W24010 128K x 8 CMOS STATIC RAM GENERAL DESCRIPTION The W24010 is a normal-speed, very low-power CMOS static RAM organized as 131072 x 8 bits that operates on a wide voltage range from 2.7V to 5.5V power supply. The W24010 family, W2401070SL, W24010-70LE and W24010-70LI, can meet the requirement of various operating temperature. This device is manufactured using Winbond's high performance CMOS technology. FEATURES * * * * * Low power consumption: - Active: 350 mW (max.) - Standby: 15 W (max.)/3V 50 W (max.)/5V Access time: 70 nS (max.)/5V 100 nS (max.)/3V Single 3V/5V power supply Fully static operation All inputs and outputs directly TTL compatible PIN CONFIGURATIONS * Three-state outputs * Battery back-up operation capability * Data retention voltage: 2V (min.) * Packaged in 32-pin 600 mil DIP, 450 mil SOP, standard type one TSOP (8 mm x 20 mm), reverse type one TSOP (8 mm x 20 mm), small type one TSOP (8 mm x 13.4 mm) and reverse small type one TSOP (8 mm x 13.4 mm) BLOCK DIAGRAM PRECHARGE CKT. CLK GEN. NC 1 32 VDD A16 A16 2 31 A15 A14 A14 3 30 CS2 A12 A12 4 29 WE A7 5 28 A13 A2 A6 6 27 A8 A7 A5 7 26 A9 A6 A4 8 25 A11 A3 9 24 OE A2 10 23 A10 A1 11 22 CS1 A0 12 21 I/O8 I/O1 13 20 I/O7 A4 A3 R O W CORE CELL ARRAY 1024 ROWS D E C O D E R 128 X 8 COLUMNS A5 A9 A11 A9 A8 A13 WE CS2 A15 VDD NC A16 A14 A12 A7 A6 A5 A4 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 A4 A5 A6 A7 A12 A14 A16 NC VDD A15 CS2 WE A13 A8 A9 A11 16 15 14 13 12 11 10 9 8 7 6 5 4 3 2 1 I/O1 : I/O8 CLK GEN. A15 WE I/O2 14 19 I/O6 I/O3 15 18 I/O5 VSS 16 17 I/O4 32-pin TSOP 32-pin Reverse TSOP I/O CKT. COLUMN DECODER DATA CNTRL. A13 A8 A1 A0 A11 A10 CS1 CS2 OE 32 31 30 29 28 27 26 25 24 23 22 21 20 19 18 17 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32 OE A10 CS1 I/O8 I/O7 I/O6 I/O5 I/O4 VSS I/O3 I/O2 I/O1 A0 A1 A2 A3 PIN DESCRIPTION SYMBOL A0-A16 I/O1-I/O8 CS1, CS2 A3 A2 A1 A0 I/O1 I/O2 I/O3 VSS I/O4 I/O5 I/O6 I/O7 I/O8 WE OE VDD VSS NC CS1 A10 OE -1- DESCRIPTION Address Inputs Data Inputs/Outputs Chip Select Input Write Enable Input Output Enable Input Power Supply Ground No Connection Publication Release Date: December 1996 Revision A2 W24010 TRUTH TABLE CS1 CS2 OE WE MODE H X L L L X L H H H X X H L X X X H H L Not Selected Not Selected Output Disable Read Write VDD CURRENT I/O1-I/O8 High Z High Z High Z Data Out Data In ISB, ISB1 ISB, ISB1 IDD IDD IDD DC CHARACTERISTICS Absolute Maximum Ratings PARAMETER Supply Voltage to VSS Potential Input/Output to VSS Potential Allowable Power Dissipation Storage Temperature Operating Temperature RATING -0.5 to +7.0 -0.5 to VDD +0.5 1.0 -65 to +150 UNIT V V W SL 0 to 70 C LE -20 to 85 C LI -40 to 85 C C Note: Exposure to conditions beyond those