ACT8938 - Active-Semi - Datasheet.Live

- 1 - www.active-semi.com

ActivePMUTM and ActivePathTM are trademarks of Active-Semi.

I2CTM is a trademark of NXP.

Innovative PowerTM

Active-Semi Proprietary―For Authorized Recipients and Customers

Rev 3, 23-Dec-11

ACT8938

Advanced PMU for Marvell Aspen

FEATURES

• Optimized for Marvell Aspen Processors

• Three Step-Down DC/DC Converters

• Four Low-Dropout Linear Regulators

• Integrated ActivePathTM Charger

• I2CTM Serial Interface

• Advanced Enable/Disable Sequencing Controller

• Minimal External Components

• Tiny 5×5mm TQFN55-40 Package

− 0.75mm Package Height

− Pb-Free and RoHS Compliant

GENERAL DESCRIPTION

The ACT8938 is a complete, cost effective, highly

efficient ActivePMUTM power management solution,

optimized for the unique power, voltage

sequencing, and control requirements of the Marvell

Aspen processor.

This device features three step-down DC/DC

converters and four low-noise, low-dropout linear

regulators, along with a complete battery charging

solution featuring the advanced ActivePathTM

system-power selection function.

The three DC/DC converters utilize a high

efficiency, fixed-frequency (2MHz), current-mode

PWM control architecture that requires a minimum

number of external components. Two DC/DCs are

capable of supplying up to 1150mA of output

current, while the third supports up to 1300mA. All

four low-dropout linear regulators are high-

performance, low-noise regulators that supply up to

150mA, 150mA, 320mA and 320mA respectively.

The ACT8938 is available in a compact, Pb-Free

and RoHS-compliant TQFN55-40 package .

TYPICAL APPLICATION DIAGRAM

ctive-Semi

Marvell

Aspen

ACT8938

Rev 3, 23-Dec-11

- 2 - www.active-semi.com

ActivePMUTM and ActivePathTM are trademarks of Active-Semi.

I2CTM is a trademark of NXP.

Innovative PowerTM

Active-Semi Proprietary―For Authorized Recipients and Customers

TABLE OF CONTENTS

General Information ..................................................................................................................................... p. 01

Functional Block Diagram ............................................................................................................................ p. 03

Ordering Information .................................................................................................................................... p. 04

Pin Configuration ......................................................................................................................................... p. 04

Pin Descriptions ........................................................................................................................................... p. 05

Absolute Maximum Ratings ......................................................................................................................... p. 07

I2C Interface Electrical Characteristics ........................................................................................................ p. 08

Global Register Map .................................................................................................................................... p. 09

Register and Bit Descriptions ...................................................................................................................... p. 10

System Control Electrical Characteristics .................................................................................................... p. 15

Step-Down DC/DC Electrical Characteristics .............................................................................................. p. 16

Low-Noise LDO Electrical Characteristics ................................................................................................... p. 17

ActivePathTM Charger Electrical Characteristics .......................................................................................... p. 18

Typical Performance Characteristics ........................................................................................................... p. 20

System control information .......................................................................................................................... p. 28

Interfacing with the Marvell Aspen ................................................................................................... p. 28

Control Signals ................................................................................................................................. p. 29

Push-Button Control ......................................................................................................................... p. 30

Control Sequences ........................................................................................................................... p. 30

Functional Description ................................................................................................................................. p. 33

I2C Interface ..................................................................................................................................... p. 33

Voltage Monitor and Interrupt ........................................................................................................... p. 33

Thermal Shutdown ........................................................................................................................... p. 34

Step-own DC/DC Regulators ....................................................................................................................... p. 35

General Description .......................................................................................................................... p. 35

100% Duty Cycle Operation ............................................................................................................. p. 35

Synchronous Rectification ................................................................................................................ p. 35

Soft-Start .......................................................................................................................................... p. 35

Compensation .................................................................................................................................. p. 35

Configuration Options ....................................................................................................................... p. 35

OK[ ] and Output Fault Interrupt ....................................................................................................... p. 36

PCB Layout Considerations ............................................................................................................. p. 36

Low-Noise, Low-Dropout Linear Regulators ................................................................................................ p. 37

General Description .......................................................................................................................... p. 37

Output Current Limit ......................................................................................................................... p. 37

Compensation .................................................................................................................................. p. 37

Configuration Options ....................................................................................................................... p. 37

OK[ ] and Output Fault Interrupt ....................................................................................................... p. 37

PCB Layout Considerations ............................................................................................................. p. 38

ActivePathTM Charger .................................................................................................................................. p. 39

General Description .......................................................................................................................... p. 39

ActivePath Architecture .................................................................................................................... p. 39

System Configuration Optimization .................................................................................................. p. 39

Input Protection ................................................................................................................................ p. 39

Battery Management ........................................................................................................................ p. 39

Charge Current Programming .......................................................................................................... p. 40

Charge Input Interrupts .................................................................................................................... p. 40

Charge-Control State Machine ......................................................................................................... p. 42

State Machine Interrupts .................................................................................................................. p. 42

Thermal Regulation .......................................................................................................................... p. 43

Charge Safety Timers ...................................................................................................................... p. 43

Charge Timer Interrupts ................................................................................................................... p. 43

Charge Status Indicator.................................................................................................................... p. 43

Reverse-Current Protection ............................................................................................................. p. 43

Battery Temperature Monitoring ...................................................................................................... p. 43

Battery Temperature Interrupts ........................................................................................................ p. 44

TQFN55-40 Package Outline and Dimensions ........................................................................................... p. 45

ACT8938

Rev 3, 23-Dec-11

- 3 - www.active-semi.com

ActivePMUTM and ActivePathTM are trademarks of Active-Semi.

I2CTM is a trademark of NXP.

Innovative PowerTM

Active-Semi Proprietary―For Authorized Recipients and Customers

FUNCTIONAL BLOCK DIAGRAM

ctive-Sem i

REG6

LDO

REG7

LDO

ACT8938

Charge

Control

CHGIN

BAT

CURRENT SENSE

VOLTAGE SENSE

4.35V to 6V

AC Adaptor

USB

Li+Battery

BODY

SWITCH

SDA

ActivePath

Control

System Supply

VSYS

BODY

SWITCH

2.85V

PRE-

CONDITION

110°C

THERMAL

REGULATION

VP2

GP12

SW2

OUT2

VP1

GP12

SW1

OUT1

To VSYS

(Optional)

OUT7

OUT6

REG5

LDO OUT5

OUT7

OUT6

OUT5

System

Control

nIRQ

REG4

LDO OUT4

OUT4

INL

REFBP

Reference

ACIN

ISET

VP3

GP3

SW3

OUT3

CHGLEV

GA EP

nSTAT

CHARGE STATUS

VSYS

To VSYS

nPBSTAT

PWRHLD

nHIB

SCL

nRSTO

VSEL

nLBO

1.2V

LBI

VSYS

BAT

102µA

OUT2

nPBIN

PUSH BUTTON

VSYS

ACT8938

Rev 3, 23-Dec-11

- 4 - www.active-semi.com

ActivePMUTM and ActivePathTM are trademarks of Active-Semi.

I2CTM is a trademark of NXP.

Innovative PowerTM

Active-Semi Proprietary―For Authorized Recipients and Customers

PIN CONFIGURATION

TOP VIEW

Thin - QFN (TQFN55-40)

ORDERING INFORMATION

PART NUMBER VOUT1/VSTBY1

 VOUT2/VSTBY2 VOUT3/VSTBY3 VOUT4 VOUT5 VOUT6 VOUT7 PACKAGE PINS TEMPERATURE

RANGE

ACT8938QJ133-T 1.8V/1.8V 3.3V/3.3V 1.2V/1.1V 1.8V 3.3V 3.3V 3.3V TQFN55-40 40 -40°C to +85°C

ACT8938QJ131-T 1.8V/1.8V 3.3V/3.3V 1.1V/1.0V 1.8V 3.3V 3.3V 3.3V TQFN55-40 40 -40°C to +85°C

: All Active-Semi components are RoHS Compliant and with Pb-free plating unless otherwise specified.

: Standard product options are listed in this table. Contact factory for custom options. Minimum order quantity is 12,000 units.

: To select VSTBYx as the output regulation voltage for REGx, drive VSEL to logic high. VSTBYx can be set by software via I2C interface.

Refer to appropriate sections of this datasheet for VSTBYx setting.

ACT8938QJ_ _ _-T

Option Code

Pin Count

Package Code

Product Number

Active-Semi

Tape and Reel

REFBP

OUT1

OUT4

OUT5

INL

OUT7

OUT6

nPBIN

PWRHLD

BAT

nSTAT

SDA

SCL

VSEL

ISET

CHGLEV

ACIN

LBI

nLBO

OUT3

VP3

SW3

GP3

nPBSTAT

nIRQ

nRSTO

PWREN

VSYS

CHGIN

OUT2

VP2

SW2

GP12

SW1

VP1

ACTIVE

AA33

DATE CODE

ACT8938

Rev 3, 23-Dec-11

- 5 - www.active-semi.com

ActivePMUTM and ActivePathTM are trademarks of Active-Semi.

I2CTM is a trademark of NXP.

Innovative PowerTM

Active-Semi Proprietary―For Authorized Recipients and Customers

PIN DESCRIPTIONS

PIN NAME DESCRIPTION

1 REFBP

Reference Bypass. Connect a 0.047F ceramic capacitor from REFBP to GA. This pin is

discharged to GA in shutdown.

2 OUT1

Output Feedback Sense for REG1. Connect this pin directly to the output node to connect the

internal feedback network to the output voltage.

3 GA

Analog Ground. Connect GA directly to a quiet ground node. Connect GA, GP12 and GP3

together at a single point as close to the IC as possible.

4 OUT4

REG4 output. Capable of delivering up to 150mA of output current. Connect a 1.5µF ceramic

capacitor from OUT4 to GA. The output is discharged to GA with 1.5k resistor when disabled.

5 OUT5

REG5 output. Capable of delivering up to 150mA of output current. Connect a 1.5µF ceramic

capacitor from OUT5 to GA. The output is discharged to GA with 1.5k resistor when disabled.

6 INL

Power Input for REG4, REG5, REG6, and REG7. Bypass to GA with a high quality ceramic

capacitor placed as close to the IC as possible.

7 OUT7

REG7 output. Capable of delivering up to 320mA of output current. Connect a 3.3µF ceramic

capacitor from OUT7 to GA. The output is discharged to GA with 1.5k resistor when disabled.

8 OUT6

REG6 output. Capable of delivering up to 320mA of output current. Connect a 3.3µF ceramic

capacitor from OUT6 to GA. The output is discharged to GA with 1.5k resistor when disabled.

9 nPBIN

Master Enable Input. Drive nPBIN to GA through a 50k resistor to enable the IC, drive nPBIN

directly to GA to assert a manual reset condition. Refer to the nPBIN Multi-Function Input section

for more information. nPBIN is internally pulled up to VSYS through a 35k resistor.

10 PWRHLD Power Hold Input. Refer to the Control Sequences section for more information.

11 nRSTO Active Low Reset Output. See the nRSTO Output section for more information.

12 nIRQ

Open-Drain Interrupt Output. nIRQ is asserted any time an unmasked fault condition exists or a

charger interrupt occurs. See the nIRQ Output section for more information.

13 nPBSTAT

Active-Low Open-Drain Push-Button Status Output. nPBSTAT is asserted low whenever the

nPBIN is pushed, and is high-Z otherwise. See the nPBSTAT Output section for more information.

14 GP3

Power Ground for REG3. Connect GA, GP12, and GP3 together at a single point as close to the

IC as possible.

15 SW3 Switching Node Output for REG3.

16 VP3

Power Input for REG3. Bypass to GP3 with a high quality ceramic capacitor placed as close to the

IC as possible.

17 OUT3 Output Feedback Sense for REG3.

18 nHIB Hibernate Mode Input. Refer to the Control Sequences section for more information.

19 nLBO

Low Battery Indicator Output. nLBO is asserted low whenever the voltage at LBI is lower than

1.2V, and is high-Z otherwise. See the Precision Voltage Detector section for more information.

20 LBI

Low Battery Input. The input voltage is compared to 1.2V and the output of this comparison drives

nLBO. See the Precision Voltage Detector section for more information.

21 ACIN AC Input Supply Detection. See the Charge Current Programming section for more information.

22 CHGLEV Charge Current Selection Input. See the Charge Current Programming section for more information.

ACT8938

Rev 3, 23-Dec-11

- 6 - www.active-semi.com

ActivePMUTM and ActivePathTM are trademarks of Active-Semi.

I2CTM is a trademark of NXP.

Innovative PowerTM

Active-Semi Proprietary―For Authorized Recipients and Customers

PIN DESCRIPTIONS CONT’D

PIN NAME DESCRIPTION

25 VSEL

Step-Down DC/DCs Output Voltage Selection. Drive to logic low to select default output voltage.

Drive to logic high to select secondary output voltage. See the Output Voltage Programming

section for more information.

26 SCL Clock Input for I2C Serial Interface.

27 SDA Data Input for I2C Serial Interface. Data is read on the rising edge of SCL.

28 nSTAT

Active-Low Open-Drain Charger Status Output. nSTAT has a 8mA (typ) current limit, allowing it

to directly drive an indicator LED without additional external components. See the Charge Status

Indicator section for more information.

29, 30 BAT Battery Charger Output. Connect this pin directly to the battery anode (+ terminal)

31, 32 VSYS System Output Pin. Bypass to GA with a 10µF or larger ceramic capacitor.

33 CHGIN

Power Input for the Battery Charger. Bypass CHGIN to GA with a capacitor placed as close to

the IC as possible. The battery charger is automatically enabled when a valid voltage is present

on CHGIN.

34 OUT2 Output Feedback Sense for REG2.

35 VP2

Power Input for REG2. Bypass to GP12 with a high quality ceramic capacitor placed as close to

the IC as possible.

36 SW2 Switching Node Output for REG2.

37 GP12

Power Ground for REG1 and REG2. Connect GA, GP12 and GP3 together at a single point as

close to the IC as possible.

38 SW1 Switching Node Output for REG1.

39 VP1

Power Input for REG1. Bypass to GP12 with a high quality ceramic capacitor placed as close to

the IC as possible.

40 NC No Connect. Not internally connected.

EP EP Exposed Pad. Must be soldered to ground on PCB.

24 TH

Temperature Sensing Input. Connect to battery thermistor. TH is pulled up with a 102µA (typ) current

internally. See the Battery Temperature Monitoring section for more information.

23 ISET

Charge Current Set. Program the charge current by connecting a resistor (RISET) between ISET

and GA. See the Charge Current Programming section for more information.

ACT8938

Rev 3, 23-Dec-11

- 7 - www.active-semi.com

ActivePMUTM and ActivePathTM are trademarks of Active-Semi.

I2CTM is a trademark of NXP.

