HW050AFZ - GE CRITICAL POWER

Data Sheet

April 2008

HW050AF and HW050FG Power Modules: dc-dc Converters:

36 to 75 Vdc Input, 5.0 and 3.3 Vdc or 3.3 and 2.5 Vdc Dual Output; 50 W

Applications

nDistributed power architectures

nCommunications equipment

nComputer equipment

Options

nRemote on/off logic choice (positive or negative)

nShort Pins

Features

nDual outputs with tight regulation

nLow profile

nSmall size: 99.1 mm x 60.0 mm x 8.5 mm

(3.90 in. x 2.36 in. x 0.33 in.)

nHigh efficiency: 85.5% typical

nFlexible loading between outputs

nFixed frequency

nOpen frame design; no case or potting

nOvercurrent protection

nOutput overvoltage protection

nRemote on/off

nWide output voltage adjustment

nOvertemperature protection

nWide operating temperature range

nISO* 9001 Certified manufacturing facilities

nComplies with ETSI ETI-300-321-2 voltage and

current requirements .

nUL† 60950 Recognized, CSA‡ 22.2 No. 60950-00

Certified, and VDE § 0805 (IEC60950) Licensed

nCE mark meets 73/23/EEC and 93/68/EEC

directives**

Description

The HW050 Dual-Output Power Modules are open frame (no case, no potting) dc-dc converters that operate

over an input voltage range of 36 Vdc to 75 Vdc and provide two precisely regulated dc outputs. The module

has a maximum power rating of 50 W, and uses synchronous rectification on both outputs to achieve a typical

full-load efficiency of 85.5%.

* ISO is a registered trademark of the International Organization for Standardization.

† UL is a registered trademark of Underwriters Laboratories, Inc.

‡ CSA is a registered trademark of Canadian Standards Association.

§ VDE is a trademark of Verband Deutscher Elektrotechniker e.V.

** This product is intended for integration into end-use equipment. All the required procedures for CE marking of end-use equipment should

be followed. (The CE mark is placed on selected products.)

The HW050 Dual-Output Power Modules use advanced

surface-mount technology and deliver high-quality, efficient,

and compact dc-dc conversion.

2Lineage Power

Data Sheet

April 200836 to 75 Vdc Input, 5.0 and 3.3 Vdc or 3.3 and 2.5 Vdc Dual Output; 50 W

HW050AF and HW050FG Power Modules: dc-dc Converters:

Absolute Maximum Ratings

Stresses in excess of the absolute maximum ratings can cause permanent damage to the device. These are abso-

lute stress ratings only. Functional operation of the device is not implied at these or any other conditions in excess

of those given in the operations sections of the data sheet. Exposure to absolute maximum ratings for extended

periods can adversely affect device reliability.

* With derated output power, see Thermal Considerations section.

Electrical Specifications

Unless otherwise indicated, specifications apply over all operating input voltage, resistive load, and temperature

conditions.

Table 1. Input Specifications

Fusing Considerations

CAUTION: This power module is not internally fused. An input line fuse must always be used.

This power module can be used in a wide variety of applications, ranging from simple stand-alone operation to an

integrated part of a sophisticated power architecture. To preserve maximum flexibility, internal fusing is not

included; however, to achieve maximum safety and system protection, always use an input line fuse. The safety

agencies require a normal-blow, fuse with a maximum rating of 6 A (see Safety Considerations section). Based on

the information provided in this data sheet on inrush energy and maximum dc input current, the same type of fuse

with a lower rating can be used. Refer to the fuse manufacturer’s data for further information.

Parameter Symbol Min Max Unit

Input Voltage:

Continuous

Transient (2 ms)

VI, trans

—

100

Vdc

Operating Ambient Temperature

(See Thermal Considerations section.)

TA–40 85* °C

Storage Temperature Tstg –55 125 °C

I/O Isolation Voltage (for 1 minute) — — 1500 Vdc

Parameter Symbol Min Typ Max Unit

Operating Input Voltage VI36 48 75 Vdc

Maximum Input Current II, max ——2.6A

Inrush Transient — — — 1.0 A2s

Input Reflected-ripple Current, Peak-to-peak

(5 Hz to 20 MHz, 12 µH source impedance)

——10—mAp-p

Input Ripple Rejection (100 Hz—120 Hz) — — 60 — dB

EMC, EN55022

(VI, nom, full load)

See EMC Consideration section.

Lineage Power 3

Data Sheet

April 2008 36 to 75 Vdc Input, 5.0 and 3.3 Vdc or 3.3 and 2.5 Vdc Dual Output; 50 W

HW050AF and HW050FG Power Modules: dc-dc Converters:

Electrical Specifications (continued)

Table 2. Output Specifications

* These are manufacturing test limits. In some situations, results may differ.

Parameter Device Symbol Min Typ Max Unit

Output Voltage Set Point

(VI = 48 V; IO = IO, max; TA = 25 °C)

HW050AF

HW050FG

VO1, set

VO2, set

VO1, set

VO2, set

4.92

3.25

2.46

5.00

3.30

2.50

5.08

3.35

2.54

Vdc

Output Voltage

(Over all operating input voltage, resistive

load, and temperature conditions until

end of life. See Figure 21.)

