DS2106SY/DS2106SV Rectifier Diode DS4182-6.1 June 2005 (LN23990) FEATURES * Double Side Cooling * High Surge Capability KEY PARAMETERS APPLICATIONS * Rectification * Free-wheel Diode * DC Motor Control * Power Supplies * Welding * Battery Chargers VRRM IF(AV) IFSM 4000V 3830A 62500A VOLTAGE RATINGS Part and Ordering Number Repetitive Peak Voltages VDRM and VDRM V DS2106SY40 DS2106SY39 DS2106SY38 DS2106SY37 DS2106SY36 DS2106SY35 4000 3900 3800 3700 3600 3500 Conditions VRSM = VRRM+100V Lower voltage grades available. (See Package Details for further information) ORDERING INFORMATION Fig. 1 Package outlines When ordering, select the required part number shown in the Voltage Ratings selection table. For example: DS2106SY37 for a 3700V device in a Y outline or DS2106SV37 for a 3700V device in a V outline Note: Please use the complete part number when ordering and quote this number in any future correspondence relating to your order. 1/8 www.dynexsemi.com DS2106SY/DS2106SV SEMICONDUCTOR CURRENT RATINGS Tcase = 75 C unless stated otherwise Parameter Symbol Test Conditions Max. Units 3830 A Double Side Cooled IF(AV) Mean forward current IF(RMS) RMS value - 6016 A Continuous (direct) on-state current - 5597 A 2525 A IF Half wave resistive load Double Side Cooled (Anode side) IF(AV) Mean forward current IF(RMS) RMS value - 3966 A Continuous (direct) on-state current - 3421 A Test Conditions Max. Units 2850 A IF Half wave resistive load Tcase = 100 C unless stated otherwise Parameter Symbol Double Side Cooled IF(AV) Mean forward current IF(RMS) RMS value - 4475 A Continuous (direct) on-state current - 4190 A 1920 A IF Half wave resistive load Double Side Cooled (Anode side) IF(AV) Mean forward current IF(RMS) RMS value - 3014 A Continuous (direct) on-state current - 2500 A IF Half wave resistive load 2/8 www.dynexsemi.com DS2106SY/DS2106SV SEMICONDUCTOR SURGE RATINGS Symbol IFSM 2 It IFSM 2 It Parameter Surge (non-repetitive) on-state current 2 I t for fusing Surge (non-repetitive) on-state current Test Conditions Max. Units 10ms half sine, Tcase = 150 C 50.0 kA VR = 50% VRRM - 1/4 sine 12.5 MA s 10ms half sine, Tcase = 150 C 62.5 kA VR = 0 19.6 MA s Min. Max. Units 2 I t for fusing 2 2 THERMAL AND MECHANICAL RATINGS Symbol Rth(j-c) Rth(c-h) Tvj Parameter Thermal resistance - junction to case Thermal resistance - case to heatsink Virtual junction temperature Test Conditions Double side cooled DC - 0.0095 C/W Single side cooled Anode DC - 0.019 C/W Cathode DC - 0.019 C/W Clamping force 43kN Double side - 0.002 C/W (with mounting compound) Single side - 0.004 C/W On-state (conducting) - 160 C Reverse (blocking) - 150 C Tstg Storage temperature range -55 150 C Fm Clamping force 38.0 47.0 kN 3/8 www.dynexsemi.com DS2106SY/DS2106SV SEMICONDUCTOR CHARACTERISTICS Symbol Parameter Test Conditions Min. Max. Units VFM Forward voltage At 3000A peak, Tcase = 25 C - 1.15 V IRM Peak reverse current At VDRM, Tcase = 150 C - 250 mA QS Total stored charge IF = 2000A, dIRR/dt =3A/s - 5000 C Irr Peak reverse recovery current Tcase = 150 C, VR =100V - 150 A VTO Threshold voltage At Tvj = 150 C - 0.75 V rT Slope resistance At Tvj = 150 C - 0.118 m CURVES Mean Power Dissipation - (W) 10000 8000 6000 4000 dc 1/2 wave 3 phase sq. 6 phase sq. 2000 0 0 2000 4000 6000 8000 Mean forward current IF(AV)- (A) Fig.2 Maximum & minimum on-state characteristics VTM EQUATION VTM = A + Bln (IT) + C.IT+D.IT Fig.3 Dissipation curves Where A = - 0.15357 B = 0.177571 C = 0.000179 D = - 0.01294 these values are valid for Tj = 150 C for IF 500A to 5000A 4/8 www.dynexsemi.com DS2106SY/DS2106SV SEMICONDUCTOR Fig.4 Total stored charge Fig.5 Maximum reverse recovery current Fig.6 Surge (non-repetitive) forward current vs time (with 50% VRRM at Tcase 150 C) Fig.7 Maximum (limit) transient thermal impedancejunction to case 5/8 