STB75NF75 STP75NF75 - STP75NF75FP N-channel 75V - 0.0095 - 80A - TO-220 - TO-220FP - D2PAK STripFETTM II Power MOSFET General features Type VDSS RDS(on) ID STB75NF75 75V <0.011 80A(1) STP75NF75 75V <0.011 80A(1) STP75NF75FP 75V <0.011 80A(1) 3 3 1 2 1 TO-220 2 TO-220FP 1. Current limited by package Exceptional dv/dt capability 100% avalanche tested 3 1 DPAK Description This Power MOSFET series realized with STMicroelectronics unique STripFETTM process has specifically been designed to minimize input capacitance and gate charge. It is therefore suitable as primary switch in advanced highefficiency, high-frequency isolated DC-DC converters for Telecom and Computer applications. It is also intended for any applications with low gate drive requirements. Internal schematic diagram Applications Switching application Order codes Part number Marking Package Packaging STB75NF75T4 B75NF75 DPAK Tape & reel STP75NF75 P75NF75 TO-220 Tube STP75NF75FP P75NF75 TO-220FP Tube February 2007 Rev 8 1/16 www.st.com 16 Contents STB75NF75 - STP75NF75 - STP75NF75FP Contents 1 Electrical ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3 2 Electrical characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4 2.1 Electrical characteristics (curves) ............................ 6 3 Test circuit 4 Package mechanical data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10 5 Packaging mechanical data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14 6 Revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15 2/16 ................................................ 9 STB75NF75 - STP75NF75 - STP75NF75FP 1 Electrical ratings Electrical ratings Table 1. Absolute maximum ratings Value Symbol VDS VDGR VGS Parameter D2PAK /TO-220 Unit TO-220FP Drain-source voltage (VGS = 0) 75 V Drain-gate voltage (RGS = 20K) 75 V 20 V Gate-source voltage (1) Drain current (continuous) at TC = 25C 80 80 A ID(1) Drain current (continuous) at TC=100C 70 70 A IDM(2) Drain current (pulsed) 320 320 A PTOT Total dissipation at TC = 25C 300 45 W Derating factor 2.0 0.3 W/C ID (3) dv/dt EAS (4) VISO TJ Tstg Peak diode recovery voltage slope 12 V/ns Single pulse avalanche energy 700 mJ Insulation withstand voltage (RMS) from all three leads to external heat sink (t=1s;TC=25C) Operating junction temperature Storage temperature -- 2000 -55 to 175 V C 1. Current limited by package 2. Pulse width limited by safe operating area 3. ISD 80A, di/dt 300A/s, VDD V(BR)DSS, Tj TJMAX 4. Starting TJ = 25 oC, ID = 40A, VDD = 37.5V Table 2. Thermal data Value Symbol Parameter Unit D2PAK /TO-220 TO-220FP 0.5 3.33 RthJC Thermal resistance junction-case max RthJA Thermal resistance junction-ambient max 62.5 C/W Tl Maximum lead temperature for soldering purpose(1) 300 C C/W 1. 