ACT8938 (R) Rev 3, 23-Dec-11 Advanced PMU for Marvell Aspen FEATURES GENERAL DESCRIPTION * * * * * * * * The ACT8938 is a complete, cost effective, highly efficient ActivePMUTM power management solution, optimized for the unique power, voltage sequencing, and control requirements of the Marvell Aspen processor. Optimized for Marvell Aspen Processors Three Step-Down DC/DC Converters Four Low-Dropout Linear Regulators Integrated ActivePathTM Charger I2CTM Serial Interface Advanced Enable/Disable Sequencing Controller Minimal External Components Tiny 5x5mm TQFN55-40 Package - 0.75mm Package Height - Pb-Free and RoHS Compliant This device features three step-down DC/DC converters and four low-noise, low-dropout linear regulators, along with a complete battery charging solution featuring the advanced ActivePathTM system-power selection function. The three DC/DC converters utilize a high efficiency, fixed-frequency (2MHz), current-mode PWM control architecture that requires a minimum number of external components. Two DC/DCs are capable of supplying up to 1150mA of output current, while the third supports up to 1300mA. All four low-dropout linear regulators are highperformance, low-noise regulators that supply up to 150mA, 150mA, 320mA and 320mA respectively. The ACT8938 is available in a compact, Pb-Free and RoHS-compliant TQFN55-40 package . TYPICAL APPLICATION DIAGRAM Active-Semi Innovative PowerTM Active-Semi ProprietaryFor Authorized Recipients and Customers ActivePMUTM and ActivePathTM are trademarks of Active-Semi. I2CTM is a trademark of NXP. Marvell Aspen -1- www.active-semi.com Copyright (c) 2011 Active-Semi, Inc. ACT8938 (R) Rev 3, 23-Dec-11 TABLE OF CONTENTS General Information ..................................................................................................................................... p. 01 Functional Block Diagram ............................................................................................................................ p. 03 Ordering Information .................................................................................................................................... p. 04 Pin Configuration ......................................................................................................................................... p. 04 Pin Descriptions ........................................................................................................................................... p. 05 Absolute Maximum Ratings ......................................................................................................................... p. 07 I2C Interface Electrical Characteristics ........................................................................................................ p. 08 Global Register Map .................................................................................................................................... p. 09 Register and Bit Descriptions ...................................................................................................................... p. 10 System Control Electrical Characteristics.................................................................................................... p. 15 Step-Down DC/DC Electrical Characteristics .............................................................................................. p. 16 Low-Noise LDO Electrical Characteristics ................................................................................................... p. 17 ActivePathTM Charger Electrical Characteristics.......................................................................................... p. 18 Typical Performance Characteristics ........................................................................................................... p. 20 System control information .......................................................................................................................... p. 28 Interfacing with the Marvell Aspen ................................................................................................... p. 28 Control Signals ................................................................................................................................. p. 29 Push-Button Control ......................................................................................................................... p. 30 Control Sequences ........................................................................................................................... p. 30 Functional Description ................................................................................................................................. p. 33 I2C Interface ..................................................................................................................................... p. 33 Voltage Monitor and Interrupt........................................................................................................... p. 33 Thermal Shutdown ........................................................................................................................... p. 34 Step-own DC/DC Regulators ....................................................................................................................... p. 35 General Description.......................................................................................................................... p. 35 100% Duty Cycle Operation ............................................................................................................. p. 35 Synchronous Rectification ................................................................................................................ p. 35 Soft-Start .......................................................................................................................................... p. 35 Compensation .................................................................................................................................. p. 35 Configuration Options....................................................................................................................... p. 35 OK[ ] and Output Fault Interrupt ....................................................................................................... p. 36 PCB Layout Considerations ............................................................................................................. p. 36 Low-Noise, Low-Dropout Linear Regulators................................................................................................ p. 37 General Description.......................................................................................................................... p. 37 Output Current Limit ......................................................................................................................... p. 37 Compensation .................................................................................................................................. p. 37 Configuration Options....................................................................................................................... p. 37 OK[ ] and Output Fault Interrupt ....................................................................................................... p. 37 PCB Layout Considerations ............................................................................................................. p. 38 ActivePathTM Charger .................................................................................................................................. p. 39 General Description.......................................................................................................................... p. 39 ActivePath Architecture .................................................................................................................... p. 39 System Configuration Optimization .................................................................................................. p. 39 Input Protection ................................................................................................................................ p. 39 Battery Management ........................................................................................................................ p. 39 Charge Current Programming .......................................................................................................... p. 40 Charge Input Interrupts .................................................................................................................... p. 40 Charge-Control State Machine ......................................................................................................... p. 42 State Machine Interrupts .................................................................................................................. p. 42 Thermal Regulation .......................................................................................................................... p. 43 Charge Safety Timers ...................................................................................................................... p. 43 Charge Timer Interrupts ................................................................................................................... p. 43 Charge Status Indicator.................................................................................................................... p. 43 Reverse-Current Protection ............................................................................................................. p. 43 Battery Temperature Monitoring ...................................................................................................... p. 43 Battery Temperature Interrupts ........................................................................................................ p. 44 TQFN55-40 Package Outline and Dimensions ........................................................................................... p. 45 Innovative PowerTM Active-Semi ProprietaryFor Authorized Recipients and Customers ActivePMUTM and ActivePathTM are trademarks of Active-Semi. I2CTM is a trademark of NXP. -2- www.active-semi.com Copyright (c) 2011 Active-Semi, Inc. ACT8938 (R) Rev 3, 23-Dec-11 FUNCTIONAL BLOCK DIAGRAM (Optional) AC Adaptor Active-Semi BODY SWITCH ACT8938 4.35V to 6V CHGIN VSYS System Supply BAT Li+ Battery USB ACIN BODY SWITCH ActivePath Control VSYS nSTAT + 102A CURRENT SENSE CHARGE STATUS TH VOLTAGE SENSE Charge Control CHGLEV PRECONDITION 2.85V VP1 ISET THERMAL REGULATION OUT2 To VSYS 110C SW1 OUT1 nRSTO OUT1 VSYS GP12 nPBIN PUSH BUTTON VP2 OUT2 To VSYS SW2 nPBSTAT OUT2 OUT2 OUT2 GP12 nIRQ VP3 To VSYS SW3 PWRHLD OUT3 OUT3 System Control nHIB GP3 VSEL INL SCL REG4 LDO SDA BAT LBI 1.2V VSYS REG5 LDO + REG6 LDO nLBO REG7 LDO REFBP To VSYS OUT4 OUT4 OUT5 OUT5 OUT6 OUT6 OUT7 OUT7 Reference GA Innovative PowerTM Active-Semi ProprietaryFor Authorized Recipients and Customers ActivePMUTM and ActivePathTM are trademarks of Active-Semi. I2CTM is a trademark of NXP. EP -3- www.active-semi.com Copyright (c) 2011 Active-Semi, Inc. ACT8938 (R) Rev 3, 23-Dec-11 ORDERING INFORMATION PART NUMBER VOUT1/VSTBY1 VOUT2/VSTBY2 VOUT3/VSTBY3 VOUT4 VOUT5 VOUT6 VOUT7 PACKAGE PINS TEMPERATURE RANGE ACT8938QJ133-T 1.8V/1.8V 3.3V/3.3V 1.2V/1.1V 1.8V 3.3V 3.3V 3.3V TQFN55-40 40 -40C to +85C ACT8938QJ131-T 1.8V/1.8V 3.3V/3.3V 1.1V/1.0V 1.8V 3.3V 3.3V 3.3V TQFN55-40 40 -40C to +85C : All Active-Semi components are RoHS Compliant and with Pb-free plating unless otherwise specified. : Standard product options are listed in this table. Contact factory for custom options. Minimum order quantity is 12,000 units. : To select VSTBYx as the output regulation voltage for REGx, drive VSEL to logic high. VSTBYx can be set by software via I2C interface. Refer to appropriate sections of this datasheet for VSTBYx setting. ACT8938QJ_ _ _-T Active-Semi Product Number Package Code Pin Count Option Code Tape and Reel PIN CONFIGURATION VSYS CHGIN VSYS OUT2 VP2 SW2 GP12 SW1 VP1 NC TOP VIEW REFBP BAT OUT1 BAT GA nSTAT OUT4 SDA ACTIVE AA33 DATE CODE OUT5 INL OUT7 SCL VSEL TH OUT6 ISET nPBIN CHGLEV EP LBI nLBO PWREN OUT3 VP3 SW3 GP3 nPBSTAT nIRQ ACIN nRSTO PWRHLD Thin - QFN (TQFN55-40) Innovative PowerTM Active-Semi ProprietaryFor Authorized Recipients and Customers ActivePMUTM and ActivePathTM are trademarks of Active-Semi. I2CTM is a trademark of NXP. -4- www.active-semi.com Copyright (c) 2011 Active-Semi, Inc. ACT8938 (R) Rev 3, 23-Dec-11 PIN DESCRIPTIONS PIN NAME DESCRIPTION 1 REFBP 2 OUT1 3 GA 4 OUT4 REG4 output. Capable of delivering up to 150mA of output current. Connect a 1.5F ceramic capacitor from OUT4 to GA. The output is discharged to GA with 1.5k resistor when disabled. 5 OUT5 REG5 output. Capable of delivering up to 150mA of output current. Connect a 1.5F ceramic capacitor from OUT5 to GA. The output is discharged to GA with 1.5k resistor when disabled. 6 INL 7 OUT7 REG7 output. Capable of delivering up to 320mA of output current. Connect a 3.3F ceramic capacitor from OUT7 to GA. The output is discharged to GA with 1.5k resistor when disabled. 8 OUT6 REG6 output. Capable of delivering up to 320mA of output current. Connect a 3.3F ceramic capacitor from OUT6 to GA. The output is discharged to GA with 1.5k resistor when disabled. 9 nPBIN Master Enable Input. Drive nPBIN to GA through a 50k resistor to enable the IC, drive nPBIN directly to GA to assert a manual reset condition. Refer to the nPBIN Multi-Function Input section for more information. nPBIN is internally pulled up to VSYS through a 35k resistor. 