listed under Absolute Maximum Ratings may adversely affect the life and reliability of the device. Operating Characteristics (VDD = 5V 10%; VDD = 3V 10%; VSS = 0V; TA (C) = 0 to 70 for SL, -20 to 85 for LE, -40 to 85 for LI) PARAMETER SYM. 5V 10% TEST CONDITIONS 3V 10% MIN. MAX. MIN. MAX. UNIT Input Low Voltage VIL - -0.5 +0.8 -0.5 +0.6 V Input High Voltage VIH - +2.2 VDD +0.5 +2.0 VDD +0.5 V Input Leakage Current ILI VIN = VSS to VDD -1 +1 -1 +1 A Output Leakage Current ILO VI/O = VSS to VDD, -1 +1 -1 +1 A CS = VIH (min.) or OE = VIH (min.) or WE = VIL (max.) Output Low Voltage VOL IOL = +2.1 mA - 0.4 - 0.4 V Output High Voltage VOH IOH = -1.0 mA 2.4 - 2.2 - V -2- W24010 Operating Characteristics, continued PARAMETER SYM. 5V 10% TEST CONDITIONS 3V 10% UNIT MIN. MAX. MIN. MAX. Operating Power Supply Current IDD CS = VIL (max.), I/O = 0 mA, Cycle = min. Duty = 100% - 70 - 30 mA Standby Power Supply Current ISB CS = VIH (min.), Cycle = min. Duty = 100% - 3 - 1 mA ISB1 CS VDD -0.2V - 10 - 5 A CAPACITANCE (VDD = 5V, TA = 25 C, f = 1 MHz) PARAMETER Input Capacitance Input/Output Capacitance SYM. CIN CI/O CONDITIONS VIN = 0V VOUT = 0V MAX. 6 8 UNIT pF pF Note: These parameters are sampled but not 100% tested. AC CHARACTERISTICS AC Test Conditions PARAMETER Input Pulse Levels CONDITIONS Input Rise and Fall Times Input and Output Timing Reference Level Output Load 3V 10%, 0V to 2.4V 5V 10%, 0V to 3.0V 5 nS 1.5V See the drawing below AC Test Loads and Waveform 1 TTL 1 TTL OUTPUT OUTPUT 100 pF Including Jig and Scope 5 pF Including Jig and Scope (For TCLZ, TOLZ, TCHZ, TOHZ, TWHZ, TOW ) 2.4V/3.0V 90% 10% 0V 5 nS 90% 10% 5 nS -3- Publication Release Date: December 1996 Revision A2 W24010 AC Characteristics, continued (VDD = 5V 10%; VDD = 3V 10%; VSS = 0V; TA (C) = 0 to 70 for SL, -20 to 85 for LE, -40 to 85 for LI) Read Cycle PARAMETER SYM. 5V 3V UNIT MIN. MAX. MIN. MAX. Read Cycle Time TRC 70 - 100 - nS Address Access Time TAA - 70 - 100 nS Chip Select Access Time TACS - 70 - 100 nS Output Enable to Output Valid TAOE - 35 - 50 nS Chip Selection to Output in Low Z TCLZ* 10 - 15 - nS Output Enable to Output in Low Z TOLZ* 5 - 5 - nS Chip Deselection to Output in High Z TCHZ* - 30 - 35 nS Output Disable to Output in High Z TOHZ* - 30 - 35 nS Output Hold from Address Change TOH 10 - 15 - nS These parameters are sampled but not 100% tested Write Cycle PARAMETER SYM. 5V 3V UNIT MIN. MAX. MIN. MAX. Write Cycle Time TWC 70 - 100 - nS Chip Selection to End of Write TCW 50 - 70 - nS Address Valid to End of Write TAW 50 - 70 - nS Address Setup Time TAS 0 - 0 - nS Write Pulse Width TWP 50 - 70 - nS TWR 0 - 0 - nS Data Valid to End of Write TDW 30 - 50 - nS Data Hold from End of Write TDH 0 - 0 - nS Write to Output in High Z TWHZ* - 25 - 30 nS Output Disable to Output in High Z TOHZ* - 25 - 30 nS Output Active from End of Write TOW 5 - 10 - nS Write Recovery Time CS1 , CS2, WE These parameters are sampled but not 100% tested -4- W24010 TIMING WAVEFORMS Read Cycle 1 (Address Controlled) TRC Address TAA TOH TOH DOUT Read Cycle 2 (Chip Select Controlled) CS1 CS2 TACS TCHZ TCLZ DOUT Read Cycle 3 (Output Enable Controlled) T RC Address T AA OE T OH T AOE T OLZ CS1 CS2 T ACS D OUT T CHZ T OHZ TCLZ -5- Publication Release Date: December 1996 Revision A2 W24010 Timing Waveforms, continued Write Cycle 1 TWC Address T WR OE T CW CS1 CS2 T AW WE T WP TAS TOHZ (1, 4) D OUT T DW TDH D IN Write Cycle 2 ( OE = VIL Fixed) T WC Address TWR TCW CS1 CS2 TAW WE T WP TAS TOH TWHZ (1, 4) D OUT TDW (2) (3) TOW TDH DIN Notes: 1. During this period, I/O pins are in the output state, so input signals of opposite phase to the outputs should not be applied. 2. The data output from DOUT are the same as the data written to DIN during the write cycle. 3. DOUT provides the read data for the next address. 4. Transition is measured 500 mV from steady state with CL = 5 pF. This parameter is guaranteed but not 100% tested. -6- W24010 DATA RETENTION CHARACTERISTICS (TA (C) = 0 to 70 for SL; -20 to 85 for LE; -40 to 85 for LI) PARAMETER SYM. TEST CONDITIONS VDD for Data Retention VDR CS VDD -0.2V Data Retention Current IDDDR Chip Deselect to Data Retention Time TCDR Operation Recovery Time TR MIN. TYP. MAX. UNIT 2.0 - - V CS VDD -0.2V, VDD = 3V - - 5 A See data retention waveform 0 - - nS TRC* - - nS * Read Cycle Time DATA RETENTION WAVEFORM VDD 0.9 VDD VDR > = 2V TCDR CS1 0.9 V DD TR CS > = V DD - 0.2V CS2 -7- Publication Release Date: December 1996 Revision A2 W24010 ORDERING INFORMATION PART NO. ACCESS TIME (nS) OPERATING VOLTAGE (V) OPERATING TEMPERATURE (C) PACKAGE W24010-70SL 70/100 5V/3V 0 to 70 600 mil DIP W24010S-70SL 70/100 5V/3V 0 to 70 450 mil SOP W24010T-70SL 70/100 5V/3V 0 to 70 Standard type one TSOP W24010U-70SL 70/100 5V/3V 0 to 70 Reverse type one TSOP W24010Q-70SL 70/100 5V/3V 0 to 70 Small type one TSOP W24010V-70SL 70/100 5V/3V 0 to 70 Reverse small type one TSOP W24010-70LE 70/100 5V/3V -20 to 85 600 mil DIP W24010S-70LE 70/100 5V/3V -20 to 85 450 mil SOP W24010T-70LE 70/100 5V/3V -20 to 85 Standard type one TSOP W24010U-70LE 70/100 5V/3V -20 to 85 Reverse type one TSOP W24010Q-70LE 70/100 5V/3V -20 to 85 Small type one TSOP W24010V-70LE 70/100 5V/3V -20 to 85 Reverse small type one TSOP W24010-70LI 70/100 5V/3V -40 to 85 600 mil DIP W24010S-70LI 70/100 5V/3V -40 to 85 450 mil SOP W24010T-70LI 70/100 5V/3V -40 to 85 Standard type one TSOP W24010U-70LI 70/100 5V/3V -40 to 85 Reverse type one TSOP W24010Q-70LI 70/100 5V/3V -40 to 85 Small type one TSOP W24010V-70LI 70/100 5V/3V -40 to 85 Reverse small type one TSOP Notes: 1. Winbond reserves the right to make changes to its products without prior notice. 