S E M I C O N D U C T O R HIN230 thru HIN241 +5V Powered RS-232 Transmitters/Receivers August 1997 Features Description * Meets All RS-232E and V.28 Specifications The HIN230-HIN241 family of RS-232 transmitters/receivers interface circuits meet all ElA RS-232E and V.28 specifications, and are particularly suited for those applications where 12V is not available. They require a single +5V power supply (except HIN231 and HIN239) and features onboard charge pump voltage converters which generate +10V and -10V supplies from the 5V supply. The HIN233 and HIN235 require no external capacitors and are ideally suited for applications where circuit board space is critical. The family of devices offer a wide variety of RS-232 transmitter/receiver combinations to accommodate various applications (see Selection Table). * Requires Only Single +5V Power Supply - (+5V and +12V - HIN231 and HIN239) * HIN233 and HIN235 Require No External Capacitors * Onboard Voltage Doubler/Inverter * Low Power Consumption * Low Power Shutdown Function * Three-State TTL/CMOS Receiver Outputs The drivers feature true TTL/CMOS input compatibility, slewrate-limited output, and 300 power-off source impedance. The receivers can handle up to 30V, and have a 3k to 7k input impedance. The receivers also feature hysteresis to greatly improve noise rejection. * Multiple Drivers - 10V Output Swing for +5V lnput - 300 Power-Off Source Impedance - Output Current Limiting - TTL/CMOS Compatible - 30V/s Maximum Slew Rate Applications * Multiple Receivers - 30V Input Voltage Range - 3k to 7k Input Impedance - 0.5V Hysteresis to Improve Noise Rejection * Any System Requiring RS-232 Communications Port - Computer - Portable, Mainframe, Laptop - Peripheral - Printers and Terminals - Instrumentation - Modems Selection Table POWER SUPPLY VOLTAGE NUMBER OF RS-232 DRIVERS NUMBER OF RS-232 RECEIVERS EXTERNAL COMPONENTS LOW POWER SHUTDOWN/TTL THREE-STATE NUMBER OF LEADS HIN230 +5V 5 0 4 Capacitors YES/NO 20 HIN231 +5V and +7.5V to 13.2V 2 2 2 Capacitors NO/NO 16 HIN232 +5V 2 2 4 Capacitors NO/NO 16 HIN233 +5V 2 2 None NO/NO 20 HIN234 +5V 4 0 4 Capacitors NO/NO 16 HIN235 +5V 5 5 None YES/YES 24 HIN236 +5V 4 3 4 Capacitors YES/YES 24 HIN237 +5V 5 3 4 Capacitors NO/NO 24 HIN238 +5V 4 4 4 Capacitors NO/NO 24 HIN239 +5V and +7.5V to 13.2V 3 5 2 Capacitors NO/YES 24 HIN240 +5V 5 5 4 Capacitors YES/YES 44 HIN241 +5V 4 5 4 Capacitors YES/YES 28 PART NUMBER CAUTION: These devices are sensitive to electrostatic discharge. Users should follow proper IC Handling Procedures. Copyright (c) Harris Corporation 1997 8-29 File Number 3138.4 HIN230 thru HIN241 Ordering Information PART NUMBER TEMP. RANGE (oC) PACKAGE PART NUMBER PKG. NO. HIN230CB 0 to 70 20 Ld SOIC M20.3 HIN236BY HIN230IB -40 to 85 20 Ld SOIC M20.3 HIN237CP HIN230BY Die TEMP. RANGE (oC) PACKAGE PKG. NO. Die 