Document No. DS13698, Rev. B, ECN 9816
Revision Date: 6/16/2011
Surface Mount PIN Diode Limiter
LM200802-M-A-300 Series Datasheet
Description
The LM200802-M-A-300 Series of Surface Mount Silicon PIN Diode Limiters is manufactured using
Aeroflex / Metelics proven hybrid manufacturing process incorporating Silicon NIP and PIN Diodes
integrated within a ceramic substrate. This low profile, compact, surface mount component,
(8mm L x 5mm W x 2.5 mm H ) offers superior low and high signal performance to comparable MMIC
devices in QFN packages. The Limiter Modules are designed to optimize small signal insertion loss, (N.F.)
and high signal flat leakage performance in a compact, surface mount package.
The design incorporates a NIP Diode with an Anti-Parallel PIN Diode to provide broadband microwave
performance from 20 MHz – 8 GHz. Using NIP and PIN Limiter Diodes with lower thermal resistance,
(< 55 ºC/W), RF C.W. incident power levels of +44 dBm and RF peak incident power levels of +50 dBm
@ 1 μS RF pulse width, 0.001 duty cycle are very achievable in broadband limiter applications. The lower
PIN and NIP Diode series resistance, (< 1.5 Ω), coupled with the smaller minority carrier lifetime,
(< 300 ηS), provides lower flat leakage power (< +20 dBm) and lower spike leakage energy (< 0.1 Ergs)
for superior LNA protection.
Applications
The LM200802-M-A-300 Limiter Series is ideal for 20 MHz to 8 GHz wideband applications, requiring
high volume, surface mount, solder re-flow manufacturing. These products are durable, reliable, and
capable of meeting all military, commercial, and industrial environments. The devices are fully RoHS
compliant and are available in tube or tape-reel.
Environmental Capabilities
The LM200802-M-A-300 Limiters are capable of meeting the environmental requirements of MIL-STD-
750 and MIL-STD-202.
ESD and Moisture Sensitivity Level Rating
PIN Diode Limiters are susceptible to ESD conditions as with all semiconductors. The ESD rating for this
device is Class 0, HBM. The moisture sensitivity level rating for this device is MSL 2.
Features
Surface Mount Limiter in Compact Outline:
8mm L x 5mm W x 2.5 mm H
Incorporates Anti-Parallel Limiter Diodes
Broadband Performance (20 MHz – 8 GHz)
Higher Average Power Handling than Plastic (44 dBm Avg Power)
Lower Insertion Loss (0.7 dB) & Lower Flat Leakage Power (20 dBm)
RoHS Compliant
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Document No. DS13698, Rev. B, ECN 9816
Revision Date: 6/16/2011
2
Parameter Symbol Units Test Conditions Minimum Typical Maximum
Value Value Value
Frequency F MHz Swept Frequency 10 20 - 8000 8500
Insertion Loss ILdB Swept Frequency | -1.4 | | -1.6 |
Po = 0 dBm
Return Loss RL dB Swept Frequency | -13 | | -15 |
Po = 0 dBm
Input Compression Power P1dB dBm Swept Frequency +6 +8 +10
2nd Harmonic 2FodBc Po = 0 dBm 40 50
Fo = 2 GHz
Peak Incident Power Pinc(Pk) dBm RF Pulse Width = +50 +51
1 μS, 0.001 duty
C.W. Incident Power Pinc(CW) dBm Swept Frequency +43 +44
Flat Leakage Power PfdBm +50 dBm, +20 +23
RF Pulse Width =
1 μS, 0.001 duty
Spike Leakage Energy EsErgs +50 dBm, 0.2 0.3
RF Pulse Width =
1 μS, 0.001 duty
Recovery Time ΤrηS ( 50% Trailing RF 500 800
Pulse – 1dB IL )
+50 dBm,
RF Pulse Width =
1 μS, 0.001 duty
LM200802-M-A-300 Electrical Specifications
@ Zo = 50 Ω, TA=+ 25 ºC (Unless Otherwise Defined)
PIN Diode Limiter
Absolute Maximum Ratings @ TA= + 25 ºC ( Unless Otherwise Defined )
Parameter Absolute Maximum Value
Operating Temperature -65 ºC to +125 ºC
Storage Temperature -65 ºC to +150 ºC
Junction Temperature +175 ºC
RF C.W. Incident Power @ + 85 ºC +42 dBm
Source & Load VSWR < 1.2:1
RF Peak. Incident Power @ + 85 ºC + 50 dBm, RF Pulse Width = 1μS,
Source & Load VSWR < 1.2:1 0.001 duty cycle
Insertion Loss Rate of Change | - 0.005 dB / º C |
with Operating Temperature
θjc, C.W. Thermal Resistance 55 º C/W
( Junction to Case )
Assembly Temperature +260 ºC for 10 Seconds
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Document No. DS13698, Rev. B, ECN 9816
Revision Date: 6/16/2011
3
PIN Diode Limiter
Assembly Instructions
The LM200802-M-A-300 Limiters are capable of being placed onto circuit boards with pick and place manufacturing
equipment from tube or tape-reel dispensing. The devices are attached to the circuit board using conventional solder
re-flow or wave soldering procedures with RoHS type or Sn 63 / Pb 37 type solders per Table I and Graph I
Time-Temperature recommended profile.
