MPF200T-1FCG484E - MICROSEMI

PO0137

Product Overview

PolarFire FPGA

PolarFire FPGA
51700137 PO0137 Product Overview Revision 1.5
Contents
Revision History  ............................................................................................................................. 1
1 Revision 1.5  ........................................................................................................................................ 1
2 Revision 1.4  ........................................................................................................................................ 1
3 Revision 1.3  ........................................................................................................................................ 1
4 Revision 1.2  ........................................................................................................................................ 1
5 Revision 1.1  ........................................................................................................................................ 1
6 Revision 1.0  ........................................................................................................................................ 1
Overview ........................................................................................................................................ 2
1 Summary of Features  ......................................................................................................................... 2
1.1 Low-Power Features ................................................................................................................................ 2
1.2 Reliability Features  .................................................................................................................................. 2
1.3 Security Features ..................................................................................................................................... 2
1.4 Libero® SoC PolarFire FPGA Toolset  ........................................................................................................ 3
2 Block Diagram ..................................................................................................................................... 3
3 Product Family Table  .......................................................................................................................... 4
Non-Volatile FPGA Fabric ............................................................................................................... 5
1 Logic Element  ..................................................................................................................................... 5
2 On-Chip Memory  ................................................................................................................................ 5
3 LSRAM  ................................................................................................................................................ 5
3.1 Dual-Port Mode ....................................................................................................................................... 6
3.2 Two-Port Mode  ....................................................................................................................................... 6
4 µSRAM  ................................................................................................................................................ 6
5 µPROM  ............................................................................................................................................... 7
6 sNVM  .................................................................................................................................................. 7
7 Math Block .......................................................................................................................................... 7
Clock Management  ........................................................................................................................ 9
1 DLL  ...................................................................................................................................................... 9
2 PLL  ...................................................................................................................................................... 9
3 Clock Network  .................................................................................................................................. 10
3.1 Global Clocks  ......................................................................................................................................... 10
3.2 Regional Clocks ...................................................................................................................................... 10
I/Os  .............................................................................................................................................. 11
1 Low-Power High-Speed Transceiver Lane  ........................................................................................ 11
1.1 Low-Power Transceiver Lane Features .................................................................................................. 11
1.2 Transmitter ............................................................................................................................................ 12
1.3 Receiver ................................................................................................................................................. 12

PolarFire FPGA
51700137 PO0137 Product Overview Revision 1.5
1.4 Transceiver Lane Modes ........................................................................................................................ 12
1.5 Reference Clock ..................................................................................................................................... 13
1.6 Quad Lane Overlay Assignments ........................................................................................................... 14
2 Inputs/Outputs  ................................................................................................................................. 15
2.1 Input Buffer Speed  ................................................................................................................................ 15
2.2 Output Buffer Speed  ............................................................................................................................. 17
2.3 Maximum PHY Rate for Memory Interface IP  ....................................................................................... 19
3 I/O Digital  ......................................................................................................................................... 20
3.1 I/O Digital Features  ............................................................................................................................... 20
3.2 I/O Digital Modes  .................................................................................................................................. 20
PCI Express ................................................................................................................................... 22
1 PCI Express Features ......................................................................................................................... 23
2 PCI Express DMA Engines  ................................................................................................................. 23
PolarFire FPGA System Controller  ............................................................................................... 24
1 System Services  ................................................................................................................................ 24
Debug Probe System .................................................................................................................... 25
Programming  ............................................................................................................................... 26
1 Dedicated SPI Programming Port  ..................................................................................................... 26
Low Power  .................................................................................................................................. 27
1 Non-Volatile Technology  ................................................................................................................ 27
2 Low-Power Transceiver Lane .......................................................................................................... 27
3 Lower Power "L" Devices ................................................................................................................ 27
Reliability  .................................................................................................................................... 28
1 FPGA Fabric  .................................................................................................................................... 28
2 LSRAM  ............................................................................................................................................ 28
3 µSRAM  ............................................................................................................................................ 28
4 Digests  ............................................................................................................................................ 28
5 System Controller Suspend Mode  .................................................................................................. 28
Security  ....................................................................................................................................... 30
1 Design Security  ............................................................................................................................... 30
1.1 Tamper Detectors ................................................................................................................................ 30
1.2 Tamper Responses  .............................................................................................................................. 30
2 Data Security  .................................................................................................................................. 30
PolarFire FPGA Device Offerings ................................................................................................. 32
Ordering Information .................................................................................................................. 33
Export Classification .................................................................................................................... 34

PolarFire FPGA
51700137 PO0137 Product Overview Revision 1.5 1
1 Revision History
The revision history describes the changes that were implemented in the document. The changes are 
listed by revision, starting with the most current publication.
1.1 Revision 1.5
Revision 1.5 was published in March of 2019. The following is a summary of changes.
Flash*Freeze mode was removed from the sections  ,  , I/Os (see page 11) Low Power (see page 27)
and  .System Services (see page 24)
1.2 Revision 1.4
Revision 1.4 was published in September of 2018. The following is a summary of changes.
Flash*Freeze mode was removed.
Export classification was added. For more information, see section Export Classification (see page 
.34)
1.3 Revision 1.3
Revision 1.3 was published in June 2018. The following is a summary of changes.
Updated the block diagram. For more information, see the PolarFire FPGA Block Diagram (see page 
.3)
Updated sections to reflect changes in the preliminary datasheet. For more information, see section 
 and section  .I/Os (see page 11) Data Security (see page 30)
1.4 Revision 1.2
Revision 1.2 was published in August 2017. The following is a summary of changes.
LVDS rates were changed to a max of 1.25G. For more information, see Differential I/O Standards.
1.5 Revision 1.1
Revision 1.1 was published in May 2017. The following is a summary of changes.
The Product Family Table was updated. For more information, see Product Family Table (see page 
.4)
Information about the Dedicated SPI Programming Port was updated. For more information, see 
.Dedicated SPI Programming Port (see page 26)
The PolarFire FPGA Device Offerings were updated. For more information, see PolarFire FPGA 
.Device Offerings (see page 32)
1.6 Revision 1.0
Revision 1.0 was published in February 2017. It was the first publication of this document.

PolarFire FPGA

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2 Overview

PolarFire™ FPGAs are the fifth-generation family of non-volatile FPGA devices from Microsemi, built on

state-of-the-art 28nm non-volatile process technology. Cost-optimized PolarFire FPGAs deliver the

lowest power at mid-range densities. PolarFire FPGAs lower the cost of mid-range FPGAs by integrating

the industry’s lowest power FPGA fabric, lowest power 12.7 Gbps transceiver lane, built-in low power

dual PCI Express Gen2 (EP/RP), and, on select data security (S) devices, an integrated low-power crypto

co-processor. PolarFire FPGAs can operate at 1.0 V and 1.05 V, offering the end user the ability to trade

off power and performance to match the application requirements.

This document describes the features of the production PolarFire FPGA extended commercial (0 °C to

100 °C) and industrial (–40 °C to 100 °C) device offerings. Please refer to the datasheet for current silicon

status and electrical characteristics.