2. Purchasers are responsible for performing appropriate quality assurance testing on products intended for use in applications where personal injury might occur as a consequence of product failure. -8- W24010 PACKAGE DIMENSIONS 32-pin P-DIP Dimension in inches Symbol A A1 A2 B B1 c D E E1 e1 L D 17 32 E1 a eA E S c A A2 A1 L Base Plane Seating Plane B e1 eA a B1 5.33 0.210 0.010 0.25 0.150 0.155 0.160 3.81 3.94 4.06 0.016 0.018 0.022 0.41 0.46 0.56 0.048 0.050 0.054 1.22 1.27 0.008 0.010 0.014 0.20 1.650 1.660 0.600 0.610 0.590 1.37 0.25 0.36 41.91 42.16 14.99 15.24 15.49 0.545 0.550 0.555 13.84 13.97 14.10 0.090 0.100 0.110 2.29 2.54 2.79 0.120 0.130 0.140 3.05 3.30 3.56 15 0 0.670 16.00 16.51 17.02 0 0.630 0.650 S Notes: 16 1 Dimension in mm Min. Nom. Max. Min. Nom. Max. 15 0.085 2.16 1. Dimensions D Max. & S include mold flash or tie bar burrs. 2. Dimension E1 does not include interlead flash. 3. Dimensions D & E1 . include mold mismatch and are determined at the mold parting line. 4. Dimension B1 does not include dambar protrusion/intrusion. 5. Controlling dimension: Inches 6. General appearance spec. should be based on final visual inspection spec. 32-pin SOP Wide Body Symbol A A1 A2 b c D E e HE L LE S y 17 32 e1 E HE L Detail F 1 b 16 Dimension in Inches Min. Nom. Max. Dimension in mm Min. Nom. 0.004 Max. 3.00 0.118 0.10 0.101 0.106 0.111 2.57 2.69 2.82 0.014 0.016 0.020 0.36 0.41 0.51 0.006 0.008 0.012 0.15 0.20 0.31 20.45 20.75 11.30 11.43 0.805 0.817 0.440 0.445 0.450 0.044 0.050 0.056 1.12 1.27 1.42 0.546 0.556 0.556 13.87 14.12 14.38 0.023 0.031 0.039 0.58 0.79 0.99 0.047 0.055 0.063 1.19 1.40 1.60 11.18 0.036 0.91 0.10 0.004 0 10 0 10 Notes: e1 D c A2 S Seating Plane y A e LE A1 1. Dimensions D Max. & S include mold flash or tie bar burrs. 2. Dimension b does not include dambar protrusion/intrusion. 3. Dimensions D & E include mold mismatch . and determined at the mold parting line. 4. Controlling dimension: Inches 5. General appearance spec should be based on final visual inspection spec. See Detail F -9- Publication Release Date: December 1996 Revision A2 W24010 Package Dimensions, continued 32-pin Standard Type One TSOP HD Dimension in Inches Dimension in mm Symbol D c 1 M e E 0.10(0.004) b A L Min. Nom. A __ __ A1 0.002 Min. Nom. __ __ 0.006 0.05 __ 0.037 0.039 0.041 0.95 1.00 1.05 0.008 0.009 0.17 0.20 0.23 c 0.005 0.006 0.007 0.12 0.15 0.17 D 0.720 0.724 0.728 18.30 18.40 18.50 E 0.311 0.315 0.319 7.90 8.00 8.10 HD 0.780 