HW050AF

HW050FG

VO1

VO2

VO1

VO2

4.78

3.16

2.42

—

5.21

3.44

2.58

Vdc

Output Regulation:

Line (VI = 36 V to 75 V)

Load (IO = IO, min to IO, max)

Temperature (TA = –40 °C to +70 °C)

All

—

0.05

0.03

0.3

0.2

1.0

%VO

Output Ripple and Noise Voltage (see

Figure 20):

RMS (5 Hz to 20 MHz bandwidth)

(VI = 48 V)

Peak-to-peak (5 Hz to 20 MHz

bandwidth)

Temperature (TA = –25 °C to +70 °C)

HW050AF

HW050FG

HW050AF

HW050FG

—

150

mVrms

mVp-p

External Load Capacitance All — 0 — 10,000 µF

Output Current

(At IO < IO, min, the modules may exceed

output ripple specifications.)

Note: The maximum combined output

current must not exceed 12 A for

HW050AF, 16 A for HW050FG.

HW050AF

HW050FG

IO1

IO2

IO1

IO2

0.5

—

8.0

12.0

Adc

Output Current-limit Inception

(VO = 90% of VO, nom; 4 A load on other output

for HW050AF, and 4 A load on other output

for HW050FG)

HW050AF

HW050FG

IO, cli

—

11.0

15.0

13.0*

18.0*

Output Short-circuit Current (VO = 250 mV) All — — 30 — %IO, max

Efficiency

(for VI = 48 V, TA = 25 °C,

for HW050AF IO1 = 6 A, IO2 = 6 A;

for HW050FG IO1 = 8 A, IO2 = 8 A)

When Trimmed to Lowest Voltages:

HW050FG Trimmed to VO1 = 2.5 V,

VO2 = 1.5 V, IO1 = IO2 = 8 A

HW050AF

HW050FG

(trimmed down)

—

85.5

84.0

81.5

—

Switching Frequency All — — 200 — kHz

4Lineage Power

Data Sheet

April 200836 to 75 Vdc Input, 5.0 and 3.3 Vdc or 3.3 and 2.5 Vdc Dual Output; 50 W

HW050AF and HW050FG Power Modules: dc-dc Converters:

Electrical Specifications (continued)

Table 2. Output Specifications (continued)

Isolation Specifications

General Specifications

Parameter Device Symbol Min Typ Max Unit

Dynamic Response

(ΔIO/Δt = 1 A/10 µs, VI = 48 V, TA = 25 °C;

tested without any load capacitance.

Adding load capacitance will improve

performance.):

Load Change from IO1 = 50% to 75% of

IO1, max, lO2 = 30% of lO2, max:

Peak Deviation

Settling Time (VO < 10% of peak

deviation)

Load Change from IO = 50% to 25% of

IO1, max, lO2 = 30% of lO2, max:

Peak Deviation

Settling Time (VO < 10% of peak

deviation)

All

—

200

—

µs

Parameter Min Typ Max Unit

Isolation Capacitance — 40 — nF

Isolation Resistance 10 — — MΩ

Parameter Min Typ Max Unit

Calculated MTBF (IO = 80% of IO, max; TA = 20 °C) 2,000,000 hours

Weight — — 60 (2.1) g (oz.)

Data Sheet

April 2008

Lineage Power 5

36 to 75 Vdc Input, 5.0 and 3.3 Vdc or 3.3 and 2.5 Vdc Dual Output; 50 W

HW050AF and HW050FG Power Modules: dc-dc Converters:

Feature Specifications

Unless otherwise indicated, specifications apply over all operating input voltage, resistive load, and temperature

conditions. See Feature Descriptions for additional information.

* These are manufacturing test limits. In some situations, results may differ.

Solder Ball and Cleanliness Requirements

The open frame (no case or potting) power module will meet the solder ball requirements per J-STD-001B. These

requirements state that solder balls must neither be loose nor violate the power module minimum electrical spacing.

The cleanliness designator of the open frame power module is C00 (per J specification).

Solder, Cleaning, and Drying Considerations

Post solder cleaning is usually the final circuit-board assembly process prior to electrical board testing. The result

of inadequate circuit-board cleaning and drying can affect both the reliability of a power module and the testability

of the finished circuit-board assembly. For guidance on appropriate soldering, cleaning, and drying procedures,

refer to the Board-Mounted Power Modules Soldering and Cleaning Application Note

(AP97-021EPS.)

Parameter Device Symbol Min Typ Max Unit

Remote On/Off Signal Interface

(VI = 0 V to 75 V; open collector or equivalent

compatible; signal referenced to VI(–)

terminal; see Figure 22 and Feature

Descriptions.):

HW050AF1 Preferred Logic:

Logic Low—Module On

Logic High—Module Off

HW050FG Optional Logic:

Logic Low—Module Off

Logic High—Module On

Logic Low:

At Ion/off = 1.0 mA

At Von/off = 0.0 V

Logic High:

At Ion/off = 0.0 µA

Leakage Current

Turn-on Time (IO = 80% of IO, max; VO within

±1% of steady state; see Figure 17.)

—

All

Von/off

Ion/off

Von/off

Ion/off

—

1.2

1.0

µA

Output Voltage Set-point Adjustment (trim),

Each Output:

Note: There are trim restrictions based on

output voltage combinations. Refer to

the Feature Description section for

details.