2.1 Summary of Features

Up to 481K logic elements consisting of a 4-input look-up table (LUT) with a fractureable D-type flip-

flop

20 Kb dual- or two-port large static random access memory (LSRAM) block with built-in single error

correct double error detect (SECDED)

64 × 12 two-port µRAM block implemented as an array of latches

18 × 18 math block with a pre-adder, a 48-bit accumulator, and an optional 16 deep x 18 coefficient

ROM

Built-in µPROM, modifiable at program time, readable at run time for user data storage

High-speed serial connectivity with built-in multi-gigabit multi-protocol transceivers from 250 Mbps

to 12.7 Gbps

Integrated dual PCIe for up to ×4 Gen2 endpoint (EP) and root port (RP) designs

High-speed I/O (HSIO) supporting up to 1600 Mbps DDR4, 1333 Mbps DDR3L, and 1333 Mbps

LPDDR3/DDR3 memories with integrated I/O digital

General purpose I/O (GPIO) supporting 3.3 V, built-in CDR for serial gigabit Ethernet, 1067 Mbps

DDR3, and 1600 Mbps LVDS I/O speed with integrated I/O digital logic

Low-power phase-locked loops (PLLs) and delay-locked loops (DLLs) for high precision and low-jitter

1.0 V and 1.05 V operating modes

2.1.1 Low-Power Features

Low device static power

Low inrush current

Low power transceivers

2.1.2 Reliability Features

FPGA configuration cells single event upset (SEU) immune

Built-in SECDED and memory interleaving on LSRAMs

System controller suspend mode for safety-critical designs

2.1.3 Security Features

Cryptography Research Incorporated (CRI)-patented differential power analysis (DPA) bitstream

protection

Integrated physically unclonable function (PUF)

56 KBytes of secure non-volatile memory (sNVM)

Built-in tamper detectors and countermeasures

Digest integrity check for FPGA, µPROM, and sNVM

Data security features in S devices—true random number generator, integrated Athena TeraFire

EXP5200B Crypto Coprocessor, suite B capable, and CRI DPA countermeasure pass-through license

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2.1.4 Libero® SoC PolarFire FPGA Toolset

Complete FPGA and embedded software development environment

Includes Synplify Pro synthesis and Mentor ModelSim ME simulation

2.2 Block Diagram

The following illustration shows the functional blocks of PolarFire FPGAs.

Figure 1 • PolarFire FPGA Block Diagram

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2.3 Product Family Table

The following table lists the product overview and packaging overview of the PolarFire FPGA product

family.

Table 1 • PolarFire FPGA Product Family

Features MPF100T MPF200T MPF300T MPF500T

FPGA fabric K Logic elements (4 LUT + DFF) 109 192 300 481

Math blocks (18 x 18 MACC) 336 588 924 1480

LSRAM blocks (20 kbit) 352 616 952 1520

μSRAM blocks (64 x 12) 1008 1764 2772 4440

Total RAM (Mbits) 7.6 13.3 20.6 33

μPROM (Kbits 9-bit bus) 297 297 459 513

sNVM (K Bytes) 56 56 56 56

User DLLs/PLLs 8 8 8 8

High-speed

I/O

250 Mbps to 12.7 Gbps

transceiver lanes

8 16 16 24

PCIe Gen2 endpoints/

root ports

2 2 2 2

Total I/Os Total user I/Os 284 364 512 584

Packaging Type/size/pitch Total user I/Os (HSIO/GPIO), GPIO CDRs/Transceivers

FCSG325 0.5 mm

11 mm x 11 mm,

11 mm x 14.5 mm (MPF200T only)

170(84/86), 8/4 170(84/86), 8/4

FCSG536 0.5 mm

16 mm x 16 mm

300(120/180),

15/4

300(120/180),

15/4

FCVG484 0.8 mm

19 mm x 19 mm

284(120/164),

14/4

284(120/164),

14/4

284(120/164),

14/4

FCG484 1.0 mm

23 mm x 23 mm

244(96/148),

13/8

244(96/148),

13/8

244(96/148),

13/8

FCG784 1.0 mm

29 mm x 29 mm

364(132/232),

20/16

388(156/232),

20/16

388(156/232),

20/16

FCG1152 1.0 mm

35 mm x 35 mm

512(276/236),

24/16

584(324/260),

24/24

Notes:

Devices in the same package type are pin compatible.

TS devices contain an Athena TeraFire F5200B Crypto-Coprocessor.

Extended Commercial and Industrial temperature grade devices are available in Green RoHS

packages. Military temperature grade devices are available in leaded packages.

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3 Non-Volatile FPGA Fabric

The non-volatile FPGA fabric is built on state-of-the-art 28nm low power non-volatile process

technology. The PolarFire FPGA fabric is composed of the following building blocks:

Logic element

On-chip memory (LSRAM, μSRAM, sNVM, and μPROM)

Math block

The FPGA fabric configuration cells are SEU immune, and are used to configure I/Os and other aspects of

the device. Non-volatile FPGAs do not require the configuration process inherent in SRAM FPGAs. Non-

volatile FPGAs power up quickly like an ASIC with minimal inrush current, and are ideal for root-of-trust

first-up functionality in any system.

3.1 Logic Element

The 4-input LUT can be configured either to implement any 4-input combinatorial function or to

implement an arithmetic function where the LUT output is XORed with a carry input to generate the

sum output.

The logic element has the following features.

A fully permutable 4-input LUT optimized for lowest power

A dedicated carry chain based on a carry look-ahead technique

A separate flip-flop that can be used independently from the LUT

3.2 On-Chip Memory

PolarFire FPGAs integrate four different types of memories that allow the designer to optimize for

power, functionality, and area. Two memory types are volatile, and two memory types are non-volatile.

Volatile memories include:

LSRAM

µSRAM

The LSRAMs are 20-Kbit SRAMs with a built-in SECDED and interleaving to prevent multi-bit-upsets

(MBUs). The µSRAMs are small distributed 64 x 12 RAMs, well suited for efficient implementation of

small buffers, thereby reserving LSRAM usage for the wider and deeper memories.

Non-volatile memories (NVMs) include:

µPROM

sNVM

The µPROM, constructed of SEU-immune FPGA configuration non-volatile cells, is readable at runtime

and writable during device programming. It provides users with SEU-immune parameters, constants,

IDs, and parametric or initialization data. The sNVM is accessible through system service calls. Data

written to the sNVM can be protected by the PUF. The sNVM is readable and writable by the designer’s

application during runtime and is an ideal storage location for the boot code for soft processors and

user keys.

3.3 LSRAM

Each LSRAM block consists of 20,480 bits of RAM and includes functionality to support dual-port and

two-port modes. There are numerous configurations and features for each block. The Libero SoC

PolarFire toolset has an LSRAM configurator that provides automated combining and cascading of

several LSRAM blocks into larger memories.

LSRAM features include:

428 MHz operation

True dual-port memory

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True dual-port memory

Two-port memory (one dedicated write port, one dedicated read port)

Data widths of ×1, ×2, ×5, ×10, ×20, ×40, and ×33 with SECDED enabled

Multi-bit-upset mitigation

Synchronous operation

Independent port clocks

Byte enables

Registered inputs

Output registers with separate enables and synchronous resets

Read enables to conserve power while retaining output data

Power switch to minimize static power when the LSRAM is not used

Fast zeroization mode

3.3.1 Dual-Port Mode

In dual-port mode, the width of both ports is less than 33 and the ports are independent of each other.

