

SEMICONDUCTOR
TECHNICAL DATA
UNDERVOLTAGE
SENSING CIRCUIT
ORDERING INFORMATION
Order this document by MC34064/D
Device Operating
Temperature Range Package
MC34064D–5 TA = 0° to +70°C
TA = – 40° to +85°C
SO–8
MC34064P–5 TO–226AA
MC33064DM–5 Micro–8
MC33064P–5 TO–226AA
P SUFFIX
PLASTIC PACKAGE
CASE 29
(TO–226AA)
12
D SUFFIX
PLASTIC PACKAGE
CASE 751
(SO–8)
3
Pin 1. Reset
2. Input
3. Ground
8
1
(Top View)
3
1N.C.
Ground
N.C.
N.C.
2
4
8
7
6
5N.C.
N.C.
Input
Reset
DM SUFFIX
PLASTIC PACKAGE
CASE 846A
(Micro–8)
8
1
MC34064DM–5 Micro–8
MC33064D–5 SO–8
1
MOTOROLA ANALOG IC DEVICE DATA
  
The MC34064 is an undervoltage sensing circuit specifically designed for
use as a reset controller in microprocessor-based systems. It offers the
designer an economical solution for low voltage detection with a single
external resistor. The MC34064 features a trimmed-in-package bandgap
reference, and a comparator with precise thresholds and built-in hysteresis
to prevent erratic reset operation. The open collector reset output is capable
of sinking in excess of 10 mA, and operation is guaranteed down to 1.0 V
input with low standby current. These devices are packaged in 3-pin
TO-226AA, 8-pin SO–8 and Micro–8 surface mount packages.
Applications include direct monitoring of the 5.0 V MPU/logic power
supply used in appliance, automotive, consumer and industrial equipment.
Trimmed-In-Package Temperature Compensated Reference
Comparator Threshold of 4.6 V at 25°C
Precise Comparator Thresholds Guaranteed Over Temperature
Comparator Hysteresis Prevents Erratic Reset
Reset Output Capable of Sinking in Excess of 10 mA
Internal Clamp Diode for Discharging Delay Capacitor
Guaranteed Reset Operation with 1.0 V Input
Low Standby Current
Economical TO–226AA, SO–8 and Micro–8 Surface Mount Packages
Representative Block Diagram
1.2 Vref
2 (2)
1 (1)
3 (4)
Reset
Gnd
Input
=Sink Only
Positive True Logic
Pin numbers adjacent to terminals are for the 3–pin TO–226AA package.
Pin numbers in parenthesis are for the 8–lead packages.
This device contains 21 active transistors.
Motorola, Inc. 1996 Rev 2
MC34064 MC33064
2MOTOROLA ANALOG IC DEVICE DATA
MAXIMUM RATINGS
Rating Symbol Value Unit
Power Input Supply Voltage Vin –1.0 to 10 V
Reset Output Voltage VO10 V
Reset Output Sink Current (Note 1) ISink Internally
Limited mA
Clamp Diode Forward Current, Pin 1 to 2 (Note 1) IF100 mA
Power Dissipation and Thermal Characteristics
P Suffix, Plastic Package
Maximum Power Dissipation @ TA = 25°C
Thermal Resistance, Junction–to–Air
D Suffix, Plastic Package
Maximum Power Dissipation @ TA = 25°C
Thermal Resistance, Junction–to–Air
DM Suffix, Plastic Package
Maximum Power Dissipation @ TA = 25°C
Thermal Resistance, Junction–to–Air
PD
RθJA
PD
RθJA
PD
RθJA
625
200
625
200
520
240
mW
°C/W
mW
°C/W
mW
°C/W
Operating Junction Temperature TJ+150 °C
Operating Ambient Temperature
MC34064
MC33064
TA0 to +70
–40 to +85
°C
Storage Temperature Range Tstg –65 to +150 °C
NOTE: ESD data available upon request.
ELECTRICAL CHARACTERISTICS (For typical values TA = 25°C, for min/max values TA is the operating ambient temperature range
that applies [Notes 2 and 3] unless otherwise noted.)
Characteristics Symbol Min Typ Max Unit
COMPARATOR
Threshold Voltage
High State Output (Vin Increasing)
Low State Output (Vin Decreasing)
Hysteresis
VIH
VIL
VH
4.5
4.5
0.01
4.61
4.59
0.02
4.7
4.7
0.05
V
RESET OUTPUT
Output Sink Saturation
(Vin = 4.0 V, ISink = 8.0 mA)
(Vin = 4.0 V, ISink = 2.0 mA)
(Vin = 1.0 V, ISink = 0.1 mA)
VOL
0.46
0.15
1.0
0.4
0.1
V
Output Sink Current (Vin, Reset = 4.0 V) ISink 10 27 60 mA
Output Off-State Leakage (V in, Reset = 5.0 V) IOH 0.02 0.5 µA
Clamp Diode Forward Voltage, Pin 1 to 2 (IF = 10 mA) VF0.6 0.9 1.2 V
TOTAL DEVICE
Operating Input Voltage Range Vin 1.0 to 6.5 V
Quiescent Input Current (Vin = 5.0 V) Iin 390 500 µA
NOTES: 1.Maximum package power dissipation limits must be observed.
