CUSTOMER ADVISORY ADV0217 FULL LASER MARKING INTRODUCTION Change Description: Beginning January 2003, Altera will introduce a full topside laser mark on all Altera(R) plastic body packages. Currently, the Altera device logo, part number, and date code are ink marked, while the Altera lot number and traceability code are laser marked. Reason for Change: Laser marking provides manufacturing advantages to Altera by increasing mark permanency and quality, productivity gains through process simplification, and enables continuity of format. The use of a laser-marking process is also environmentally friendly when compared to current ink-marking processes. Products Affected: The following plastic body packages will be affected: Plastic Lead Chip Carrier (PLCC), Quad Flat Package (QFP), Thin Quad Flat Package (TQFP), Plastic Ball Grid Array (PBGA), FineLine(R) BGA (FBGA), Ultra FineLine(R) Ball Grid Array (UFBGA), Plastic Dual in Line Package (PDIP), and Small Outline IC (SOIC) packages. Product Traceability and Transition Dates: Altera plans to introduce this full laser marking in January 2003. After this date, customers may receive either laser marked or ink marked devices. Contact: For more information, please contact your local Altera sales representative. Altera Corporation 11/11/02 ADV0217