HW050AF

HW050FG

for VO1

for VO2

for VO1

for VO2

4.75

1.50

2.50

1.50

—

5.25

3.46

2.50

Output Overvoltage Protection (shutdown) HW050AF

HW050FG

VO1 & VO2

—

7.0*

4.6*

6Lineage Power

Data Sheet

April 200836 to 75 Vdc Input, 5.0 and 3.3 Vdc or 3.3 and 2.5 Vdc Dual Output; 50 W

HW050AF and HW050FG Power Modules: dc-dc Converters:

Characteristic Curves

The following figures provide typical characteristics for the power modules. The figures are identical for both on/off

configurations.

8-2669 (F)

Figure 1. Typical HW050AF1 Input Characteristics

at Room Temperature

8-2670 (F)

Figure 2. Typical HW050FG1 Input Characteristics

at Room Temperature

Figure 3. Typical HW050AF1 Converter Efficiency

vs. Output Current at Room Temperature

Figure 4. Typical HW050FG1 Converter Efficiency

vs. Output Current at Room Temperature

1.8

1.4

1.2

1.0

0.8

0.6

0.4

0.2

0.0

0 6 24 42 48 54 60 66 72 78

1.6

INPUT VOLTAGE, VI (V)

INPUT CURRENT, II (A)

12 18 30 36

IO = 12.0 A

IO = 6.0 A

IO = 1.0 A

1.8

1.4

1.2

1.0

0.8

0.6

0.4

0.2

0.0

0 6 24 42 48 54 60 66 72 78

1.6

INPUT VOLTAGE, VI (V)

INPUT CURRENT, II (A)

12 18 30 36

IO = 16.0 A

IO = 8.0 A

IO = 1.0 A

4 6 8 10 12

TOTAL OUTPUT CURRENT, Io (A)

EFFICIENCY, η (%)

VI = 48 V

VI = 36 V

VI = 75 V

4 6 8 10 12 14 16

TOTAL OUTPUT CURRENT, Io (A)

EFFICIENCY, η (%)

VI = 48 V

VI = 36 V

VI = 75 V

Data Sheet

April 2008

Lineage Power 7

36 to 75 Vdc Input, 5.0 and 3.3 Vdc or 3.3 and 2.5 Vdc Dual Output; 50 W

HW050AF and HW050FG Power Modules: dc-dc Converters:

Characteristic Curves (continued)

8-2673 (F)

Figure 5. Typical HW050AF1 Output Ripple Voltage

5 V Output at Room Temperature and

IO = IO, max, Different Input Voltage

8-2674 (F)

Figure 6. Typical HW050AF1 Output Ripple Voltage

3.3 V Output at Room Temperature and

IO = IO, max, Different Input Voltage

8-2593 (F)

Figure 7. Typical HW050FG1 Output Ripple Voltage

3.3 V Output at Room Temperature and

IO = IO, max, Different Input Voltage

8-2594 (F)

Figure 8. Typical HW050FG1 Output Ripple Voltage

2.5 V at Room Temperature and

IO = IO, max, Different Input Voltage

TIME, t (2 μs/div)

OUTPUT VOLTAGE, VO (V)

(100 mV/div)

VI = 36 V

VI = 48 V

VI = 75 V

TIME, t (2 μs/div)

OUTPUT VOLTAGE, VO (V)

(100 mV/div)

VI = 36 V

VI = 48 V

VI = 75 V

TIME, t (2 μs/div)

OUTPUT VOLTAGE, VO (V)

(50 mV/div)

VI = 36 V

VI = 48 V

VI = 75 V

TIME, t (2 μs/div)

OUTPUT VOLTAGE, VO (V)

(50 mV/div)

VI = 36 V

VI = 48 V

VI = 75 V

88 Lineage Power

Data Sheet

April 200836 to 75 Vdc Input, 5.0 and 3.3 Vdc or 3.3 and 2.5 Vdc Dual Output; 50 W

HW050AF and HW050FG Power Modules: dc-dc Converters:

Characteristic Curves (continued)

8-3085 (F)

Note: Tested without any load capacitance. Adding load capacitance

will improve performance.

Figure 9. Typical HW050AF1 Transient Response to

Step Decrease in Load, IO1 = 50% to 25%

of IO1, max, IO2 = 30% of IO2, max, at Room

Temperature and 48 V Input (Waveform

Averaged to Eliminate Ripple

Component.)

8-3086 (F)

Note: Tested without any load capacitance. Adding load capacitance

will improve performance.

Figure 10. Typical HW050AF1 Transient Response

to Step Decrease in Load, IO2 = 50% to

25% of IO2, max, IO1 = 30% of IO1, max, at

Room Temperature and 48 V Input

(Waveform Averaged to Eliminate Ripple

Component.)

TIME, t (100 μs/div)

OUTPUT CURRENT, IO1 (A)

(5 A/div)

OUTPUT VOLTAGE, VO (V)

(100 mV/div)

VO1

VO2

IO1

TIME, t (100 μs/div)

OUTPUT CURRENT, IO2 (A)

(5 A/div)

OUTPUT VOLTAGE, VO (V)

(100 mV/div)

VO1

VO2

IO1

Lineage Power 9

Data Sheet

April 2008 36 to 75 Vdc Input, 5.0 and 3.3 Vdc or 3.3 and 2.5 Vdc Dual Output; 50 W

HW050AF and HW050FG Power Modules: dc-dc Converters:

Characteristic Curves (continued)

8-3087 (F)

Note: Tested without any load capacitance. Adding load capacitance

will improve performance.