2.Low duty cycle pulse techniques are used during test to maintain junction temperature as close to ambient as possible.
3.Tlow =0°C for MC34064 Thigh = +70°C for MC34064
–40°C for MC33064 +85°C for MC33064
MC34064 MC33064
3
MOTOROLA ANALOG IC DEVICE DATA
VO, OUTPUT VOLTAGE (V)
VO, OUTPUT VOLTAGE (V)
Figure 1. Reset Output Voltage versus
Input Voltage Figure 2. Reset Output Voltage versus
Input Voltage
Figure 3. Comparator Threshold Voltage
versus Temperature Figure 4. Input Current versus Input Voltage
Figure 5. Reset Output Saturation versus
Sink Current Figure 6. Reset Delay Time
Vin, INPUT VOLTAGE (V)
1
0
8.0
6.0
4.0
2.0
00 2.0 4.0 6.0 8.0 1
0
RL = 10 k to Vin
TA = 25
°
C
Vin, INPUT VOLTAGE (V)
5.0
4.0
3.0
2.0
1.0
04.56
04.58
04.60
04.62
04.64
0
RL = 10 k to Vin
TA = 25
°
C
TA, AMBIENT TEMPERATURE (
°
C)
th, THRESHOLD VOL TAGE (V)
4.630
4.620
4.610
4.600
4.590
4.580
4.570–55 –25 0 25 50 75 100 125
V
RL = 10 k to Vin Upper Threshold
High State Output
Lower Threshold
Low State Output
Vin, INPUT VOLTAGE (V)
in, INPUT CURRENT (mA)
1.0
0.8
0.6
0.4
0.2
00 2.0 4.0 6.0 8.0 10
I
TA = +25
°
C
–40
°
C
TA = +25
°
C
+85
°
C–40
°
C
VOL, OUTPUT SATURATION (V)
ISink, SINK CURRENT (mA)
2.0
1.5
1.0
0.5
0010203040
V
in = 4.0 V
TA = 85
°
C
TA = 25
°
C
TA = –40
°
C
90%
5.0 V –
4.0 V –
10%
+85
°
C
Reset
Vin
5.0V
4.0V
REF
10k
200 ns/DIV
Reset
Vin
Vin = 5.0 V to 4.0 V
RL = 10 k
TA = 25
°
C
Figure 7. Clamp Diode Forward Current
versus Voltage
Figure 8. Low Voltage Microprocessor Reset
Figure 9. Low Voltage Microprocessor Reset with Additional Hysteresis
80
60
40
20
00 0.4 0.8 1.2 1.6
VF, FORWARD VOLTAGE (V)
, FORWARD CURRENT (mA)
F
I
Vin = 0 V
TA = 25
°
C
A time delayed reset can be accomplished with the
addition of CDLY. For systems with extremely fast
power supply rise times (<500 ns) it is recommended
that the RCDLY time constant be greater than 5.0
µ
s.
Vth(MPU) is the microprocessor reset input threshold.
tDLY = RCDLY In 1
1 – Vth(MPU)
Power
Supply
+
2 (2) R
1 (1)
Reset
CDLY
Microprocessor
Circuit
1.2 V ref
3 (4)
+
Power
Supply
+
2 (2) RL
1 (1) Reset Microprocessor
Circuit
1.2Vref
3 (4)
+VH
4.6 RH+ 0.02
Vth(lower)
340 RH x 10–6
Where: RH
150
Where: RL
1.5
,
10 k
Comparator hysteresis can be increased with the addition of resistor RH. The hysteresis equation has been
simplified and does not account for the change of input current Iin as VCC crosses the comparator threshold
(Figure 4). An increase of the lower threshold
Vth(lower) will be observed due to Iin which is typically 340
µ
A at
4.59 V. The equations are accurate to
±
10% with RH less than 150
and RL between 1.5 k
and 10 k
Ω.
Iin
RH
Vin
RL
MC34064 MC33064
4MOTOROLA ANALOG IC DEVICE DATA
Test Data
VH
(mV) Vth
(mV) RH
()RL
(k)
20 0 0 0
51 3.4 10 1.5
40 6.8 20 4.7
81 6.8 20 1.5
71 10 30 2.7
112 10 30 1.5
100 16 47 2.7
164 16 47 1.5
190 34 100 2.7
327 34 100 1.5
276 51 150 2.7
480 51 150 1.5
Figure 10. Voltage Monitor Figure 11. Solar Powered Battery Charger
Figure 12. Low Power Switching Regulator
Figure 13. MOSFET Low Voltage Gate Drive Protection
Overheating of the logic level power MOSFET due to insufficient gate voltage can be prevented with the above
circuit. When the input signal is below the 4.6 V threshold of the MC34064, its output grounds the gate of the L2
MOSFET.