10 PWRHLD Power Hold Input. Refer to the Control Sequences section for more information. 11 nRSTO Active Low Reset Output. See the nRSTO Output section for more information. 12 nIRQ 13 nPBSTAT 14 GP3 Power Ground for REG3. Connect GA, GP12, and GP3 together at a single point as close to the IC as possible. 15 SW3 Switching Node Output for REG3. 16 VP3 Power Input for REG3. Bypass to GP3 with a high quality ceramic capacitor placed as close to the IC as possible. 17 OUT3 Output Feedback Sense for REG3. 18 nHIB Hibernate Mode Input. Refer to the Control Sequences section for more information. 19 nLBO Low Battery Indicator Output. nLBO is asserted low whenever the voltage at LBI is lower than 1.2V, and is high-Z otherwise. See the Precision Voltage Detector section for more information. 20 LBI 21 ACIN 22 CHGLEV Reference Bypass. Connect a 0.047F ceramic capacitor from REFBP to GA. This pin is discharged to GA in shutdown. Output Feedback Sense for REG1. Connect this pin directly to the output node to connect the internal feedback network to the output voltage. Analog Ground. Connect GA directly to a quiet ground node. Connect GA, GP12 and GP3 together at a single point as close to the IC as possible. Power Input for REG4, REG5, REG6, and REG7. Bypass to GA with a high quality ceramic capacitor placed as close to the IC as possible. Open-Drain Interrupt Output. nIRQ is asserted any time an unmasked fault condition exists or a charger interrupt occurs. See the nIRQ Output section for more information. Active-Low Open-Drain Push-Button Status Output. nPBSTAT is asserted low whenever the nPBIN is pushed, and is high-Z otherwise. See the nPBSTAT Output section for more information. Low Battery Input. The input voltage is compared to 1.2V and the output of this comparison drives nLBO. See the Precision Voltage Detector section for more information. AC Input Supply Detection. See the Charge Current Programming section for more information. Charge Current Selection Input. See the Charge Current Programming section for more information. Innovative PowerTM Active-Semi ProprietaryFor Authorized Recipients and Customers ActivePMUTM and ActivePathTM are trademarks of Active-Semi. I2CTM is a trademark of NXP. -5- www.active-semi.com Copyright (c) 2011 Active-Semi, Inc. ACT8938 (R) Rev 3, 23-Dec-11 PIN DESCRIPTIONS CONT'D PIN NAME DESCRIPTION 23 ISET 24 TH Temperature Sensing Input. Connect to battery thermistor. TH is pulled up with a 102A (typ) current internally. See the Battery Temperature Monitoring section for more information. 25 VSEL Step-Down DC/DCs Output Voltage Selection. Drive to logic low to select default output voltage. Drive to logic high to select secondary output voltage. See the Output Voltage Programming section for more information. 26 SCL Clock Input for I2C Serial Interface. 27 SDA Data Input for I2C Serial Interface. Data is read on the rising edge of SCL. 28 nSTAT 29, 30 BAT 31, 32 VSYS System Output Pin. Bypass to GA with a 10F or larger ceramic capacitor. 33 CHGIN Power Input for the Battery Charger. Bypass CHGIN to GA with a capacitor placed as close to the IC as possible. The battery charger is automatically enabled when a valid voltage is present on CHGIN. 34 OUT2 Output Feedback Sense for REG2. 35 VP2 Power Input for REG2. Bypass to GP12 with a high quality ceramic capacitor placed as close to the IC as possible. 36 SW2 Switching Node Output for REG2. 37 GP12 Power Ground for REG1 and REG2. Connect GA, GP12 and GP3 together at a single point as close to the IC as possible. 38 SW1 Switching Node Output for REG1. 39 VP1 Power Input for REG1. Bypass to GP12 with a high quality ceramic capacitor placed as close to the IC as possible. 40 NC No Connect. Not internally connected. EP EP Exposed Pad. Must be soldered to ground on PCB. Charge Current Set. Program the charge current by connecting a resistor (RISET) between ISET and GA. See the Charge Current Programming section for more information. Active-Low Open-Drain Charger Status Output. nSTAT has a 8mA (typ) current limit, allowing it to directly drive an indicator LED without additional external components. See the Charge Status Indicator section for more information. Battery Charger Output. Connect this pin directly to the battery anode (+ terminal) Innovative PowerTM Active-Semi ProprietaryFor Authorized Recipients and Customers ActivePMUTM and ActivePathTM are trademarks of Active-Semi. I2CTM is a trademark of NXP. -6- www.active-semi.com Copyright (c) 2011 Active-Semi, Inc. ACT8938 (R) Rev 3, 23-Dec-11 ABSOLUTE MAXIMUM RATINGS PARAMETER VALUE UNIT VP1, VP2 to GP12 VP3 to GP3 -0.3 to +6 V BAT, VSYS, INL to GA -0.3 to +6 V CHGIN to GA -0.3 to +14 V SW1, OUT1 to GP12 -0.3 to (VVP1 + 0.3) V SW2, OUT2 to GP12 -0.3 to (VVP2 + 0.3) V SW3, OUT3 to GP3 -0.3 to (VVP3 + 0.3) V -0.3 to +6 V nPBIN, ACIN, CHGLEV, ISET, LBI, PWRHLD, nHIB, REFBP, SCL, SDA, TH, VSEL to GA -0.3 to (VSYS+0.3) V OUT4, OUT5, OUT6, OUT7 to GA -0.3 to (VINL + 0.3) V -0.3 to +0.3 V Operating Ambient Temperature -40 to 85 C Maximum Junction Temperature 125 C Maximum Power Dissipation TQFN55-40 (Thermal Resistance JA = 30oC/W) 2.7 W -65 to 150 C 300 C nIRQ, nLBO, nPBSTAT, nRSTO, nSTAT to GA GP12, GP3 to GA Storage Temperature Lead Temperature (Soldering, 10 sec) : Do not exceed these limits to prevent damage to the device. Exposure to absolute maximum rating conditions for long periods may affect device reliability. Innovative PowerTM Active-Semi ProprietaryFor Authorized Recipients and Customers ActivePMUTM and ActivePathTM are trademarks of Active-Semi. I2CTM is a trademark of NXP. -7- www.active-semi.com Copyright (c) 2011 Active-Semi, Inc. ACT8938 (R) Rev 3, 23-Dec-11 I2C INTERFACE ELECTRICAL CHARACTERISTICS (VVSYS = 3.6V, TA = 25C, unless otherwise specified.) PARAMETER TEST CONDITIONS MIN SCL, SDA Input Low VVSYS = 3.1V to 5.5V, TA = -40C to 85C SCL, SDA Input High VVSYS = 3.1V to 5.5V, TA = -40C to 85C TYP UNIT 0.35 V 1.55 V SDA Leakage Current SCL Leakage Current 8 SDA Output Low MAX IOL = 5mA 1 A 18 A 0.35 V SCL Clock Period, tSCL 1.5 s SDA Data Setup Time, tSU 100 ns SDA Data Hold Time, tHD 300 ns Start Setup Time, tST For Start Condition 100 ns Stop Setup Time, tSP For Stop Condition 100 ns Figure 1: I2C Compatible Serial Bus Timing tSCL SCL tST tHD tSU tSP SDA Start condition Innovative PowerTM Active-Semi ProprietaryFor Authorized Recipients and Customers ActivePMUTM and ActivePathTM are trademarks of Active-Semi. I2CTM is a trademark of NXP. Stop condition -8- www.active-semi.com Copyright (c) 2011 Active-Semi, Inc. ACT8938 (R) Rev 3, 23-Dec-11 GLOBAL REGISTER MAP BITS OUTPUT ADDRESS SYS 0x00 SYS 0x01 REG1 REG1 0x20 0x21 REG1 0x22 REG2 0x30 REG2 REG2 0x31 0x32 REG3 0x40 REG3 0x41 REG3 REG4 0x42 0x50 REG4 0x51 REG5 0x54 REG5 REG6 0x55 0x60 REG6 0x61 REG7 0x64 REG7 APCH 0x65 0x70 APCH 0x71 APCH 0x78 APCH APCH 0x79 0x7A D7 NAME DEFAULT NAME DEFAULT NAME DEFAULT NAME DEFAULT NAME DEFAULT NAME DEFAULT NAME DEFAULT NAME DEFAULT NAME DEFAULT NAME DEFAULT NAME DEFAULT NAME DEFAULT NAME DEFAULT NAME DEFAULT NAME DEFAULT NAME DEFAULT NAME DEFAULT NAME DEFAULT NAME DEFAULT NAME DEFAULT NAME DEFAULT NAME DEFAULT NAME DEFAULT NAME DEFAULT TRST D6 D5 D4 nSYSMODE nSYSLEVMSK nSYSSTAT D3 SYSLEV[3] D2 D1 SYSLEV[2] SYSLEV[1] D0 SYSLEV[0] 1 1 0 R 0 1 1 1 Reserved FRC_ON1 Reserved Reserved SCRATCH SCRATCH HBRDY SCRATCH 0 0 0 0 0 0 0 0 Reserved Reserved VSET1[5] VSET1[4] VSET1[3] VSET1[2] VSET1[1] VSET1[0] 0 0 1 0 0 1 0 0 Reserved Reserved VSET2[5] VSET2[4] VSET2[3] VSET2[2] VSET2[1] VSET2[0] 0 0 1 0 0 1 0 0 ON PHASE MODE DELAY[2] DELAY[1] DELAY[0] nFLTMSK OK 0 0 0 0 1 0 0 R Reserved Reserved VSET1[5] VSET1[4] VSET1[3] VSET1[2] VSET1[1] VSET1[0] 0 0 1 1 1 0 0 1 Reserved Reserved VSET2[5] VSET2[4] VSET2[3] VSET2[2] VSET2[1] VSET2[0] 0 0 1 1 1 0 0 1 ON PHASE MODE DELAY[2] DELAY[1] DELAY[0] nFLTMSK OK 0 0 0 0 0 0 0 R Reserved Reserved VSET1[5] VSET1[4] VSET1[3] VSET1[2] VSET1[1] VSET1[0] 0 0 0 1 1 0 0 0 Reserved Reserved VSET2[5] VSET2[4] VSET2[3] VSET2[2] VSET2[1] VSET2[0] 0 0 0 1 0 1 0 0 ON Reserved MODE DELAY[2] DELAY[1] DELAY[0] nFLTMSK OK 0 0 0 0 0 1 0 R Reserved Reserved VSET[5] VSET[4] VSET[3] VSET[2] VSET[1] VSET[0] 0 0 1 0 0 1 0 0 ON DIS LOWIQ DELAY[2] DELAY[1] DELAY[0] nFLTMSK OK 0 1 0 0 0 0 0 R Reserved Reserved VSET[5] VSET[4] VSET[3] VSET[2] VSET[1] VSET[0] 0 0 1 1 1 0 0 1 ON DIS LOWIQ DELAY[2] DELAY[1] DELAY[0] nFLTMSK OK 0 1 0 0 1 1 0 R Reserved Reserved VSET[5] VSET[4] VSET[3] VSET[2] VSET[1] VSET[0] 0 0 1 1 1 0 0 1 ON DIS LOWIQ DELAY[2] DELAY[1] DELAY[0] nFLTMSK OK 0 1 0 0 0 0 0 R Reserved Reserved VSET[5] VSET[4] VSET[3] VSET[2] VSET[1] VSET[0] 0 0 1 1 1 0 0 1 ON DIS LOWIQ DELAY[2] DELAY[1] DELAY[0] nFLTMSK OK 0 1 0 0 0 0 0 R Reserved Reserved Reserved Reserved Reserved Reserved Reserved Reserved 0 1 0 0 0 0 1 SUSCHG Reserved 0 0 TIMRSTAT TEMPSTAT TOTTIMO[1] TOTTIMO[0] PRETIMO[1] PRETIMO[0] OVPSET[1] 0 OVPSET[0] 1 0 1 0 0 0 CHGDAT INSTAT CHGSTAT TIMRDAT TEMPDAT INDAT 0 0 0 0 R R R R TIMRTOT TEMPIN INCON CHGEOCIN TIMRPRE TEMPOUT INDIS CHGEOCOUT 0 0 0 0 0 0 0 0 Reserved Reserved CSTATE[0] CSTATE[1] Reserved Reserved ACINSTAT Reserved 0 0 R R R R R R : Default values of ACT8938QJ133-T. 2: All bits are automatically cleared to default values when the input power is removed or falls below the system UVLO. Innovative PowerTM Active-Semi ProprietaryFor Authorized Recipients and Customers ActivePMUTM and ActivePathTM are trademarks of Active-Semi. I2CTM is a trademark of NXP. -9- www.active-semi.com Copyright (c) 2011 Active-Semi, Inc. ACT8938 (R) Rev 3, 23-Dec-11 REGISTER AND BIT DESCRIPTIONS Table 1: Global Register Map OUTPUT ADDRESS BIT NAME ACCESS DESCRIPTION SYS 0x00 [7] TRST R/W Reset Timer Setting. Defines the reset time-out threshold. Reset time-out is 65ms when value is 1, reset time-out is 260ms when value is 0. See nRSTO Output section for more information. SYS 0x00 [6] nSYSMODE R/W SYSLEV Mode Select. Defines the response to the SYSLEV voltage detector, 1: Generate an interrupt when VVSYS falls below the programmed SYSLEV threshold, 0: automatic shutdown when VVSYS falls below the programmed SYSLEV threshold. R/W System Voltage Level Interrupt Mask. SYSLEV interrupt is masked by default, set to 1 to unmask this interrupt. See the Programmable System Voltage Monitor section for more information SYS 0x00 [5] nSYSLEVMSK SYS 0x00 [4] nSYSSTAT R System Voltage Status. Value is 1 when VVSYS is lower than the SYSLEV voltage threshold, value is 0 when VVSYS is higher than the system voltage detection threshold. SYS 0x00 [3:0] SYSLEV R/W System Voltage Detect Threshold. Defines the SYSLEV voltage threshold. See the Programmable System Voltage Monitor section for more information. SYS 0x01 [7] - R/W Reserved. SYS 0x01 [6] FRC_ON1 R/W Force-On bit for REG1. Set bit to 1 before entering Hibernate mode to keep REG1 ON during Hibernate even when PWRHLD is de-asserted. Clear bit to 0 after waking from Hibernate mode. SYS 0x01 [5:4] - R/W Reserved. SYS 0x01 [3:2] SCRATCH R/W Scratchpad Bits. Non-functional bits, maybe be used by user to store system status information. Volatile bits, which are cleared when system voltage falls below UVLO threshold. SYS 0x01 [1] HBRDY R/W Hibernate Ready Flag. Set bit to 1 before entering Hibernate mode, then read this bit during enable sequence to identify system status: if bit value is 1 the system is waking from Hibernate mode, if bit value is 0 the system is waking from a disabled state. SYS 0x01 [0] SCRATCH R/W Scratchpad Bit. Non-functional bit, maybe be used by user to store system status information. Volatile bit, which is cleared when system voltage falls below UVLO threshold. REG1 0x20 [7:6] - R Reserved. Primary Output Voltage Selection. Valid when VSEL is driven low. See the Output Voltage Programming section for more information. REG1 0x20 [5:0] VSET1 R/W REG1 0x21 [7:6] - R REG1 0x21 [5:0] VSET2 R/W Secondary Output Voltage Selection. Valid when VSEL is driven high. See the Output Voltage Programming section for more information. REG1 0x22 [7] ON R/W Regulator Enable Bit. Set bit to 1 to enable the regulator, clear bit to 0 to disable the regulator. REG1 0x22 [6] PHASE R/W Regulator Phase Control. Set bit to 1 for the regulator to operate 180 out of phase with the oscillator, clear bit to 0 for the regulator to operate in phase with the oscillator. REG1 0x22 [5] MODE R/W Regulator Mode Select. Set bit to 1 for fixed-frequency PWM under all load conditions, clear bit to 0 to transit to power-savings mode under light-load conditions. REG1 0x22 [4:2] DELAY R/W Regulator Turn-On Delay Control. See the REG1, REG2, REG3 Turn-on Delay section for more information. Reserved. Innovative PowerTM - 10 Active-Semi ProprietaryFor Authorized Recipients and Customers ActivePMUTM and ActivePathTM are trademarks of Active-Semi. I2CTM is a trademark of NXP. www.active-semi.com Copyright (c) 2011 Active-Semi, Inc. ACT8938 (R) Rev 3, 23-Dec-11 REGISTER AND BIT DESCRIPTIONS CONT'D OUTPUT ADDRESS BIT NAME ACCESS DESCRIPTION REG1 0x22 [1] nFLTMSK R/W REG1 0x22 [0] OK R Regulator Power-OK Status. Value is 1 when output voltage exceeds the power-OK threshold, value is 0 otherwise. REG2 0x30 [7:6] - R Reserved. REG2 0x30 [5:0] VSET1 R/W REG2 0x31 [7:6] - R Regulator Fault Mask Control. Set bit to 1 enable faultinterrupts, clear bit to 0 to disable fault-interrupts. Primary Output Voltage Selection. Valid when VSEL is driven low. See the Output Voltage Programming section for more information. Reserved. REG2 0x31 [5:0] VSET2 R/W Secondary Output Voltage Selection. Valid when VSEL is driven high. See the Output Voltage Programming section for more information. REG2 0x32 [7] ON R/W Regulator Enable Bit. Set bit to 1 to enable the regulator, clear bit to 0 to disable the regulator. REG2 0x32 [6] PHASE R/W Regulator Phase Control. Set bit to 1 for the regulator to operate 180 out of phase with the oscillator, clear bit to 0 for the regulator to operate in phase with the oscillator. REG2 0x32 [5] MODE R/W Regulator Mode Select. Set bit to 1 for fixed-frequency PWM under all load conditions, clear bit to 0 to transit to powersavings mode under light-load conditions. REG2 0x32 [4:2] DELAY R/W Regulator Turn-On Delay Control. See the REG1, REG2, REG3 Turn-on Delay section for more information. REG2 0x32 [1] nFLTMSK R/W Regulator Fault Mask Control. Set bit to 1 enable faultinterrupts, clear bit to 0 to disable fault-interrupts. REG2 0x32 [0] OK R Regulator Power-OK Status. Value is 1 when output voltage exceeds the power-OK threshold, value is 0 otherwise. REG3 0x40 [7:6] - R Reserved. REG3 0x40 [5:0] VSET1 R/W REG3 0x41 [7:6] - R Primary Output Voltage Selection. Valid when VSEL is driven low. See the Output Voltage Programming section for more information. Reserved. REG3 0x41 [5:0] VSET2 R/W Secondary Output Voltage Selection. Valid when VSEL is driven high. See the Output Voltage Programming section for more information. REG3 0x42 [7] ON R/W Regulator Enable Bit. Set bit to 1 to enable the regulator, clear bit to 0 to disable the regulator. REG3 0x42 [6] - R/W Reserved. REG3 0x42 [5] MODE R/W Regulator Mode Select. Set bit to 1 for fixed-frequency PWM under all load conditions, clear bit to 0 to transit to powersavings mode under light-load conditions. REG3 0x42 [4:2] DELAY R/W Regulator Turn-On Delay Control. See the REG1, REG2, REG3 Turn-on Delay section for more information. REG3 0x42 [1] nFLTMSK R/W Regulator Fault Mask Control. Set bit to 1 enable faultinterrupts, clear bit to 0 to disable fault-interrupts. REG3 0x42 [0] OK R Regulator Power-OK Status. Value is 1 when output voltage exceeds the power-OK threshold, value is 0 otherwise. Innovative PowerTM - 11 Active-Semi ProprietaryFor Authorized Recipients and Customers ActivePMUTM and ActivePathTM are trademarks of Active-Semi. I2CTM is a trademark of NXP. www.active-semi.com Copyright (c) 2011 Active-Semi, Inc. ACT8938 (R) Rev 3, 23-Dec-11 REGISTER AND BIT DESCRIPTIONS CONT'D OUTPUT ADDRESS BIT NAME ACCESS DESCRIPTION REG4 0x50 [7:6] - R REG4 0x50 [5:0] VSET R/W Output Voltage Selection. See the Output Voltage Programming section for more information. REG4 0x51 [7] ON R/W Regulator Enable Bit. Set bit to 1 to enable the regulator, clear bit to 0 to disable the regulator. Reserved. REG4 0x51 [6] DIS R/W Output Discharge Control. When activated, LDO output is discharged to GA through 1.5k resistor when in shutdown. Set bit to 1 to enable output voltage discharge in shutdown, clear bit to 0 to disable this function. REG4 0x51 [5] LOWIQ R/W LDO Low-IQ Mode Control. Set bit to 1 for low-power operating mode, clear bit to 0 for normal mode. REG4 0x51 [4:2] DELAY R/W Regulator Turn-On Delay Control. See the REG4, REG5, REG6, REG7 Turn-on Delay section for more information. REG4 0x51 [1] nFLTMSK R/W Regulator Fault Mask Control. Set bit to 1 enable faultinterrupts, clear bit to 0 to disable fault-interrupts. REG4 0x51 [0] OK R Regulator Power-OK Status. Value is 1 when output voltage exceeds the power-OK threshold, value is 0 otherwise. REG5 0x54 [7:6] - R Reserved. REG5 0x54 [5:0] VSET R/W Output Voltage Selection. See the Output Voltage Programming section for more information. REG5 0x55 [7] ON R/W Regulator Enable Bit. Set bit to 1 to enable the regulator, clear bit to 0 to disable the regulator. REG5 0x55 [6] DIS R/W Output Discharge Control. When activated, LDO output is discharged to GA through 1.5k resistor when in shutdown. Set bit to 1 to enable output voltage discharge in shutdown, clear bit to 0 to disable this function. REG5 0x55 [5] LOWIQ R/W LDO Low-IQ Mode Control. Set bit to 1 for low-power operating mode, clear bit to 0 for normal mode. REG5 0x55 [4:2] DELAY R/W Regulator Turn-On Delay Control. See the REG4, REG5, REG6 , REG7 Turn-on Delay section for more information. REG5 0x55 [1] nFLTMSK R/W Regulator Fault Mask Control. Set bit to 1 enable faultinterrupts, clear bit to 0 to disable fault-interrupts. REG5 0x55 [0] OK R Regulator Power-OK Status. Value is 1 when output voltage exceeds the power-OK threshold, value is 0 otherwise. REG6 0x60 [7:6] - R Reserved. REG6 0x60 [5:0] VSET R/W Output Voltage Selection. See the Output Voltage Programming section for more information. REG6 0x61 [7] ON R/W Regulator Enable Bit. Set bit to 1 to enable the regulator, clear bit to 0 to disable the regulator. REG6 0x61 [6] DIS R/W Output Discharge Control. When activated, LDO output is discharged to GA through 1.5k resistor when in shutdown. Set bit to 1 to enable output voltage discharge in shutdown, clear bit to 0 to disable this function. REG6 0x61 [5] LOWIQ R/W LDO Low-IQ Mode Control. Set bit to 1 for low-power operating mode, clear bit to 0 for normal mode. REG6 0x61 [4:2] DELAY R/W Regulator Turn-On Delay Control. See the REG4, REG5, REG6, REG7 Turn-on Delay section for more information. REG6 0x61 [1] nFLTMSK R/W Regulator Fault Mask Control. Set bit to 1 enable faultinterrupts, clear bit to 0 to disable fault-interrupts. Innovative PowerTM - 12 Active-Semi ProprietaryFor Authorized Recipients and Customers ActivePMUTM and ActivePathTM are trademarks of Active-Semi. I2CTM is a trademark of NXP. www.active-semi.com Copyright (c) 2011 Active-Semi, Inc. ACT8938 (R) Rev 3, 23-Dec-11 REGISTER AND BIT DESCRIPTIONS CONT'D OUTPUT ADDRESS BIT NAME ACCESS REG6 0x61 [0] OK R REG7 0x64 [7:6] - R DESCRIPTION Regulator Power-OK Status. Value is 1 when output voltage exceeds the power-OK threshold, value is 0 otherwise. Reserved. REG7 0x64 [5:0] VSET R/W Output Voltage Selection. See the Output Voltage Programming section for more information. REG7 0x65 [7] ON R/W Regulator Enable Bit. Set bit to 1 to enable the regulator, clear bit to 0 to disable the regulator. REG7 0x65 [6] DIS R/W Output Discharge Control. When activated, LDO output is discharged to GA through 1.5k resistor when in shutdown. Set bit to 1 to enable output voltage discharge in shutdown, clear bit to 0 to disable this function. REG7 0x65 [5] LOWIQ R/W LDO Low-IQ Mode Control. Set bit to 1 for low-power operating mode, clear bit to 0 for normal mode. REG7 0x65 [4:2] DELAY R/W Regulator Turn-On Delay Control. See the REG4, REG5, REG6, REG7 Turn-on Delay section for more information. REG7 0x65 [1] nFLTMSK R/W Regulator Fault Mask Control. Set bit to 1 enable faultinterrupts, clear bit to 0 to disable fault-interrupts. REG7 0x65 [0] OK R APCH 0x70 [7:0] - R/W Reserved. APCH 0x71 [7] SUSCHG R/W Charge Suspend Control Input. Set bit to 1 to suspend charging, clear bit to 0 to allow charging to resume. APCH 0x71 [6] - R/W Reserved. APCH 0x71 [5:4] TOTTIMO R/W Total Charge Time-out Selection. See the Charge Safety Timers section for more information. APCH 0x71 [3:2] PRETIMO R/W Precondition Charge Time-out Selection. See the Charge Safety Timers section for more information. APCH 0x71 [1:0] OVPSET R/W Input Over-Voltage Protection Threshold Selection. See the Input Over-Voltage Protection section for more information. R/W Charge Time-out Interrupt Status. Set this bit with TIMRPRE[ ] and/or TIMRTOT[ ] to 1 to generate an interrupt when charge safety timers expire, read this bit to get charge time-out interrupt status. See the Charge Safety Timers section for more information. R/W Battery Temperature Interrupt Status. Set this bit with TEMPIN[ ] and/or TEMPOUT[ ] to 1 to generate an interrupt when a battery temperature event occurs, read this bit to get the battery temperature interrupt status. See the Battery Temperature Monitoring section for more information. R/W Input Voltage Interrupt Status. Set this bit with INCON[ ] and/or INDIS[ ] to generate an interrupt when UVLO or OVP condition occurs, read this bit to get the input voltage interrupt status. See the Charge Current Programming section for more information. Charge State Interrupt Status. Set this bit with CHGEOCIN[ ] and/or CHGEOCOUT[ ] to 1 to generate an interrupt when the state machine gets in or out of EOC state, read this bit to get the charger state interrupt status. See the State Machine Interrupts section for more information. APCH APCH APCH 0x78 0x78 0x78 [7] [6] [5] TIMRSTAT1 TEMPSTAT1 INSTAT APCH 0x78 [4] CHGSTAT1 R/W APCH 0x78 [3] TIMRDAT1 R Regulator Power-OK Status. Value is 1 when output voltage exceeds the power-OK threshold, value is 0 otherwise. Charge Timer Status. Value is 1 when precondition time-out or total charge time-out occurs. Value is 0 in other case. Innovative PowerTM - 13 Active-Semi ProprietaryFor Authorized Recipients and Customers ActivePMUTM and ActivePathTM are trademarks of Active-Semi. I2CTM is a trademark of NXP. www.active-semi.com Copyright (c) 2011 Active-Semi, Inc. ACT8938 (R) Rev 3, 23-Dec-11 REGISTER AND BIT DESCRIPTIONS CONT'D OUTPUT ADDRESS BIT NAME ACCESS DESCRIPTION APCH 0x78 [2] TEMPDAT1 R Temperature Status. Value is 0 when battery temperature is outside of valid range. Value is 1 when battery temperature is inside of valid range. APCH 0x78 [1] INDAT R Input Voltage Status. Value is 1 when a valid input at CHGIN is present. Value is 0 when a valid input at CHGIN is not present. APCH 0x78 [0] CHGDAT1 R Charge State Machine Status. Value is 1 indicates the charger state machine is in EOC state, value is 0 indicates the charger state machine is in other states. APCH 0x79 [7] TIMRTOT R/W Total Charge Time-out Interrupt Control. Set both this bit and TIMRSTAT[ ] to 1 to generate an interrupt when a total charge time-out occurs. See the Charge Safety Timers section for more information. APCH 0x79 [6] TEMPIN R/W Battery Temperature Interrupt Control. Set both this bit and TEMPSTAT[ ] to 1 to generate an interrupt when the battery temperature goes into the valid range. See the Battery Temperature Monitoring section for more information. R/W Input Voltage Interrupt Control. Set both this bit and INSTAT[ ] to 1 to generate an interrupt when CHGIN input voltage goes into the valid range. See the Charge Current Programming section for more information. R/W Charge State Interrupt Control. Set both this bit and CHGSTAT[ ] to 1 to generate an interrupt when the state machine goes into the EOC state. See the State Machine Interrupts section for more information. APCH APCH 0x79 0x79 [5] [4] INCON CHGEOCIN APCH 0x79 [3] TIMRPRE R/W PRECHARGE Time-out Interrupt Control. Set both this bit and TIMRSTAT[ ] to 1 to generate an interrupt when a PRECHARGE time-out occurs. See the Charge Safety Timers section for more information. APCH 0x79 [2] TEMPOUT R/W Battery Temperature Interrupt Control. Set both this bit and TEMPSTAT[ ] to 1 to generate an interrupt when the battery temperature goes out of the valid range. See the Battery Temperature Monitoring section for more information. R/W Input Voltage Interrupt Control. Set both this bit and INSTAT[ ] to 1 to generate an interrupt when CHGIN input voltage goes out of the valid range. See the Charge Current Programming section for more information. Charge State Interrupt Control. Set both this bit and CHGSTAT[ ] to 1 to generate an interrupt when the state machines jumps out of the EOC state. See the State Machine Interrupts section for more information. APCH 0x79 [1] INDIS APCH 0x79 [0] CHGEOCOUT R/W APCH 0x7A [7:6] - R Reserved. APCH 0x7A [5:4] CSTATE R Charge State. Values indicate the current charging state. See the State Machine Interrupts section for more information. APCH 0x7A [3:2] - R Reserved. APCH 0x7A [1] ACINSTAT R ACIN Status. Indicates the state of the ACIN input, typically in order to identify the type of input supply connected. Value is 1 when ACIN is above the 1.2V precision threshold, value is 0 when ACIN is below this threshold. APCH 0x7A [0] - R Reserved. : Valid only when CHGIN UVLO Threshold<VCHGIN<CHGIN OVP Threshold. Innovative PowerTM - 14 Active-Semi ProprietaryFor Authorized Recipients and Customers ActivePMUTM and ActivePathTM are trademarks of Active-Semi. I2CTM is a trademark of NXP. www.active-semi.com Copyright (c) 2011 Active-Semi, Inc. ACT8938 (R) Rev 3, 23-Dec-11 SYSTEM CONTROL ELECTRICAL CHARACTERISTICS (VVSYS = 3.6V, TA = 25C, unless otherwise specified.) PARAMETER TEST CONDITIONS Input Voltage Range MIN TYP 2.7 UVLO Threshold Voltage VVSYS Rising UVLO Hysteresis VVSYS Falling 200 REG1 Enabled. REG2, REG3, REG4, REG5, REG6 and REG7 Disabled 150 REG1, REG2, REG3, REG4 and REG5 Enabled. REG6 and REG7 Disabled 350 REG1, REG2, REG3, REG4, REG5, REG6 and REG7 Enabled 420 Supply Current Shutdown Supply Current All Regulators Disabled Oscillator Frequency Logic High Input Voltage 2.2 1.8 2.45 MAX UNIT 5.5 V 2.65 V mV A 8 18 A 2 2.2 MHz 1.4 1 V Logic Low Input Voltage Leakage Current VnIRQ = VnRSTO = 4.2V LBI Threshold Voltage VBAT Falling LBI Hysteresis Threshold VBAT Rising Low Level Output Voltage 2 1.2 Temperature rising Thermal Shutdown Hysteresis V 1 A 1.31 V 200 ISINK = 5mA nRSTO Delay Thermal Shutdown Temperature 1.03 0.4 mV 0.35 V 65 ms 160 C 20 C : PWRHLD, nHIB, VSEL are logic inputs. 2: nLBO, nPBSTAT, nIRQ, nRSTO are open drain outputs. 