Figure 11. Typical HW050AF1 Transient Response

to Step Increase in Load, IO1 = 50% to

75% of IO1, max, IO2 = 30% of IO2, max, at

Room Temperature and 48 V Input

(Waveform Averaged to Eliminate Ripple

Component.)

83088 (F)

Note: Tested without any load capacitance. Adding load capacitance

will improve performance.

Figure 12. Typical HW050AF1 Transient Response

to Step Increase in Load, IO2 = 50% to

75% of IO2, max, IO1 = 30% of IO1, max, at

Room Temperature and 48 V Input

(Waveform Averaged to Eliminate Ripple

Component.)

TIME, t (100 μs/div)

OUTPUT CURRENT, IO1 (A)

(5 A/div)

OUTPUT VOLTAGE, VO (V)

(100 mV/div)

VO1

VO2

IO1

TIME, t (100 μs/div)

OUTPUT CURRENT, IO2 (A)

(5 A/div)

OUTPUT VOLTAGE, VO (V)

(100 mV/div)

VO1

VO2

IO2

1010 Lineage Power

Data Sheet

April 200836 to 75 Vdc Input, 5.0 and 3.3 Vdc or 3.3 and 2.5 Vdc Dual Output; 50 W

HW050AF and HW050FG Power Modules: dc-dc Converters:

Characteristic Curves (continued)

8-3089 (F)

Note: Tested without any load capacitance. Adding load capacitance

will improve performance.

Figure 13. Typical HW050FG1 Transient Response

to Step Decrease in Load, IO1 = 50% to

25% of IO1, max, IO2 = 30% of IO2, max, at

Room Temperature and 48 V Input

(Waveform Averaged to Eliminate Ripple

Component.)

8-3090 (F)

Note: Tested without any load capacitance. Adding load capacitance

will improve performance.

Figure 14. Typical HW050FG1 Transient Response

to Step Decrease in Load, IO2 = 50% to

25% of IO2, max, IO1 = 30% of IO1, max, at

Room Temperature and 48 V Input

(Waveform Averaged to Eliminate Ripple

Component.)

TIME, t (100

s/div)

OUTPUT CURRENT, I

(A)

(5 A/div)

OUTPUT VOLTAGE, V

(V)

(200 mV/div)

TIME, t (100 μs/div)

OUTPUT CURRENT, IO2 (A)

(5 A/div)

OUTPUT VOLTAGE, VO (V)

(200 mV/div)

VO1

VO2

IO2

Lineage Power 11

Data Sheet

April 2008 36 to 75 Vdc Input, 5.0 and 3.3 Vdc or 3.3 and 2.5 Vdc Dual Output; 50 W

HW050AF and HW050FG Power Modules: dc-dc Converters:

Characteristic Curves (continued)

8-3091 (F)

Note: Tested without any load capacitance. Adding load capacitance

will improve performance.

Figure 15. Typical HW050FG1 Transient Response

to Step Increase in Load, IO1 = 50% to

75% of IO1, max, IO2 = 30% of IO2, max, at

Room Temperature and 48 V Input

(Waveform Averaged to Eliminate Ripple

Component.)

8-3092 (F)

Note: Tested without any load capacitance. Adding load capacitance

will improve performance.

Figure 16. Typical HW050FG1 Transient Response

to Step Increase in Load, IO2 = 50% to

75% of IO2, max, IO1 = 30% of IO1, max, at

Room Temperature and 48 V Input

(Waveform Averaged to Eliminate Ripple

Component.)

TIME, t (100 μs/div)

OUTPUT CURRENT, IO1 (A)

(5 A/div)

OUTPUT VOLTAGE, VO (V)

(200 mV/div)

VO1

VO2

IO1

TIME, t (100 μs/div)

OUTPUT CURRENT, IO2 (A)

(5 A/div)

OUTPUT VOLTAGE, VO (V)

(200 mV/div)

VO1

VO2

IO2

1212 Lineage Power

Data Sheet

April 200836 to 75 Vdc Input, 5.0 and 3.3 Vdc or 3.3 and 2.5 Vdc Dual Output; 50 W

HW050AF and HW050FG Power Modules: dc-dc Converters:

Characteristic Curves (continued)

8-2679

Note: Tested without any load capacitance.

Figure 17. Typical Start-Up from Remote On/Off

HW050AF; IO = IO, max

8-2599 (F)

Note: Tested without any load capacitance.

Figure 18. Typical Start-Up from Remote On/Off

HW050FG; IO = IO, max

Test Configurations

8-2794 (F)

Note: Measure input reflected-ripple current with a simulated source

inductance (LTEST) of 12 µH. Capacitor CS offsets possible bat-

tery impedance. Measure current as shown above.

Figure 19. Input Reflected-Ripple Test Setup

8-2795 (F)

Note: Use a 1.0 µF ceramic capacitor and a 10 µF aluminum or

tantalum capacitor. Scope measurement should be made

using a BNC socket. Position the load between 51 mm and

76 mm (2 in. and 3 in.) from the module.

Figure 20. Peak-to-Peak Output Noise

Measurement Test Setup

8-2796 (F)

Note: All measurements are taken at the module terminals. When

socketing, place Kelvin connections at module terminals to

avoid measurement errors due to socket contact resistance.