The write and read operations can occur independently of each other, at any location. On write

collisions, while the write operations occur correctly, the read operations can return ambiguous results

while the write completes. After completing the write operation, the read data reads the newly written

write data correctly.

3.3.2 Two-Port Mode

In two-port mode, at least one port has a width of 32 or 40 (or 33 with SECDED). Port A is dedicated for

reads and port B for writes.

The following illustration shows port widths in various modes.

Figure 2 • LSRAM Dual- and Two-Port Configurations

3.4 µSRAM

The µSRAM is a two-port memory embedded in the FPGA fabric, which is provided for an efficient low-

power implementation for small buffers. On write collisions, the write operations occur correctly, while

the read operations can return ambiguous results while the write completes. After completing the write

operation, the read data reads the newly written write data.

The following are key features of the µSRAM block:

480 MHz operation

Two-port memory with 64 words of 12 bits

The write port operates synchronously

The write port has a fixed width

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The write port has a fixed width

The read port operates asynchronously and supports synchronous and pipeline operations with the

FPGA fabric flip-flops

The Libero SoC PolarFire toolset provides automated combining and cascading for larger memories

Multiple memory blocks can be combined to extend the depth or width

Provides a state-keeping, low-power suspend mode

Implemented as an array of latches

3.5 µPROM

The µPROM is a single monolithic non-volatile memory that provides a PROM-like storage for a variety

of purposes, including but not limited to: initialization data for other memories, user calibration data,

and so on. The memory cells are constructed from the FPGA configuration cells and are updated when

the device is programmed.

The following are key features of the µPROM:

10 ns read access time

Programmed with the FPGA bitstream

Asynchronous or synchronous read access mode from the FPGA fabric

3.6 sNVM

Each PolarFire FPGA has 56 KBytes of sNVM. The sNVM is organized into 221 pages of 236 or 252 bytes,

depending on whether the data is stored as plain text or encrypted/authenticated data. It is accessible

to users through system services calls to the PolarFire FPGA system controller. Pages within the sNVM

can be marked as ROM during bitstream programming. The sNVM content can be used to initialize

LSRAM and µSRAMs with secure data. The sNVM is only accessible through system service calls. Data

written to the sNVM can be protected by the PUF.

3.7 Math Block

The fundamental building block in any digital signal processing algorithm is the multiply-accumulate

(MACC) operation. PolarFire FPGAs implement a custom 18 x 18 MACC block for an efficient low-power

implementation of complex DSP algorithms such as finite impulse response (FIR) filters, infinite impulse

response (IIR) filters, and fast fourier transform (FFT) for filtering and image processing applications. An

optional 16-word coefficient ROM can be constructed from logic elements located near the math block.

The following are key features of the math block functionality:

500 MHz operation

18 × 18 two's complement multiplier accumulator with an output width of 48 bits

Power-saving pre-adder to optimize linear phase FIR filter applications and reduce the math block

usage

Optional pipelining and dedicated buses for cascading

Dot-product mode for complex multiplies

The following illustration shows the functional blocks of the math block.

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Figure 3 • Math Block

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4 Clock Management

In each PolarFire FPGA, there are eight DLLs and eight PLLs to provide flexible clock generation and

management capabilities. In addition to these DLLs and PLLs, up to 15 transceiver lane transmit PLLs are

also available.

The following are key highlights of the clock management architecture:

High-speed buffers and routing for low-skew clock distribution

Frequency synthesis and phase shifting

Low-jitter clock generation and jitter filtering

4.1 DLL

The DLL provides a calculated PVT compensated delay to the I/O’s digital delay lines as well as delay or

phase-shifted clocks to the FPGA fabric.

The following are the major modes to which the DLL can be configured.

Time reference mode—the DLL takes a single clock as an input and determines how many delay line

buffer taps are required for a signal to pass through them to rotate a signal. The main use of time

reference mode is to know how many delay taps are needed to delay the clock by 90 degrees. The

value is then provided to the data strobe signal (DQS)/DQSn input signals for double data rate (DDR)

memory controllers to delay all DQS/DQSn signals by the required 90-degree phase shift to capture

the data from the memory devices. Multiple memory interfaces of the same clock rate can reuse the

same DLL with lane level controls for PVT updates.

Clock injection delay mode—the DLL can be used to compensate for the clock injection delay

associated with the source synchronous receive interfaces. The DLL can match delays for the global,

regional, and high-speed bank clocks. There are two outputs from the DLL in this mode: a x1 output

fixed in time and another output that can be divided by x1, x2, or x4 and can be phase shifted.

4.2 PLL

The programmable delta-sigma low-jitter fractional PLLs are multi-function and general purpose

frequency synthesizers, as shown in the following illustration. Wide input and output ranges along with

the best-in-class jitter performance allow these PLLs to be used for almost any clocking application. With

excellent supply noise immunity, the PLL is ideal for use in noisy FPGA environments.

The PLL output clock is available in eight phases with 45-degree phase differences. All eight phases

are selectable to drive four separate outputs from the PLL, where each output can select any of the

eight phases independent of other output selections and that each output can also be driven to a

zero output when not used.

Each of the four outputs from the PLL can then be divided independently for any value from 1 to

127. Each of the PLL outputs can have the output divider released by up to seven VCO/4 cycles. The

delayed outputs can be set independently for each output clock.

Fractional-N (24-bit accuracy) capability is added to the feedback divider to have the VCO frequency

be a non-integer divide of the reference clock input frequency. The base frequency is applied to all

PLL outputs.

The PLL supports glitch-free start and stop on any one of the four outputs independently by either a

phase selection to be modified glitch-free during the time that the clock is stopped.

For fine granularity phase control of the PLLs, they can be cascaded with DLLs located near the PLLs,

whereby the DLL delay lines can be used in a process, voltage, and temperature (PVT) compensated

or non-PVT compensated mode to provide the phase control needed.

The following illustration shows the flow of the PLL functionality.

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Figure 4 • PLL Block Diagram

4.3 Clock Network

The clock network is designed to route clocks and asynchronous reset signals to large sections of the

fabric with limited skew. On occasion, the network can also be used for other high fanout signals that

can tolerate long delays, such as non-timing-critical synchronous enables or resets. There are two main

clock networks for the FPGA fabric, global and regional clocks.

4.3.1 Global Clocks

There are 24 clocks on the device with global low skew scope to all synchronous elements. The global

can be divided into left and right sides of the device. Thus, the number of globals can increase to 48

total clocks with 24 in the left and 24 in the right.

4.3.2 Regional Clocks

There are up to 38 regional clock domains that interface to the edges of the device. The regional clocks

provide a fixed number of logic elements based on the size of the device. Up to 14 clocks are available

for the FPGA I/Os and up to 24 clocks for the transceiver lanes, one for each lane direction. These are

the fast insertion clock networks used to move data in and out of the fabric.

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5 I/Os

PolarFire device user I/Os support multiple I/O standards while providing the high bandwidth needed to

maximize the internal logic capabilities of the device and achieve the required system-level

performance.