0 to 70 24 Ld PDIP E24.3 HIN237CB 0 to 70 24 Ld SOIC M24.3 HIN231CB 0 to 70 16 Ld SOIC M16.3 HIN237IP -40 to 85 24 Ld PDIP E24.3 HIN231IB -40 to 85 16 Ld SOIC M16.3 HIN237IB -40 to 85 24 Ld SOIC M24.3 HIN231BY Die HIN237BY Die HIN232CP 0 to 70 16 Ld PDIP E16.3 HIN238CP 0 to 70 24 Ld PDIP E24.3 HIN232CB 0 to 70 16 Ld SOIC M16.3 HIN238CB 0 to 70 24 Ld SOIC M24.3 HIN232IP -40 to 85 16 Ld PDIP E16.3 HIN238IP -40 to 85 24 Ld PDIP E24.3 HIN232IJ -40 to 85 16 Ld CERDIP F16.3 HIN238IB -40 to 85 24 Ld SOIC M24.3 HIN232IB -40 to 85 16 Ld SOIC M16.3 HIN238BY HIN232MJ -55 to 125 16 Ld CERDIP F16.3 HIN239CB 0 to 70 24 Ld SOIC M24.3 HIN239IB -40 to 85 24 Ld SOIC M24.3 HIN232BY HIN233CP Die Die 0 to 70 20 Ld PDIP E20.3 HIN239BY HIN234CB 0 to 70 16 Ld SOIC M16.3 HIN240CN 0 to 70 44 Ld MQFP Q44.10X10 HIN234IB -40 to 85 16 Ld SOIC M16.3 HIN240IN -40 to 85 44 Ld MQFP Q44.10X10 HIN234BY Die HIN235CP 0 to 70 24 Ld PDIP HIN236CP 0 to 70 HIN236CB 0 to 70 HIN236IP -40 to 85 HIN236IB -40 to 85 Die HIN240BY Die E24.3 HIN241CB 0 to 70 28 Ld SOIC M28.3 24 Ld PDIP E24.3 HIN241IB -40 to 85 28 Ld SOIC M28.3 24 Ld SOIC M24.3 HIN241CA 0 to 70 28 Ld SSOP M28.209 24 Ld PDIP E24.3 HIN241IA -40 to 85 28 Ld SSOP M28.209 24 Ld SOIC M24.3 HIN241BY Die Pin Descriptions PIN VCC FUNCTION Power Supply Input 5V 10%. HIN233 and HIN235 5V 5%. V+ Internally generated positive supply (+10V nominal), HIN231 and HIN239 requires +7.5V to +13.2V. V- Internally generated negative supply (-10V nominal). GND Ground lead. Connect to 0V. C1+ External capacitor (+ terminal) is connected to this lead. C1- External capacitor (- terminal) is connected to this lead. C2+ External capacitor (+ terminal) is connected to this lead. C2- External capacitor (- terminal) is connected to this lead. TIN Transmitter Inputs. These leads accept TTL/CMOS levels. An internal 400k pull-up resistor to VCC is connected to each lead. TOUT RIN ROUT Transmitter Outputs. These are RS-232 levels (nominally 10V). Receiver Inputs. These inputs accept RS-232 input levels. An internal 5k pull-down resistor to GND is connected to each input. Receiver Outputs. These are TTL/CMOS levels. EN Enable input. This is an active low input which enables the receiver outputs. With EN = 5V, the outputs are placed in a high impedance state. SD Shutdown Input. With SD = 5V, the charge pump is disabled, the receiver outputs are in a high impedance state and the transmitters are shut off. NC No Connect. No connections are made to these leads. 