3: Typical value shown. Actual value may vary from 56.3ms to 72.8ms. Innovative PowerTM - 15 Active-Semi ProprietaryFor Authorized Recipients and Customers ActivePMUTM and ActivePathTM are trademarks of Active-Semi. I2CTM is a trademark of NXP. www.active-semi.com Copyright (c) 2011 Active-Semi, Inc. ACT8938 (R) Rev 3, 23-Dec-11 STEP-DOWN DC/DC ELECTRICAL CHARACTERISTICS (VVP1 = VVP2 = VVP3 = 3.6V, TA = 25C, unless otherwise specified.) PARAMETER CONDITIONS Operating Voltage Range MIN TYP 2.7 5.5 V 2.7 V Input Voltage Rising UVLO Hysteresis Input Voltage Falling 100 Quiescent Supply Current Regulator Enabled 65 90 A Shutdown Current VVP = 5.5V, Regulator Disabled 0 1 A mV VOUT 1.2V, IOUT = 10mA -1% VNOM 1% VOUT < 1.2V, IOUT = 10mA -2% VNOM 2% Line Regulation VVP = Max(VNOM1 +1, 3.2V) to 5.5V Load Regulation IOUT = 10mA to IMAX Power Good Threshold Power Good Hysteresis Oscillator Frequency 2.6 UNIT UVLO Threshold Output Voltage Accuracy 2.5 MAX V 0.15 %/V 0.0017 %/mA VOUT Rising 93 %VNOM VOUT Falling 2 %VNOM 2 VOUT 20% of VNOM 1.8 VOUT = 0V 2 2.2 MHz 500 kHz Soft-Start Period 400 s Minimum On-Time 75 ns REG1 Maximum Output Current 1.15 Current Limit 1.5 A 1.8 2.1 A PMOS On-Resistance ISW1 = -100mA 0.16 NMOS On-Resistance ISW1 = 100mA 0.16 SW1 Leakage Current VVP1 = 5.5V, VSW1 = 0 or 5.5V 1 A REG2 Maximum Output Current 1.15 Current Limit 1.5 PMOS On-Resistance A 1.8 ISW2 = -100mA 0.16 NMOS On-Resistance ISW2 = 100mA 0.16 SW2 Leakage Current VVP2 = 5.5V, VSW2 = 0 or 5.5V 2.1 A 1 A REG3 Maximum Output Current 1.3 Current Limit 1.7 A 2.1 2.5 A PMOS On-Resistance ISW3 = -100mA 0.16 NMOS On-Resistance ISW3 = 100mA 0.16 SW3 Leakage Current VVP3 = 5.5V, VSW3 = 0 or 5.5V 0 1 A : VNOM refers to the nominal output voltage level for VOUT as defined by the Ordering Information section. 2: IMAX Maximum Output Current. Innovative PowerTM - 16 Active-Semi ProprietaryFor Authorized Recipients and Customers ActivePMUTM and ActivePathTM are trademarks of Active-Semi. I2CTM is a trademark of NXP. www.active-semi.com Copyright (c) 2011 Active-Semi, Inc. ACT8938 (R) Rev 3, 23-Dec-11 LOW-NOISE LDO ELECTRICAL CHARACTERISTICS (VINL = 3.6V, COUT4 = COUT5 = 1.5F, COUT6 = COUT7 = 3.3F, LOWIQ[ ] = [0], TA = 25C, unless otherwise specified.) PARAMETER TEST CONDITIONS Operating Voltage Range Output Voltage Accuracy Line Regulation Load Regulation Power Supply Rejection Ratio Supply Current per Output MIN TYP 2.5 MAX UNIT 5.5 V VOUT 1.2V, TA = 25C, IOUT = 10mA -1% VNOM 2% VOUT < 1.2V, TA = 25C, IOUT = 10mA -2% VNOM 4% VINL = Max(VOUT + 0.5V, 3.6V) to 5.5V LOWIQ[ ] = [0] 0.05 VINL = Max(VOUT + 0.5V, 3.6V) to 5.5V LOWIQ[ ] = [1] 0.5 IOUT = 1mA to IMAX2 0.08 V mV/V V/A f = 1kHz, IOUT = 20mA, VOUT =1.2V 75 f = 10kHz, IOUT = 20mA, VOUT =1.2V 65 Regulator Enabled, LOWIQ[ ] = [0] 37 60 Regulator Enabled, LOWIQ[ ] = [1] 31 52 Regulator Disabled 0 1 dB A Soft-Start Period VOUT = 2.9V 140 s Power Good Threshold VOUT Rising 89 % Power Good Hysteresis VOUT Falling 3 % Output Noise IOUT = 20mA, f = 10Hz to 100kHz, VOUT = 1.2V 50 VRMS Discharge Resistance LDO Disabled, DIS[ ] = 1 1.5 k IOUT = 80mA, VOUT > 3.1V 90 REG4 Dropout Voltage Maximum Output Current Current Limit VOUT = 95% of regulation voltage Stable COUT4 Range 180 mV 150 mA 200 mA 1.5 20 F REG5 Dropout Voltage IOUT = 80mA, VOUT > 3.1V Maximum Output Current Current Limit 140 280 VOUT = 95% of regulation voltage Stable COUT5 Range mV mA 150 200 mA 1.5 20 F 180 mV REG6 Dropout Voltage IOUT = 160mA, VOUT > 3.1V Maximum Output Current Current Limit VOUT = 95% of regulation voltage Stable COUT6 Range 90 320 mA 400 mA 3.3 20 F 280 mV REG7 Dropout Voltage IOUT = 160mA, VOUT > 3.1V Maximum Output Current Current Limit 140 320 VOUT = 95% of regulation voltage Stable COUT7 Range mA 400 mA 3.3 20 F : VNOM refers to the nominal output voltage level for VOUT as defined by the Ordering Information section. 2: IMAX Maximum Output Current. 3: Dropout Voltage is defined as the differential voltage between input and output when the output voltage drops 100mV below the regulation voltage (for 3.1V output voltage or higher). : LDO current limit is defined as the output current at which the output voltage drops to 95% of the respective regulation voltage. Innovative PowerTM - 17 Active-Semi ProprietaryFor Authorized Recipients and Customers ActivePMUTM and ActivePathTM are trademarks of Active-Semi. I2CTM is a trademark of NXP. www.active-semi.com Copyright (c) 2011 Active-Semi, Inc. ACT8938 (R) Rev 3, 23-Dec-11 ActivePathTM CHARGER ELECTRICAL CHARACTERISTICS (VCHGIN = 5.0V, TA = 25C, unless otherwise specified.) PARAMETER TEST CONDITIONS MIN TYP MAX UNIT 6.0 V 3.9 V ActivePath CHGIN Operating Voltage Range 4.35 CHGIN UVLO Threshold CHGIN Voltage Rising CHGIN UVLO Hysteresis CHGIN Voltage Falling CHGIN OVP Threshold CHGIN Voltage Rising CHGIN OVP Hysteresis CHGIN Voltage Falling 0.4 VCHGIN < VUVLO 35 70 A VCHGIN < VBAT + 50mV, VCHGIN > VUVLO 100 200 A VCHGIN > VBAT + 150mV, VCHGIN > VUVLO Charger disabled, IVSYS = 0mA 1.3 2.0 mA IVSYS = 100mA 0.3 A CHGIN Supply Current CHGIN to VSYS On-Resistance CHGIN to VSYS Current Limit 3.1 3.5 0.5 6.0 6.6 V 7.2 V V ACIN = VSYS 1.5 2 ACIN = GA, CHGLEV = GA 80 90 100 ACIN = GA, CHGLEV = VSYS 400 450 500 IVSYS = 10mA 4.45 4.6 4.8 V 4 8 12 mA 1 A mA VSYS REGULATION VSYS Regulated Voltage nSTAT OUTPUT nSTAT Sink current VnSTAT = 2V nSTAT Leakage Current VnSTAT = 4.2V ACIN AND CHGLEV INPUTS CHGLEV Logic High Input Voltage 1.4 V CHGLEV Logic Low Input Voltage CHGLEV Leakage Current VCHGLEV = 4.2V ACIN Voltage Thresholds ACIN voltage rising ACIN Hysteresis voltage threshold ACIN voltage falling ACIN Leakage Current VACIN = 4.2V 1.03 1.2 0.4 V 1 A 1.31 V 200 mV 1 A TH INPUT TH Pull-Up Current VCHGIN > VBAT + 100mV, Hysteresis = 50mV 91 102 110 A VTH Upper Temperature Voltage Threshold (VTHH) Hot Detect NTC Thermistor 2.44 2.51 2.58 V VTH Lower Temperature Voltage Threshold (VTHL) Cold Detect NTC Thermistor 0.47 0.50 0.53 V VTH Hysteresis Upper and Lower Thresholds Innovative PowerTM - 18 Active-Semi ProprietaryFor Authorized Recipients and Customers ActivePMUTM and ActivePathTM are trademarks of Active-Semi. I2CTM is a trademark of NXP. 30 mV www.active-semi.com Copyright (c) 2011 Active-Semi, Inc. ACT8938 (R) Rev 3, 23-Dec-11 ActivePathTM CHARGER ELECTRICAL CHARACTERISTICS CONT'D (VCHGIN = 5.0V, TA = 25C, unless otherwise specified.) PARAMETER TEST CONDITIONS MIN TYP MAX UNIT CHARGER BAT Reverse Leakage Current VCHGIN = 0V, VBAT = 4.2V, IVSYS = 0mA BAT to VSYS On-Resistance ISET Pin Voltage Charge Termination Voltage VTERM Charge Current Precondition Charge Current A 70 m Fast Charge 1.2 Precondition 0.13 V TA = -20C to 70C 4.179 4.2 4.221 TA = -40C to 85C 4.170 4.2 4.230 ACIN = VSYS, CHGLEV = VSYS -10% ICHG1 +10% ACIN = VSYS, CHGLEV = GA -10% ICHG/5 +10% ACIN = GA, CHGLEV = VSYS 400 450 500 ACIN = GA, CHGLEV = GA 80 90 100 VBAT = 3.8V RISET = 6.8K VBAT = 2.7V RISET = 6.8K ACIN = VSYS, CHGLEV = VSYS 10% ICHG ACIN = VSYS, CHGLEV = GA 10% ICHG ACIN = GA, CHGLEV = VSYS 45 ACIN = GA, CHGLEV = GA 45 Precondition Threshold Voltage VBAT Voltage Rising Precondition Threshold Hysteresis VBAT Voltage Falling END-OF-CHARGE Current Threshold 8 VBAT = 4.15V 2.75 2.85 10% ICHG ACIN = VSYS, CHGLEV = GA 10% ICHG ACIN = GA, CHGLEV = VSYS 45 ACIN = GA, CHGLEV = GA 45 3.0 205 V mV mA Charge Restart Threshold VTERM - VBAT, VBAT Falling Precondition Safety Timer PRETIMO[ ] = 10 80 min Total Safety Timer TOTTIMO[ ] = 10 5 hr 100 C Thermal Regulation Threshold 190 mA mA 150 ACIN = VSYS, CHGLEV = VSYS V 220 mV : RISET (k) = 2336 x (1V/ICHG (mA)) - 0.205 Innovative PowerTM - 19 Active-Semi ProprietaryFor Authorized Recipients and Customers ActivePMUTM and ActivePathTM are trademarks of Active-Semi. I2CTM is a trademark of NXP. www.active-semi.com Copyright (c) 2011 Active-Semi, Inc. ACT8938 (R) Rev 3, 23-Dec-11 TYPICAL PERFORMANCE CHARACTERISTICS (VVSYS = 3.6V, TA = 25C, unless otherwise specified.) Frequency vs. Temperature VREF vs. Temperature 0 -0.42 2 Frequency (%) VREF (%) 0.42 2.5 -20 0 20 40 60 80 100 1.5 1 0.5 0 -0.5 Typical VREF=1.2V -0.84 -40 ACT8938-002 ACT8938-001 0.84 Typical Oscillator Frequency=2MHz -1 -40 120 -20 0 20 40 60 Temperature (C) Temperature (C) nPBIN Startup Sequence PWRHLD Startup Sequence ACT8938-004 ACT8938-003 CH1 80 85 CH1 CH2 CH3 CH2 CH4 CH5 CH6 CH3 CH1: VnPBIN, 5V/div CH2: VOUT2, 2V/div CH3: VOUT4, 2V/div CH4: VOUT3, 2V/div CH5: VOUT1, 2V/div CH6: VOUT5, 2V/div TIME: 2ms/div CH1: VnPBIN, 2V/div CH2: VPWRHLD, 2V/div CH3: VOUT1, 2V/div FRC_ON1[ ] = 0 TIME: 100ms/div PWRHLD Startup Sequence PWRHLD Startup Sequence CH1 CH2 CH2 CH3 CH3 CH1: VnPBIN, 2V/div CH2: VOUT1, 2V/div CH3: VPWRHLD, 2V/div FRC_ON1[ ] = 0 TIME: 100ms/div Innovative PowerTM - 20 Active-Semi ProprietaryFor Authorized Recipients and Customers ActivePMUTM and ActivePathTM are trademarks of Active-Semi. I2CTM is a trademark of NXP. ACT8938-006 ACT8938-005 CH1 CH1: VnPBIN, 2V/div CH2: VPWRHLD, 2V/div CH3: VOUT1, 2V/div FRC_ON1[ ] = 1 TIME: 100ms/div www.active-semi.com Copyright (c) 2011 Active-Semi, Inc. ACT8938 (R) Rev 3, 23-Dec-11 TYPICAL PERFORMANCE CHARACTERISTICS (VVSYS = 3.6V, TA = 25C, unless otherwise specified.) nHIB Sequence nHIB Sequence ACT8938-008 ACT8938-007 CH1 CH1 CH2 CH2 CH3 CH3 CH4 CH5 CH4 CH1: VnPBIN, 2V/div CH2: VnHIB, 2V/div CH3: VOUT2, 2V/div CH4: VnRSTO, 2V/div TIME: 20ms/div CH1: VnHIB, 2V/div CH2: VOUT2, 2V/div CH3: VOUT4, 1.97V/div CH4: VOUT3, 1V/div CH5: VOUT5, 2V/div TIME: 2ms/div nHIB Sequence ACT8938-009 CH1 CH2 CH3 CH4 CH5 CH6 CH1: VnHIB, 5V/div CH2: VOUT2, 2V/div CH3: VOUT4, 2V/div CH4: VOUT3, 2V/div CH5: VOUT1, 2V/div CH6: VOUT5, 5V/div TIME: 20ms/div Innovative PowerTM - 21 Active-Semi ProprietaryFor Authorized Recipients and Customers ActivePMUTM and ActivePathTM are trademarks of Active-Semi. I2CTM is a trademark of NXP. www.active-semi.com Copyright (c) 2011 Active-Semi, Inc. ACT8938 (R) Rev 3, 23-Dec-11 TYPICAL PERFORMANCE CHARACTERISTICS CONT'D (TA = 25C, unless otherwise specified.) Push-Button Response (First Power-Up) Manual Reset Response ACT8938-011 ACT8938-010 CH1 CH1 CH2 CH2 CH3 CH3 CH4 CH1: VnPBIN, 2V/div CH2: VnHIB, 2V/div CH3: VnPBSTAT, 2V/div CH4: VnRSTO, 2V/div TIME: 20ms/div CH1: VnPBIN, 2V/div CH2: VnPBSTAT, 2V/div CH3:VnRSTO , 2V/div TIME: 30ms/div nPBIN Resistor = 50k REG2 Efficiency vs. Output Current REG1 Efficiency vs. Output Current VIN = 3.6V VIN = 4.2V 60 VIN = 5.0V 80 VIN = 4.2V Efficiency (%) Efficiency (%) VIN = 5.0V VOUT = 3.3V 40 VIN = 3.6V ACT8938-013 VOUT = 1.8V 80 100 ACT8938-012 100 nPBIN Resistor = 0 60 40 20 20 0 0 1 10 100 1000 1 10 Output Current (mA) 100 1000 Output Current (mA) REG3 Efficiency vs. Output Current VOUT = 1.2V 80 Efficiency (%) ACT8938-014 100 VIN = 5.0V VIN = 3.6V VIN = 4.2V 60 40 20 0 10 1 100 1000 Output Current (mA) Innovative PowerTM - 22 Active-Semi ProprietaryFor Authorized Recipients and Customers ActivePMUTM and ActivePathTM are trademarks of Active-Semi. I2CTM is a trademark of NXP. www.active-semi.com Copyright (c) 2011 Active-Semi, Inc. ACT8938 (R) Rev 3, 23-Dec-11 TYPICAL PERFORMANCE CHARACTERISTICS CONT'D (TA = 25C, unless otherwise specified.) REG2 Output Voltage vs. Temperature REG1 Output Voltage vs. Temperature Output Voltage (V) 1.809 1.803 1.797 1.791 1.785 -40 -20 0 20 40 60 80 100 3.310 VOUT2 = 3.3V ILOAD = 100mA 3.306 Output Voltage (V) VOUT1 = 1.8V ILOAD = 100mA 3.302 3.298 3.294 3.290 -40 120 -20 0 20 40 60 80 100 120 Temperature (C) Temperature (C) REG1, 2, 3 MOSFET Resistance REG3 Output Voltage vs. Temperature 1.202 1.198 ILOAD = 100mA 300 250 RDSON (m) 1.206 ACT8938-018 350 ACT8938-017 1.210 V OUT3 = 1.2V ILOAD = 100mA Output Voltage (V) ACT8938-016 ACT8938-015 1.815 200 PMOS NMOS 150 100 1.194 1.190 -40 50 0 -20 0 20 40 60 80 100 120 Temperature (C) Innovative PowerTM - 23 Active-Semi ProprietaryFor Authorized Recipients and Customers ActivePMUTM and ActivePathTM are trademarks of Active-Semi. I2CTM is a trademark of NXP. 3.0 3.5 4.0 4.5 5.0 5.5 Input Voltage (V) www.active-semi.com Copyright (c) 2011 Active-Semi, Inc. ACT8938 (R) Rev 3, 23-Dec-11 TYPICAL PERFORMANCE CHARACTERISTICS CONT'D (TA = 25C, unless otherwise specified.) Output Voltage vs. Output Current Output Voltage (V) 1.860 1.840 REG4 1.800 1.780 1.760 1.740 3.380 3.360 3.340 3.320 3.300 REG5 3.280 3.260 3.240 3.220 1.720 1.700 ACT8938-020 ACT8938-019 1.880 1.820 Output Voltage vs. Output Current 3.400 Output Voltage (V) 1.900 3.200 0 20 40 60 80 100 120 140 0 160 20 40 Output Current (mA) Output Voltage vs. Output Current Output Voltage (V) 120 140 160 3.340 REG6 3.300 3.280 3.260 3.240 ACT8938-022 ACT8938-021 3.360 3.390 3.350 3.310 REG7 3.270 3.230 3.190 3.220 3.200 0 50 100 150 200 250 300 350 400 3.150 450 0 50 Output Current (mA) Dropout Voltage vs. Output Current 80 60 40 60 80 100 120 350 400 450 140 REG5 150 100 50 VIN = 3.3V 0 VIN = 3.3V 40 300 200 20 20 250 250 Dropout Voltage (mV) REG4 0 200 ACT8938-024 ACT8938-023 120 0 150 Dropout Voltage vs. Output Current 140 100 100 Output Current (mA) 160 Dropout Voltage (mV) 100 Output Voltage vs. Output Current 3.380 3.320 80 3.430 Output Voltage (V) 3.400 60 Output Current (mA) 160 Output Current (mA) Innovative PowerTM - 24 Active-Semi ProprietaryFor Authorized Recipients and Customers ActivePMUTM and ActivePathTM are trademarks of Active-Semi. I2CTM is a trademark of NXP. 0 20 40 60 80 100 120 140 160 Output Current (mA) www.active-semi.com Copyright (c) 2011 Active-Semi, Inc. ACT8938 (R) Rev 3, 23-Dec-11 TYPICAL PERFORMANCE CHARACTERISTICS CONT'D (TA = 25C, unless otherwise specified.) Dropout Voltage vs. Output Current Dropout Voltage vs. Output Current REG6 150 100 50 350 300 Dropout Voltage (mV) Dropout Voltage (mV) 200 VIN = 3.3V 0 0 50 100 150 200 250 300 350 400 250 REG7 200 150 100 50 VIN = 3.3V 0 450 0 50 Output