5.1 Low-Power High-Speed Transceiver Lane

All PolarFire FPGAs contain state-of-the-art low-power transceiver lane capabilities from speeds as low

as 250 Mbps up to 12.7 Gbps. The PMA is designed to support multiple protocols (as listed in the

following table) with state-of-the-art control and debug features. PCI Express Gen1 or Gen2 support is

provided by a hard macro. All other protocols are implemented with a soft IP. Serial Gigabit Ethernet is

also supported with GPIO 3.3 V LVDS differential pairs. A single transmit PLL can provide a high-speed

clock up to four transceiver lanes.

Table 2 • Transceiver Lane Protocol Support

Protocol Data Rate (Gbps) Channels Bonded

PCIe 2.5, 5 1, 2, 4

Interlaken 6.375, 12.7 1–16

10GBASE-R/KR 10.3125–12.7 1

SGMII/QSGMII 1.25–5 1

XAUI 3.125 4

RXAUI 6.25 2, 3, 4, 6

HiGig/HiGig+/HiGiGII 3.75–4.065 4

CPRI 0.6144–12.165 1

Fiber channel 0.6144–12.165 1

SRIO 1.25–6.3 1, 2, 4, 8

SATA 1.5–6 1

JESD204B 0.5–12.5 1–4

Display port 2, 5, 8 4

SDI 0.277–11.88 1

5.1.1 Low-Power Transceiver Lane Features

The following are low-power transceiver lane features:

Advanced low-power modes

Programmable transmit amplitude and emphasis control

Low-speed CDR operation with support for 270 Mbps SMPTE serial line rates

Continuous time linear equalization (CTLE) and decision feedback equalization (DFE) for long-reach

or backplane applications

Auto-adaption at receiver equalization and integrated eye monitor feature for easy serial link tuning

Eye monitor and/or equalization can be powered down to reduce power if not needed

Out-of-band, electrical idle signaling capability for SAS, SATA, and PCIe

Multiple loopback modes for test and debug

Transmit jitter attenuation for loop timing applications (SyncE compatible)

Hot-socketing capable

IEEE 1149.6 AC JTAG

Adjacent channel loopback modes allow transceiver lane data streams to remain active during FPGA

fabric programming

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5.1.2 Transmitter

The transmitter is fundamentally a parallel-to-serial converter with a conversion ratio of 8, 10, 16, 20,

32, 40, 64, or 80 bits. It allows the designer to trade-off data path width for timing margin in high-

performance designs. These transmitter outputs drive the PC board with a differential output signal.

TX_CLK is the appropriately divided serial data clock available to the fabric, and can be used directly to

hardware support for the 8b/10b, 64b/66b, or 64b/67b encoding schemes to provide a sufficient

number of transitions. The bit-serial output signal drives two package pins with differential signals. The

output signal pair supports a wide variety of serial protocols and has programmable signal swing as well

as programmable pre- and post-emphasis to compensate for PC board losses and other interconnect

characteristics. For shorter channels, the swing can be reduced to lower power consumption. Each

transmit lane can be sourced by one of two transmit PLLs. Each transmit PLL can drive up to four

transceiver lanes. Transmitter PLLs are state-of-the-art fractional frequency synthesizers with integrated

jitter attenuation.

5.1.3 Receiver

The receiver is fundamentally a serial-to-parallel converter with clock recovery changing the incoming

bit-serial differential signal into a parallel stream of words of 8, 10, 16, 20, 32, 40, 64, or 80 bits. This

allows the FPGA designer to trade off the internal data path width versus logic timing margin. The

receiver takes the incoming differential data stream, feeds it through programmable linear and decision

feedback equalizers (to compensate for PC board and other interconnect characteristics), and uses the

reference clock input to initiate clock recognition. The data pattern uses non-return-to-zero (NRZ)

encoding and optionally guarantees sufficient data transitions by using the selected encoding scheme.

The outgoing parallel data has additional hardware support for the 8b/10b, 64b/66b, or 64b/67b

encoding schemes to provide a sufficient number of transitions. Parallel data is transferred into the

FPGA logic using the recovered clock (RX_CLK).

5.1.4 Transceiver Lane Modes

The transceiver lane supports five different modes of operations:

PMA—direct access to the PMA without any encoding

8b/10b—8b/10b encoding/decoding is provided

64b/6xb—64b/66b or 64/67b encoding/decoding with gearbox logic is provided

PIPE—a PIPE interface supporting both PCIe Gen2 and SATA 3.0

PCIe—direct connection to the embedded PCIe Gen2 controller

The following illustration shows the collaboration of five modes that transceiver lanes support.

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Figure 5 • Transceiver Lane Modes

5.1.5 Reference Clock

The reference clock pins allow connections directly with the transceiver lane quads. The reference clock

inputs provide flexibility to interface with both single-ended and differential clocks, and can drive up to

two independent clocks per transceiver lane quad. These reference clocks can also be sources for the

global and regional clock networks in the FPGA fabric of the device.

The following illustration shows the connectivity between the reference clock and transceiver lane

quads.

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Figure 6 • Reference Clock

5.1.6 Quad Lane Overlay Assignments

The transceiver lane either connects the parallel side of the interface to the PCIe Gen2 controller or to

the fabric. The PCIe connections are fixed in the hardware and have a dedicated number of

combinations between the two controllers. The fabric interface is used to support the PMA, 8b/10b,

64b/6xb, and PIPE modes and have complete flexibility into the fabric connections.

The following table lists the combinations between the PCIe and fabric controllers.

Table 3 • Quad0 Lane Assignments

PCIe_0 Controller Quad0

Lane 0

Quad0

Lane 1

Quad0

Lane 2

Quad0

Lane 3

PCIe_1 Controller

x1 PCIe_0 Not available Not available PCIe_1 x1

x1 PCIe_0 Unused PCIe_1 PCIe_1 x2

x2 PCIe_0 PCIe_0 Not available PCIe_1 x1

x2 PCIe_0 PCIe_0 PCIe_1 PCIe_1 x2

x4 PCIe_0 PCIe_0 PCIe_0 PCIe_0 Unused

x1 PCIe_0 Not available Fabric Fabric Unused

x2 PCIe_0 PCIe_0 Fabric Fabric Unused

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PCIe_0 Controller Quad0

Lane 0

Quad0

Lane 1

Quad0

Lane 2

Quad0

Lane 3

PCIe_1 Controller

Unused Fabric Fabric Not available PCIe_1 x1

Unused Fabric Fabric PCIe_1 PCIe_1 x2

Unused Fabric Fabric Fabric Fabric Unused

Note: Fabric includes PMA, 8b/10b, 64b/66b, 64b/67b, and PIPE modes.

5.2 Inputs/Outputs

PolarFire FPGA I/Os are grouped into pairs to meet the differential I/O standards. Additionally, they are

grouped in lanes of 12 buffers with a lane controller for memory interfaces, as shown in the following

illustration.

Figure 7 • I/O Topology

The number of I/O pins varies depending on the device and package size. The persistent I/O feature

preserves a state on an I/O without user intervention during programming mode. The PolarFire FPGA

I/O buffers are constructed from the following main sub modules.