8-30 HIN230 thru HIN241 Pinouts HIN230 (SOIC) TOP VIEW HIN231 (SOIC) TOP VIEW T3OUT 1 20 T4OUT T1OUT 2 19 T5IN T2OUT 3 18 NC T2IN 4 17 SHUTDOWN T1IN 5 16 T5OUT GND 6 15 T4IN VCC 7 C1+ 8 14 T3IN 13 V- V+ 9 12 C2- C1- 10 11 C2+ C+ 1 16 V+ C- 2 15 VCC V- 3 14 GND R2IN 5 12 R1IN R2OUT 6 11 R1OUT T2IN 7 10 T1IN NC 8 9 NC +5V +5V 1F 1F T1IN T2IN T3IN T4IN T5IN + 10 VCC C1+ C1- 11 C2+ + 12 C2- +5V TO 10V VOLTAGE DOUBLER +5V 400k T1 +5V 400k T2 4 14 +5V 400k T3 19 + VCC 1 +5V 400k +5V 400k V- 13 + 5 15 V+ 9 1F 1F +10V TO -10V VOLTAGE INVERTER +7.5V TO +13.2V 15 7 8 13 T1OUT T2OUT 4 2 3 + 2 C+ C- V+ +12V TO -12V VOLTAGE INVERTER V- 3 + 1F T1OUT T1IN T2OUT T2IN +5V 400k T1 10 +5V 400k T2 7 13 4 11 1 16 1F T1OUT T2OUT 12 R1IN R1OUT T3OUT 5k R1 T4 20 T4OUT R2OUT 6 5 5k R2 T5 16 17 T5OUT SHUTDOWN 6 8-31 14 R2IN HIN230 thru HIN241 Pinouts (Continued) HIN232 (PDIP, CERDIP, SOIC) TOP VIEW C1+ 1 V+ 2 HIN233 (PDIP, SOIC) TOP VIEW 16 VCC T2IN 1 20 R2OUT 15 GND T1IN 2 19 R2IN R1OUT 3 18 T2OUT C1- 3 14 T1OUT C2+ 4 13 R1IN 12 R1OUT C2- 5 6 11 T1IN T2OUT 7 10 T2IN V- 9 R2OUT R2IN 8 R1IN 4 17 V- T1OUT 5 16 C2- GND 6 15 C2+ VCC 7 14 V+ (C1-) (V+) C1+ 8 13 C1- (C1+) GND 9 12 V- (C2+) (V-) C2- 10 11 C2+ (C2-) NOTE: Pin numbers in parentheses are for SOIC Package. +5V +5V + 1F 1 1F + 3 4 1F T1IN T2IN + 5 11 10 + 16 VCC C1+ C1C2+ C2- V+ 2 +10V TO -10V VOLTAGE INVERTER 1F T1IN 2 400k +5V V- 6 + 1 400k T1 5 T2 18 3 1F 4 R1OUT T1OUT T2OUT R1IN 5k T1 14 T1OUT R2OUT 7 R2IN 13 R1IN R1OUT 5k R1 9 8 NO 13 (14) CONNECT T2OUT R2IN INTERNAL -10V SUPPLY INTERNAL +10V SUPPLY 12 (10) 17 14 (8) 5k C1+ C1- 15 8-32 11 (12) 15 16 V- C2- VV+ C2+ C2+ C2GND 6 5k R2 19 20 8 (13) T2 12 R2OUT + T2IN +5V 400k VCC +5V +5V TO 10V VOLTAGE INVERTER +5V 400k 0.1F 6 GND 9 10 (11) HIN230 thru HIN241 Pinouts (Continued) HIN234 (SOIC) TOP VIEW T1OUT 1 T2OUT 2 T2IN 3 HIN235 (PDIP) TOP VIEW 16 T3OUT T4OUT 1 24 R3IN 15 T4OUT T3OUT 2 23 R3OUT 14 T4IN T1OUT 3 22 T5IN T2OUT 4 21 SD R2IN 5 20 EN 13 T3IN T1IN 4 GND 5 VCC 6 11 C2- C1+ 7 10 C2+ V+ 8 9 C1- 12 V- 19 T5OUT R2OUT 6 T2IN 7 18 R4IN T1IN 8 17 R4OUT R1OUT 9 16 T4IN R1IN 10 15 T3IN GND 11 14 R5OUT VCC 12 13 R5IN +5V +5V 12 VCC 6 7 1F 1F T1IN T2IN T3IN T4IN + 9 C1- 10 C2+ + 11 C24 3 VCC C1+ +5V TO 10V VOLTAGE DOUBLER +10V TO -10V VOLTAGE INVERTER +5V 400k +5V 400k V+ 8 + T1IN T2IN V- 12 + T1 +5V 1F 1 1F T3IN T1OUT T4IN 2 13 +5V 400k T3 +5V 400k T4 14 T2OUT T5IN R1OUT 16 400k 7 +5V 400k T2 15 +5V 400k T3 16 +5V 400k T4 22 +5V 400k T5 3 4 2 1 19 10 9 T3OUT 5 6 T4OUT 23 T2OUT T3OUT T4OUT T5OUT R1IN R2IN 24 R3IN R3OUT 5k R3 17 18 R4OUT R4IN 5k R4 14 13 R5OUT R5IN 20 5k R5 21 EN SD GND 11 8-33 T1OUT 5k R2 5 0.1F 5k R1 R2OUT 15 T1 8 T2 + HIN230 thru HIN241 Pinouts (Continued) HIN236 (PDIP, SOIC) TOP VIEW HIN237 (PDIP, SOIC) TOP VIEW T3OUT 1 24 T4OUT T1OUT 24 T4OUT 23 R2IN T3OUT 1 2 T1OUT 2 23 R2IN T2OUT 3 22 R2OUT T2OUT 3 22 R2OUT R1IN 4 21 SHUTDOWN R1OUT 5 20 EN T2IN 6 19 T4IN T2IN 6 19 T4IN T1IN 7 18 T3IN T1IN 7 18 T3IN GND 8 17 R3OUT GND 8 17 R3OUT VCC 9 16 R3IN VCC 9 16 R3IN 15 V- C1+ 10 15 V- C1+ 10 R1IN 4 14 C2- V+ 11 14 C2- C1- 12 13 C2+ C1- 12 13 C2+ +5V 9 9 1F T1IN T2IN T3IN T4IN 10 C1+ + 12 C113 C2+ + 14 C2- VCC 11 +5V TO 10V VOLTAGE DOUBLER V+ +10V TO -10V