Innovative PowerTM

Active-Semi Proprietary―For Authorized Recipients and Customers

ABSOLUTE MAXIMUM RATINGS

PARAMETER VALUE UNIT

VP1, VP2 to GP12

VP3 to GP3 -0.3 to +6 V

CHGIN to GA -0.3 to +14 V

SW1, OUT1 to GP12 -0.3 to (VVP1 + 0.3) V

SW3, OUT3 to GP3 -0.3 to (VVP3 + 0.3) V

nPBIN, ACIN, CHGLEV, ISET, LBI, PWRHLD, nHIB, REFBP, SCL, SDA, TH, VSEL to

GA -0.3 to (VSYS+0.3) V

OUT4, OUT5, OUT6, OUT7 to GA -0.3 to (VINL + 0.3) V

GP12, GP3 to GA -0.3 to +0.3 V

Operating Ambient Temperature -40 to 85 °C

Maximum Junction Temperature 125 °C

Maximum Power Dissipation

TQFN55-40 (Thermal Resistance JA = 30oC/W) 2.7 W

Storage Temperature -65 to 150 °C

Lead Temperature (Soldering, 10 sec) 300 °C

BAT, VSYS, INL to GA -0.3 to +6 V

SW2, OUT2 to GP12 -0.3 to (VVP2 + 0.3) V

nIRQ, nLBO, nPBSTAT, nRSTO, nSTAT to GA -0.3 to +6 V

: Do not exceed these limits to prevent damage to the device. Exposure to absolute maximum rating conditions for long periods may

affect device reliability.

ACT8938

Rev 3, 23-Dec-11

- 8 - www.active-semi.com

ActivePMUTM and ActivePathTM are trademarks of Active-Semi.

I2CTM is a trademark of NXP.

Innovative PowerTM

Active-Semi Proprietary―For Authorized Recipients and Customers

Figure 1:

I2C Compatible Serial Bus Timing

(VVSYS = 3.6V, TA = 25°C, unless otherwise specified.)

I2C INTERFACE ELECTRICAL CHARACTERISTICS

SDA

SCL

tST tSU

tHD tSP

tSCL

Start

condition

Stop

condition

PARAMETER TEST CONDITIONS MIN TYP MAX UNIT

SCL, SDA Input Low VVSYS = 3.1V to 5.5V, TA = -40ºC to 85ºC 0.35 V

SCL, SDA Input High VVSYS = 3.1V to 5.5V, TA = -40ºC to 85ºC 1.55 V

SDA Leakage Current 1 µA

SDA Output Low IOL = 5mA 0.35 V

SCL Clock Period, tSCL 1.5 µs

SDA Data Setup Time, tSU 100 ns

SDA Data Hold Time, tHD 300 ns

Start Setup Time, tST For Start Condition 100 ns

Stop Setup Time, tSP For Stop Condition 100 ns

SCL Leakage Current

8 18 µA

ACT8938

Rev 3, 23-Dec-11

- 9 - www.active-semi.com

ActivePMUTM and ActivePathTM are trademarks of Active-Semi.

I2CTM is a trademark of NXP.

Innovative PowerTM

Active-Semi Proprietary―For Authorized Recipients and Customers

OUTPUT ADDRESS D7 D6 D5 D4 D3 D2 D1 D0

SYS 0x00 NAME TRST nSYSMODE nSYSLEVMSK nSYSSTAT SYSLEV[3] SYSLEV[2] SYSLEV[1] SYSLEV[0]

DEFAULT 1 1 0 R 0 1 1 1

SYS 0x01 NAME Reserved FRC_ON1 Reserved Reserved SCRATCH SCRATCH HBRDY SCRATCH

DEFAULT 0 0 0 0 0 0 0 0

REG1 0x20 NAME Reserved Reserved VSET1[5] VSET1[4] VSET1[3] VSET1[2] VSET1[1] VSET1[0]

DEFAULT 0 0 1 0 0 1 0 0

REG1 0x21 NAME Reserved Reserved VSET2[5] VSET2[4] VSET2[3] VSET2[2] VSET2[1] VSET2[0]

DEFAULT 0 0 1 0 0 1 0 0

REG1 0x22 NAME ON PHASE MODE DELAY[2] DELAY[1] DELAY[0] nFLTMSK OK

DEFAULT 0 0 0 0 1 0 0 R

REG2 0x30 NAME Reserved Reserved VSET1[5] VSET1[4] VSET1[3] VSET1[2] VSET1[1] VSET1[0]

DEFAULT 0 0 1 1 1 0 0 1

REG2 0x31 NAME Reserved Reserved VSET2[5] VSET2[4] VSET2[3] VSET2[2] VSET2[1] VSET2[0]

DEFAULT 0 0 1 1 1 0 0 1

REG2 0x32 NAME ON PHASE MODE DELAY[2] DELAY[1] DELAY[0] nFLTMSK OK

DEFAULT 0 0 0 0 0 0 0 R

REG3 0x40 NAME Reserved Reserved VSET1[5] VSET1[4] VSET1[3] VSET1[2] VSET1[1] VSET1[0]

DEFAULT 0 0 0 1 1 0 0 0

REG3 0x41 NAME Reserved Reserved VSET2[5] VSET2[4] VSET2[3] VSET2[2] VSET2[1] VSET2[0]

DEFAULT 0 0 0 1 0 1 0 0

REG3 0x42 NAME ON Reserved MODE DELAY[2] DELAY[1] DELAY[0] nFLTMSK OK

DEFAULT 0 0 0 0 0 1 0 R

REG4 0x50 NAME Reserved Reserved VSET[5] VSET[4] VSET[3] VSET[2] VSET[1] VSET[0]

DEFAULT 0 0 1 0 0 1 0 0

REG4 0x51 NAME ON DIS LOWIQ DELAY[2] DELAY[1] DELAY[0] nFLTMSK OK

DEFAULT 0 1 0 0 0 0 0 R

REG5 0x54 NAME Reserved Reserved VSET[5] VSET[4] VSET[3] VSET[2] VSET[1] VSET[0]

DEFAULT 0 0 1 1 1 0 0 1

REG5 0x55 NAME ON DIS LOWIQ DELAY[2] DELAY[1] DELAY[0] nFLTMSK OK

DEFAULT 0 1 0 0 1 1 0 R

REG6 0x60 NAME Reserved Reserved VSET[5] VSET[4] VSET[3] VSET[2] VSET[1] VSET[0]

DEFAULT 0 0 1 1 1 0 0 1

REG6 0x61 NAME ON DIS LOWIQ DELAY[2] DELAY[1] DELAY[0] nFLTMSK OK

DEFAULT 0 1 0 0 0 0 0 R

REG7 0x64 NAME Reserved Reserved VSET[5] VSET[4] VSET[3] VSET[2] VSET[1] VSET[0]

DEFAULT 0 0 1 1 1 0 0 1

REG7 0x65 NAME ON DIS LOWIQ DELAY[2] DELAY[1] DELAY[0] nFLTMSK OK

DEFAULT 0 1 0 0 0 0 0 R

APCH 0x70 NAME Reserved Reserved Reserved Reserved Reserved Reserved Reserved Reserved

DEFAULT 0 1 0 1 0 0 0 0

APCH 0x71 NAME SUSCHG Reserved TOTTIMO[1] TOTTIMO[0] PRETIMO[1] PRETIMO[0] OVPSET[1] OVPSET[0]

DEFAULT 0 0 1 0 1 0 0 0

APCH 0x78 NAME TIMRSTAT TEMPSTAT INSTAT CHGSTAT TIMRDAT TEMPDAT INDAT CHGDAT

DEFAULT 0 0 0 0 R R R R

APCH 0x79 NAME TIMRTOT TEMPIN INCON CHGEOCIN TIMRPRE TEMPOUT INDIS CHGEOCOUT

DEFAULT 0 0 0 0 0 0 0 0

APCH 0x7A NAME Reserved Reserved CSTATE[0] CSTATE[1] Reserved Reserved ACINSTAT Reserved

DEFAULT 0 0 R R R R R R

BITS

GLOBAL REGISTER MAP

: Default values of ACT8938QJ133-T.

2: All bits are automatically cleared to default values when the input power is removed or falls below the system UVLO.

ACT8938

Rev 3, 23-Dec-11

- 10 - www.active-semi.com

ActivePMUTM and ActivePathTM are trademarks of Active-Semi.

I2CTM is a trademark of NXP.

Innovative PowerTM

Active-Semi Proprietary―For Authorized Recipients and Customers

Table 1:

Global Register Map

OUTPUT ADDRESS BIT NAME ACCESS DESCRIPTION

SYS 0x00 [7] TRST R/W

Reset Timer Setting. Defines the reset time-out threshold. Reset

time-out is 65ms when value is 1, reset time-out is 260ms when

value is 0. See nRSTO Output section for more information.

SYS 0x00 [6] nSYSMODE R/W

SYSLEV Mode Select. Defines the response to the SYSLEV

voltage detector, 1: Generate an interrupt when VVSYS falls below

the programmed SYSLEV threshold, 0: automatic shutdown

when VVSYS falls below the programmed SYSLEV threshold.

SYS 0x00 [5] nSYSLEVMSK R/W

System Voltage Level Interrupt Mask. SYSLEV interrupt is

masked by default, set to 1 to unmask this interrupt. See the

Programmable System Voltage Monitor section for more

information

SYS 0x00 [4] nSYSSTAT R

System Voltage Status. Value is 1 when VVSYS is lower than the

SYSLEV voltage threshold, value is 0 when VVSYS is higher than

the system voltage detection threshold.

SYS 0x00 [3:0] SYSLEV R/W

System Voltage Detect Threshold. Defines the SYSLEV voltage

threshold. See the Programmable System V oltage Monitor

section for more information.

SYS 0x01 [7] - R/W Reserved.

SYS 0x01 [6] FRC_ON1 R/W

Force-On bit for REG1. Set bit to 1 before entering Hibernate

mode to keep REG1 ON during Hibernate even when PWRHLD

is de-asserted. Clear bit to 0 after waking from Hibernate mode.

SYS 0x01 [5:4] - R/W Reserved.

SYS 0x01 [3:2] SCRATCH R/W

Scratchpad Bits. Non-functional bits, maybe be used by user to

store system status information. Volatile bits, which are cleared

when system voltage falls below UVLO threshold.

SYS 0x01

[1] HBRDY R/W

Hibernate Ready Flag. Set bit to 1 before entering

Hibernate mode, then read this bit during enable sequence

to identify system status: if bit value is 1 the system is

waking from Hibernate mode, if bit value is 0 the system is

waking from a disabled state.

SYS 0x01 [0] SCRATCH R/W

Scratchpad Bit. Non-functional bit, maybe be used by user to

store system status information. Volatile bit, which is cleared

when system voltage falls below UVLO threshold.

REG1 0x20 [5:0] VSET1 R/W

Primary Output Voltage Selection. Valid when VSEL is driven low.

See the Output Voltage Programming section for more

information.

REG1 0x21 [7:6] - R Reserved.

REG1 0x21 [5:0] VSET2 R/W

Secondary Output Voltage Selection. Valid when VSEL is driven

high. See the Output Voltage Program ming section for more

information.

REG1 0x22 [7] ON R/W Regulator Enable Bit. Set bit to 1 to enable the regulator, clear bit

to 0 to disable the regulator.

REG1 0x22 [6] PHASE R/W

Regulator Phase Control. Set bit to 1 for the regulator to operate

180° out of phase with the oscillator, clear bit to 0 for the

regulator to operate in phase with the oscillator.

REG1 0x22 [5] MODE R/W

Regulator Mode Select. Set bit to 1 for fixed-frequency PWM

under all load conditions, clear bit to 0 to transit to power-savings

mode under light-load conditions.

REG1 0x22 [4:2] DELAY R/W Regulator Turn-On Delay Control. See the REG1, REG2, REG3

Turn-on Delay section for more information.

REG1 0x20 [7:6] - R Reserved.

ACT8938

Rev 3, 23-Dec-11

- 11 - www.active-semi.com

ActivePMUTM and ActivePathTM are trademarks of Active-Semi.

I2CTM is a trademark of NXP.

Innovative PowerTM

Active-Semi Proprietary―For Authorized Recipients and Customers

OUTPUT ADDRESS BIT NAME ACCESS DESCRIPTION

REG1 0x22 [1] nFLTMSK R/W Regulator Fault Mask Control. Set bit to 1 enable fault-

interrupts, clear bit to 0 to disable fault-interrupts.

REG1 0x22 [0] OK R Regulator Power-OK Status. Value is 1 when output voltage

exceeds the power-OK threshold, value is 0 otherwise.

REG2 0x30 [7:6] - R Reserved.

REG2 0x30 [5:0] VSET1 R/W

Primary Output Voltage Selection. Valid when VSEL is driven

low. See the Output Voltage Progra m ming section for more

information.

REG2 0x31 [7:6] - R Reserved.

REG2 0x31 [5:0] VSET2 R/W

Secondary Output Voltage Selection. Valid when VSEL is

driven high. See the Output Voltage Program ming section for

more information.

REG2 0x32 [7] ON R/W Regulator Enable Bit. Set bit to 1 to enable the regulator, clear

bit to 0 to disable the regulator.

REG2 0x32 [6] PHASE R/W

Regulator Phase Control. Set bit to 1 for the regulator to

operate 180° out of phase with the oscillator, clear bit to 0 for

the regulator to operate in phase with the oscillator.

REG2 0x32 [5] MODE R/W

Regulator Mode Select. Set bit to 1 for fixed-frequency PWM

under all load conditions, clear bit to 0 to transit to power-

savings mode under light-load conditions.

REG2 0x32 [4:2] DELAY R/W Regulator Turn-On Delay Control. See the REG1, REG2,

REG3 Turn-on Delay section for more information.

REG2 0x32 [1] nFLTMSK R/W Regulator Fault Mask Control. Set bit to 1 enable fault-

interrupts, clear bit to 0 to disable fault-interrupts.

REG2 0x32 [0] OK R Regulator Power-OK Status. Value is 1 when output voltage

exceeds the power-OK threshold, value is 0 otherwise.

REG3 0x40 [7:6] - R Reserved.

REG3 0x40 [5:0] VSET1 R/W

Primary Output Voltage Selection. Valid when VSEL is driven

low. See the Output Voltage Progra m ming section for more

information.

REG3 0x41 [7:6] - R Reserved.

REG3 0x41 [5:0] VSET2 R/W

Secondary Output Voltage Selection. Valid when VSEL is

driven high. See the Output Voltage Program ming section for

more information.

REG3 0x42 [7] ON R/W Regulator Enable Bit. Set bit to 1 to enable the regulator, clear

bit to 0 to disable the regulator.

REG3 0x42 [6] - R/W Reserved.

REG3 0x42 [5] MODE R/W

Regulator Mode Select. Set bit to 1 for fixed-frequency PWM

under all load conditions, clear bit to 0 to transit to power-

savings mode under light-load conditions.