Figure 21. Output Voltage and Efficiency

Measurement Test Setup

TIME, t (5 ms/div)

REMOTE ON/OFF

VON/OFF (V)

OUTPUT VOLTAGE, VO (V)

(2 V/div)

VO1

VO2

TIME, t (5 ms/div)

REMOTE ON/OFF

VOLTAGE, VON/OFF (V)

OUTPUT VOLTAGE, VO (V)

(1 V/div)

VO1

VO2

V(+)

V(–)

CURRENT

PROBE

OSCILLOSCOPE

LTEST

12 μH

BATTERY

CS 100 μF

ESR < 0.1 Ω

@ 20 °C 100 kHz

33 μF

ESR < 0.7 Ω

@ 20 ºC

100 kHz

COPPER STRIP

1.0 μF10 μFSCOPE RESISTIVE

LOAD

VO(+)

COM

1.0 μF 10 μFSCOPE RLOAD1

VO1

1.0 μF 10 μF RLOAD2

VO2

COM

ηVO1(+) – VO1(–)[]IOVO2(+) – VO2(–)[]IO+

VI(+) –VI(–)[]II

------------------------------------------------------------------------------------------------------------

⎝⎠

⎛⎞

x 100=

Lineage Power 13

Data Sheet

April 2008 36 to 75 Vdc Input, 5.0 and 3.3 Vdc or 3.3 and 2.5 Vdc Dual Output; 50 W

HW050AF and HW050FG Power Modules: dc-dc Converters:

Design Considerations

Input Source Impedance

The power module should be connected to a low

ac-impedance input source. Highly inductive source

impedances can affect the stability of the power mod-

ule. For the test configuration in Figure 19, a 33 µF

electrolytic capacitor (ESR < 0.7 Ω at 100 kHz)

mounted close to the power module helps ensure sta-

bility of the unit. For other highly inductive source

impedances, consult the factory for further application

guidelines.

Safety Considerations

For safety-agency approval of the system in which the

power module is used, the power module must be

installed in compliance with the spacing and separation

requirements of the end-use safety agency standard,

i.e., UL 60950, CSA C22.2 No. 60950-00, VDE 0805

(IEC60950).

If the input source is non-SELV (ELV or a hazardous

voltage greater than 60 Vdc and less than or equal to

75 Vdc), for the module’s output to be considered

meeting the requirements of safety extra-low voltage

(SELV), all of the following must be true:

nThe input source is to be provided with reinforced

insulation from any other hazardous voltages, includ-

ing the ac mains.

nOne VI pin and one VO pin are to be grounded or

both the input and output pins are to be kept floating.

nThe input pins of the module are not operator acces-

sible.

nAnother SELV reliability test is conducted on the

whole system, as required by the safety agencies, on

the combination of supply source and the subject

module to verify that under a single fault, hazardous

voltages do not appear at the module’s output.

Note: Do not ground either of the input pins of the

module without grounding one of the output pins.

This may allow a non-SELV voltage to appear

between the output pins and ground.

The power module has extra-low voltage (ELV) outputs

when all inputs are ELV.

For input voltages exceeding 60 Vdc but less than or

equal to 75 Vdc, these converters have been evaluated

to the applicable requirements of BASIC INSULATION

between secondary DC MAINS DISTRIBUTION input

(classified as TNV-2 in Europe) and unearthed SELV

outputs.

The input to these units is to be provided with a maxi-

mum 6 A normal-blow fuse in the ungrounded lead.

Feature Descriptions

Overcurrent Protection

To provide protection in a fault (output overload) condi-

tion, the unit is equipped with internal current-limiting

circuitry and can endure current limiting continuously.

At the point of current-limit inception, the unit shifts

from voltage control to current control. The form of cur-

rent-limit used is hiccup mode. The unit operates nor-

mally once the output current is brought back into its

specified range. Average output current during hiccup

mode is 30% of IO, max.

Remote On/Off

Two remote on/off options are available. Positive logic

remote on/off turns the module on during a logic-high

voltage on the ON/OFF pin, and off during a logic low.

Negative logic remote on/off turns the module off dur-

ing a logic high and on during a logic low. Negative

logic, device code suffix “1,” is the factory-preferred

configuration.

To turn the power module on and off, the user must

supply a switch to control the voltage between the

on/off terminal and the VI(–) terminal (Von/off). The

switch can be an open collector or equivalent

(see Figure 22). A logic low is Von/off = 0 V to 1.2 V. The

maximum Ion/off during a logic low is 1 mA. The switch

should maintain a logic-low voltage while sinking 1 mA.

During a logic high, the maximum Von/off generated by

the power module is 6.1 V. The maximum allowable

leakage current of the switch at Von/off = 6.1 V is 50 µA.

If not using the remote on/off feature, do one of the

following:

nFor negative logic, short ON/OFF pin to VI(–).

nFor positive logic, leave ON/OFF pin open.

1414 Lineage Power

Data Sheet

April 200836 to 75 Vdc Input, 5.0 and 3.3 Vdc or 3.3 and 2.5 Vdc Dual Output; 50 W

HW050AF and HW050FG Power Modules: dc-dc Converters:

Feature Descriptions (continued)

Remote On/Off (continued)

8-2800 (F)

Figure 22. Remote On/Off Implementation

Output Voltage Set-Point Adjustment

(Trim)

Output voltage set point adjustment (trim) allows the

output voltage set point to be increased or decreased.

There are two trim pins, one for each output. The

adjustment (trim) is accomplished by connecting an

external resistor between the TRIM pin and either the

Vo(+) pin or COM pin of the output to be adjusted. In

order to maintain the output voltage set-point percent-

age accuracy, the trim resistor tolerance should be

± 0.1%.The trim resistor should be positioned close to

the module.