VOLTAGE INVERTER V- 15 + +5V 400k T1 +5V 400k T2 6 +5V 400k 18 T3 +5V 400k T4 2 3 1 24 5 1F 1F 1F + 7 19 20 T5OUT V+ 11 +5V 1F 21 T5IN R1OUT 5 1F T1IN T1OUT T2IN T2OUT T3IN T3OUT T4IN T4OUT 4 R1IN R1OUT T5IN 5k R1 22 10 C1+ + 12 C113 C2+ + 14 C2- 11 +5V TO 10V VOLTAGE DOUBLER V+ +10V TO -10V VOLTAGE INVERTER V- 15 +5V 400k 7 T1 +5V 400k T2 6 18 +5V 400k T3 +5V 400k T4 19 +5V 400k T5 21 3 1 24 20 22 5k R3 EN 21 17 16 R3IN 5k R3 8 8 8-34 T5OUT 5k R3OUT SHUTDOWN T4OUT 23 R2 R3IN 20 T3OUT R2IN 16 R3OUT T2OUT R1IN R2OUT 17 T1OUT 5k R1 R2IN 5k 1F 4 R1OUT 23 + 1F + 2 5 R2OUT R2 VCC HIN230 thru HIN241 Pinouts (Continued) HIN238 (PDIP, SOIC) TOP VIEW T2OUT 1 HIN239 (SOIC) TOP VIEW R1OUT 1 24 T1IN 23 R3IN R1IN 2 23 T2IN 22 R3OUT GND 3 22 R2OUT 24 T3OUT T1OUT 2 R2IN 3 R2OUT 4 T1IN 5 21 R2IN VCC 4 21 T4IN 20 T4OUT V+ 5 20 T2OUT R1OUT 6 19 T3IN C1+ 6 19 T1OUT R1IN 7 18 T2IN C1- 7 18 R3IN GND 8 17 R4OUT 17 R3OUT V- 8 16 T3IN R5IN 9 VCC 9 16 R4IN C1+ 10 15 V- R5OUT 10 15 NC (NOTE) V+ 11 14 C2- R4OUT 11 14 EN C1- 12 13 C2+ R4IN 12 13 T3OUT NOTE: No Connect +5V 1F 1F T1IN T2IN T3IN T4IN 10 C1+ + 12 C113 C2+ + 14 C2- VCC V+ +10V TO -10V VOLTAGE INVERTER V- 15 +5V 400k 18 +5V 400k 19 21 11 +5V TO 10V VOLTAGE DOUBLER +5V 400k 5 +5V 400k +7.5V TO +13.2V +5V 9 + 2 6 1F + T1 4 1F 1F T1IN T1OUT T2IN + 7 T2OUT T3IN T3 24 T3OUT R1OUT C1- +10V TO -10V VOLTAGE INVERTER T1 +5V 400k T2 23 16 +5V 400k T3 6 T4OUT 13 21 R2 5k R3IN R2IN R2OUT 18 R3OUT 3 T3OUT R1IN 17 4 T2OUT R2IN 5k R1 T1OUT 5k 22 R1IN 1F 2 R2OUT 7 R1OUT 8 20 R1 20 V- 5 19 1 T4 V+ + +5V 400k 24 T2 1 VCC C1+ R3 5k 5k R2 11 22 R3IN R3OUT 12 R4IN R4OUT 23 R4 5k 5k R3 10 17 R4IN R4OUT R5IN 14 5k R4 9 R5OUT 16 R5 EN 3 8 8-35 5k Pinouts (Continued) HIN241 (SOIC, SSOP) TOP VIEW R5IN NC R5OUT T3IN T4IN R4OUT T5OUT R4IN NC SHUT DOWN EN HIN240 (MQFP) 44 43 42 41 40 39 38 37 36 35 34 1 33 2 32 NC T5IN T3OUT 1 28 T4OUT T1OUT 2 27 R3IN T2OUT 3 26 R3OUT NC R2IN 4 NC R2OUT 5 25 SHUTDOWN 24 EN R3OUT 3 31 NC T2IN 6 23 R4IN R3IN 4 30 V- T1IN 7 22 R4OUT T4OUT 5 29 C2- R1OUT 8 21 T4IN T3OUT 6 28 C2+ T1OUT R1IN 9 20 T3IN 7 27 C1- GND 10 T2OUT 8 26 19 R5OUT V+ NC 9 25 C1+ R2IN NC NC 18 R5IN C1+ 12 17 V- V+ 13 16 C2- C1- 14 15 C2+ NC NC NC VCC R1IN GND T1IN R1OUT T2IN NC NC R2OUT 24 10 11 23 12 13 14 15 16 17 18 19 20 21 22 VCC 11 +5V +5V 19 1F 1F T1IN T2IN T3IN T4IN T5IN R1OUT 25 VCC C1+ + +5V TO 10V 27 C1- VOLTAGE DOUBLER 28 C2+ +10V TO -10V + 29 VOLTAGE INVERTER C2+5V T1 400k 15 +5V 400k 14 +5V 400k 37 +5V 400k 38 +5V 400k 2 11 V+ V- 26 + 1F 1F 30 1F 1F 7 T1OUT T1IN T2 8 T3 6 T4 5 T5 41 16 17 R1 T2OUT T2IN T3OUT T3IN T4OUT T4IN R1OUT T5OUT R1IN T2 +5V 400k 20 T3 +5V 400k T4 9 23 R4IN 5k 18 R5IN 24 5k R5 25 SHUTDOWN 5k 10 SHUTDOWN 18 8-36 R1IN R3IN EN 43 T4OUT 5k 19 R5IN T3OUT 27 R5OUT 35 T2OUT R2IN 40 R5OUT T1OUT 5k R4 R4IN 1F 4 22 5k + 5k R4OUT R4OUT EN 28 R3 R3IN R5 1 26 5k 36 3 8 4 R4 2 R3OUT R3OUT 42 +5V 400k 6 21 13 + 1F T1 R2 5k 39 V- 17 5 R2IN R3 +10V TO -10V VOLTAGE INVERTER +5V 400k 7 10 3 V+ R2OUT R2OUT R2 VCC +5V TO 10V VOLTAGE DOUBLER R1 5k 13 12 C1+ + 14 C115 C2+ + 16 C2- HIN230 thru HIN241 Absolute Maximum Ratings Thermal Information VCC to Ground . . . . . . . . . . . . . . . . . . . . . .