Product Specification 108-57603 26-Nov-2008 Rev A DC POWER JACK 1. SCOPE 1.1. CONTENTS This specification covers the performance, tests and quality requirements for the DC power jack connector. 1.2. QUALIFICATION When tests are performed on the subject product line, the procedures specified in TE 109 series specifications shall be used. All inspections shall be performed using the applicable inspection plan and product drawing. 2. APPLICABLE DOCUMENT The following TE documents form a part of this specification to the extent specified herein. Unless otherwise specified, the latest edition of the document applies. In the event of conflict between the requirements of this specification and the product drawing, the product drawing shall take precedence. In the event of conflict between the requirements of this specification and the referenced documents, this specification shall take precedence. 2.1. TE SPECIFICATIONS A. 109-1: General Requirements for Test Specifications B. 109-197TE Specification vs EIA and IEC Test Methods C. 501-57700Test Report 3. REQUIREMENTS 3.1. DESIGN AND CONSTRUCTION Product shall be of the design, construction and physical dimensions specified on the applicable product drawing. 3.2. MATERIALS A. HousingThermoplastic, UL94V-0. B. Contact Copper Alloy, Gold plating on contact area, Tin Plating on solder-tail over Nickel under-plating overall.. 3.3. RATINGS A. Current Rating5 A B. Voltage Rating13 VDC C. Operating temperature-25 to 70. DR Fanny Yang (c)2007 Tyco Electronics Corporation Taipei, Taiwan All International Rights Reserved. DATE APVD 26Nov08 William Kodama * Trademark Indicates change For latest revision, visit our website at www.tycoelectronics.com\documents. For Regional Customer Service, visit our website at www.tycoelectronics.com DATE 26Nov08 1 of 4 LOC DW 108-57603 3.4. PERFOMANCE REQUEIREMENT AND TEST DESCRIPTION The product shall be designed to meet the electrical, mechanical and environmental performance requirements specified in Figure 1. All tests shall be performed at ambient environmental conditions per TE Specification 109-1 TEST REQUIREMENTS AND PROCEDURES SUMMARY. 3.5. TEST REQUIREMENTS AND PROCEDURES SUMMARY TEST ITEM Examination of 1 Product REQUIREMENT PROCEDURE Meets requirements of product drawing. No physical damage. Visual inspection. ELECTRICAL REQUIREMENT 2 Contact Resistance 3 30 m Ohm Max (Initial) 40 m Ohm Max (finial) Dielectric No creeping discharge or withstanding Voltage flashover shall occur. 4 Insulation Resistance 1000 M Ohm Min. Subject mated contacts assembled in housing to 20mV Max open circuit at 10mA Max. EIA- 364-23A 500V AC rms., for 1 minutes applied between adjacent contacts. EIA-364-20A.method B. Impressed voltage 500 VDC. Test between adjacent circuits of unmated connector. EIA-364-21C. MECHANICAL REQUIREMENT 5 6 Connector Mating Force Connector Un-mating Force 7 Durability 0.3-2.0 Kgf Operation Speed 25.4 mm/min. Measure the force required to mate connector. EIA-364-13A 0.3 kgf Min.. Operation Speed25.4 mm/min. Measure the force required to un-mate connector. EIA-364-13A See Note R=10m Max finial. Operation Speed250 cycle/hour. EIA-364-09B 3000 cycles. Steam Aging Preconditioning The inspected area of each lead 93+3/-58hrs15min. [Apply to wave soldering must have 95% solder coverage <JESD22-B102D, Condition C> minimum. process. See note 2] Dip Solder temperature: 2455, 5sec Solder-ability 8 Solder-ability [Apply to IR soldering process. See note 2] The inspected area of each lead Steam Aging Preconditioning: must have 95% solder coverage 93C +3/-5C, 8 hours 15 min. minimum. <JESD22-B102D, Condition C> Reflow 230 - 245C, 50 - 70 s. Figure 1Cont. Rev A 2 of 4 108-57603 ENVIRONMENTAL REQUIREMENTS Resistance to Wave Soldering Heat [Apply with customer drawing notes. See note 2] No physical damage shall occur. 9 Resistance to Reflow Soldering Heat No physical damage shall 10 Thermal Shock See Note occur. [Apply with customer drawing notes. See note 2] 11 12 Humidity-Temperature See Note Cycle R=10m Max finial. Temperature Life See Note R=10m Max finial (Heat Aging) 13 Salt Spray TE spec. 109-202, Condition B Solder Temp.2655, 100.5sec. Pre-soak condition, 85 /85 RH for 168 hours. Pre Heat150~180, 9030sec. Heat230 Min., 3010sec. Peak Temp.260+0/-5, 20~40sec. Duration3 cycles TE spec. 109-201, Condition B 30 minute EIA-364-32B,condition I 5 cycles between +85/30minute and 55/ EIA-364-31A, method III, condition B. At a temperature of 40 2 and relative Humidity of 90~95% for 96 hours. EIA-364-17A,method A, condition 3 Temperature 1053 for 250 hours. EIA-364-26A,condition A See Note No base metal exposed. Exposing in a heat chamber at a temperature of 352 for 24 hours Figure 1End Note 1Shall meet visual requirements, show no physical damage, and meet requirement of additional tests as specified in the test sequence in Figures 2 Note 2Soldering process is indicated on customer drawing notes. Select the appropriate optional which is compliant with customer drawing's. Rev A 3 of 4 108-57603 3.6. Qualification Test Sequence Test Group Test or Examination A B C D E F G H 1,3 1, 3 Test Sequencea Examination of Product 1, 7 Contact Resistance Dielectric withstanding Voltage 3, 6 Insulation Resistance 2, 5 1, 9 1, 5 1, 5 1, 5 1, 5 2, 8 2, 4 2, 4 2, 4 2, 4 Mating Force 3, 6 Un-mating Force 4, 7 Durability 5 Solder-ability 2 Resistance to Wave Soldering 2 Heat Thermal Shock Humidity Temperature Cycling 3 4 Temperature Life 3 3 Salt Spray 3 Figure 2. (end) NOTE (a) Numbers indicate sequence in which tests are performed. Rev A 4 of 4