Skyworks Solutions, Inc. • Phone [781] 376-3000 • Fax [781] 376-3100 • sales@skyworksinc.com • www.skyworksinc.com
200793D • Skyworks Proprietary Information • Products and Product Information are Subject to Change Without Notice • August 15, 2014 1
DATA SHEET
Silicon Beamless Schottky Diodes: Pairs and Quads
Applications
Microwave MIC assembly and automated high volume
manufacturing lines
Mixers
Features
Mechanically rugged design
Three barrier heights for optimized mixer performance
Wide product range: series pair, ring, bridge, and eight-diode
rings
Use in ring or crossover designs in double balanced mixers
Virtually any LO requirement can be met with choice of barrier
height
100% DC tested on water
Available on film frame or waffle pack
Skyworks Green™ products are compliant with
all applicable legislation and are halogen-free.
For additional information, refer to Skyworks
Definition of Green™, document number
SQ04-0074.
Description
Skyworks beamless diode family is designed for a high degree of
device reliability in both commercial and industrial uses. The
diodes are designed to offer the utmost in performance as well as
achieving price sensitive cost targets for commercial systems.
Assembly and Handling Procedure
The process flow for assembly is:
Die attach using nonconductive epoxy
Wire bond
Encapsulation (nonconductive epoxy)
Die Attach Methods
All leadless chips are compatible with both eutectic and
conductive epoxy die attach methods. Eutectic processes use
Sn/Au or Sn/Pb solder. Nonconductive die attach is
recommended.
Packing Methods
1. Gel pak
2. Wafer on film frame (rejects are marked with ink):
– Diced, ready for pick and place
– Unsawn, whole wafer, 7-mil thick, maximum
Wire Bonding
Two methods can be used to connect wire, ribbon, or wire mesh
to the chips:
Thermocompression
Ballbonding
Skyworks recommends use of pure gold wire.
Electrical and Physical Specifications
Absolute maximum ratings for the beamless Schottky diodes are
provided in Table 1. Electrical specifications are noted in Table 2.
SPICE model parameters are defined in Table 3.
A typical bonding configuration is illustrated in Figure 1.
DATA SHEET • SILICON BEAMLESS SCHOTTKY DIODES
Skyworks Solutions, Inc. • Phone [781] 376-3000 • Fax [781] 376-3100 • sales@skyworksinc.com • www.skyworksinc.com
2 August 15, 2014 • Skyworks Proprietary Information • Products and Product Information are Subject to Change Without Notice • 200793D
Table 1. Absolute Maximum Ratings (Note 1)
Parameter Symbol Minimum Maximum Units
Peak inverse voltage PIV VB –
Supply current IMAX 50 mA/V
Power dissipation (CW) PDISS 75 mW/junction
Storage temperature TSTG –65 +175 C
Operating temperature TOP –65 +150 C
Electrostatic discharge:
Human Body Model (HBM), Class 0
ESD
< 250
V
Note 1: Exposure to maximum rating conditions for extended periods may reduce device reliability. There is no damage to device with only one parameter set at the limit and all other
parameters set at or below their nominal value. Exceeding any of the limits listed here may result in permanent damage to the device.
CAUTION: Although this device is designed to be as robust as possible, electrostatic discharge (ESD) can damage this device. This device
must be protected at all times from ESD. Static charges may easily produce potentials of several kilovolts on the human body
or equipment, which can discharge without detection. Industry-standard ESD precautions should be used at all times.