(GND -0.3V) < VCC < 6V V+ to Ground . . . . . . . . . . . . . . . . . . . . . . . (VCC -0.3V) < V+ < 12V V- to Ground . . . . . . . . . . . . . . . . . . . . . . . -12V < V- < (GND +0.3V) Input Voltages TIN . . . . . . . . . . . . . . . . . . . . . . . . . (V- -0.3V) < VIN < (V+ +0.3V) RIN . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 30V Output Voltages TOUT . . . . . . . . . . . . . . . . . . . . (V- -0.3V) < VTXOUT < (V+ +0.3V) ROUT. . . . . . . . . . . . . . . . . . (GND -0.3V) < VRXOUT < (V+ +0.3V) Short Circuit Duration TOUT . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Continuous ROUT. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Continuous Thermal Resistance (Typical, Note 1) JA (oC/W) JC (oC/W) 16 Ld PDIP Package . . . . . . . . . . . . . . 90 N/A 24 Ld PDIP Package . . . . . . . . . . . . . . 75 N/A 16 Ld SOIC (W) Package . . . . . . . . . . 100 N/A 24 Ld SOIC Package . . . . . . . . . . . . . . 80 N/A 28 Ld SOIC Package . . . . . . . . . . . . . . 75 N/A 28 Ld SSOP Package . . . . . . . . . . . . . 100 N/A 44 Ld MQFP Package . . . . . . . . . . . . . 80 N/A 16 Ld CERDIP Package . . . . . . . . . . . 80 18 Maximum Junction Temperature (Hermetic Package) . . . . . . . . 175oC Maximum Junction Temperature (Plastic Package) . . . . . . . . 150oC Maximum Storage Temperature Range . . . . . . . . . .-65oC to 150oC Maximum Lead Temperature (Soldering 10s) . . . . . . . . . . . . . 300oC (SOIC, SSOP, MQFP - Lead Tips Only) Operating Conditions Temperature Range HIN-XXXCX . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .0oC to 70oC HIN-XXXIX . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -40oC to 85oC HIN-XXXMX . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -55oC to 125oC CAUTION: Stresses above those listed in "Absolute Maximum Ratings" may cause permanent damage to the device. This is a stress only rating and operation of the device at these or any other conditions above those indicated in the operational sections of this specification is not implied. NOTE: 1. JA is measured with the component mounted on an evaluation PC board in free air. Electrical Specifications Test Conditions: VCC = +5V 10%, (VCC = +5V 5% HIN233 and HIN235) TA = Operating Temperature Range PARAMETER TEST CONDITIONS MIN TYP MAX 5 9 10 V No Load, TA = 25oC, HIN232-233 - 5 10 mA HIN230, HIN234-238, HIN240-241 - 7 15 mA HIN231, HIN239 - 0.4 1 mA HIN231 - 1.8 5 mA Output Voltage Swing, TOUT Transmitter Outputs, 3k to Ground Power Supply Current, ICC V+ Power