1.6mm from case for 10sec) 3/16 Electrical characteristics 2 STB75NF75 - STP75NF75 - STP75NF75FP Electrical characteristics (TCASE=25C unless otherwise specified) Table 3. Symbol V(BR)DSS On/off states Parameter Drain-source breakdown voltage Test conditions ID = 250A, VGS= 0 Zero gate voltage drain current (VGS = 0) IGSS Gate body leakage current (VDS = 0) VGS = 20V VGS(th) Gate threshold voltage VDS= VGS, ID = 250A RDS(on) Static drain-source on resistance VGS= 10V, ID= 40A Symbol gfs (1) Ciss Coss Crss Qg Qgs Qgd Max. 75 2 Unit V VDS = Max rating @125C 3 1 10 A A 100 nA 4 V 0.0095 0.011 Dynamic Parameter Test conditions Min. Typ. Max. Unit Forward transconductance VDS = 15V, ID = 40A 20 S Input capacitance Output capacitance Reverse transfer capacitance VDS =25V, f = 1 MHz, VGS = 0 3700 730 240 pF pF pF Total gate charge Gate-source charge Gate-drain charge VDD = 60V, ID = 80A VGS =10V 1. Pulsed: pulse duration=300s, duty cycle 1.5% 4/16 Typ. VDS = Max rating, IDSS Table 4. Min. 117 27 47 160 nC nC nC STB75NF75 - STP75NF75 - STP75NF75FP Table 5. Symbol td(on) tr td(off) tf Table 6. Symbol Electrical characteristics Switching times Parameter Turn-on delay time Rise time Turn-off delay time Fall time Test conditions Min. Typ. Max. 25 100 66 30 VDD= 37.5V, ID= 45A, RG=4.7, VGS=10V Figure 15 on page 9 Unit ns ns ns ns Source drain diode Max Unit Source-drain current 80 A ISDM(1) Source-drain current (pulsed) 320 A VSD(2) Forward on voltage 1.5 V ISD trr Qrr IRRM Parameter Reverse recovery time Reverse recovery charge Reverse recovery current Test conditions Min Typ. ISD = 80A, VGS = 0 ISD = 80A, di/dt = 100A/s, VDD = 25V, TJ = 150C Figure 17 on page 9 132 660 10 ns nC A 1. Pulse width limited by safe operating area 2. Pulsed: pulse duration=300s, duty cycle 1.5% 5/16 Electrical characteristics STB75NF75 - STP75NF75 - STP75NF75FP 2.1 Electrical characteristics (curves) Figure 1. Safe operating area for TO-220 DPAK Figure 2. Thermal impedancefor TO-220 DPAK Figure 3. Safe operating area for TO-220FP Figure 4. Thermal impedance for TO-220FP Figure 5. Output characterisics Figure 6. Transfer characteristics 6/16 STB75NF75 - STP75NF75 - STP75NF75FP Electrical characteristics Figure 7. Transconductance Figure 9. Gate charge vs gate-source voltage Figure 10. Capacitance variations Figure 11. Normalized gate threshold voltage vs temperature Figure 8. Static drain-source on resistance Figure 12. Normalized on resistance vs temperature 7/16 Electrical characteristics Figure 13. Source-drain diode forward characteristics 8/16 STB75NF75 - STP75NF75 - STP75NF75FP Figure 14. Normalized BVDSS vs temperature STB75NF75 - STP75NF75 - STP75NF75FP 3 Test circuit Test circuit Figure 15. Switching times test circuit for resistive load Figure 16. Gate charge test circuit Figure 17. Test circuit for inductive load Figure 18. Unclamped inductive load test switching and diode recovery times circuit Figure 19. Unclamped inductive waveform 9/16 Package mechanical data 4 STB75NF75 - STP75NF75 - STP75NF75FP Package mechanical data In order to meet environmental requirements, ST offers these devices in ECOPACK(R) packages. These packages have a Lead-free second level interconnect . The category of second level interconnect is marked on the package and on the inner box label, in compliance with JEDEC Standard JESD97. The maximum ratings related to soldering conditions are also marked on the inner box label. ECOPACK is an