Table 1: Time-Temperature Profile for Sn 60/Pb40 or RoHS Type Solders
Profile Feature Sn-Pb Eutectic Assembly Pb-Free Assembly
Average ramp-up rate 3°C/second maximum 3°C/second maximum
(TLto TP)
Preheat
- Temperature Minimum (TSMIN)100°C 150°C
- Temperature Maximum (TSMAX)150°C 200°C
- Time (Minimum to maximum) (ts)60-120 seconds 60-180 seconds
TSMAX to TL
- Ramp-up Rate 3°C/second maximum
Time Maintauined above:
- Temperature (TL)183°C 217°C
- Time (tL) 60-150 seconds 60-150 seconds
Peak Temperature (TP)225 +0 / -5°C 245 +0/-5°C
Time within 5°C of actual
Peak Temperature (TP) 10-30 seconds 20-40 seconds
Ramp-down Rate 6°C/second maximum 6°C/second maximum
Time 25°C to Peak Temperature 6minutes maximum 8minutes maximum
LM200802-M-A-300 Limiter Schematic
Zo = 50 Ω
RF Input RF Output
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Document No. DS13698, Rev. B, ECN 9816
Revision Date: 6/16/2011
4
PIN Diode Limiter
Graph1: Solder Re-Flow Time-Temperature Function
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Document No. DS13698, Rev. B, ECN 9816
Revision Date: 6/16/2011
5
PIN Diode Limiter
LM200802-M-A-300 Typical RF Small Signal Performance @ +25 ºC
LM200802-M-A-300 Insertion Loss Vs. Frequency
-2
-1.8
-1.6
-1.4
-1.2
-1
-0.8
-0.6
-0.4
-0.2
0
0 1000 2000 3000 4000 5000 6000 7000 8000
Frequency (MHz)
Insertion Loss (dB)
Insertion Loss
LM200802-M-A-300 Return Loss vs. Frequency
-45
-40
-35
-30
-25
-20
-15
-10
-5
0
0 1000 2000 3000 4000 5000 6000 7000 8000
Frequency (MHz)
Return Loss (dB)
Return Loss
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Document No. DS13698, Rev. B, ECN 9816
Revision Date: 6/16/2011
6
PIN Diode Limiter
LM200802-M-A-300 High Signal Parametric Data
LM200802-M-A-300 Pout vs Pin Function (Continuous Wave)
0
2
4
6
8
10
12
14
16
18
20
10 15 20 25 30 35 40 45
Pin ( dBm )
Pout ( dBm )
F= 2.5 GHz
10 dB 20 dB 30 dB
0 dB
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Document No. DS13698, Rev. B, ECN 9816
Revision Date: 6/16/2011
7
PIN Diode Limiter
ARX
DATE CODE
PART NUMBER
LM200802-M-A-300 Outline Drawing, Case Style 300, (CS300)
RF Circuit Solder Footprint for Case Style 300 (CS 300)
Thatched Area is RF, D.C., and Thermal Ground.Vias should be solid copper fill and gold plated for optimum heat
transfer from backside of limiter module through Circuit Vias to metal thermal ground.
Document No. DS13698, Rev. B, ECN 9816
Revision Date: 6/16/2011
ISO 9001:2008 certified companies
Aeroflex / Metelics, Inc.
54 Grenier Field Road, Londonderry, NH 03053
Tel: (603) 641-3800
Sales: (888) 641-SEMI (7364)
Fax: (603)-641-3500
975 Stewart Drive, Sunnyvale, CA 94085
Tel: (408) 737-8181
Fax: (408) 733-7645
www.aeroflex.com/metelics metelics-sales@aeroflex.com
Our passion for performance is defined by three
attributes represented by these three icons:
solution-minded, performance-driven and customer-focused.
Aeroflex / Metelics, Inc. reserves the right to make changes to any products
and services herein at any time without notice. Consult Aeroflex or an author-
ized sales representative to verify that the information in this data sheet is cur-
rent before using this product. Aeroflex does not assume any responsibility or
liability arising out of the application or use of any product or service
described herein, except as expressly agreed to in writing by Aeroflex; nor
does the purchase, lease, or use of a product or service from Aeroflex con-
vey a license under any patent rights, copyrights, trademark rights, or any
other of the intellectual rights of Aeroflex or of third parties.
Copyright 2011 Aeroflex / Metelics. All rights reserved.
Part Number Ordering Information:
Part Number Description
LM200802-M-A-300-T Tube Packaging
LM200802-M-A-300-R Tape-Reel Packaging Quantities of 250 or 500
LM200802-M-A-300-W Waffle Packaging
LM200802-M-A-300-E RF Evaluation Board