REG3 0x42 [4:2] DELAY R/W

Regulator Turn-On Delay Control. See the REG1, REG2,

REG3 Turn-on Delay section for more information.

REG3 0x42 [1] nFLTMSK R/W Regulator Fault Mask Control. Set bit to 1 enable fault-

interrupts, clear bit to 0 to disable fault-interrupts.

REG3 0x42 [0] OK R Regulator Power-OK Status. Value is 1 when output voltage

exceeds the power-OK threshold, value is 0 otherwise.

ACT8938

Rev 3, 23-Dec-11

- 12 - www.active-semi.com

ActivePMUTM and ActivePathTM are trademarks of Active-Semi.

I2CTM is a trademark of NXP.

Innovative PowerTM

Active-Semi Proprietary―For Authorized Recipients and Customers

OUTPUT ADDRESS BIT NAME ACCESS DESCRIPTION

REG4 0x50 [7:6] - R Reserved.

REG4 0x50 [5:0] VSET R/W Output Voltage Selection. See the Output Voltage

Programming section for more information.

REG4 0x51 [7] ON R/W Regulator Enable Bit. Set bit to 1 to enable the regulator,

clear bit to 0 to disable the regulator.

REG4 0x51 [6] DIS R/W

Output Discharge Control. When activated, LDO output is

discharged to GA through 1.5k resistor when in shutdown.

Set bit to 1 to enable output voltage discharge in shutdown,

clear bit to 0 to disable this function.

REG4 0x51 [5] LOWIQ R/W LDO Low-IQ Mode Control. Set bit to 1 for low-power

operating mode, clear bit to 0 for normal mode.

REG4 0x51 [4:2] DELAY R/W Regulator Turn-On Delay Control. See the REG4, REG5,

REG6, REG7 Turn-on Delay section for more information.

REG4 0x51 [1] nFLTMSK R/W Regulator Fault Mask Control. Set bit to 1 enable fault-

interrupts, clear bit to 0 to disable fault-interrupts.

REG4 0x51 [0] OK R Regulator Power-OK Status. Value is 1 when output voltage

exceeds the power-OK threshold, value is 0 otherwise.

REG5 0x54 [7:6] - R Reserved.

REG5 0x54 [5:0] VSET R/W Output Voltage Selection. See the Output Voltage

Programming section for more information.

REG5 0x55 [7] ON R/W Regulator Enable Bit. Set bit to 1 to enable the regulator,

clear bit to 0 to disable the regulator.

REG5 0x55 [6] DIS R/W

Output Discharge Control. When activated, LDO output is

discharged to GA through 1.5k resistor when in shutdown.

Set bit to 1 to enable output voltage discharge in shutdown,

clear bit to 0 to disable this function.

REG5 0x55 [5] LOWIQ R/W LDO Low-IQ Mode Control. Set bit to 1 for low-power

operating mode, clear bit to 0 for normal mode.

REG5 0x55 [4:2] DELAY R/W Regulator Turn-On Delay Control. See the REG4, REG5,

REG6 , REG7 Turn-on Delay section for more information.

REG5 0x55 [1] nFLTMSK R/W Regulator Fault Mask Control. Set bit to 1 enable fault-

interrupts, clear bit to 0 to disable fault-interrupts.

REG5 0x55 [0] OK R Regulator Power-OK Status. Value is 1 when output voltage

exceeds the power-OK threshold, value is 0 otherwise.

REG6 0x60 [7:6] - R Reserved.

REG6 0x60 [5:0] VSET R/W Output Voltage Selection. See the Output Voltage

Programming section for more information.

REG6 0x61 [7] ON R/W Regulator Enable Bit. Set bit to 1 to enable the regulator,

clear bit to 0 to disable the regulator.

REG6 0x61 [6] DIS R/W

Output Discharge Control. When activated, LDO output is

discharged to GA through 1.5k resistor when in shutdown.

Set bit to 1 to enable output voltage discharge in shutdown,

clear bit to 0 to disable this function.

REG6 0x61 [5] LOWIQ R/W LDO Low-IQ Mode Control. Set bit to 1 for low-power

operating mode, clear bit to 0 for normal mode.

REG6 0x61 [4:2] DELAY R/W Regulator Turn-On Delay Control. See the REG4, REG5,

REG6, REG7 Turn-on Delay section for more information.

REG6 0x61 [1] nFLTMSK R/W Regulator Fault Mask Control. Set bit to 1 enable fault-

interrupts, clear bit to 0 to disable fault-interrupts.

ACT8938

Rev 3, 23-Dec-11

- 13 - www.active-semi.com

ActivePMUTM and ActivePathTM are trademarks of Active-Semi.

I2CTM is a trademark of NXP.

Innovative PowerTM

Active-Semi Proprietary―For Authorized Recipients and Customers

OUTPUT ADDRESS BIT NAME ACCESS DESCRIPTION

REG6 0x61 [0] OK R Regulator Power-OK Status. Value is 1 when output voltage

exceeds the power-OK threshold, value is 0 otherwise.

REG7 0x64 [7:6] - R Reserved.

REG7 0x64 [5:0] VSET R/W Output Voltage Selection. See the Output Voltage

Programming section for more information.

REG7 0x65 [7] ON R/W Regulator Enable Bit. Set bit to 1 to enable the regulator, clear

bit to 0 to disable the regulator.

REG7 0x65 [6] DIS R/W

Output Discharge Control. When activated, LDO output is

discharged to GA through 1.5k resistor when in shutdown.

Set bit to 1 to enable output voltage discharge in shutdown,

clear bit to 0 to disable this function.

REG7 0x65 [5] LOWIQ R/W LDO Low-IQ Mode Control. Set bit to 1 for low-power

operating mode, clear bit to 0 for normal mode.

REG7 0x65 [4:2] DELAY R/W Regulator Turn-On Delay Control. See the REG4, REG5,

REG6, REG7 Turn-on Delay section for more information.

REG7 0x65 [1] nFLTMSK R/W Regulator Fault Mask Control. Set bit to 1 enable fault-

interrupts, clear bit to 0 to disable fault-interrupts.

REG7 0x65 [0] OK R Regulator Power-OK Status. Value is 1 when output voltage

exceeds the power-OK threshold, value is 0 otherwise.

APCH 0x70 [7:0] - R/W Reserved.

APCH 0x71 [7] SUSCHG R/W

Charge Suspend Control Input. Set bit to 1 to suspend

charging, clear bit to 0 to allow charging to resume.

APCH 0x71 [6] - R/W Reserved.

APCH 0x71 [5:4] TOTTIMO R/W

Total Charge Time-out Selection. See the Charge Safety

Timers section for more information.

APCH 0x71 [3:2] PRETIMO R/W

Precondition Charge Time-out Selection. See the Charge

Safety Timers section for more information.

APCH 0x71 [1:0] OVPSET R/W

Input Over-Voltage Protection Threshold Selection. See the

Input Over-Voltage Protection section for more information.

APCH 0x78 [7] TIMRSTAT1 R/W

Charge Time-out Interrupt Status. Set this bit with

TIMRPRE[ ] and/or TIMRTOT[ ] to 1 to generate an interrupt

when charge safety timers expire, read this bit to get charge

time-out interrupt status. See the Charge Safety Timers

section for more information.

APCH 0x78 [6] TEMPSTAT1 R/W

Battery Temperature Interrupt Status. Set this bit with

TEMPIN[ ] and/or TEMPOUT[ ] to 1 to generate an interrupt

when a battery temperature event occurs, read this bit to get

the battery temperature interrupt status. See the Battery

Temperature Monitoring section for more information.

APCH 0x78 [5] INSTAT R/W

Input Voltage Interrupt Status. Set this bit with INCON[ ] and/or

INDIS[ ] to generate an interrupt when UVLO or OVP condition

occurs, read this bit to get the input voltage interrupt status.

See the Charge Current Programming section for more

information.

APCH 0x78 [4] CHGSTAT1 R/W

Charge State Interrupt Status. Set this bit with

CHGEOCIN[ ] and/or CHGEOCOUT[ ] to 1 to generate an

interrupt when the state machine gets in or out of EOC state,

read this bit to get the charger state interrupt status. See the

State Machine Interrupts section for more information.

APCH 0x78 [3] TIMRDAT1 R

Charge Timer Status. Value is 1 when precondition time-out or

total charge time-out occurs. Value is 0 in other case.

ACT8938

Rev 3, 23-Dec-11

- 14 - www.active-semi.com

ActivePMUTM and ActivePathTM are trademarks of Active-Semi.

I2CTM is a trademark of NXP.

Innovative PowerTM

Active-Semi Proprietary―For Authorized Recipients and Customers

OUTPUT ADDRESS BIT NAME ACCESS DESCRIPTION

APCH 0x78 [0] CHGDAT1 R

Charge State Machine Status. Value is 1 indicates the

charger state machine is in EOC state, value is 0 indicates

the charger state machine is in other states.

APCH 0x79 [7] TIMRTOT R/W

Total Charge Time-out Interrupt Control. Set both this bit

and TIMRSTAT[ ] to 1 to generate an interrupt when a total

charge time-out occurs. See the Charge Safety Timers

section for more information.

APCH 0x79 [6] TEMPIN R/W

Battery Temperature Interrupt Control. Set both this bit and

TEMPSTAT[ ] to 1 to generate an interrupt when the battery

temperature goes into the valid range. See the Battery

Temperature Monitoring section for more information.

APCH 0x79 [5] INCON R/W

Input Voltage Interrupt Control. Set both this bit and

INSTAT[ ] to 1 to generate an interrupt when CHGIN input

voltage goes into the valid range. See the C harge Current

Programming section for more information.

APCH 0x79 [4] CHGEOCIN R/W

Charge State Interrupt Control. Set both this bit and

CHGSTAT[ ] to 1 to generate an interrupt when the state

machine goes into the EOC state. See the State Machine

Interrupts section for more information.

APCH 0x79 [3] TIMRPRE R/W

PRECHARGE Time-out Interrupt Control. Set both this bit

and TIMRSTAT[ ] to 1 to generate an interrupt when a

PRECHARGE time-out occurs. See the Charge Safety

Timers section for more information.

APCH 0x79 [2] TEMPOUT R/W

Battery Temperature Interrupt Control. Set both this bit and

TEMPSTAT[ ] to 1 to generate an interrupt when the battery

temperature goes out of the valid range. See the Battery

Temperature Monitoring section for more information.

APCH 0x79 [1] INDIS R/W

Input Voltage Interrupt Control. Set both this bit and

INSTAT[ ] to 1 to generate an interrupt when CHGIN input

voltage goes out of the valid range. See the Charge Current

Programming section for more information.

APCH 0x79 [0] CHGEOCOUT R/W

Charge State Interrupt Control. Set both this bit and

CHGSTAT[ ] to 1 to generate an interrupt when the state

machines jumps out of the EOC state. See the State

Machine Interrupts section for more information.

APCH 0x7A [7:6] - R Reserved.

APCH 0x7A [5:4] CSTATE R

Charge State. Values indicate the current charging state.

See the State Machine Interrupts section for more

information.

APCH 0x7A [3:2] - R Reserved.

APCH 0x7A [1] ACINSTAT R

ACIN Status. Indicates the state of the ACIN input, typically

in order to identify the type of input supply connected. Value

is 1 when ACIN is above the 1.2V precision threshold, value

is 0 when ACIN is below this threshold.

APCH 0x7A [0] - R Reserved.

APCH 0x78 [1] INDAT R

Input Voltage Status. Value is 1 when a valid input at

CHGIN is present. Value is 0 when a valid input at CHGIN

is not present.

APCH 0x78 [2] TEMPDAT1 R

Temperature Status. Value is 0 when battery temperature is

outside of valid range. Value is 1 when battery temperature

is inside of valid range.

: Valid only when CHGIN UVLO Threshold<VCHGIN<CHGIN OVP Threshold.

ACT8938

Rev 3, 23-Dec-11

- 15 - www.active-semi.com

ActivePMUTM and ActivePathTM are trademarks of Active-Semi.

I2CTM is a trademark of NXP.

Innovative PowerTM

Active-Semi Proprietary―For Authorized Recipients and Customers

SYSTEM CONTROL ELECTRICAL CHARACTERISTICS

(VVSYS = 3.6V, TA = 25°C, unless otherwise specified.)

PARAMETER TEST CONDITIONS MIN TYP MAX UNIT

Input Voltage Range 2.7 5.5 V

UVLO Threshold Voltage VVSYS Rising 2.2 2.45 2.65 V

UVLO Hysteresis VVSYS Falling 200 mV

Supply Current

REG1 Enabled. REG2, REG3, REG4,

REG5, REG6 and REG7 Disabled 150

REG1, REG2, REG3, REG4 and REG5

Enabled. REG6 and REG7 Disabled 350

REG1, REG2, REG3, REG4, REG5,

REG6 and REG7 Enabled 420

Shutdown Supply Current All Regulators Disabled 8 18 µA

Oscillator Frequency 1.8 2 2.2 MHz

Logic High Input Voltage1 1.4 V

Logic Low Input Voltage 0.4 V

Leakage Current VnIRQ = VnRSTO = 4.2V 1 µA

Low Level Output Voltage2 I

SINK = 5mA 0.35 V

nRSTO Delay 65 ms

Thermal Shutdown Temperature Temperature rising 160 °C

Thermal Shutdown Hysteresis 20 °C

µA

LBI Hysteresis Threshold VBAT Rising 200 mV

LBI Threshold Voltage VBAT Falling 1.03 1.2 1.31 V

: PWRHLD, nHIB, VSEL are logic inputs.

2: nLBO, nPBSTAT, nIRQ, nRSTO are open drain outputs.

3: Typical value shown. Actual value may vary from 56.3ms to 72.8ms.

ACT8938

Rev 3, 23-Dec-11

- 16 - www.active-semi.com

ActivePMUTM and ActivePathTM are trademarks of Active-Semi.

I2CTM is a trademark of NXP.

Innovative PowerTM

Active-Semi Proprietary―For Authorized Recipients and Customers

STEP-DOWN DC/DC ELECTRICAL CHARACTERISTICS

(VVP1 = VVP2 = VVP3 = 3.6V, TA = 25°C, unless otherwise specified.)

