February 2007 Rev 8 1/16
16
Order codes
Part number Marking Package Packaging
STB75NF75T4 B75NF75 D²PAK Tape & reel
STP75NF75 P75NF75 TO-220 Tube
STP75NF75FP P75NF75 TO-220FP Tube
STB75NF75
STP75NF75 - STP75NF75FP
N-channel 75V - 0.0095Ω - 80A - TO-220 - TO-220FP - D2PA K
STripFET™ II Power MOSFET
General features
■Exceptional dv/dt capability
■100% avalanche tested
Description
This Power MOSFET series realized with
STMicroelectronics unique STripFET™ process
has specifically been designed to minimize input
capacitance and gate charge. It is therefore
suitable as primary switch in advanced high-
efficiency, high-frequency isolated DC-DC
converters for Telecom and Computer
applications. It is also intended for any
applications with low gate drive requirements.
Applications
■Switching application
Internal schematic diagram
Type VDSS RDS(on) ID
STB75NF75 75V <0.011Ω80A(1)
STP75NF75 75V <0.011Ω80A(1)
STP75NF75FP 75V <0.011Ω80A(1)
1. Current limited by package
123
TO-220 TO-220FP
D²PAK
1
3
12
3
www.st.com
Contents STB75NF75 - STP75NF75 - STP75NF75FP
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Contents
1 Electrical ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3
2 Electrical characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4
2.1 Electrical characteristics (curves) . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
3 Test circuit . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
4 Package mechanical data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
5 Packaging mechanical data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14
6 Revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15
STB75NF75 - STP75NF75 - STP75NF75FP Electrical ratings
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1 Electrical ratings
Table 1. Absolute maximum ratings
Symbol Parameter
Value
Unit
D2PAK /TO-220 TO-220FP
VDS Drain-source voltage (VGS = 0) 75 V
VDGR Drain-gate voltage (RGS = 20KΩ)75V
VGS Gate-source voltage ± 20 V
ID (1)
1. Current limited by package
Drain current (continuous) at TC = 25°C 80 80 A
ID(1) Drain current (continuous) at TC=100°C 70 70 A
IDM(2)
2. Pulse width limited by safe operating area
Drain current (pulsed) 320 320 A
PTOT Total dissipation at TC = 25°C 300 45 W
Derating factor 2.0 0.3 W/°C
dv/dt (3)
3. ISD ≤ 80A, di/dt ≤ 300A/µs, VDD ≤ V(BR)DSS, Tj ≤ TJMAX
Peak diode recovery voltage slope 12 V/ns
EAS (4)
4. Starting TJ = 25 oC, ID = 40A, VDD = 37.5V
Single pulse avalanche energy 700 mJ
VISO
Insulation withstand voltage (RMS) from all
three leads to external heat sink (t=1s;TC=25°C) -- 2000 V
TJ
Tstg
Operating junction temperature
Storage temperature -55 to 175 °C
Table 2. Thermal data
Symbol Parameter
Value
Unit
D2PAK /TO-220 TO-220FP
RthJC Thermal resistance junction-case max 0.5 3.33 °C/W
RthJA Thermal resistance junction-ambient max 62.5 °C/W
Tl
Maximum lead temperature for soldering
purpose(1)
1. 1.6mm from case for 10sec)
300 °C
Electrical characteristics STB75NF75 - STP75NF75 - STP75NF75FP
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2 Electrical characteristics
(TCASE=25°C unless otherwise specified)
Table 3. On/off states
Symbol Parameter Test conditions Min. Typ. Max. Unit
V(BR)DSS Drain-source breakdown
voltage ID = 250µA, VGS= 0 75 V
IDSS
Zero gate voltage drain
current (VGS = 0)
VDS = Max rating,