If not using the trim feature, leave the TRIM pin(s)

open.

Connecting an external resistor (Rtrim-down) between the

TRIM pin of the desired output and COM pin decreases

the output voltage set point (see Figure 23). The follow-

ing equations determine the required external-resistor

value to obtain a percentage output voltage change of

Δ%.

The test results for these configurations are displayed

in Figure 24.

8-2798 (F)

Figure 23. Circuit Configuration to Decrease

Output Voltage

8-2680 (F)

Figure 24. Resistor Selection for Decreased

Output Voltage for VO1

8-2681 (F)

Figure 25. Resistor Selection for Decreased

Output Voltage for VO2

VI(+)

ON/OFF

VI(–)

VO1(+)

VO2(+)

LOAD

–

ION/OFF

VON/OFF

COM

VO1 Radj-down 511()

Δ%

-------------- 6 . 1 1–

⎝⎠

⎛⎞

kΩ=

VO2Radj-down 100()

Δ%

-------------- 1 . 3 3–

⎝⎠

⎛⎞

kΩ=

VI(+)

ON/OFF

VI(+) COM

TRIM

VO(+)

RADJ-DOWN

RLOAD

100

510 25

% CHANGE IN OUTPUT VOLTAGE (Δ%)

15 20

ADJUSTMENT RESISTOR VALUE (kΩ)

510 25

% CHANGE IN OUTPUT VOLTAGE (Δ%)

15 20

ADJUSTMENT RESISTOR VALUE (kΩ)

Lineage Power 15

Data Sheet

April 2008 36 to 75 Vdc Input, 5.0 and 3.3 Vdc or 3.3 and 2.5 Vdc Dual Output; 50 W

HW050AF and HW050FG Power Modules: dc-dc Converters:

Feature Descriptions (continued)

Output Voltage Set-Point Adjustment

(Trim) (continued)

8-2797 (F)

Figure 26. Circuit Configuration to Increase

Output Voltage

8-3093 (F)

Figure 27.Resistor Selection for Increased Output

Voltage for VO1

8-3094 (F)

Figure 28. Resistor Selection for Increased Output

Voltage for VO2

Connecting an external resistor (Rtrim-up) between the

TRIM pin and Vo(+) pin of the desired output increases

the output voltage set point (see Figure 26).

The following equation determines the required exter-

nal-resistor value to obtain a percentage output voltage

change of Δ%.

The test results for these configurations are displayed

in Figure 27.

Note: The following voltage range restrictions apply:

HW050AF:

For Vo1 set to 5.0 V

Vo2 range is 1.5 V to 3.46 V

HW050FG:

For Vo1 set to 3.3 V

Vo2 range is 1.5 V to 2.5 V

For Vo1 set to 2.5 V

Vo2 range is 1.5 V to 1.8 V

Note: The voltage between the VO(+) and COM termi-

nals must not exceed the minimum output over-

voltage shutdown voltage as indicated in the

Feature Specifications table.

VI(+)

ON/OFF

CASE

VI(+)

VO(+)

TRIM

COM

RADJ-UP

RLOAD

100

300

500

700

900

1100

1300

1500

1700

1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0

% CHANGE IN OUTPUT VOLTAGE (Δ%)

ADJUSTMENT RESISTOR VALUE (kΩ)

100

120

140

160

180

1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0

% CHANGE IN OUTPUT VOLTAGE (Δ%)

ADJUSTMENT RESISTOR VALUE (kΩ)

VO1 Rtrim-up 5.11VO100 Δ%+()

1.225Δ%

-------------------------------------------------- 511

Δ%

----------

–6.11–

⎝⎠

⎛⎞

VO2 Rtrim-up VO100 Δ%+()

1.225Δ%

-------------------------------------- 100

Δ%

----------

–1.33–

⎝⎠

⎛⎞

kΩ=

1616 Lineage Power

Data Sheet

April 200836 to 75 Vdc Input, 5.0 and 3.3 Vdc or 3.3 and 2.5 Vdc Dual Output; 50 W

HW050AF and HW050FG Power Modules: dc-dc Converters:

Feature Descriptions (continued)

Output Voltage Set-Point Adjustment

(Trim) (continued)

Consult the factory if you need to increase the output

voltage more than the above limitation.

The amount of power delivered by the module is

defined as the voltage at the output terminals multiplied

by the output current. When using trim, the output volt-

age of the module can be increased, which at the same

output current would increase the power output of the

module. Care should be taken to ensure that the maxi-

mum output power of the module remains at or below

the maximum rated power.

Output Overvoltage Protection

The output overvoltage protection consists of circuitry

that monitors the voltage on the output terminals. If the

voltage on the output terminals exceeds the overvolt-

age protection threshold, then the module will shut

down and latch off. The overvoltage latch is reset by

either cycling the input power for one second or by

toggling the ON/OFF pin for one second.

Overtemperature Protection

To provide protection in a fault condition, the unit is

equipped with a thermal shutdown circuit. The shut-

down circuit will not engage unless the unit is operated

above the maximum device temperature. Recovery for

the thermal shutdown is accomplished by cycling the

dc input power off for at least one second or toggling

the primary referenced on/off signal for at least one

second.