PARAMETER CONDITIONS MIN TYP MAX UNIT

Operating Voltage Range 2.7 5.5 V

UVLO Threshold Input Voltage Rising 2.5 2.6 2.7 V

UVLO Hysteresis Input Voltage Falling 100 mV

Quiescent Supply Current Regulator Enabled 65 90 µA

Shutdown Current VVP = 5.5V, Regulator Disabled 0 1 µA

Output Voltage Accuracy VOUT  1.2V, IOUT = 10mA -1% VNOM

 1% V

VOUT < 1.2V, IOUT = 10mA -2% VNOM

 2%

Line Regulation VVP = Max(VNOM

+1, 3.2V) to 5.5V 0.15 %/V

Load Regulation IOUT = 10mA to IMAX2 0.0017 %/mA

Power Good Threshold VOUT Rising 93 %VNOM

Power Good Hysteresis VOUT Falling 2 %VNOM

Oscillator Frequency VOUT  20% of VNOM 1.8 2 2.2 MHz

VOUT = 0V 500 kHz

Soft-Start Period 400 µs

Minimum On-Time 75 ns

REG1

Maximum Output Current 1.15 A

Current Limit 1.5 1.8 2.1 A

PMOS On-Resistance ISW1 = -100mA 0.16 

NMOS On-Resistance ISW1 = 100mA 0.16 

SW1 Leakage Current VVP1 = 5.5V, VSW1 = 0 or 5.5V 1 µA

REG2

Maximum Output Current 1.15 A

Current Limit 1.5 1.8 2.1 A

PMOS On-Resistance ISW2 = -100mA 0.16 

NMOS On-Resistance ISW2 = 100mA 0.16 

SW2 Leakage Current VVP2 = 5.5V, VSW2 = 0 or 5.5V 1 µA

REG3

Maximum Output Current 1.3 A

Current Limit 1.7 2.1 2.5 A

PMOS On-Resistance ISW3 = -100mA 0.16 

NMOS On-Resistance ISW3 = 100mA 0.16 

SW3 Leakage Current VVP3 = 5.5V, VSW3 = 0 or 5.5V 0 1 µA

: VNOM refers to the nominal output voltage level for VOUT as defined by the Ordering Information section.

2: IMAX Maximum Output Current.

ACT8938

Rev 3, 23-Dec-11

- 17 - www.active-semi.com

ActivePMUTM and ActivePathTM are trademarks of Active-Semi.

I2CTM is a trademark of NXP.

Innovative PowerTM

Active-Semi Proprietary―For Authorized Recipients and Customers

LOW-NOISE LDO ELECTRICAL CHARACTERISTICS

(VINL = 3.6V, COUT4 = COUT5 = 1.5µF, COUT6 = COUT7 = 3.3µF, LOWIQ[ ] = [0], TA = 25°C, unless otherwise specified.)

: VNOM refers to the nominal output voltage level for VOUT as defined by the Ordering Information section.

2: IMAX Maximum Output Current.

3: Dropout Voltage is defined as the differential voltage between input and output when the output voltage drops 100mV below the

regulation voltage (for 3.1V output voltage or higher).

: LDO current limit is defined as the output current at which the output voltage drops to 95% of the respective regulation voltage.

PARAMETER TEST CONDITIONS MIN TYP MAX UNIT

Operating Voltage Range 2.5 5.5 V

Output Voltage Accuracy VOUT  1.2V, TA = 25°C, IOUT = 10mA -1% VNOM

 2% V

VOUT < 1.2V, TA = 25°C, IOUT = 10mA -2% VNOM

 4%

Line Regulation

VINL = Max(VOUT + 0.5V, 3.6V) to 5.5V

LOWIQ[ ] = [0] 0.05

VINL = Max(VOUT + 0.5V, 3.6V) to 5.5V

LOWIQ[ ] = [1] 0.5

Load Regulation IOUT = 1mA to IMAX2 0.08 V/A

Power Supply Rejection Ratio f = 1kHz, IOUT = 20mA, VOUT =1.2V 75 dB

f = 10kHz, IOUT = 20mA, VOUT =1.2V 65

Supply Current per Output

Regulator Enabled, LOWIQ[ ] = [0] 37 60

µA Regulator Enabled, LOWIQ[ ] = [1] 31 52

Regulator Disabled 0 1

Soft-Start Period VOUT = 2.9V 140 µs

Power Good Threshold VOUT Rising 89 %

Power Good Hysteresis VOUT Falling 3 %

Output Noise IOUT = 20mA, f = 10Hz to 100kHz, VOUT =

1.2V 50 µVRMS

Discharge Resistance LDO Disabled, DIS[ ] = 1 1.5 k

REG4

Dropout Voltage IOUT = 80mA, VOUT > 3.1V 90 180 mV

Maximum Output Current 150 mA

Current Limit VOUT = 95% of regulation voltage 200 mA

Stable COUT4 Range 1.5 20 µF

REG5

Dropout Voltage IOUT = 80mA, VOUT > 3.1V 140 280 mV

Maximum Output Current 150 mA

Current Limit VOUT = 95% of regulation voltage 200 mA

Stable COUT5 Range 1.5 20 µF

REG6

Dropout Voltage IOUT = 160mA, VOUT > 3.1V 90 180 mV

Maximum Output Current 320 mA

Current Limit VOUT = 95% of regulation voltage 400 mA

Stable COUT6 Range 3.3 20 µF

REG7

Dropout Voltage IOUT = 160mA, VOUT > 3.1V 140 280 mV

Maximum Output Current 320 mA

Current Limit VOUT = 95% of regulation voltage 400 mA

Stable COUT7 Range 3.3 20 µF

mV/V

ACT8938

Rev 3, 23-Dec-11

- 18 - www.active-semi.com

ActivePMUTM and ActivePathTM are trademarks of Active-Semi.

I2CTM is a trademark of NXP.

Innovative PowerTM

Active-Semi Proprietary―For Authorized Recipients and Customers

ActivePathTM CHARGER ELECTRICAL CHARACTERISTICS

(VCHGIN = 5.0V, TA = 25°C, unless otherwise specified.)

PARAMETER TEST CONDITIONS MIN TYP MAX UNIT

ActivePath

CHGIN Operating Voltage Range 4.35 6.0 V

CHGIN UVLO Threshold CHGIN Voltage Rising 3.1 3.5 3.9 V

CHGIN UVLO Hysteresis CHGIN Voltage Falling 0.5 V

CHGIN OVP Threshold CHGIN Voltage Rising 6.0 6.6 7.2 V

CHGIN OVP Hysteresis CHGIN Voltage Falling 0.4 V

CHGIN Supply Current

VCHGIN < VUVLO 35 70 µA

VCHGIN < VBAT + 50mV, VCHGIN > VUVLO 100 200 µA

VCHGIN > VBAT + 150mV, VCHGIN > VUVLO

Charger disabled, IVSYS = 0mA 1.3 2.0 mA

CHGIN to VSYS On-Resistance IVSYS = 100mA 0.3 

CHGIN to VSYS Current Limit

ACIN = VSYS 1.5 2 A

ACIN = GA, CHGLEV = GA 80 90 100

ACIN = GA, CHGLEV = VSYS 400 450 500

VSYS REGULATION

VSYS Regulated Voltage IVSYS = 10mA 4.45 4.6 4.8 V

nSTAT OUTPUT

nSTAT Sink current VnSTAT = 2V 4 8 12 mA

nSTAT Leakage Current VnSTAT = 4.2V 1 µA

ACIN AND CHGLEV INPUTS

CHGLEV Logic High Input Voltage 1.4 V

CHGLEV Logic Low Input Voltage 0.4 V

CHGLEV Leakage Current VCHGLEV = 4.2V 1 µA

ACIN Voltage Thresholds ACIN voltage rising 1.03 1.2 1.31 V

ACIN Hysteresis voltage threshold ACIN voltage falling 200 mV

ACIN Leakage Current VACIN = 4.2V 1 µA

TH INPUT

TH Pull-Up Current VCHGIN > VBAT + 100mV, Hysteresis = 50mV 91 102 110 µA

VTH Upper Temperature Voltage

Threshold (VTHH) Hot Detect NTC Thermistor 2.44 2.51 2.58 V

VTH Lower Temperature Voltage

Threshold (VTHL) Cold Detect NTC Thermistor 0.47 0.50 0.53 V

VTH Hysteresis Upper and Lower Thresholds 30 mV

ACT8938

Rev 3, 23-Dec-11

- 19 - www.active-semi.com

ActivePMUTM and ActivePathTM are trademarks of Active-Semi.

I2CTM is a trademark of NXP.

Innovative PowerTM

Active-Semi Proprietary―For Authorized Recipients and Customers

ActivePathTM CHARGER ELECTRICAL CHARACTERISTICS CONT’D

(VCHGIN = 5.0V, TA = 25°C, unless otherwise specified.)

PARAMETER TEST CONDITIONS MIN TYP MAX UNIT

CHARGER

BAT Reverse Leakage Current VCHGIN = 0V, VBAT = 4.2V, IVSYS = 0mA 8 µA

BAT to VSYS On-Resistance 70 m

ISET Pin Voltage Fast Charge 1.2 V

Precondition 0.13

Charge Termination Voltage

VTERM

TA = -20°C to 70°C 4.179 4.2 4.221 V

TA = -40°C to 85°C 4.170 4.2 4.230

Charge Current VBAT = 3.8V

RISET = 6.8K

ACIN = VSYS, CHGLEV = VSYS -10% ICHG

1 +10%

ACIN = VSYS, CHGLEV = GA -10% ICHG/5 +10%

ACIN = GA, CHGLEV = VSYS 400 450 500

ACIN = GA, CHGLEV = GA 80 90 100

Precondition Charge Current VBAT = 2.7V

RISET = 6.8K

ACIN = VSYS, CHGLEV = VSYS 10% ICHG

ACIN = VSYS, CHGLEV = GA 10% ICHG

ACIN = GA, CHGLEV = VSYS 45

ACIN = GA, CHGLEV = GA 45

Precondition Threshold Voltage VBAT Voltage Rising 2.75 2.85 3.0 V

Precondition Threshold

Hysteresis VBAT Voltage Falling 150 mV

END-OF-CHARGE Current

Threshold VBAT = 4.15V

ACIN = VSYS, CHGLEV = VSYS 10% ICHG

ACIN = VSYS, CHGLEV = GA 10% ICHG

Charge Restart Threshold VTERM - VBAT, VBAT Falling 190 205 220 mV

Precondition Safety Timer PRETIMO[ ] = 10 80 min

Total Safety Timer TOTTIMO[ ] = 10 5 hr

Thermal Regulation Threshold 100 °C

ACIN = GA, CHGLEV = VSYS 45

ACIN = GA, CHGLEV = GA 45

: RISET (k) = 2336 × (1V/ICHG (mA)) - 0.205

ACT8938

Rev 3, 23-Dec-11

- 20 - www.active-semi.com

ActivePMUTM and ActivePathTM are trademarks of Active-Semi.

I2CTM is a trademark of NXP.

Innovative PowerTM

Active-Semi Proprietary―For Authorized Recipients and Customers

TYPICAL PERFORMANCE CHARACTERISTICS

(VVSYS = 3.6V, TA = 25°C, unless otherwise specified.)

Temperature (°C)

-40 -20 0 20 40 60 80 100 120

ACT8938-001

VREF vs. Temperature

VREF (%)

ACT8938-002

Frequency vs. Temperature

Frequency (%)

Temperature (°C)

-40 -20 0 20 40 60 80 85

Typical VREF=1.2V Typical Oscillator Frequency=2MHz

0.84

0.42

-0.42

-0.84

2.5

1.5

0.5

-0.5

-1

ACT8938-004

PWRHLD Startup Sequence

CH1

CH1: VnPBIN, 2V/div

CH2: VPWRHLD, 2V/div

CH3: VOUT1, 2V/div

FRC_ON1[ ] = 0

TIME: 100ms/div

CH2

CH3

ACT8938-003

nPBIN Startup Sequence

CH1

CH2

CH3

CH1: VnPBIN, 5V/div

CH2: VOUT2, 2V/div

CH3: VOUT4, 2V/div

CH4: VOUT3, 2V/div

CH5: VOUT1, 2V/div

CH6: VOUT5, 2V/div

TIME: 2ms/div

CH4

CH5

CH6

ACT8938-005

PWRHLD Startup Sequence

CH1

CH2

CH3

CH1: VnPBIN, 2V/div

CH2: VOUT1, 2V/div

CH3: VPWRHLD, 2V/div

FRC_ON1[ ] = 0

TIME: 100ms/div

ACT8938-006

PWRHLD Startup Sequence

CH1

CH2

CH3

CH1: VnPBIN, 2V/div

CH2: VPWRHLD, 2V/div

CH3: VOUT1, 2V/div

FRC_ON1[ ] = 1

TIME: 100ms/div

ACT8938

Rev 3, 23-Dec-11

- 21 - www.active-semi.com

ActivePMUTM and ActivePathTM are trademarks of Active-Semi.

I2CTM is a trademark of NXP.

Innovative PowerTM

Active-Semi Proprietary―For Authorized Recipients and Customers

TYPICAL PERFORMANCE CHARACTERISTICS

(VVSYS = 3.6V, TA = 25°C, unless otherwise specified.)

nHIB Sequence

ACT8938-007

CH1: VnPBIN, 2V/div

CH2: VnHIB, 2V/div

CH3: VOUT2, 2V/div

CH4: VnRSTO, 2V/div

TIME: 20ms/div

CH1

CH2

CH3

CH4

nHIB Sequence

ACT8938-008

CH1: VnHIB, 2V/div

CH2: VOUT2, 2V/div

CH3: VOUT4, 1.97V/div

CH4: VOUT3, 1V/div

CH5: VOUT5, 2V/div

TIME: 2ms/div

CH1

CH2

CH3

CH4

nHIB Sequence

ACT8938-009

CH1: VnHIB, 5V/div

CH2: VOUT2, 2V/div

CH3: VOUT4, 2V/div

CH4: VOUT3, 2V/div

CH5: VOUT1, 2V/div

CH6: VOUT5, 5V/div

TIME: 20ms/div

CH1

CH2

CH3

CH4

CH5

CH6

ACT8938

Rev 3, 23-Dec-11

- 22 - www.active-semi.com

ActivePMUTM and ActivePathTM are trademarks of Active-Semi.

I2CTM is a trademark of NXP.

Innovative PowerTM

Active-Semi Proprietary―For Authorized Recipients and Customers

ACT8938-010

Push-Button Response (First Power-Up)

(TA = 25°C, unless otherwise specified.)

TYPICAL PERFORMANCE CHARACTERISTICS CONT’D

CH1

CH2

CH3

Manual Reset Response

CH1

CH2

CH3

ACT8938-011

nPBIN Resistor = 50k CH1: VnPBIN, 2V/div

CH2: VnPBSTAT, 2V/div

CH3:VnRSTO , 2V/div

TIME: 30ms/div

nPBIN Resistor = 0

CH4

CH1: VnPBIN, 2V/div

CH2: VnHIB, 2V/div

CH3: VnPBSTAT, 2V/div

CH4: VnRSTO, 2V/div

TIME: 20ms/div

ACT8938-013

REG2 Efficiency vs. Output Current

Efficiency (%)

Output Current (mA)

1 10 100 1000

100

VOUT = 3.3V

VIN = 3.6V

VIN = 4.2V

VIN = 5.0V

ACT8938-014

REG3 Efficiency vs. Output Current

100

Efficiency (%)

Output Current (mA)

1 10 100 1000

VOUT = 1.2V

VIN = 4.2V

VIN = 3.6V

VIN = 5.0V

ACT8938-012

REG1 Efficiency vs. Output Current

100

Efficiency (%)

Output Current (mA)

1 10 100 1000

VOUT = 1.8V

VIN = 3.6V

VIN = 4.2V

VIN = 5.0V

ACT8938

Rev 3, 23-Dec-11

- 23 - www.active-semi.com

ActivePMUTM and ActivePathTM are trademarks of Active-Semi.