Table 2. Electrical Specifications (Per Junction) (1 of 2) (Note 1)
Part Number Band Barrier
VF
IF = 1.0 mA
(mV)
ΔVF
IF = 1.0 mA
(mV)
CJ (Note 2)
VR = 0 V,
f = 1 MHz
(pF)
RS
IF = 5 mA
(Ω)
VB
@ 10 μA
(V)
Outline
Drawing
Number
Min Max Max Min Max Max Min
Ring Quad (Note 3)
DMF3926-000 S Low 200 260 10 0.30 0.50 5 – 551-002
DME3927-000 S Medium 300 400 10 0.30 0.50 5 – 551-002
DMJ3928-000 S High 500 600 10 0.30 0.50 5 – 551-002
DMF3942-000 X Low 250 310 10 0.15 0.30 8 – 551-002
DME3943-000 X Medium 325 425 10 0.15 0.30 8 – 551-002
DMJ3944-000 X High 550 650 10 0.15 0.30 8 – 551-002
Bridge Quad (Note 3)
DMF3929-000 S Low 200 260 10 0.30 0.50 5 2 551-004
DME3930-000 S Medium 300 400 10 0.30 0.50 5 3 551-004
DMJ3931-000 S High 500 600 10 0.30 0.50 5 4 551-004
DMF4102-000 X Low 250 310 10 0.15 0.3 14 2 551-004
DME4101-000 X Medium 325 425 10 0.15 0.3 14 3 551-004
DMJ4103-000 X High 550 650 10 0.15 0.3 14 4 551-004
Series Pair (Note 3)
DMF3932-000 S Low 200 260 10 0.30 0.50 5 2 551-012
DME3933-000 S Medium 300 400 10 0.30 0.50 5 3 551-012
DMJ3934-000 S High 500 600 10 0.30 0.50 5 4 551-012
Back-to-Back Ring Series Pair (Note 3)
DMF3935-000 S Low 200 260 10 0.30 0.50 5 – 551-056
DME3936-000 S Medium 300 400 10 0.30 0.50 5 – 551-056
DMJ3937-000 S High 500 600 10 0.30 0.50 5 – 551-056
DATA SHEET • SILICON BEAMLESS SCHOTTKY DIODES
Skyworks Solutions, Inc. • Phone [781] 376-3000 • Fax [781] 376-3100 • sales@skyworksinc.com • www.skyworksinc.com
200793D • Skyworks Proprietary and Confidential information • Products and Product Information are Subject to Change Without Notice • August 15, 2014 3
Table 2. Electrical Specifications (Per Junction) (2 of 2) (Note 1)
Part Number Band Barrier
VF
IF = 1.0 mA
(mV)
ΔVF
IF = 1.0 mA
(mV)
CJ (Note 2)
VR = 0 V,
f = 1 MHz
(pF)
RS
IF = 5 mA
(Ω)
VS
@ 10 μA
(V)
Outline
Drawing
Number
Min Max Max Min Max Max Min
Octoquad Ring (Note 4)
DMF3938-000 S-X Low 400 520 15 0.15 0.30 16 – 556-020
DME3939-000 S-X Medium 600 800 15 0.15 0.30 16 – 556-020
DMJ3940-000 S-X High 1000 1200 15 0.15 0.30 16 – 556-020
Back-to-Back Crossover Quad, to 6 GHz
DMF3945-000 S Low 200 260 15 0.30 0.50 5 – 588-065
DME3946-000 S Medium 300 400 15 0.30 0.50 5 – 588-065
DMJ3947-000 S High 525 625 15 0.30 0.50 5 – 588-065
N
ote 1. Performance is guaranteed only under the conditions listed in this table.
N
ote 2: Cj represents total capacitance. Maximum Cj unbalance @ 0 V, 1 MHz = 0.25 pF.
N
ote 3: Matching criteria Vf @ 1 mA ≤ 15 mV available for matched sets.
N
ote 4: Matching criteria Vf @ 1 mA ≤ 20 mV available for matched sets.
Table 3. SPICE Model Parameters (Per Junction)
Part
Number
Prefix
IS
(A)
RS
(Ω) N TT
(s)
CJO
(pF) M EG
(eV)
VJ
(V) XTI FC BV
(V)
IBV
(A)
DMF3926 2.5 x 10–7 4 1.04 1 x 10–11 0.42 0.32 0.69 0.51 2 0.5 2 1 x 10–5
DME3927 1.3 x 10–9 4 1.04 1 x 10–11 0.39 0.34 0.69 0.65 2 0.5 3 1 x 10–5
DMJ3926 9.0 x 10–13 4 1.04 1 x 10–11 0.39 0.42 0.69 0.84 2 0.5 3 1 x 10–5
DMF4102 1.1 x 10–7 6 1.04 1 x 10–11 0.22 0.32 0.69 0.495 2 0.5 2 1 x 10–5
DME4101 2.4 x 10–9 6 1.04 1 x 10–11 0.20 0.37 0.69 0.595 2 0.5 3 1 x 10–5
DMJ4103 8.5 x 10–13 6 1.04 1 x 10–11 0.20 0.42 0.69 0.800 2 0.5 4 1 x 10–5
DATA SHEET • SILICON BEAMLESS SCHOTTKY DIODES
Skyworks Solutions, Inc. • Phone [781] 376-3000 • Fax [781] 376-3100 • sales@skyworksinc.com • www.skyworksinc.com
4 August 15, 2014 • Skyworks Proprietary Information • Products and Product Information are Subject to Change Without Notice • 200793D
Ring Quad
Crossover Quad
Bond Pad
13
24
13
24 Bond Pad
S3542
Figure 1. Typical Bonding Configuration
Package Information
Skyworks silicon beamless Schottky diodes are provided in Gel
paks and on film frame. Package dimensions are provided in
Figures 2 through 7.