Transmit buffer (PVT compensated)

Receive buffer

Termination (Thevenin, Differential, Up, and Down)

Weak pull mode logic (Up, Down, and Bus-Hold)

Each I/O is configurable and can comply with a large number of I/O standards. There two types of user

I/Os in PolarFire FPGAs:

High-speed I/O (HSIO) optimized for DDR4 memories at speeds up to 1.6 Gbps and a maximum

voltage of 1.8 V nominal

GPIO capable of supporting multiple standards including 3.3 V with an integrated CDR to support

SGMII Ethernet applications

5.2.1 Input Buffer Speed

The following tables provide information about input buffer speed.

Table 4 • HSIO Maximum Input Buffer Speed

Standard STD –1 Unit

LVDS18 1250 1250 Mbps

RSDS18 800 800 Mbps

MINILVDS18 800 800 Mbps

SUBLVDS18 800 800 Mbps

PPDS18 800 800 Mbps

SLVS18 800 800 Mbps

SSTL18I 800 1066 Mbps

PolarFire FPGA

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Standard STD –1 Unit

SSTL18II 800 1066 Mbps

SSTL15I 1066 1333 Mbps

SSTL15II 1066 1333 Mbps

SSTL135I 1066 1333 Mbps

SSTL135II 1066 1333 Mbps

HSTL15I 900 1100 Mbps

HSTL15II 900 1100 Mbps

HSTL135I 1066 1066 Mbps

HSTL135II 1066 1066 Mbps

HSUL18I 400 400 Mbps

HSUL18II 400 400 Mbps

HSUL12 1066 1333 Mbps

HSTL12 1066 1266 Mbps

POD12I 1333 1600 Mbps

POD12II 1333 1600 Mbps

LVCMOS18 (12 mA) 500 500 Mbps

LVCMOS15 (10 mA) 500 500 Mbps

LVCMOS12 (8 mA) 300 300 Mbps

Performance is achieved with VID ≥200 mV.

Table 5 • GPIO Maximum Input Buffer Speed

Standard STD –1 Unit

LVDS25/LVDS33/LCMDS25/LCMDS33 1250 1600 Mbps

RSDS25/RSDS33 800 800 Mbps

MINILVDS25/MINILVDS33 800 800 Mbps

SUBLVDS25/SUBLVDS33 800 800 Mbps

PPDS25/PPDS33 800 800 Mbps

SLVS25/SLVS33 800 800 Mbps

SLVSE15 800 800 Mbps

HCSL25/HCSL33 800 800 Mbps

BUSLVDSE25 800 800 Mbps

MLVDSE25 800 800 Mbps

LVPECL33 800 800 Mbps

SSTL25I 800 800 Mbps

SSTL25II 800 800 Mbps

SSTL18I 800 800 Mbps

SSTL18II 800 800 Mbps

SSTL15I 800 1066 Mbps

SSTL15II 800 1066 Mbps

HSTL15I 800 900 Mbps

HSTL15II 800 900 Mbps

HSUL18I 400 400 Mbps

PolarFire FPGA

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Standard STD –1 Unit

HSUL18II 400 400 Mbps

PCI 500 500 Mbps

LVTTL33 (20 mA) 500 500 Mbps

LVCMOS33 (20 mA) 500 500 Mbps

LVCMOS25 (16 mA) 500 500 Mbps

LVCMOS18 (12 mA) 500 500 Mbps

LVCMOS15 (10 mA) 500 500 Mbps

LVCMOS12 (8 mA) 300 300 Mbps

MIPI25/MIPI33 800 800 Mbps

All SSTLD/HSTLD/HSULD/LVSTLD/POD type receivers use the LVDS differential receiver.

Performance is achieved with VID ≥200 mV.

5.2.2 Output Buffer Speed

Table 6 • HSIO Maximum Output Buffer Speed

Standard STD –1 Unit

SSTL18I 800 1066 Mbps

SSTL18II 800 1066 Mbps

SSTL18I (differential) 800 1066 Mbps

SSTL18II (differential) 800 1066 Mbps

SSTL15I 1066 1333 Mbps

SSTL15II 1066 1333 Mbps

SSTL15I (differential) 1066 1333 Mbps

SSTL15II (differential) 1066 1333 Mbps

SSTL135I 1066 1333 Mbps

SSTL135II 1066 1333 Mbps

SSTL135I (differential) 1066 1333 Mbps

SSTL135II (differential) 1066 1333 Mbps

HSTL15I 900 1100 Mbps

HSTL15II 900 1100 Mbps

HSTL15I (differential) 900 1100 Mbps

HSTL15II (differential) 900 1100 Mbps

HSTL135I 1066 1066 Mbps

HSTL135II 1066 1066 Mbps

HSTL135I (differential) 1066 1066 Mbps

HSTL135II (differential) 1066 1066 Mbps

HSUL18I 400 400 Mbps

HSUL18II 400 400 Mbps

HSUL18II (differential) 400 400 Mbps

HSUL12 1066 1333 Mbps

HSUL12I (differential) 1066 1333 Mbps

HSTL12 1066 1266 Mbps

PolarFire FPGA

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Standard STD –1 Unit

HSTL12I (differential) 1066 1266 Mbps

POD12I 1333 1600 Mbps

POD12II 1333 1600 Mbps

LVCMOS18 (12 mA) 500 500 Mbps

LVCMOS15 (10 mA) 500 500 Mbps

LVCMOS12 (8 mA) 250 300 Mbps

Table 7 • GPIO Maximum Output Buffer Speed

Standard STD –1 Unit

LVDS25/LCMDS25 1250 1250 Mbps

LVDS33/LCMDS33 1250 1600 Mbps

RSDS25 800 800 Mbps

MINILVDS25 800 800 Mbps

SUBLVDS25 800 800 Mbps

PPDS25 800 800 Mbps

SLVSE15 500 500 Mbps

BUSLVDSE25 500 500 Mbps

MLVDSE25 500 500 Mbps

LVPECLE33 500 500 Mbps

SSTL25I 800 800 Mbps

SSTL25II 800 800 Mbps

SSTL25I (differential) 800 800 Mbps

SSTL25II (differential) 800 800 Mbps

SSTL18I 800 800 Mbps

SSTL18II 800 800 Mbps

SSTL18I (differential) 800 800 Mbps

SSTL18II (differential) 800 800 Mbps

SSTL15I 800 1066 Mbps

SSTL15II 800 1066 Mbps

SSTL15I (differential) 800 1066 Mbps

SSTL15II (differential) 800 1066 Mbps

HSTL15I 900 900 Mbps

HSTL15II 900 900 Mbps

HSTL15I (differential) 900 900 Mbps

HSTL15II (differential) 900 900 Mbps

HSUL18I 400 400 Mbps

HSUL18II 400 400 Mbps

HSUL18I (differential) 400 400 Mbps

HSUL18II (differential) 400 400 Mbps

PCI 500 500 Mbps

LVTTL33 (20 mA) 500 500 Mbps

LVCMOS33 (20 mA) 500 500 Mbps

PolarFire FPGA

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Standard STD –1 Unit

LVCMOS25 (16 mA) 500 500 Mbps

LVCMOS18 (12 mA) 500 500 Mbps

LVCMOS15 (10 mA) 500 500 Mbps

LVCMOS12 (8 mA) 250 300 Mbps

MIPIE25 500 500 Mbps

5.2.3 Maximum PHY Rate for Memory Interface IP

The following tables provide information about the maximum PHY rate for memory interface IP.