Current (mA) Output Voltage vs. Temperature 200 250 300 350 400 450 3.00 ESR () 2.50 REG4 1.50 ACT8938-028 1 ACT8938-027 Output Voltage (V) 150 Region of Stable COUT ESR vs. Output Current REG5, REG6, REG7 2.00 100 Output Current (mA) 4.00 3.50 ACT8938-026 ACT8938-025 250 0.1 Stable ESR 1.00 0.50 0.01 0 -40 -20 0 20 40 60 80 100 120 0 50 100 150 200 250 300 340 Output Current (mA) Temperature (C) LDO Output Voltage Noise ACT8938-029 CH1 CH1: VOUTx, 200V/div (AC COUPLED) TIME: 200ms/div Innovative PowerTM - 25 Active-Semi ProprietaryFor Authorized Recipients and Customers ActivePMUTM and ActivePathTM are trademarks of Active-Semi. I2CTM is a trademark of NXP. www.active-semi.com Copyright (c) 2011 Active-Semi, Inc. ACT8938 (R) Rev 3, 23-Dec-11 TYPICAL PERFORMANCE CHARACTERISTICS CONT'D (TA = 25C, unless otherwise specified.) VSYS Voltage vs. CHGIN Voltage VSYS Voltage vs. VSYS Current 4.0 ACIN/CHGLEV = 01 ACIN/CHGLEV = 11 3.0 2.0 5.0 VSYS Voltage (V) VSYS Voltage (V) 5.0 5.2 ACT8938-031 ACT8938-030 6.0 4.8 VVSYS = 4.6V 4.6 4.4 4.2 1.0 4.0 0 0 500 1000 1500 2000 2 0 2500 4 70 60 50 40 30 VCHGIN = 5V ACIN = 0 CHGLEV = 0 90mA USB 0 0.0 Charger Current (mA) 1.5 2.0 2.5 3.0 3.5 4.0 350 300 250 200 150 VBAT Falling VBAT Rising 100 0 0.0 4.5 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 Battery Voltage (V) Battery Voltage (V) Charger Current vs. Battery Voltage DCCC and Battery Supplement Modes RISET = 2.4k VCHGIN = 5V ACIN/CHGLEV = 11 800 4.5 ACT8938-035 1000 1.0 CHGLEV = 1 400 450mA USB 50 ACT8938-034 1200 0.5 VCHGIN = 5V 450 ACIN = 0 Charger Current (mA) Charger Current (mA) 80 500 ACT8938-033 ACT8938-032 90 VBAT Falling VBAT Rising 10 Charger Current vs. Battery Voltage Charger Current vs. Battery Voltage 100 10 8 CHGIN Voltage (V) VSYS Current (mA) 20 6 CH4 CH3 600 CH2 VBAT = 3.5V VVSYS = 4.6V IVSYS = 0-1.8A ICHARGE = 1000mA VCHGIN = 5.1V-3A 400 VBAT Falling VBAT Rising 200 CH1 0 0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 Battery Voltage (V) Innovative PowerTM - 26 Active-Semi ProprietaryFor Authorized Recipients and Customers ActivePMUTM and ActivePathTM are trademarks of Active-Semi. I2CTM is a trademark of NXP. CH1: IVSYS, 1.00A/div CH2: IBAT, 1.00A/div CH3: VBAT, 1.00V/div CH4: VVSYS, 1V/div TIME: 200ms/div www.active-semi.com Copyright (c) 2011 Active-Semi, Inc. ACT8938 (R) Rev 3, 23-Dec-11 TYPICAL PERFORMANCE CHARACTERISTICS CONT'D (TA = 25C, unless otherwise specified.) VAC Applied VAC Removed CH3 ACT8938-037 ACT8938-036 CH4 CH4 CH3 CH2 CH2 CH1 CH1 CH1: IBAT, 400mA/div CH2: VBAT, 1V/div CH3: VVSYS, 2V/div CH4: VCHGIN, 5V/div TIME: 40ms/div VCHGIN = 5V VBAT = 3.5V RVSYS = 100 ACIN/CHGLEV = 01 CH1: IBAT, 200mA/div CH2: VVSYS, 2V/div CH3: VBAT, 1V/div CH4: VCHGIN, 5V/div TIME: 40ms/div VAC Applied VAC Removed CH3 ACT8938-039 ACT8938-038 CH4 VCHGIN = 5V VBAT = 3.5V RVSYS = 100 ACIN/CHGLEV = 01 CH4 CH3 CH2 CH2 CH1 CH1 CH1: IBAT, 1A/div CH2: VBAT, 2V/div CH3: VVSYS, 2V/div CH4: VCHGIN, 5V/div TIME: 40ms/div VCHGIN = 5V VBAT = 3.97V RVSYS = 47 ACIN/CHGLEV = 11 Innovative PowerTM - 27 Active-Semi ProprietaryFor Authorized Recipients and Customers ActivePMUTM and ActivePathTM are trademarks of Active-Semi. I2CTM is a trademark of NXP. CH1: IBAT, 1A/div CH2: VVSYS, 2V/div CH3: VBAT, 2V/div CH4: VCHGIN, 5V/div TIME: 40ms/div VCHGIN = 5V VBAT = 3.97V RVSYS = 47 ACIN/CHGLEV = 11 www.active-semi.com Copyright (c) 2011 Active-Semi, Inc. ACT8938 (R) Rev 3, 23-Dec-11 SYSTEM CONTROL INFORMATION Interfacing with the Marvell Aspen The ACT8938 is optimized for use in applications using the Marvell Aspen processors, supporting both the power domains as well as the signal interface for these processors. While the ACT8938 supports many possible configurations for powering these processors, one of the most common configurations is detailed in this datasheet. In general, this document refers to the ACT8938 pin names and functions. However, in cases where the description of interconnections between these devices benefits by doing so, both the ACT8938 pin names and the Marvell Aspen processors pin names are provided. When this is done, the Aspen pin names are located after the ACT8938 pin names, and are italicized and located inside parentheses. For example, VSEL (DVS_GPIO) refers to the logic signal applied to the ACT8938's VSEL input, identifying that it is driven from the Aspen's DVS_GPIO output. Likewise, OUT2 (VDD_IO ) refers to ACT8938's OUT2 pin, identifying that it is connected to the Aspen's VDD_IO power domain. Table 2: ACT8938 and Marvell Aspen Power Domains POWER DOMAIN ACT8938 CHANNEL TYPE DEFAULT VOLTAGE CURRENT CAPABILITY VDD_M REG1 DC/DC 1.8V/1.8V 1150mA VDD_IO REG2 DC/DC 3.3V/3.3V 1150mA VDD_Core REG3 DC/DC 1.1V/1.0V 1300mA REG4 LDO 1.8V 150mA AVDD_USB REG5 LDO 3.3V 150mA TBD REG6 LDO 3.3V 320mA TBD REG7 LDO 3.3V 320mA AVDD_OSC AVDD_PLL Table 3: ACT8938 and Marvell Aspen Power Modes POWER MODE CONTROL STATE POWER DOMAIN STATE QUIESCENT CURRENT ALL ON PWRHLD is asserted, nHIB is de-asserted, REG6 and REG7 are enabled by I2C REG1, REG2, REG3, REG4, REG5, REG6 and REG7 are all on 420A NORMAL PWRHLD is asserted, nHIB is de-asserted, REG6 and REG7 are disabled by I2C REG1, REG2, REG3, REG4 and REG5 are on. REG6 and REG7 are off 350A Hibernate PWRHLD is asserted, nHIB is asserted, FRC_ON1[ ] is 1, REG6 and REG7 are disabled by I2C REG1 is on. REG2,REG3,REG4,REG5, REG6 and REG7 are off 150A ALL OFF PWRHLD is de-asserted, nHIB is asserted, REG6 and REG7 are disabled by I 2C REG1, REG2, REG3, REG4, REG5, REG6 and REG7 are all off <18A Innovative PowerTM - 28 Active-Semi ProprietaryFor Authorized Recipients and Customers ActivePMUTM and ActivePathTM are trademarks of Active-Semi. I2CTM is a trademark of NXP. www.active-semi.com Copyright (c) 2011 Active-Semi, Inc. ACT8938 (R) Rev 3, 23-Dec-11 Table 4: ACT8938 Signal Interface with Marvell Aspen ACT8938 DIRECTION MARVELL ASPEN SCL PWR_SCL SDA PWR_SDA VSEL DVS_GPIO nRSTO RESET_IN_N nIRQ EXT_WAKEUP nPBSTAT EXT_WAKEUP PWRHLD GPIO nHIB GPIO 1: Optional connection for DVS control. 2, : External wake up/interrupt signal used to wake up the processor from system idle mode. , : Optional connection for shut down control. Table 5: Control Pins PIN NAME OUTPUT nPBIN REG1, REG2, REG3, REG4, REG5 PWRHLD REG1 nHIB REG2, REG3, REG4, REG5 Control Signals Manual Reset Function Enable Inputs The ACT8938 features a variety of control inputs, which are used to enable and disable outputs depending upon the desired mode of operation. nHIB, PWRHLD are logic inputs, while nPBIN is a unique, multi-function input. Refer to Table 5 for a description of which channels are controlled by each input. nPBIN Multi-Function Input ACT8938 features the nPBIN multi-function pin, which combines system enable/disable control with a hardware reset function. Select either of the two pin functions by asserting this pin, either through a direct connection to GA, or through a 50k resistor to GA, as shown in Figure 2. Figure 2: The second major function of the nPBIN input is to provide a manual-reset input for the processor. To manually-reset the processor, drive nPBIN directly to GA through a low impedance (less than 2.5k). When this occurs, nRSTO immediately asserts low, then remains asserted low until the nPBIN input is de-asserted and the reset time-out period expires. nPBSTAT Output nPBSTAT is an open-drain output that reflects the state of the nPBIN input; nPBSTAT is asserted low whenever nPBIN is asserted, and is high-Z otherwise. This output is typically used as an interrupt signal to the processor, to initiate a software-programmable routine such as operating mode selection or to open a menu. Connect nPBSTAT to an appropriate supply voltage (typically OUT2) through a 10k or greater resistor. nRSTO Output nPBIN Input nRSTO is an open-drain output which asserts low upon startup or when manual reset is asserted via the nPBIN input. When asserted on startup, nRSTO remains low until reset time-out period expires after OUT2 reaches its power-OK threshold. When asserted due to manual-reset, nRSTO immediately asserts low, then remains asserted low until the nPBIN input is de-asserted and the reset time-out period expires. Innovative PowerTM - 29 Active-Semi ProprietaryFor Authorized Recipients and Customers ActivePMUTM and ActivePathTM are trademarks of Active-Semi. I2CTM is a trademark of NXP. www.active-semi.com Copyright (c) 2011 Active-Semi, Inc. ACT8938 (R) Rev 3, 23-Dec-11 Connect a 10k or greater pull-up resistor from nRSTO to an appropriate voltage supply (typically OUT2). nIRQ Output nIRQ is an open-drain output that asserts low any time an interrupt is generated. Connect a 10k or greater pull-up resistor from nIRQ to an appropriate voltage supply. nIRQ is typically used to drive the interrupt input of the system processor. Many of the ACT8938's functions support interruptgeneration as a result of various conditions. These are typically masked by default, but may be unmasked via the I2C interface. For more information about the available fault conditions, refer to the appropriate sections of this datasheet. Note that under some conditions a false interrupt may be generated upon initial startup. For this reason, it is recommended that the interrupt service routine check and validate nSYSLEVMSK[-] and nFLTMSK[-] bits before processing an interrupt generated by these bits. These interrupts may be validated by nSYSSTAT[-], OK[-] bits. Push-Button Control The ACT8938 is designed to initiate a system enable sequence when the nPBIN multi-function input is asserted. Once this occurs, a power-on sequence commences, as described below. The power-on sequence must complete and the microprocessor must take control (by asserting PWRHLD and de-asserting nHIB) before nPBIN is de-asserted. If the microprocessor is unable to complete its power-up routine successfully before the user releases the push-button, the ACT8938 automatically shuts the system down. This provides protection against accidental or momentary assertions of the push-button. If desired, longer "push-and-hold" times can be implemented by simply adding an additional time delay before asserting PWRHLD and de-asserting nHIB. Control Sequences The ACT8938 features a variety of control sequences that are optimized for supporting system enable and disable, as well as Hibernate mode of the Aspen processors. Enable Sequence A typical enable sequence initiates as a result of asserting nPBIN, and begins by enabling REG2, REG4, REG3, REG1 and REG5. When REG2 : Typical value shown, reaches its power-OK threshold, REG4 is enabled and nRSTO is asserted low, resetting the microprocessor. REG3 is enabled when REG2 reaches its power-OK threshold for 2ms . REG1 is enabled when REG2 reaches its power-OK threshold for 4ms . REG5 is enabled when REG2 reaches its power-OK threshold for 8ms . If REG2 is above its power-OK threshold when the reset timer expires, nRSTO is de-asserted, allowing the microprocessor to begin its boot sequence. During the boot sequence, the processor should read the HBRDY[ ] bit; if the value of HBRDY[ ] is 0 then the software should proceed with a typical enable sequence, whereas if the value of HBRDY[ ] is 1 then the software should proceed with a "wake from Hibernate Mode" routine. See the Hibernate Mode Sequence section for more information. During the boot sequence, the microprocessor must assert PWRHLD, holding REG1, and set nHIB to a logic high, holding REG2, REG3, REG4 and REG5 to ensure that the system remains powered after nPBIN is released. REG6 and REG7 should be enabled/disabled via I2C after microprocessor completes its boot sequence. Once the power-up routine is completed, the system remains enabled after the push-button is released as long as PWRHLD is asserted and nHIB is de-asserted. If the processor does not assert PWRHLD or de-assert nHIB to logic high before the user releases the push-button, the boot-up sequence is terminated and all regulators are disabled. This provides protection against "falseenable", when the push-button is accidentally depressed, and also ensures that the system remains enabled only if the processor successfully completes the boot-up sequence. Hibernate Mode Sequence The ACT8938 supports Hibernate mode of operation for Aspen processor. Once a successful power-up routine is completed, Hibernate mode may be initiated through a variety of softwarecontrolled mechanisms. Hibernate mode is typically initiated when the user presses the push-button during normal operation. Pressing the push-button asserts the nPBIN input, which asserts the nPBSTAT output to interrupt the processor. In response to this interrupt the processor should first set the FRC_ON1[ ] bit to 1, and the HBRDY[ ] bit to 1. Then the processor should assert nHIB to logic low, disabling REG2, REG3, REG4, REG5. Waking from Hibernate mode is initiated when the actual delay time may vary from (T-1ms) x 88% to T x 112%, where T is the typical delay time setting. Innovative PowerTM - 30 Active-Semi ProprietaryFor Authorized Recipients and Customers ActivePMUTM and ActivePathTM are trademarks of Active-Semi. I2CTM is a trademark of NXP. www.active-semi.com Copyright (c) 2011 Active-Semi, Inc. ACT8938 (R) Rev 3, 23-Dec-11 user presses the push-button again. Asserting nPBIN enables REG2, REG3, REG4 and REG5. Once REG2 reaches regulation, REG3 is enabled and the nRSTO timer begins. Once the reset timer period expires the nRSTO output is deasserted and the processor initiates a boot-up sequence, during which it should determine the system status by reading the HBRDY[ ] bit; if the value of HBRDY[ ] is 0 then the software