Thermal Considerations

The power modules operate in a variety of thermal

environments; however, sufficient cooling should be

provided to help ensure reliable operation of the unit.

Heat is removed by convection and radiation to the sur-

rounding environment.

The thermal data presented is based on measure-

ments taken in a wind tunnel. The test setup shown in

Figure 29 was used to collect data for Figure 32

through Figure 35. Note that the orientation of the mod-

ule with respect to airflow affects thermal performance.

Two orientations are shown in Figure 30 and Figure 31.

8-2603 (F)

Note: Dimensions are in millimeters and (inches).

Figure 29. Thermal Test Setup

AIRFLOW

4 (1.0) 76.2 (3.0)

AIR VELOCIT

AND AMBIEN

TEMPERATU

MEASURE H

.2 (8.0)

Lineage Power 17

Data Sheet

April 2008 36 to 75 Vdc Input, 5.0 and 3.3 Vdc or 3.3 and 2.5 Vdc Dual Output; 50 W

HW050AF and HW050FG Power Modules: dc-dc Converters:

Thermal Considerations (continued)

8-2604 (F)

Figure 30. Best Orientation (Top View)

8-2605 (F)

Figure 31. Worst Orientation (Top View)

Proper cooling can be verified by measuring the power modules temperature at the top center of the case of the

body of Q18 as shown in Figure 31.

The temperature at this location should not exceed 100 °C at full power. The output power of the module should

not exceed the rated power.

AIRFLOW

Q18

THERMOCOUPLE

LOCATION Q18

1818 Lineage Power

Data Sheet

April 200836 to 75 Vdc Input, 5.0 and 3.3 Vdc or 3.3 and 2.5 Vdc Dual Output; 50 W

HW050AF and HW050FG Power Modules: dc-dc Converters:

Thermal Considerations (continued)

Convection Requirements for Cooling

To predict the approximate cooling needed for the

module, determine the power dissipated as heat by the

unit for the particular application. Figure 32 and

Figure 33 show typical heat dissipation for the module

over a range of output currents. IO1 = IO2 = ½ IO for Fig-

ure 32 and Figure 33.

8-2601 (F)

Figure 32. HW050AF1 Power Dissipation vs.

Output Current, TA = 25 °C

8-2600 (F)

Figure 33. HW050FG1 Power Dissipation vs.

Output Current, TA = 25 °C

With the known heat dissipation, module orientation

with respect to airflow, and a given local ambient tem-

perature, the minimum airflow can be chosen from the

derating curves in Figure 34 through Figure 35.

8-2708 (F)

Figure 34. Power Derating vs. Local Ambient Tem-

perature and Air Velocity; Best Orienta-

tion

8-2741 (F)

Figure 35. Power Derating vs. Local Ambient Tem-

perature and Air Velocity; Worst Orienta-

tion

For example, if the HW050FG1 dissipates 7.5 W of

heat at 14 A load and 48 V input voltage, the minimum

airflow for best module orientation in a 65 °C environ-

ment is 1 m/s (200 ft./min.).

Keep in mind that these derating curves are approxi-

mations of the ambient temperatures and airflows

required to keep the power module temperature below

its maximum rating. Once the module is assembled in

the actual system, the module’s temperature should be

checked to ensure it does not exceed 100 °C.

24681012

TOTAL OUTPUT CURRENT, Io (A)

POWER DISSIPATION, PD (W)

VI = 75 V

VI = 36 V

VI = 48 V

246810121416

TOTAL OUTPUT CURRENT, Io (A)

POWER DISSIPATION, PD (W)

VI = 75 V

VI = 36 V

VI = 48 V

0 102030405060708090100

LOCAL AMBIENT TEMPERATURE, TA (°C)

DISSIPATED POWER, PD (W)

3.0 m/s (600ft./min.)

2.0 m/s (400ft./min.)

1.5 m/s (300ft./min.)

1.0 m/s (200ft./min.)

0.5 m/s (100ft./min.)

0.1 m/s (NAT. CONV.)

(20ft./min.)

0 102030405060708090100

LOCAL AMBIENT TEMPERATURE, TA (°C)

DISSIPATED POWER, PD (W)

3.0 m/s (600ft./min.)

2.0 m/s (400ft./min.)

1.5 m/s (300ft./min.)

1.0 m/s (200ft./min.)

0.5 m/s (100ft./min.)

0.1 m/s (NAT. CONV.)

(20ft./min.)

Lineage Power 19

Data Sheet

April 2008 36 to 75 Vdc Input, 5.0 and 3.3 Vdc or 3.3 and 2.5 Vdc Dual Output; 50 W

HW050AF and HW050FG Power Modules: dc-dc Converters:

EMC Considerations

Figure 36 shows the suggested configuration to meet conducted limits of EN55022 Class B.

8-2684 (F)

Figure 36. Suggested Configuration for EN55022

For assistance with designing for EMC compliance, please refer to the FLTR100V10 data sheet

(DS99-294EPS).

Layout Considerations

Copper paths must not be routed beneath the power module mounting inserts. For additional layout guidelines,

refer to FLTR100V10 data sheet

(DS99-294EPS).

V(+)

V(–)

HW050

COM

33 μF

100 V

0.47 μF

100 V

3.3 mH COMMON-

MODE CHOKE

(GROUNDED)

100 nF CERAMIC

2020 Lineage Power

Data Sheet

April 200836 to 75 Vdc Input, 5.0 and 3.3 Vdc or 3.3 and 2.5 Vdc Dual Output; 50 W

HW050AF and HW050FG Power Modules: dc-dc Converters:

Outline Diagram

Dimensions are in millimeters and (inches).