VDS = Max rating @125°C
1
10
µA
µA
IGSS
Gate body leakage current
(VDS = 0) VGS = ±20V ±100 nA
VGS(th) Gate threshold voltage VDS= VGS, ID = 250µA 23 4V
RDS(on) Static drain-source on
resistance VGS= 10V, ID= 40A 0.0095 0.011 Ω
Table 4. Dynamic
Symbol Parameter Test conditions Min. Typ. Max. Unit
gfs (1)
1. Pulsed: pulse duration=300µs, duty cycle 1.5%
Forward transconductance VDS = 15V, ID = 40A 20 S
Ciss
Coss
Crss
Input capacitance
Output capacitance
Reverse transfer
capacitance
VDS =25V, f = 1 MHz,
VGS = 0
3700
730
240
pF
pF
pF
Qg
Qgs
Qgd
Total gate charge
Gate-source charge
Gate-drain charge
VDD = 60V, ID = 80A
VGS =10V
117
27
47
160 nC
nC
nC
STB75NF75 - STP75NF75 - STP75NF75FP Electrical characteristics
5/16
Table 5. Switching times
Symbol Parameter Test conditions Min. Typ. Max. Unit
td(on)
tr
td(off)
tf
Turn-on delay time
Rise time
Turn-off delay time
Fall time
VDD= 37.5V, ID= 45A,
RG=4.7Ω, VGS=10V
Figure 15 on page 9
25
100
66
30
ns
ns
ns
ns
Table 6. Source drain diode
Symbol Parameter Test conditions Min Typ. Max Unit
ISD Source-drain current 80 A
ISDM(1)
1. Pulse width limited by safe operating area
Source-drain current (pulsed) 320 A
VSD(2)
2. Pulsed: pulse duration=300µs, duty cycle 1.5%
Forward on voltage ISD = 80A, VGS = 0 1.5 V
trr
Qrr
IRRM
Reverse recovery time
Reverse recovery charge
Reverse recovery current
ISD = 80A,
di/dt = 100A/µs,
VDD = 25V, TJ = 150°C
Figure 17 on page 9
132
660
10
ns
nC
A
Electrical characteristics STB75NF75 - STP75NF75 - STP75NF75FP
6/16
2.1 Electrical characteristics (curves)
Figure 1. Safe operating area for TO-220 -
D²PAK
Figure 2. Thermal impedancefor TO-220 -
D²PAK
Figure 3. Safe operating area for TO-220FP Figure 4. Thermal impedance for TO-220FP
Figure 5. Output characterisics Figure 6. Transfer characteristics
STB75NF75 - STP75NF75 - STP75NF75FP Electrical characteristics
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Figure 7. Transconductance Figure 8. Static drain-source on resistance
Figure 9. Gate charge vs gate-source voltage Figure 10. Capacitance variations
Figure 11. Normalized gate threshold voltage
vs temperature
Figure 12. Normalized on resistance vs
temperature
Electrical characteristics STB75NF75 - STP75NF75 - STP75NF75FP
8/16
Figure 13. Source-drain diode forward
characteristics
Figure 14. Normalized BVDSS vs temperature
STB75NF75 - STP75NF75 - STP75NF75FP Test circuit
9/16
3 Test circuit
Figure 15. Switching times test circuit for
resistive load
Figure 16. Gate charge test circuit
Figure 17. Test circuit for inductive load
switching and diode recovery times
Figure 18. Unclamped inductive load test
circuit
Figure 19. Unclamped inductive waveform
Package mechanical data STB75NF75 - STP75NF75 - STP75NF75FP
10/16
4 Package mechanical data
In order to meet environmental requirements, ST offers these devices in ECOPACK®
packages. These packages have a Lead-free second level interconnect . The category of
second level interconnect is marked on the package and on the inner box label, in
compliance with JEDEC Standard JESD97. The maximum ratings related to soldering
conditions are also marked on the inner box label. ECOPACK is an ST trademark.
ECOPACK specifications are available at: www.st.com
STB75NF75 - STP75NF75 - STP75NF75FP Package mechanical data
11/16
DIM.
mm. inch
MIN. TYP MAX. MIN. TYP. MAX.