DATA SHEET • SILICON BEAMLESS SCHOTTKY DIODES
Skyworks Solutions, Inc. • Phone [781] 376-3000 • Fax [781] 376-3100 • sales@skyworksinc.com • www.skyworksinc.com
200793D • Skyworks Proprietary and Confidential information • Products and Product Information are Subject to Change Without Notice • August 15, 2014 5
0.015 in (0.381 mm)
± 0.001 in (0.025 mm)
0.015 in (0.381 mm)
± 0.001 in (0.025 mm)
3
2
4
1
0.0035 in (0.089 mm)
± 0.0035 in (0.089 mm)
4 Plcs.
Schematic
0.006 in (0.18 mm)
± 0.001 in (0.025 mm)
13
2
4
S3543
Figure 2. 551-002 Package Dimensions
0.015 in (0.381 mm)
± 0.001 in (0.025 mm)
0.015 in (0.381 mm)
± 0.001 in (0.025 mm)
3
4
4321
2
1
0.0035 in (0.089 mm)
± 0.0035 in (0.089 mm)
4 Plcs.
Schematic
0.006 in (0.18 mm)
± 0.001 in (0.025 mm)
S3546
Figure 4. 551-056 Package Dimensions
Schematic
0.015 in (0.381 mm)
± 0.001 in (0.025 mm)
0.015 in (0.381 mm)
± 0.001 in (0.025 mm)
3
2
1
3
12
0.0035 in (0.089 mm)
± 0.0035 in (0.089 mm)
3 Plcs.
0.006 in (0.18 mm)
± 0.001 in (0.025 mm)
S3544
Figure 3. 551-012 Package Dimensions
Schematic
1
2
3
4
017-1
3
2
1
4
0.004 x 0.004 in
(0.10 x 0.10 mm)
4 Plcs.
0.020 in (0.500 mm)
± 0.001 in (0.025 mm)
0.020 in (0.500 mm)
± 0.001 in (0.025 mm)
0.006 in (0.180 mm)
± 0.001 in (0.025 mm)
0.020 in (0.500 mm)
S3545
Figure 5. 556-020 Package Dimensions
DATA SHEET • SILICON BEAMLESS SCHOTTKY DIODES
Skyworks Solutions, Inc. • Phone [781] 376-3000 • Fax [781] 376-3100 • sales@skyworksinc.com • www.skyworksinc.com
6 August 15, 2014 • Skyworks Proprietary Information • Products and Product Information are Subject to Change Without Notice • 200793D
Measurement tolerance = ± 0.001 in (± 0.025 mm)
1
6
5
4
3
2
1
6
5
2
3
4
Schematic
0.003 in (0.09 mm)
0.008 in (0.20 mm)
0.013 in (0.31 mm)
0.022 in (0.54 mm)
0.016 in (0.40 mm)
0.025 in (0.62 mm)
Au-plated bond pad
0.003 in (0.08 mm) Sq. 6 Plcs.
0.003 in (0.08 mm)
0.007 in (0.17 mm)
S3547
0.004 in (0.09 mm)
0.008 in (0.20 mm)
0.017 in (0.42 mm)
Figure 6. 588-065 Package Dimensions
0.015 in (0.381 mm)
± 0.001 in (0.025 mm)
0.015 in (0.381 mm)
± 0.001 in (0.025 mm)
23
4
1
0.006 in (0.18 mm)
± 0.001 in (0.025 mm)
0.0035 in (0.089 mm)
± 0.0035 in (0.089 mm)
4 Plcs.
Schematic
3
4
1
2
S3548
Figure 7. 551-004 Package Dimensions
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