Supply Current, ICC HIN239 Shutdown Supply Current, ICC(SD) UNITS - 5.0 15 mA - 1 10 A V Input Logic Low, TIN , EN, VlL TIN , EN, Shutdown - - 0.8 Input Logic High, VlH TIN 2.0 - - V EN, Shutdown 2.4 - - V A Logic Pullup Current, IP TIN = 0V RS-232 Input Voltage Range, VIN - 15 200 -30 - +30 V 7.0 k Receiver Input Impedance, RIN VIN = 3V 3.0 5.0 Receiver Input Low Threshold, VlN (H-L) VCC = 5V, TA = 25oC 0.8 1.2 - V Receiver Input High Threshold, VIN (L-H) VCC = 5V, TA = 25oC - 1.7 2.4 V 0.2 0.5 1.0 V - 0.1 0.4 V Receiver Input Hysteresis, VHYST TTL/CMOS Receiver Output Voltage Low, VOL IOUT = 1.6mA (HIN231-HIN233 IOUT = 3.2mA) TTL/CMOS Receiver Output Voltage High, VOH IOUT = -1.0mA 3.5 4.6 - V Output Enable Time, tEN HIN235, 236, 239, 240, 241 - 400 - ns Output Disable Time, tDIS HIN235, 236, 239, 240, 241 - 250 - ns Propagation Delay, tPD RS-232 to TTL - 0.5 - s Instantaneous Slew Rate, SR CL = 10pF, RL = 3k, TA = 25oC (Note 2) - - 30 V/s Transition Region Slew Rate, SRT RL = 3k, CL = 2500pF Measured from +3V to -3V or -3V to +3V - 3 - V/s Output Resistance, ROUT VCC = V+ = V- = 0V, VOUT = 2V RS-232 Output Short Circuit Current, ISC TOUT shorted to GND NOTE: 2. Guaranteed by design. 8-37 300 - - - 10 - mA HIN230 thru HIN241 VOLTAGE DOUBLER S1 C1+ VOLTAGE INVERTER S2 V+ = 2VCC C2+ S5 S6 VCC GND + GND S3 C1- + C1 - + C3 VCC GND S4 - C4 V- = -(V+) C2- S7 + C2 S8 RC OSCILLATOR FIGURE 1. CHARGE PUMP Detailed Description The HIN230 thru HIN241 family of RS-232 transmitters/receivers are powered by a single +5V power supply (except HIN-231 and HIN239), feature low power consumption, and meet all ElA RS-232C and V.28 specifications. The circuit is divided into three sections: the charge pump, transmitter, and receiver. slew rate which is less than 30V/s. The outputs are short circuit protected and can be shorted to ground indefinitely. The powered down output impedance is a minimum of 300 with 2V applied to the outputs and VCC = 0V. V+ VCC 400k Charge Pump An equivalent circuit of the charge pump is illustrated in Figure 1. The charge pump contains two sections: the voltage doubler and the voltage inverter. Each section is driven by a two phase, internally generated clock to generate +10V and -10V. The nominal clock frequency is 16kHz. During phase one of the clock, capacitor C1 is charged to VCC . During phase two, the voltage on C1 is added to VCC , producing a signal across C3 equal to twice VCC . During phase one, C2 is also charged to 2VCC , and then during phase two, it is inverted with respect to ground to produce a signal across C4 equal to -2VCC . The charge pump accepts input voltages up to 5.5V. The output impedance of the voltage doubler section (V+) is approximately 200, and the output impedance of the voltage inverter section (V-) is approximately 450. A typical application uses 1F capacitors for C1-C4, however, the value is not critical. Increasing the values of C1 and C2 will lower the output impedance of the voltage doubler and inverter, increasing the values of the reservoir capacitors, C3 and C4, lowers the ripple on the V+ and V- supplies. 