should proceed with a typical enable sequence, whereas if the value of HBRDY[ ] is 1 then the software should proceed with a "wake from Hibernate Mode" routine. To complete the wake process, the processor should assert PWRHLD, holding REG1, and de-assert nHIB to logic high, holding REG2, REG3, REG4 and REG5 to ensure that the system remains enabled after the push-button is released then set FRC_ON1[ ] and HBRDY[ ] to 0 to complete a full wake-up routine. Disable Sequence As with the enable sequence, a typical disable sequence is initiated when the user presses the push-button, which interrupts the processor via the nPBSTAT output. The actual disable sequence is completely software-controlled, but typically involved initiating various "clean-up" processes before finally de-assert PWRHLD and assert nHIB to logic low, disabling all regulators and shutting the system down. It is important that FRC_ON1[ ] is clear to 0 prior to shutting down the system, otherwise REG1 will remain ON. Figure 3: Enable Sequence Innovative PowerTM - 31 Active-Semi ProprietaryFor Authorized Recipients and Customers ActivePMUTM and ActivePathTM are trademarks of Active-Semi. I2CTM is a trademark of NXP. www.active-semi.com Copyright (c) 2011 Active-Semi, Inc. (R) ACT8938 Rev 3, 23-Dec-11 Figure 4: Hibernate Mode Sequence Figure 5: Disable Sequence Innovative PowerTM - 32 Active-Semi ProprietaryFor Authorized Recipients and Customers ActivePMUTM and ActivePathTM are trademarks of Active-Semi. I2CTM is a trademark of NXP. www.active-semi.com Copyright (c) 2011 Active-Semi, Inc. ACT8938 (R) Rev 3, 23-Dec-11 FUNCTIONAL DESCRIPTION I2C Interface below the SYSLEV[-] voltage threshold: The ACT8938 features an I2C interface that allows advanced programming capability to enhance overall system performance. To ensure compatibility with a wide range of system processors, the I2C interface supports clock speeds of up to 400kHz ("Fast-Mode" operation) and uses standard I2C commands. I2C write-byte commands are used to program the ACT8938, and I2C read-byte commands are used to read the ACT8938's internal registers. The ACT8938 always operates as a slave device, and is addressed using a 7-bit slave address followed by an eighth bit, which indicates whether the transaction is a readoperation or a write-operation, [1011011x]. 1) If nSYSMODE[-] = 1 (default case), when system vo l ta g e l e ve l i n te r r u p t is unmasked (nSYSLEVMSK[ ]=1) and VVSYS falls below the programmable threshold, the ACT8938 asserts nIRQ, providing a software "under-voltage alarm". The response to this interrupt is controlled by the CPU, but will typically initiate a controlled shutdown sequence either or alert the user that the battery is low. In this case the interrupt is cleared when VVSYS rises up again above the SYSLEV rising threshold and nSYSSTAT[-] is read via I2C. SDA is a bi-directional data line and SCL is a clock input. The master device initiates a transaction by issuing a START condition, defined by SDA transitioning from high to low while SCL is high. Data is transferred in 8-bit packets, beginning with the MSB, and is clocked-in on the rising edge of SCL. Each packet of data is followed by an "Acknowledge" (ACK) bit, used to confirm that the data was transmitted successfully. For more information regarding the I2C 2-wire serial interface, go to the NXP website: http://www.nxp.com. Voltage Monitor and Interrupt Programmable System Voltage Monitor The ACT8938 features a programmable systemvoltage monitor, which monitors the voltage at VSYS and compares it to a programmable threshold voltage. The programmable voltage threshold is programmed by SYSLEV[3:0], as shown in Table 6. SYSLEV[ ] is set to 3.0V by default. There is a 200mV rising hysteresis on SYSLEV[ ] threshold such that VVSYS needs to be 3.2V(typ) or higher in order to power up the IC. The nSYSSTAT[-] bit reflects the output of an internal voltage comparator that monitors VVSYS relative to the SYSLEV[-] voltage threshold, the value of nSYSTAT[-] = 1 when VVSYS is lower than the SYSLEV[-] voltage threshold, and nSYSTAT[-] = 0 when VVSYS is higher than the SYSLEV[-] voltage threshold. Note that the SYSLEV[-] voltage threshold is defined for falling voltages, and that the comparator produces about 200mV of hysteresis at VSYS. As a result, once VVSYS falls below the SYSLEV threshold, its voltage must increase by more than about 200mV to clear that condition. After the IC is powered up, the ACT8938 responds in one of two ways when the voltage at VSYS falls 2) If nSYSMODE[-] = 0, when VVSYS falls below the programmable threshold the ACT8938 shuts down, immediately disabling all regulators. This option is useful for implementing a programmable "undervoltage lockout" function that forces the system off when the battery voltage falls below the SYSLEV threshold voltage. Since this option does not support a controlled shutdown sequence, it is generally used as a "fail-safe" to shut the system down when the battery voltage is too low. Table 6: SYSLEV Falling Threshold SYSLEV[3:0] 0000 0001 0010 0011 0100 0101 0110 0111 1000 1001 1010 1011 1100 1101 1110 1111 Precision Voltage Detector The LBI input connects to one input of a precision voltage comparator, which can be used to monitor a system voltage such as the battery voltage. An external resistive-divider network can be used to set voltage monitoring thresholds, as shown in Functional Block Diagram. The output of the comparator is present at the nLBO open-drain output. Innovative PowerTM - 33 Active-Semi ProprietaryFor Authorized Recipients and Customers ActivePMUTM and ActivePathTM are trademarks of Active-Semi. I2CTM is a trademark of NXP. SYSLEV Falling Threshold (Hysteresis = 200mV) 2.3 2.4 2.5 2.6 2.7 2.8 2.9 3.0 3.1 3.2 3.3 3.4 3.5 3.6 3.7 3.8 www.active-semi.com Copyright (c) 2011 Active-Semi, Inc. (R) ACT8938 Rev 3, 23-Dec-11 Thermal Shutdown The ACT8938 integrates thermal shutdown protection circuitry to prevent damage resulting from excessive thermal stress, as may be encountered fault conditions. This circuitry disables all regulators if the ACT8938 die temperature exceeds 160C, and prevents the regulators from being enabled until the IC temperature drops by 20C (typ). Innovative PowerTM - 34 Active-Semi ProprietaryFor Authorized Recipients and Customers ActivePMUTM and ActivePathTM are trademarks of Active-Semi. I2CTM is a trademark of NXP. www.active-semi.com Copyright (c) 2011 Active-Semi, Inc. ACT8938 (R) Rev 3, 23-Dec-11 STEP-DOWN DC/DC REGULATORS General Description The ACT8938 features three synchronous, fixedfrequency, current-mode PWM step down converters that achieve peak efficiencies of up to 97%. REG1 and REG2 are capable of supplying up to 1150mA of output current, while REG3 supports up to 1300mA. These regulators operate with a fixed frequency of 2MHz, minimizing noise in sensitive applications and allowing the use of small external components. 100% Duty Cycle Operation Each regulator is capable of operating at up to 100% duty cycle. During 100% duty-cycle operation, the high-side power MOSFET is held on continuously, providing a direct connection from the input to the output (through the inductor), ensuring the lowest possible dropout voltage in battery powered applications. Synchronous Rectification REG1, REG2, and REG3 each feature integrated nchannel synchronous rectifiers, maximizing efficiency and minimizing the total solution size and cost by eliminating the need for external rectifiers. Soft-Start When enabled, each output voltages tracks an internal 400s soft-start ramp, minimizing input current during startup and allowing each regulator to power up in a smooth, monotonic manner that is independent of output load conditions. Compensation Each buck regulator utilizes current-mode control and a proprietary internal compensation scheme to simultaneously simplify external component selection and optimize transient performance over its full operating range. No compensation design is required; simply follow a few simple guidelines described below when choosing external components. Input Capacitor Selection The input capacitor reduces peak currents and noise induced upon the voltage source. A 4.7F ceramic capacitor is recommended for each regulator in most applications. Output Capacitor Selection For most applications, 22F ceramic output capacitors are recommended for REG1, REG2 and REG3. Despite the advantages of ceramic capacitors, care must be taken during the design process to ensure stable operation over the full operating voltage and temperature range. Ceramic capacitors are available in a variety of dielectrics, each of which exhibits different characteristics that can greatly affect performance over their temperature and voltage ranges. Two of the most common dielectrics are Y5V and X5R. Whereas Y5V dielectrics are inexpensive and can provide high capacitance in small packages, their capacitance varies greatly over their voltage and temperature ranges and are not recommended for DC/DC applications. X5R and X7R dielectrics are more suitable for output capacitor applications, as their characteristics are more stable over their operating ranges, and are highly recommended. Inductor Selection REG1, REG2, and REG3 utilize current-mode control and a proprietary internal compensation scheme to simultaneously simplify external component selection and optimize transient performance over their full operating range. These devices were optimized for operation with 2.2H inductors, although inductors in the 1.5H to 3.3H range can be used. Choose an inductor with a low DC-resistance, and avoid inductor saturation by choosing inductors with DC ratings that exceed the maximum output current by at least 30%. Configuration Options Output Voltage Programming By default, each regulator powers up and regulates to its default output voltage. Output voltage is selectable by setting VSEL pin that when VSEL is low, output voltage is programmed by VSET1[-] bits, and when VSEL is high, output voltage is programmed by VSET2[-] bits. However, once the system is enabled, each regulator's output voltage may be independently programmed to a different value, typically in order to minimize the power consumption of the microprocessor during some operating modes. Program the output voltages via the I2C serial interface by writing to the regulator's VSET1[-] register if VSEL is low or VSET2[-] register if VSEL is high as shown in Table 7. Enable / Disable Control During normal operation, each buck may be enabled or disabled via the I2C interface by writing to that regulator's ON[ ] bit. The regulator accept rising or falling edge of ON[ ] bit as on/off signal. To enable the regulator, clear ON[ ] to 0 first then set to 1. To disable the regulator, set ON[ ] to 1 first then clear it to 0. Innovative PowerTM - 35 Active-Semi ProprietaryFor Authorized Recipients and Customers ActivePMUTM and ActivePathTM are trademarks of Active-Semi. I2CTM is a trademark of NXP. www.active-semi.com Copyright (c) 2011 Active-Semi, Inc. ACT8938 (R) Rev 3, 23-Dec-11 REG1, REG2, REG3 Turn-On Delay Each of REG1, REG2 and REG3 features a programmable Turn-On Delay which help ensure a reliable qualification. This delay is programmed by DELAY[2:0], as shown in Table 8. Operating Mode By default, REG1, REG2, and REG3 each operate in fixed-frequency PWM mode at medium to heavy loads, while automatically transitioning to a proprietary power-saving mode at light loads in order to maximize standby battery life. In applications where low noise is critical, force fixedfrequency PWM operation across the entire load current range, at the expense of light-load efficiency, by setting the MODE[ ] bit to 1. OK[ ] and Output Fault Interrupt Each DC/DC features a power-OK status bit that can be read by the system microprocessor via the I2C interface. If an output voltage is lower than the power-OK threshold, typically 7% below the programmed regulation voltage, that regulator's OK[ ] bit will be 0. If a DC/DC's nFLTMSK[-] bit is set to 1, the ACT8938 will interrupt the processor if that DC/DC's output voltage falls below the power-OK threshold. In this case, nIRQ will assert low and remain asserted until either the regulator is turned off or back in regulation, and the OK[ ] bit has been read via I2C. PCB Layout Considerations High switching frequencies and large peak currents make PC board layout an important part of stepdown DC/DC converter design. A good design minimizes excessive EMI on the feedback paths and voltage gradients in the ground plane, both of which can result in instability or regulation errors. Step-down DC/DCs exhibit discontinuous input current, so the input capacitors should be placed as close as possible to the IC, and avoiding the use of via if possible. The inductor, input filter capacitor, and output filter capacitor should be connected as close together as possible, with short, direct, and wide traces. The ground nodes for each regulator's power loop should be connected at a single point in a star-ground configuration, and this point should be connected to the backside ground plane with multiple via. The output node for each regulator should be connected to its corresponding OUTx pin through the shortest possible route, while keeping sufficient distance from switching nodes to prevent noise injection. Finally, the exposed pad should be directly connected to the backside ground plane using multiple via to achieve low electrical and thermal resistance. Table 7: REGx/VSET[ ] Output Voltage Setting REGx/VSET[2:0] REGx/VSET[5:3] 000 001 010 011 100 