Table 8 • Maximum PHY Rate for Memory Interfaces IP for HSIO Banks

Memory

Standard

Gearing

Ratio

VDDAUX VDDI STD

(Mbps)

–1

(Mbps)

Fabric

STD

(MHz)

–1 Fabric

(MHz)

DDR418:1 1.8 V 1.2 V 1333 1600 167 200

DDR3 8:1 1.8 V 1.5 V 1067 1333 133 167

DDR3L 8:1 1.8 V 1.35 V 1067 1333 133 167

LPDDR3 8:1 1.8 V 1.2 V 1067 1333 133 167

QDRII+ 8:1 1.8 V 1.5 V 900 1100 112.5 137.5

RLDRAM328:1 1.8 V 1.35 V 1067 1067 133 133

RLDRAM324:1 1.8 V 1.35 V 667 800 167 200

RLDRAM322:1 1.8 V 1.35 V 333 400 167 200

RLDRAM228:1 1.8 V 1.8 V 800 1067 100 133

RLDRAM224:1 1.8 V 1.8 V 667 800 167 200

RLDRAM222:1 1.8 V 1.8 V 333 400 167 200

Table represents DDR4 in the FC1152 package for all data widths without ECC and CRC enabled.

DDR4 in the FCG484 and FCVG484 packages are limited to 16-bit interfaces for 1600 Mbps support.

RLDRAM2 and RLDRAM3 are not supported with a soft IP controller currently.

Table 9 • Maximum PHY Rate for Memory Interfaces IP for GPIO Banks

Memory

Standard

Gearing

Ratio

VDDAUX VDDI STD

(Mbps)

–1

(Mbps)

Fabric

STD

(MHz)

Fabric –1

(MHz)

DDR3 8:1 2.5 V 1.5 V 800 1067 100 133

QDRII+ 8:1 2.5 V 1.5 V 900 900 113 113

RLDRAM214:1 2.5 V 1.8 V 800 800 200 200

RLDRAM212:1 2.5 V 1.8 V 400 400 200 200

RLDRAM2 is currently not supported with a soft IP controller.

The following table lists the GPIO LVTTL or LVCMOS receivers that are also designed to support a limited

mixed mode of operation to provide greater board I/O design flexibility. For example, if VDDIO is set to

3.3 V, the I/O receivers can operate at the lower voltage of JEDEC standards.

PolarFire FPGA

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Table 10 • GPIO Mixed Receiver Mode Operation Capability

VDDIO (V) LVCMOS33 LVCMOS25 LVCMOS18 LVCMOS15 LVCMOS12

3.3 Yes Yes Yes Not available Yes

2.5 Yes Yes Yes Yes Yes

1.8 Yes Yes Yes Yes Yes

1.5 Yes Yes Yes Yes Yes

1.2 Yes Yes Not available Yes Yes

The following table lists the HSIO mixed receiver mode capability.

Table 11 • HSIO Mixed Receiver Mode Capability

VDDIO (V) LVCMOS18 LVCMOS15 LVCMOS12

1.8 Yes Yes Yes

1.5 Yes Yes Yes

1.2 Not available Yes Yes

5.3 I/O Digital

The PolarFire FPGA I/O digital logic is used to interface between the FPGA fabric and the I/O buffers. It

interfaces between the high-speed I/O buffers and lower-speed FPGA fabric. The I/O digital block

consists of the following:

A delay chain, for input or output delay

Registers and control logic for input modes and output modes

The I/O digital registers can be configured for both input and output DDR and shift register modes and

combined DDR-shift register modes. It allows gearing up the output data rate and gearing down the

input data rate. The PolarFire FPGA I/O digital logic works in conjunction with fast and low-skew clock

distributions that are optimized for DDR applications, special clock dividers, and other support circuits to

guarantee clock domain crossings.

5.3.1 I/O Digital Features

The following are the I/O digital features:

Programmable input and/or output delay chain

Data eye monitor for detecting margin to clock edges

Data eye position optimizer

Up to 10:1 input deserialization

Up to 10:1 output serialization

Support for DDR and SDR interfaces

Receive slip control to facilitate word alignment

Fast and low-skew lane clocks per 12 I/Os

Clock recovery for SGMII and similar interfaces (one per 12 I/Os)

5.3.2 I/O Digital Modes

The following table lists the associated memory interface, I/O data rate, FPGA clock rate, and its

applications.

PolarFire FPGA

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Table 12 • I/O Digital Modes

Interface Direction I/O Data

Rate

I/O Clock Rate

(MHz)

Gear

Ratio

FPGA Clock Rate

(MHz)

Applications

DDR4 BiDir 1.6 Gbps 800 8:1 200 Memory interface

DDR3 (L) BiDir 1.3 Gbps 650 8:1 162.5 Memory interface

LPDDR3 BiDir 1.3 Gbps 650 8:1 162.5 Low-power memory

interface

QDRII+ Input/

Output

1.1 Gbps 550 8:1 137.5 Low-latency memory

interface

RLDRAM3 Input/

Output

1.0 Gbps 500 8:1 125 Low-latency memory

interface

7:1 LVDS Input 800 Mbps 400 7:1 114 Flatlink, Cameralink

CDR Input 1.25 Gbps 625 10:1 125 1000BASE-T, SGMII

MIPI-DPHY Input/

Output

800 Mbps/

500 Mbps

250 2:1 125 MIPI CSI, DSI

PolarFire FPGA

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6 PCI Express

Each PolarFire FPGA integrates two low-power built-in PCIe Gen2 controllers, allowing seamless and

easy connectivity to one or more host processors. The two PCIe controllers are shared across two quads,

as shown in the following illustration. All PLLs are jitter attenuation-capable, while the SSC label

indicates spread spectrum clock (SSC) capability.

Figure 8 • PCI Express Hard Macro Lane Sharing

PolarFire FPGA

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6.1 PCI Express Features

The following are PCIe features:

×1, ×2, and ×4 lane support

Suitable for root port, native endpoint

PCI Express base specification revision 2.0 and 1.1 compliant

AXI4 master and slave interfaces to the FPGA fabric

Single function capability

Advanced error reporting (AER) support

Integrated clock domain crossing (CDC) to support user-selected AXI4 frequency

Lane reversal support

Legacy PCI power management support

Native active state power management L0s and L1 state support

Power management event (PME message)

MSI and legacy INT message support

Latency tolerance reporting (LTR)

L1 PM sub-states with CLKREQ

Address translation tables between the PCIe and AXI4 domains

6.2 PCI Express DMA Engines

Each PCIe controller supports the following built-in DMA modes, enabling low-power and efficient data

transfer into the FPGA fabric.

Two DMA channels

Eight outstanding read and write requests

Completion reordering support

Flexible scatter-gather DMA modes, including dynamic DMA control per descriptor

Optional DMA engine reporting to the descriptor to ease software management

Fetching of up to three descriptors to optimize throughput

PolarFire FPGA

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7 PolarFire FPGA System Controller

The PolarFire FPGA system controller is based on the industry-standard ARM Cortex-M3 and is only used

for FPGA powerup, secure DPA safe FPGA programming, and executing and responding to system

services. All internal memories are SECDED protected with background scrubbing capabilities to remove

single bit errors.