I2CTM is a trademark of NXP.

Innovative PowerTM

Active-Semi Proprietary―For Authorized Recipients and Customers

(TA = 25°C, unless otherwise specified.)

Temperature (°C)

-40 -20 0 20 40 60 80 100 120

ACT8938-015

REG1 Output Voltage vs. Temperature

Output Voltage (V)

1.210

1.206

1.202

1.198

1.194

1.190

Temperature (°C)

-40 -20 0 20 40 60 80 100 120

ACT8938-017

REG3 Output Voltage vs. Temperature

Output Voltage (V)

1.815

1.809

1.803

1.797

1.791

1.785

VOUT3 = 1.2V

ILOAD = 100mA

VOUT1 = 1.8V

ILOAD = 100mA

TYPICAL PERFORMANCE CHARACTERISTICS CONT’D

Temperature (°C)

-40 -20 0 20 40 60 80 100 120

ACT8938-016

REG2 Output Voltage vs. Temperature

Output Voltage (V)

3.310

3.306

3.302

3.298

3.294

3.290

VOUT2 = 3.3V

ILOAD = 100mA

ACT8938-018

REG1, 2, 3 MOSFET Resistance

RDSON (m)

Input Voltage (V)

3.0 3.5 4.0 4.5 5.0 5.5

300

250

200

150

100

350

ILOAD = 100mA

PMOS NMOS

ACT8938

Rev 3, 23-Dec-11

- 24 - www.active-semi.com

ActivePMUTM and ActivePathTM are trademarks of Active-Semi.

I2CTM is a trademark of NXP.

Innovative PowerTM

Active-Semi Proprietary―For Authorized Recipients and Customers

(TA = 25°C, unless otherwise specified.)

ACT8938-020

Output Voltage (V)

Output Voltage vs. Output Current

ACT8938-019

1.800

1.780

1.760

1.740

1.720

1.700

1.820

1.840

1.860

1.880

1.900

Output Voltage (V)

Output Voltage vs. Output Current

Output Current (mA)

0 20 40 60 80 100 160 120 140

TYPICAL PERFORMANCE CHARACTERISTICS CONT’D

Output Current (mA)

0 20 40 60 80 100 120 140 160

ACT8938-023

Dropout Voltage vs. Output Current

Dropout Voltage (mV)

160

100

140

120

VIN = 3.3V

REG4

ACT8938-024

Dropout Voltage vs. Output Current

Dropout Voltage (mV)

250

200

150

100

VIN = 3.3V

REG5

Output Current (mA)

0 20 40 60 80 100 120 140 160

ACT8938-021

Output Voltage (V)

Output Voltage vs. Output Current

ACT8938-022

3.430

3.390

3.350

3.310

3.270

3.230

3.190

3.150

Output Voltage (V)

Output Voltage vs. Output Current

REG4

3.300

3.280

3.260

3.240

3.220

3.200

3.320

3.340

3.360

3.380

3.400

Output Current (mA)

0 20 40 60 80 100 160 120 140

REG5

Output Current (mA)

0 50 100 150 200 250 450 300 350 400

3.300

3.280

3.260

3.240

3.220

3.200

3.320

3.340

3.360

3.380

3.400

REG6

Output Current (mA)

0 50 100 150 200 250 450 300 350 400

REG7

ACT8938

Rev 3, 23-Dec-11

- 25 - www.active-semi.com

ActivePMUTM and ActivePathTM are trademarks of Active-Semi.

I2CTM is a trademark of NXP.

Innovative PowerTM

Active-Semi Proprietary―For Authorized Recipients and Customers

(TA = 25°C, unless otherwise specified.)

ESR ()

ACT8938-028

Region of Stable COUT ESR vs. Output Current

0.1

0.01

Output Current (mA)

0 50 100 340 200 150 250 300

Stable ESR

ACT8938-029

LDO Output Voltage Noise

CH1

CH1: VOUTx, 200µV/div (AC COUPLED)

TIME: 200ms/div

Temperature (°C)

-40 -20 0 20 40 60 80 100 120

ACT8938-027

Output Voltage vs. Temperature

3.50

3.00

2.50

2.00

1.50

1.00

0.50

4.00

Output Voltage (V)

REG4

REG5, REG6, REG7

TYPICAL PERFORMANCE CHARACTERISTICS CONT’D

ACT8938-026

Dropout Voltage vs. Output Current

Dropout Voltage (mV)

300

250

200

150

100

350

Output Current (mA)

0 50 100 150

200 250 450 300 350 400

ACT8938-025

Dropout Voltage vs. Output Current

Dropout Voltage (mV)

REG6

VIN = 3.3V

250

200

150

100

REG7

Output Current (mA)

0 50 100 150

200 250 450 300 350 400

VIN = 3.3V

ACT8938

Rev 3, 23-Dec-11

- 26 - www.active-semi.com

ActivePMUTM and ActivePathTM are trademarks of Active-Semi.

I2CTM is a trademark of NXP.

Innovative PowerTM

Active-Semi Proprietary―For Authorized Recipients and Customers

(TA = 25°C, unless otherwise specified.)

ACIN/CHGLEV = 01

ACT8938-030

VSYS Voltage vs. VSYS Current

6.0

5.0

4.0

3.0

2.0

1.0

VSYS Voltage (V)

VSYS Current (mA)

0 500 1000 1500 2000 2500

Battery Voltage (V)

0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5

Battery Voltage (V)

0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5

ACT8938-031

VSYS Voltage vs. CHGIN Voltage

VSYS Voltage (V)

CHGIN Voltage (V)

0 2 4 6 8 10

5.2

5.0

4.8

4.6

4.4

4.2

4.0

VVSYS = 4.6V

ACIN/CHGLEV = 11

CH1: IVSYS, 1.00A/div

CH2: IBAT, 1.00A/div

CH3: VBAT, 1.00V/div

CH4: VVSYS, 1V/div

TIME: 200ms/div

DCCC and Battery Supplement Modes

ACT8938-035

CH3

CH4

CH1

CH2 VBAT = 3.5V

VVSYS = 4.6V

IVSYS = 0-1.8A

ICHARGE = 1000mA

VCHGIN = 5.1V-3A

TYPICAL PERFORMANCE CHARACTERISTICS CONT’D

ACT8938-032

Charger Current (mA)

Charger Current vs. Battery Voltage

100

ACT8938-033

Charger Current (mA)

Charger Current vs. Battery Voltage

500

450

400

350

300

250

200

150

100

VCHGIN = 5V

ACIN = 0

CHGLEV = 1

450mA USB

VCHGIN = 5V

ACIN = 0

CHGLEV = 0

90mA USB

ACT8938-034

Charger Current vs. Battery Voltage

1200

1000

800

600

400

200

Battery Voltage (V)

0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5

Charger Current (mA)

RISET = 2.4k

VCHGIN = 5V

ACIN/CHGLEV = 11

VBAT Falling

VBAT Rising

VBAT Falling

VBAT Rising

VBAT Falling

VBAT Rising

ACT8938

Rev 3, 23-Dec-11

- 27 - www.active-semi.com

ActivePMUTM and ActivePathTM are trademarks of Active-Semi.

I2CTM is a trademark of NXP.

Innovative PowerTM

Active-Semi Proprietary―For Authorized Recipients and Customers

(TA = 25°C, unless otherwise specified.)

TYPICAL PERFORMANCE CHARACTERISTICS CONT’D

CH1: IBAT, 1A/div

CH2: VBAT, 2V/div

CH3: VVSYS, 2V/div

CH4: VCHGIN, 5V/div

TIME: 40ms/div

VAC Applied

ACT8938-036 ACT8938-038

CH1

CH2

CH3

CH4

CH1

CH2

CH3

CH4

VCHGIN = 5V

VBAT = 3.5V

RVSYS = 100

ACIN/CHGLEV = 01

VCHGIN = 5V

VBAT = 3.97V

RVSYS = 47

ACIN/CHGLEV = 11

VAC Removed

CH1: IBAT, 400mA/div

CH2: VBAT, 1V/div

CH3: VVSYS, 2V/div

CH4: VCHGIN, 5V/div

TIME: 40ms/div

ACT8938-037 ACT8938-039

CH1

CH2

CH3

CH4

CH1: IBAT, 200mA/div

CH2: VVSYS, 2V/div

CH3: VBAT, 1V/div

CH4: VCHGIN, 5V/div

TIME: 40ms/div

CH4

CH3

CH2

CH1

CH1: IBAT, 1A/div

CH2: VVSYS, 2V/div

CH3: VBAT, 2V/div

CH4: VCHGIN, 5V/div

TIME: 40ms/div

VCHGIN = 5V

VBAT = 3.5V

RVSYS = 100

ACIN/CHGLEV = 01

VCHGIN = 5V

VBAT = 3.97V

RVSYS = 47

ACIN/CHGLEV = 11

ACT8938

Rev 3, 23-Dec-11

- 28 - www.active-semi.com

ActivePMUTM and ActivePathTM are trademarks of Active-Semi.

I2CTM is a trademark of NXP.

Innovative PowerTM

Active-Semi Proprietary―For Authorized Recipients and Customers

The ACT8938 is optimized for use in applications

using the Marvell Aspen processors, supporting

both the power domains as well as the signal

interface for these processors.

While the ACT8938 supports many possible

configurations for powering these processors, one

of the most common configurations is detailed in

this datasheet. In general, this document refers to

the ACT8938 pin names and functions. However, in

cases where the description of interconnections

between these devices benefits by doing so, both

the ACT8938 pin names and the Marvell Aspen

processors pin names are provided. When this is

done, the Aspen pin names are located after the

ACT8938 pin names, and are italicized and located

inside parentheses. For example, VSEL

(DVS_GPIO) refers to the logic signal applied to the

ACT8938's VSEL input, identifying that it is driven

from the Aspen's DVS_GPIO output. Likewise,

OUT2 (VDD_IO ) refers to ACT8938's OUT2 pin,

identifying that it is connected to the Aspen's

VDD_IO power domain.

SYSTEM CONTROL INFORMATION

Interfacing with the Marvell Aspen

Table 2:

ACT8938 and Marvell Aspen Power Domains

POWER DOMAIN ACT8938 CHANNEL TYPE DEFAULT VOLTAGE CURRENT CAPABILITY

VDD_M REG1 DC/DC 1.8V/1.8V 1150mA

VDD_IO REG2 DC/DC 3.3V/3.3V 1150mA

VDD_Core REG3 DC/DC 1.1V/1.0V 1300mA

AVDD_OSC

REG4 LDO 1.8V

AVDD_PLL

AVDD_USB REG5 LDO 3.3V 150mA

TBD REG6 LDO 3.3V 320mA

TBD REG7 LDO 3.3V 320mA

150mA

Table 3:

ACT8938 and Marvell Aspen Power Modes

POWER

MODE CONTROL STATE POWER DOMAIN STATE QUIESCENT

CURRENT

ALL ON PWRHLD is asserted, nHIB is de-asserted,

REG6 and REG7 are enabled by I2C

REG1, REG2, REG3, REG4, REG5,

REG6 and REG7 are all on 420µA

NORMAL PWRHLD is asserted, nHIB is de-asserted,

REG6 and REG7 are disabled by I2C

REG1, REG2, REG3, REG4 and

REG5 are on. REG6 and REG7 are off 350µA

ALL OFF

PWRHLD is de-asserted, nHIB is

asserted, REG6 and REG7 are disabled by

I2C

REG1, REG2, REG3, REG4, REG5,

REG6 and REG7 are all off <18µA

Hibernate

PWRHLD is asserted, nHIB is asserted,

FRC_ON1[ ] is 1, REG6 and REG7 are

disabled by I2C

REG1 is on. REG2,REG3,REG4,REG5,

REG6 and REG7 are off 150µA

ACT8938

Rev 3, 23-Dec-11

- 29 - www.active-semi.com

ActivePMUTM and ActivePathTM are trademarks of Active-Semi.

I2CTM is a trademark of NXP.

Innovative PowerTM

Active-Semi Proprietary―For Authorized Recipients and Customers

ACT8938 DIRECTION MARVELL ASPEN

SCL PWR_SCL

SDA PWR_SDA

VSEL DVS_GPIO

nRSTO RESET_IN_N

nIRQ EXT_WAKEUP

nPBSTAT EXT_WAKEUP

PWRHLD GPIO

nHIB GPIO

Table 5:

Control Pins

PIN NAME OUTPUT

nPBIN REG1, REG2, REG3, REG4, REG5

PWRHLD REG1

nHIB REG2, REG3, REG4, REG5

Table 4:

ACT8938 Signal Interface with Marvell Aspen

Control Signals

Enable Inputs

The ACT8938 features a variety of control inputs,

which are used to enable and disable outputs

depending upon the desired mode of operation.

nHIB, PWRHLD are logic inputs, while nPBIN is a

unique, multi-function input. Refer to Table 5 for a

description of which channels are controlled by

each input.

nPBIN Multi-Function Input

ACT8938 features the nPBIN multi-function pin,

which combines system enable/disable control with

a hardware reset function. Select either of the two

pin functions by asserting this pin, either through a

direct connection to GA, or through a 50k resistor

to GA, as shown in Figure 2.

Figure 2:

nPBIN Input

Manual Reset Function

The second major function of the nPBIN input is to

provide a manual-reset input for the processor. To

manually-reset the processor, drive nPBIN directly

to GA through a low impedance (less than 2.5k).

When this occurs, nRSTO immediately asserts low,

then remains asserted low until the nPBIN input is

de-asserted and the reset time-out period expires.

nPBSTAT Output

nPBSTAT is an open-drain output that reflects the

state of the nPBIN input; nPBSTAT is asserted low

whenever nPBIN is asserted, and is high-Z

otherwise. This output is typically used as an

interrupt signal to the processor, to initiate a

software-programmable routine such as operating

mode selection or to open a menu. Connect

nPBSTAT to an appropriate supply voltage

(typically OUT2) through a 10k or greater resistor.

nRSTO Output

nRSTO is an open-drain output which asserts low

upon startup or when manual reset is asserted via

the nPBIN input. When asserted on startup, nRSTO

remains low until reset time-out period expires after

OUT2 reaches its power-OK threshold. When

asserted due to manual-reset, nRSTO immediately

asserts low, then remains asserted low until the

nPBIN input is de-asserted and the reset time-out

period expires.

1: Optional connection for DVS control.

2, : External wake up/interrupt signal used to wake up the processor from system idle mode.

, : Optional connection for shut down control.

ACT8938

Rev 3, 23-Dec-11

- 30 - www.active-semi.com

ActivePMUTM and ActivePathTM are trademarks of Active-Semi.

I2CTM is a trademark of NXP.