0.787 0.795 19.80 20.00 20.20 e __ L 0.016 L1 __ Y 0.000 1 0.020 0.020 0.031 __ __ __ 0.024 0.40 __ __ 0.004 0.00 5 1 3 0.50 0.50 0.80 __ 3 Controlling dimension: Millimeters 32-pin Reverse Type One TSOP Dimension in Inches Dimension in mm Symbol D c M e E 0.10(0.004) b 1 L Min. Nom. A __ __ A1 0.002 Min. Nom. __ __ 0.006 0.05 1.20 0.15 0.037 0.039 0.041 0.95 1.00 1.05 0.008 0.009 0.17 0.20 0.23 c 0.005 0.006 0.007 0.12 0.15 0.17 D 0.720 0.724 0.728 18.30 18.40 18.50 E 0.311 0.315 0.319 7.90 8.10 HD 0.780 0.787 0.795 19.80 e __ __ A2 Y 0.000 A1 1 0.020 0.020 0.031 __ 3 __ __ 0.024 0.40 __ __ 0.004 0.00 5 1 Controlling dimension: Millimeters - 10 - __ Max. 0.007 0.016 Y 0.047 b L L1 __ Max. A2 L1 A 1.20 0.15 0.007 HD Max. b A1 L1 0.047 A2 A2 Y __ Max. 8.00 20.00 20.20 0.50 0.50 0.80 __ 3 __ 0.60 __ 0.10 5 __ 0.60 __ 0.10 5 W24010 Package Dimensions, continued 32-pin Small Type One TSOP HD Dimension in Inches Dimension in mm Symbol D Min. A c e E A L A 2 A1 Y L1 1.25 0.006 0.05 0.037 0.039 0.041 0.95 1.00 1.05 0.007 0.008 0.009 0.17 0.20 0.27 0.0056 0.0059 0.0062 0.14 0.15 0.16 0.002 D E HD e L b Min. Nom. Max. 0.049 A1 A2 b c 1 Nom. Max. 0.461 0.15 0.465 0.469 11.70 11.80 11.90 0.311 0.315 0.319 7.90 8.00 8.10 0.520 0.528 0.536 13.20 13.40 13.60 0.50 0.020 0.012 0.020 0.028 L1 0.027 Y 0.000 0 0.30 0.50 0.70 0.675 0.004 3 0.00 5 0 0.10 3 5 Controlling dimension: Millimeters 32-pin Reverse Small Type One TSOP HD Symbol Min. D A A2 b c E D E HD e L 1 A 2 A L A1 Y L1 - 11 - Min. Nom. Max. 0.049 1 e Nom. Max. A c b Dimension in Inches Dimension in mm 1.25 0.006 0.05 0.037 0.039 0.041 0.95 1.00 1.05 0.007 0.008 0.009 0.17 0.20 0.27 0.0056 0.0059 0.0062 0.14 0.15 0.16 0.002 0.461 0.15 0.465 0.469 11.70 11.80 11.90 0.311 0.315 0.319 7.90 8.00 8.10 0.520 0.528 0.536 13.20 13.40 13.60 0.020 0.50 0.012 0.020 0.028 L1 0.027 Y 0.000 0 0.30 0.50 0.70 0.675 0.004 3 5 0.00 0 0.10 3 5 Controlling dimension: Millimeters Publication Release Date: December 1996 Revision A2 W24010 Headquarters Winbond Electronics (H.K.) Ltd. No. 4, Creation Rd. III, Science-Based Industrial Park, Hsinchu, Taiwan TEL: 886-3-5770066 FAX: 886-3-5792647 http://www.winbond.com.tw/ Voice & Fax-on-demand: 886-2-7197006 Rm. 803, World Trade Square, Tower II, 123 Hoi Bun Rd., Kwun Tong, Kowloon, Hong Kong TEL: 852-27513100 FAX: 852-27552064 Taipei Office 11F, No. 115, Sec. 3, Min-Sheng East Rd., Taipei, Taiwan TEL: 886-2-7190505 FAX: 886-2-7197502 Note: All data and specifications are subject to change without notice. - 12 - Winbond Electronics North America Corp. Winbond Memory Lab. Winbond Microelectronics Corp. Winbond Systems Lab. 2730 Orchard Parkway, San Jose, CA 95134, U.S.A. TEL: 1-408-9436666 FAX: 1-408-9436668