7.1 System Services

System services provide the user with information about the state of the FPGA and allow the user to

request the system controller to perform predefined functions using a standard Application

Programming Interface (API).

Design services

Initialize fabric RAM

Bitstream authentication

IAP image authentication

Data services

sNVM read/write

PUF emulation service

Nonce service

Device services

Serial number

JTAG user code

Design version number

Device certificate

FPGA fabric services

In-application programming

Digest check

PolarFire FPGA

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8 Debug Probe System

Two specified user I/Os can be configured (at design capture stage) as either two single-ended live

probes or one differential live probe. These live probes can provide read access to any register in the

FPGA fabric, to the output pipeline registers in the LSRAMs, and to all the registers in the math block in

real-time without having to re-instrument the code. A snapshot of all internal probe points can be

created and read out asynchronously. The live-probe feature can be considered like a two-channel

oscilloscope, whose two channels can be routed out to I/Os for external observation, and to internal

ports to allow fabric design observation. Selecting different probe points within the PolarFire FPGA

occurs dynamically through commands over the JTAG port using SmartDebug. Reprogramming of the

FPGA is not required.

The debug probe system includes the following:

Active probe allows dynamic asynchronous read and write to a flip-flop or a probe point. This

enables quick internal observation of the logic output or experimentation on how the logic will be

affected by writing to a probe point.

Memory debug allows dynamic asynchronous read and write to a µSRAM or a large SRAM block to

quickly verify if the content of the memory is changing as expected.

Probe insertion allows routing of nodes or debug points in the FPGA design externally through

unused I/Os. An oscilloscope/logic analyzer can be attached to monitor them as live signals.

PolarFire FPGA

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9 Programming

Microsemi’s PolarFire FPGAs have multiple programming modes designed to enable various use models.

All bitstreams are always encrypted and DPA safe. Each PolarFire FPGA can be programmed using a

dedicated SPI peripheral and JTAG port. All PolarFire FPGAs are typically reprogrammed in less than 60

seconds. For device specific programming timings, see .DS0141: PolarFire FPGA Datasheet

The following programming modes are supported:

Slave Programming

JTAG

Slave SPI—an external SPI master programs the FPGA

SPI Master Programming—In-Application Programming (IAP)

Auto update feature—the system controller on power-up checks for a new bitstream in an

external SPI flash and programs the FPGA.

Auto programming feature—on a blank device, the system controller on power-up checks for a

bitstream in an external SPI flash and programs the FPGA.

Programming recovery feature—if remote programming fails due to a power interruption, the

system controller reprograms the FPGA on the next power-up cycle from a golden bitstream

(located in an external SPI flash).

9.1 Dedicated SPI Programming Port

To facilitate the use of various programming modes PolarFire FPGAs share dedicated SPI port pins

between the system controller and user logic embedded in the FPGA. User logic must instantiate the

User SPI macro to gain access to the pins from their design. The SPI port pins can be used as a master or

slave programming port based on the signal level on the dedicated SPI mode pin. The dedicated SPI

Enable pin also allows an external SPI master to program the on-board SPI flash without an external

MUX by tri-stating the SPI MOSI/MISO/SS/CLK pins on the PolarFire FPGA.

The following illustration shows the SPI port facilitating the use of various programming modes.

Figure 9 • SPI Programming Port

PolarFire FPGA

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10 Low Power

PolarFire FPGAs offer a variety of techniques and capabilities to lower the total application power. Users

can take advantage of these features to lower both capital and operational expenditures with smaller or

no heat sinks, smaller or fewer fans, lower cooling costs, and so on. Additionally, the lower total power

advantage can also allow the user to pack more compute operations into an existing thermal budget.

10.1 Non-Volatile Technology

Using a non-volatile complementary metal–oxide semiconductor (CMOS) technology for the FPGA

configuration cells offers several power advantages over SRAM FPGA technology.

A non-volatile switch has lower power than a SRAM switch, leading to lower static power

consumption

No SRAM configuration in-rush currents

An external configuration component is not necessary

10.2 Low-Power Transceiver Lane

PolarFire FPGAs’ low-power capability is also extended to the industry’s most power efficient

transceiver lane, enabling 10GBASE-KR applications at less than 100 mW of power per lane. The

transceiver lane has comprehensive power-down controls to optimize power consumption, including

programmable amplitude and edge rate control.

The following illustration shows the connection between transceiver power and data rate.

Figure 10 • Transceiver Power versus Data Rate

10.3 Lower Power "L" Devices

Low power (L) devices provide up to 35 percent lower static power with identical electrical specifications

to the STD speed grade device. L devices can be ordered as described in the section Ordering

.Information (see page 33)

PolarFire FPGA

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11 Reliability

Microsemi continues to offer the industry’s most reliable FPGAs for your mission and safety critical

applications.

11.1 FPGA Fabric

PolarFire FPGA configuration cells are inherently immune to SEUs caused by neutrons. Contrary to

popular belief, shielding does not prevent a neutron from passing through an electronic system or

electronic device. As semiconductor device geometry shrinks to smaller lithography, the problem of

MBUs starts appearing. SRAM FPGA scrubbing techniques might be inadequate in these circumstances

and while scrubbing may help, an important point is that scrubbing detects an error after the fact. The

error has already occurred and propagated throughout the system. The configuration of the PolarFire

FPGA fabric provides worry-free operation against random events caused by SEUs.

11.2 LSRAM

LSRAMs have built-in SECDED capability on a 32-bit word boundary. Seven additional bits are used for

error correction. Two flags are provided to the user to indicate SECDED. Mitigation against multi-bit

upsets is provided by keeping all cells in a word separated by a minimum distance of 5 µm. Applications

that require scrubbing need to be accomplished with user logic. The error correction logic can be turned

ON and OFF by the user to enable easy validation of the error correction operation.

11.3 µSRAM

The 64 × 12 µSRAMs are constructed from latches and are not as sensitive to SEUs as SRAMs are.

11.4 Digests

Digests verify the integrity of the programmed non-volatile data. Digests are a cryptographic hash of

various data areas. Any digest that reports back an error raises the digest tamper flag.

The following are digestible non-volatile areas:

The FPGA fabric and consequently the µPROM

sNVM marked as ROM

User key 1

User key 2

Factory parametric and key storage

11.5 System Controller Suspend Mode

For safety critical applications, PolarFire FPGAs allow the user to place the Cortex-M3-based system

controller in a reset state after the FPGA has powered up. By programming an SEU configuration non-

volatile bit, the Cortex-M3 is placed in reset by a TMRed SEU immune reset latch after FPGA power-up.

User logic can monitor if the suspend mode command is active and if the system controller cannot fetch

instructions while in the reset state. The FPGA can be re-programmed after disabling the suspend mode

by asserting the appropriate JTAG signals. The JTAG TRSTB signal must be asserted low for suspend

mode to remain active.

The following illustration shows how to activate and deactivate suspend mode.