Tolerances: x.x mm ± 0.5 mm (x.xx in. ± 0.02 in.)

x.xx mm ± 0.25 mm (x.xxx in. ± 0.010 in.)

Top View

Side View

Bottom View

8-2799 (F)

99.1

ON/OFF

VIN(+)

VIN(–)

25.14 (0.99)

59.5

(3.90)

(2.34)

24.38 (0.96)

VO1TRIM

VO2TRIM

VO1

COM

VO2

PITCH = 5.08 (0.200)

NONACCUMULATIVE

VIEW ON TOP SIDE OF PWB

35.56 (1.400)

PITCH = 5.08 (0.200)

NONACCUMULATIVE

10.16 (0.400)

10.16

(0.400)

8.5

MAX MATING PWB

SURFACE

PIN TERMINATION IN 11 PLACES

SOLDER-PLATED BRASS

1.05 (0.041)

0.99 (0.039)

6.1

(0.24)

(0.335)

NOM

94.36 (3.715)

93.60 (3.685)

3.2 TYP

(0.13)

CONDUCTIVE SPACER

IN 4 PLACES

2.92 (0.115)

2.16 (0.085)

90.2 (3.55)

IN 2 PLACES

VIEW ON UNDER SIDE OF PWB

55.4 (2.181)

IN 2 PLACES

3.2 TYP

(0.13)

4.3 (0.17)

2 PLACES

4.0 (0.16)

2 PLACES

Lineage Power 21

Data Sheet

April 2008 36 to 75 Vdc Input, 5.0 and 3.3 Vdc or 3.3 and 2.5 Vdc Dual Output; 50 W

HW050AF and HW050FG Power Modules: dc-dc Converters:

Recommended Hole Pattern

Component-side footprint.

Dimensions are in millimeters and (inches).

8-2607 (F)

Table 3. Pin Function

59.5

(2.34)

24.77

(0.975)

10.16

(0.4)

5.08

(0.2)

4.0

(0.157)

93.98

(3.70)

99.1

(3.90)

2.54

(0.1)

4.30

(0.17)

85.87

(3.38)

3.2 (0.100)

SQUARE STANDOFF,

4 PLACES

20.32

(0.8)

15.24

(0.6)

51.40

(2.02)

3 PITCHES

OF 5.08

NONACCUMULATIVE

4 PITCHES

OF 5.08

NONACCUMULATIVE

Pin Function

I(+)

I(–)

3ON/OFF

O1TRIM

O2TRIM

7VO1

8COM

9COM

10 VO2

11 VO2

22 Lineage Power

Data Sheet

April 200836 to 75 Vdc Input, 5.0 and 3.3 Vdc or 3.3 and 2.5 Vdc Dual Output; 50 W

HW050AF and HW050FG Power Modules: dc-dc Converters:

Ordering Information

Please contact your Lineage Power Account Manager or Field Application Engineer for pricing and

availability.

Optional features may be chosen from the device code suffixes shown below. The feature suffixes are listed

numerically in descending order. Please contact your Lineage Power Account Manager or Application Engineer

for pricing and availability of options.

Input

Voltage

Output

Voltage

Output

Power

Device

Code Comcode

48 V 5.0 V and 3.3 V 53.2 W HW050AF 108365610

48 V 5.0 V and 3.3 V 53.2 W HW050AF1 TBD

48 V 5.0 V and 3.3 V 53.2 W HW050AF6 108958240

48 V 3.3 V and 2.5 V 49.6 W HW050FG 108341710

48 V 3.3 V and 2.5 V 49.6 W HW050FG1 TBD

48 V 3.3 V and 2.5 V 49.6 W HW050FG6 108891680

48 V 3.3 V and 2.5 V 49.6 W HW050FG8 108934233

48 V 3.3 V and 2.5 V 49.6 W HW050FG-B 108840190

Option Device Code Suffix

Short pins: 2.79 mm +0.5/-0.25 mm

(0.110 in. + 0.020/-0.010 in.)

Short pins: 3.81 mm +0.5/-0.25 mm

(0.110 in. + 0.020/-0.010 in.)

Negative remote on/off logic 1

Lineage Power 23

Data Sheet

April 2008 36 to 75 Vdc Input, 5.0 and 3.3 Vdc or 3.3 and 2.5 Vdc Dual Output; 50 W

HW050AF and HW050FG Power Modules: dc-dc Converters:

Notes

Data Sheet

April 2008

36 to 75 Vdc Input, 5.0 and 3.3 Vdc or 3.3 and 2.5 Vdc Dual Output; 50 W

HW050AF and HW050FG Power Modules: dc-dc Converters:

April 2008

FDS01-029EPS (Replaces FDS01-028EPS)

World Wide Headquarters

Lin eage Po wer Co rporation

30 00 Skyline Drive, Mesquite, TX 75149, USA

+1-800-526-7819

(Outside U.S.A.: +1- 97 2-2 84 -2626)

www.line agepower.com

e-m ail: techsupport1@linea gepower.com

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Tel: +65 6 41 6 4283

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Lineage Power reserves the right to make changes to the product(s) or information contained herein without notice. No liability is assumed as a result of their use or

application. No rights under any patent accompany the sale of any such product(s) or information.