Innovative PowerTM

Active-Semi Proprietary―For Authorized Recipients and Customers

Connect a 10k or greater pull-up resistor from

nRSTO to an appropriate voltage supply (typically

OUT2).

nIRQ Output

nIRQ is an open-drain output that asserts low any

time an interrupt is generated. Connect a 10k or

greater pull-up resistor from nIRQ to an appropriate

voltage supply. nIRQ is typically used to drive the

interrupt input of the system processor.

Many of the ACT8938's functions support interrupt-

generation as a result of various conditions. These

are typically masked by default, but may be

unmasked via the I2C interface. For more

information about the available fault conditions,

refer to the appropriate sections of this datasheet.

Note that under some conditions a false interrupt

may be generated upon initial startup. For this

reason, it is recommended that the interrupt service

routine check and validate nSYSLEVMSK[-] and

nFLTMSK[-] bits before processing an interrupt

generated by these bits. These interrupts may be

validated by nSYSSTAT[-], OK[-] bits.

Push-Button Control

The ACT8938 is designed to initiate a system

enable sequence when the nPBIN multi-function

input is asserted. Once this occurs, a power-on

sequence commences, as described below. The

power-on sequence must complete and the

microprocessor must take control (by asserting

PWRHLD and de-asserting nHIB) before nPBIN is

de-asserted. If the microprocessor is unable to

complete its power-up routine successfully before

the user releases the push-button, the ACT8938

automatically shuts the system down. This provides

protection against accidental or momentary

assertions of the push-button. If desired, longer

“push-and-hold” times can be implemented by

simply adding an additional time delay before

asserting PWRHLD and de-asserting nHIB.

Control Sequences

The ACT8938 features a variety of control

sequences that are optimized for supporting system

enable and disable, as well as Hibernate mode of

the Aspen processors.

Enable Sequence

A typical enable sequence initiates as a result of

asserting nPBIN, and begins by enabling REG2,

REG4, REG3, REG1 and REG5. When REG2

reaches its power-OK threshold, REG4 is enabled

and nRSTO is asserted low, resetting the

microprocessor. REG3 is enabled when REG2

reaches its power-OK threshold for 2ms. REG1 is

enabled when REG2 reaches its power-OK

threshold for 4ms. REG5 is enabled when REG2

reaches its power-OK threshold for 8ms. If REG2

is above its power-OK threshold when the reset

timer expires, nRSTO is de-asserted, allowing the

microprocessor to begin its boot sequence.

During the boot sequence, the processor should

read the HBRDY[ ] bit; if the value of HBRDY[ ] is 0

then the software should proceed with a typical

enable sequence, whereas if the value of HBRDY[ ]

is 1 then the software should proceed with a “wake

from Hibernate Mode” routine. See the Hibernate

Mode Sequence section for more information.

During the boot sequence, the microprocessor must

assert PWRHLD, holding REG1, and set nHIB to a

logic high, holding REG2, REG3, REG4 and REG5

to ensure that the system remains powered after

nPBIN is released. REG6 and REG7 should be

enabled/disabled via I2C after microprocessor

completes its boot sequence.

Once the power-up routine is completed, the

system remains enabled after the push-button is

released as long as PWRHLD is asserted and nHIB

is de-asserted. If the processor does not assert

PWRHLD or de-assert nHIB to logic high before the

user releases the push-button, the boot-up

sequence is terminated and all regulators are

disabled. This provides protection against "false-

enable", when the push-button is accidentally

depressed, and also ensures that the system

remains enabled only if the processor successfully

completes the boot-up sequence.

Hibernate Mode Sequence

The ACT8938 supports Hibernate mode of

operation for Aspen processor. Once a successful

power-up routine is completed, Hibernate mode

may be initiated through a variety of software-

controlled mechanisms. Hibernate mode is typically

initiated when the user presses the push-button

during normal operation. Pressing the push-button

asserts the nPBIN input, which asserts the

nPBSTAT output to interrupt the processor. In

response to this interrupt the processor should first

set the FRC_ON1[ ] bit to 1, and the HBRDY[ ] bit to

1. Then the processor should assert nHIB to logic

low, disabling REG2, REG3, REG4, REG5.

Waking from Hibernate mode is initiated when the

: Typical value shown, actual delay time may vary from (T-1ms) x 88% to T x 112%, where T is the typical delay time setting.

ACT8938

Rev 3, 23-Dec-11

- 31 - www.active-semi.com

ActivePMUTM and ActivePathTM are trademarks of Active-Semi.

I2CTM is a trademark of NXP.

Innovative PowerTM

Active-Semi Proprietary―For Authorized Recipients and Customers

user presses the push-button again. Asserting

nPBIN enables REG2, REG3, REG4 and REG5.

Once REG2 reaches regulation, REG3 is enabled

and the nRSTO timer begins. Once the reset timer

period expires the nRSTO output is de-

asserted and the processor initiates a boot-up

sequence, during which it should determine the

system status by reading the HBRDY[ ] bit; if the

value of HBRDY[ ] is 0 then the software should

proceed with a typical enable sequence, whereas if

the value of HBRDY[ ] is 1 then the software should

proceed with a “wake from Hibernate Mode”

routine. To complete the wake process, the

processor should assert PWRHLD, holding REG1,

and de-assert nHIB to logic high, holding REG2,

REG3, REG4 and REG5 to ensure that the system

remains enabled after the push-button is released

then set FRC_ON1[ ] and HBRDY[ ] to 0 to

complete a full wake-up routine.

Disable Sequence

As with the enable sequence, a typical disable

sequence is initiated when the user presses the

push-button, which interrupts the processor via the

nPBSTAT output. The actual disable sequence is

completely software-controlled, but typically

involved initiating various “clean-up” processes

before finally de-assert PWRHLD and assert nHIB

to logic low, disabling all regulators and shutting the

system down. It is important that FRC_ON1[ ] is

clear to 0 prior to shutting down the system,

otherwise REG1 will remain ON.

Figure 3:

Enable Sequence

ACT8938

Rev 3, 23-Dec-11

- 32 - www.active-semi.com

ActivePMUTM and ActivePathTM are trademarks of Active-Semi.

I2CTM is a trademark of NXP.

Innovative PowerTM

Active-Semi Proprietary―For Authorized Recipients and Customers

Figure 5:

Disable Sequence

Figure 4:

Hibernate Mode Sequence

ACT8938

Rev 3, 23-Dec-11

- 33 - www.active-semi.com

ActivePMUTM and ActivePathTM are trademarks of Active-Semi.

I2CTM is a trademark of NXP.

Innovative PowerTM

Active-Semi Proprietary―For Authorized Recipients and Customers

I2C Interface

The ACT8938 features an I2C interface that allows

advanced programming capability to enhance overall

system performance. To ensure compatibility with a

wide range of system processors, the I2C interface

supports clock speeds of up to 400kHz (“Fast-Mode”

operation) and uses standard I2C commands. I2C

write-byte commands are used to program the

ACT8938, and I2C read-byte commands are used to

read the ACT8938’s internal registers. The ACT8938

always operates as a slave device, and is addressed

using a 7-bit slave address followed by an eighth bit,

which indicates whether the transaction is a read-

operation or a write-operation, [1011011x].

SDA is a bi-directional data line and SCL is a clock

input. The master device initiates a transaction by

issuing a START condition, defined by SDA

transitioning from high to low while SCL is high. Data

is transferred in 8-bit packets, beginning with the

MSB, and is clocked-in on the rising edge of SCL.

Each packet of data is followed by an “Acknowledge”

(ACK) bit, used to confirm that the data was

transmitted successfully.

For more information regarding the I2C 2-wire serial

interface, go to the NXP website:

http://www.nxp.com.

Voltage Monitor and Interrupt

Programmable System Voltage Monitor

The ACT8938 features a programmable system-

voltage monitor, which monitors the voltage at VSYS

and compares it to a programmable threshold

voltage. The programmable voltage threshold is

programmed by SYSLEV[3:0], as shown in Table 6.

SYSLEV[ ] is set to 3.0V by default. There is a

200mV rising hysteresis on SYSLEV[ ] threshold

such that VVSYS needs to be 3.2V(typ) or higher in

order to power up the IC.

The nSYSSTAT[-] bit reflects the output of an

internal voltage comparator that monitors VVSYS

relative to the SYSLEV[-] voltage threshold, the

value of nSYSTAT[-] = 1 when VVSYS is lower than

the SYSLEV[-] voltage threshold, and nSYSTAT[-] =

0 when VVSYS is higher than the SYSLEV[-] voltage

threshold. Note that the SYSLEV[-] voltage threshold

is defined for falling voltages, and that the

comparator produces about 200mV of hysteresis at

VSYS. As a result, once VVSYS falls below the

SYSLEV threshold, its voltage must increase by

more than about 200mV to clear that condition.

After the IC is powered up, the ACT8938 responds in

one of two ways when the voltage at VSYS falls

below the SYSLEV[-] voltage threshold:

1) If nSYSMODE[-] = 1 (default case), when system

vol tag e l eve l i nt e rru pt is un m ask e d

(nSYSLEVMSK[ ]=1) and VVSYS falls below the

programmable threshold, the ACT8938 asserts

nIRQ, providing a software “under-voltage alarm”.

The response to this interrupt is controlled by the

CPU, but will typically initiate a controlled shutdown

sequence either or alert the user that the battery is

low. In this case the interrupt is cleared when VVSYS

rises up again above the SYSLEV rising threshold

and nSYSSTAT[-] is read via I2C.

2) If nSYSMODE[-] = 0, when VVSYS falls below the

programmable threshold the ACT8938 shuts down,

immediately disabling all regulators. This option is

useful for implementing a programmable “under-

voltage lockout” function that forces the system off

when the battery voltage falls below the SYSLEV

threshold voltage. Since this option does not support

a controlled shutdown sequence, it is generally used

as a "fail-safe" to shut the system down when the

battery voltage is too low.

Table 6:

SYSLEV Falling Threshold

Precision Voltage Detector

The LBI input connects to one input of a precision

voltage comparator, which can be used to monitor a

system voltage such as the battery voltage. An

external resistive-divider network can be used to set

voltage monitoring thresholds, as shown in

Functional Block Diagram. The output of the

comparator is present at the nLBO open-drain

output.

SYSLEV[3:0] SYSLEV Falling Threshold

(Hysteresis = 200mV)

0000 2.3

0001 2.4

0010 2.5

0011 2.6

0100 2.7

0101 2.8

0110 2.9

0111 3.0

1000 3.1

1001 3.2

1010 3.3

1011 3.4

1100 3.5

1101 3.6

1110 3.7

1111 3.8

FUNCTIONAL DESCRIPTION

ACT8938

Rev 3, 23-Dec-11

- 34 - www.active-semi.com

ActivePMUTM and ActivePathTM are trademarks of Active-Semi.

I2CTM is a trademark of NXP.

Innovative PowerTM

Active-Semi Proprietary―For Authorized Recipients and Customers

Thermal Shutdown

The ACT8938 integrates thermal shutdown

protection circuitry to prevent damage resulting from

excessive thermal stress, as may be encountered

fault conditions. This circuitry disables all regulators if

the ACT8938 die temperature exceeds 160°C, and

prevents the regulators from being enabled until the

IC temperature drops by 20°C (typ).

ACT8938

Rev 3, 23-Dec-11

- 35 - www.active-semi.com

ActivePMUTM and ActivePathTM are trademarks of Active-Semi.

I2CTM is a trademark of NXP.

Innovative PowerTM

Active-Semi Proprietary―For Authorized Recipients and Customers

General Description

The ACT8938 features three synchronous, fixed-

frequency, current-mode PWM step down

converters that achieve peak efficiencies of up to

97%. REG1 and REG2 are capable of supplying up

to 1150mA of output current, while REG3 supports

up to 1300mA. These regulators operate with a

fixed frequency of 2MHz, minimizing noise in

sensitive applications and allowing the use of small

external components.

100% Duty Cycle Operation

Each regulator is capable of operating at up to

100% duty cycle. During 100% duty-cycle

operation, the high-side power MOSFET is held on

continuously, providing a direct connection from the

input to the output (through the inductor), ensuring

the lowest possible dropout voltage in battery

powered applications.

Synchronous Rectification

REG1, REG2, and REG3 each feature integrated n-

channel synchronous rectifiers, maximizing

efficiency and minimizing the total solution size and

cost by eliminating the need for external rectifiers.

Soft-Start

When enabled, each output voltages tracks an

internal 400s soft-start ramp, minimizing input

current during startup and allowing each regulator

to power up in a smooth, monotonic manner that is

independent of output load conditions.

Compensation

Each buck regulator utilizes current-mode control

and a proprietary internal compensation scheme to

simultaneously simplify external component

selection and optimize transient performance over

its full operating range. No compensation design is

required; simply follow a few simple guidelines

described below when choosing external

components.

Input Capacitor Selection

The input capacitor reduces peak currents and

noise induced upon the voltage source. A 4.7F

ceramic capacitor is recommended for each

regulator in most applications.

Output Capacitor Selection

For most applications, 22F ceramic output

capacitors are recommended for REG1, REG2 and

REG3.

Despite the advantages of ceramic capacitors, care

must be taken during the design process to ensure

stable operation over the full operating voltage and

temperature range. Ceramic capacitors are

available in a variety of dielectrics, each of which

exhibits different characteristics that can greatly

affect performance over their temperature and

voltage ranges.

Two of the most common dielectrics are Y5V and

X5R. Whereas Y5V dielectrics are inexpensive and

can provide high capacitance in small packages,

their capacitance varies greatly over their voltage

and temperature ranges and are not recommended

for DC/DC applications. X5R and X7R dielectrics

are more suitable for output capacitor applications,

as their characteristics are more stable over their

operating ranges, and are highly recommended.

Inductor Selection

REG1, REG2, and REG3 utilize current-mode control

and a proprietary internal compensation scheme to

simultaneously simplify external component selection

and optimize transient performance over their full

operating range. These devices were optimized for

operation with 2.2H inductors, although inductors in

the 1.5H to 3.3H range can be used. Choose an

inductor with a low DC-resistance, and avoid inductor

saturation by choosing inductors with DC ratings that

exceed the maximum output current by at least 30%.

Configuration Options

Output Voltage Programming

By default, each regulator powers up and regulates

to its default output voltage. Output voltage is

selectable by setting VSEL pin that when VSEL is

low, output voltage is programmed by VSET1[-]

bits, and when VSEL is high, output voltage is

programmed by VSET2[-] bits. However, once the

system is enabled, each regulator's output voltage

may be independently programmed to a different

value, typically in order to minimize the power

consumption of the microprocessor during some

operating modes. Program the output voltages via

the I2C serial interface by writing to the regulator's

VSET1[-] register if VSEL is low or VSET2[-]

Enable / Disable Control

During normal operation, each buck may be

enabled or disabled via the I2C interface by writing

to that regulator's ON[ ] bit. The regulator accept

rising or falling edge of ON[ ] bit as on/off signal. To

enable the regulator, clear ON[ ] to 0 first then set to

1. To disable the regulator, set ON[ ] to 1 first then

clear it to 0.