A 4.40 4.60 0.173 0.181
b 0.61 0.88 0.024 0.034
b1 1.15 1.70 0.045 0.066
c 0.49 0.70 0.019 0.027
D 15.25 15.75 0.60 0.620
E 10 10.40 0.393 0.409
e 2.40 2.70 0.094 0.106
e1 4.95 5.15 0.194 0.202
F 1.23 1.32 0.048 0.052
H1 6.20 6.60 0.244 0.256
J1 2.40 2.72 0.094 0.107
L 13 14 0.511 0.551
L1 3.50 3.93 0.137 0.154
L20 16.40 0.645
L30 28.90 1.137
øP 3.75 3.85 0.147 0.151
Q 2.65 2.95 0.104 0.116
TO-220 MECHANICAL DATA
Package mechanical data STB75NF75 - STP75NF75 - STP75NF75FP
12/16
TO-247 MECHANICAL DATA
1
DIM.
mm. inch
MIN. TYP MAX. MIN. TYP. MAX.
A 4.4 4.6 0.173 0.181
A1 2.49 2.69 0.098 0.106
A2 0.03 0.23 0.001 0.009
B 0.7 0.93 0.027 0.036
B2 1.14 1.7 0.044 0.067
C 0.45 0.6 0.017 0.023
C2 1.23 1.36 0.048 0.053
D 8.95 9.35 0.352 0.368
D1 8 0.315
E 10 10.4 0.393
E1 8.5 0.334
G 4.88 5.28 0.192 0.208
L 15 15.85 0.590 0.625
L2 1.27 1.4 0.050 0.055
L3 1.4 1.75 0.055 0.068
M 2.4 3.2 0.094 0.126
R0.4 0.015
V2 0º 4º
D2PAK MECHANICAL DATA
3
STB75NF75 - STP75NF75 - STP75NF75FP Package mechanical data
13/16
L2
A
B
D
E
H
G
L6
F
L3
G1
123
F2
F1
L7
L4
L5
DIM.
mm. inch
MIN. TYP MAX. MIN. TYP. MAX.
A 4.4 4.6 0.173 0.181
B 2.5 2.7 0.098 0.106
D 2.5 2.75 0.098 0.108
E 0.45 0.7 0.017 0.027
F 0.75 1 0.030 0.039
F1 1.15 1.7 0.045 0.067
F2 1.15 1.7 0.045 0.067
G 4.95 5.2 0.195 0.204
G1 2.4 2.7 0.094 0.106
H 10 10.4 0.393 0.409
L2 16 0.630
L3 28.6 30.6 1.126 1.204
L4 9.8 10.6 .0385 0.417
L5 2.9 3.6 0.114 0.141
L6 15.9 16.4 0.626 0.645
L7 9 9.3 0.354 0.366
Ø 3 3.2 0.118 0.126
TO-220FP MECHANICAL DATA
Packaging mechanical data STB75NF75 - STP75NF75 - STP75NF75FP
14/16
5 Packaging mechanical data
TAPE AND REEL SHIPMENT
D2PAK FOOTPRINT
* on sales type
DIM. mm inch
MIN. MAX. MIN. MAX.
A 330 12.992
B1.5 0.059
C 12.8 13.2 0.504 0.520
D20.2 0795
G 24.4 26.4 0.960 1.039
N100 3.937
T 30.4 1.197
BASE QTY BULK QTY
1000 1000
REEL MECHANICAL DATA
DIM. mm inch
MIN. MAX. MIN. MAX.
A0 10.5 10.7 0.413 0.421
B0 15.7 15.9 0.618 0.626
D 1.5 1.6 0.059 0.063
D1 1.59 1.61 0.062 0.063
E 1.65 1.85 0.065 0.073
F11.4 11.6 0.449 0.456
K0 4.8 5.0 0.189 0.197
P0 3.9 4.1 0.153 0.161
P1 11.9 12.1 0.468 0.476
P2 1.9 2.1 0.075 0.082
R 50 1.574
T 0.25 0.35 0.0098 0.0137
W23.7 24.3 0.933 0.956
TAPE MECHANICAL DATA
STB75NF75 - STP75NF75 - STP75NF75FP Revision history
15/16
6 Revision history
Table 7. Revision history
Date Revision Changes
03-Aug-2006 6 Complete version
15-Sep-2006 7 RDS(on) value update
27-Feb-2007 8 The document has been reformatted
STB75NF75 - STP75NF75 - STP75NF75FP
16/16
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