300 TXIN TOUT GND < TXIN < VCC V- < VTOUT < V+ V- FIGURE 2. TRANSMITTER Receivers The receiver inputs accept up to 30V while presenting the required 3k to 7k input impedance even it the power is off (VCC = 0V). The receivers have a typical input threshold of 1.3V which is within the 3V limits, known as the transition region, of the RS-232 specifications. The receiver output is 0V to VCC . The output will be low whenever the input is greater than 2.4V and high whenever the input is floating or driven between +0.8V and -30V. The receivers feature 0.5V hysteresis to improve noise rejection. The receiver Enable line EN, when set to logic "1", (HIN236, 239, 240, and 241) disables the receiver outputs, placing them in the high impedance mode. The receiver outputs are also placed in the high impedance state when in shutdown mode. During shutdown mode (HIN230, 236, 240 and 241), SHUTDOWN control line set to logic "1", the charge pump is turned off, V+ is pulled down to VCC , V- is pulled up to GND, and the supply current is reduced to less than 10A. The transmitter outputs are disabled and the receiver outputs are placed in the high impedance state. VCC RXIN -30V < RXIN < +30V ROUT 5k GND < VROUT < VCC GND FIGURE 3. RECEIVER Transmitters The transmitters are TTL/CMOS compatible inverters which translate the inputs to RS-232 outputs. The input logic threshold is about 26% of VCC , or 1.3V for VCC = 5V. A logic 1 at the input results in a voltage of between -5V and V- at the output, and a logic 0 results in a voltage between +5V and (V+ -0.6V). Each transmitter input has an internal 400k pullup resistor so any unused input can be left unconnected and its output remains in its low state. The output voltage swing meets the RS-232C specifications of 5V minimum with the worst case conditions of: all transmitters driving 3k minimum load impedance, VCC = 4.5V, and maximum allowable operating temperature. The transmitters have an internally limited output 8-38 TIN OR RIN TOUT OR ROUT VOL VOL tPHL Average Propagation Delay = tPLH tPHL + tPLH 2 FIGURE 4. PROPAGATION DELAY DEFINITION HIN230 thru HIN241 Typical Performance Curves 12 12 10 SUPPLY VOLTAGE (|V|) V- SUPPLY VOLTAGE 1F 0.47F 8 0.10F 6 4 10 V+ (VCC = 5V) 8 6 TA = 25oC 2 2 3.5 4.0 4.5 5.0 5.5 6.0 0 5 10 15 20 |ILOAD| (mA) VCC FIGURE 5. V- SUPPLY VOLTAGE vs VCC , VARYING CAPACITORS V- (VCC = 5V) TRANSMITTER OUTPUTS OPEN CIRCUIT 0 0 3.0 V+ (VCC = 4V) V- (VCC = 4V) 4 25 FIGURE 6. V+, V- OUTPUT VOLTAGE vs LOAD Test Circuits (HIN232) 1 C1+ +4.5V TO +5.5V INPUT 1F C3 1F C1 3 C1- + 1 C1+ + 2 V+ - 3 C1- 1F + C2 - - + 3k 2 V+ - 1F C4 VCC 16 3k GND 15 T1OUT 14 T1 OUTPUT R1IN 13 R1OUT 12 6 V- T1IN 11 T2IN 10 R1IN 13 RS-232 30V INPUT 5 C2- R1OUT 12 TTL/CMOS OUTPUT 8 R2IN T1IN 11 TTL/CMOS INPUT T2IN 10 TTL/CMOS INPUT 8 R2IN R2OUT 9 GND 15 T1OUT 14 5 C2- 4 C2+ 7 12OUT VCC 16 4 C2+ 7 12OUT 6 V- R2OUT 9 ROUT = VIN/1T2OUT TTL/CMOS OUTPUT T1OUT T2 OUTPUT VIN = 2V A RS-232 30V INPUT FIGURE 7. GENERAL TEST CIRCUIT FIGURE 8. POWER-OFF SOURCE RESISTANCE CONFIGURATION 8-39 30 35 HIN230 thru HIN241 Applications +5V The HINXXX may be used for all RS-232 data terminal and communication links. It is particularly useful in applications where 12V power supplies are not available for conventional RS-232 interface circuits. The applications presented represent typical interface configurations. TD INPUTS OUTPUTS TTL/CMOS RTS 5 T1 11 14 T2 INPUTS RTS OUTPUTS 12 TTL/CMOS RD CTS 9 + 10 7 13 R2 R1 8 15 RS-232 INPUTS AND OUTPUTS TD (2) TRANSMIT DATA RTS (4) REQUEST TO SEND RD (3) RECEIVE DATA CTS (5) CLEAR TO SEND SIGNAL GROUND (7) FIGURE 9. SIMPLE DUPLEX RS-232 PORT WITH CTS/RTS HANDSHAKING - 14 T2 10 + C2 1F 5 T1 11 TD (2) TRANSMIT DATA 7 RTS (4) REQUEST TO SEND 13 12 RD (3) RECEIVE DATA RD CTS 6 4 HIN232 3 9 HIN232 C2 + 1F TD CTR (20) DATA TERMINAL READY DSRS (24) DATA SIGNALING RATE SELECT 3 4 In applications requiring four RS-232 inputs and outputs (Figure 10), note that each circuit requires two charge pump capacitors (C1 and C2) but can share common reservoir capacitors (C3 and C4). The benefit of sharing common reservoir capacitors is the elimination of two capacitors and the reduction of the charge pump source impedance which effectively increases the output swing of the transmitters. 1 16 1 C1 + 1F - A simple duplex RS-232 port with CTS/RTS handshaking is illustrated in Figure 9. Fixed output signals such as DTR (data terminal ready) and DSRS (data signaling rate select) is generated by driving them through a 5k resistor connected to V+. C1 + 1F - + R2 R1 8 CTS (5) CLEAR TO SEND 15 16 6 2 - C3 + + C4 V- V+ 2F 6 - 2F 2 16 +5V RS-232 INPUTS AND OUTPUTS HIN232 C1 + 1F DTR INPUTS OUTPUTS TTL/CMOS DSRS 1 4 3 5 T1 11 14 T2 10 7 13 12 DCD R1 9 R2 R1 15 8 + C2 1F - DTR (20) DATA TERMINAL READY DSRS (24) DATA SIGNALING RATE SELECT DCD (8) DATA CARRIER DETECT R1 (22) RING INDICATOR SIGNAL GROUND (7) FIGURE 10. COMBINING TWO HIN232s FOR 4 PAIRS OF RS-232 INPUTS AND OUTPUTS 8-40 HIN230 thru HIN241 Die Characteristics DIE DIMENSIONS: PASSIVATION: Type: Nitride over Silox Nitride Thickness: 8kA Silox Thickness: 7kA 160 mils x 140 mils METALLIZATION: Type: Al Thickness: 10kA 1kA TRANSISTOR COUNT: 238 SUBSTRATE POTENTIAL PROCESS: V+ CMOS Metal Gate Metallization Mask Layout HIN240 T2OUT T1OUT T3OUT T4OUT R3OUT R3IN T5IN R2IN SHUTDOWN R2OUT EN T2IN T5OUT T1IN R4IN R1OUT R4OUT R1IN T4IN GND T3IN R5OUT VCC R5IN C1+ V+ C1- C2+ 8-41 C2- V-