STEP-DOWN DC/DC REGULATORS

ACT8938

Rev 3, 23-Dec-11

- 36 - www.active-semi.com

ActivePMUTM and ActivePathTM are trademarks of Active-Semi.

I2CTM is a trademark of NXP.

Innovative PowerTM

Active-Semi Proprietary―For Authorized Recipients and Customers

REG1, REG2, REG3 Turn-On Delay

Each of REG1, REG2 and REG3 features a

programmable Turn-On Delay which help ensure a

reliable qualification. This delay is programmed by

DELAY[2:0], as shown in Table 8.

Operating Mode

By default, REG1, REG2, and REG3 each operate

in fixed-frequency PWM mode at medium to heavy

loads, while automatically transitioning to a

proprietary power-saving mode at light loads in

order to maximize standby battery life. In

applications where low noise is critical, force fixed-

frequency PWM operation across the entire load

current range, at the expense of light-load

efficiency, by setting the MODE[ ] bit to 1.

OK[ ] and Output Fault Interrupt

Each DC/DC features a power-OK status bit that

can be read by the system microprocessor via the

I2C interface. If an output voltage is lower than the

power-OK threshold, typically 7% below the

programmed regulation voltage, that regulator's

OK[ ] bit will be 0.

If a DC/DC's nFLTMSK[-] bit is set to 1, the

ACT8938 will interrupt the processor if that DC/DC's

output voltage falls below the power-OK threshold.

In this case, nIRQ will assert low and remain

asserted until either the regulator is turned off or

back in regulation, and the OK[ ] bit has been read

via I2C.

PCB Layout Considerations

High switching frequencies and large peak currents

make PC board layout an important part of step-

down DC/DC converter design. A good design

minimizes excessive EMI on the feedback paths

and voltage gradients in the ground plane, both of

which can result in instability or regulation errors.

Step-down DC/DCs exhibit discontinuous input

current, so the input capacitors should be placed as

close as possible to the IC, and avoiding the use of

via if possible. The inductor, input filter capacitor,

and output filter capacitor should be connected as

close together as possible, with short, direct, and

wide traces. The ground nodes for each regulator's

power loop should be connected at a single point in

a star-ground configuration, and this point should

be connected to the backside ground plane with

multiple via. The output node for each regulator

should be connected to its corresponding OUTx pin

through the shortest possible route, while keeping

sufficient distance from switching nodes to prevent

noise injection. Finally, the exposed pad should be

directly connected to the backside ground plane

using multiple via to achieve low electrical and

thermal resistance.

REGx/VSET[2:0] 000 001 010 011 100 101 110 111

000 0.600 0.800 1.000 1.200 1.600 2.000 2.400 3.200

001 0.625 0.825 1.025 1.250 1.650 2.050 2.500 3.300

010 0.650 0.850 1.050 1.300 1.700 2.100 2.600 3.400

011 0.675 0.875 1.075 1.350 1.750 2.150 2.700 3.500

100 0.700 0.900 1.100 1.400 1.800 2.200 2.800 3.600

101 0.725 0.925 1.125 1.450 1.850 2.250 2.900 3.700

110 0.750 0.950 1.150 1.500 1.900 2.300 3.000 3.800

111 0.775 0.975 1.175 1.550 1.950 2.350 3.100 3.900

REGx/VSET[5:3]

Table 7:

REGx/VSET[ ] Output Voltage Setting

ACT8938

Rev 3, 23-Dec-11

- 37 - www.active-semi.com

ActivePMUTM and ActivePathTM are trademarks of Active-Semi.

I2CTM is a trademark of NXP.

Innovative PowerTM

Active-Semi Proprietary―For Authorized Recipients and Customers

DELAY[2] DELAY[1] DELAY[0] TURN-ON DELAY

0 0 0 0 ms

0 0 1 2 ms

0 1 0 4 ms

0 1 1 8 ms

1 0 0 16 ms

1 0 1 32 ms

1 1 0 64 ms

1 1 1 128 ms

General Description

REG4, REG5, REG6, and REG7 are low-noise,

low-dropout linear regulators (LDOs) that supply up

to 150mA, 150mA, 320mA, and 320mA,

respectively. Each LDO has been optimized to

achieve low noise and high-PSRR, achieving more

than 65dB PSRR at frequencies up to 10kHz.

Output Current Limit

Each LDO contains current-limit circuitry featuring a

current-limit fold-back function. During normal and

moderate overload conditions, the regulators can

support more than their rated output currents.

During extreme overload conditions, however, the

current limit is reduced by approximately 30%,

reducing power dissipation within the IC.

Compensation

The LDOs are internally compensated and require

very little design effort, simply select input and

output capacitors according to the guidelines below.

Input Capacitor Selection

Each LDO requires a small ceramic input capacitor

to supply current to support fast transients at the

input of the LDO. Bypassing each INL pin to GA

with 1F. High quality ceramic capacitors such as

X7R and X5R dielectric types are strongly

recommended.

Output Capacitor Selection

Each LDO requires a small ceramic output

capacitor for stability. Capacitance value is 1.5F

for REG4 and REG5, 3.3F for REG6 and REG7.

For best performance, each output capacitor should

be connected directly between the output and GA

pins, as close to the output as possible, and with a

short, direct connection. High quality ceramic

capacitors such as X7R and X5R dielectric types

are strongly recommended.

Configuration Options

Output Voltage Programming

By default, each LDO powers up and regulates to

its default output voltage. Once the system is

enabled, each output voltage may be independently

programmed to a different value by writing to the

regulator's VSET[-] register via the I2C serial

interface as shown in Table 7.

Enable / Disable Control

During normal operation, each LDO may be

enabled or disabled via the I2C interface by writing

to that LDO's ON[ ] bit. The regulator accept rising

or falling edge of ON[ ] bit as on/off signal. To

enable the regulator, clear ON[ ] to 0 first then set to

1. To disable the regulator, set ON[ ] to 1 first then

clear it to 0.

REG4, REG5, REG6, REG7 Turn-on Delay

Each of REG4, REG5, REG6 and REG7 features a

programmable Turn-on Delay which help ensure a

reliable qualification. This delay is programmed by

DELAY[2:0], as shown in Table 8.

Table 8:

REGx/DELAY[ ] Turn-On Delay

Output Discharge

Each of the ACT8938’s LDOs features an optional

output discharge function, which discharges the

output to ground through a 1.5k resistance when

the LDO is disabled. This feature may be enabled

or disabled by setting DIS[-]; set DIS[-] to 1 to

enable this function, clear DIS[-] to 0 to disable it.

Low-Power Mode

Each of ACT8938's LDOs features a LOWIQ[-] bit

which, when set to 1, reduces the LDO's quiescent

current by about 16%, saving power and extending

battery lifetime.

OK[ ] and Output Fault Interrupt

Each LDO features a power-OK status bit that can

be read by the system microprocessor via the

interface. If an output voltage is lower than the

power-OK threshold, typically 11% below the

programmed regulation voltage, the value of that

regulator's OK[-] bit will be 0.

If a LDO's nFLTMSK[-] bit is set to 1, the ACT8938

will interrupt the processor if that LDO's output

voltage falls below the power-OK threshold. In this

case, nIRQ will assert low and remain asserted until

either the regulation is turned off or back in

regulation, and the OK[-] bit has been read via I2C.

LOW-NOISE, LOW-DROPOUT LINEAR REGULATORS

ACT8938

Rev 3, 23-Dec-11

- 38 - www.active-semi.com

ActivePMUTM and ActivePathTM are trademarks of Active-Semi.

I2CTM is a trademark of NXP.

Innovative PowerTM

Active-Semi Proprietary―For Authorized Recipients and Customers

PCB Layout Considerations

The ACT8938’s LDOs provide good DC, AC, and

noise performance over a wide range of operating

conditions, and are relatively insensitive to layout

considerations. When designing a PCB, however,

careful layout is necessary to prevent other circuitry

from degrading LDO performance.

A good design places input and output capacitors

as close to the LDO inputs and output as possible,

and utilizes a star-ground configuration for all

regulators to prevent noise-coupling through

ground. Output traces should be routed to avoid

close proximity to noisy nodes, particularly the SW

nodes of the DC/DCs.

REFBP is a noise-filtered reference, and internally

has a direct connection to the linear regulator

controller. Any noise injected into REFBP will

directly affect the outputs of the linear regulators,

and therefore special care should be taken to

ensure that no noise is injected to the outputs via

REFBP. As with the LDO output capacitors, the

REFBP bypass capacitor should be placed as close

to the IC as possible, with short, direct connections

to the star-ground. Avoid the use of via whenever

possible. Noisy nodes, such as from the DC/DCs,

should be routed as far away from REFBP as

possible.

ACT8938

Rev 3, 23-Dec-11

- 39 - www.active-semi.com

ActivePMUTM and ActivePathTM are trademarks of Active-Semi.

I2CTM is a trademark of NXP.

Innovative PowerTM

Active-Semi Proprietary―For Authorized Recipients and Customers

General Description

The ACT8938 features an advanced battery

charger that incorporates the patent-pending

ActivePath architecture for system power selection.

This combination of circuits provides a complete,

advanced battery-management system that

automatically selects the best available input

supply, manages charge current to ensure system

power availability, and provides a complete, high-

accuracy (±0.5%), thermally regulated, full-featured

single-cell linear Li+ charger that can withstand

input voltages of up to 12V.

ActivePath Architecture

The ActivePath architecture performs three

important functions:

1) System Configuration Optimization

2) Input Protection

3) Battery-Management

System Configuration Optimization

The ActivePath circuitry monitors the state of the

input supply, the battery, and the system, and

automatically reconfigures itself to optimize the

power system. If a valid input supply is present,

ActivePath powers the system from the input while

charging the battery in parallel. This allows the

battery to charge as quickly as possible, while

supplying the system. If a valid input supply is not

present, ActivePath powers the system from the

battery. Finally, if the input is present and the

system current requirement exceeds the capability

of the input supply, ActivePath allows system power

to be drawn from both the battery and the input

supply.

Input Protection

Input Over-Voltage Protection

The ActivePath circuitry features input over-voltage

protection circuitry. This circuitry disables charging

when the input voltage exceeds the voltage set by

OVPSET[-] as shown in Table 9, but stands off the

input voltage in order to protect the system. Note

that the adjustable OVP threshold is intended to

provide the charge cycle with adjustable immunity

against upward voltage transients on the input, and

is not intended to allow continuous charging with

input voltages above the charger's normal operating

voltage range. Independent of the OVPSET[-]

setting, the charge cycle is not allowed to resume

until the input voltage falls back into the charger's

normal operating voltage range (i.e. below 6.0V).

In an input over-voltage condition this circuit limits

VVSYS to 4.6V, protecting any circuitry connected to

VSYS from the over-voltage condition, which may

exceed this circuitry's voltage capability. This circuit

is capable of withstanding input voltages of up to

12V.

Table 9:

Input Over-Voltage Protection Setting

Input Supply Overload Protection

The ActivePath circuitry monitors and limits the total

current drawn from the input supply to a value set

by the ACIN and CHGLEV inputs, as well as the

resistor connected to ISET. Drive ACIN to a logic-

low for “USB Mode”, which limits the input current to

either 100mA, when CHGLEV is driven to a logic-

low, or 450mA, when CHGLEV is driven to a logic-

high. Drive ACIN to a logic-high for “AC-Mode”,

which limits the input current to 2A, typically.

Input Under Voltage Lockout

If the input voltage applied to CHGIN falls below

3.5V (typ), an input under-voltage condition is

detected and the charger is disabled. Once an input

under-voltage condition is detected, a new charge

cycle will initiate when the input exceeds the under-

voltage threshold by at least 500mV.

Battery Management

The ACT8938 features a full-featured, intelligent

charger for Lithium-based cells, and was designed

specifically to provide a complete charging solution

with minimum system design effort.

The core of the charger is a CC/CV (Constant-

Current/Constant-Voltage), linear-mode charge

controller. This controller incorporates current and

voltage sense circuitry, an internal 70m power

MOSFET, thermal-regulation circuitry, a full-

featured state machine that implements charge

control and safety features, and circuitry that

eliminates the reverse blocking diode required by

conventional charger designs.

The charge termination voltage is highly accurate

(±0.5%), and features a selection of charge safety

time-out periods that protect the system from

operation with damaged cells. Other features

ActivePathTM CHARGER

OVPSET[1] OVPSET[0] OVP THRESHOLD

0 0 6.6V

0 1 7.0V

1 0 7.5V

1 1 8.0V

ACT8938

Rev 3, 23-Dec-11

- 40 - www.active-semi.com

ActivePMUTM and ActivePathTM are trademarks of Active-Semi.

I2CTM is a trademark of NXP.

Innovative PowerTM

Active-Semi Proprietary―For Authorized Recipients and Customers

include pin-programmable fast-charge current and

one current-limited nSTAT output that can directly

drive LED indicator or provide a logic-level status

signal to the host microprocessor.

Dynamic Charge Current Contr ol (DCCC)

The ACT8938's ActivePath charger features

dynamic charge current control (DCCC) circuitry,

which acts to ensure that the system remains

powered while operating within the maximum output

capability of the power adapter. The DCCC circuitry

continuously monitors VVSYS, and if the voltage at

VSYS drops by more than 200mV, the DCCC

circuitry automatically reduces charge current in

order to prevent VVSYS from continuing to drop.

Charge Current Programming

The ACT8938's ActivePath charger features a

flexible charge current-programming scheme that

combines the convenience of internal charge

current programming with the flexibility of resistor

based charge current programming. Current limits

and charge current programming are managed as a

function of the ACIN and CHGLEV pins, in

combination with RISET, the resistance connected to

the ISET pin.

ACIN is a logic input that configures the current-limit

of ActivePath's linear regulator as well as that of the

battery charger. ACIN features a precise 1.2V logic

threshold, so that the input voltage detection

threshold may be adjusted with a simple resistive

voltage divider. This input also allows a simple, low-

cost dual-input charger switch to be implemented

with just a few, low-cost components.

When the voltage at ACIN is above the 1.2V

threshold, the charger operates in “AC-Mode” with a

charge current programmed by RISET, and the RISET

is given by:

RISET (k) = 2336 × (1V/ICHG (mA)) - 0.205

With a given RISET then charge current will reduce 5

times when CHGLEV is driven low.

When ACIN is below the 1.2V threshold, the

charger operates in “USB-Mode”, with a maximum

CHGIN input current and charge current defined by

the CHGLEV input; 450mA, if CHGLEV is driven to

a logic-high, or 100mA, if CHGLEV is driven to a

logic-low.

The ACT8938's charge current settings are

summarized in Table 10.

Note that the actual charge current may be limited

to a current lower than the programmed fast charge

current due to the ACT8938’s internal thermal

regulation loop. See the Thermal Regulation section

for more information.