PolarFire FPGA

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Figure 11 • System Controller Suspend Mode

PolarFire FPGA

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12 Security

Today’s demanding applications not only have to meet the functional requirements, but also to meet

them in a secured way. Security starts during silicon manufacturing and continues through system

deployment and operations. Microsemi’s PolarFire FPGAs represent the industry’s most advanced

secure programmable FPGAs.

12.1 Design Security

Protecting your design starts with wafer manufacturing and continues through the deployment of the

end product. The following are key features that provide state-of-the-art supply chain assurance and IP

protection benefits in all PolarFire FPGA devices:

Secure supply chain management through the use of hardware security modules (HSMs) during

wafer test and packaging

Supply chain assurance through the use of a 768-byte digitally signed x.509 FPGA certificate

embedded in every FPGA

AES256-encrypted CRI DPA countermeasures patent protected, bitstream, and key management

protocols

Built-in tamper detectors: voltage monitors, temperature monitor, clock glitch detectors, voltage

glitch detectors, protective meshes, and bus scrambling

Data integrity through built-in cryptographic digest capabilities

Zeroization capabilities for all on-chip memories and the FPGA fabric

Integrated PUF for the ultimate in key storage

56 Kbytes of PUF protected sNVM

Secure reprogrammable keys using non-volatile memory

12.1.1 Tamper Detectors

Microsemi’s PolarFire FPGAs integrate numerous on-chip tamper detectors, enabling users to monitor

the environment and the operating parameters of the design. The user can respond to the events that

are determined to be out-of-scope for proper operation. Tamper flags indicate that a tamper event has

occurred and are available as signals to the FPGA fabric for users to process and respond. The following

is a partial list of tamper detectors:

Clock glitch detectors

Clock frequency detectors

Voltage monitor detectors

Voltage glitch detector for all three power supplies

Temperature sensor

JTAG active detector

Mesh active detector

12.1.2 Tamper Responses

After processing a detected event, the user can perform one of the following actions.

Disable I/Os—configurable on a per I/O basis

Security lockdown

Reset

Zeroize

12.2 Data Security

Select Microsemi PolarFire FPGAs (TS FPGAs) build on the design security capabilities in all PolarFire

FPGAs by enabling high-speed DPA safe cryptographic protocols at wire-line speeds. PolarFire data

security FPGAs include the following additional features.

Integrated true random number generator for enabling modern cryptographic protocols capable of

generating random numbers at greater than 100 Mbps

189 MHz Athena TeraFire 5200B DPA safe Crypto Coprocessor capable of implementing Suite-B+

PolarFire FPGA

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189 MHz Athena TeraFire 5200B DPA safe Crypto Coprocessor capable of implementing Suite-B+

algorithms

CRI DPA pass-through licensing enabling DPA safe high-speed cryptographic designs in the FPGA

fabric. A CRI license is included in the purchase price of the TS FPGA. There is no need to negotiate a

separate license.

NIST-certified protocols

The following are TeraFire EXP-F5200B supported protocols/features:

TRNG (integrated): SP800-90A CTR_DRBG-256, and SP800-90B(draft) NRBG

AES-128/192/256 E/D (ECB, CBC, CTR, OFB, CFB, CCM, GCM, KeyWrap)

AES GCM mode is implemented through an application note.Note:

SHA-1/224/256/384/512

HMAC-SHA-256/384/512; GMAC; CMAC

SHA-256 Key Tree

ECC-NIST P192/224/256/384/521 and Brainpool P256/384/512 curves with: KAS-ECC CDH; ECDSA-

SigGen, SigVer, PKG, and PKV

FFC: 1024/1536/2048/3072/4096-bits with: DSA SigGen and SigVer; and KAS-DH

IFC: 1024/1536/2048/3072/4096/8192-bits with: RSA E/D; SSA_PKCS1_V1_5 SigGen and SigVer; and

ANSI X9.31 SigGen and SigVer

The following illustration shows a typical use model for using the Athena Crypto Coprocessor.

Figure 12 • Using the Athena TeraFire 5200B Crypto Coprocessor

Users instantiate a RISC-V CPU for command and control, including fetching keys from the system

controller through a system service API, initializing the Athena Core, and setting up DMA to perform the

desired function. The TeraFire core comes with a complete firmware driver library for all supported

protocols. These driver libraries are delivered to the designer’s desktop through our Firmware Catalog

within Libero SoC PolarFire.

PolarFire FPGA

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13 PolarFire FPGA Device Offerings

PolarFire FPGAs offer low-power transceiver devices and various device offerings with transceivers, such

as design security, data security, and low-power data security. All PolarFire FPGAs are integrated with

multi-protocol industry-leading low-power transceivers. Low power (L) devices provide up to 35 percent

lower static power with identical electrical specifications to the STD speed grade device. Also, data

security (S) devices integrate a DPA-resistant crypto accelerator.

The following table lists the PolarFire FPGA device options using the MPF300T as an example. The

MPF100T, MPF200T, and MPF500T device densities have identical offerings. Temperatures listed are

junction temperatures.

Table 13 • PolarFire FPGA Offerings

Device

Options

Extended Commercial

Temperature (E)

0 °C–100 °C

Industrial

Temperature (I)

–40 °C–100 °C

STD

Speed

Grade

–1

Speed

Grade

Transceivers

(T)

Lower

Static

Power

(L)

Data

Security

(S)

MPF300T Yes Yes Yes Yes Yes

MPF300TL Yes Yes Yes Yes Yes

MPF300TS Yes Yes Yes Yes Yes

MPF300TLS Yes Yes Yes Yes Yes

The following table lists the planned military temperature offerings for the PolarFire FPGA device (data

security "S", STD speed grade, leaded package, –55 °C–125 °C Tj). For availability, please contact your

local Microsemi representative. Only Military Temperature grade devices are offered in a leaded

package.

Table 14 • PolarFire FPGA Military Temperature Offering

Package Type MPF200TS MPF300TS MPF500TS

FCS325 (11x14.5, 0.5 mm) Yes

FCS536 (16x16, 0.5 mm) Yes

FCV484 (19x19, 0.8 mm) Yes

FC484 (23x23, 1.0 mm) Yes

FC784 (29x29, 1.0 mm) Yes

FC1152 (35x35, 1.0 mm) Yes

PolarFire FPGA

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14 Ordering Information

PolarFire FPGAs are offered with multiple speed grades, temperatures, and package combinations. All

FPGAs are equipped with low-power transceivers. All temperatures are specified as junction

temperatures.

Figure 13 • Ordering Information

PolarFire FPGA

51700137 PO0137 Product Overview Revision 1.5 34

15 Export Classification

The following table lists the PolarFire FPGA export classification using the MPF300T as an example. The

MPF100T, MPF200T, and MPF500T device densities have identical classifications. This table is applicable

to extended commercial and industrial temperature grade devices.

Table 15 • PolarFire FPGA Export Classification

Device

Options

Data Security (S) ECCN

MPF300T No 3A991.d

MPF300TL No 3A991.d

MPF300TS Yes 5A002.a.1

MPF300TLS Yes 5A002.a.1

PolarFire FPGA

51700137 PO0137 Product Overview Revision 1.5 35

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