101 110 111 000 0.600 0.800 1.000 1.200 1.600 2.000 2.400 3.200 001 0.625 0.825 1.025 1.250 1.650 2.050 2.500 3.300 010 0.650 0.850 1.050 1.300 1.700 2.100 2.600 3.400 011 0.675 0.875 1.075 1.350 1.750 2.150 2.700 3.500 100 0.700 0.900 1.100 1.400 1.800 2.200 2.800 3.600 101 0.725 0.925 1.125 1.450 1.850 2.250 2.900 3.700 110 0.750 0.950 1.150 1.500 1.900 2.300 3.000 3.800 111 0.775 0.975 1.175 1.550 1.950 2.350 3.100 3.900 Innovative PowerTM - 36 Active-Semi ProprietaryFor Authorized Recipients and Customers ActivePMUTM and ActivePathTM are trademarks of Active-Semi. I2CTM is a trademark of NXP. www.active-semi.com Copyright (c) 2011 Active-Semi, Inc. ACT8938 (R) Rev 3, 23-Dec-11 LOW-NOISE, LOW-DROPOUT LINEAR REGULATORS General Description REG4, REG5, REG6, and REG7 are low-noise, low-dropout linear regulators (LDOs) that supply up to 150mA, 150mA, 320mA, and 320mA, respectively. Each LDO has been optimized to achieve low noise and high-PSRR, achieving more than 65dB PSRR at frequencies up to 10kHz. Output Current Limit Each LDO contains current-limit circuitry featuring a current-limit fold-back function. During normal and moderate overload conditions, the regulators can support more than their rated output currents. During extreme overload conditions, however, the current limit is reduced by approximately 30%, reducing power dissipation within the IC. Compensation to that LDO's ON[ ] bit. The regulator accept rising or falling edge of ON[ ] bit as on/off signal. To enable the regulator, clear ON[ ] to 0 first then set to 1. To disable the regulator, set ON[ ] to 1 first then clear it to 0. REG4, REG5, REG6, REG7 Turn-on Delay Each of REG4, REG5, REG6 and REG7 features a programmable Turn-on Delay which help ensure a reliable qualification. This delay is programmed by DELAY[2:0], as shown in Table 8. Table 8: REGx/DELAY[ ] Turn-On Delay DELAY[2] DELAY[1] DELAY[0] TURN-ON DELAY 0 0 0 0 ms 0 0 1 2 ms 0 1 0 4 ms The LDOs are internally compensated and require very little design effort, simply select input and output capacitors according to the guidelines below. 0 1 1 8 ms 1 0 0 16 ms 1 0 1 32 ms Input Capacitor Selection 1 1 0 64 ms Each LDO requires a small ceramic input capacitor to supply current to support fast transients at the input of the LDO. Bypassing each INL pin to GA with 1F. High quality ceramic capacitors such as X7R and X5R dielectric types are strongly recommended. 1 1 1 128 ms Output Capacitor Selection Each LDO requires a small ceramic output capacitor for stability. Capacitance value is 1.5F for REG4 and REG5, 3.3F for REG6 and REG7. For best performance, each output capacitor should be connected directly between the output and GA pins, as close to the output as possible, and with a short, direct connection. High quality ceramic capacitors such as X7R and X5R dielectric types are strongly recommended. Configuration Options Output Voltage Programming By default, each LDO powers up and regulates to its default output voltage. Once the system is enabled, each output voltage may be independently programmed to a different value by writing to the regulator's VSET[-] register via the I2C serial interface as shown in Table 7. Enable / Disable Control During normal operation, each LDO may be enabled or disabled via the I2C interface by writing Output Discharge Each of the ACT8938's LDOs features an optional output discharge function, which discharges the output to ground through a 1.5k resistance when the LDO is disabled. This feature may be enabled or disabled by setting DIS[-]; set DIS[-] to 1 to enable this function, clear DIS[-] to 0 to disable it. Low-Power Mode Each of ACT8938's LDOs features a LOWIQ[-] bit which, when set to 1, reduces the LDO's quiescent current by about 16%, saving power and extending battery lifetime. OK[ ] and Output Fault Interrupt Each LDO features a power-OK status bit that be read by the system microprocessor via interface. If an output voltage is lower than power-OK threshold, typically 11% below programmed regulation voltage, the value of regulator's OK[-] bit will be 0. If a LDO's nFLTMSK[-] bit is set to 1, the ACT8938 will interrupt the processor if that LDO's output voltage falls below the power-OK threshold. In this case, nIRQ will assert low and remain asserted until either the regulation is turned off or back in regulation, and the OK[-] bit has been read via I2C. Innovative PowerTM - 37 Active-Semi ProprietaryFor Authorized Recipients and Customers ActivePMUTM and ActivePathTM are trademarks of Active-Semi. I2CTM is a trademark of NXP. can the the the that www.active-semi.com Copyright (c) 2011 Active-Semi, Inc. (R) ACT8938 Rev 3, 23-Dec-11 PCB Layout Considerations The ACT8938's LDOs provide good DC, AC, and noise performance over a wide range of operating conditions, and are relatively insensitive to layout considerations. When designing a PCB, however, careful layout is necessary to prevent other circuitry from degrading LDO performance. A good design places input and output capacitors as close to the LDO inputs and output as possible, and utilizes a star-ground configuration for all regulators to prevent noise-coupling through ground. Output traces should be routed to avoid close proximity to noisy nodes, particularly the SW nodes of the DC/DCs. REFBP is a noise-filtered reference, and internally has a direct connection to the linear regulator controller. Any noise injected into REFBP will directly affect the outputs of the linear regulators, and therefore special care should be taken to ensure that no noise is injected to the outputs via REFBP. As with the LDO output capacitors, the REFBP bypass capacitor should be placed as close to the IC as possible, with short, direct connections to the star-ground. Avoid the use of via whenever possible. Noisy nodes, such as from the DC/DCs, should be routed as far away from REFBP as possible. Innovative PowerTM - 38 Active-Semi ProprietaryFor Authorized Recipients and Customers ActivePMUTM and ActivePathTM are trademarks of Active-Semi. I2CTM is a trademark of NXP. www.active-semi.com Copyright (c) 2011 Active-Semi, Inc. ACT8938 (R) Rev 3, 23-Dec-11 ActivePathTM CHARGER General Description The ACT8938 features an advanced battery charger that incorporates the patent-pending ActivePath architecture for system power selection. This combination of circuits provides a complete, advanced battery-management system that automatically selects the best available input supply, manages charge current to ensure system power availability, and provides a complete, highaccuracy (0.5%), thermally regulated, full-featured single-cell linear Li+ charger that can withstand input voltages of up to 12V. In an input over-voltage condition this circuit limits VVSYS to 4.6V, protecting any circuitry connected to VSYS from the over-voltage condition, which may exceed this circuitry's voltage capability. This circuit is capable of withstanding input voltages of up to 12V. Table 9: Input Over-Voltage Protection Setting OVPSET[1] OVPSET[0] OVP THRESHOLD 0 0 6.6V 0 1 7.0V ActivePath Architecture 1 0 7.5V The ActivePath architecture important functions: 1 1 8.0V performs three 1) System Configuration Optimization 2) Input Protection 3) Battery-Management System Configuration Optimization The ActivePath circuitry monitors the state of the input supply, the battery, and the system, and automatically reconfigures itself to optimize the power system. If a valid input supply is present, ActivePath powers the system from the input while charging the battery in parallel. This allows the battery to charge as quickly as possible, while supplying the system. If a valid input supply is not present, ActivePath powers the system from the battery. Finally, if the input is present and the system current requirement exceeds the capability of the input supply, ActivePath allows system power to be drawn from both the battery and the input supply. Input Protection Input Over-Voltage Protection The ActivePath circuitry features input over-voltage protection circuitry. This circuitry disables charging when the input voltage exceeds the voltage set by OVPSET[-] as shown in Table 9, but stands off the input voltage in order to protect the system. Note that the adjustable OVP threshold is intended to provide the charge cycle with adjustable immunity against upward voltage transients on the input, and is not intended to allow continuous charging with input voltages above the charger's normal operating voltage range. Independent of the OVPSET[-] setting, the charge cycle is not allowed to resume until the input voltage falls back into the charger's normal operating voltage range (i.e. below 6.0V). Input Supply Overload Protection The ActivePath circuitry monitors and limits the total current drawn from the input supply to a value set by the ACIN and CHGLEV inputs, as well as the resistor connected to ISET. Drive ACIN to a logiclow for "USB Mode", which limits the input current to either 100mA, when CHGLEV is driven to a logiclow, or 450mA, when CHGLEV is driven to a logichigh. Drive ACIN to a logic-high for "AC-Mode", which limits the input current to 2A, typically. Input Under Voltage Lockout If the input voltage applied to CHGIN falls below 3.5V (typ), an input under-voltage condition is detected and the charger is disabled. Once an input under-voltage condition is detected, a new charge cycle will initiate when the input exceeds the undervoltage threshold by at least 500mV. Battery Management The ACT8938 features a full-featured, intelligent charger for Lithium-based cells, and was designed specifically to provide a complete charging solution with minimum system design effort. The core of the charger is a CC/CV (ConstantCurrent/Constant-Voltage), linear-mode charge controller. This controller incorporates current and voltage sense circuitry, an internal 70m power MOSFET, thermal-regulation circuitry, a fullfeatured state machine that implements charge control and safety features, and circuitry that eliminates the reverse blocking diode required by conventional charger designs. The charge termination voltage is highly accurate (0.5%), and features a selection of charge safety time-out periods that protect the system from operation with damaged cells. Other features Innovative PowerTM - 39 Active-Semi ProprietaryFor Authorized Recipients and Customers ActivePMUTM and ActivePathTM are trademarks of Active-Semi. I2CTM is a trademark of NXP. www.active-semi.com Copyright (c) 2011 Active-Semi, Inc. ACT8938 (R) Rev 3, 23-Dec-11 include pin-programmable fast-charge current and one current-limited nSTAT output that can directly drive LED indicator or provide a logic-level status signal to the host microprocessor. a logic-high, or 100mA, if CHGLEV is driven to a logic-low. Dynamic Charge Current Control (DCCC) Note that the actual charge current may be limited to a current lower than the programmed fast charge current due to the ACT8938's internal thermal regulation loop. See the Thermal Regulation section for more information. The ACT8938's ActivePath charger features dynamic charge current control (DCCC) circuitry, which acts to ensure that the system remains powered while operating within the maximum output capability of the power adapter. The DCCC circuitry continuously monitors VVSYS, and if the voltage at VSYS drops by more than 200mV, the DCCC circuitry automatically reduces charge current in order to prevent VVSYS from continuing to drop. Charge Current Programming The ACT8938's ActivePath charger features a flexible charge current-programming scheme that combines the convenience of internal charge current programming with the flexibility of resistor based charge current programming. Current limits and charge current programming are managed as a function of the ACIN and CHGLEV pins, in combination with RISET, the resistance connected to the ISET pin. ACIN is a logic input that configures the current-limit of ActivePath's linear regulator as well as that of the battery charger. ACIN features a precise 1.2V logic threshold, so that the input voltage detection threshold may be adjusted with a simple resistive voltage divider. This input also allows a simple, lowcost dual-input charger switch to be implemented with just a few, low-cost components. When the voltage at ACIN is above the 1.2V threshold, the charger operates in "AC-Mode" with a charge current programmed by RISET, and the RISET is given by: RISET (k) = 2336 x (1V/ICHG (mA)) - 0.205 With a given RISET then charge current will reduce 5 times when CHGLEV is driven low. When ACIN is below the 1.2V threshold, the charger operates in "USB-Mode", with a maximum CHGIN input current and charge current defined by the CHGLEV input; 450mA, if CHGLEV is driven to The ACT8938's charge summarized in Table 10. current settings are Charger Input Interrupts In order to ease input supply detection and eliminate the size and cost of external detection circuitry, the charger has the ability to generate interrupts based upon the status of the input supply. This function is capable of generating an interrupt when the input is connected, disconnected, or both. An interrupt is generated any time the input supply is connected when INSTAT[ ] bit is set to 1 and the INCON[-] bit is set to 1, and an interrupt is generated any time the input supply is disconnected when INSTAT[ ] bit is set to 1 and the INDIS[ ] bit is set to 1. INDAT[-] indicates the status of the CHGIN input supply. A value of 1 indicates that a valid CHGIN input (CHGIN UVLO Threshold<VCHGIN<CHGIN OVP Threshold) is present, a value of 0 indicates