Charger Input Interrupts

In order to ease input supply detection and

eliminate the size and cost of external detection

circuitry, the charger has the ability to generate

interrupts based upon the status of the input supply.

This function is capable of generating an interrupt

when the input is connected, disconnected, or both.

An interrupt is generated any time the input supply

is connected when INSTAT[ ] bit is set to 1 and the

INCON[-] bit is set to 1, and an interrupt is

generated any time the input supply is disconnected

when INSTAT[ ] bit is set to 1 and the INDIS[ ] bit is

set to 1.

INDAT[-] indicates the status of the CHGIN input

supply. A value of 1 indicates that a valid CHGIN

input (CHGIN UVLO Threshold<VCHGIN<CHGIN

OVP Threshold) is present, a value of 0 indicates a

valid input is not present.

When an interrupt is generated by the input supply,

reading the INSTAT[ ] returns a value of 1.

INSTAT [ ] is automatically cleared to 0 upon

reading. When no interrupt is generated by the

input supply, reading the INSTAT[ ] returns a value

of 0.

When responding to an Input Status Interrupt, it is

often useful to know the state of the ACIN input. For

example, in a dual-input charger application

knowing the state of the ACIN input can identify

which type of input supply has been connected. The

state of the ACIN input can be read at any time by

reading the ACINSTAT[-] bit, where a value of 1

indicates that the voltage at ACIN is above the 1.2V

threshold (indicating that a wall-cube has been

attached), and a value of 0 indicates that the

voltage is below this threshold (indicating that ACIN

input is not valid and USB supply input is selected).

ACIN CHGLEV CHARGE CURRENT

(mA)

PRECONDITION CHARGE CURRENT

(mA)

0 0 90 45

0 1 450 45

1 0 ICHG/5 10% × ICHG

1 1 ICHG 10% × ICHG

Table 10:

ACIN and CHGLEV Inputs

ACT8938

Rev 3, 23-Dec-11

- 41 - www.active-semi.com

ActivePMUTM and ActivePathTM are trademarks of Active-Semi.

I2CTM is a trademark of NXP.

Innovative PowerTM

Active-Semi Proprietary―For Authorized Recipients and Customers

Figure 6:

Typical Li+ charge profile and ACT8938 charge states

A: PRECONDITION State

B: FAST-CHARGE State

C: TOP-OFF State

D: END-OF-CHARGE State

Figure 7:

Charger State Diagram

SUSPEND

PRECONDITION

FAST-CHARGE

END-OF-CHARGE

(VCHGIN < VBAT) OR (VCHGIN <V

CHGIN UVLO)

OR (VCHGIN > VOVP) OR (SUSCHG[ ] = 1)

(VCHGIN > VBAT) AND (VCHGIN >V

CHGIN UVLO)

AND (VCHGIN < VOVP) AND (SUSCHG[ ] = 0)

(VBAT > 2.85V) AND

(TQUAL = 32ms)

(VBAT = VTERM ) AND

(TQUAL = 32ms)

TEMP-FAULT

TOP-OFF

(IBAT < 10% x ICHG) OR (Total

Time-out) AND (TQUAL = 32ms)

Total Time-out

TEMP OK

ANY STATE

TEMP NOT OK

TIME-OUT-FAULT

PRECONDITION

Time-out

(VBAT < VTERM - 205mV )

AND (TQUAL = 32ms)

ACT8938

Rev 3, 23-Dec-11

- 42 - www.active-semi.com

ActivePMUTM and ActivePathTM are trademarks of Active-Semi.

I2CTM is a trademark of NXP.

Innovative PowerTM

Active-Semi Proprietary―For Authorized Recipients and Customers

Charge-Control State Machine

PRECONDITION State

A new charging cycle begins with the

PRECONDITION state, and operation continues in

this state until VBAT exceeds the Precondition

Threshold Voltage. When operating in

PRECONDITION state, the cell is charged at 10%

of the programmed maximum fast-charge constant

current, ICHG.

Once VBAT reaches the Precondition Threshold

Voltage, the state machine jumps to the FAST-

CHARGE state. If VBAT does not reach the

Precondition Threshold Voltage before the

Precondition Time-out period expires, then the state

machine jumps to the TIME-OUT-FAULT state in

order to prevent charging a damaged cell. See the

Charge Safety Timers section for more information.

FAST-CHARGE State

In the FAST-CHARGE state, the charger operates

in constant-current (CC) mode and regulates the

charge current to the current set by RISET . Charging

continues in CC mode until VBAT reaches the charge

termination voltage (VTERM), at which point the state-

machine jumps to the TOP-OFF state. If VBAT does

not reach VTERM before the total time out period

expires then the state-machine will jump to the

“EOC” state and will re-initiate a new charge cycle

after 32ms “relax”. See the Current Limits and

Charge Current Programming sections for more

information about setting the maximum charge

current.

TOP-OFF State

In the TOP-OFF state, the cell charges in constant-

voltage (CV) mode. In CV mode operation, the

charger regulates its output voltage to the 4.20V

charge termination voltage, and the charge current

is naturally reduced as the cell approaches full

charge. Charging continues until the charge current

drops to END-OF-CHARGE current threshold, at

which point the state machine jumps to the END-

OF-CHARGE (EOC) state.

If the state-machine does not jump out of the TOP-

OFF state before the Total-Charge Time-out period

expires, the state machine jumps to the EOC state

and will re-initiate a new charge cycle if VBAT falls

below termination voltage 205mV (typ). For more

information about the charge safety timers, see the

Charging Safety Times section.

END-OF-CHARGE (EOC) State

In the END-OF-CHARGE (EOC) state, the charger

presents a high-impedance to the battery,

minimizing battery current drain and allowing the

cell to “relax”. The charger continues to monitor the

cell voltage, and re-initiates a charging sequence if

the cell voltage drops to 205mV (typ) below the

charge termination voltage.

SUSPEND State

The state-machine jumps to the SUSPEND state

any time the battery is removed, and any time the

input voltage either falls below the CHGIN UVLO

threshold or exceeds the OVP threshold. Once

none of these conditions are present, a new charge

cycle initiates.

A charging cycle may also be suspended manually

by setting the SUSPEND[ ] bit. In this case, initiate

a new charging sequence by clearing SUSPEND[ ]

to 0.

State Machine Interrupts

The charger features the ability to generate

interrupts when the charger state machine

transitions, based upon the status of the CHG_ bits.

Set CHGEOCIN[ ] bit to 1 and CHGSTAT[ ] bit to 1

to generate an interrupt when the charger state

machine goes into the END-OF-CHARGE (EOC)

state. Set CHGEOCOUT[ ] bit to 1 and CHGSTAT[ ]

bit to 1 to generate an interrupt when the charger

state machine exits the EOC state.

CHGDAT[ ] indicates the status of the charger state

machine. A value of 1 indicates that the charger

state machine is in END-OF-CHARGE state, a

value of 0 indicates the charger state machine is in

other states.

When an interrupt is generated by the charger state

machine, reading the CHGSTAT[ ] returns a value

of 1. CHGSTAT[ ] is automatically cleared to 0 upon

reading. When no interrupt is generated by the

charger state machine, reading the CHGSTAT[ ]

returns a value of 0.

For additional information about the charge cycle,

CSTATE[0:1] may be read at any time via I2C to

determine the current charging state.

Table 11:

Charging Status Indication

CSTATE[0] CSTATE[1] STATE MACHINE STATUS

1 1 PRECONDITION State

1 0 FAST-CHARGE/

TOP-OFF State

0 1 END-OF-CHARGE State

0 0 SUSPEND/DISABLED/

FAULT State

ACT8938

Rev 3, 23-Dec-11

- 43 - www.active-semi.com

ActivePMUTM and ActivePathTM are trademarks of Active-Semi.

I2CTM is a trademark of NXP.

Innovative PowerTM

Active-Semi Proprietary―For Authorized Recipients and Customers

TOTTIMO[1] TOTTIMO[0] TOTAL TIME-OUT

PERIOD

0 0 3 hrs

0 1 4 hrs

1 0 5 hrs

1 1 Disabled

Thermal Regulation

The charger features an internal thermal regulation

loop that monitors die temperature and reduces

charging current as needed to ensure that the die

temperature does not exceed the thermal regulation

threshold of 110°C. This feature protects against

excessive junction temperature and makes the

device more accommodating to aggressive thermal

designs. Note, however, that attention to good

thermal designs is required to achieve the fastest

possible charge time by maximizing charge current.

Charge Safety Timers

The charger features programmable charge safety

timers which help ensure a safe charge by

detecting potentially damaged cells. These timers

are programmable via the PRETIMO[1:0] and

TOTTIMO[1:0] bits, as shown in Table 12 and Table

13. Note that in order to account for reduced charge

current resulting from DCCC operation, the charge

time-out periods are extended proportionally to the

reduction in charge current. As a result, the actual

safety period may exceed the nominal timer period.

Charger Timer Interrupts

The charger features the ability to generate

interrupts based upon the status of the charge

timers. Set the TIMRPRE[ ] bit to 1 and

TIMRSTAT[ ] bit to 1 to generate an interrupt when

the Precondition Timer expires. Set the TIMRTOT[ ]

bit to 1 and TIMRSTAT[ ] bit to 1 to generate an

interrupt when the Total-Charge Timer expires.

TIMRDAT[ ] indicates the status of the charge

timers. A value of 1 indicates a precondition time-

out or a total charge time-out occurs, a value of 0

indicates other cases.

When an interrupt is generated by the charge

timers, reading the TIMRSTAT[ ] returns a value of

1. TIMRSTAT[ ] is automatically cleared to 0 upon

reading. When no interrupt is generated by the

charge timers, reading the TIMRSTAT[ ] returns a

value of 0.

Table 12:

PRECONDITION Safety Timer Setting

Table 13:

Total Safety Timer Setting

Charge Status Indicator

The charger provides a charge-status indicator

output, nSTAT. nSTAT is an open-drain output

which sinks current when the charger is in an

active-charging state, and is high-Z otherwise.

nSTAT features an internal 8mA current limit, and is

capable of directly driving a LED without the need

of a current-limiting resistor or other external

circuitry. To drive an LED, simply connect the LED

between nSTAT pin and an appropriate supply,

such as VSYS. For a logic-level charge status

indication, simply connect a resistor from nSTAT to

an appropriate voltage supply.

Table 14:

Charging Status Indication

Reverse-Current Protection

The charger includes internal reverse-current

protection circuitry that eliminates the need for

blocking diodes, reducing solution size and cost as

well as dropout voltage relative to conventional

battery chargers. When the voltage at CHGIN falls

below VBAT, the charger automatically reconfigures

its power switch to minimize current drawn from the

battery.

Battery Temperature Monitoring

In a typical application, the TH pin is connected to

the battery pack's thermistor input, as shown in

Figure 8. The charger continuously monitors the

temperature of the battery pack by injecting a

PRETIMO[1] PRETIMO[0] PRECONDITION

TIME-OUT PERIOD

0 0 40 mins

0 1 60 mins

1 0 80 mins

1 1 Disabled

STATE nSTAT

PRECONDITION Active

FAST-CHARGE Active

TOP-OFF Active

END-OF-CHARGE High-Z

SUSPEND High-Z

TEMPERATURE FAULT High-Z

TIME-OUT-FAULT High-Z

ACT8938

Rev 3, 23-Dec-11

- 44 - www.active-semi.com

ActivePMUTM and ActivePathTM are trademarks of Active-Semi.

I2CTM is a trademark of NXP.

Innovative PowerTM

Active-Semi Proprietary―For Authorized Recipients and Customers

102A (typ) current into the thermistor (via the TH

pin) and sensing the voltage at TH. The voltage at

TH is continuously monitored, and charging is

suspended if the voltage at TH exceeds either of

the internal VTHH and VTHL thresholds of 0.5V and

2.51V, respectively.

The net resistance (from TH to GA) required to

cross the thresholds are given by:

102A × RNOM × kHOT = 0.5V  RNOM × kHOT

 5k

102A × RNOM × kCOLD = 2.51V  RNOM ×

kCOLD  25k

where RNOM is the nominal thermistor resistance

at room temperature, and kHOT and kCOLD

represent the ratios of the thermistor's resistance at

the desired hot and cold thresholds, respectively, to

the resistance at 25°C.

Battery Temperature Interrupts

In order to ease detecting the status of the battery

temperature, the charger features the ability to

generate interrupts based upon the status of the

battery temperature. Set the TEMPOUT[ ] bit to 1

and TEMPSTAT[ ] bit to 1 to generate an interrupt

when battery temperature goes out of the valid

temperature range. Set the TEMPIN[ ] bit to 1 and

TEMPSTAT[ ] bit to 1 to generate an interrupt when

battery temperature returns to the valid range.

TEMPDAT[ ] indicates the status of the battery

temperature. A value of 1 indicates the battery

temperature is inside of the valid range, a value of 0

indicates the battery is outside of the valid range.

When an interrupt is generated by the battery

temperature event, reading the TEMPSTAT[ ]

returns a value of 1. TEMPSTAT[ ] is automatically

cleared to 0 upon reading. When no interrupt is

generated by the battery temperature event,

reading the TEMPSTAT[ ] returns a value of 0.

Figure 8:

Simple Configuration

ACT8938

Rev 3, 23-Dec-11

- 45 - www.active-semi.com

ActivePMUTM and ActivePathTM are trademarks of Active-Semi.

I2CTM is a trademark of NXP.

Innovative PowerTM

Active-Semi Proprietary―For Authorized Recipients and Customers

TQFN55-40 PACKAGE OUTLINE AND DIMENSIONS

SYMBOL

DIMENSION IN

MILLIMETERS

DIMENSION IN

INCHES

MIN MAX MIN MAX

A 0.700 0.800 0.028 0.031

A1 0.200 REF 0.008 REF

A2 0.000 0.050 0.000 0.002

b 0.150 0.250 0.006 0.010

D 4.900 5.100 0.193 0.201

E 4.900 5.100 0.193 0.201

D2 3.450 3.750 0.136 0.148

E2 3.450 3.750 0.136 0.148

e 0.400 BSC 0.016 BSC

L 0.300 0.500 0.012 0.020

R 0.300 0.012

Active-Semi, Inc. reserves the right to modify the circuitry or specifications without notice. Users should evaluate each

product to make sure that it is suitable for th eir applicatio ns. Active-Se mi products are not inten ded or aut horized for use

as critical components in life-support devices or systems. Active-Semi, Inc. does not assume any liability arising out of

the use of any product or circuit described in this datasheet, nor does it convey any patent license.

Active-Semi and its logo are trademarks of Active-Semi, Inc. F or more info rmation on this and other products, contact

sales@active-semi.com or visit http://www.active-semi.com.

® is a registered trademark of Active-Semi.

Mouser Electronics

Authorized Distributor

Click to View Pricing, Inventory, Delivery & Lifecycle Information:

Active-Semi:

ACT8938