Features
1 of 5
Optimum Technology
Matching® Applied
GaAs HBT
InGaP HBT
GaAs MESFET
SiGe BiCMOS
Si BiCMOS
SiGe HBT
GaAs pHEMT
Si CMOS
Si BJT
GaN HEMT
NOT FOR NEW DESIGNS
RF MICRO DEVICES®, RFMD®, Optimum Technology Matching®, Enabling Wireless Connectivity™, PowerStar®, POLARIS™ TOTAL RADIO™ and UltimateBlue™ are trademarks of RFMD, LLC. BLUETOOTH is a trade-
mark owned by Bluetooth SIG, Inc., U.S.A. and licensed for use by RFMD. All other trade names, trademarks and registered trademarks are the property of their respective owners. ©2012, RF Micro Devices, Inc.
Product Description
7628 Thorndike Road, Greensboro, NC 27409-9421 · For sales or technical
support, contact RFMD at (+1) 336-678-5570 or customerservice@rfmd.com.
InP HBT
LDMOS
RF MEMS
FMS2027
DC-20GHz MMIC LOW LOSS SPDT
ABSORPTIVE SWITCH
The FMS2027 is a low loss, high isolation broadband single-pole double-throw Gal-
lium Arsenide switch, designed on the FL05 0.5m switch process from RFMD. It
offers absorptive properties from the output (50 termination). This process tech-
nology offers leading-edge performance optimized for switch applications.
The FMS2027 is developed for the broadband communications, instrumentation,
and electronic warfare markets.
RFIN
RFO1RFO2
Low Insertion Loss: 2.1dB at
20GHz
High Isolation: 42dB at
20GHz
Absorptive Output in Off State
Excellent Low Control Voltage
Performance
Applications
Broadband Communications
Test Instrumentation
Fiber Optics
Electronic Warfare (ECM,
ESM)
DS120621
NOT FOR NEW DESIGNS
Package Style: Bare Die
FMS2027
Parameter Specification Unit Condition
Min. Typ. Max.
Electrical Specifications
(Small-Signal Unless Noted)
Based on on-wafer measurements.
TAMBIENT=25°C, VCTRL =0V/-5V, ZIN=ZOUT=50
Insertion Loss -1 -0.85 dB DC
-1.5 -1.3 dB 10GHz
-1.8 -1.6 dB 15GHz
-2.3 -2.1 dB 20GHz
Isolation -42 -40 dB DC-20GHz
Input Return Loss (ON State) -12 -10 dB DC-20GHz
Output Return Loss (OFF State) -16 -13 dB DC-20GHz
Output Return Loss (OFF State) -22 -12 dB DC-20GHz
P1dB 23 23 dBm 2GHz
21 22.5 dBm 10GHz
19 21 dBm 18 GHz
2 of 5 DS120621
7628 Thorndike Road, Greensboro, NC 27409-9421 · For sales or technical
support, contact RFMD at (+1) 336-678-5570 or customerservice@rfmd.com.
NOT FOR NEW DESIGNS
FMS2027
Notes: -5V±0.2 V; -0V±0.2 V
Pad Layout
Note: Only one control line A and one control line B require
connection.
Absolute Maximum Ratings
Parameter Rating Unit
Maximum Input Power (PIN)+27dBm
Control Voltage (VCTRL)V
Operating Temperature (TOPER) -40 to 85 °C
Storage Temperature (TSTOR) -55 to 150 °C
Truth Table
Control Line RF Path
A B RFIN-RFO1 RFIN-RFO2
-5V 0V On Off
0V -5V Off On
Pad Description
RFIN RFIN
RFO1 RFOUT1
RFO2 RFOUT2
AVA1
AVA2
AVA3
AVA4
BVB1
BVB2
BVB3
Die Size (m) Die Thickness (m) Min. Bond Pad Pitch (m) Min. Bond Pad Opening (mxm)
1336x934 100 146 94x94
Caution! ESD sensitive device.
Exceeding any one or a combination of the Absolute Maximum Rating conditions may
cause permanent damage to the device. Extended application of Absolute Maximum
Rating conditions to the device may reduce device reliability. Specified typical perfor-
mance or functional operation of the device under Absolute Maximum Rating condi-
tions is not implied.
RoHS status based on EUDirective2002/95/EC (at time of this document revision).
The information in this publication is believed to be accurate and reliable. However, no
responsibility is assumed by RF Micro Devices, Inc. ("RFMD") for its use, nor for any
infringement of patents, or other rights of third parties, resulting from its use. No
license is granted by implication or otherwise under any patent or patent rights of
RFMD. RFMD reserves the right to change component circuitry, recommended appli-
cation circuitry and specifications at any time without prior notice.
RFIN
A
AB
B
RFO 2RFO1AAB
3 of 5
NOT FOR NEW DESIGNS
DS120621
7628 Thorndike Road, Greensboro, NC 27409-9421 · For sales or technical
support, contact RFMD at (+1) 336-678-5570 or customerservice@rfmd.com.