270
4.6V
VCC
RL
MTP3055EL
2 (2)
1 (1)
3 (4)
+
1.2Vref
2 (2)
1 (1)
3 (4)
+
1.2Vref
Power
Supply
+
1.0k 2 (2)
1 (1)
3 (4)
+
1.2Vref
+
Solar
Cells
2 (2)
1 (1)
3 (4)
+
1.2Vref
Vin = 11.5
to 14.5V 470 +MPSW51A 25
µ
H
VO = 5.0 V
IO = 50 mA
470 +
68022 +1N5819
1.2k
330 1N756
4.7k
MC34064 MC33064
5
MOTOROLA ANALOG IC DEVICE DATA
Test Conditions Results
Line Regulation Vin = 11.5 V to 14.5 V, IO = 50 mA 35 mV
Load Regulation Vin = 12.6 V, IO = 0 mA to 50 mA 12 mV
Output Ripple Vin = 12.6 V, IO = 50 mA 60 mVpp
Efficiency Vin = 12.6 V, IO = 50 mA 77%
MC34064 MC33064
6MOTOROLA ANALOG IC DEVICE DATA
P SUFFIX
PLASTIC PACKAGE
CASE 29–04
(TO–226AA)
ISSUE AD
D SUFFIX
PLASTIC PACKAGE
CASE 751–05
(SO–8)
ISSUE P
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
3. CONTOUR OF PACKAGE BEYOND DIMENSION R
IS UNCONTROLLED.
4. DIMENSION F APPLIES BETWEEN P AND L.
DIMENSION D AND J APPLY BETWEEN L AND K
MINIMUM. LEAD DIMENSION IS UNCONTROLLED
IN P AND BEYOND DIMENSION K MINIMUM.
R
A
P
J
L
F
B
K
G
H
SECTION X–X
C
V
D
N
N
XX
SEATING
PLANE DIM MIN MAX MIN MAX
MILLIMETERSINCHES
A0.175 0.205 4.45 5.20
B0.170 0.210 4.32 5.33
C0.125 0.165 3.18 4.19
D0.016 0.022 0.41 0.55
F0.016 0.019 0.41 0.48
G0.045 0.055 1.15 1.39
H0.095 0.105 2.42 2.66
J0.015 0.020 0.39 0.50
K0.500 ––– 12.70 –––
L0.250 ––– 6.35 –––
N0.080 0.105 2.04 2.66
P––– 0.100 ––– 2.54
R0.115 ––– 2.93 –––
V0.135 ––– 3.43 –––
1
SEATING
PLANE
14
58
C
K
4X P
A0.25 (0.010) MTBSS
0.25 (0.010) MBM
8X D
R
M
J
X 45
_
_
F
–A–
–B–
–T–
DIM MIN MAX
MILLIMETERS
A4.80 5.00
B3.80 4.00
C1.35 1.75
D0.35 0.49
F0.40 1.25
G1.27 BSC
J0.18 0.25
K0.10 0.25
M0 7
P5.80 6.20
R0.25 0.50
__
G
NOTES:
1. DIMENSIONS A AND B ARE DATUMS AND T IS A
DATUM SURFACE.
2. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
3. DIMENSIONS ARE IN MILLIMETER.
4. DIMENSION A AND B DO NOT INCLUDE MOLD
PROTRUSION.
5. MAXIMUM MOLD PROTRUSION 0.15 PER SIDE.
6. DIMENSION D DOES NOT INCLUDE MOLD
PROTRUSION. ALLOWABLE DAMBAR
PROTRUSION SHALL BE 0.127 TOTAL IN EXCESS
OF THE D DIMENSION AT MAXIMUM MATERIAL
CONDITION.
OUTLINE DIMENSIONS
MC34064 MC33064
7
MOTOROLA ANALOG IC DEVICE DATA
DM SUFFIX
PLASTIC PACKAGE
CASE 846A–02
(Micro–8)
ISSUE B
S
B
M
0.08 (0.003) A S
TDIM MIN MAX MIN MAX
INCHESMILLIMETERS
A2.90 3.10 0.114 0.122
B2.90 3.10 0.114 0.122
C––– 1.10 ––– 0.043
D0.25 0.40 0.010 0.016
G0.65 BSC 0.026 BSC
H0.05 0.15 0.002 0.006
J0.13 0.23 0.005 0.009
K4.75 5.05 0.187 0.199
L0.40 0.70 0.016 0.028
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSION A DOES NOT INCLUDE MOLD FLASH,
PROTRUSIONS OR GATE BURRS. MOLD FLASH,
PROTRUSIONS OR GATE BURRS SHALL NOT
EXCEED 0.15 (0.006) PER SIDE.
4. DIMENSION D DOES NOT INCLUDE INTERLEAD
FLASH OR PROTRUSION. INTERLEAD FLASH OR
PROTRUSION SHALL NOT EXCEED 0.25 (0.010)
PER SIDE.
–B–
–A–
D
K
G
PIN 1 ID
8 PL
0.038 (0.0015)
–T–
SEATING
PLANE
C
HJL
OUTLINE DIMENSIONS
MC34064 MC33064
8MOTOROLA ANALOG IC DEVICE DATA
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MC34064/D
*MC34064/D*