a valid input is not present. When an interrupt is generated by the input supply, reading the INSTAT[ ] returns a value of 1. INSTAT [ ] is automatically cleared to 0 upon reading. When no interrupt is generated by the input supply, reading the INSTAT[ ] returns a value of 0. When responding to an Input Status Interrupt, it is often useful to know the state of the ACIN input. For example, in a dual-input charger application knowing the state of the ACIN input can identify which type of input supply has been connected. The state of the ACIN input can be read at any time by reading the ACINSTAT[-] bit, where a value of 1 indicates that the voltage at ACIN is above the 1.2V threshold (indicating that a wall-cube has been attached), and a value of 0 indicates that the voltage is below this threshold (indicating that ACIN input is not valid and USB supply input is selected). Table 10: ACIN and CHGLEV Inputs ACIN CHGLEV CHARGE CURRENT (mA) PRECONDITION CHARGE CURRENT (mA) 0 0 90 45 0 1 450 45 1 0 ICHG/5 10% x ICHG 1 1 ICHG 10% x ICHG Innovative PowerTM - 40 Active-Semi ProprietaryFor Authorized Recipients and Customers ActivePMUTM and ActivePathTM are trademarks of Active-Semi. I2CTM is a trademark of NXP. www.active-semi.com Copyright (c) 2011 Active-Semi, Inc. ACT8938 (R) Rev 3, 23-Dec-11 Figure 6: Typical Li+ charge profile and ACT8938 charge states A: PRECONDITION State B: FAST-CHARGE State C: TOP-OFF State D: END-OF-CHARGE State Figure 7: Charger State Diagram TEMP NOT OK ANY STATE (VCHGIN < VBAT) OR (VCHGIN < VCHGIN UVLO) OR (VCHGIN > VOVP) OR (SUSCHG[ ] = 1) SUSPEND TEMP-FAULT (VCHGIN > VBAT) AND (VCHGIN > VCHGIN UVLO) AND (VCHGIN < VOVP) AND (SUSCHG[ ] = 0) TEMP OK PRECONDITION TIME-OUT-FAULT PRECONDITION Time-out Total Time-out (VBAT > 2.85V) AND (TQUAL = 32ms) FAST-CHARGE (VBAT = VTERM ) AND (TQUAL = 32ms) (VBAT < VTERM - 205mV ) AND (TQUAL = 32ms) TOP-OFF (IBAT < 10% x ICHG) OR (Total Time-out) AND (TQUAL = 32ms) END-OF-CHARGE Innovative PowerTM - 41 Active-Semi ProprietaryFor Authorized Recipients and Customers ActivePMUTM and ActivePathTM are trademarks of Active-Semi. I2CTM is a trademark of NXP. www.active-semi.com Copyright (c) 2011 Active-Semi, Inc. ACT8938 (R) Rev 3, 23-Dec-11 Charge-Control State Machine PRECONDITION State A new charging cycle begins with the PRECONDITION state, and operation continues in this state until VBAT exceeds the Precondition Threshold Voltage. When operating in PRECONDITION state, the cell is charged at 10% of the programmed maximum fast-charge constant current, ICHG. Once VBAT reaches the Precondition Threshold Voltage, the state machine jumps to the FASTCHARGE state. If VBAT does not reach the Precondition Threshold Voltage before the Precondition Time-out period expires, then the state machine jumps to the TIME-OUT-FAULT state in order to prevent charging a damaged cell. See the Charge Safety Timers section for more information. FAST-CHARGE State In the FAST-CHARGE state, the charger operates in constant-current (CC) mode and regulates the charge current to the current set by RISET . Charging continues in CC mode until VBAT reaches the charge termination voltage (VTERM), at which point the statemachine jumps to the TOP-OFF state. If VBAT does not reach VTERM before the total time out period expires then the state-machine will jump to the "EOC" state and will re-initiate a new charge cycle after 32ms "relax". See the Current Limits and Charge Current Programming sections for more information about setting the maximum charge current. TOP-OFF State In the TOP-OFF state, the cell charges in constantvoltage (CV) mode. In CV mode operation, the charger regulates its output voltage to the 4.20V charge termination voltage, and the charge current is naturally reduced as the cell approaches full charge. Charging continues until the charge current drops to END-OF-CHARGE current threshold, at which point the state machine jumps to the ENDOF-CHARGE (EOC) state. If the state-machine does not jump out of the TOPOFF state before the Total-Charge Time-out period expires, the state machine jumps to the EOC state and will re-initiate a new charge cycle if VBAT falls below termination voltage 205mV (typ). For more information about the charge safety timers, see the Charging Safety Times section. END-OF-CHARGE (EOC) State In the END-OF-CHARGE (EOC) state, the charger presents a high-impedance to the battery, minimizing battery current drain and allowing the cell to "relax". The charger continues to monitor the cell voltage, and re-initiates a charging sequence if the cell voltage drops to 205mV (typ) below the charge termination voltage. SUSPEND State The state-machine jumps to the SUSPEND state any time the battery is removed, and any time the input voltage either falls below the CHGIN UVLO threshold or exceeds the OVP threshold. Once none of these conditions are present, a new charge cycle initiates. A charging cycle may also be suspended manually by setting the SUSPEND[ ] bit. In this case, initiate a new charging sequence by clearing SUSPEND[ ] to 0. State Machine Interrupts The charger features the ability to generate interrupts when the charger state machine transitions, based upon the status of the CHG_ bits. Set CHGEOCIN[ ] bit to 1 and CHGSTAT[ ] bit to 1 to generate an interrupt when the charger state machine goes into the END-OF-CHARGE (EOC) state. Set CHGEOCOUT[ ] bit to 1 and CHGSTAT[ ] bit to 1 to generate an interrupt when the charger state machine exits the EOC state. CHGDAT[ ] indicates the status of the charger state machine. A value of 1 indicates that the charger state machine is in END-OF-CHARGE state, a value of 0 indicates the charger state machine is in other states. When an interrupt is generated by the charger state machine, reading the CHGSTAT[ ] returns a value of 1. CHGSTAT[ ] is automatically cleared to 0 upon reading. When no interrupt is generated by the charger state machine, reading the CHGSTAT[ ] returns a value of 0. For additional information about the charge cycle, CSTATE[0:1] may be read at any time via I2C to determine the current charging state. Table 11: Charging Status Indication CSTATE[0] CSTATE[1] 1 1 PRECONDITION State 1 0 FAST-CHARGE/ TOP-OFF State 0 1 END-OF-CHARGE State 0 0 SUSPEND/DISABLED/ FAULT State Innovative PowerTM - 42 Active-Semi ProprietaryFor Authorized Recipients and Customers ActivePMUTM and ActivePathTM are trademarks of Active-Semi. I2CTM is a trademark of NXP. STATE MACHINE STATUS www.active-semi.com Copyright (c) 2011 Active-Semi, Inc. ACT8938 (R) Rev 3, 23-Dec-11 Thermal Regulation Table 13: The charger features an internal thermal regulation loop that monitors die temperature and reduces charging current as needed to ensure that the die temperature does not exceed the thermal regulation threshold of 110C. This feature protects against excessive junction temperature and makes the device more accommodating to aggressive thermal designs. Note, however, that attention to good thermal designs is required to achieve the fastest possible charge time by maximizing charge current. Total Safety Timer Setting Charge Safety Timers Charge Status Indicator The charger features programmable charge safety timers which help ensure a safe charge by detecting potentially damaged cells. These timers are programmable via the PRETIMO[1:0] and TOTTIMO[1:0] bits, as shown in Table 12 and Table 13. Note that in order to account for reduced charge current resulting from DCCC operation, the charge time-out periods are extended proportionally to the reduction in charge current. As a result, the actual safety period may exceed the nominal timer period. The charger provides a charge-status indicator output, nSTAT. nSTAT is an open-drain output which sinks current when the charger is in an active-charging state, and is high-Z otherwise. nSTAT features an internal 8mA current limit, and is capable of directly driving a LED without the need of a current-limiting resistor or other external circuitry. To drive an LED, simply connect the LED between nSTAT pin and an appropriate supply, such as VSYS. For a logic-level charge status indication, simply connect a resistor from nSTAT to an appropriate voltage supply. Charger Timer Interrupts TOTTIMO[1] TOTTIMO[0] TOTAL TIME-OUT PERIOD 0 0 3 hrs 0 1 4 hrs 1 0 5 hrs 1 1 Disabled The charger features the ability to generate interrupts based upon the status of the charge timers. Set the TIMRPRE[ ] bit to 1 and TIMRSTAT[ ] bit to 1 to generate an interrupt when the Precondition Timer expires. Set the TIMRTOT[ ] bit to 1 and TIMRSTAT[ ] bit to 1 to generate an interrupt when the Total-Charge Timer expires. Table 14: Charging Status Indication TIMRDAT[ ] indicates the status of the charge timers. A value of 1 indicates a precondition timeout or a total charge time-out occurs, a value of 0 indicates other cases. When an interrupt is generated by the charge timers, reading the TIMRSTAT[ ] returns a value of 1. TIMRSTAT[ ] is automatically cleared to 0 upon reading. When no interrupt is generated by the charge timers, reading the TIMRSTAT[ ] returns a value of 0. Table 12: PRECONDITION Safety Timer Setting PRETIMO[1] PRETIMO[0] PRECONDITION TIME-OUT PERIOD 0 0 40 mins 0 1 60 mins 1 0 80 mins 1 1 Disabled STATE nSTAT PRECONDITION Active FAST-CHARGE Active TOP-OFF Active END-OF-CHARGE High-Z SUSPEND High-Z TEMPERATURE FAULT High-Z TIME-OUT-FAULT High-Z Reverse-Current Protection The charger includes internal reverse-current protection circuitry that eliminates the need for blocking diodes, reducing solution size and cost as well as dropout voltage relative to conventional battery chargers. When the voltage at CHGIN falls below VBAT, the charger automatically reconfigures its power switch to minimize current drawn from the battery. Battery Temperature Monitoring In a typical application, the TH pin is connected to the battery pack's thermistor input, as shown in Figure 8. The charger continuously monitors the temperature of the battery pack by injecting a Innovative PowerTM - 43 Active-Semi ProprietaryFor Authorized Recipients and Customers ActivePMUTM and ActivePathTM are trademarks of Active-Semi. I2CTM is a trademark of NXP. www.active-semi.com Copyright (c) 2011 Active-Semi, Inc. ACT8938 (R) Rev 3, 23-Dec-11 102A (typ) current into the thermistor (via the TH pin) and sensing the voltage at TH. The voltage at TH is continuously monitored, and charging is suspended if the voltage at TH exceeds either of the internal VTHH and VTHL thresholds of 0.5V and 2.51V, respectively. Figure 8: Simple Configuration The net resistance (from TH to GA) required to cross the thresholds are given by: 102A x RNOM x kHOT = 0.5V RNOM x kHOT 5k 102A x RNOM x kCOLD = 2.51V RNOM x kCOLD 25k where RNOM is the nominal thermistor resistance at room temperature, and kHOT and kCOLD represent the ratios of the thermistor's resistance at the desired hot and cold thresholds, respectively, to the resistance at 25C. Battery Temperature Interrupts In order to ease detecting the status of the battery temperature, the charger features the ability to generate interrupts based upon the status of the battery temperature. Set the TEMPOUT[ ] bit to 1 and TEMPSTAT[ ] bit to 1 to generate an interrupt when battery temperature goes out of the valid temperature range. Set the TEMPIN[ ] bit to 1 and TEMPSTAT[ ] bit to 1 to generate an interrupt when battery temperature returns to the valid range. TEMPDAT[ ] indicates the status of the battery temperature. A value of 1 indicates the battery temperature is inside of the valid range, a value of 0 indicates the battery is outside of the valid range. When an interrupt is generated by the battery temperature event, reading the TEMPSTAT[ ] returns a value of 1. TEMPSTAT[ ] is automatically cleared to 0 upon reading. When no interrupt is generated by the battery temperature event, reading the TEMPSTAT[ ] returns a value of 0. Innovative PowerTM - 44 Active-Semi ProprietaryFor Authorized Recipients and Customers ActivePMUTM and ActivePathTM are trademarks of Active-Semi. I2CTM is a trademark of NXP. www.active-semi.com Copyright (c) 2011 Active-Semi, Inc. ACT8938 (R) Rev 3, 23-Dec-11 TQFN55-40 PACKAGE OUTLINE AND DIMENSIONS SYMBOL A A1 DIMENSION IN MILLIMETERS DIMENSION IN INCHES MIN MAX MIN MAX 0.700 0.800 0.028 0.031 0.200 REF 0.008 REF A2 0.000 0.050 0.000 0.002 b 0.150 0.250 0.006 0.010 D 4.900 5.100 0.193 0.201 E 4.900 5.100 0.193 0.201 D2 3.450 3.750 0.136 0.148 E2 3.450 3.750 0.136 0.148 e L R 0.400 BSC 0.300 0.500 0.300 0.016 BSC 0.012 0.020 0.012 Active-Semi, Inc. reserves the right to modify the circuitry or specifications without notice. Users should evaluate each product to make sure that it is suitable for their applications. Active-Semi products are not intended or authorized for use as critical components in life-support devices or systems. Active-Semi, Inc. does not assume any liability arising out of the use of any product or circuit described in this datasheet, nor does it convey any patent license. Active-Semi and its logo are trademarks of Active-Semi, Inc. For more information on this and other products, contact sales@active-semi.com or visit http://www.active-semi.com. (R) is a registered trademark of Active-Semi. Innovative PowerTM - 45 Active-Semi ProprietaryFor Authorized Recipients and Customers ActivePMUTM and ActivePathTM are trademarks of Active-Semi. I2CTM is a trademark of NXP. www.active-semi.com Copyright (c) 2011 Active-Semi, Inc. Mouser Electronics Authorized Distributor Click to View Pricing, Inventory, Delivery & Lifecycle Information: Active-Semi: ACT8938