FMS2027
Typical Measured Performance On Wafer
Measurement Conditions: VCTRL=5V (low) and 0V (high), TAMBIENT=25C.
Both arms RFO1 and RFO2 are symmetrical.
Insertion Loss (S2 1 ON )
-2.50
-2.00
-1.50
-1.00
-0.50
0.00
02468101214161820
Fr eque nc y (G Hz)
S21 (dB)
Isola tion (S21 OFF)
-120.00
-100.00
-80.00
-60.00
-40.00
-20.00
0.00
02468101214161820
Fr eque ncy (GHz)
S21 (dB)
Inp u t Return Loss (S 11 O N)
-30.00
-25.00
-20.00
-15.00
-10.00
-5.00
0.00
0 2 4 6 8 101214161820
Frequency (GHz)
S11 (dB)
Output Return Loss (S22 ON)
-25.00
-20.00
-15.00
-10.00
-5.00
0.00
0 2 4 6 8 10 12 14 16 18 20
Frequency (G Hz)
S22 (dB)
Absorptive O u tput Return L o ss (S22 OFF)
-60.00
-50.00
-40.00
-30.00
-20.00
-10.00
0.00
0 2 4 6 8 10 12 14 16 18 20
Freque ncy (GHz )
S22 ( dB)
P1dB
0.00
4.00
8.00
12.00
16.00
20.00
24.00
28.00
2 4 6 8 10 12 14 16 18 20
Frequenc y (G Hz)
P1dB (dB m)
4 of 5 DS120621
7628 Thorndike Road, Greensboro, NC 27409-9421 · For sales or technical
support, contact RFMD at (+1) 336-678-5570 or customerservice@rfmd.com.
NOT FOR NEW DESIGNS
FMS2027
Typical Measured Performance On-Wafer Over Temperature
Measurement Conditions: VCTRL =-5V (low) and 0V (high).
Both arms RFO1 and RFO2 are symmetrical.
TAMBIENT=25C, TCOLD=-40C, THOT=+85C
Isolat ion (S2 1 OFF)
-90.00
-80.00
-70.00
-60.00
-50.00
-40.00
-30.00
-20.00
-10.00
0.00
02468101214161820
Freque n cy (G Hz)
S21 (dB)
Absorptive Output Return Loss (S22 OFF)
-60.00
-50.00
-40.00
-30.00
-20.00
-10.00
0.00
0 2 4 6 8 10 12 14 16 18 20
Frequenc y (GHz)
S22(dB)
5 of 5
NOT FOR NEW DESIGNS
DS120621
7628 Thorndike Road, Greensboro, NC 27409-9421 · For sales or technical
support, contact RFMD at (+1) 336-678-5570 or customerservice@rfmd.com.
FMS2027
Preferred Assembly Instructions
GaAs devices are fragile and should be handled with great care. Specially designed collets should be used where possible.
The back of the die is metallized and the recommended mounting method is by the use of conductive epoxy. Epoxy should be
applied to the attachment surface uniformly and sparingly to avoid encroachment of epoxy onto the top face of the die. Ideally
it should not exceed half the chip height. For automated dispense Ablestick LMISR4 is recommended and for manual dispense
Ablestick 84-1 LMI or 84-1 LMIT are recommended. These should be cured at a temperature of 150C for one hour in an oven
especially set aside for epoxy curing only. If possible the curing oven should be flushed with dry nitrogen. The gold-tin (80% Au
20% Sn) eutectic die attach has a melting point of approximately 280°C but the absolute temperature being used depends on
the leadframe material used and the particular application. The maximum time at used should be kept to a minimum.
This part has gold (Au) bond pads requiring the use of gold (99.99% pure) bondwire. It is recommended that 25.4mm diameter
gold wire be used. Recommended lead bond technique is thermocompression wedge bonding with 0.001” (25µm) diameter
wire. Bond force, time stage temperature and ultrasonics are all critical parameters and the settings are dependent on the
setup and application being used. Ultrasonic or thermosonic bonding is not recommended.
Bonds should be made from the die first and then to the mounting substrate or package. The physical length of the bondwires
should be minimized especially when making RF or ground connections.
Handling Precautions
To avoid damage to the devices, care should be exercised during handling. Proper Electro-
static Discharge (ESD) precautions should be observed at all stages of storage, handling,
assembly, and testing.
ESD/MSL Rating
These devices should be treated as Class 1A (250V to 500V) using the human body model as defined in JEDEC Standard No.
22-A114. Further information on ESD control measures can be found in MIL-STD-1686 and MIL-HDBK-263. This is an unpack-
aged part and therefore no MSL rating applies.
Application Notes and Design Data
Application Notes and design data including S-parameters are available on request from www.rfmd.com.
Reliability
An MTTF of in excess of 9 million hours at a channel temperature of 150°C is achieved for the process used to manufacture
this device.
Disclaimers
This product is not designed for use in any space-based or life-sustaining/supporting equipment.
Ordering Information
Delivery Quantity Ordering Code
Full Pack (100) FMS2027-000
Small Quantity (25) FMS2027-000SQ
Sample Quantity (3) FMS2027-000S3