ±0.01
Color Limits
Cool White (Chromaticity Coordinates)
Bin A1
X
Y
0.364
0.383
0.367
0.400
0.348
0.385
0.347
0.372
Bin A2
X
Y
0.364
0.383
0.362
0.372
0.346
0.359
0.347
0.372
Bin A3
X
Y
0.329
0.357
0.329
0.369
0.348
0.385
0.347
0.372
Bin A4
X
Y
0.329
0.345
0.329
0.357
0.347
0.372
0.346
0.359
Bin B1
X
Y
0.362
0.372
0.360
0.357
0.344
0.344
0.346
0.359
Bin B2
X
Y
0.360
0.357
0.358
0.343
0.343
0.331
0.344
0.344
Bin B3
X
Y
0.358
0.343
0.356
0.330
0.341
0.314
0.343
0.331
Bin B4
X
Y
0.329
0.331
0.329
0.345
0.346
0.359
0.344
0.344
Bin B5
X
Y
0.329
0.331
0.344
0.344
0.343
0.331
0.329
0.320
Bin B6
X
Y
0.343
0.331
0.341
0.314
0.329
0.302
0.329
0.320
Bin C1
X
Y
0.329
0.369
0.329
0.357
0.315
0.344
0.314
0.355
Bin C2
X
Y
0.329
0.357
0.329
0.345
0.316
0.333
0.315
0.344
Bin C3
X
Y
0.314
0.355
0.315
0.344
0.303
0.333
0.301
0.342
Bin C4
X
Y
0.315
0.344
0.316
0.333
0.305
0.322
0.303
0.333
Figure 20. Sub-color bins (Cool White)
0.24
0.26
0.28
0.30
0.32
0.34
0.36
0.38
0.40
0.42
0.44
0.24 0.26 0.28 0.30 0.32 0.34 0.36 0.38 0.40 0.42 0.44
X - COORDINATE
Y - COORDINATE
4.5k
5.6k
7k
10k
4.0k
A1
A2A3
A4 B1
B2
B3
B4
B5
B6
C1
C2
C3
C4 D1
D2
D3
D4
D5
D6
G1
G2
H1
H2
H3
Black Body Curve
Packing Tube - Option 0
Tape & Reel - Option 1
Tape Dimension
Dim Value
A0 8.80±0.10
B0 16.45±0.10
K0 3.60±0.10
W 24.0±0.10
P 16.0±0.10
Qty/Reel 250EA
Unit: mm
535.00
1.00
5.45
5.80
4.65
5.50
10.10
37.00
8.30
TOP VIEW
SIDE VIEW
A
A
B
Ao
B
P
SECTION B
SECTION A
Ko
W
F
E
Bo
2.5
Figure 21. Tube dimensions
Figure 22. Carrier tape dimensions
Example
ASMT-MR00-AHJ00
ASMT-MR00-Axxxx – AllnGaP Red, Non-diffused
x1 = H – Minimum Flux Bin H
x2 = J – Maximum Flux Bin J
x3 = 0 – Full Distribution
x4 = 0 – Tube Option
Packaging option [x4]
Selection Option
0 Tube
1 Tape & Reel
Reel Dimensions
R10.00
60.0º
∅268.00
∅330.00 ± 1.00
∅99.50 ± 1.00
2.30 2.30
24.0+1.00
−0.00
∅
13.50 ± 0.50
2.50 ± 0.50
R10.50 ± 0.50
120.0º
END
THERE SHALL BE A MINIMUM OF
160 mm OF EMPTY COMPONENT
POCKETS SEALED WITH COVER TAPE.
MOUNTED WITH
COMPONENTS
THERE SHALL BE A MINIMUM OF 390 mm OF EMPTY
COMPONENT POCKETS SEALED WITH COVER TAPE.
START
Tape & Reel - Option 1 (Cont.)
Tape Dimension
Figure 23. Carrier tape leader and trailer dimensions
Figure 24. Reel dimensions
DISCLAIMER
AVAGO’S PRODUCTS AND SOFTWARE ARE NOT SPECIFICALLY DESIGNED, MANUFACTURED OR AUTHORIZED FOR
SALE AS PARTS, COMPONENTS OR ASSEMBLIES FOR THE PLANNING, CONSTRUCTION, MAINTENANCE OR DIRECT OP-
ERATION OF A NUCLEAR FACILITY OR FOR USE IN MEDICAL DEVICES OR APPLICATIONS. CUSTOMER IS SOLELY RE-
SPONSIBLE, AND WAIVES ALL RIGHTS TO MAKE CLAIMS AGAINST AVAGO OR ITS SUPPLIERS, FOR ALL LOSS, DAMAGE,
EXPENSE OR LIABILITY IN CONNECTION WITH SUCH USE.
Handling Precaution
The encapsulation material of the product is made of sili-
cone for better reliability of the product. As silicone is a
soft material, please do not press on the silicone or poke
a sharp object onto the silicone. These might damage
the product and cause premature failure. During as-
sembly or handling, the unit should be held on the body
only. Please refer to Avago Application Note AN5288 for
detail information.
Moisture Sensitivity
This product is qualified as Moisture Sensitive Level 2a
for InGaN devices and MSL 4 for AlInGaP devices per
Jedec J-STD-020. Precautions when handling this mois-
ture sensitive product is important to ensure the reliabil-
ity of the product. Do refer to Avago Application Note
AN5305 Handling of Moisture Sensitive Surface Mount
Devices for details.
A. Storage before use
• Unopen moisture barrier bag (MBB) can be stored
at <40°C/90%RH for 12 months. If the actual shelf
life has exceeded 12 months and the humidity
indicator card (HIC) indicates that baking is not
required, then it is safe to reflow the LEDs per the
original MSL rating.
• It is not recommended to open the MBB prior to
assembly (e.g. for IQC).
For product information and a complete list of distributors, please go to our web site: www.avagotech.com
Avago, Avago Technologies, and the A logo are trademarks of Avago Technologies in the United States and other countries.
Data subject to change. Copyright © 2005-2009 Avago Technologies. All rights reserved. Obsoletes AV01-0668EN
AV02-0129EN - September 2, 2009
B. Control after opening the MBB
• The humidity indicator card (HIC) shall be read
immediately upon opening of MBB.
• The LEDs must be kept at <30°C/60%RH at all time
and all high temperature related process including
soldering, curing or rework need to be completed
within 672 hours for MSL 2a and 72 hours for MSL
4.
C. Control for unfinished reel
• For any unused LEDs, they need to be stored
in sealed MBB with desiccant or desiccator at
<5%RH.
D. Control of assembly boards
• If the PCB soldered with the LEDs is to be subjected
to other high temperature processes, the PCB
need to be stored in sealed MBB with desiccant
or desiccator at <5%RH to ensure no LEDs have
exceeded their floor life of 672 hours for MSL 2a
and 72 hours for MSL 4.
E. Baking is required if
• HIC “10%” indicator is not blue and “5%” indicator
is pink. - The LEDs are exposed to condition of
>30°C/60% RH at any time.
• The LEDs floor life exceeded 672 hours for MSL 2a
and 72 hours for MSL 4.
Recommended baking condition: 60±5ºC for 20hrs.