ST trademark. ECOPACK specifications are available at: www.st.com 10/16 STB75NF75 - STP75NF75 - STP75NF75FP Package mechanical data TO-220 MECHANICAL DATA DIM. mm. MIN. TYP inch MAX. MIN. TYP. MAX. A 4.40 4.60 0.173 0.181 b 0.61 0.88 0.024 0.034 b1 1.15 1.70 0.045 0.066 c 0.49 0.70 0.019 0.027 D 15.25 15.75 0.60 0.620 E 10 10.40 0.393 0.409 e 2.40 2.70 0.094 0.106 e1 4.95 5.15 0.194 0.202 F 1.23 1.32 0.048 0.052 H1 6.20 6.60 0.244 0.256 J1 2.40 2.72 0.094 0.107 0.551 L 13 14 0.511 L1 3.50 3.93 0.137 L20 16.40 L30 0.154 0.645 28.90 1.137 oP 3.75 3.85 0.147 0.151 Q 2.65 2.95 0.104 0.116 11/16 Package mechanical data STB75NF75 - STP75NF75 - STP75NF75FP D2PAK MECHANICAL DATA TO-247 MECHANICAL DATA mm. inch DIM. MIN. TYP MAX. MIN. TYP. MAX. A 4.4 4.6 0.173 0.181 A1 2.49 2.69 0.098 0.106 A2 0.03 0.23 0.001 0.009 B 0.7 0.93 0.027 0.036 B2 1.14 1.7 0.044 0.067 C 0.45 0.6 0.017 0.023 C2 1.23 1.36 0.048 0.053 D 8.95 9.35 0.352 0.368 10.4 0.393 D1 E 8 10 E1 0.315 8.5 0.334 G 4.88 5.28 0.192 0.208 L 15 15.85 0.590 0.625 L2 1.27 1.4 0.050 0.055 L3 1.4 1.75 0.055 0.068 M 2.4 3.2 0.094 0.126 R 0 0.015 4 3 V2 0.4 1 12/16 STB75NF75 - STP75NF75 - STP75NF75FP Package mechanical data TO-220FP MECHANICAL DATA mm. DIM. MIN. A 4.4 inch TYP MAX. MIN. TYP. 4.6 0.173 0.181 MAX. 0.106 B 2.5 2.7 0.098 D 2.5 2.75 0.098 0.108 E 0.45 0.7 0.017 0.027 F 0.75 1 0.030 0.039 F1 1.15 1.7 0.045 0.067 F2 1.15 1.7 0.045 0.067 G 4.95 5.2 0.195 0.204 G1 2.4 2.7 0.094 0.106 H 10 10.4 0.393 0.409 1.126 1.204 0.417 L2 16 0.630 L3 28.6 30.6 L4 9.8 10.6 .0385 L5 2.9 3.6 0.114 0.141 L6 15.9 16.4 0.626 0.645 9 9.3 0.354 0.366 O 3 3.2 0.118 0.126 B D A E L7 L3 L6 F2 H G G1 F F1 L7 L2 L5 1 2 3 L4 13/16 Packaging mechanical data 5 STB75NF75 - STP75NF75 - STP75NF75FP Packaging mechanical data D2PAK FOOTPRINT TAPE AND REEL SHIPMENT REEL MECHANICAL DATA DIM. mm MIN. A B DIM. mm MIN. MAX. MIN. A0 10.5 10.7 0.413 0.421 B0 15.7 15.9 0.618 0.626 D 1.5 1.6 0.059 0.063 D1 1.59 1.61 0.062 0.063 E 1.65 1.85 0.065 0.073 F 11.4 11.6 0.449 0.456 K0 4.8 5.0 0.189 0.197 MAX. 0.153 0.161 P0 3.9 4.1 P1 11.9 12.1 0.468 0.476 P2 1.9 2.1 0.075 0.082 R 50 T 0.25 0.35 0.0098 0.0137 W 23.7 24.3 * on sales type 14/16 inch 1.574 0.933 0.956 MAX. MIN. 330 1.5 C 12.8 D 20.2 G 24.4 N 100 T TAPE MECHANICAL DATA inch MAX. 12.992 0.059 13.2 0.504 0.520 26.4 0.960 1.039 0795 3.937 30.4 1.197 BASE QTY BULK QTY 1000 1000 STB75NF75 - STP75NF75 - STP75NF75FP 6 Revision history Revision history Table 7. Revision history Date Revision Changes 03-Aug-2006 6 Complete version 15-Sep-2006 7 RDS(on) value update 27-Feb-2007 8 The document has been reformatted 15/16 STB75NF75 - STP75NF75 - STP75NF75FP Please Read Carefully: Information in this document is provided solely in connection with ST products. STMicroelectronics NV and its subsidiaries ("ST") reserve the right to make changes, corrections, modifications or improvements, to this document, and the products and services described herein at any time, without notice. All ST products are sold pursuant to ST's terms and conditions of sale. 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