www.dynexsemi.com DS2106SY/DS2106SV SEMICONDUCTOR PACKAGE DETAILS For further package information, please contact Customer Services. All dimensions in mm, unless stated otherwise. DO NOT SCALE. Normal weight: 1600g Clamping force: 43kN10% Pakage outline type code:Y Note: Some packages may be supplied with gate and or tags. 6/8 www.dynexsemi.com DS2106SY/DS2106SV SEMICONDUCTOR PACKAGE DETAILS For further package information, please contact Customer Services. All dimensions in mm, unless stated otherwise. DO NOT SCALE. Normal weight: 1100g Clamping force: 43kN 10% Package outline type code: V Note: Some packages may be supplied with gate and or tags. 7/8 www.dynexsemi.com POWER ASSEMBLY CAPABILITY The Power Assembly group was set up to provide a support service for those customers requiring more than the basic semiconductor, and has developed a flexible range of heatsink and clamping systems in line with advances in device voltages and current capability of our semiconductors. We offer an extensive range of air and liquid cooled assemblies covering the full range of circuit designs in general use today. The Assembly group offers high quality engineering support dedicated to designing new units to satisfy the growing needs of our customers. Using the latest CAD methods our team of design and applications engineers aim to provide the Power Assembly Complete Solution (PACs). HEATSINKS The Power Assembly group has its own proprietary range of extruded aluminium heatsinks which have been designed to optimise the performance of Dynex semiconductors. Data with respect to air natural, forced air and liquid cooling (with flow rates) is available on request. For further information on device clamps, heatsinks and assemblies, please contact your nearest sales representative or Customer Services. Stresses above those listed in this data sheet may cause permanent damage to the device. In extreme conditions, as with all semiconductors, this may include potentially hazardous rupture of the package. Appropriate safety precautions should always be followed. http://www.dynexsemi.com e-mail: power_solutions@dynexsemi.com HEADQUARTERS OPERATIONS DYNEX SEMICONDUCTOR LTD Doddington Road, Lincoln. Lincolnshire. LN6 3LF. United Kingdom. Tel: +44-(0)1522-500500 Fax: +44-(0)1522-500550 CUSTOMER SERVICE Tel: +44 (0)1522 502753 / 502901. Fax: +44 (0)1522 500020 (c) Dynex Semiconductor 2003 TECHNICAL DOCUMENTATION - NOT FOR RESALE. PRODUCED IN UNITED KINGDOM This publication is issued to provide information only which (unless agreed by the Company in writing) may not be used, applied or reproduced for any purpose nor form part of any order or contract nor to be regarded as a representation relating to the products or services concerned. No warranty or guarantee express or implied is made regarding the capability, performance or suitability of any product or service. The Company reserves the right to alter without prior notice the specification, design or price of any product or service. Information concerning possible methods of use is provided as a guide only and does not constitute any guarantee that such methods of use will be satisfactory in a specific piece of equipment. It is the user's responsibility to fully determine the performance and suitability of any equipment using such information and to ensure that any publication or data used is up to date and has not been superseded. These products are not suitable for use in any medical products whose failure to perform may result in significant injury or death to the user. All products and materials are sold and services provided subject to the Company's conditions of sale, which are available on request. All brand names and product names used in this publication are trademarks, registered trademarks or trade names of their respective owners. www.dynexsemi.com